A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
Defect detection plays a vital role in the manufacturing process of
integrated circuits (ICs). Die attachment and wire bonding are two steps of the
manufacturing process that determine the power and signal transmission quality
and dependability in an IC. This paper presents a survey or literature review
of the methods used for detecting these defects based on different sensing
modalities used including optical, radiological, acoustical, and infrared
thermography. A discussion of the detection methods used is provided in this
survey. Both conventional and deep learning approaches for detecting die
attachment and wire bonding defects are considered along with challenges and
future research directions.