CROSS-REFERENCE TO RELATED APPLICATION

This U.S. nonprovisional application claims priority under 35 U.S.C § 119 to Korean Patent Application No. 10-2020-0085207 filed on Jul. 10, 2020 in the Korean Intellectual Property Office, the disclosure of which is hereby incorporated by reference in its entirety.

TECHNICAL FIELD

Example embodiments relate generally to a wire bonding apparatus, and more particularly, to a wire bonding apparatus capable of suppressing swinging movement of wires.

DISCUSSION OF RELATED ART

A semiconductor package includes an integrated circuit chip for use in electronic products. In general, the semiconductor package may be fabricated by mounting a semiconductor chip on a substrate such as a printed circuit board (PCB). A single semiconductor package may have a plurality of mounted semiconductor chips. The semiconductor package may be configured such that the semiconductor chip is electrically connected to the substrate. The connection between the semiconductor chip and the substrate may be achieved in various ways. For example, the semiconductor chip and the substrate may be electrically connected though a wire connected between a pad of the semiconductor chip and a pad of the substrate. A wire bonding apparatus may direct the wire to connect the pad of the semiconductor chip to the pad of the substrate.

SUMMARY

Some example embodiments of the present inventive concepts provide a wire bonding apparatus capable of suppressing swinging movement of wires.

Some example embodiments of the present inventive concepts provide a wire bonding apparatus capable of increasing a yield of wire bonding.

Some example embodiments of the present inventive concepts provide a wire bonding apparatus capable of increasing a yield of wire bonding performed at various angles.

According to some example embodiments of the present inventive concepts, a wire bonding apparatus may include: a capillary that extracts a wire; a wire clamp assembly on the capillary; and a support on the wire clamp assembly. The wire clamp assembly may include: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member may include: a first body that extends in a first direction; and a first tilting member that makes an acute angle relative to the first direction. The second member may include: a second body that extends in the first direction and is spaced apart from the first body in a second direction intersecting the first direction; and a second tilting member that makes the acute angle relative to the first direction and is spaced apart from the first tilting member. The first contact member may be coupled to an inner surface of the first tilting member and may extend in an extending direction of the first tilting member. The second contact member may be coupled to an inner surface of the second tilting member and may extend in an extending direction of the second tilting member. The second member may be movable in the second direction.

According to some example embodiments of the present inventive concepts, a wire bonding apparatus may include: a capillary that extracts a wire; a wire clamp assembly on the capillary; and a driver that drives the wire clamp assembly to move in the first direction and a second direction intersecting the first direction. The wire clamp assembly may include: a first tilting member that makes an acute angle relative to the first direction; a second tilting member that makes the acute angle relative to the first direction and is spaced apart from the first tilting member; a first contact member coupled to an inner surface of the first tilting member; and a second contact member coupled to an inner surface of the second tilting member and spaced apart from the first contact member. The first contact member may extend in an extending direction of the first tilting member. The second contact member may extend in an extending direction of the second tilting member. The second tilting member may be movable in the second direction.

According to some example embodiments of the present inventive concepts, a wire bonding apparatus may include: a capillary that extracts a wire; a wire clamp assembly on the capillary; a support on the wire clamp assembly, the support providing a through hole; a driver that drives the wire clamp assembly to move in a first direction and a second direction intersecting the first direction; and a slide rail that provides a slide hole. The wire clamp assembly may include: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The second member may be movable in the second direction. The slide hole may form an arc shape whose center is occupied by the through hole. The wire clamp assembly may be slidably coupled to the slide hole.

Details of other example embodiments are included in the description and drawings.

