BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a sound producing package structure and a method for packaging a sound producing package structure, and more particularly, to a sound producing package structure and a method for packaging a sound producing package structure where a surface mount technology (SMT) is used.

2. Description of the Prior Art

Nowadays, a surface mount technology (SMT) is widely used in a package structure, wherein the surface mount technology is an assembly technology in which electronic components are directly connected onto a surface of a substrate (e.g., a circuit board) with printed conductive elements (e.g. solders). The surface mount technology has the following advantages: 1) The electronic components in the package structure can be disposed in high density, such that the size of the package structure can be decreased (e.g., the package structure can be miniaturized); 2) The surface mount technology has the high reliability; 3) The highly automatized formation of the package structure can be achieved by the surface mount technology, so as to decrease the cost of the package structure and enhance the productivity of the package structure.

However, the surface mount technology cannot be used in a conventional speaker because the conventional speaker cannot tolerate the process temperature of the surface mount technology. For example, if the surface mount technology is used in the conventional speaker, the electronic component(s) and/or structure(s) of the conventional speaker can be damaged due to the process temperature of the surface mount technology, such that the conventional speaker cannot be normally operated after processing the surface mount technology.

SUMMARY OF THE INVENTION

It is therefore a primary objective of the present invention to provide a sound producing package structure and a method for packaging a sound producing package structure where a surface mount technology is used.

An embodiment of the present invention provides a sound producing package structure configured to produce sound, wherein the sound producing package structure includes a substrate, a sound producing component and a conductive adhesive layer. The sound producing component is disposed on the substrate, and the sound producing component is configured to generate an acoustic wave corresponding to an input audio signal. The conductive adhesive layer is disposed between the substrate and the sound producing component by a surface mount technology.

An embodiment of the present invention further provides a method for packaging a sound producing package structure. The method includes: providing a substrate; forming a sound producing component, wherein the sound producing component is configured to generate an acoustic wave corresponding to an input audio signal; and disposing the sound producing component on the substrate via a conductive adhesive layer by using a surface mount technology.

In the present invention, according to the present invention, the surface mount technology is used to manufacture the sound producing package structure, the highly automatized formation of the sound producing package structure can be achieved, and/or the sound producing package structure can be miniaturized more.

These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

