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ST's solutions for mobile devices Content Introduction............................................................................................ 4 MEMS and Sensors.............................................................................. 5 Imaging solutions.............................................................................. 12 Audio solutions................................................................................... 15 Mobile security solutions............................................................... 17 NFC tags................................................................................................. 19 Serial EEPROM..................................................................................... 21 Signal conditionning....................................................................... 23 Microcontrollers.................................................................................. 24 Radio frequency................................................................................ 32 Smart antenna tuning.................................................................... 34 Interfaces................................................................................................ 37 Protection and EMI filtering......................................................... 40 Power management....................................................................... 44 Introduction STMicroelectronics is a leading semiconductor supplier in the mobile industry and provides solutions to both mobile platform suppliers and mobile device manufacturers (OEM/ODM). ST has proven products for the cellular handset and mobile device markets and ships billions of products to the mobile industry every year. These products include the world's most deployed MEMS accelerometers, gyroscopes, magnetometers, pressure sensors, compasses and inertial modules, state-of-the-art analog and digital MEMS microphones, high-quality audio headphone and speaker amplifiers, touch-sensor controllers with multi-touch capabilities, Near Field Communication Secure MCUs for SIM, M2M SIM and Secure Elements, a wide RF product offer based on Integrated passive device technology, ESD protection and EMI filtering products (IPAD™), interface devices, level translators, I/O expanders, antenna tuner, analog switches, supervisors and smart resets, imaging solutions with photonic sensors like proximity and gesture sensors, ranging sensors, ambient light sensors, high-efficiency power management devices and innovative lighting management solutions. ST is an active player in all major standardization initiatives. • High-volume manufacturing capacity • Multiple production sites • Integrated HW and SW solutions • High-quality products, already tested in different application fields • Strong commitment to Sustainable Technology 4 Interface and interconnected devices signal conditioning Op amps, comparators Imaging solutions Proximity and gesture sensors, ranging sensors, and ambient light sensors memory Serial EEPROM (2 Kbits up to 2 Mbits) in a miniature packages Sensors and user interfaces Accelerometers, gyroscopes, pressure sensors, iNEMO-Inertial modules, digital compasses, proximity sensors, touchscreen controllers, optical finger navigation sensors, and temperature sensors Radio frequency Couplers, diplexers, baluns, and band-pass filters Protection and EMI filtering ESD and EOS protections, EMI filtering Level translators, I/O expanders, camera interfaces, analog switches, supervisors and smart resets Microcontrollers 32-bit STM32 ARM® Cortex® -based MCUs and 8-bit STM8 MCUs offer a wide choice of solutions NFC, SIM and secure elements NFC controllers and transceivers, and secure MCUs Audio solutions MEMS digital and analog microphones, headphone and speaker amplifiers Power management LDO and DC-DC converters, battery management, Flash LED and backlight drivers, and OLED display power supplies, battery monitoring Smart antenna tuning Tunable RF capacitors, and dynamic impedance matching controllers MEMS and Sensors Enhanced user interfaces, gaming, OIS and much more ST has shipped 10 billion micro-electromechanical sensors and has one of the industry's most extensive MEMS portfolio including accelerometers, gyroscopes, digital compasses, inertial modules, MEMS microphones, and environmental sensors including pressure, temperature, and humidity sensors. Digital compasses: accurate compass heading in any conditions ST's digital compasses include combo solutions, with an accelerometer and magnetic sensor integrated in a single LGA package, to give the possibility of designing a solution locating the magnetic sensor in the suitable position of printed circuit board (PCB). Accurately detecting the direction and magnitude of external magnetic fields and using accelerometer measurements for tilt compensation, ST's digital compasses ensure very accurate compass heading even when the portable device is inclined. ST's low-noise e-compasses offer better than 3 mgauss resolution and a wide range of full scales, all selectable by the user: up to ±16g full scale acceleration and up to ±16 gauss magnetic field full scale. The compass family includes embedded self-test and smart power functionalities to minimize current consumption. The LSM303C is board- and software-compatible with the latest generation of accelerometers, thus offering maximum design flexibility. Key BENEFITS • Superior sensing precision combined with low power consumption • Extended magnetic-scale range • Minimized measurement noise • Very small package to address footprint reduction • Temperature detection for advanced thermal drift compensation • New possibilities for advanced navigation and location-based services in increasingly-portable consumer devices 5 Accelerometer + gyroscope SIP solution featuring multiple degrees of freedom iNEMO inertial modules integrate complementary types of sensors to offer more compact, robust and easy-to-assemble solutions compared to discrete MEMS products. iNEMO solutions bring motion sensing systems to the level required for the most demanding applications, such as enhanced gesture recognition, gaming, augmented reality, indoor navigation, and localization-based services. The 6-axis accelerometer and gyroscope family offers best-in-class accuracy, stability and resolution ensuring ultra-low-power, alwayson activity for advanced tracking and smart motion capture. 2.5 x 3.0 x 0.83 mm 6 Power consumption (mA) (high perf mode) EIS/OIS features Package size (mm) Digital interface Gyro ODR (Hz) LSM6DS3H 1.1 yes/yes 2.5x3x0.83 I2C/SPI + aux SPI for OIS/EIS 3333 LSM6DS3 1.25 yes/no 2.5x3x0.83 I2C/SPI 1666 LSM6DS33 1.25 yes/no 3x3x0.86 I C/SPI 1666 Part number 2.5 x 3.0 x 0.83 mm 2 3 x 3 x 0.86 mm Digital gyroscopes ST's new digital gyroscopes are the perfect synthesis of accuracy and design flexibility ST's latest gyroscopes feature excellent accuracy as a result of their unique and patented mechanical structure based on a single driving mass. ST developed specific gyroscopes for addressing user interface (L3GD20H) or Optical Image Stabilization (L2G2IS) applications boasting superior output stability over time and temperature, removing the need for any further calibration on customer side. They offer user-selectable full scales, ranging from ±100 to ±2000 dps, to cater for gaming, navigation, and OIS applications. L3GD20H features • Full scale ±245/±500/±2000 dps for UI, ±100/±200 dps for OIS • I2C/SPI digital interface • 16-bit data output • 8-bit (UI) and 12-bit (OIS) temperature data output • Wide supply voltage: up to 3.6 V • Low-voltage compatible IOs (1.8 V) • Embedded power-down and sleep modes • Embedded temperature sensor • Fast turn-on and wake-up • User-enabled integrated filters • Embedded 32 levels of 16-bit data output FIFO (UI) Key BENEFITS • ECOPACK® RoHS and "Green" compliant • High performance in terms of • High shock survivability accuracy, and stability • Design flexibility • Extremely low power consumption lengthens battery life • Temperature detection for advanced thermal drift compensation • Enables faster system wake up L2G2IS features • ±100/±200 dps full-scale range Key BENEFITS • 3- and 4-wire SPI digital interface • Low noise and low latency device • Embedded temperature sensor • High stability in temperature reducing • Integrated low- and high-pass filters with user-selectable bandwidth • Wide supply voltage range: 1.71 to 3.6 V • Embedded self-test • Power-down and sleep modes for smart power saving OIS algorithm complexity • Embedded temperature sensor data can be accessed through SPI digital interface by application • Robustness for ultrasonic cleaning process • ECOPACK®, RoHS and «Green» compliant Device summary Features Typ. angular rate range (FS) (dps) Driving frequency (kHz) Angular rate noise density (°/s/√Hz) ODR (Hz) Programmable interrupts Embedded FIFO Typ. current consumption (mA) Supply voltage range (V) Operating temperature range (˚C) Applications Digital interfaces Size (mm) L3GD20H L2G2IS ±245/±500/±2000 ±100/±200 20 20 0.011 0.006 up to 800 9090 2 N/A 32 levels of 16-bit data output N/A 5 3.8 2.2 to 3.6 1.71 to 3.6 -40 to +85 -40 to +85 Gaming, pointing devices, navigation and motion control Optical image stabilization (OIS) I2C/SPI SPI (3/4 W) 3x3x1 2.3 x 2.3 x 0.7 7 3-axis digital accelerometers ST's ultra-low-power accelerometers for advanced motion recognition and power management features Housed in ultra-small packages and featuring excellent stability over time and temperature, ST's accelerometers are the ideal choice for all the most demanding consumer and industrial applications. The LIS3DSH, LIS3DH, LIS2HH12, LIS2DH12, LIS2DE12, and LIS2DS12 accelerometers are able to operate in ultra-low-power modes, thus lowering the overall system power consumption and extending the device's battery life. They also offer smart motion features, such as sleep-to-wakeup and return-to-sleep functions, to easily design the most intuitive and precise user interfaces. Key FEATURES • Embedded digital functions (pedometer, • Selectable full-scale up to ±16g • High resolution • Power-down, sleep and ultra-low-power operating modes for advanced power saving • Smart embedded functions such as 4D/6D orientation detection auto wakeup and return-to-sleep • Programmable interrupts and embedded FIFO step detector, step counter, and SMD) • Embedded state machines for custom motion recognition (LIS3DSH) • Digital interfaces: I²C/SPI • Output data rates from 1 Hz to 6.4 kHz • Embedded temperature sensor Key BENEFITS • Extremely accurate motion-sensing capabilities in ever smaller and sleeker consumer gadgets • Design flexibility • Extremely low power consumption maximizes battery life • Embedded FIFO for smart data storage and power saving • State machines enable custom motion recognition inside the sensor, further reducing system complexity • Temperature detection for advanced thermal drift compensation 8 DEVICE SUMMARY Features LIS2DS12 LIS3DSH LIS3DH LIS2HH12 LIS2DH12 LIS2DE12 ±2g/4g/8g/16g ±2g/4g/8g/16g ±2g/4g/8g/16g ±2g/4g/8g ±2g/4g/8g/16g ±2g/4g/8g/16g 14 bit 14 bit 12 bit 14 bit 12 bit 8 bit 120 150 220 130 220 350μg/√Hz ODR =1600Hz 1, 12.5, 25, 50, 100, 200, 400, 800, 1600, 3200, 6400 3.125, 6.25, 12.5, 25, 50, 100, 400, 800, 1600 1, 10, 25, 50, 100, 200, 400, 1250, 1600, 5000 10, 50,100, 200,400,800 1, 10, 25, 50, 100, 200, 400, 1620, 5376 1, 10, 25, 50, 100, 200, 400, 1620, 5376 Programmable interrupts 2 2 2 2 2 2 Embedded FIFO 256 level 32 level 32 level 32 level 32 level 32 level Supply voltage (V) 1.62 to 1.98 1.7 to 3.6 1.7 to 3.6 1.7 to 3.6 1.7 to 3.6 1.7 to 3.6 Temperature range (˚C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 I²C/SPI I²C/SPI I²C/SPI I²C/SPI I²C/SPI I²C/SPI 2 x 2 x 0.86 3x3x1 3x3x1 2x2x1 2x2x1 2x2x1 Basic function and programmable motion detection by FSM Basic function: 6D/4D orientation detection, free-fall detection, motion detection, click - double click, and wake up Basic function and anti-aliasing filter: 6-axis detection, 6D/4D orientation detection Basic function: 6D/4D orientation detection, free-fall detection, motion detection, click - double click, and wake up Basic function: 6D/4D orientation detection, free-fall detection, motion detection, click - double click, and wake up Full scale Output resolution Noise density (µg/√Hz) Output data rate (Hz) Digital interfaces Size (mm) Advanced digital functions Basic function and pedometer, step detector and step counters, tilt function, sensor hub, and always-on experience MEMS pressure sensors MEMS pressure sensor: 260-1260 hPa absolute digital output barometer STMicroelectronics LPS25HB and LPS22HB pressure sensors integrate ST's consolidated technology with the new fully molded package to further improve robustness, reliability, and moisture resistance while reducing package thickness. With their ultra-low height of 0.76 mm, LPS25HB and LPS22HB sensors offer high design flexibility and easy implementation into multi-functional applications: from smartphones, tablets, and wearable technology such as sports watches, smart watches, fitness bands, and Internet-of-Things (IoT) products. APPLICATIONS Key Features • Weather forecast • 260 to 1260 hPa digital output • Barometric altitude barometer • Ascent/descent detection • Current consumption: 4 μA • Vertical speed indication • Selectable ODR from 1 to 25 Hz • Indoor navigation (floor detection) • SPI and I2C • Enhanced GPS navigation • Embedded FIFO • Supply voltage: 1.7 to 3.6 V • Package: 2.5 x 2.5 x 0.76 (typ.) or 2 x 2 x 0.8 (max.) mm 9 Touch sensing WQHD display Wake-up gesture Waterproof touch Curved screen Passive pen Multi-finger gloved touch Ultra-low power capacitive multi-touch screen controller for 2" to 13" screens 10 FingerTip capacitive touchscreen controller FingerTip provides an optimal mix of low power, small size, low external part count and versatile features with unmatched true multi-touch performance in a single-chip touchscreen controller. The touchscreen controller can detect, classify, and track 10 finger touches with fast a report rate and response times. The touch acquisition analog front-end has a wide dynamic range capable of coping with touchscreens of different sizes and configurations. This offers the flexibility to use FingerTip with multiple touchscreens using different ITO designs and overlay materials. One- or two-layer ITO sensors are supported using glass or PET substrates. FingerTip provides support for curved displays through proprietary node compensation hardware. FingerTip's low-noise capacitive analog front-end provides enhanced noise suppression capabilities for various noise sources such as display, 3-phase noise and severe common mode noise introduced by battery chargers. The device utilizes ST proprietary hardware and firmware techniques to significantly reduce power in low-power active and low-power idle modes, and incorporates multiple TX driving methods that can further boost the SNR and report rate. Advanced features • Multi-mode sensing technology: Detects water on the top of the screen without false touch or line breaking • Multi-finger glove operation • Small passive stylus All types of SYNC mode (HSYNC and VSYNC) support, which enables touch sampling to be synchronized with the display SYNC signal to work even with quad high definition displays. The main processor implements a powerful 32-bit ARM Cortex-M3 core with Flash memory that is capable of providing a high level of overall touch performance in terms of noise rejection, response time, and power consumption. The device supports an I²C serial interface, I²C master interface, HID over I²C interface, and SPI interface for greater flexibility. Key features • Scan rate > 150 Hz • Touch screen size with round or • High SNR square form factor • Noise immunity to all sources • Support all types of Touch ITO • GPIO for button support • I²C interface • Support for multi-finger, thick glove, wet • Ultra-low power modes for longer battery life • Small and thin QFN (4 x 4 x 0.4 mm ) fingers and 1mm passive pen touches Temperature sensors DIGITAL TEMPERATURE SENSOR STTS751 ST's digital temperature sensors are high-precision CMOS ICs with a delta-sigma analog-to-digital converter (ADC) and I²C compatible serial digital interface. The on-board delta-sigma ADC converts the measured temperature to a digital value that is calibrated in degrees Celsius. These temperature sensors feature low power consumption, up to 12-bit resolution and can operate over a temperature range as wide as -40 to +125 °C. Key features • Accuracy: ±1.0 °C (typ.), ±1.5 °C (max.) from 0 to +85 °C • Operating voltage: 2.25 to 3.6 V • Operating temperature: -40 to +125 °C • Dual alarm • Programmable resolution • Tiny packages UDFN-6L (2 x 2 mm), SOT23-6L (1.69 x 2.9 mm) • 9- to 12-bit resolution • Low operating current: 50 μA (typ.) • Low standby current: 3 μA (typ.) • One-shot mode for power saving • Supports 400 kHz serial clock UDFN-6L, 2 x 2 x 0.5 mm ANALOG TEMPERATURE SENSOR STLM20 ultra-low-power precision temperature sensor The analog temperature sensors feature ultra-low power consumption and provide superior linearity at much lower currents than a high accuracy thermistor and can operate over a temperature range as wide as -55 to +130 °C. They are ideal for regulating the gain of the power amp of any RF device including eReader, GPS devices, and medical instrumentation, where low power, small size, accuracy, and linearity over the full temperature range are fundamental. Key features • Operating voltage range: 2.4 to 5.5 V • Precision analog voltage output tempe- • Operating temperature range: rature sensor • ±1.5 °C temperature accuracy at 25 °C • Ultra-low quiescent supply current: • 4.8 μA (typ.), 8.0 μA (max.) • -55 to 130 °C • Packages: ultra-small UDFN-4L (1 x 1.3 mm), SOT323-5L (2 x 1.25 mm) UDFN-4L, 1 x 1.3 x 0.5 mm 11 Imaging solutions VL6180X combines an IR light source, a proximity sensor and an ambient light sensor in a single integrated module 12 STMicroelectronics offers a family of high-accuracy and target-independent ranging sensors, leveraging ST's own patented technology called FlightSense™ using the Time-of-Flight (ToF) principle. ST's family of products featuring high performance, small footprint and low power consumption is ideally suited for wireless applications and handheld devices. First to enable high-volume production of fully integrated and small-sized Time-of-Flight products, ST's Imaging solutions are opening for more innovative use-cases and for user-experience enhancements for a wide variety of devices and application markets. ST's internal manufacturing and supply chain guarantees supply as required by high-volume applications such as mobile phones or tablets. Key benefits Key Applications • Fully integrated module: IR laser emitter, • Mobile devices Key features ranging sensor and ALS. No need for external LEDs • Only SPAD (single photon avalanche diode) array-based product on market • Absolute distance measurement (in millimeters, register output) • Independent of target reflectance: workes with dark colours, gloves • Can work with coverglass (offset and crosstalk compensation) • Accurate and low power Proximity detection • Ambient light sensing • Simple but robust gesture control • Home appliances • Power on/off, volume +/• Collision avoidance for cleaning robots (wall and cliff) • User detection • Automatic faucet control • Industrial • Object detection and ranging • Human-machine interface • 3-in-1 Time-Of-Flight module: • proximity sensor, ALS (ambient light sensing) and basic gesture control • Development tools and technical support • Driver and API available • Full set of documentation on www.st.com/VL6180X • Proximity sensor NUCLEO expansion board compatible with STM32 NUCLEO family System architecture The VL6180X contains an array of SPAD (Single Photon Avalanche Diode) detectors. The SPAD array forms part of an advanced system architecture that can detect the arrival of individual photons and hence calculate the time taken for the photon to leave the module, hit the target and then return back to the module. Actual distance measurement combined with signal amplitude allows simple, but robust, gesture recognition to enable multiple use cases. Furthermore, the VL6180X's ultra-low-power system architecture is perfectly suited to the demanding requirements of wireless and consumer products. Module design All components needed to support the proximity sensor and ambient light sensor are embedded in the simple optical module. No mechanical gaskets or additional lens systems are required to complete the industrial design. The module can be mounted on the host PCB using a standard reflow profile or flex attached. Its unique time-of-flight properties allow the module to be hidden behind a wide variety of cover-glass materials. This enables very innovative product design with the possibility of removing the hole that normally forms part of the industrial design. SYSTEM BLOCK DIAGRAM VL6180X module VL6180X module VL6180X silicon GPIO-0 GPIO-1 SDA SCL Ranging ALS AVDD Microcontroller NVM RAM GND IR emitter driver IRIR+ 13 IR emitter (VCSEL) VL6180X Nucleo expansion board Time-of-flight principle VL6180X Photon travel time Emitter Target Sensor Distance Measured distance Photon travel time = X 2 Speed of light Sensors and human interface products Accelerometers LIS2DS12 Ultra-low-power, high-performance 3-axis digital output accelerometer, embedded smart digital features, 2x2 LGA package, 12 bit LIS3DSH Ultra-low-power high-performance 3-axis nano accelerometer, embedding 2 finite-state machines LIS3DH Ultra-low-power, high-performance 3-axis digital output accelerometer, 3x3 LGA package, 12 bit LIS2HH12 High-performance 3-axis digital output accelerometer, 2x2 LGA package, 14 bit LISDH12 Ultra-low-power, high-performance 3-axis digital output accelerometer, 2x2 LGA package, 12 bit LISDE12 Ultra-low-power, high-performance 3-axis digital output accelerometer, 2x2 LGA package, 8 bit L3GD20H 3-axis digital output gyroscope for User Interface Digital gyroscopes L2G2IS 2-axis digital output gyroscope for OIS iNEMO inertial modules LSM6DS3H 3D accelerometer and 3D gyroscope, 2.5x3 LGA package, supporting multimode connections, high performance for OIS LSM6DS3 3D accelerometer and 3D gyroscope, 2.5x3 LGA package, supporting multimode connections LSM6DS33 3D accelerometer and 3D gyroscope, 3x3 LGA package LSM303C Ultra-compact, high-performance e-compass 3D accelerometer and 3D magnetometer module Digital compasses Pressure sensors LPS25HB, LPS22HB 260 to 1260 mbar absolute digital output barometer iNEMO engine sensor fusion libraries iNEMOEngine_LI3 A free software library for motion-detection system evaluation iNEMOEngine_PI3P A compiled software library with data-fusion algorithms for multiple sensor output processing Proximity sensors VL6180X Proximity sensor, gesture and ambient light sensing (ALS) module HTS221 Capacitive digital sensor for relative humidity and temperature Humidity and temperature sensor 14 Digital / Analog temperature sensors STTS751 2.25 V low-voltage local digital temperature sensor STLM20 Ultra-low-current 2.4 V precision analog temperature sensor FingerTip Ultra-low power capacitive multi-touch screen controller for 2" to 13" screens STLED524 5 x 24 dot intelligent matrix LED display driver Touchscreen