PRIORITY CLAIM

The present application claims benefit of priority under 35 U.S.C. §§ 120, 365 to the previously filed Japanese Patent Application No. JP2019-89251 with a priority date of May 9, 2019, which is incorporated by reference herein.

TECHNICAL FIELD

The present invention relates to heat transport devices in general, and in particular to a heat transport device that transports heat from a heating element located within an electronic apparatus.

BACKGROUND

An electronic apparatus, such as a laptop personal computer (PC), may include a heating element, such as a central processing unit (CPU), and it is desirable to appropriately dissipate heat from the heating element. Because a CPU, a heat pipe, and a heat spreader are stacked in a thickness direction within a chassis of an electronic apparatus, it is difficult to make the electronic apparatus.

In addition, combinations of a heat pipe and a heat spreader include heat transport devices500A,500B, and500C, as illustrated inFIG. 8. The heat transport device500A illustrated inFIG. 8Aincludes a heat pipe502and a heat spreader504a. The heat pipe502has a heat receiving surface506in contact with a CPU508, which is a heating element. The CPU508is mounted on a board510. The heat spreader504ais fixed to a side surface512perpendicularly intersecting with the heat receiving surface506of the heat pipe502to perform heat transfer. The heat pipe502and the heat spreader504aare equal in thickness. This heat transport device500A is heavy in weight since the heat spreader504ais thick. In addition, although a design area of contact between the heat pipe502and the heat spreader504ais large, there is concern that no good heat transfer characteristics can be obtained if an actual contact between them is insufficient.

The heat transport device500B illustrated inFIG. 8Bincludes the heat pipe502and a heat spreader504b. The heat spreader504bis fixed to the side surface512to perform heat transfer. The heat spreader504bis thinner than the heat pipe502. This heat transport device500B is light in weight since the heat spreader504bis thin. However, since an area of contact between the heat pipe502and the heat spreader504bis small, there is concern that heat transfer characteristics and mechanical strength may be insufficient.

The heat transport device500C illustrated inFIG. 8Cincludes the heat pipe502and a heat spreader504c. The heat spreader504cis fixed to an opposed surface514opposite to the heat receiving surface506of the heat pipe502. In this heat transport device500C, the CPU508, the heat pipe502, and the heat spreader504care stacked in a thickness direction. Although it is possible to set the heat spreader504cmoderately thin, it is desirable to make it thinner.

The present disclosure provides an improved heat transport device that transports heat of a heating element within an electronic apparatus.

SUMMARY

In accordance with an embodiment of the present disclosure, a heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.

All features and advantages of the present disclosure will become apparent in the following detailed written description.

