BACKGROUND

A microelectronic device is an individual electronic device and component or a collection thereof at a micrometer or smaller scale. An individual microelectronic device may include transistors, capacitors, inductors, resistors, diodes, insulators, conductors, and the like. Other devices may include circuitry and some combination of individual devices. An integrated circuit (IC) is such an example of such a device, which is sometimes called a microchip or the like.

Because of their small size, sophisticated techniques are used in the manufacture of microelectronic devices. One such technique involves the fabrication of semiconductor wafers. Typically, the microelectronic devices are produced as part of a stack of patterned layers of materials to form a semiconductor wafer.

As the size of microelectronic devices decreases and their complexity increases, it becomes increasingly more difficult to maximize the yield of electrical-mechanically functional microelectronic devices produced by semiconductor fabrication. The existing approaches to address these issues are becoming less effective.

SUMMARY

In cooperation with a semiconductor fabrication process, the technologies described herein facilitate the enhancement of systemic conformities of patterns of a semiconductor wafer. A semiconductor wafer with few or no systemic non-conformities will maximize the electrical-mechanical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer.

In cooperation with the fabrication process, the technologies described herein use fabrication metrology data of the semiconductor wafers to determine a systemic impact on non-conformities in non-conforming regions on the electrical-mechanical functionality of the microelectronic devices being formed therein. With this determination, an amelioration may be performed on the non-conformities that are determined to have a sufficient systemic impact on the electrical-mechanical functionality of the microelectronic device being formed as part of the semiconductor wafer. That amelioration may be performed by one semiconductor fabrication tool or a combination of multiple tools.