controllers Display driver Audio solutions MEMS microphones and audio subsystems High-quality audio is the differentiating factor for multimedia-rich mobile platforms. ST manufactures state-of-the art analog and digital microphones with MEMS technology enabling crystal-clear sound and conversations. Our audio amplifier portfolio ranges from class G headphone drivers to class D speaker drivers that deliver high-quality sound extremely efficiently. Customers can also tune the complete audio system with ST's APWorkbench™ software. MEMS microphones Headphone amplifiers MEMS microphones target all audio applications where small size, high sound quality, reliability, and affordability are key. Our microphones meet price points set by the traditional electret condenser microphones (ECM), while featuring superior reliability and robustness. ST's MEMS microphones perfectly pair with our latest generation of Sound Terminal® audio processing devices, that feature a dedicated built-in interface for direct connection of a MEMS microphone, saving part count and cost. Very high audio quality and low power consumption with capacitor-less class G architectures in tiny flip-chip packages. Speaker amplifiers Wide range of filterless class D audio amplifiers for mono and stereo applications with gain control, 3D sound effects, and anticlipping. Key features • Microphones: Excellent SNR (>63 dB) with full frequency response (20 Hz to 20 kHz) in small package (3 x 4 x 1 mm) • Headphone and speaker amplifiers: High audio quality (PSRR, SNR, THD+N) for headsets in high-efficiency class G topologies; high power in low battery voltages with Class D technology • Audio system design: ST's APWorkbench™ software to browse through ST's audio portfolio, and select, control and tune the complete audio system easily and accurately 15 Featured products High-performance, low-power digital mems microphone with 63 db snr MP34DT01/ MP34DT01-M The MP34DT01 and MP34DT01-M are ultra-compact, low-power, omnidirectional, digital MEMS microphones built with a capacitive sensing element and an IC interface. The sensing element that detects the acoustic waves is manufactured using a special silicon micromachining process dedicated to producing audio sensors. The IC interface is manufactured using a CMOS process so that a dedicated circuit may be designed to provide a digital signal externally in PDM format. The MP34DT01 and MP34DT01-M have an acoustic overload point of 120 dBSPL with a 63 dB signal-to-noise ratio and -26 dBFS sensitivity. The MP34DT01-M is assembled in metal cap package. Key features • Single supply voltage • Low power consumption • 120 dBSPL acoustic overload point • 63 dB signal-to-noise ratio • Omnidirectional sensitivity: –26 dBFS sensitivity • PDM output • HCLGA package • Top port design • SMD compliant • EMI shielded • 16 Top port mems audio microphone with analog output in 3.35 X 2.5 X 0.98 METAL PACKAGE MP23AB02B The MP23AB02B is a compact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP23AB02B has an acoustic overload point of 125 dBSPL with a 64 dB signal-to-noise ratio. The MP23AB02B is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 to +85 °C. Key features • SNR: 64 dB • Sensitivity: -38 dBFS • Acoustic overload point: 125 dBSPL • Supply voltage: 1.6 to 3.6 V • Current consumption: 150 μA • Flat frequency response • Size: 3.35 x 2.5 x 0.98 mm Mobile security solutions F ST21N C NFC controller ST33 SWP-SIM ST33 SE & eUICC ST54 NFC & SE SiP NFC and secure element Near field communication (NFC) technology is at the heart of an expanding spectrum of easy-to-use, intuitive, contactless applications. These target a broad range of electronics devices such as handsets, wearables, and other consumer electronics devices. STMicroelectronics provides a global offer of products and solutions for NFC enablement. This includes state-of-the-art NFC controllers and a set of secure 32-bit Flash-based microcontrollers to address SWPSIM, embedded secure elements (SE), M2M SIM, and eUICC. Secure solutions are delivered as discrete ICs, or system-in-package for optimized solutions. NFC controller The ST21NFC product family is based on a microcontroller architecture with embedded EEPROM and multiple connectivity channels. The devices comply with all relevant standards, that address all possible NFC use cases. • ISO/IEC 14443 A, B, F • ISO/IEC 15693 and ISO/IEC 18092 compliant • Active load modulation is already included in the above standards • Extremely low power consumption • Up to 3 SWP for UICC, eUICC and SE • Card, reader/writer and peer-to peer modes • Power by RF field capability Secure element, SWP-SIM, eUICC The ST33 family has been designed to meet the advanced EAL5+/EMVCO security and performance requirements, combining the latest Flash technologies with the highest security levels on the secure ARM® Cortex™ SC300 core. • 32-bit ARM® SecureCore® SC300™ core • From 512 Kbytes to 1.2 Mbytes of Flash memory • 1.8 V, 3 V and 5 V VCC range • High-performance cryptographic engine • SWP, ISO and SPI interfaces • EMVCo and CC-EAL5+ certifications • Optional MIFARE® and M4M® support • Wafer, micro-module, DFN8, and WLCSP packages Key benefits • No compromise on security • Multiple application support • Design flexibility • One stop shop 17 Secure element Lowering the complexity of secured OS management, the ST33 secure element is an ST33 with a pre-loaded state-of-the-art Global Platform GP2.2 OS. A wide range of configurations are available to meet market demand. • Java JC 3.0.1 • Global Platform GP2.2 Amendment A, C, D, E • Up to 600 Kbytes of user Flash memory • EMVCo and CC EAL5+ • Multiple TSM support • Optional MIFARE® Classic, DESFire® and Mifare4Mobile® NFC CONTROLLER SECURE ELEMENT COMBO As part of global NFC offer and to minimize the PCB footprint impact of NFC, the ST54 product family is a system in package made by stack an ST21NFC NFC controller and an ST33 secure element. • Turnkey stack solution • All NFC use cases supported • BGA 4.0 x 4.0 x 0.9 mm • Pin compatibility with ST21NFC NFC Components and architectures (*) UICC Or/And eUICC ISO s so r Proce k 18 ta c NFC S Or/And eSE SPI NFC SWP (*) ST also offers NFC tags, please refer to section NFC tags NFC and secure element products Accelerometers ST21NFCB NFC controller with I²C, SPI, GPIOs and SWP interfaces Multiple secure element capable with automatic AID routing via SWP ST21NFCC NFC controller with I²C, SPI, GPIOs and SWP interfaces Multiple secure element capable with automatic AID routing via SWP, supporting active booster front-end ST33G1M2 Secure MCU with 32-bit ARM® SecurCore® SC300™ CPU, MIFARE®, SWP, ISO, SPI, GPIO interface and high-density Flash memory (1280 Kbytes) ST33H768 Secure MCU with 32-bit ARM® SecurCore® SC300™ CPU, MIFARE®, SWP, ISO, SPI, GPIO interface and high-density Flash memory (768 Kbytes) ST54D SIP (System In Package) with NFC controller, 32-bit secure microcontroller and Global Platform GP2.2 OS ST54E SIP (System In Package) with NFC controller, 32-bit secure microcontroller and Global Platform GP2.2 OS, supporting RF front-end booster NFC tags NFC/RFID tags with ISO/IEC 14443 Type A RF interface, NDEF memory and 128-bit password protection ST's ST25TA ICs provide the NFC Forum Type 4 Tag RF interface and built-in NDEF (NFC Data Exchange Format) message support. The embedded EEPROM memory density spans from 512 bits to 64 Kbits, covering a wide spectrum of applications including content-rich virtual business cards and smart signs. The ST25TA series delivers state-of-the-art RF performance and features a user-programmable digital CMOS General Purpose Output (GPO) that eliminates the need for an external component to trigger the host wake-up. KEY BENEFITS KEY APPLICATIONS • Wide memory density options from 2 K to • Smart posters Key features 64 K bits • High-reliability EEPROM • Built-in NDEF format support • Strong password protection scheme • Read or Write operations counter • Flexible user-programmable GPO • NFC business cards • ISO/IEC 14443 Type A • Consumer electronics • NFC Forum Type 4 Tag • Wireless handover • 13.56 MHz carrier frequency • Gaming • 512-bit, 2-Kbit, 16-Kbit and • Industrial • Traceability • Wearable electronics 64-Kbit densities • 56-bit unique identifier • 128-bit password protection • Optional 20-bit counter • Optional RF status digital output • 5- and 8-lead UFDFPN packages • Bumped wafer die form packages • 25 or 50pF tuning capacitance • 200 years data retention • 1 million write erase cycles 19 DEVICE SUMMARY Part number RF interface Memory size Data protection (128 bit password) 20 bit Counter Package RF status output ST25TA512 ISO 14443A Type A 512 bits Yes Yes SBN12 * No ST25TA02K ISO 14443A Type A 2 Kbits Yes Yes SBN12 * No ST25TA02K-P ISO 14443A Type A 2 Kbits Yes Yes UFDFPN5 and 8, SBN12 * Yes ST25TA16K ISO 14443A Type A 16 Kbits Yes No SBN12 * No ST25TA64K ISO 14443A Type A 64 Kbits Yes No SBN12 * No * SBN12: Sawn and Bumped wafer (die form), 120µm thickness 20 Serial EEPROM ST's EEPROMs perfectly meet the major market requirement of flexibility, with a complete portfolio of densities from 2 Kbits up to 2 Mbits. I2C and SPI buses are offered in standard and miniature packages, accommodating power supplies from 1.6 to 5.5 V. ST guarantees its portfolio at 4 million E/W cycles per byte, 100 million cycles per device, and 200 years data retention. Standard EEPROM in WLCSP are recommended each time non-volatile memory is required and available board space is less than 1 mm²: • Communication modules • Display drive modules • Camera modules UFDFPN5 package (1.4 x 1.7 mm) with reduced footprint is also available. This makes ST's EEPROMs the first choice for parameter and data management in Mobile applications. Million cycles per byte Ideal choice for heavy cycling WLCSP package Wide portfolio with high compatibility Less than 1 mA Low power consumption compared to other NVMs UFDFPN5 package 16-Kbit up to 128-Kbit I²C 21 KEY BENEFITS Key features • Optimized footprint • Reduced dimension at 0.72 mm² • Thinnest profile • Protect the whole/defined blocks of the EEPROM by software, against undesirable write instructions even if device has no hardware write protect pin (4-ball design) • Mount several EEPROMs on the same I²C bus, even if device has no chip enable pin (4-ball design) WLCSP series Memory density Software write protect M24C32S-FCU6T/T 32-Kbit M24C32S-FCU6T/TF Part number 22 Compatible 4-ball design Profile Ball size Pinout compatibility Min pitch (mm) Back side coating Device select code max. X (mm) max. Y (mm) max. (mm) typ. (mm) Yes 0.853 0.853 0.300 0.185 M24C64S 0.4 x 0.5 No 1010 001x 32-Kbit Yes 0.853 0.853 0.330 0.185 M24C64S 0.4 x 0.5 Yes 1010 001x M24C64S-FCU6T/T 64-Kbit Yes 0.853 0.853 0.300 0.185 M24128S 0.4 x 0.5 No 1010 001x M24C64S-FCU6T/TF 64-Kbit Yes 0.853 0.853 0.330 0.185 M24128S 0.4 x 0.5 Yes 1010 001x M24128S-FCU6T/T 128-Kbit Yes 0.853 0.853 0.300 0.185 M24C64S 0.4 x 0.5 No 1010 001x M24128S-FCU6T/TF 128-Kbit Yes 0.853 0.853 0.330 0.185 M24C64S 0.4 x 0.5 Yes 1010 001x M24C32T-FCU6T/TF 32-Kbit Yes 0.853 0.853 0.330 0.185 M24C64T 0.4 x 0.5 Yes 1010 000x M24C64T-FCU6T/TF 64-Kbit Yes 0.853 0.853 0.330 0.185 M24128T 0.4 x 0.5 Yes 1010 000x M24128T-FCU6T/TF 128-Kbit Yes 0.853 0.853 0.330 0.185 M24C64T 0.4 x 0.5 Yes 1010 000x M24C08-FCT6TP/T 8-Kbit No 0.715 0.705 0.330 0.185 M24C16 0.4 x 0.4 No 1010 0zzx M24C16-DFCU6TP/K 16-Kbit No 0.745 0.839 0.300 0.185 M24C08 0.4 x 0.4 No N/A M24C32-FCU6TP/TF 32-Kbit No 0.815 0.694 0.345 0.160 M24C64-FCU 0.4 x 0.4 Yes 1010 000x M24C32M-FCU6T/TF 32-Kbit No 0.815 0.694 0.345 0.160 M24C64M-FCU 0.4 x 0.4 Yes 1010 100x M24C64-FCU6TP/TF 64-Kbit No 0.815 0.694 0.345 0.160 M24C32-FCU 0.4 x 0.4 Yes 1010 000x M24C64M-FCU6T/TF 