CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 107137874, filed on Oct. 26, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The disclosure relates to a transfer method and a transfer apparatus.

Description of Related Art

A mass transfer technology for transferring micro-devices has been applied in the emerging manufacturing process of an electronic device. The manufacturing process of a light-emitting diode (LED) display apparatus is taken as an example. The manufacturing process of the LED display apparatus includes following steps: providing an elastic transfer head having a plurality of transfer bumps; providing an LED array; having the transfer bumps of the elastic transfer head contact with a plurality of LEDs of the LED array and picking up the LEDs; transferring the LEDs to a receiving device by using the elastic transfer head, so as to completely form the LED display apparatus. However, if the transfer process is to be expanded in scale, the transfer method using the elastic transfer head having the transfer bumps faces issues of insufficient manufacturing yield, inaccuracy, and difficulty in mass production.

SUMMARY

The disclosure provides a transfer method and a transfer apparatus with high manufacturing yield.

In an embodiment of the disclosure, a transfer method includes following steps. A pick-up device having a plurality of caves is provided. A first magnetic force configured to attract a plurality of micro-devices to move toward the caves of the pick-up device is provided. Given that the first magnetic force is provided, the pick-up device is in contact with the micro-devices, so as to snap the micro-devices by the caves of the pick-up device. The micro-devices are transferred from the caves of the pick-up device to a receiving device.

In an embodiment of the disclosure, a transfer apparatus includes a pick-up device, a first magnetic device, and a control device. The pick-up device has a plurality of caves. At least a part of the pick-up device is disposed between the first magnetic device and the micro-devices. The first magnetic device is configured to provide a first magnetic force configured to attract the micro-devices to move toward the caves of the pick-up device. Given that the first magnetic device provides the first magnetic force, the control device has the pick-up device contact the micro-devices, so as to snap the micro-devices by the caves of the pick-up device.

In view of the above, while the micro-devices are being transferred, the micro-devices are accurately positioned in the caves because of the balance of the first magnetic force and the mechanical force between the micro-devices and the pick-up device. The micro-devices in the caves of the pick-up device are then transferred to the receiving device through gravure printing or in other similar manner. Thereby, the micro-devices can be accurately aligned to the receiving device, so as to improve the manufacturing yield.

To make the above features and advantages described in one or more of the embodiments provided in the disclosure more comprehensible, several embodiments accompanied with drawings are described in detail as follows.

