TECHNICAL FIELD

The present disclosure relates to a double-layer shielding device and a thin-film-deposition equipment with the same, which mainly employ shield members to cover a substrate carrier, in order to prevent polluting the carrier during a process of cleaning the reaction chamber.

BACKGROUND

Thin-film-deposition equipments, such as chemical-vapor deposition (CVD), physical-vapor deposition (PVD) and the atomic-layer deposition (ALD) equipments, those are commonly employed in manufacturing process of semiconductors, light-emitting diodes and displays, etc.

A thin-film-deposition equipment mainly includes a chamber and a substrate carrier, wherein the substrate carrier is within the chamber for carrying at least one substrate. To exemplify by PVD, a target material is required to dispose within the chamber, wherein the target material faces the substrate on the substrate carrier. When performing PVD, noble gas or reactive gas is transferred into the chamber, then bias electricity is applied on the target material and the substrate carrier respectively, also the substrate carried on by the substrate carrier is heated up.

The noble gas or reactive gas within the chamber transforms into ionized gas in effect of a high-voltage electric field, then the ionized gas is attracted by the bias electricity to bombard the target material. Thereby, atoms or molecules splashed from the target material are attracted by the bias electricity on the substrate carrier, then be deposited on surface of the substrate and forms a thin film on the surface of the substrate.

After some time of usage, an inner-edge surface of the chamber may also be formed with thin film, then a periodic cleaning is required to perform to the chamber, in order to prevent the waste thin film from dropping onto the substrate and causing pollution during the process of thin-film deposition. Moreover, surface of the target material may be formed with oxide or other pollutant, therefore requires a periodic cleaning as well. Generally, a burn-in process is applied to bombard the target material within the chamber by plasma ions, then to remove the oxides or pollutants on the surface of target material.

To perform the abovementioned cleaning process, the substrate carrier and the substrate must be extracted or kept out, to prevent the removed pollutant from turning to pollute the substrate carrier and the substrate, during the cleaning process.

SUMMARY

Generally, after some time of usage, the thin-film-deposition equipment is required for cleaning, in order to remove the waste thin film within the chamber and the oxide or nitride on the target material. During the cleaning process, some removed pollutant particles may turn to pollute the substrate carrier, thus there is a need to keep out the substrate carrier (carrier) from the removed pollutant. The present disclosure provides a double-layer shielding device and a thin-film-deposition equipment with the same, which mainly employs a driver to rotate and swing two shield members in opposite angular directions to approach or leave each other, such that to operate between a shielding state and an open state. Thereby, the shield members in shielding state can cover and shield the substrate carrier, to prevent the removed pollutant particles from turning to pollute the substrate carrier during the process of cleaning the chamber or the target material.

An object of the present disclosure is to provide a thin-film-deposition equipment with double-layer shielding device, which includes a reaction chamber, a carrier and a shielding device. The shielding device includes a driver, two shield members and two guard plates, wherein the driver interconnects and swings the shield members to move in opposite angular directions, such that to operate the shield members between an open state and a shielding state. Moreover, the two guard plates are respectively disposed on the two shield members, and hence positioned between the two shield members and the target material.

During a process of cleaning the reaction chamber, the driver swings the two shield members to approach each other, such that the two shield members come together to cover the carrier within a containing space, in order to prevent a plasma employed to proceed the cleaning or some removed waste pollutant from turning to pollute the substrate carrier and/or the substrate thereon. Alternatively, during a process of performing the deposition, the driver swings the two shielding members to leave each other, such that to permit the process to proceed on the substrate within the reaction chamber.

An object of the present disclosure is to provide a thin-film-deposition equipment with shielding device, which employs two shield members that can combine to form a whole shield, thereby to improve space efficiency. In one embodiment, the two shield members sway in opposite angular directions within the containing space of the reaction chamber, wherein the two are operable between an open state and a shielding state within the reaction chamber, such that to improve space efficiency of the reaction chamber.

Furthermore, the two shield members can approach each other to form a whole shield for a full coverage of the carrier against the pollutants. Therewith, the two guard plates also approach each other to cover and protect the two shield members. Moreover, the two guard plates and the two shield members have a gap therebetween, for preventing high-temperature matters and some heat directly transferring from the two guard plates to the two shield members during the cleaning process, such that to prevent thermal deformation of the shield members.

An object of the present disclosure is to provide a thin-film-deposition equipment with double-layer shielding device, wherein the first-shield member and the second-shield member have a first gap space therebetween, the first-guard plate and the second-guard plate have a second gap space therebetween, and moreover the first gap space and the second gap space do not spatially overlap. Such that, the pollutants created during the cleaning process are prevented from straightly passing the first gap space and the second gap space and then contact the carrier.

To achieve the abovementioned object, the present disclosure provides a thin-film-deposition equipment, which includes a reaction chamber that has a carrier within the containing space for carrying at least one substrate; and a double-layer shielding device. The double-layer shielding device comprising: a first-shield member that is disposed within the containing space; a first-guard plate that is disposed on a surface of the first-shield member; a second-shield member that is disposed within the containing space; a second-guard plate that is disposed on a surface of the second-shield member; and a driver that interconnects and drives the first-shield member and the second-shield member to respectively sway and move the first-shield member and the second-shield member in opposite directions between an open state and a shielding state, wherein in the shielding state, the first-shield member and the second-shield member approach each other to cover the carrier, therewith the first-guard plate and the second-guard plate also approach each other to protect the first-shield member and the second-shield member.

The present disclosure also provides a double-layer shielding device, which is adapted to thin-film-deposition equipment, and includes: a first-shield member; a first-guard plate that is disposed on a surface of the first-shield member; a second-shield member; a second-guard plate that is disposed on a surface of the second-shield member; and a driver that interconnects and drives the first-shield member and the second-shield member to respectively sway and move the first-shield member and the second-shield member in opposite directions between an open state and a shielding state, wherein in the shielding state, the first-shield member and the second-shield member approach each other, therewith the first-guard plate and the second-guard plate also approach each other to protect the first-shield member and the second-shield member.

Another object of the present disclosure is to provide the abovementioned shielding device and thin-film-deposition equipment, wherein each of the two shield members has a surface facing each other and respectively disposed with a cavity and a protrusion. The driver drives and swings the two shield members to approach each other, wherein the protrusion on one of the shield member is inserted into the cavity on another one of the shield member, such that the two shield members form a whole shield.

To achieve the abovementioned object, the present disclosure provides the aforementioned shielding device, wherein: the first-shield member includes a first-inner-edge surface formed with at least one protrusion; the second-shield member includes a second-inner-edge surface formed with at least one cavity corresponding to the protrusion of the first-inner-edge surface.

Another object of the present disclosure is to provide the abovementioned shielding device and thin-film-deposition equipment, wherein the shielding device includes two drivers respectively connected to the two shield members.

To achieve the abovementioned object, the present disclosure provides the aforementioned shielding device, wherein the driver includes: a first driver connected to the first-shield member; and a second driver connected to the second-shield member, wherein the first driver and the second driver respectively drive and swing the first-shield member and the second-shield member in the opposite directions, thereby the first-shield member and the second-shield member are switchable between the open state and the open state.

