BACKGROUND

1. Technical Field

The instant disclosure relates to an optical device package, and more particularly, to a package structure with a low manufacturing cost and a confidential performance.

2. Description of Related Art

An optical device package can include some semiconductor devices on a carrier. Some of the semiconductor devices can be integrated or embedded into the carrier for miniaturization. However, cost of integrating or embedding the semiconductor devices into the carrier may be inevitably increased.

SUMMARY

In some embodiments, an optical device package comprises a carrier and a lid. The carrier comprises a first surface and a second surface recessed with respect to the first surface. The lid is disposed on the second surface of the carrier.

In some embodiments, an optical device package comprises a carrier and a lid. The carrier comprises a first surface and a second surface. The lid comprises a first surface supported by the second surface of the carrier. The first surface of the carrier and the first surface of the lid are not lying in s same plane.

In some embodiments, a method of manufacturing an optical device package comprises: providing a carrier; removing a portion of the carrier such that the carrier has a first surface and a second surface recessed with respect to the first surface, and disposing a lid on the second surface of the carrier.

