RELATED APPLICATIONS

This application claims priority to Taiwan Application Serial Number 108141271, filed Nov. 13, 2019, which is herein incorporated by reference.

BACKGROUND

Field of Invention

The present disclosure relates to a light-emitting package structure and a method of manufacturing the light-emitting package structure.

Description of Related Art

Light-emitting diodes (LEDs) are widely used in illuminating, backlights, and light-emitting diode displays because of their long life, low power consumption, and simple driving. In general, a light-emitting diode display often uses a red, green, and blue light-emitting diode chips as a pixel, and the pixels are arranged to form a full-color light-emitting diode display.

However, such a light-emitting diode display often faces problems such as uneven illumination, electrical controlling difficulties, inability to reduce size, and high manufacturing cost. Therefore, how to effectively solve the above problems is an urgent issue to be resolved.

SUMMARY

The disclosure relates in general to a light-emitting package structure and a manufacturing method thereof.

According to an embodiment of the present disclosure, the light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

In an embodiment of the present disclosure, an oblique surface is between the second surface of the first portion and the second surface of the second portion, and the oblique surface gradually extends away the light emitting-diode chip from the second surface of the second portion to the second surface of the first portion.

In an embodiment of the present disclosure, a height of a climbing of the first portion of the light transmissive adhesive layer is smaller than 20% of a height of the light-emitting diode chip.

In an embodiment of the present disclosure, a number of the light-emitting diode chip is plural.

In an embodiment of the present disclosure, each of the light-emitting diode chips includes a red light-emitting diode chip, a green light-emitting diode chip or a blue light-emitting diode chip.

In an embodiment of the present disclosure, light-emitting package further includes a plurality of filler particles in the light transmissive adhesive layer, in which the filler particles are configured to adjust a path of light emitted by the light-emitting diode chip.

In an embodiment of the present disclosure, the light-emitting diode chip emits blue light, the light-emitting package structure further includes a wavelength converting substance in the light transmissive adhesive layer, and the wavelength converting substance absorbs portions of the blue light and converts to corresponding color light.

In an embodiment of the present disclosure, the substrate is a light transmissive substrate.

In an embodiment of the present disclosure, light-emitting package structure further includes an encapsulation layer on the second surface of the light transmissive adhesive layer and covering the light-emitting diode chip.

According to an embodiment of the present disclosure, the method of manufacturing the light-emitting package structure includes: forming a light transmissive adhesive material on a carrier; heating the light transmissive adhesive material, in which a maximum of a rheological loss factor (tan δ)maxof the light transmissive adhesive material is in a range from 0.5 to 2.5; transferring the light transmissive adhesive material from the carrier to a substrate; disposing at least one light-emitting diode chip on the light transmissive adhesive material; and heating the light transmissive adhesive material to form a light transmissive adhesive layer, such that the light-emitting diode chip is fixed onto the light transmissive adhesive layer.

In an embodiment of the present disclosure, heating the light transmissive adhesive material is performed under a maximum temperature in a range from about 110° C. to about 150° C.

In an embodiment of the present disclosure, heating the light transmissive adhesive material to form the light transmissive adhesive layer is performed under a temperature in a range from about 80° C. to about 160° C.

In an embodiment of the present disclosure, transferring the light transmissive adhesive material from the carrier to the substrate includes: disposing the light transmissive adhesive material to the substrate, such that the substrate and the carrier are respectively on opposite surfaces of the light transmissive adhesive material; heating and pressurizing the carrier, the light transmissive adhesive material, and the substrate; and utilizing a difference between an adhesion force between the light transmissive adhesive material and the carrier and an adhesion force between the light transmissive adhesive material and the substrate, such that the light transmissive adhesive material is detached from the carrier and adhered to the substrate.

In an embodiment of the present disclosure, the light transmissive adhesive layer has a first portion and a second portion, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

In an embodiment of the present disclosure, the method of manufacturing the light-emitting package structure further includes: doping a plurality of filler particles or a wavelength converting substance into the light transmissive adhesive material before forming the light transmissive adhesive material on the carrier.

In the aforementioned embodiments of the present disclosure, during the manufacturing process of the light-emitting package structure, the light transmissive adhesive material is first heated to be in a semi-solid colloidal state, and since the maximum of the rheological loss factor (tan δ)maxof the light transmissive adhesive material is in a range from 0.5 to 2.5, fluidity of the light transmissive adhesive material can be appropriate. As such, the climbing of the light transmissive adhesive material will not obviously occur when the light-emitting diode chip is being disposed thereon, and a displacement of the light-emitting diode chip will not obviously occur during the disposing of the light-emitting diode chip, neither. Therefore, the light-emitting diode chip is effectively fixed onto the substrate through the subsequently formed light transmissive adhesive layer, and hence the yield of the light-emitting package structure is improved. Furthermore, the light transmissive adhesive layer of the light-emitting package structure formed by the aforementioned manufacturing method may have the first portion and the second portion surrounded by the first portion, in which the light-emitting diode chip is disposed on the second portion, and the thickness of the second portion is smaller than or equal to the thickness of the first portion.

