TECHNICAL FIELD

One or more embodiments of the present invention relate to a pressure sensing device, in particular to a pressure sensing device and a manufacturing method thereof.

BACKGROUND

With the rapid development of science and technology, pressure sensing devices can be applied to increasingly diverse products. For example, pressure sensing devices appear in chair cushions, mattresses, medical equipment, even clothing, insoles, VR (Virtual Reality) equipment, etc. At present, the common thin pressure sensing device is mainly manufactured by a screen printing process, in which a conductive circuit is usually printed on a substrate, then a plurality of pressure sensing blocks electrically connected to the conductive circuit are arranged at the conductive circuit, and a layer of sealing film is finally hot-pressed or roller hot-pressed at the substrate and the pressure sensing blocks to form the pressure sensing device. However, during the process of hot-pressing the sealing film, the pressure sensing blocks are also subjected to the roller hot-pressing, such that excessive relative shifts may be generated for the positions of the circuit structures in some pressure sensing blocks, which may easily cause errors in the sensitivity of the pressure sensing device sealed.

SUMMARY

One or more embodiments of the present invention provide a pressure sensing device, which can ensure that each pressure sensing block in the packaged pressure sensing device can be maintained in a preset uncompressed state.

In one or more embodiments, the pressure sensing device of the present invention is adapted to sense pressure and be electrically connected to a processing unit. The pressure sensing device comprises a substrate, at least one pressure sensing module, and a packaging layer. The pressure sensing module is arranged at the substrate, and comprises a plurality of conductive units, a plurality of pressure sensing blocks, and a plurality of buffer units. Each of the conductive units has a first electrode and a second electrode spaced apart from each other and arranged at the substrate, a first wire connected to the first electrode for grounding, and a second wire connected to the second electrode and electrically connected to the processing unit. The pressure sensing blocks are arranged at the conductive units respectively, and each of the pressure sensing blocks has a circuit structure that electrically connects the first electrode and the second electrode of the corresponding each of the conductive units and can produce different resistances at different degrees of pressure. Each buffer unit is arranged between the corresponding each of the conductive units and each of the pressure sensing blocks, and each of the buffer units comprises a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of the corresponding each of the conductive units. The packaging layer is bonded to the substrate and the conductive units and pressure sensing blocks of the pressure sensing module.

In one or more embodiments, each of the buffer bumps has a height of 0.01 mm to 0.05 mm.

In one or more embodiments, each of the buffer bumps has a diameter of 0.1 mm to 0.5 mm.

In one or more embodiments, a distance between every two buffer bumps is 1 mm to 3 mm.

In one or more embodiments, a material of each of the buffer bumps is insulating ink.

In one or more embodiments, each of the buffer units further comprises a buffer wall covering the corresponding each of the conductive units and surrounding the buffer bumps, the first electrode and the second electrode therein.

In one or more embodiments, the buffer wall is hollow and square.

In one or more embodiments, a material of the buffer wall is insulating ink.

In one or more embodiments, the pressure sensing device further comprises a release layer arranged at the packaging layer and having a hardness greater than that of the packaging layer.

In one or more embodiments, the pressure sensing module further comprises a plurality of adhesive units arranged at the substrate and respectively corresponding to the conductive units, and each of the adhesive units has a plurality of adhesive bodies around the first electrode and the second electrode to adhere a lower surface of the pressure sensing blocks.

In one or more embodiments, the conductive units of the at least one pressure sensing module are arranged apart in a left-right direction, the first electrode and the second electrode of each of the conductive units are spaced apart in a front-back direction, and the pressure sensing device comprises a plurality of pressure sensing modules.

One or more embodiments of the present invention provide another pressure sensing device, which can ensure that each pressure sensing block in the packaged pressure sensing device can be maintained in a preset uncompressed state.

In one or more embodiments, the pressure sensing device of the present invention is adapted to sense pressure and be electrically connected to a processing unit. The pressure sensing device comprises a substrate, at least one pressure sensing module, and a packaging layer. The pressure sensing module is arranged at the substrate, and comprises a plurality of conductive units, a plurality of pressure sensing blocks, and a plurality of buffer units. Each of the conductive units has a first electrode and a second electrode spaced apart from each other and arranged at the substrate, a first wire connected to the first electrode for grounding, and a second wire connected to the second electrode and electrically connected to the processing unit. The pressure sensing blocks are arranged at the conductive units respectively, and each of the pressure sensing blocks has a circuit structure that electrically connects the first electrode and the second electrode of the corresponding each of the conductive unit and can produce different resistances at different degrees of pressure. Each of the buffer units is arranged between the corresponding each of the conductive unit and each of the pressure sensing blocks, and each of the buffer units comprises a buffer wall surrounding the corresponding each of the conductive units. The packaging layer is bonded to the substrate and the conductive units and pressure sensing blocks of the pressure sensing module.

