RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No. 2020-027648, filed Feb. 21, 2020, the entire content of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method of manufacturing the same.

2. Description of the Related Art

Along with the needs for downsizing and reducing the weight of electronic devices and improving the functions thereof, surface mount packages have been frequently used. A surface mount package allows high-density mounting of semiconductor devices on an electronic device. In analog ICs or the like, in recent years, further increase in accuracy of electrical characteristics has been demanded. However, during a packaging step or other mounting steps, stress may be applied to a semiconductor element to cause variations in electrical characteristics. Accordingly, target electrical characteristics may not be obtained.

A low-stress resin film having a Young's modulus smaller than that of a mold resin may be provided between the mold resin and the semiconductor element. In this manner, stress to be applied to the semiconductor element can be reduced (see, for example, Japanese Patent Application Laid-open No. 2014-27266).

However, in such an environment that requirements for variations in electrical characteristics are becoming more severe, further reduction of the stress to be applied to the semiconductor element is demanded.

SUMMARY OF THE INVENTION

The present invention has an object to provide a semiconductor device capable of reducing stress to be applied to a semiconductor element.

In order to solve the above-mentioned problem, the present invention adopts the following measures.

There is provided a semiconductor device including: a semiconductor element; a die pad on which the semiconductor element is placed; a lead arranged so as to be spaced apart from the die pad; a low-stress resin film provided on an element surface of the semiconductor element; and an encapsulating resin for covering the semiconductor element, the low-stress resin film, the die pad, and the lead, wherein the low-stress resin film has a Young's modulus which is smaller than a Young's modulus of the encapsulating resin, and has a first concave curved surface in a surface of the low-stress resin film opposite to a surface thereof in contact with the semiconductor element.

Further, there is provided a method of manufacturing a semiconductor device including: a semiconductor element; a die pad on which the semiconductor element is placed; a lead arranged so as to be spaced apart from the die pad; a low-stress resin film provided on an element surface of the semiconductor element; and. an encapsulating resin for covering the semiconductor element, the low-stress resin film, the die pad, and the lead, the method including: preparing the die pad and the lead arranged so as to be spaced apart from the die pad; mounting the semiconductor element on the die pad; forming, on the element surface of the semiconductor element, the low-stress resin film in which a first back surface is a planar surface and a first main surface opposite to the first back surface is a first concave curved surface; and forming the encapsulating resin to cover the semiconductor element, the low-stress resin film, the die pad, and the lead.

Through use of the above-mentioned measures, the semiconductor device capable of reducing the stress to be applied to the semiconductor element from the encapsulating resin can be achieved.

