CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0127204 filed on Oct. 24, 2018 in the Korean Intellectual Property Office, the disclosure of which is herein incorporated by reference in its entirety.

TECHNICAL FIELD

Exemplary embodiments of the present inventive concept relate to a device and a method for testing a semiconductor device and a test handler, and more particularly, to a device for testing a semiconductor device, a method for testing a semiconductor device, and a test handler to easily check a state of contact between the semiconductor device and a test board during a process of manufacturing the semiconductor device.

DISCUSSION OF THE RELATED ART

A variety of semiconductor products including a memory such as, for example a dynamic random access memory (DRAM), a flash memory, etc., and non-memory devices such as, for example, non-memory logic devices, may go through numerous product quality verification processes depending on usage. Generally, a test process performed in a final stage of the verification process may be conducted by semiconductor test equipment such as a test handler, a tester, etc. The test handler may provide support for testing a semiconductor device manufactured through a certain manufacturing process, and semiconductor devices may be classified by grades in accordance with a test result.

To test a semiconductor device, the test handler may perform an operation for connecting the semiconductor device to a test board. The test hander may be a handling device which provides an appropriate temperature and condition for testing a device or a module, moves the semiconductor device or module to a position in which the semiconductor device or module is to be automatically tested using an electrical test, automatically inserts the device or module into or removes the device or module from a socket electrically connected to a tester, communicates with the tester and determines whether the device or module has defects in accordance with the test result, automatically classifies the device or module by grade, and stores the device or module, in relation to a process of testing a semiconductor device.

As semiconductor process technology advances, memory devices have a relatively higher integration density. As a result, it may be more difficult to implement the process of testing a semiconductor device.

SUMMARY

Exemplary embodiments of the present inventive concept provide a device for testing a semiconductor device, a method of testing a semiconductor device, and a test handler capable of efficiently checking a state of contact between the semiconductor device and a test board during a process of manufacturing the semiconductor device.

According to an exemplary embodiment, a device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

According to an exemplary embodiment, a test handler includes a blade movable from a first position to a second position, and one or more outer blade conductors formed on at least one side surface of the blade. While the blade is moved from the first position to the second position, the one or more outer blade conductors indicate whether a test process is continued, depending on whether a test signal is transferred from one or more outer socket conductors formed on outer regions of a socket.

According to an exemplary embodiment, a method of testing a semiconductor device includes a first process of moving a blade comprising one or more outer blade conductors disposed on one or more side surfaces of the blade from a first position to a second position, a second process of determining whether a test signal is transferred from one or more outer socket conductors formed on one or more outer regions of a socket to the one or more outer blade conductors, and a third process of determining whether an error is detected based on whether the test signal is transferred from the one or more outer socket conductors to the one or more outer blade conductors.

