CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims the benefit of priority from Japanese Patent Application Nos. 2018-244752 and 2019-203311 filed on Dec. 27, 2018 and Nov. 8, 2019, respectively, with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

Exemplary embodiments of the present disclosure relate to a substrate placing table and a substrate processing apparatus.

BACKGROUND

A substrate (wafer) placed on a placing table can be held by an electrostatic chuck. The electrostatic chuck electrostatically attracts the wafer to the placing table by an electrostatic force. A placing device disclosed in Japanese Unexamined Patent Publication No. 2008-117982 is provided with a placing body and an electrostatic chuck. An object to be treated is placed on the placing body. The electrostatic chuck is provided with an insulating layer and an electrode layer embedded in the insulating layer. In the electrostatic chuck, voltage is applied to the electrode layer, whereby an electrostatic force is generated between the electrode layer and the object to be treated, and thus the object to be treated is electrostatically attracted to the surface of the insulating layer. An electrostatic chuck layer which is an insulating layer on the surface side of the electrode layer is an yttrium oxide sprayed layer having a thickness in a range of 200 to 280 μm and formed by plasma spraying. The surface of the electrostatic chuck layer is formed with a surface roughness depending on the particle size of yttrium oxide which is thermally sprayed.

SUMMARY

In an exemplary embodiment, a substrate placing table is provided. The substrate placing table includes a base and an electrostatic chuck provided on the base. The electrostatic chuck includes a lamination layer portion, an intermediate layer, and a covering layer. The lamination layer portion is provided on the base. The intermediate layer is provided on the lamination layer portion. The covering layer is provided on the intermediate layer. The lamination layer portion includes a first layer, an electrode layer, and a second layer. The first layer is provided on the base. The electrode layer is provided on the first layer. The second layer is provided on the electrode layer. The intermediate layer is provided between the second layer and the covering layer and is in close contact with the second layer and the covering layer. The second layer is a resin layer. The covering layer is ceramics.

The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, exemplary embodiments, and features described above, further aspects, exemplary embodiments, and features will become apparent by reference to the drawings and the following detailed description.