64-Kbit No 0.815 0.694 0.345 0.160 M24C32M-FCU 0.4 x 0.4 Yes 1010 100x DEVICE SUMMARY SWP 4-ball design Dimension for 128-Kbit EEPROM • Thickness less than 0.3 mm • Software write protect feature • Device select code option Signal conditionning Operational amplifiers and comparators for handheld devices STMicroelectronics is a leading supplier of power-saving and space-saving op amps and comparators offering a wide portfolio of products. ST's op amps and comparators enhance the signal chain by being the perfect companion chips for ST's microcontrollers and analog sensors. In addition to providing industry-standard solutions supported with a large production capability, ST offers upgraded versions of op amps and comparators that include better accuracy, standby functions and tiny packages. On top of upgraded versions, ST also offers high-performance zero-drift and nanopower op amps and comparators. • Heart-rate monitoring by light reflection • Gesture recognition by electromyography • Infrared emitter-receiver for remote control • Ultra-violet light measurement • Air quality sensor signal conditioning • Wireless battery charging DEVICE SUMMARY Part number Description Supply current (µA) Package TSU101, TSU102, TSU104 Nanopower 5 V CMOS op amp 0.58 SC70-5, DFN8 2 x 2, QFN16 3 x 3 TSZ121, TSZ122, TSZ124 Very high accuracy (5 µV) zero drift micropower 5 V op amp 31 SC70-5, DFN8 2 x 2, QFN16 3 x 3 TSV711, TSV712, TSV714 High accuracy (Vio < 200 µV) micropower CMOS op amp 10 SC70-5, DFN8 2 x 2, QFN16 3 x 3 TSV731, TSV732, TSV734 High accuracy (Vio < 200 µV) micropower CMOS op amp 60 SC70-5, DFN8 2 x 2, QFN16 3 x 3 Rail to rail input/output high merit factor op amp 820 DFN6 1.3 x 1.6 Rail-to-rail 0.9 V nanopower comparator 0.21 SC70-5, DFN8 2 x 2, QFN16 3 x 3 TSV991A TS881, TS882, TS884 23 Microcontrollers STM32 SMART AND WIDE CHOICE OF SOLUTIONS FOR WEARABLE DEVICES By choosing one of ST's microcontrollers for mobile application, you gain from our leading expertise in MCU architecture, technology, multi-source manufacturing and support. ST's product portfolio contains a comprehensive STM32 range of microcontrollers, from robust, low-cost 8-bit MCUs, 32-bit ARM®® based Cortex -M0 and M0+, Cortex®-M3, Cortex®-M4 and up to Cortex®-M7 Flash microcontrollers with a great choice of peripherals. Leveraging its wide and market-proven portfolio, ST offers a selection of STM32 microcontrollers perfectly fitting wearable devices targeting applications such as: • Healthcare and consumer fitness and wellness • Medical • Portable infotainment • Monitoring and safety in industrial applications In these applications, high precision, low power consumption, compact form factor, and outstanding performance are a must and ST's products take into account the needs of the most recent and innovative wearable devices. 8-bit MCUs • Wide range of processing performance • Low power and energy efficiency • Multiple and flexible power modes • Wide voltage operation range • Batch acquisition mode (BAM) • LCD drivers • Serial audio interfaces • RTC with Calendar • Multiple peripherals • Advance analog features • WLCSP packages • Small and thin UQFN packages 32-bit MCUs 24 STM8 Ultra-low-power Mainstream High-performance ST MCU Finder: All ST MCUs in your hand The ST MCU Finder app for mobile devices is the best way to explore the STM32 and STM8 portfolio of more than 700 references of microcontrollers and development boards. Define the part that best fits your application with the powerful search engine: choose and save your search criteria, compare and sort the results. Instantly access technical documentation, key features, functional block diagrams, and prices for our MCUs and development tools. Share your results with colleagues and directly buy online at our distributors. Download the complete documentation library and stay synced with the latest releases from ST. Stay connected and keep up to date with the STM32 and STM8 world through our social media, community and news feeds. Supported languages: English, Chinese (simplified and traditional), and Japanese. STM32 – The reference in sensor hubs A complete microcontroller offer including ultra-low-power STM32L as well as high-performance and power-efficient STM32F401/411 to address sensor hub applications in smartphones, tablets, and wearable devices. STM32 sensor hub microcontrollers enable low power, low latency sensor fusion and implement an innovative batch acquisition mode (BAM) allowing ultra-low-power sensor data acquisition. The application range is wide and covers from simple activity trackers (suggestion) implementing a single accelerometer up to smartphones with 9-axis accelerometer, gyroscope & magnetometer combined with environmental sensor and audio with MEMS microphones. STM32 sensor hub microcontrollers are available with 3rd party motion processing libraries including Always-on sensor fusion, gesture recognition, activity & sleep monitoring, context awareness, and indoor navigation with map matching on both AndroidTM and Windows® platforms. Key Features • Cortex®-M0+, M3 and M4 devices • Up to 100 MHz with FPU • Up to 125 DMIPS, 339 CoreMark • Up to 1 Mbyte of Flash memory and 128 Kbytes of RAM • Batch Acquisition Mode (BAM) • Current down to 87 µA/MHz in Run mode • Current down to 300 nA in Stop mode • I2C, SPI/I2S, USB, USART, and SDIO • ADC and DFSDM (PDM to PCM) • From WLCSP25 down to 2 x 2.2 mm Sensors G sensors Gyroscope Compass Proximity I2C (1 Mbit/s) SPI (42 Mbit/s) 12-bit ADC Motion coprocessor Main processor 1.8/3.3 V 1.8 V STM32 I2C (1 Mbit/s) SPI (42 Mbit/s) USB OTG FS Application processor Pressure Ambient light Gesture recognition Micro Context awareness Sensor fusion STM32 Dynamic Efficiency™ Less dynamic power More performance STM32L Ultra-low-power MCUs Indoor navigation 25 STM32 – the reference in advanced graphic user interfaces Enhanced user experience with the Chrom-ART Accelerator™ STM32 high-performance products take full advantage of ST's proprietary Chrom-ART Accelerator™ to offer advanced graphic capabilities with minimum processing overhead. Through the combination of processing acceleration, rich connectivity and optimized architecture, STM32 high-performance MCUs can handle both the demanding real-time processing and enhanced GUI that would otherwise require even more powerful – and more power-hungry – processors. Key Features • Chrom-ART Accelerator™ enabling efficient 2D copy, transparency effects and pixel format conversion independently from the main CPU • MIPI-DSI controller supporting up to 720 p / 30 Hz resolution • TFT-LCD controller supporting up to XGA resolution • LCD parallel interface supporting 8080/6800 modes • Power efficiency • Maximum integration 26 Support for the most advanced display technology ST introduced the world's first MIPI-Display Serial Interface (DSI) -enabled microcontroller, opening the door to the most advanced displays from the mobile phone industry with higher pixel density and lower power consumption. Efficiently combining the Chrom-ART Accelerator™ and the new MIPI-DSI interface, ST's latest STM32 high-performance microcontrollers enable high resolution and enhanced user experience in the smallest product form factors. Rich graphic ecosystem The STM32 ecosystem offers a large choice of advanced graphic libraries taking the full advantage of the Chrom-ART Accelerator™ and simplifying your GUI design. STM32 – the reference in audio and voice Low-power audio DSP replacement STM32L4 ultra-low-power and STM32F4 Dynamic Efficiency™ product lines combine advanced processing capabilities, outstanding low power consumption, and maximum integration to offer the ideal low-power audio and voice solutions for wearable applications. Leveraging ST's proprietary ART Accelerator™, the two product lines achieve zero wait state execution from internal Flash memory and deliver the full processing capabilities of the Cortex-M4 core running at up to 80 and 100 MHz. The Cortex-M4 DSP instruction set and the embedded floating point unit boost the performance capabilities, enabling advanced audio processing. STM32L4 ultra-low-power and STM32F4 Dynamic Efficiency™ access lines achieve an outstanding 100 µA/MHz power consumption in Run mode and offer a Batch Acquisition Mode (BAM) enabling extended battery life by exchanging batches of data through communication peripherals while maintaining the rest of the system, including the CPU, in power-saving modes. Always-on acquisition (PDM to PCM & signal conditioning) Low-power sound detector < 410 µA • 100/125 DMIPS • DSP & FPU • 100 µA/MHz in Run mode • Batch Acquisition Mode • Maximum integration Voice trigger detection < 22 mA Sub-microwatt acquisition thanks to batch acquisition mode (BAM) 27 Wide range of processing performance, connectivity features and optimized software ST's scalable STM32 microcontroller portfolio offers a wide range of processing performance and embedded SRAM sizes to meet a large number of audio application requirements. In addition, STM32 microcontrollers embed numerous audio interfaces with I2S, TDM and PDM support as well as audio dedicated PLLs to achieve audio accuracy. STM32 microcontrollers also offer rich connectivity features with USB, SDMMC, camera, and display interfaces to meet the requirements for the most advanced applications. Equally important, the STM32 software ecosystem facilitates the development of audio and voice applications by providing optimized internal and third-party audio software as well as hardware kits for prototyping. The software offer includes internal voice and audio codecs with MP3, AAC, WMA, Speex, ADPCM, G711, and G726 support. It also includes synchronization software, as well as audio post-processing solutions with SRC, equalization, bass management, smart volume control, and visualization. The STM32 ecosystem also gives access to a wide range of optimized third-party software including voice command solutions. STM32 and STM8 – the references in touch sensing and wireless STM32 and STM8L families: Integrated touch-sensing functions Certain STM32 microcontrollers feature a full hardware touch-sensing acquisition module STM8 L based on self-capacitance technology. These devices include several I/Os (up to 24 channels) for integrating multiple touch keys and providing developers with a single-device solution. 