WaferSegClassNet -- A Light-weight Network for Classification and Segmentation of Semiconductor Wafer Defects
As the integration density and design intricacy of semiconductor wafers
increase, the magnitude and complexity of defects in them are also on the rise.
Since the manual inspection of wafer defects is costly, an automated artificial
intelligence (AI) based computer-vision approach is highly desired. The
previous works on defect analysis have several limitations, such as low
accuracy and the need for separate models for classification and segmentation.
For analyzing mixed-type defects, some previous works require separately
training one model for each defect type, which is non-scalable. In this paper,
we present WaferSegClassNet (WSCN), a novel network based on encoder-decoder
architecture. WSCN performs simultaneous classification and segmentation of
both single and mixed-type wafer defects. WSCN uses a "shared encoder" for
classification, and segmentation, which allows training WSCN end-to-end. We use
N-pair contrastive loss to first pretrain the encoder and then use BCE-Dice
loss for segmentation, and categorical cross-entropy loss for classification.
Use of N-pair contrastive loss helps in better embedding representation in the
latent dimension of wafer maps. WSCN has a model size of only 0.51MB and
performs only 0.2M FLOPS. Thus, it is much lighter than other state-of-the-art
models. Also, it requires only 150 epochs for convergence, compared to 4,000
epochs needed by a previous work. We evaluate our model on the MixedWM38
dataset, which has 38,015 images. WSCN achieves an average classification
accuracy of 98.2% and a dice coefficient of 0.9999. We are the first to show
segmentation results on the MixedWM38 dataset. The source code can be obtained
from https://github.com/ckmvigil/WaferSegClassNet.