CROSS REFERENCE TO RELATED APPLICATIONS

This application is a U.S. National Phase of International Patent Application No. PCT/JP2018/038812 filed on Oct. 18, 2018, which claims priority benefit of Japanese Patent Application No. JP 2018-159996 filed in the Japan Patent Office on Aug. 29, 2018 and also claims priority benefit of Japanese Patent Application No. JP 2017-203311 filed in the Japan Patent Office on Oct. 20, 2017. Each of the above-referenced applications is hereby incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to an imaging unit including a semiconductor substrate.

BACKGROUND ART

A solid-state imaging unit (imaging unit) such as a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor includes a photoelectric converter (for example, a photodiode (PD: Photo Diode)) for each pixel.

The imaging unit enables suppression of a dark current, for example, by cooling (for example, see PTL 1).

CITATION LIST

Patent Literature

PTL 1: Japanese Unexamined Patent Application Publication No. 2015-135932

SUMMARY OF THE INVENTION

Such an imaging unit is desired to cool a photoelectric converter more efficiently.

Therefore, it is desirable to provide an imaging unit that enables more efficient cooling of a photoelectric converter.

An imaging unit according to an embodiment of the present disclosure includes a first semiconductor substrate, a heat conductive wiring line, and a cooling device. The first semiconductor substrate includes a photoelectric converter. The heat conductive wiring line is provided in contact with the first semiconductor substrate. The cooling device controls a temperature of the photoelectric converter via the heat conductive wiring line.

In the imaging unit according to the embodiment of the present disclosure, the heat conductive wiring line is provided in contact with the first semiconductor substrate. The first semiconductor substrate is therefore efficiently cooled by the cooling device via the heat conductive wiring line.

It is noted that the above-described contents are examples of the present disclosure. Effects of the present disclosure are not limited to those described above, may be other different effects, or may further include other effects.

