The present application is based on, and claims priority from JP Application Serial Number 2019-216445, filed Nov. 29, 2019 and JP Application Serial Number 2020-110249, filed Jun. 26, 2020, the disclosures of which are hereby incorporated by reference herein in their entireties.

BACKGROUND

1. Technical Field

The present disclosure relates to a sensor unit, an electronic apparatus, and a moving object.

2. Related Art

For example, in a sensor unit described in JP-A-2016-118421, a sensor module mounted with an inertial sensor is fixed to an outer case with a screw. Further, a flexible joining member is provided between the outer case and the sensor module, and the outer case and the sensor module are joined via this joining member.

However, in the sensor unit having such a configuration, since the sensor module is fixed to the outer case with the screw, noise vibration generated in the outer case is easily transmitted to the inertial sensor via the screw. Therefore, a detection characteristic of the sensor module may deteriorate.

SUMMARY

A sensor unit according to an aspect of the present disclosure includes: a substrate; an inertial sensor module mounted at the substrate; a container including a storage space for storing the substrate and the inertial sensor module; and a coupling member that couples the container and the substrate in a state in which the substrate and the container are in non-contact with each other, in which the coupling member has elasticity, and an elastic modulus of the coupling member is smaller than an elastic modulus of the container.

