TECHNICAL FIELD

The present technology is related to forming through-package interconnects that extend through the casings of semiconductor device packages. In particular, some embodiments of the present technology are related to forming such interconnects in assemblies of semiconductor device packages.

BACKGROUND

Packaged semiconductor devices, such as memory chips and microprocessor chips, typically include a semiconductor device mounted to a substrate and encased in a protective covering. The device includes functional features, such a memory cells, processor circuits, and interconnecting circuitry. The device also typically includes bond pads electrically coupled to the functional features. The bond pads are coupled to pins or other types of terminals that extend outside the protective covering for connecting the semiconductor device to buses, circuits and/or other semiconductor devices.

One conventional approach to reducing the surface area occupied by packaged semiconductor devices in compact electronic products is to stack one packaged device on another packaged device having an identical configuration. For example, as shown inFIG. 1, a conventional semiconductor device assembly10includes two identical packaged devices12(shown as a upper packaged device12aand a lower packaged device12b) that are connected to each other and to a printed circuit board (PCB)14with solder balls16. Each packaged device12can include a semiconductor die18mounted to a support PCB20and encased with an encapsulant22. Each die18has die bond pads (not shown) connected with corresponding bond pads24aof the support PCB20with circuitry internal to the support PCB20. The solder balls16connect the bond pads24aof the upper package12ato the bond pads24bof the lower package12b. Additional solder balls16connect the lower package12bto corresponding bond pads24bof the PCB14.

One drawback with the conventional arrangement ofFIG. 1is that the bond pads24aand24bcontribute to the overall footprint of the assembly10. In particular, the bond pads24aand24boccupy a portion26of the perimeter of the PCB14and the support PCB20. Accordingly, there remains a need for improved semiconductor device assemblies that occupy less surface area.

