CROSS-REFERENCE TO RELATED APPLICATION

The present application is based on Japanese Patent Application No. 2019-093617 filed on May 17, 2019, disclosure of which is incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to an electronic apparatus.

BACKGROUND

In an existing technology, a printed board formed with a plurality of circuits is divided at a division scheduled line.

SUMMARY

The present disclosure provide an electronic apparatus that has a large effective mounting area in a wiring board.

In an aspect of the present disclosure, an electronic apparatus comprises a wiring board provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further comprises a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to a wiring of the wiring board. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, a through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.

