BACKGROUND

Technical Field

The present disclosure relates to package technology. More particularly, the present disclosure relates to a package structure.

Description of Related Art

With development of technology, integrated circuits (ICs) have been applied to various fields, and various packaging methods also have been developed.

In some related arts, one or more individual chips are packaged into one package structure. For example, one or more chips belong to different wafers and are attached on a flexible print circuit board such that they are packaged into one package structure. Since these chips belong to the different wafers, two adjacent chips in the package structure are separated by a longer distance (for example, 6 mm to 10 mm) based on the packaging rule. In this situation, the size of the package structure is larger.

SUMMARY

Some aspects of the present disclosure are to provide a package structure. The package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip.

