BACKGROUND

Technical Field

The present disclosure relates to an electronic device and the method for manufacturing the electronic device, and in particular relates to the processing of the substrate of the electronic device.

Description of the Related Art

Liquid-crystal molecules are widely used in various electronic devices. In recent years, liquid-crystal molecules apply in display devices or tunable microwave devices, such as liquid-crystal display devices or antenna devices. The display device and the antenna device can work by controlling the directions of the liquid-crystal molecules for modulating the phase or amplitude of light, or microwave signal emitting from the display device.

Liquid-crystal molecules are generally disposed between two substrates of electronic devices. The substrates are often different in size, and some portions (e.g., the side portions) of the substrates protrude one another. The substrates usually have some defects or cracks on the side portions due to cutting or pre-cutting processes of the substrates. Therefore, the exposure of these weak portions may increase the risk of the substrates breaking. In addition, in some cases where the substrates are tiled together (e.g., in a tiled display device), the collision or contact between the side portions of the substrates may also result in damage to the substrates.

Accordingly, it is desirable to develop a way for processing the side portions of the substrates to enhance the structural strength of the substrates in electronic devices.

SUMMARY

In accordance with some embodiments of the present disclosure, an electronic device is provided. The electronic device includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate includes a first portion. The second substrate is disposed on the first substrate. The first portion protrudes outward a boundary of the second substrate in a direction perpendicular to a normal direction of the first substrate. The third substrate is disposed adjacent to the first substrate. The fourth substrate is disposed on the third substrate and includes a second portion. The second portion protrudes outward a boundary of the third substrate in a direction perpendicular to a normal direction of the third substrate. The second portion overlaps the first portion. The first substrate includes a first side surface. The first side surface faces to the third substrate and extends along a boundary of a top surface of the first substrate and a boundary of a bottom surface of the first substrate. The first side surface is not parallel to the top surface and the bottom surface. The fourth substrate includes a second side surface. The second side surface faces the second substrate and extends along a boundary of a top surface of the fourth substrate and a boundary of a bottom surface of the fourth substrate. The second side surface is not parallel to the top surface and the bottom surface. In addition, the first side surface and the second side surface are at least partially grinded.

In accordance with some embodiments of the present disclosure, a method for manufacturing an electronic device is provided. The method includes the following steps: providing a first substrate, the first substrate comprising a first portion; forming a second substrate on the first substrate, wherein the first portion protrudes outward a boundary of the second substrate in a direction perpendicular to a normal direction of the first substrate; providing a third substrate adjacent to the first substrate; forming a fourth substrate on the third substrate, the fourth substrate comprising a second portion protruding outward a boundary of the third substrate in a direction perpendicular to a normal direction of the third substrate, wherein the second portion overlaps the first portion; and at least partially grinding the first side surface and the second side surface. In addition, the first substrate includes a first side surface. The first side surface faces the third substrate and extends along a boundary of a top surface of the first substrate and a boundary of a bottom surface of the first substrate. The first side surface is not parallel to the top surface and the bottom surface. The fourth substrate includes a second side surface. The second side surface faces the second substrate and extends along a boundary of a top surface of the fourth substrate and a boundary of a bottom surface of the fourth substrate. The second side surface is not parallel to the top surface and the bottom surface.

A detailed description is given in the following embodiments with reference to the accompanying drawings.