14ch 12ch STM32F3x STM32F0x 24ch 24ch 12ch 14ch STM32L4 STM32L0 24ch Microcontroller-based I/Os internally coupled to touch sensing controller with up to 24 channels 24ch Touch sensing acquisition < 5% CPU load. Based on charge transfer acquisition Free-of-charge software libraries (C source code, firmware examples) Self -capacitance Adapted development tools: STM-STUDIO and STM32CubeMX 28 STM8 - STM32 families: Wireless charging system From basic waveform generation for low-end devices up to complex waveform generation, our MCU mainstream series ensures extreme flexibility for the digital control of the coil. Timers with flexible PWM generation, dead-time management, or complemented output. • ARM Cortex-M4 + FPU at 72 MHz – 90 DMIPS • From 16 to 512 Kbytes of Flash memory • Mixed-signals: CCM-SRAM, 16-bit ΣΔ ADC, hi-res timer • ARM Cortex-M3 at 72 MHz – 61 DMIPS • From 16 Kbytes to 1 Mbyte of Flash memory • STM32 foundation: USB, Ethernet, CEC… • ARM Cortex-M0 at 48 MHz – 38 DMIPS • From 16 to 256 Kbytes of Flash memory • Entry-level, cost-sensitive: 32-bit MCU at 32 cents, USB, CAN… • STM8 core at 24 MHz STM8 S • From 4 to 128 Kbytes of Flash memory, plus E2Data • Robust and reliable for basic functions STM32 and STM8 – the references in power management • Entry-level in ultra-low- STM8L family: 8-bit ultra-low-power MCU family The STM8L, based on the 8-bit STM8 core, benefits from our proprietary ultra-low-leakage process, shared with the STM32L family, and features an ultra-low power consumption of 0.30 µA with the lowest power mode. STM8 L STM32L family: the 32-bit ultra-low power mcu family ST's ultra-low-power MCU platform is based on a proprietary ultra-low-leakage technology. STM32L0 (ARM® Cortex®-M0+), STM32L1 (Cortex-M3), STM32L4 (Cortex-M4) and the STM8L (8-bit proprietary core) represent a large range of devices addressing devices supplied from batteries or through energy harvesting and grant an optimized cost/performance ratio in all kinds of low-power applications. This ultra-low-power platform with the industry's lowest current variation between 25 and 125 °C ensures outstandingly low current consumption at elevated temperatures. The MCUs reach the industry's lowest power consumption of 350 nA in Stop mode (with SRAM retention), while maintaining the wakeup time as low as 3.5 µs. The new STM32L4 is the convergence of the ultra-low-power and high performance providing 100 DMIPS with DSP instructions and floating point unit, more memory (up to 1 Mbyte of Flash memory) and innovative features. DMIPS Performance power performance • Targeting cost-sensitive applications • Ultra-low-power market-proven solutions • Best in class in ultra–low-power performance • 32-bit ARM Cortex-M4 core with floating point unit (FPU) • From 256 Kbytes to 1 Mbyte of Flash memory • Lowest power mode + RAM + RTC: 0.6 µA 100 100 • 32-bit ARM Cortex-M3 at 32 MHz • From 32 to 512 Kbytes of Flash memory 75 • Lowest power mode + RAM + RTC: 1.2 µA 26 25 0 • 32-bit ARM Cortex-M0+ at 32 MHz L4 50 5 STM8L 16 L0 32 • From 8 to 192 Kbytes of Flash memory 33 • Lowest power mode + RAM + RTC: 0.8 µA • 8-bit STM8 core at 16 MHz L1 STM8 L 32 80 MHz • From 2 to 64 Kbytes of Flash memory • Lowest power mode + RAM +RTC: 0.5 µA 29 STM32 - BRIDGING BETWEEN VOLTAGE DOMAINS The STM32F0x8 and STM32F3x8 are specific low-voltage lines, helping overcome the challenges when adding a companion chip to a low-voltage host processor. The microcontrollers with Cortex M0 or Cortex M4 cores connect to the same digital power domain as the host, such as a 1.8 V power supply, while allowing on-chip peripherals to operate from higher voltages such as 3.3 V. This combination of 1.8 V digital supply voltage and independent analog domain is particularly strong where a wide analog dynamic range is required, or for connecting directly to USB devices. It leads to an immediate cost advantage in mobile system architectures. Key features • Multiple voltage domains in one chip • No level shifter required • Cortex-6M0 or Cortex-6M4 • Up to 90 DMIPS • Small footprint (WCSP package down to 2.6 x 2.7 mm) 1.8V STM32 VDD 1.8V VDD I/O 3.3V I/O at 1.8V USB 3.3V SPI at 1.8V ADC In 0 to 2.7V ADC of STM32F3x8 fully functional down to 1.865 V VDD Analog 2.7V 30 STM32 for antenna tuning Thanks to their low pin count and ultra-small footprint, STM32F0 and L0 MCUs are ready to be used for simple auxiliary functions like flexible switches or control elements for antenna tuning. A rich peripheral set, wide operating range, and low power consumption values allow easy integration into mobile architectures, while 38 DMIPS give enough headroom for execution of control algorithms. R F I C Sensor Key features • Low pin count QFN or WLCSP down to 4.4 mm² • ARM Cortex-M0/M0+ • Up to 38 DMIPS • Ultra-low current consumption STM32CubeMx power consumption calculator wizard With the STM32CubeMX configuration and initialization C code generator, select your chip and configure its peripherals and power supply. Then use its Power Consumption Calculator wizard to define a sequence of steps representing your application and analyze its power consumption and battery life results. 31 Radio frequency Integrated passive devices for RF front-end antenna tuners 32 STMicroelectronics provides a wide RF product offer based on its integrated passive device (IPD) technology. IPD solutions based on glass substrate can offer a low parasitic and high-Q solution suitable for RF applications. Baluns Couplers Baluns use ST's process to integrate high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm2 for the complete function. Wideband couplers use ST's process to integrate high-quality RF passive components on a single glass substrate. They are intended for cellular applications (GSM, WCDMA, LTE). The range includes highdirectivity, frequency selector and various coupling factor devices. Diplexers Band-pass filters Cost- and size-efficient way to combine different complementary radio access paths into a single antenna, combine dual antenna feeds into single feeds or vice versa. Improves RF system performance through cost-efficient frequency filtering for cellular and ISM bands. RF IPDs provide highperformance RF solutions with low sensitivity to top shielding. Key benefits • Size: up to 80% board saving • Cost: up to 40% cost saving • Performance: improved RF immunity • Low component height compared to low-temperature co-fired ceramic technologies • Fewer board placement variation effects than discrete due to monolithic implementation • High predictability from simulation enabling fast production response time Featured products Smallest high-directivity wide-band couplers with integrated attenuators CPL and DCPL series The CPL and DCPL are single- and dual-path antenna couplers used to closely monitor the forward and reverse power between the RF power amplifier and the antenna. By also integrating attenuators on coupled and isolated ports, the antenna couplers simplify circuit design while saving cost and PCB space. This additional integration is achieved using ST's proprietary integrated passive device (IPD) technology. Other types of couplers need separate attenuators. In addition, insulated glass-substrate fabrication and wafer-level packaging reduce total device height and footprint compared to alternative low-temperature co-fired ceramic (LTCC) technology. ST now offers a range of couplers with various coupling levels and an integrated flattener. Key features • 50-ohm nominal input/output impedance • Operating frequency range: 700 to 2700 MHz • Less than 0.2 dB insertion loss • 20 to 40 dB typical coupling factor • 25 dB typical directivity • Component and PCB area: • 1.3 mm2 for single path (incl. integrated attenuators) • 2.4 mm2 for dual path (incl. integrated attenuators) Low-loss frequency diplexer DIP1524-01D3 The DIP1524-01D3 is a diplexer to separate GPS/Glonass signals and WLAN, Bluetooth or LTE band VII signals received on the same antenna. The 20 dB of attenuation between bands guarantees a good separation between GPS and the other RF signals. This diplexer uses ST's proprietary integrated passive device (IPD) technology developed to address the needs of passive integration in RF applications. The DIP1524-01D3 is available in a flip-chip package with a pitch of 0.4 mm and does not require any extra PCB land around the component such as for LTCC packages. ST's solution is extremely small and saves over 50% more PCB space than conventional solutions. Key features • Operating frequency range: 1600 MHz and 2400 to 2700 MHz • 0.65 to 0.85 dB insertion loss • 20 dB attenuation between bands • -20 to -10 dB return losses • Component and PCB area: 1.1 mm2 • 50% space saving versus LTCC solutions device summary Balun companion chip BALF-SPI-01D3 BALF-SPI-02D3 BAL-CC1101-01D3 BAL-NRF01D3 + 0.8 pF 50 Ohm / Conjugate match balun to SPIRIT1 at 868/915 MHz 50 Ohm / Conjugate match balun to SPIRIT1 at 433 MHz 50 Ohm / Conjugate match balun to CC1101 at 868/915 MHz 50 Ohm / Conjugate match balun to nRFnRF51422-QFAACA/C0, nRF51822-QFAACA/C0, nRF51822-QFABAA/A0 BAL-NRF01D3 50 Ohm / Conjugate match balun to nRF24LE1, nRF24AP2-1CH, nRF24AP2-8CH BAL-NRF02D3 50 Ohm / Conjugate match balun to nRF51822-CEAA, nRF51422-CEAA, nRF51822-CDAB, nRF51822-CFAC, nRF51422-CDAB, nRF51422-CFAC BALF-NRF01D3 50 Ohm / Conjugate match balun to nRF51422-QFAADAA/E00, nRF51422-QFABA00, nRF51822-QFAAFA0/GC0/G00, nRF51822-QFABB00 BALF-NRF01E3 50 Ohm / Conjugate match balun to nRF51422-QFAADAA/E00, nRF51422-QFABA00, nRF51822-QFAAFA0/GC0/G00, nRF51822-QFABB00, nRF51822-QFAAH00, nRF51822-QFABC00,nRF51822-QFACA00 BALF-2690-02D3 BALF-NRG-01D3 50 Ohm / Conjugate match balun to STLC2690 50 Ohm / Conjugate match balun to BlueNRG DLPF-GP-01D3 Dual low-pass filter matched to GreenPeak GP540/560 RF IC BAL-CC25-01D3 50 Ohm / Conjugate match balun to CC2540/44, CC2530/31/33, CC8520/21/30/31 BAL-CC25-02D3 50 Ohm / Conjugate match balun to CC2541 33 Smart antenna tuning RF front-end antenna tuners 34 ST's smart antenna tuners offer high quality and high reliability RF tunable capacitors based on a ferroelectric material composed of baryum strontium and titanate (BST). This new tunable material allows the implementation of dynamic impedance matching for wireless handsets, which improves power amplifier efficiency and battery life while simultaneously reducing the likelihood of dropped or missed calls. tunable capacitors BST CONTROLLERs The STPTIC series of integrated tunable capacitors offers excellent RF performance, low power consumption, and high linearity required in adaptive RF tuning applications. Standard capacitor values ranging from 1.5 to 8.2 pF with a tuning ratio of 3.5:1 or 5:1. They are available in miniature chip-scale packages. The STHVDAC series are dedicated devices able to control tunable capacitors. They provide a high-voltage digital-to-analog converter (DAC), specifically designed to control and meet the wide tuning bias voltage requirement of BST tunable capacitors. Devices include SPI and MIPI RFFE serial interfaces. Key features • High tuning range (5:1) • Excellent RF linearity (IP3 > 65 dB) • High Q factor (Q > 60 @ 1 GHz) • Miniature CSP package with single footprint all PTIC values • Battery-powered operation with low-power mode to reduce power consumption • Compliant with MIPI RFFE interface for easy integration in mobile phone RF front-ends • Dynamic control to optimize capacitor transition time thanks to turbo and glide modes Featured products SMALLEST HIGH QUALITY FACTOR RF TUNABLE CAPACITOR STPTIC G2 series The STPTIC G2 series of integrated tunable capacitors offers excellent RF performance, low power consumption, and high linearity required in adaptive RF tuning applications. These tunable capacitors are controlled through an extended bias voltage ranging from 1 to 24 V to provide a 5:1 tuning ratio. Capacitor values are range from 1.5 to 8.2 pF and are packaged in a 4-ball chip-scale package to allow designers to use a single footprint for all PTIC values. The G2 series features 70dBc 3rd harmonic rejection. When higher harmonic rejection is required, the L2 series is also available. The implementation of STPTIC G2 series of tunable capacitors in mobile phones enables significant improvement in term of radiated performance, making the performance almost insensitive to the external environment. Key features • Miniature CSP package with single footprint all PTIC values • Capacitor can be connected in a shunt or series configuration • Capacitor bias is low frequency, low noise ANALOG control • Number of capacitors in the stack is increased for higher linearity: 24 (standard) for G series (x24) and 48 (high)for L series • High tuning range (5:1) • Excellent RF linearity (IP3 > 65 dB) • High Q factor Q > 60 @ 1 GHz 35 New antenna-tuning circuit boosts LTE smartphone performance STHVDAC series ST's STHVDAC-253M integrates three high-voltage DACs, allowing it to simultaneously optimize antenna performance in three different frequency bands. It supports all MIPI RFFE features such as extended mode, triggers, 26 MHz clock operation, and brings stronger