BACKGROUND

The present disclosure relates to a light-emitting device.

Regarding a flat lead package in which a light-emitting element is mounted, a structure of a lead having a groove on its upper surface to improve adhesion between the lead and a resin portion is known (See for example, Japanese Patent No. 6167556).

For example, such a light-emitting device receives a force such as bending from a secondary mounting board on or above which the light-emitting device has been mounted, and stress such as bending stress may be produced in the light-emitting device.

The present disclosure provides a light-emitting device that can reduce stress such as bending stress.

SUMMARY

In a mode of the present disclosure, a light-emitting device includes a package and a light-emitting element. The package includes a first lead having a first groove on an upper surface, a second lead having a second groove on an upper surface and separated from the first lead, and a resin portion holding the first lead and the second lead. The package has a depressed portion defined by one or more lateral walls and a bottom surface. The upper surface of the first lead and the upper surface of the second lead are exposed on the bottom surface of the package. The first groove and the second groove are embedded in a lateral wall of the depressed portion. The light-emitting element is mounted on or above the bottom surface of the depressed portion. A first lateral surface of the first lead facing the second lead has a first recess that is recessed so as to be away from the second lead toward the first lead in a top view, and is continuous with an end of the first groove. A second lateral surface of the second lead facing the first lead has a second recess that is recessed so as to be away from the first lead toward the second lead in the top view, and is continuous with an end of the second groove. In the top view, a part of the resin portion is continuously disposed between the end of the first groove and the end of the second groove.

The light-emitting device of the present disclosure can reduce stress such as bending stress.

