CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priorities from Japanese Patent Application No. 2019-013385 filed on Jan. 29, 2019, Japanese Patent Application No. 2019-039687 filed on Mar. 5, 2019, Japanese Patent Application No. 2019-059486 filed on Mar. 26, 2019, and Japanese Patent Application No. 2019-238083 filed on Dec. 27, 2019; the entire contents of these applications are incorporated herein by reference.

BACKGROUND

1. Field

Embodiments of the present invention relate to a method for manufacturing a light-emitting device.

2. Description of Related Art

A small light-emitting device is known, in which an encapsulating member containing a reflecting material covers the lateral and lower surfaces of a light-emitting element instead of a housing for accommodating the light-emitting element and in which plated electrodes are arranged in contact with the lower surfaces of bump electrodes of the light-emitting element and the lower surface of the encapsulating member (for example, Japanese Unexamined Patent Application Publication No. 2012-124443).

A method for manufacturing a light-emitting device is known that includes forming a metal layer continuously covering paired electrodes and a covering member and removing a portion of the metal layer by irradiation with laser light (for example, Japanese Unexamined Patent Application Publication No. 2017-118098).

SUMMARY

An object of embodiments of the present invention is to provide a method for manufacturing a small and reliable light-emitting device.

According to one aspect of the present invention, a method for manufacturing a light-emitting device includes a step of preparing an intermediate product including a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed, a step of forming a metal paste layer continuously covering the exposed portion of the paired electrodes and the first covering member, and a step of forming paired wirings for preventing the paired electrodes from being short-circuited by irradiating the metal paste layer on the paired electrodes and the metal paste layer on the first covering member with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

