CROSS REFERENCE

The present application claims foreign priority of Chinese Patent Applications No. 201922499927.5, filed on Dec. 31, 2019 in the State Intellectual Property Office of China, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to the field of electronic devices, in particular to an electronic device and a power module thereof.

BACKGROUND

With the widespread application of electronic devices, the number of electronic components arranged on a circuit board in a power module is increasing. Pins of the electronic components are usually soldered on the circuit board. As the use time of the electronic devices is prolonged, the electrical connection between the pins of the electronic component and pads on the circuit board is likely to fail, which may cause damage to the electronic devices.

SUMMARY OF THE DISCLOSURE

The present disclosure provides a power module including: a power housing; a circuit board, connected to the power housing and arranged with a plurality of pads on a surface of the circuit board facing the power housing; an electronic component, arranged on the circuit board and including a plurality of pins; wherein the plurality of pins are soldered and connected to the plurality of pads; and a first sealant layer, arranged on the surface of the circuit board facing the power housing, and covering the plurality of pins and the plurality of pads.

The present disclosure further provides an electronic device, including a power module as described above.

