FIELD OF THE DISCLOSURE

The present disclosure relates to a heat-dissipating substrate structure, and more particularly to a heat-dissipating substrate structure with built-in conductive circuits.

BACKGROUND OF THE DISCLOSURE

An electrical connection is formed by wire bonding after metal layers are formed in current heat-dissipating substrate structures. However, due to a need for an additional external wire bonding process, an inadequate bonding force of the wire bonding may cause problems and reduce reliability. In addition, an overall volume and occupied space are consequently increased.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the present disclosure provides a heat-dissipating substrate structure with built-in conductive circuits.

In one aspect, the present disclosure provides a heat-dissipating substrate structure with built-in conductive circuits, which includes an electrically insulating layer, a first metal layer, a second metal layer, and a heat-dissipating layer. The first metal layer and the second metal layer are disposed on the heat-dissipating layer at an interval. The electrically insulating layer encloses and is in contact with side walls of the first metal layer and side walls of the second metal layer, such that a top wall of the first metal layer and a top wall of the second metal layer are exposed from the electrically insulating layer, and at least one of the conductive circuits extends through at least one of the side wall of the first metal layer and the side wall of the second metal layer and is embedded in the electrically insulating layer.

In certain embodiments, one of the conductive circuits is connected between the side wall of the first metal layer and the side wall of the second metal layer, so that the side wall of the first metal layer is electrically connected to the side wall of the second metal layer, and the one of the conductive circuits is completely embedded in the electrically insulating layer.

In certain embodiments, the conductive circuits correspondingly extend from the side wall of the first metal layer and the side wall of the second metal layer and pass through the electrically insulating layer, so that the conductive circuits are partially embedded in the electrically insulating layer.

In certain embodiments, two of the conductive circuits respectively extend from two of the side walls of the first metal layer that are opposite to each other, and respectively bend upwards to form bending portions that pass through the electrically insulating layer, and remaining ones of the conductive circuits extend from the side wall of the second metal layer and respectively bend upwards to form the bending portions that pass through the electrically insulating layer.

In certain embodiments, the conductive circuit is made of a highly electrically conductive material, and the conductive circuit is at least one of a conductive wire, a conductive strip, and a conductive plate.

In certain embodiments, the first metal layer and the second metal layer are connected to the heat-dissipating layer, respectively, through a first thermally conductive and electrically insulating layer and a second thermally conductive and electrically insulating layer.

In certain embodiments, the first thermally conductive and electrically insulating layer and the second thermally conductive and electrically insulating layer are each made of a high-binding polymeric material, and the first thermally conductive and electrically insulating layer and the second thermally conductive and electrically insulating layer each include a ceramic filler.

In certain embodiments, the first metal layer and the second metal layer are each connected to the heat-dissipating layer by sintering.

In certain embodiments, the heat-dissipating substrate structure with built-in conductive circuits further includes a first heat-dissipating sub-layer and a second heat-dissipating sub-layer. The first heat-dissipating sub-layer and the second heat-dissipating sub-layer are respectively disposed on the first metal layer and the second metal layer.

In certain embodiments, the first heat-dissipating sub-layer is connected to the first metal layer through one thermally conductive and electrically insulating layer, and the second heat-dissipating sub-layer is connected to the second metal layer through another thermally conductive and electrically insulating layer.

In certain embodiments, the one thermally conductive and electrically insulating layer and the another thermally conductive and electrically insulating layer are each made of a high-binding polymeric material, and the one thermally conductive and electrically insulating layer and the another thermally conductive and electrically insulating layer each include a ceramic filler.

In certain embodiments, the first heat-dissipating sub-layer and the second heat-dissipating sub-layer are respectively connected to the first metal layer and the second metal layer by sintering.

Therefore, by virtue of “the electrically insulating layer enclosing and being in contact with side walls of the first metal layer and side walls of the second metal layer, such that the top wall of the first metal layer and the top wall of the second metal layer being exposed from the electrically insulating layer, and at least one of the conductive circuits extending through at least one of the side wall of the first metal layer and the side wall of the second metal layer and being embedded in the electrically insulating layer”, the conduct circuits in the heat-dissipating substrate structure provided by the present disclosure extend from the side wall of the metal layer and are embedded in the electrically insulating layer, so that the need for an additional external wire bonding process and a reliability problem caused by a bonding force of wire bonding can be eliminated, thereby effectively improving the reliability thereof and reducing an overall volume and space occupied.

These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.

