CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. 119 and 35 U.S.C. 365 to Korean Patent Application No. 10-2019-0024227 (filed on Feb. 28, 2019), which is hereby incorporated by reference in its entirety.

FIELD

The present disclosure relates to an assembly apparatus for assembling a semiconductor light emitting diode to a display panel.

BACKGROUND

Recently, displays having excellent characteristics such as a thin shape and flexibility have been developed in the display technology field. On the other hand, an LCD (Liquid Crystal Display) and AMOLED (Active Matrix Organic Light Emitting Diodes) are representative of main displays that are commonly used now.

However, the LCD has a problem that a response time is not short and it is difficult to implement flexibility and AMOLED has a defect that the lifespan is short and the yield is not good.

Meanwhile, a light emitting diode (LED), which is a well-known semiconductor device that converts a current into light, has been used as a light source for displaying images in electronic devices including information devices together with a green LED based on GaP:N since a red LED using a GaAsP compound semiconductor was commercialized in 1962. Accordingly, a plan that solves the problems by implementing a display using the semiconductor LED may be proposed. Such an LED has the advantage of a long lifespan, low power consumption, an excellent initial driving characteristic, high vibration resistance, etc, as compared with a filament-based light emitting element.

Meanwhile, according to a display that uses semiconductor light emitting diodes, it is required to couple semiconductor light emitting diodes respectively corresponding to pixels to a substrate, so it may be relatively difficult to implement a display having a large screen and many pixels. Accordingly, recently, a self-assembling method of moving LEDs put in fluid to a substrate, using an electromagnetic field, and then assembling them is being developed.

SUMMARY

An objective of the present disclosure is to provide an assembly apparatus that can reduce time that is taken to assemble semiconductor light emitting diodes to a panel.

Another objective of the present disclosure is to provide an assembly apparatus that can prevent a decrease in assembly yield due to bending of a display panel when a large-area display is manufactured.

An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.

According to an embodiment, the at least one magnetic member of the assembly module may protrude downward from the magnetic member accommodator through the at least one magnetic member accommodation hole.

According to an embodiment, in the magnetic member, the radius of a first portion accommodated in the magnetic member accommodation hole may be larger than the radius of a second portion protruding downward from the magnetic member accommodation hole.

According to an embodiment, at least one protrusion protruding from an inner circumferential surface may be formed at a lower portion of the magnetic member accommodation hole.

According to an embodiment, a lower inner diameter of the magnetic member accommodation hole based on the at least one protrusion may be smaller than the radius of the first portion of the magnetic member.

According to an embodiment, the assembly module may further include a magnetic member fixing plate accommodated in an accommodation space recessed on an upper portion of the magnetic member accommodator, and the magnetic member fixing plate may be made of metal.

According to an embodiment, the assembly module may further include at least one fixing magnetic member accommodated in the at least one magnetic member accommodation hole and attached to a bottom of the magnetic member fixing plate.

According to an embodiment, the at least one magnetic member may be positioned under the at least one fixed magnetic member, and the at least one magnetic member and the at least one fixed magnetic member may have the same polarity on surfaces thereof facing each other.

According to an embodiment, the at least one magnetic member may be moved up and down on the basis of repulsion by the at least one fixed magnetic member and external force.

According to an embodiment, the assembly module may further include a housing fastened to an upper portion of the magnetic member accommodator and at least one shaft fastened between the housing and the rotary module.

According to an embodiment, the rotary module may include: a bar connected to the external driving source; a main gear to which the bar is fixed; at least one auxiliary gear geared with the main gear; and at least one connection shaft fixed to the at least one auxiliary gear, and the at least one shaft is connected with the at least one connection shaft.

According to an embodiment, the at least one shaft may be connected with the at least one connection shaft to be spaced apart from a rotational center of the at least one connection shaft.

According to an embodiment, a fastening groove in which the at least one shaft is inserted may be formed at a lower portion of the at least one connection shaft. A center of the fastening groove may be spaced apart from a rotational axis of the connection shaft.

