TECHNICAL FIELD

This disclosure relates to actuators in general and, more particularly, to miniaturized MEMS actuators configured for use within camera packages.

BACKGROUND

As is known in the art, actuators may be used to convert electronic signals into mechanical motion. In many applications such as e.g., portable devices, imaging-related devices, telecommunications components, and medical instruments, it may be beneficial for miniature actuators to fit within the small size, low power, and cost constraints of these application.

Micro-electrical-mechanical system (MEMS) technology is the technology that in its most general form may be defined as miniaturized mechanical and electro-mechanical elements that are made using the techniques of microfabrication. The critical dimensions of MEMS devices may vary from well below one micron to several millimeters. In general, MEMS actuators are more compact than conventional actuators, and they consume less power.

SUMMARY OF DISCLOSURE

In one implementation, a method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

One or more of the following features may be included. Mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate may include applying epoxy to the metal plate, positioning the micro-electrical-mechanical system (MEMS) actuator on the epoxy, and curing the epoxy. Mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator may include applying epoxy to the micro-electrical-mechanical system (MEMS) actuator, positioning the image sensor on the epoxy, and curing the epoxy. Electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator may include wirebonding the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator. The micro-electrical-mechanical system (MEMS) subassembly may be mounted to a printed circuit board. Mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board may include applying epoxy to the printed circuit board, positioning the micro-electrical-mechanical system (MEMS) subassembly on the epoxy, and curing the epoxy. The micro-electrical-mechanical system (MEMS) subassembly may be electrically coupled to the printed circuit board. Electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board may include wirebonding the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board. Electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board further may include encapsulating the wirebonding in epoxy. A holder assembly may be mounted to the micro-electrical-mechanical system (MEMS) subassembly. Mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly may include applying epoxy to the printed circuit board, positioning the holder assembly on the epoxy, and curing the epoxy.

In another implementation, a method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly. The micro-electrical-mechanical system (MEMS) subassembly is mounted to a printed circuit board. The micro-electrical-mechanical system (MEMS) subassembly is electrically coupled to the printed circuit board.

One or more of the following features may be included. Mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate may include: applying epoxy to the metal plate, positioning the micro-electrical-mechanical system (MEMS) actuator on the epoxy, and curing the epoxy. Mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator may include: applying epoxy to the micro-electrical-mechanical system (MEMS) actuator, positioning the image sensor on the epoxy, and curing the epoxy. Electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator may include wirebonding the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator. Mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board may include: applying epoxy to the printed circuit board, positioning the micro-electrical-mechanical system (MEMS) subassembly on the epoxy, and curing the epoxy. Electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board may include: wirebonding the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board, and encapsulating the wirebonding in epoxy. A holder assembly may be mounted to the micro-electrical-mechanical system (MEMS) subassembly. Mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly may include: applying epoxy to the printed circuit board, positioning the holder assembly on the epoxy, and curing the epoxy.

In another implementation, a method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes: mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate, mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly, mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board, electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board; and mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly.

The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features and advantages will become apparent from the description, the drawings, and the claims.

