CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean Patent Application No. 10-2019-0094257 filed on Aug. 2, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer ceramic electronic component, and more specifically to a multilayer ceramic electronic component having excellent reliability and a manufacturing method thereof.

BACKGROUND

Generally, electronic components using ceramic materials such as capacitors, inductors, piezoelectric devices, varistors, thermistors, or the like, may include a ceramic body formed of a ceramic material, internal electrodes formed inside the ceramic body, and external electrodes disposed on a surface of the ceramic body so as to be connected to the internal electrodes.

Among multilayer ceramic electronic components, a multilayer ceramic capacitor includes a plurality of laminated dielectric layers, internal electrodes disposed to oppose each other with a dielectric layer interposed therebetween, and external electrodes electrically connected to the internal electrodes.

Multilayer ceramic capacitors are widely used as components of computers, PDAs, mobile phones, and other mobile communication devices due to their small size, high capacity and ease of mounting.

Recently, in accordance with the lightening and miniaturization of electronic devices with high performance, there has been demand also for electronic components to be miniaturized and have high performance and high capacity.

In particular, a method of simultaneously achieving miniaturization, high performance and high capacity is to laminate a large number of layers by reducing thicknesses of dielectric layers and the internal electrode layers of the multilayer ceramic capacitor. Currently, the thickness of the dielectric layer has reached at about 0.6 μm, and slimming of the dielectric layers is ongoing.

In this regard, a ratio of interface contact between the internal electrode and the dielectric continuously increases; however, a region in which a metal and ceramic are bonded is vulnerable to delamination and cracking due to low adhesion therebetween.

As the delamination and cracking lead to deterioration of moisture resistance reliability of the multilayer ceramic capacitor, a new method for securing high reliability with respect to materials or structures to solve such problems.

SUMMARY

The present disclosure relates to a multilayer ceramic electronic component and a manufacturing method thereof, and more particularly to a multilayer ceramic electronic component and a manufacturing method thereof having excellent reliability.

According to an aspect of the present disclosure, a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

According to another aspect of the present disclosure, a manufacturing method of a multilayer ceramic electronic component includes preparing a ceramic green sheet comprising ceramic powder, forming an internal electrode pattern with a conductive paste comprising a conductive metal particle and an additive on the ceramic green sheet, laminating a ceramic green sheet on which the internal electrode pattern is formed to form a ceramic laminate and plasticizing the ceramic laminate to form a ceramic body comprising a dielectric layer and an internal electrode, wherein, when an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

