CROSS-REFERENCE TO RELATED APPLICATIONS

This Application claims priority to Japanese Patent Application No. 2020-219106 filed Dec. 28, 2020, the contents of which are incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a composite material bonding apparatus and a composite material bonding method for bonding composite material members to each other that contain fibers and resin.

BACKGROUND ART

As structural members for airplanes or the like, composite material members containing fibers and thermoplastic resin are used. For bonding a plurality of composite material members to each other, a bonding method of attaching and bonding the composite material members to each other after heating and melting their bonding surfaces is known (Patent Literature (PLT) 1). PLT 1 discloses that bonding surfaces of composite material members are melted by using an infrared heater provided in a heating furnace, the composite material members are moved to a pressure bonding molding device, and the bonding surfaces are then attached and bonded to each other.

CITATION LIST

Patent Literature

{PTL 1}Japanese Patent No. 3859321

SUMMARY OF INVENTION

Technical Problem

However, since the bonding method disclosed in PLT 1 requires a step of transporting the composite material members to the pressure bonding molding device after melting, there are problems of a longer cycle time and a decrease in temperature during the transportation. Further, since bonding surfaces are heated by using an infrared heater, the rate of temperature rise is limited, and it is difficult to further shorten the cycle time.

Further, when bonding a wide area, there is a problem of need of a large infrared heater that can heat the wide area at once and a large device that can perform pressure bonding on the wide area at once.

The present disclosure has been made in view of such circumstances and intends to provide a composite material bonding apparatus and a composite material bonding method that can shorten the cycle time when bonding composite material members to each other.

The present disclosure intends to reduce the size of a heating device and a pressure bonding molding device as small as possible.

Solution to Problem

A composite material bonding apparatus according to one aspect of the present disclosure includes: a planar sheet heater; a sheet heater motion device that moves the sheet heater, which is arranged between a first bonding surface of a first composite material member and a second bonding surface of a second composite material member facing the first bonding surface, in a first direction with the sheet heater being in contact with the first bonding surface and the second bonding surface; and a control unit that controls the sheet heater to heat the first bonding surface and the second bonding surface while the sheet heater is in contact with the first bonding surface and the second bonding surface.

A composite material bonding method according to one aspect of the present disclosure is a composite material bonding method using a planar sheet heater and a sheet heater motion device that moves the sheet heater, which is arranged between a first bonding surface of a first composite material member and a second bonding surface of a second composite material member facing the first bonding surface, in a first direction with the sheet heater being in contact with the first bonding surface and the second bonding surface, and the composite material bonding method includes: causing the sheet heater to heat the first bonding surface and the second bonding surface while the sheet heater is in contact with the first bonding surface and the second bonding surface.

Advantageous Effects of Invention

The cycle time when composite material members are bonded to each other can be shortened.

The size of a heating device and a pressure bonding molding device can be reduced as small as possible.

