CROSS-REFERENCE TO RELATED APPLICATIONS APPLICATION(S)

This application claims the benefit under 35 USC 119(a) of Korean Patent Application Nos. 10-2017-0090196 filed on Jul. 17, 2017, and 10-2017-0110130 filed on Aug. 30, 2017, in the Korean Intellectual Property Office, the entire disclosures of which are incorporated herein by reference for all purposes.

BACKGROUND

1. Field

The present disclosure relates to an acoustic wave device and a method of manufacturing the same.

2. Description of Related Art

A band pass filter is a key component in a communications device that selects only a signal within a required frequency band, from among various frequency bands, to transmit and receive the selected signal.

Recently, an acoustic wave device has been widely used as such a band pass filter. In the acoustic wave device, a thin film element is formed as a filter by depositing a piezoelectric dielectric material on a silicon wafer, a semiconductor substrate, and resonates using its piezoelectric characteristics.

Examples of the acoustic wave device may include a surface acoustic wave (SAW) filter, a bulk acoustic wave (BAW) filter, and the like.

A plurality of acoustic wave devices may be mounted on a substrate and used as a module in applications that may include small and lightweight filters of mobile communications devices, chemical and biological devices, oscillators, acoustic resonance mass sensors, and the like.

SUMMARY

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.

The protective member may comprise a substrate covering an upper portion of the acoustic wave generator.

The protective member may include an insulating member, and the at least one element may include an inductor pattern embedded in the insulating member.

The acoustic wave device may further include a connection conductor disposed to penetrate through the support portion and the protective member. The inductor pattern may be electrically connected to the acoustic wave generator through the connection conductor.

The connection conductor may have one end connected to the substrate and another end coupled to a connection terminal.

The acoustic wave device may further include a plurality of connection terminals disposed on an outer surface of the protective member and electrically connecting the substrate and a main board to each other; and at least one supporting terminal disposed between the main board and the protective member to support the protective member.

The supporting terminal and the connection terminal may be formed of a same material, and the supporting terminal and the connection terminal may be coupled to the main board.

The supporting terminal may be a dummy terminal which is not electrically connected to the substrate.

The supporting terminal may be disposed in a region corresponding to a region in which the acoustic wave generator is formed.

The acoustic wave device may further include an airtight film disposed along surfaces of the protective member and the support portion to prevent moisture or foreign materials from entering the acoustic wave generator.

The airtight film may be formed of an inorganic insulating film or a thin film.

In another general aspect, a method of manufacturing an acoustic wave device includes: preparing a substrate having an acoustic wave generator formed on one surface thereof; disposing a support portion on the substrate along a circumference of the acoustic wave generator; and forming a protective member by embedding at least one element in an insulating member, and coupling the protective member to the support portion such that the protective member is spaced apart from the acoustic wave generator by an interval.

The embedding of the at least one element in the insulating member may include disposing a first insulating layer of the insulating member on a carrier substrate, forming the at least one element in a pattern on the first insulating layer, and disposing a second insulating layer of the insulating member on the at least one element; and the coupling the protective member to the support portion may include transferring a structure formed on the carrier substrate onto the substrate.

The forming of the protective member may include: disposing a first insulating layer on the support portion; forming an inductor pattern on the insulating layer; and forming a second insulating layer on the inductor pattern.

The method may further include forming a connection terminal and a supporting terminal on the protective member.

The method may further include forming an airtight film along surfaces of the protective member and the support portion.

In another general aspect, an acoustic wave device includes an acoustic wave generator, a support portion, and insulating layers. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The insulating layers are coupled to the support portion, and disposed to be spaced apart from the acoustic wave generator by a predetermined interval. Elements are embedded in each of the insulating layers.

At least one of the elements in the insulating layers may include an inductor pattern.

The acoustic wave device may further include a connection conductor penetrating through the support portion and the insulating layers. The inductor pattern may be electrically connected to the acoustic wave generator through the connection conductor.

The connection conductor may have one end connected to the substrate and another end coupled to a connection terminal.

Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.

