TECHNICAL FIELD

Embodiments of the present disclosure relate to a microelectromechanical system (MEMS) device and a manufacturing method of the same, and in particular they relate to a MEMS device with good sealing quality and a manufacturing method of the same.

BACKGROUND

Microelectromechanical system (MEMS) devices typically include mechanical components (e.g., fixing and/or movable components) to sense a physical condition (e.g., force, acceleration, pressure, temperature, or vibration) and electronic components to process electrical signals. Therefore, MEMS devices are often used as sensors and are widely used in applications such as automotive systems, inertial guidance systems, home appliances, protection systems for various devices, and many other industrial, scientific, and engineering systems.

Existing MEMS devices generally meet requirements, but they are not satisfactory in every respect. For example, when a MEMS device is used as a pressure sensor, it may be necessary to provide a sealed (air-tight) chamber, thus requiring good sealing quality. However, in order to achieve this, manufacturing problems may arise, including long processing times and complicated manufacturing processes.

SUMMARY

In some embodiments of the present disclosure, by providing a recess structure in the dielectric layer and an opening corresponding to the recess structure in the structure layer, a packaging layer (i.e., a structure for sealing holes) may be continuously and uniformly filled into the opening and the recess structure to complete sealing. The MEMS device and the manufacturing method thereof according to the embodiments of the present disclosure may effectively prevent the generation of sealing seams and hollow structures, thereby improving sealing quality and overall stability. In addition, no complicated process is required, which may effectively shorten the process time and reduce costs.

The embodiments of the present disclosure provide a MEMS device. The MEMS device includes a substrate having at least one contact. The MEMS device also includes a first dielectric layer disposed on the substrate. The MEMS device further includes at least one metal layer disposed on the first dielectric layer, and at least a portion of the metal layer electrically connected to the contact. The MEMS device includes a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure. The MEMS device also includes a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device further includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.

The embodiments of the present disclosure also provide a manufacturing method of a MEMS device. The manufacturing method of the MEMS device includes providing a substrate having at least one contact. The manufacturing method of the MEMS device also includes forming a first dielectric layer on the substrate. The first dielectric layer has at least one through hole exposing a portion of a top surface of the contact. The manufacturing method of the MEMS device further includes forming at least one metal layer on the first dielectric layer. At least a portion of the metal layer is electrically connected to the contact. The manufacturing method of the MEMS device includes forming a second dielectric layer on the first dielectric layer and the metal layer. The second dielectric layer has a recess structure. The manufacturing method of the MEMS device also includes forming a sacrificial layer on the second dielectric layer and in the recess structure. The manufacturing method of the MEMS device further includes forming a structure layer on the second dielectric layer and the sacrificial layer. The manufacturing method of the MEMS device includes removing a portion of the structure layer to form an opening. The opening exposes the sacrificial layer in the recess structure. The manufacturing method of the MEMS device also includes removing the sacrificial layer to expose the recess structure. The cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The manufacturing method of the MEMS device further includes forming a packaging layer. At least a portion of the packaging layer is formed in the opening and the recess structure, and the second dielectric layer, the structure layer, and the packaging layer define a chamber.

