PRIORITY APPLICATION

This application claims the benefit of priority to Malaysian Application Serial Number PI 2017703697, filed Sep. 29, 2017, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This document pertains generally, but not by way of limitation, to electronic packaging.

BACKGROUND

Electronic packages, such as microchip packages or processor packages are often used with voltage regulation circuits. The voltage regulation circuit can provide power to the electronic package, such as power that is within the operating parameters of the particular electronic package. Sometimes voltage regulation circuits are included in an electronic device to which the electronic package is attached to. For instance, the voltage regulator circuit can be located on a mother board of the electronic device for regulating power to the electronic package.

In some instances, electronic packages include integrated voltage regulators (IVRs). The IVR can include voltage regulation circuitry and components that are incorporated into the electronic package. For instance, the electronic package can include the voltage regulation circuit on a substrate of the electronic package, such as on an upper surface (die side) or a lower surface (land side) of an electronic package. Where the IVR is placed on the land side of the electronic package, the size or pitch of the electrical contacts (E.g., BGA) can be increased to provide clearance between the IVR components and the motherboard. Optionally, a recess might be provided in the motherboard to provide clearance between the IVR and the motherboard.

