Tape-automated bonding
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system or module board or assembled inside a package (TAB outer lead bonding, OLB). Typically the FPC includes from one to three conductive layers and all inputs and outputs of the semiconductor die are connected simultaneously during the TAB bonding. Tape automated bonding is one of the methods needed for achieving chip-on-flex (COF) assembly and it is one of the first roll-to-roll processing (also called R2R, reel-to-reel) type methods in the electronics manufacturing.
Q80831
integrated circuit
Concept
Q4137937
flexible circuit
UNK
Q145273
polyamide
Concept
Q145958
polyimide
Concept
Q3192874
Kapton
MISC
Q7865493
UPILEX
UNK
Q4400004
roll-to-roll processing
Concept
Q1487512
Tape-automated bonding
UNK
+2^^http://www.w3.org/2001/XMLSchema#decimal
2
NUMBER
made from material