BACKGROUND

Components, including optical components (e.g., reflectors, lenses, optical fibers, etc.), electro optic components (e.g., LEDs (light-emitting diodes), lasers, waveguides, detectors, emitters, VCSELs (vertical-cavity surface-emitting lasers), etc.), or other precision components are often mounted in a mechanical stackup approach in order to form a precisely aligned assembly. Alternatively, a great deal of effort is spent actively aligning each and every assembly. Often times in the stackup approach, each component must each be individually manufactured to high precision tolerances in order to achieve the desired final alignment in the overall assembly, thus increasing complexity, time, and cost of the entire assembly. For example, high volume thixomolded automotive headlamp brackets may require secondary machining operations to add precise alignment features requiring additional fixturing, setup, and labor, and thus increasing the total assembly cost. In another example, the lenses in mobile phones must be actively aligned for each individual camera module with significant effort and expense.

There is a need for less complex, less time consuming, and less expensive assemblies and techniques to align components in assemblies with greater precision and increased assembly efficiency (e.g., camera modules, automotive LED headlamps, fiber optic assemblies, electro-optic assemblies, fine pitch electronic assemblies, etc.).

SUMMARY

Locating features such as electronic surface mount components, MEMS components (semiconductor based microelectromechanical systems), or NEMS components (nanoelectromechanical systems) may be used as physical locating features to constrain the positions of components within an assembly. The placement of the components may be further constrained using wetting dynamics to precisely locate said locating features. The overall alignment may be further refined by leveraging advanced kinematic coupling techniques.

In an implementation, an assembly comprises a substrate or a bare die microchip, at least one pad disposed on the substrate or die, at least one locating feature disposed on the pad using an attachment means, and at least one component disposed in a position in the assembly. With respect to the attachment means, any type of attachment materials may be used such as hot melt adhesive, reactive hot melt adhesive, or any type of solder. The at least one locating feature constrains the position in the assembly of the at least one component being aligned.

In an implementation, a method of fabricating an assembly comprises disposing an attachment means comprising an attachment material on at least one pad on a substrate or die, disposing at least one locating feature on a respective one of the at least one pad, and disposing at least one component to be positioned. The at least one locating feature is configured to act as a mechanical locating feature for aligning components. The position of the at least one aligned component is constrained by the at least one locating feature.

In one embodiment, the method further includes removing the at least one locating feature from the assembly after disposing the at least one component. In one embodiment, the assembly is a headlamp, automotive lighting, a printed circuit assembly, a camera, a lens, an electronic device for the visual presentation of data, a mixed reality headset, a virtual reality headset, a 3D scanner, a measurement device, a microscope, or a precision instrument. In another embodiment, the method further includes precisely locating in 3D space the at least one component to an additional component, wherein the additional component comprises an electro optical component, an optical component, or a mechanical component. In a different embodiment, the method further includes disposing an electronic circuit on the substrate, wherein the electronic circuit comprises at least one of an electro optical component, an optical component, or a mechanical component.

In one embodiment, the at least one component includes a reflector or a lens, and the electro optical component, the optical component, or the mechanical component includes an LED. In another embodiment, the method further includes kinematically coupling the least one component within the assembly. In one embodiment, kinematically coupling the least one component includes kinematically coupling the at least one component to the at least one locating feature.

In one embodiment, the attachment material comprises an adhesive, or even a hot melt adhesive or a reactive hot melt adhesive. In a different embodiment, the attachment material comprises solder. In another embodiment, the method further includes aligning the at least one locating feature using an attachment means, wherein the attachment means includes the attachment material. In another embodiment, the at least one locating feature comprises a plurality of locating features, and wherein the at least one component comprises a plurality of components. In a different embodiment, the method includes depositing an adhesive that retains the position of the plurality of components after they are disposed in the position in the assembly.

In one embodiment, the method includes disposing the at least one component in the position on the substrate including disposing the at least one component on one of a mounting bracket or a heat sink. In another embodiment, the method further includes providing structural support to the assembly without the at least one locating feature providing any structural support to the assembly.

In an implementation, a method of aligning components comprises aligning a plurality of locating features with respect to respective pads by disposing the plurality of locating features on wet attachment material on the respective pads, and aligning a plurality of components by constraining the positions of the plurality of components using the plurality of locating features. An attachment means aligns the plurality of locating features with respect to the respective pads. Any type of attachment material(s) may be used, such as hot melt adhesive, reactive hot melt adhesive, or any type of solder.

In one embodiment, the method further includes positioning the pads on a circuit board. In another embodiment, the method further includes positioning the pads on a substrate, wherein the substrate is a mounting bracket or a heat sink. In a different embodiment, the method further includes providing structural support to the mounting bracket or the heat sink without any structural support from the plurality of locating features.

In one embodiment, the method further includes installing the substrate in a headlamp, automotive lighting, a printed circuit assembly, a camera, a lens, an electronic device for the visual presentation of data, a mixed reality headset, a virtual reality headset, a 3D scanner, a measurement device, a microscope, or a precision instrument. In another embodiment, the plurality of components comprises a reflector or a lens.

In one embodiment, the method further includes precisely locating in 3D space each of the plurality of components to at least one electro optical component, at least one optical component, or at least one mechanical component. In one embodiment, the method further includes kinematically coupling each of the plurality of components to the plurality of locating features. In another embodiment, the method further includes removing the plurality of locating features from the respective pads after aligning the plurality of locating features. In a different embodiment, the method further includes depositing an adhesive that retains the position of the plurality of components after aligning the plurality of components.

In an implementation, a kinematic coupling comprises a substrate or die, at least one locating feature, and at least one pad on the substrate, on which the at least one locating feature is disposed.

In one embodiment, the kinematic coupling further includes at least one component.

In one embodiment, the substrate is a printed circuit substrate, and the at least one locating feature is disposed on the printed circuit substrate using an attachment means. In another embodiment, the attachment means of the kinematic coupling includes an adhesive. In another embodiment, the attachment means comprises a hot melt adhesive or a reactive hot melt adhesive. In another embodiment, the attachment means comprises solder.

In one embodiment, the kinematic coupling further includes dimensionally stable adhesives for retaining the position of the electronic circuit. In another embodiment, the kinematic coupling further includes at least one electro optical component, at least one optical component, or at least one mechanical component. In a different embodiment, the kinematic coupling further includes an LED.

In one embodiment, the kinematic coupling further includes mating alignment features on mating parts. In another embodiment, the at least one locating feature comprises at least one surface mounted component. In a different embodiment, a headlamp comprising the kinematic coupling.

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

