BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a semiconductor package and a camera module including the semiconductor package.

Description of the Related Art

In recent years, a camera module2is mounted in a mobile terminal1, such as a smartphone or a cellular phone. The camera module2has a lens3of a camera, semiconductor packages4aeach mounted with a sensor4for position detection of the lens3and the like, and a lens control mechanism including a coil5, a magnet6, or the like for adjusting the position of the lens3and adjusting the position of the lens3. The lens position control mechanism includes an autofocus mechanism, a hand shake correction mechanism, and the like. The lens position control mechanism detects the position of the lens3based on an output signal of the sensor4for position detection and the like, and then adjusts the position of the lens3in such a manner that the lens3is located at a target position (for example, see PTL 1).

In the camera module2, constituent components configuring the lens position control mechanism are arranged along the periphery of a lens holder3asupporting the lens3as viewed in plan or the lens3, the semiconductor packages4aeach mounted with the sensor4for position detection and the like, the lens position control mechanism, and the like are configured as one unit.

CITATION LIST

Patent Literature

PTL 1: JP 2017-58523 A

SUMMARY OF THE INVENTION

Nowadays, the mobile terminal1has been demanded to enhance the performance of a camera and reduce the thickness.

As a measure for the enhancement of the performance of the camera, a method for increasing the aperture of the lens3is mentioned. However, it is necessary to arrange the sensor4for position detection and the constituent components included in the lens position control mechanism, such as the coil5and the magnet6, around the lens3as illustrated inFIG. 6. Therefore, when the aperture of the lens3is increased, the size of the camera module2is also increased. When the camera module2is unitized as illustrated inFIGS. 8A and 8B, the unit size of the camera module2needs to increase, and therefore the demand for the size reduction of the mobile terminal1cannot be satisfied.

Herein, as one method for achieving the aperture increase of the lens3without causing the size increase of the camera module2, a method for reducing the size of the semiconductor package4amounted with the sensor4for position detection included in the camera module2is considered. However, the size reduction of the semiconductor package4anamely requires a size reduction of terminals t as illustrated inFIG. 9. When the size of the terminals t is reduced, there arises a problem that the stability in mounting decreases.

The present invention has been made focusing on an unsolved problem of a conventional technology. It is an object of the present invention to provide a semiconductor package and a camera module, the sizes of which can be reduced without reducing the stability in mounting.

To achieve the object, a semiconductor package according to one aspect of the present invention is a semiconductor package of a wafer level chip size package type, including at least three terminals, in which the semiconductor package has a long and narrow rectangular shape as viewed in plan, the three terminals are individually arranged in such a manner that the center in the longitudinal direction of the semiconductor package of each of the three terminals and the center in the longitudinal direction of each of the other terminals arranged on the semiconductor package are not overlapped with each other as viewed from the side of the long side of the semiconductor package, one terminal and the other two terminals among the three terminals are present on different sides across a line segment passing through the center in the width direction of the semiconductor package, an angle formed by two line segments connecting the center of gravity of the terminal, the position in the longitudinal direction of which is the center, among the three terminals and the center of gravity of each of the other two terminals is 60° or more, and a width L1 of the semiconductor package and a distance Lt between the rightmost end position of the terminal arranged at the rightmost end in the width direction of the semiconductor package among the three terminals and the leftmost end position of the terminal arranged at the leftmost end in the width direction satisfy Lt/L1≥0.5.

Moreover, a camera module according to another aspect of the present invention has two or more the semiconductor packages of the above-described aspect, in which the semiconductor packages are arranged along the periphery of an adjustment mechanism adjusting the lens position of a camera as viewed in plan and the longitudinal directions of the semiconductor packages are orthogonal to each other.

One aspect of the present invention can achieve a size reduction of a semiconductor package while securing the stability in mounting.

