FIELD

The subject technology relates generally to apparatuses and methods for blood vessel occlusion and vascular stenting.

BACKGROUND

Veins can become incompetent through the weakening of blood vessel walls or damage to or weakening of valves within the vein. Most frequently, veins carrying oxygen-depleted blood up the legs provide the most apparent visual evidence of the vessel wall or valve weakening, demonstrating that a portion of the veins have become incompetent. When the blood vessel walls weekend or the valves no longer serve their function of reducing or preventing backflow of blood, the vain can become enlarged, weak, and twisted. This condition is referred to as a varicose vein.

While the causes of varicose veins are varied and common, varicose veins can be treated using a variety of procedures.

SUMMARY

Treatment of varicose veins and other blood vessel problems can be achieved through some embodiments disclosed herein. Some embodiments herein relate to vessel occlusion by delivery of radially expandable implant frames that achieve immediate total occlusion of blood flow. Frame configurations, expected delivered and expanded dimensions, and a description of target anatomy of some embodiments is provided.

Aspects of implants and delivery devices that can be utilized in combination with the implants, systems, methods, and features disclosed herein are disclosed in: U.S. patent application Ser. No. 12/826,593, filed on Jun. 29, 2010; U.S. patent application Ser. No. 13/367,338, filed on Feb. 6, 2012; U.S. Patent Pub. No. US20120095489, published on Apr. 19, 2012; U.S. patent application Ser. No. 13/828,974, filed on Mar. 14, 2013, U.S. patent application Ser. No. 14/044,794, filed on Oct. 2, 2013; U.S. patent application Ser. No. 61/835,406, filed on Jun. 14, 2013; U.S. Patent App. No. 61/904,376, filed on Nov. 14, 2013; U.S. Patent App. No. 61/904,379, filed on Nov. 14, 2013; U.S. Patent App. No. 61/835,461, filed on Jun. 14, 2013; U.S. Patent App. No. 61/900,321, filed on Nov. 5, 2013; and U.S. patent application Ser. No. 14/101,171, filed on Dec. 9, 2013, the entireties of which are incorporated herein by reference.

Additionally, some embodiments provided herein relate to implantation in small blood vessels (veins or arteries), such as from about 3 mm to about 20 mm, from about 5 mm to about 15 mm, or from about 7 mm to about 11 mm. The target delivery profile can be from about 2 Fr to about 6 Fr, and in some embodiments, from about 3 Fr to about 5 Fr.

Further embodiments can provide vascular stenting for vessels that are from about 3 mm to about 16 mm, from about 5 mm to about 13 mm, and in some embodiments, from about 7 mm to about 11 mm. The target delivery profile can be from about 2 Fr to about 8 Fr, about 3 Fr to about 7 Fr, from about 4 Fr to about 6 Fr, or in some embodiments, about 5 Fr. Additionally, expansion of the implant can provide sufficient radial force against the inside wall of a vein. Some embodiments can comprise features or means configured to minimize backflow of blood or minimize venous insufficiency. For example, treatment applications for embodiments of the device can include ilio-femoral venous obstruction and chronic iliac venous outflow obstruction as a result of venous disease.

Further, some embodiments provided herein can be used to provide temporary or permanent occlusion of a vessel during and/or after treatment of a tumor by intravascular injection of fluids, chemotherapy drugs, liquid embolic agents, and/or other therapeutic agents delivered into the feeding vessels and/or into the tumor.

Some embodiments of the implants provided herein can be manufactured via several methods including shape-setting of drawn wire, chemical etching of a NiTi sheet of material, laser cutting of a tubular member, such as a material sheet or tubing, and/or electrical discharge machining (EDM) of a tubular member, such as a material sheet or tubing.

The implants disclosed herein can comprise flexible and/or shape memory materials such that they may be distorted from an expanded shape to a smaller diameter or straight shape to allow for delivery to a target location by way of a minimally invasive catheter-based approach.

In accordance with some embodiments, the implant can comprise a frame and a cover material. The cover material can comprise ePTFE tubing, film, and/or suture for attachment purposes. Additionally, the cover material may be fibrous, mesh-like, or impermeable in density.

The implant frame and/or implant cover can comprise a collagen coating or collagen treatment to improve anchoring of the implant in the target vessel. The collagen can be configured to promote cell adhesion to implant materials, thereby facilitating improved support for the implant and vessel structure while acting as an anti-migration feature for the implant.

The implant frame can comprise a straight or constant diameter, a tapering diameter, or sections of variable diameter extending over its length, which can facilitate anchoring within a vessel and optimal deployment function.

Some embodiments of the systems and devices disclosed herein address the unmet need for a device that can provide a fast, precise and reliable way to close a bodily lumen. The endoluminal occlusion system can include two major subsystems: a guide sheath assembly and an implant carrier assembly. The implant carrier assembly can include an implant device and a handle assembly. Embodiments of the present disclosure can also comprise various features disclosed in U.S. Pat. No. 8,328,840, issued on Dec. 11, 2012, the entirety of which is incorporated herein by reference.

Additional features and advantages of the subject technology will be set forth in the description below, and in part will be apparent from the description, or may be learned by practice of the subject technology. The advantages of the subject technology will be realized and attained by the structure particularly pointed out in the written description and embodiments hereof as well as the appended drawings.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the subject technology.