signal/ more bars, fewer dropped calls, faster downloads, and longer battery life. Housed in a flip-chip 0.4 mm pitch package, the STHVDAC-253M embodies the best-in-class antenna performance in a compact and cost-effective solution. Key features • 16-bump chip-scale package (1.7 x 1.7 mm) with 0.4 mm pitch • Battery-powered operation with low power mode to reduce power consumption • Integrated boost converter with 3 programmable outputs (from 0 to 24 V) • Compliant with MIPI RFFE interface for easy integration in mobile phone RF front-end • Dynamic control to optimize capacitor transition time thanks to turbo and glide mode device summary Tunable capacitors F1 series STPTIC-xxF1M6 Tunable capacitor, 3.5:1 tuning ratio QFN 1.2x1.6 mm Tunable capacitors G1 series STPTIC-xxG1H5 Tunable capacitor, 3.5:1 tuning ratio CSP 0.5 mm pitch Tunable capacitors L1 series STPTIC-27L1M6 2.7 pF Tunable capacitor, 3.5:1 tuning ratio QFN 1.2x1.6 mm, high linearity Tunable capacitors G2 series STPTIC-15G2C5 1.5 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-27G2C5 2.7 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-33G2C5 3.3 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-39G2C5 3.9 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-47G2C5 4.7 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-56G2C5 5.6 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-68G2C5 6.8 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch STPTIC-82G2C5 8.2 pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm pitch Tunable capacitors L2 series STPTIC-27L2C5 2.7pF Tunable capacitor, 5:1 tuning ratio CSP 0.4 mm, high linearity BST controllers STHVDAC-303F6 STHVDAC-253MF3 36 3 ouputs, 30 V , 0.5 mm pitch CSP package, SPI interface 3 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface STHVDAC-253MTGF3 3 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface, turbo and glide modes STHVDAC-256MTGF3 6 ouputs, 25 V, 0.4 mm pitch CSP package, MIPI RFFE interface, turbo and glide modes Interfaces Interface secure digital (SD) cards with ST level translators. Increase the number of I/O ports and enhance the control capability of existing platforms with ST's Xpander™ technology. Direct audio and data signals on mobile devices with audio and high-speed switches. Improve design and user experience with ST's smart reset devices that remove the need for dedicated reset buttons or having to remove the battery when a device freezes. Prevent over-discharging and system start-up with low battery with supervisor devices. Level translators Camera interfaces ST's dual-supply level translators are the ideal solution for bidirectional level translation with mixed voltage systems of 1.8 V, 3.3 V and 5 V. Deserializer for SMIA CCP1 and CCP2. Dual mode deserializer for SMIA/CCP2 and MIPI/CSI-2. I/O expanders I/O expanders with advanced features: keypad scanning, PWM and rotator general I/O expanders with 8-16 I/Os. key benefits • Flexibility in system design versus monolithic implementation • Easier verification of subsystems • Faster development time by using discrete components • Deserializer enables use of parallel interface baseband with serial cameras 37 Analog switches Analog switches SEL When multiplexing audio lines, ST's special negative power supply rail reduces the audible click/pop noise when switching between multiple sources. key benefits • Flexibility in system design versus monolithic implementation • Easier verification of subsystems • Faster development time by using discrete components High-speed switches For high-frequency lines such as USB and CCP (compact camera port), ST's offers a choice of switches compliant with USB 2.0 (HS) specifications and bandwidths up to 950 MHz. Analog switch Real-time clock ST's M41T62LC6F real-time clock is the perfect match for wearable devices when size, weight, and power-efficiency matters. It offers a very low frequency error at 25 °C which equates to about 5 seconds per month, an ultra-low power consumption of 350 nA in standby, and comes in an ultra-small 1.5 x 3.2 mm package with an embedded crystal oscillator. key benefits • Timekeeping voltage down to 1 V • Ultra-small package with embedded • Programmable alarms with wakeup crystal oscillator • 1.5 x 3.2 x 0.8 mm • Ultra-low power consumption (350 nA in standby) functions • ± 2 ppm accuracy by digital calibration • Compatible with Li-Ion battery voltages Supervisors and smart resets 38 Smart resets key APPLICATIONS ST's family of Smart Reset™ ICs provides dual-assert manual-reset (push-button) inputs called smart reset inputs that make it possible to reliably resolve system hang or freeze conditions. Dual-assert manual-reset inputs require the user to assert two inputs simultaneously to initiate the system reset function. STM6519 and STM6524 are single- and dual- push-button smart reset ICs that add flexibility and user convenience at reduced size. • Smartphones, tablets, smart watches • Wearable / IoT devices • Multimedia and MP3 players • Activity trackers • Portable navigation devices • Any application that requires 1 or 2 delayed push buttons Supervisors Smart voltage supervisors with on/off controls; prevents over-charging and starting system with low battery. VCC key benefits • Ideal for touch screen devices with VCC VCC RST STM65 device SR1 RESET CSRC LED SR0 MCU/ Baseband/ PMU IO/INT/NMI IO/INT GND VSS Push-button switch Push-button switch non-removable batteries • Reuses existing keys for reset, no need for dedicated reset key Featured products High-performance SD card level translator ST6G3244 The ST6G3244 is a dual-supply, low-voltage 6-bit bidirectional CMOS level translator for SD, miniSD and microSD cards. Designed for use as an interface between baseband and memory cards, it achieves high-speed operation while maintaining CMOS low power dissipation.This device is intended for two-way asynchronous communication between data buses. All inputs are equipped with protection circuits against electrostatic discharge, giving them ESD and transient excess voltage immunity. Low drop-out voltage regulator LDO Key features • Supports 60 MHz clock rate • Supports DDR mode for SD Host CPU ESD 2 kV ST6G3244ME ESD 15 kV and EMI ESD 15 kV Card™ • Compliant with • SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) • SD Specification Part 1 Physical Layer Specification 2.00 • Bidirectional with direction control pin • EMI filtering and signal conditioning 39 device summary ST2378E ST6G3244 STMPE1600 STMPE1801 STG5123 STG3692 STG3696 STG4158 STG4160 STG3220 STG5678 STM6519 STM6524 STBP110 STBP120 M41T62 Level translators 8-bit, auto directional, OE, 15 kV ESD 6-bit, SD3.0 card I/F, CSP25 I/O expanders 16-bit basic I/O expander, low power 18-bit enhanced I/O expander Analog switches Single SPDT, 1 Ω, DFN6 Quad SPDT, USB2, QFN16 Dual SPDT, USB2, QFN10 Single SPDT, 0.6 Ω, CSP6 Single SPDT, 0.5 Ω, CSP8 Dual SPDT, USB2, QFN10 Dual SPDT, negative rail, CSP12 Smart resets Single push button, DFN6 Dual push button, DFN6 Supervisors 1.2 A, 170 mΩ RDS(on), DFN8 2.0 A, 90 mΩ RDS(on), DFN10 Real-time clock Ultra-low-power serial real-time clock, LCC8 package (3.2 x 1.5 mm), supply current 350 nA, supply voltage 1.3 to 4.4 V Protection and EMI filtering Crowbar GR1089/ ITU-T Kx - Networking Clamping EOS - 10/1000 µs and 8/20 µs EOS - ISO 7637 - Automotive ST complete product offer TVS clamping diodes and ICS Automotive-grade TVS clamping diodes and arrays EOS - ISO 10605 - Automotive TVS clamping arrays ESD - IEC 61000 - 4-2 Active protection 40 TVS crowbar diodes and ICS Specific requirements Current-limiting terminations Protection devices IPAD™ products integrate the various functions required by wireless applications, such as ESD protection diodes, EMI low-pass or common-mode filters, line terminations, and pull-up or pull-down resistors. ST's complete protection and filtering range with integrated or standalone solutions offers design flexibility while bringing space saving and high system immunity. ESD protection EOS protection Our solutions are not only specified against the highest level of IEC 61000-4-2 for robustness, but also target the lowest clamping voltages, and lowest residual currents for the highest protection efficiency. Protective devices for clamping arrays, rail-to-rail topologies, USB ports and highspeed ports are driven by requirements for robustness, efficiency, and transparency. ST proposes dataline and powerline high power-density protection, rated against IEC 61000-4-5. These EOS 8/20 µs protection devices are available in a large choice of packages, from 0402 to SMC, bringing flexibility to designers and reliability to the application. Key features • Robust ESD protection at system level including high-speed serial interfaces EMI and common mode filtering Audio, video Computer, consumer Display, camera, keypad Memory, SIM card Standard multiline bus USB Audio and video IPAD Memory and SIM card IPAD USB IPAD ST has developed a complete range of EMI filter and CMF (ECMF™) components dedicated to audio and video interfaces such as microphones, headsets, speakers, earphones, and analog TV out or HDMI. These devices provide efficient filtering of wireless frequencies above 800 MHz as well as superior ESD protection with extremely low clamping voltages. A complete range of IPAD™ components dedicated to memory-card interfaces such as used for microSD, T-Flash or SIM cards. These devices provide efficient filtering of wireless frequencies above 800 MHz as well as superior ESD protection with extremely low clamping voltage. Available in CSP or micro-QFN packages, these filters cover new standards such as SDA3.0 (SDR 104). These devices combine EMI low-pass or common-mode filters, ESD protection, and pull-up or pull-down resistors to support USB 2.0 and USB 3.1 specifications. Displays and cameras Standard multiline bus IPAD ST's ECMF™ series offers silicon commonmode filters combined with high-efficiency ESD protection. Now available in micro-QFN and CSP packages, this series offers ultracompact form factors and covers high-speed serial interface standards including MIPI. The ECMF devices are designed to avoid RF antenna desense and to protect ICs against destructive electrostatic discharges (ESD). They are particularly well suited for applications frequently subjected to RF linkloss, due to the high-speed differential links – USB or MIPI – combined with antenna RF, Bluetooth, or Wi-Fi connectivity. A complete range of IPAD™ components designed for bottom connectors and generalpurpose uses for mobile phones. These devices provide efficient filtering of wireless frequencies above 800 MHz as well as superior ESD protection with extremely low clamping voltages. Available in CSP or microQFN packages, RC or LC topologies, low- or high- line capacitance, these multiline filters immunize both digital and analog lines. Key features • Single chip interface integrating resistors, capacitors, inductors, and ESD components • PCB space saving up to 80% of board area compared to equivalent discrete solutions 41 Featured products USB flow-thru ESD protection HSP051-4N10 ST's new HSP051-4N10 alleviates the increasing sensitivity to ESD events from the user through the external connector of high-speed differential-line transceivers such as USB 3.1 (10 Gbit/s) or HDMI 2.0 4K (5.94 Gbit/s) interfaces. This ESD array is compatible with USB Type C connectors and protects ICs from contact discharges up to 8 kV as defined by IEC 61000-4-2 Level 4, with very low dynamic resistance (0.48 Ω). Its 1.9 mm² and 4-channel flow-through µQFN-10L package is only 0.32 mm thick with a 0.4 mm pitch, and minimizes impedance mismatch. With only 0.35 pF line capacitance, signal integrity is preserved, providing a 