CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a U.S. National Stage Application under 35 U.S.C. § 371 of International Patent Application No. PCT/CN2018/072480, filed on Jan. 12, 2018, which claims priority to the Chinese Application No. 201710392688.6 filed on May 27, 2017, the entire disclosures of each of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device, and a method of manufacturing the display panel.

BACKGROUND

With the continuous development of display technology, display panels are increasingly used in display products. Display products with narrow bezels (e.g., cell phones (especially full-screen phones) or wearable devices (e.g., smart watches)) attract a large number of consumers because they enable users to have a better viewing experience.

Currently, pad bending process is the only solution for implementing a display panel with a narrow bezel. However, the display panel manufactured by the pad bending process has many problems, and there may be a display failure phenomenon caused by cracks in the inorganic insulating layer. In addition, the conventional pad bending technology also increases process difficulty and manufacturing cost, and production efficiency is low. In addition, the formation of the pad bending region P requires increased space, and the display product produced by the pad bending process has a low utilization ratio of the substrate.

On the other hand, high-resolution (high PPI) display panels have gradually become a developing trend of the display industry because of their good visual effects. However, the higher the resolution is, the more connection terminals (also simply referred to as terminals) that are required to be set in the display panel. In such a case, it becomes a challenge to achieve a narrower bezel design.

Therefore, there is a need for a display product having a high resolution and having a narrow bezel and a method for manufacturing the same.

SUMMARY

In view of these, embodiments of the present disclosure provide a display panel, a display device, and a method of manufacturing the display panel.

According to an aspect of present disclosure, there is provided a display panel comprising: a display substrate having a first surface and a second surface opposite to the first surface, the display substrate having a display area and a non-display area, the non-display area including at least a first portion and a second portion located on two opposite sides of the display area; a first connection terminal located at the first portion and located on the first surface; a first connection hole located at the first portion, the first connection hole at least penetrating the display substrate; a second connection terminal located at the second portion and located on the first surface; a second connection hole located at the second portion, and the second connection hole at least penetrating the display substrate; a chip on film (COF) located on a second surface of the display substrate, the chip on film including third connection terminals; and conductive materials respectively disposed in the first connection hole and the second connection hole; wherein the first connection terminal and the second connection terminal of the display substrate are electrically connected to the respective third connection terminals through the conductive materials located in the first connection hole and the second connection hole, respectively; and wherein orthographic projections of the first connection hole and the second connection hole on the display substrate is located within an orthographic projection of an outer edge of the chip on film on the display substrate.

In some embodiments, the display panel may further comprises: a bonding layer disposed between the chip on film and the second surface of the display substrate.

In some embodiments, at least one of the first connection hole and the second connection hole and the conductive material corresponding to the at least one connection hole penetrate the display substrate and the bonding layer; and wherein the third connection terminal corresponding to the at least one connection hole is disposed on a side of the chip on film which faces the display substrate.

In some embodiments, at least one of the first connection hole and the second connection hole and the conductive material corresponding to the at least one connection hole penetrate the display substrate, the bonding a layer and the chip on film; and wherein the third connection terminal corresponding to the at least one connection hole is disposed on a side of the chip on film which faces away from the display substrate.

In some embodiments, the first connection terminal is electrically connected to a first wiring in the display area of the display substrate, and the second connection terminal is electrically connected to a second wiring in the display area of the display substrate, and the first wiring and the second wiring are alternately arranged.

In some embodiments, the first connection holes are in one-to-one correspondence with the first connection terminals, the second connection holes are in one-to-one correspondence with the second connection terminal, and the sizes of the first connection terminals and the second connection terminals are larger than the apertures of the respective connection holes.

In some embodiments, the first connection hole and the second connection hole have a diameter greater than or equal to 25 m; and orthographic projections of the first connection terminal and the second connection terminal on the display substrate cover orthographic projections of respective connection holes on the display substrate.

In some embodiments, the first connection terminal or the second connection terminal is adapted to function as one or more of the following: a clock connection terminal, a data connection terminal, a high level connection terminal, a low level connection terminal.

In some embodiments, the display panel may further comprises: an integrated circuit chip on a side of the chip on film facing away from the display substrate; and a flexible circuit board bonded to the chip on film on a side of the chip on film which faces away from the display substrate.

In some embodiments, the display substrate is a flexible display substrate.

According to another aspect of present disclosure, there is provided a display device comprising the display panel according to any embodiment as above or as described below.

According to an aspect of present disclosure, there is provided a method of manufacturing a display panel, comprising: providing a display substrate having a first surface and a second surface opposite to the first surface, the display substrate having a display area and a non-display area, the non-display area including at least a first portion and a second portion on opposite sides of the display area, a first connection terminal formed at the first portion of the non-display area and on the first surface, and a second connection terminal formed at the second portion of the non-display area and on the first surface; providing a chip on film assembly on the display substrate, the chip on film assembly comprising a chip on film, wherein the chip on film is bonded to a second surface of the display substrate, the chip on film having a third connection terminal; forming a first connection hole in the first portion of the non-display area, the first connection hole at least penetrating the display substrate; forming a second connection hole in the second portion of the non-display area, the second connection hole extending at least through the display substrate; forming a conductive material in the first connection hole and the second connection hole, wherein the first connection terminal and the second connection terminal are respectively electrically connected to corresponding third connection terminals of the chip on film via respective conductive material, and wherein the first connection hole and the second connection hole are configured such that orthographic projections thereof on the display substrate are within an orthographic projection of an outer edge of the chip on film on the display substrate.

In some embodiments, providing the chip on film assembly on the display substrate comprises: bonding the chip on film to the second surface of the display substrate with a bonding layer.

In some embodiments, at least one of the first connection hole and the second connection hole is formed to penetrate the display substrate and the bonding layer, the conductive material corresponding to the at least one connection hole is also formed to penetrate the display substrate and the bonding layer, and the third connection terminal corresponding to the at least one connection hole is disposed on a side of the chip on film which faces the display substrate.

In some embodiments, at least one of the first connection hole and the second connection hole is formed to penetrate through the display substrate, the bonding layer, and the chip on film, the conductive material corresponding to the at least one connection hole penetrates the display substrate, the bonding layer, and the chip on film, and the third connection terminal corresponding to the at least one connection hole is disposed on a side of the chip on film which faces away from the display substrate.

In some embodiments, the first connection holes are in one-to-one correspondence with the first connection terminals, the second connection holes are in one-to-one correspondence with the second connection terminals, and an orthographic projection of each of the first and second connection terminals on the display substrate covers the corresponding connection hole.

In some embodiments, forming the first connection hole and forming the the second connection hole are performed by a laser drilling process.

In some embodiments, the method further comprises: bonding a flexible circuit board to the chip on film on a side of the chip on film which is provided with the integrated circuit chip.

In some embodiments, the chip on film assembly further comprises an integrated circuit chip disposed on a side of the chip on film which faces away from the display substrate.

In some embodiments, after the chip on film assembly is disposed on the display substrate, forming the first connection hole and the forming the second connection hole are performed; and forming of the conductive material in the first connection hole and the second connection hole is performed after the first connection hole and the second connection hole are formed.

Other features and advantages of the present disclosure will become apparent from the following detailed description of the illustrative embodiments of the present disclosure with reference to the drawings.

