TECHNICAL FIELD

The present disclosure relates to a crystal resonator (crystal unit) or crystal oscillator or another piezoelectric device.

BACKGROUND ART

As a piezoelectric device, there is known one having a so-called H-shaped package. This H-shaped package is integrally formed by ceramic or resin and has a recessed part provided in an upper surface and a recessed part provided in a lower surface. In the recessed part in the upper surface, for example, a vibration element (crystal element) comprised of a crystal blank on which excitation electrodes are provided is mounted. In the recessed part in the lower surface, another electronic element is mounted. The other electronic element is for example a thermister or integrated circuit.

Further, an alternative structure to the H-shaped package described above has been proposed (Patent Literature 1) as well. The piezoelectric device in Patent Literature 1 has a circuit board having an opening, a resonator mounted on the upper surface of the circuit board so as to cover the opening described before, and an electronic element which is held in the opening and is mounted on the lower surface of the resonator. The resonator has a vibration element and a package which holds the vibration element.

CITATION LIST

Patent Literature

Patent Literature 1: Japanese Patent Publication No. 2015-91103

SUMMARY OF INVENTION

A piezoelectric device according to one aspect of the present disclosure includes a piezoelectric element, a package, a temperature sensitive component and a conductive adhesive. The package includes a base body and a connection conductor. The base body has electric insulation and configures a space. The space is sealed and holds the piezoelectric element. The connection conductor is located on a predetermined surface of the base body. The predetermined surface is on an outer side relative to the space. The temperature sensitive component includes apart terminal and converts temperature to an electrical signal. The conductive adhesive is configured by a thermosetting resin containing a conductive filler and is bonded to the connection conductor and the part terminal.

