CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Japanese Patent Application No. 2019-028422, filed Feb. 20, 2019, the entire content of which is incorporated herein by reference.

BACKGROUND

Technical Field

The present disclosure relates to coil components.

Background Art

Electronic components are incorporated in various electronic devices. One known example of the electronic components is a multilayer-type coil component as described, for example, in Japanese Unexamined Patent Application Publication No. 2014-127718. The multilayer-type coil component includes a multilayer body in which a plurality of insulating layers are laminated and coil conductive layers disposed inside the multilayer body.

In the above-described coil component, an internal defect, such as a crack, may occur. Typically, each of the insulating layers used in the above-described coil component has a coefficient of linear expansion different from that of each of the coil conductive layers. Thus, stress is accumulated by heat load exerted in a producing process and a mounting process, and this may cause an internal defect, such as a crack. In particular, such an internal defect is likely to occur when the insulating layer is a resin insulating layer, which is made of a resin. This is because a photosensitive resin insulating layer that has a significantly larger coefficient of linear expansion than that of the coil conductive layer is commonly used as the resin insulating layer, and a large amount of stress is accumulated in the resin insulating layer.

SUMMARY

Accordingly, the present disclosure provides a coil component in which the occurrence of internal defects can be suppressed.

According to preferred embodiments of the present disclosure, a coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and a first coil conductive layer disposed inside the multilayer body. The multilayer body includes a non-photosensitive first resin insulating layer and a photosensitive second resin insulating layer and has a section where the first resin insulating layer and the second resin insulating layer are alternately laminated.

In this configuration, the stress in the second resin insulating layer, which has a larger coefficient of linear expansion, can be easily released in the section where the first resin insulating layer and the second resin insulating layer are alternately laminated, and thus the occurrence of internal defects, such as cracks, can be suppressed.

According to preferred embodiments of the present disclosure, a coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and a first coil conductive layer disposed inside the multilayer body. The multilayer body includes a first resin insulating layer and a second resin insulating layer having a coefficient of linear expansion larger than that of the first resin insulating layer and has a section where the first resin insulating layer and the second resin insulating layer are alternately laminated.

In this configuration, the stress in the second resin insulating layer, which has the larger coefficient of linear expansion, can be easily released in the section where the first resin insulating layer and the second resin insulating layer are alternately laminated, and thus the occurrence of internal defects, such as crack(s), can be suppressed.

The preferred embodiments of the present disclosure can provide the coil component in which the occurrence of internal defects can be suppressed.

Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments of the present disclosure with reference to the attached drawings.

