CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-005288, filed on Jan. 16, 2019, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a chuck top, an inspection apparatus, and a chuck top recovery method.

BACKGROUND

In a semiconductor device manufacturing process, electrical inspection of a plurality of devices (IC chips) formed on a semiconductor wafer (hereinafter simply referred to as a wafer) is performed at a stage where all processes for the wafer are completed. An inspection apparatus that performs such electrical inspection generally includes a prober and a tester. The prober includes a wafer stage, a wafer alignment mechanism, and a wafer transfer system. A probe card having probes that come into contact with the devices formed on the wafer is mounted on the prober. The tester applies electrical signals to the devices through the probe card to test various electrical characteristics of the devices.

As such an inspection apparatus, Patent Document 1 proposes performing an inspection by holding a wafer on a wafer tray (chuck top) while being attached onto the wafer tray, and attaching the wafer tray onto the probe card by virtue of evacuation. In Patent Document 1, a support device is provided to prevent the wafer tray from being dropped. The support device includes four holders that support the wafer tray from below. The holders are configured to be opened and closed by a motor, a ball screw mechanism, and the like.

PRIOR ART DOCUMENT

[Patent Document]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-186998

SUMMARY

According to an embodiment of the present disclosure, there is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer, wherein the chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner, the chuck top including: a main body; and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.

