CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Japan Application No. 2019-098753, filed on May 27, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The disclosure relates to a wet processing device, particularly to a plating device.

Related Art

Electroplating is sometimes used in the manufacture of semiconductor devices. According to an electroplating method, a high-purity metal film (plating film) can be easily obtained, the metal film can be formed at a relatively high speed and the thickness of the metal film can be controlled relatively easily. In forming a metal film on a semiconductor wafer, in-plane uniformity of the film thickness is also required in order to achieve high-density mounting, high performance, and high yield. According to electroplating, it is expected that a metal film having excellent in-plane uniformity of film thickness can be obtained by achieving a uniform metal ion supply rate distribution or potential distribution in a plating solution. In electroplating, the plating solution is sometimes stirred in order to supply a sufficient amount of ions uniformly to a substrate. In order to stir the plating solution, there is known a plating device including a paddle for stirring (Patent Document 1).

PATENT DOCUMENTS

Patent Document 1: Japanese Laid-open No. 2016-6225

In electroplating, in order to supply a sufficient amount of ions uniformly to the substrate, a stirring speed of the paddle for stirring tends to increase. The paddle for stirring is driven by, for example, a driving mechanism, so as to linearly reciprocate within the plating solution. As an example, the driving mechanism of the paddle for stirring includes a crank mechanism, and a rotational motion of a motor is converted into a linear reciprocating motion by the crank mechanism. When the stirring speed increases, a large load is applied to a driving force transmission mechanism such as the crank mechanism, and the life of the driving mechanism is shortened. In addition, in order to reduce the load on the driving mechanism, it is important to regularly grease up the driving mechanism. However, it takes much time to grease up the driving mechanism. Therefore, the disclosure provides a stirring paddle driving mechanism with a small load.

SUMMARY

According to one embodiment, a wet substrate processing device is provided, having: a treatment tank for holding a treatment solution; a stirring paddle disposed inside the treatment tank; and a driving mechanism for driving the stirring paddle, wherein the driving mechanism has: a rotary motor; a central rotating member connected to the rotary motor; an outer fixed ring spaced from the central rotating member and surrounding an outside of the central rotating member; a planetary member connected to the central rotating member so as to rotate inside the outer fixed ring; and a driving shaft connected to the planetary member and the stirring paddle and extending in a radial direction of the outer fixed ring, wherein the driving shaft is configured to reciprocate in a longitudinal direction by rotation of the rotary motor.