10 GHz bandwidth. Key features • Flow-through routing to keep signal integrity • Ultralarge bandwidth: 10 GHz • Ultralow capacitance: • 0.2 pF (I/O to I/O) • 0.35 pF (I/O to GND) • Very low dynamic resistance: 0.48 Ω • Low leakage current: 100 nA at 25 °C 42 Common-mode filters with integrated esd protection ECMF04-4HSWM10 Smartphones are exposed to antenna input power sensitivity decrease due to common-mode noise radiating in Rx bands coming from USB data transmissions. This may lead to RF link loss and consequently to user frustration. The latest common-mode filter in ST's ECMF™ series – the ECMF04-4HSWM10 – features deep attenuation of common-mode noise at GSM, W-CDMA, LTE, GPS, BT and Wi-Fi (2.4 GHz and 5 GHz) frequencies, combined with a robust +8 kV contact discharge ESD protection. Housed in a tiny µQFN package, it is compatible with the new USB Type C connector, and saves up to 30% of the PCB area compared to an equivalent discrete solution. Key features • Ultra wide differential bandwidth: up to 7 GHz • High common-mode attenuation (Scc21): from 800 MHz to 5 GHz • Compliance with IEC 61000-42 discharge with low clamping voltage • Low DC resistance • 60% PCB space saving versus discrete solution device summary ECMF04-4HSM10 ECMF06-6HSM16 EMIF0x-1502Mx ECMF04-4AMX12 ECMF06-6AM16 EMIF04-EAR02M8 EMIF02-SPK03F2 EMIF02-SPK02F2 ESDA5-1BF4 EMIF03-SIM03F3 EMIF03-SIM05F3 EMIF06-MSD02N16 EMIF06-HSD04F3 ECMF02-2BF3 ECMF02-2AMX6 ECMF02-4CMX8 ECM02-0730V12M12 USBULC6-3F3 EMIF01-1003M3 EMIF02-1003M16 EMIF04-1005M8 EMIF06-1005M/N12 EMIF08-1005M/T16 HSP051-4M5(1) ESDAXLC6-1BU2 HSP051-4N10 ESDARF02-1BU2CK ESDALC6V1-5T6 ESDALC6V1M3 ESDAVLC5-1BF4 ESDAULC5-1BF4 SMM4F24A SMM4F13A ESDA7P60-1U1M ESDA13P70-1U1M(1) Display, camera and keypad IPAD 2-pair common-mode filter with integrated ESD protection in micro-QFN 3-pair common-mode filter with integrated ESD protection in micro-QFN 4/6/8-line low-capacitance EMI filter and ESD protection in micro-QFN 2-pair common-mode filter with integrated ESD protection in micro-QFN 3-pair common-mode filter with integrated ESD protection in micro-QFN Audio jack IPAD 2-line EMI filter for earphones + 2-line EMI filter for microphones with integrated ESD protection in micro-QFN 2-line EMI filter and ESD protection for speakers with 0.07 Ω typ. DC line 2-line EMI filter and ESD protection for speakers with 0.35Ω typ. DC line resistance Single line bidirectional ESD protection in 0201 package with < 10 V remaining voltage Memory and SIM card IPAD 3-line EMI filter and ESD protection for SIM card interfaces in chip scale package 0.4 mm 3-line EMI filter and ESD protection for SIM card interfaces + NFC in chip scale package 6-line EMI filter and ESD protection for mini and microSD cards, SD3.0 in micro-QFN 6-line EMI filter and ESD protection for mini and microSD cards, SD3.0 UHS-1 in chip scale package USB 2.0 High Speed Single-pair common-mode filter with integrated ESD protection in chip scale package 0.4 mm Single-pair common-mode filter with integrated ESD protection in micro-QFN Single-pair common-mode filter + ID pin + VBUS with integrated ESD protection in micro-QFN Single-pair ESD + common-mode filter + ID pin & Vbus 9 V ESD protection 3-line ESD protection with 8.5 GHz bandwidth in chip scale package Standard multiline bus IPAD 1-line EMI filter with integrated ESD protection in micro-QFN 2-line EMI filter with integrated ESD protection in micro-QFN 4-line EMI filter with integrated ESD protection in micro-QFN 6-line EMI filter with integrated ESD protection in micro-QFN 8-line EMI filter with integrated ESD protection in micro-QFN Super speed USB and HDMI 2.0 4-line ultra-large bandwidth (12 GHz) ESD protection in 1.3 x 0.8 mm pitch µQFN flow-thru package Single-line ESD protection for high-speed lines in 0201 package 4-line ultra-large bandwidth ESD protection in 1.9 x 1.0 mm flow-thru package Single-line extra-low-capacitance (20 GHz bandwidth) bidirectional ESD protection in 0201 package Clamping array 5-line 1 x 1 mm ESD protection in micro-QFN Dual low-capacitance for ESD protection in micro-QFN Single-line very-low-capacitance (7 pF max) bidirectional ESD protection in 0201 package Single-line ultra-low-capacitance (3 pF max) bidirectional ESD protection in 0201 package EOS protection for USB power delivery (pin Vbus) 20 V / 60 A (8/20 µs) EOS and ESD protection 13 V / 85 A (8/20 µs) EOS and ESD protection 5 V / 60 A (8/20 µs) EOS and ESD protection 9 V / 70 A (8/20 µs) EOS and ESD protection Note: 1. Under development - target datasheet and samples available upon request. 43 Power management 44 ST's power management ICs especially designed for use in mobile devices provide high efficiency and low standby power consumption with high power density for a wide range of functions including solutions for battery charging and monitoring, LED drivers for backlights and camera flashes, power supplies for OLEDs as well as switching and linear voltage regulators and are available in a choice of miniature packages for reduced footprint and height. LDO regulators Our range of LDOs features an optimal combination of low dropout voltage, low quiescent current, fast transient response, low noise and high power supply rejection even with no external capacitor. With output voltages ranging from 0.8 to 5 V and current from 50 to 300 mA, they are available in miniature packages making them ideal for use in mobile devices. Key features • Large selection of output voltages and currents • Miniature DFN, SOT and chip-scale packages • Very low quiescent current • Ultra-low noise and high PSRR for RF circuit power supplies • Requires no bypass capacitor Featured products LDBL20 200 mA - low quiescent LDO in ultra-miniature bump-less csp Small is good in mobile devices. Smallest is best: LDBL20 is world's smallest 200 mA LDO with its amazing 0.47x0.47 mm bump-less chip-scale package (CSP). In addition to its low quiescent current, shutdown feature, a large selection of output voltages and tiny size makes it a great help for designers. Key features • 200 mV typical dropout at 200 mA • Low quiescent current 20 µA @ no load 100 µA @ 200 mA • 0.03 µA in OFF mode • Output voltage range from 0.8 to 5 V in 50 mV steps • Bump-less CSP (0.49 x 0.49 mm) • • DC-DC Converters In mobile, battery-operated applications high efficiency and small size are paramount and that's what drove us in the development of our dedicated DC-DC converters. Available in stepdown, step-up and buck-boost topologies, they feature high switching frequencies and low quiescent current and are hosted in miniature DFN or chip-scale packages. Key features • Miniature chip-scale packages • Very low quiescent current • High switching frequency for reduced losses and size • Step-down, step-up and buck- boost topologies supported Featured products ST1S15, 500 mA step-down converter The ST1S15 is a high-efficiency miniaturized step-down converter with 500 mA output current from an input voltage ranging from 2.3 to 5.5 V. Thanks to its capability to run at a 6 MHz switching frequency, the ST1S15 can use the smallest nominal values for the inductor (470 nH) and for the output capacitor (4.7 µF) still providing very good load and line transients. Hosted in a small 6-bump chip-scale package, it provides invaluable help in reducing size and efficiency. Key features • 500 mA output with 85% efficiency • 45 µA quiescent current • PFM or PWM operation for highest efficiency over whole load range • Ultra-fast load and line transient • Flip-chip package (1.19 x 0.93 mm) 45 Battery management ST's range of battery management solutions includes linear and single- or dual-input switching chargers, a chipset for wireless charging for implementations compliant with industry standards, standalone gas-gauge for accurate battery state-of-charge reporting and PMIC with charger, gas gauge and LDOs. Many solutions for a single problem: keeping your battery in great shape for a prolonged, useful life. Key features • Extensive integration for reduced external component count and size • Miniature QFN, DFN and chip-scale packages • Very low quiescent current • High efficiency Featured products STWBC and STWLC03, RX and TX chipset for wireless chargers The STWBC and STWLC03 form a complete transmitter and receiver chip-set for wireless chargers. With their optimized set of analog peripherals – such as ADCs and timers for PWM generation - their efficient CPU and the on-chip of non-volatile memory, they require just a handful of external components to implement a complete wireless chargers that can be easily made to comply with PMA and Qi industry standards. Key features • Qi and PMA standards supported • Extensive set of on-chip peripherals • Integrated synchronous rectification DC-DC converter (STWLC03) • Native support for half- and fullbridge topologies (STWBC) • On-chip NVM memory STBCFG01, battery charger with OTG boost and voltage mode fuel gauge for singlecell Li+ batteries The STBCFG01 is a highly integrated power management IC with all the necessary functions to charge single cell Li-Ion batteries, monitor the battery charge and generate 5 V to supply USB OTG bus powered devices. High switching frequency and low quiescent current ensure high efficiency in the charger section while the voltage mode fuel gauge provides accurate estimation of the state of requiring no external sensing resistor to keep external part count low and size small also thanks to a small 2.3 x 2.2 mm CSP. Key features • High efficiency switching battery charger • 1.2 A max. charging current and 20 V max tolerant input with OVP • 500 mA supply for USB OTG • High accuracy voltage mode fuel gauge • Small-footprint flip-chip package, 25 bumps (2.3 x 2.2 mm) Battery monitoring 46 Gas gauge IC for handheld applications The STC3115 and STC3117 include the hardware functions required to implement a lowcost gas gauge for battery monitoring. The devices use current sensing, Coulomb counting and accurate measurements of the battery voltage to estimate the state-of-charge (SOC) of the battery. An internal temperature sensor simplifies implementation of temperature compensation. An alarm output signals a low SOC condition and can also indicate low battery voltage. The alarm threshold levels are programmable. The STC3115 and STC3117 offer advanced features to ensure high-performance gas gauge functions in all application conditions. The devices are available in a 10-bump CSP package (1.4 x 2.0 mm) and in a 9-bump CSP package (1.5 x 1.6 mm) perfect for ultra-mobile, small form-factor applications, and the STC3115 also comes in a 10-lead DFN package (2.0 x 3.0 mm) that is easier to solder and has greater PCB bending tolerance. LED drivers and display supplies The many LEDs used in modern mobile terminals require driving solutions that are optimized for the different uses of the light source. ST offers a large portfolio of energy-efficient display supplies and drivers designed for boost topologies used by high-brightness LED solutions with multiple dimming controls for backlight LEDs as well as for high-efficiency, synchronous buckboost topologies designed for driving a single or multiple strings of white LED for electronic flash units. We offer also highly-integrated optimized low-noise DC-DC converters for passive (PMOLED) and active (AMOLED) OLEDs with negative voltage capability. Key features • Extensive integration for reduced external component count and size • Very low quiescent current • High efficiency, low noise • Miniature QFN, DFN and chip-scale packages Featured products STOD32W, triple DC-DC converter for AMOLED display supplies. Integrating a main step-up converter, an inverting DC-DC converter, and an auxiliary step-up converter – with programmable