BACKGROUND

Technical Field

The disclosure relates to a circuit board structure and a layout structure thereof, and in particular to a circuit board structure, which reduces signal reflection, and a layout structure thereof.

Description of Related Art

In the design of a printed circuit board, in order to allow a signal to be transmitted between circuit boards of different heights, a bonding pad is often used for connecting to a connector, for example, a conductive via, so as to allow an electrical connection to be generated between different circuit boards. However, relative to a transmission line, the bonding pad often has a relatively large surface area and provides relatively low impedance. Therefore, an impedance discontinuity is generated in a signal transmission path formed by the transmission line and the bonding pad, and the impedance discontinuity causes reflection in the signal transmission process and reduces the quality of signal transmission.

SUMMARY

The disclosure provides a circuit board structure, which reduces reflection during signal transmission, and a layout structure thereof.

The circuit board layout structure of the disclosure includes at least one signal transmission line, at least one bonding pad, and at least one impedance adjusting wire. The signal transmission line, the bonding pad, and the impedance adjusting wire are disposed on a first circuit board. The impedance adjusting wire is electrically connected between the signal transmission line and the bonding pad. The impedance adjusting wire is disposed along a periphery of the bonding pad, and at least partially surrounds the bonding pad.

The circuit board structure of the disclosure includes a first circuit board and a second circuit board. The first circuit board has at least one signal transmission line, at least one bonding pad, and at least one impedance adjusting wire. The impedance adjusting wire is electrically connected between the signal transmission line and the bonding pad. The impedance adjusting wire is disposed along a periphery of the bonding pad, and at least partially surrounds the bonding pad. The second circuit board is electrically connected to the second circuit board through at least one connector.

Based on the above, the disclosure is electrically connected between the signal transmission line and the bonding pad through disposing the impedance adjusting wire. In addition, in the disclosure, the impedance adjusting wire is disposed along the periphery of the bonding pad, and at least partially surrounds the bonding pad. In this way, the impedance discontinuity generated in the signal transmission process may be effectively reduced, and the quality of signal transmission may be effectively improved.