In one or more embodiments, the buffer wall has a height of 0.01 mm to 0.05 mm.

In one or more embodiments, the buffer wall is hollow and square.

In one or more embodiments, a material of the buffer wall is insulating ink.

In one or more embodiments, the pressure sensing device further comprises a release layer arranged at the packaging layer and having a hardness greater than that of the packaging layer.

In one or more embodiments, the pressure sensing module further comprises a plurality of adhesive units arranged at the substrate and respectively corresponding to the conductive units, and each of the adhesive units has a plurality of adhesive bodies around the first electrode and the second electrode to adhere a lower surface of the pressure sensing blocks.

In one or more embodiments, each of the pressure sensing blocks further comprises an insulating layer, and the circuit structure is a plurality of conductive particles dispersed at the insulating layer.

In one or more embodiments, the conductive units of the at least one pressure sensing module are arranged apart in the left-right direction, the first electrode and the second electrode of each of the conductive units are spaced apart in the front-back direction, and the pressure sensing device comprises a plurality of pressure sensing modules.

In addition, one or more embodiments of the present invention provide a manufacturing method of a pressure sensing device.

In one or more embodiments, the manufacturing method of the pressure sensing device according to the present invention comprises forming a plurality of conductive units on a substrate by screen printing, each of the conductive units having a first electrode and a second electrode spaced apart from each other and arranged at the substrate; forming a plurality of buffer units on the conductive units by screen printing, each of the buffer units comprising a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of the corresponding each of the conductive units; providing a plurality of pressure sensing blocks arranged at the buffer units respectively, each of the pressure sensing blocks has a circuit structure that electrically connects the first electrode and the second electrode of the corresponding each of the conductive units and can produce different resistances at different degrees of pressure; and bonding a packaging layer to the substrate, the conductive units and the pressure sensing blocks by hot pressing.

In one or more embodiments, after the step of screen-printing the buffer bumps, the manufacturing method further comprises a step of forming a plurality of buffer walls on the conductive unit by screen printing, the plurality of buffer walls surrounding the buffer bumps, the first electrode and the second electrode therein.

In one or more embodiments, the packaging layer is bonded to the substrate, the conductive units and the pressure sensing blocks by hot pressing together with a release layer having a hardness greater than that of the packaging layer.

Yet one or more embodiments of the present invention provide another manufacturing method of a pressure sensing device.

In one or more embodiments, the manufacturing method of the pressure sensing device according to the present invention comprises: forming a plurality of conductive units on a substrate by screen printing, each of the conductive units has a first electrode and a second electrode spaced apart from each other and arranged at the substrate; forming a plurality of buffer units on the conductive unit by screen printing, each of the buffer units comprises a buffer wall surrounding the corresponding each of the conductive units; providing a plurality of pressure sensing blocks arranged at the buffer units respectively, each of the pressure sensing blocks has a circuit structure that electrically connects the first electrode and the second electrode of the corresponding each of the conductive units and can produce different resistances at different degrees of pressure; and bonding a packaging layer to the substrate, the conductive units and the buffer units by hot pressing.

In one or more embodiments, the packaging layer is bonded to the substrate, the conductive units and the pressure sensing blocks by hot pressing together with a release layer having a hardness greater than that of the packaging layer.

The beneficial effects of one or more embodiments of the present invention are: the plurality of pressure sensing blocks are electrically connected to the first electrodes and the second electrodes of the plurality of conductive units respectively, and when the pressure sensing module of the pressure sensing device is pressed, the resistances of the circuit structure of the pressure sensing blocks change, such that current of different magnitudes flows through the first electrodes and the second electrodes, and the processing unit can then determine the magnitude of the pressure; in addition, the buffer units are arranged at the conductive units, and no matter whether the buffer units are a plurality of buffer bumps arranged in an array at the first electrodes and the second electrodes, or are buffer walls surrounding the first electrodes and the second electrodes, the pressure sensing blocks can be prevented from being excessively tightly connected to the first electrodes and the second electrodes of the conductive units due to packaging of the packaging layer, thereby ensuring that each pressure sensing block in the packaged pressure sensing device can be maintained a preset uncompressed state to achieve accurate pressure sensing sensitivity.