output voltage - the STOD32W provides an optimized solution for AMOLED display panel supplies as well as an optimized TDMA noise filter to minimize flickering. The STOD32W comes in an optimized flip-chip package to help reduce the size of the final application. Key features • 100 mA/4.6 V main step-up converter • Negative step-up with up to -4.6 V programmable output voltage • 55 mA auxiliary step-up with up to 7.6 V programmable output voltage • High efficiency, low noise • Miniature flip-chip package (1.6 x 1.7 mm) device summary LDBL20 LD39130S LD39115J LD39050 LD39030SJ LD39020 LD59015 LDCL015 LDLN015 LDK120 LDK130 STLQ50 STLQ015 ST1S15 STBB2 STBB3J STBB3JCC STBCFG01 STBC02(1) STBC03(1) L6924D L6924U STNS01 STWBC STWLC03(1) STOD32W STOD1317B STP4CMP STCF04 Note: 1. Under Development LDO regulators 200 mA, low-quiescent current and High PSRR in 0.49 x 0.49 mm bump-less csp 300 mA, ultra-low-quiescent current with automatic green-mode 150 mA, ultra-low-drop, low IQ, low noise 500 mA, ultra-low-drop and power good 300 mA, ultra-low-drop, soft start 200 mA, low quiescent current and High PSRR 150 mA, very-low-noise, high PSSR 150 mA, capacitor less, ultra low drop 150 mA, ultra-low-noise, high PSRR 200 mA low quiescent current and low noise 300 mA low quiescent current and low noise 50 mA, ultra-low IQ, very low drop 150 mA, ultra-low IQ, very low drop DC-DC converters 500 mA, 6 MHz, PFM/PWM step-down converter 800 mA 2.5 MHz, high-efficiency dual mode buck-boost DC-DC converter 2 A, 2 MHz, high-efficiency dual mode buck-boost DC-DC converter 2 A, high-efficiency single inductor buck-boost DC-DC converter and high brightness white LED driver Battery management Switch-mode single cell Li+ battery charger with OTG boost, voltage mode fuel gauge and LDO 450 mA linear battery charger with switch matrix and LDO 650 mA linear battery charger with switch matrix and LDO 1 A wall/USB charger for Li-ion and Li-Po Single cell Li-Ion battery charger IC for USB port and AC adapter Li-Ion Linear Battery Charger with LDO Digital controller for wireless battery charger transmitters Qi 1.1.2 A11 certified, PMA compatible Dual mode Qi/ PMA wireless power receiver LED and Display supply 100 mA triple DC-DC converter for AMOLED displays 170 mA 13 V, high-efficiency boost converter with LDO for AMOLED displays Low-voltage 4-channel constant current LED driver with charge pump for backlight High-power white LED SuperCap driver with I2C interface 47 © STMicroelectronics - December 2015 - Printed in United Kingdom - All rights reserved The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies All other names are the property of their respective owners Order code: BRMOBILE1215 For more information on ST products and solutions, visit www.st.com
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project


text:
Black Label X: Get Back Your Lost Confidence in Sexual Life!
It is known the fact that as you grow old your sexual performance, particularly among a male group, declines rapidly. But this is not permanent and it doesn't mean you have to suffer this one just because of your age factor. Many people will have ruined marital life and love relationships just because of lower interest in sex. They become incapable to satisfy their partner sexually. This is all because of the lower level of testosterone hormone and its production inside the body. In later stages, it leads to erectile dysfunction, often mood change and low ejaculation. Then how it can be controlled? What is the way for it?
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What is Black Label X?
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subset: commoncrawl


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£47m support for developing countries to improve tax systems
19 Feb 2019
The government is to offer developing countries a £47m package of support aimed at improving tax systems in a move aimed at helping end their reliance on aid, the Department for International Development (DFID) has announced
19 Feb 2019
OECD estimates suggest the average developing country generates tax revenues of around 14% of GDP, under half the 35% average for developed countries. DFID's assistance is designed to help developing countries generate greater revenues to support increased spending on essential services such as health, education and infrastructure.
The support will also contribute to economic growth by helping tackle tax avoidance and evasion and creating a more level playing field for businesses, the government said.
Penny Mordaunt, international development secretary, said: 'This new UK support will help countries collect more taxes and leave them less reliant on aid. It will turbo charge their development.
'Governments in the developing world want to move beyond aid and we want to help them get there faster. We are supporting their efforts to implement a fairer, more transparent tax system which is vital in helping our aid money go further.'
As part of the package of support, £10.3m will go to the OECD. Additional funding will be provided for the tax inspectors without borders initiative (TIWB) run by the OECD and the United Nations development programme. TIWB assists developing countries to implement international tax standards by sending experts overseas, and has been assessed as returning an additional £100 in tax revenues for every £1 spent on operating costs.
The World Bank's global tax programme will receive £7.4m to work with countries to build effective tax systems.
There is £3.7m to support the platform for collaboration on tax (PCT), a cooperative initiative launched in 2016 by the International Monetary Fund (IMF), the OECD, the United Nations and the World Bank Group.
The African Tax Administration Forum (ATAF) is being given £4.2m, and HMRC will provide up to two tax experts for four years to help ATAF's members states build a sustainable and impactful organisation.
There is £2.25m for the intergovernmental forum for mining, minerals, metals and sustainable development (IGF) to tackle tax avoidance in the mining sector.
Around £1m goes to the IMF tax administration diagnostic assessment tool (TADAT), designed to provide an objective assessment of the health of key components of a country's system of tax administration.
There is also some £13m of support to the IMF's Africa regional technical assistance centres (AFRITACs) which support African countries to build capacity in tax administration, public financial management, economic and financial sector management, and national statistics. Around £2.6m of this funding will specifically support boosting tax revenue.
The Institute for Fiscal Studies will receive some £5m to deliver the development of tax policy analysis in four developing countries and a research fund to increase knowledge of tax collection in developing countries.
Report by Pat Sweet


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We are recruiting a new Communications and Fundraising Manager to join our team.
Could you be who we are looking for? Are you passionate about the Bible and Bible Mission? Could you take responsibility for the communication and message of the Bible Society in Northern Ireland? Could you develop our fundraising strategy and help us reach and extend our audience of supporters?
To find out more, take a look at the Information Pack for the role by clicking here. You can download an Application Form here.
Please return your completed application form by email to email@example.com or by post marked Private and Confidential to Catherine Little, Bible Society NI, 27 Howard Street, Belfast, BT1 6NB before 12noon on the 29th April 2019.


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To the bible thumping, subway car preacher:
I get it.
You want to share your one "truth". You want to spread the word of your lord. You want me to believe in your god. You want to "save" me.
Here's the thing though—
I have my own truth. Yes, I happen to be Catholic but the values and principles I have, I inherited from the strong and respectable family in which I was privileged to be surrounded by my entire life. That is my truth.
Though I think it necessary to read the bible because it is a great literary piece that is oft referenced by other great works (& I have, actually, cover to cover), it's just that: a literary piece. You cannot pick and choose which passages are to be taken literally & which you can excuse as "outdated". I mean think about it, love and commitment between two men (or two women) are wrong because the bible says so? Are you telling me then, that you would actually follow through with cutting off a woman's hand because "Bible says":
If two men, a man and his countryman, are struggling together, and the wife of one comes near to deliver her husband from the hand of the one who is striking him, and puts out her hand and seizes his genitals, then you shall cut off her hand; you shall not show pity.
Deuteronomy 25:11-12
If you would, you have more problems than I originally thought.
I believe in people. I believe that we are all inherently good and that we are all connected. I believe that the best thing I can do in my lifetime is try and be as decent, compassionate, forgiving, generous and gracious a person as I can be to man and animal alike. If god is who you says he is, that's what would matter in the end and not whether I gave money to and attend your church every Sunday.
I don't need to be saved. Period.
So next time you decide to play show and tell, please do it in your church. Preaching to grown men and women in a subway car because they have no other choice—they're literally trapped—is not just irritating it's offensive. I get enough of it walking on the street, please leave my morning commute alone.


text:
Author: Mary Beth Miller
Page Length: 276
Reading Level: 6
Genre: Fiction
PLOT SUMMARY: As far as everyone else is concerned, Zoe's guilty. She can't go anywhere near her old friends and her parents have had to move her away to a new school. Aimee is gone, and this is what Zoe gets for "helping" her – total alienation from her friends, loneliness, isolation, parents who think she's a murderer, and weekly visits to see a shrink. All Zoe did was try to be a friend and this is her reward??
REVIEW: This book is not the average read by any means. Aimee was Zoe's best friend. She talked often of killing herself and one night in Zoe's presence does just that. There are issues of teen sex where Zoe had sex with Chard and took hot baths, etc. taking what she considered aggressive actions not to be pregnant. Aimee tells Zoe stories of an abusive step mother who assaults her sexually. Zoe deals with her own depression and anorexia as a result of the incident. Zoe's parents are cracking under the stress of probation, psychiatrists, and Zoe's erratic behavior. On the other hand, the book deals well with an extremely emotional topic – suicide. The reader experiences first hand Zoe's pain, loss, and suffering (which might make an excellent anti-suicide teaching point). The topics covered in the book are excellent for sparking classroom discussion / debates. Should you elect to let your students read this book – it should definitely be a page turner and of high interest.
AREAS FOR TEACHING: character traits, sequence of events, flashback, depth of emotion for character development, cause and effect, comparing and contrasting
TOUCHY AREAS-PAGES: girl talks about slitting her wrists (p. 86), child abuse reference (p.133), suicide reference (pgs. 243-246)
RELATED BOOKS: On the Head of a Pin, Handtalk School, The Pact, Thirteen Reasons Why, Hold Tight, Teen Suicide
MUSIC CONNECTIONS: Good Charlotte – Hold On, Linkin Park – Breaking the Habit
REVIEWED BY: Dayna Taylor