FIELD OF THE PRESENT DISCLOSURE

The invention relates to a microphone technology, in particular to a method for manufacturing a MEMS (Micro-Electro-Mechanic Systems) microphone.

DESCRIPTION OF RELATED ART

With the development of wireless communication, the users have increasingly higher requirements for the call quality of mobile phones, and the design of microphone as a speech pickup device has a direct influence on the call quality of mobile phone.

As MEMS technology is featured by miniaturization, good integratability, high performance, low cost and the like, it has been appreciated by the industry, and MEMS microphone is widely used in current mobile phones; the common MEMS microphone is capacitive, i.e., including a vibrating diaphragm and a back plate which both constitutes a MEMS Acoustic sensing capacitance, and the MEMS acoustic sensing capacitance further outputs an acoustic signal to a processing chip for signal processing by connecting to the processing chip through a connecting plate. To further improve the performance of MEMS microphone, a dual-diaphragm MEMS microphone structure has been proposed in the prior art, i.e., two layers of vibrating diaphragm are used to constitute a capacitance structure with the back plate respectively. In the MEMS microphone based on silicon technology, the vibrating diaphragm and back plate of the above MEMS microphone are on the same silicon foundation and made with semiconductor making process, and it also comprises process steps such as forming an acoustic cavity, back cavity, acoustic hole, venting hole and connecting plate during manufacturing.

As each making process step of MEMS microphone is to make and form on the same silicon base, each process step can only be conducted after the previous process step is finished, thus causing a relatively low efficiency of manufacturing MEMS microphone.

Based on the above problems, it's necessary to provide a new method for manufacturing MEMS microphone dual-diaphragm structure to improve manufacturing efficiency.

