CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority from Japanese Patent Application No. 2018-088379, filed on May 1, 2018 with the Japan Patent Office, the disclosure of which is incorporated herein in its entirety by reference.

TECHNICAL FIELD

The present disclosure relates to a temperature monitoring apparatus, a heat treatment apparatus, and a temperature monitoring method.

BACKGROUND

A technique has been known in which a first-order lag filter is applied to a detection signal from a temperature sensor that detects the temperature in a processing container so as to estimate the temperature of a processing target, and a heating unit is controlled based on the estimated temperature of the processing target (see, e.g., Japanese Patent Laid-Open Publication No. 2012-209517).

There is also known a technique of calculating the predicted temperature of a substrate by a first-order delay calculation by mixing the temperatures detected by an internal thermocouple and an external thermocouple (see, e.g., International Publication Pamphlet No. WO 2005/010970).

SUMMARY

A temperature monitoring apparatus according to an embodiment of the present disclosure includes: a calculator configured to calculate a temperature monitoring waveform by a first-order lag function based on an elapsed time from a start of a temperature change from a first temperature to a second temperature, and a time constant calculated based on a locus of the temperature change; and a monitor configured to monitor a temperature changing from the first temperature to the second temperature based on the temperature monitoring waveform calculated by the calculator.

The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, exemplary embodiments, and features described above, further aspects, exemplary embodiments, and features will become apparent by reference to the accompanying drawings and the following detailed description.

