BACKGROUND

Field

Embodiments described herein relate to microelectronic packaging, and more particularly to reinforcement structures to facilitate rework processes.

Background Information

The current market demand for portable and mobile electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, portable players, gaming, and other mobile devices requires the integration of more performance and features into increasingly smaller spaces. As a result, various multiple-die or component packaging solutions such as system in package (SiP) have become more popular to meet the demand for higher die/component density devices.

SiP structures typically include two or more dissimilar dies or components in a single package as a functional system or sub-system. For example, logic and memory may be combined into a single package, along with other components such as passive devices, MEMS devices, sensors, etc. The dies and components within an SiP can be stacked vertically or arranged horizontally on a routing substrate and encapsulated in a molding compound material to provide mechanical and chemical protection for the package. Thermosetting resins such as epoxy molding compound (EMC) are commonly used for molding compound materials due to their mechanical strength, moldability, and thermal and chemical stability.

SUMMARY

Electronic package structures including reinforcement structures to facilitate the rework of exposed components and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures may be included within the package to provide mechanical rigidity and robustness to the package for warpage control while maintaining reduced z-height of the package, including a top side molding layer between the components and the package substrate, a frame board mounted on the bottom side of the package substrate, and an unbalanced package substrate.

