CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No. 2019-16398 filed Jan. 31, 2019. The contents of the foregoing application are hereby incorporated herein by reference.

BACKGROUND

The present disclosure relates to an IC chip holder in which an IC chip is mounted.

A memory cartridge is known that stores, inside a housing body, a circuit board including a storage element such as a ROM or the like. For example, in a memory cartridge, an engagement protrusion is formed on an inner surface of a side wall of a housing body. A tab, which can be elastically deformed and which engages with the engagement protrusion, is provided on a circuit board, and the circuit board is fixed inside the housing body. Further, a connector is known that causes contact portions of a circuit board stored inside a housing body and a jack portion to be fitted with each other. For example, in a connector, a tab of a fixing arm on a side surface of a housing body storing a circuit board engages from the inside of a hole of the jack portion, and the circuit board and the jack portion are held in a stable contact state.

SUMMARY

However, if the above-described known memory cartridge and connector are dropped or collide with another object, the impact is not alleviated, and there is a possibility that the circuit board may be damaged.

Embodiments of the broad principles derived herein provide an IC chip holder that can alleviate an impact if the IC chip holder is dropped or collides with another object.

An IC chip holder according to the present disclosure includes an IC chip provided with an electric contact, and a housing body in which the IC chip is mounted. The housing body includes, on the side of the electric contact, an elastic deformation portion configured to elastically deform toward the inside of the housing body. The elastic deformation portion elastically deforms toward the inside of the housing body, and thus, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and alleviates the impact. Thus, a possibility of the IC chip being damaged is reduced.

