DELIVERING THE BENEFITS OF CUPACK™ PACKAGES & CA-PACK™ PACKAGES
Our Hybrid CA-Packs™ packages combines the advantages of two of Materion’s most successful air cavity packages. Like CuPacks™ packages, they have 0.2 mm thick copper leads direct-bonded to alumina frames with no metallization on the alumina or braze alloy between the copper and the alumina. Therefore, the leads can be made 0.5 mm wide and spaced only 0.3mm apart. And like our CA-Pack packaging, the flange can be made of any desired material with or without bolt-down ears.
HYBRID CA-PACKS PROVIDE LOW COST, HIGH CONDUCTIVITY MICROELECTRONIC PACKAGING
For commercial applications, hermetic packages that were originally developed for military applications are too expensive. Hybrid CA-Packs are cost effective and can be sealed with lower cost epoxy-coated ceramic lids like Materion Epo-Lid™ covers. They are capable of handling low loss at frequencies up to 10GHz with no possibility of Ag dendrites.
VARIETY OF DESIGN OPTIONS TO MEET DEMANDS OF RF AIR CAVITY PACKAGES
Hybrid CA-Packs can be manufactured to a wide range of customer specifications. Some unique features for use in RF packaging for 5G power transistors include:
- No silver or silver alloy content
- Leads can be straight or formed (gull-wing)
- Leads and flanges can be copper
- Sense leads possible
- Ear’d or earless flanges
- Copper flange with pedestal (to minimize wire bond length)
- Ni + Au or Ni + Pd +Au plating available
- Able to withstand 1000 temp cycles
Reduce your costs while maintaining high conductivity. Discuss your needs with one of our microelectronic packaging experts