BACKGROUND

Loading of modern land grid array (LGA) microprocessors into sockets requires the application of large loads to ensure that all of the electrical connections between the processor package and the socket contacts are established and stable. As the contact count increases, greater loads are required. Current methods to load a microprocessor on a socket includes a loading mechanism to aid in mounting a microprocessor on a computer motherboard. Current loading mechanisms lack flexibility to accommodate variations in microprocessor z-height variations or may not be capable of generating sufficient loads required for present and future generations of microprocessors.

