TECHNICAL FIELD

The present disclosure relates to heat dissipation and more specifically to a new structure in an antenna array for managing heat dissipation and easier access to components.

BRIEF INTRODUCTION

In certain radar applications, such as radars configured on drones to track objects within the air, the radar will be a printed circuit board of an array of antennas. Each antenna generates heat and the overall radar includes a number of different layers of construction.

For example, the Fortem Technologies “TrueView” Radar provides a compact radar solution that can be configured on a drone and can provide warnings of intrusive or non-cooperative air traffic. The structure of such a radar can include a flat outer surface representing a first layer and can have embedded therein transmission antennas and receiving antennas. Bonded to the first layer can be an RF board, followed by a digital board and finally an I/O layer which can include couplings for cables or other channels.

One challenge with such a structure is a need to have a flat surface on the first layer. Any extension that protrudes from the flat surface, such as the head of a screw, can reflect radar signals either transmitted from the transmission antennas or that are received from the object. The boards get hot if any object, like a screw head, distorts the waves that are transmitted or received.

