CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2018-0139977, filed on Nov. 14, 2018, in the Korean Intellectual Property Office, and entitled: “Pattern Part, Method for Forming Pattern Part and Method for Manufacturing Display Device Using Same,” is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

Embodiments relate to a pattern part, a method of forming the pattern part and a method of manufacturing a display device using the same.

2. Description of the Related Art

In manufacturing display devices, at least a portion of layers or patterns constituting the display devices may be formed by using a photolithography process. The photolithography process may include exposure, development and etching steps. In the exposure step, a mask and an exposure device that reflect the design of the pattern are used to form a photoresist pattern.

SUMMARY

Embodiments are directed to a method of forming a pattern part, the method including forming a first film on a target object, the first film having a first cure shrinkage ratio, forming a second film on the first film, the second film having a second cure shrinkage ratio greater than the first cure shrinkage ratio, and patterning the first film and the second film to form a pattern.

In an example embodiment, the pattern may include a first pattern formed by patterning the first film, and a second pattern formed by patterning the second film.

In an example embodiment, the method of forming a pattern part may further include a first curing step for curing the first film and the second film after forming the second film.

In an example embodiment, the method of forming a pattern part may further include a second curing step curing the pattern after forming the pattern.

In an example embodiment, the second curing step may include a first temperature curing step for curing the pattern at a first temperature, and a second temperature curing step for curing the pattern at a second temperature lower than the first temperature.

In an example embodiment, in the second curing step, a degree of shrinkage of the second pattern may be greater than a degree of shrinkage of the first pattern.

In an example embodiment, in the forming of the first film, the first film may be formed in a first thickness, and in the forming of the second film, the second film may be formed in a second thickness larger than the first thickness.

In an example embodiment, the first film may include a first monomer, the second film may include a second monomer, and a number of functional groups of the second monomer may be more than a number of functional groups of the second monomer.

In an example embodiment, the method of forming a pattern part may further include forming a third film on the second film, wherein the third film may be patterned in the forming of the pattern.

In an example embodiment, the third film may have a third cure shrinkage ratio greater than the second cure shrinkage ratio.

In an example embodiment, the first film may include a first monomer, the second film may include a second monomer, the third film may include a third monomer, a number of functional groups of the second monomer may be more than a number of functional groups of the first monomer, and a number of functional groups of the third monomer may be more than a number of functional groups of the second monomers.

In an example embodiment, the method of forming a pattern part may further include forming a sacrificial layer on the target object, wherein the first film may be formed on the sacrificial layer.

In an example embodiment, the method of forming a pattern part may further include patterning the sacrificial layer to form a sacrificial pattern after the forming of the pattern, wherein the sacrificial pattern may have an undercut shape with respect to the pattern.

In an example embodiment, a method of manufacturing a display device includes forming a circuit layer on a base layer, forming a pixel definition film configured to define a pixel region on the circuit layer, forming a sacrificial layer configured to cover the pixel definition film, forming a first film on the sacrificial layer, forming a second film including a material different from that of the first film, patterning the first film, the second film, and the sacrificial layer to form a first pattern, a second pattern and a sacrificial pattern, forming a light-emitting layer on the pixel region, and removing the first pattern, the second pattern, and the sacrificial pattern.

In an example embodiment, the first film may have a first cure shrinkage ratio, and the second film may have a second cure shrinkage ratio greater than the first cure shrinkage ratio.

In an example embodiment, the first film may include a first monomer, the second film may include a second monomer, and a number of functional groups of the second monomer may be more than a number of functional groups of the second monomer.

In an example embodiment, in the forming of the first film, the first film may be formed in a first thickness, and in the forming the second film, the second film may be formed in a second thickness larger than the first thickness.

In an example embodiment, the pixel region may be one of a plurality of pixel regions, the plurality of pixel regions may include first pixel regions, second pixel regions, and third pixel regions, and in the forming of the first pattern, the second pattern and the sacrificial pattern, the first pattern, the second pattern and the sacrificial pattern may be formed so as to cover all the first pixel regions and the second pixel regions and expose the third pixel regions.

In an example embodiment, the method of manufacturing a display device may further include curing the first pattern, the second pattern and the sacrificial pattern, wherein the curing includes a first temperature curing step for providing a first temperature, and a second temperature curing step for providing a second temperature lower than the first temperature.

In an example embodiment, the sacrificial pattern may have an undercut shape with respect to the first pattern.

In an example embodiment, a pattern part includes a sacrificial pattern disposed on a target object, a first pattern disposed on the sacrificial pattern and including a first monomer, and a second pattern disposed on the first pattern and including a second monomer having more functional groups than that of the first monomer.

In an example embodiment, a thickness of the second pattern may be larger than a thickness of the first pattern.

In an example embodiment, the sacrificial pattern may have an undercut shape with respect to the first pattern.

