BACKGROUND

1. Technical Field

The present disclosure relates to an interconnection structure and a sensor package.

2. Description of the Related Art

Sensor packages are used in various applications. A sensor package may include a carrier, a sensor and a housing. The housing is placed on the carrier and has a cavity to accommodate the sensor. To protect the sensor, an insulation material could be filled within the cavity to cover the sensor. However, it is difficult to implement input/output (I/O) structure within the cavity. Therefore, the connection ability (or flexibility) of the sensor package may be adversely affected.

SUMMARY

In accordance with some embodiments of the present disclosure, a sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

In accordance with some embodiments of the present disclosure, a sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The sensor is disposed on the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

