CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No. 2019-081379, filed on Apr. 22, 2019, the disclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

The present invention relates to a wavelength conversion part, a method of manufacturing a wavelength conversion part, and a light emitting device having a wavelength conversion part.

Japanese Patent Publication No. 2019-9406 discloses an optical part integrally forming a phosphor-containing light transmitting member and a light reflecting member that surrounds the light transmitting member. It also discloses that this optical part is formed by integrally sintering a light transmitting member and a light reflecting member, each made primarily of a ceramic material. It also discloses an embodiment of a light emitting device in which the optical part is disposed on a heat dissipating member.

SUMMARY

From a heat dissipation perspective, however, optical parts such as those disclosed by the above patent publication have room for improvement.

According to one embodiment, a wavelength conversion part includes a wavelength conversion member formed primarily of a ceramic material, an enclosing member formed primarily of a ceramic material and surrounding the lateral faces of the wavelength conversion member, and a heat dissipating member whose upper face opposing and fixed to the lower faces of the wavelength conversion member and the enclosing member, wherein the lower face of the wavelength conversion member projects more towards the heat dissipating member than the lower face of the enclosing member.

According to another embodiment, a light emitting device includes semiconductor laser elements, a base having a bottom face on which the semiconductor laser elements are disposed and a frame portion that surrounds the semiconductor laser elements, and a wavelength conversion part disclosed in the description herein disposed above the semiconductor laser elements, wherein the heat dissipating member in the wavelength conversion part has a light transmitting region through which the light from the semiconductor laser elements passes, and the light passing through the light transmitting region enters the wavelength conversion member in the wavelength conversion part.

According to another embodiment, a method of manufacturing a wavelength conversion part includes preparing an integral sintered body in which a wavelength conversion member and an enclosing member, each made primarily of a ceramic material and having a different void content, are secured together, and grinding the lower face of the integral sintered body such that the wavelength conversion member projects more than the enclosing member at the lower face.

Certain embodiments of the present disclosure provide a wavelength conversion part that excels in heat dissipation, as well as a light emitting device that excels in heat dissipation, and a method of manufacturing the same.

