CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is based on and claims priority under 35 U.S.C. § 119(a) of a Korean patent application number 10-2019-0083250, filed on Jul. 10, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

The disclosure relates to an electronic device including an interposer. More particularly, the disclosure relates to an electronic device including an interposer formed in a multi-step or partition structure.

2. Description of Related Art

In order for electronic devices to be conveniently used by users and to have an aesthetically pleasing appearance, a thickness of electronic devices is being gradually reduced. The inner space in electronic devices is therefore becoming limited and thus use of a structure in which different types of printed circuit boards (PCBs) are laminated is increasing for efficient use of the inner space in the electronic devices.

When a millimeter wave (mmWave) module is applied to a portable electronic device, the portable electronic device may include an interposer including a conductive member in order to secure space for mounting electronic components or various active elements.

The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.

SUMMARY

An interposer may electrically connect substrates to each other. The interposer is formed to have a predetermined height and there may be the difference between the height of electronic components mounted on substrates and the height of the space between the substrates. Arranging substrates in consideration of the various heights of electronic components is difficult and thus space may be wasted.

The interposer may be formed in a closed-curve shape along the edge of a substrate so as to correspond to the shape of at least part of the substrate. Since the interposer supports the edge of the substrate, a region that is not supported by the interposer is vulnerable to bending or warping due to stress. Therefore, there is the need for method capable of reducing limitations due to the height or thickness of electronic components and of preventing warpage of a substrate.

Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide an electronic device including an interposer formed in a multi-step or partition structure so as to prevent the above-described warpage of a substrate.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a first circuit board, a first interposer disposed on the first circuit board and having a first height, a second circuit board disposed on the first interposer and electrically connected to the first interposer, a second interposer disposed on the first circuit board so as to be formed outside the first interposer and having a second height, and a third circuit board disposed on the second interposer and electrically connected to the second interposer.

In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a first circuit board, a first interposer disposed on the first circuit board and having a first height, a second circuit board disposed on the first interposer and electrically connected to the first interposer, and a partition disposed inside the first interposer and formed to support at least a portion of the second circuit board.

In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a first circuit board which includes a first surface, on which at least one component is disposed and which faces in a first direction, and a second surface facing in the opposite direction of the first direction, a first interposer which is disposed on the first surface of the first circuit board, is electrically connected to the first circuit board, and includes a first region having a first height with reference to the first surface of the first circuit board and a second region having a second height with reference to the first surface, a second interposer which is disposed on the first surface of the first circuit board, is electrically connected to the first circuit board, and includes a third region having the first height with reference to the first surface of the first circuit board, a second circuit board which faces the first surface of the first circuit board and is disposed on the first region of the first interposer and on the third region of the second interposer, and a third circuit board which faces the first surface of the first circuit board and is disposed on the second region of the first interposer.

In accordance with another aspect of the disclosure, an electronic device including an interposer can laminate multiple substrates and thus can increase efficiency of use of space in the vertical direction.

In accordance with another aspect of the disclosure, an electronic device including an interposer is provided. The electronic device includes a partition capable of supporting a substrate and thus can prevent warpage of the substrate. The electronic device enables electronic components to be disposed in regions separated by the partition, and thus can reduce signal interference therebetween.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

