The present application is based on, and claims priority from JP Application Serial Number 2019-078568, filed Apr. 17, 2019, the disclosure of which is hereby incorporated by reference herein in its entirety.

BACKGROUND

1. Technical Field

The present disclosure relates to a method for manufacturing an electro-optical device, a method for manufacturing an organic electroluminescence device, an organic electroluminescence device, and an electronic apparatus.

2. Related Art

An electro-optical device such as an organic EL device using an organic EL (electroluminescence) element is known. JP-A-2016-143605 discloses an organic EL device including an element substrate on which an organic EL element and an external connection terminal are provided, and a counter substrate arranged opposite to the element substrate. In the manufacturing of the organic EL device, a chip mount method in which individual counter substrate is bonded to each of a plurality of element substrates multi-sided on a mother substrate is used.

However, in the chip mount method described in JP-A-2016-143605, for example, when the distance between the external connection terminal and the organic EL element becomes short, it becomes difficult to arrange the counter substrate so as not to interfere with the external connection terminal. Furthermore, as the number of counter substrates arranged on the mother substrate increases, the tact time becomes longer. As described above, in the related art, there is a problem that it is difficult to efficiently manufacture an electro-optical device having stable quality.

SUMMARY

An aspect of a method for manufacturing an electro-optical device according to the present disclosure includes bonding a counter substrate to a substrate on which a pixel electrode, a circuit electrically coupled to the pixel electrode, and a terminal electrically coupled to the circuit are provided, cutting a first portion corresponding to the terminal from the counter substrate by irradiating the counter substrate with a laser beam, and removing the first portion from the counter substrate, wherein during cutting of the first portion, a first surface and a second surface sandwiching the first portion in plan view are formed on the counter substrate by irradiation of the laser beam, one or both of the first surface and the second surface is inclined with respect to a first plate surface on an opposite side of the counter substrate to the substrate, and a first distance between the first surface and the second surface in the first plate surface is greater than a second distance between the first surface and the second surface in a second plate surface, on the substrate side, of the counter substrate.

An aspect of a method for manufacturing an organic electroluminescence device of the present disclosure includes forming a protective layer overlapping an organic electroluminescence element, a circuit and a terminal in plan view on a circuit board on which the organic electroluminescence element, the circuit electrically coupled to the organic electroluminescence element, and the terminal electrically coupled to the circuit are provided, bonding a counter substrate to the protective layer, cutting a first portion corresponding to the terminal from the counter substrate by irradiating the counter substrate with a laser beam, removing the first portion from the counter substrate, and removing a portion of the protective layer overlapping the terminal in the plan view, wherein during cutting of the first portion, a first surface and a second surface sandwiching the first portion in the plan view are formed on the counter substrate by irradiation of the laser beam, one or both of the first surface and the second surface are inclined with respect to a first plate surface on an opposite side of the counter substrate to the protective layer, and a first distance between the first surface and the second surface in the first plate surface is greater than a second distance between the first surface and the second surface in a second plate surface, on the protective layer side, of the counter substrate.

An aspect of an organic electroluminescence device of the present disclosure includes a circuit board on which an organic electroluminescence element, a circuit electrically coupled to the organic electroluminescence element, and a terminal electrically coupled to the circuit are provided, a counter substrate overlapping the organic electroluminescence element and the circuit in plan view, and having a quadrangular shape in the plan view, and a protective layer arranged between the organic electroluminescence element and the counter substrate, wherein the terminal is located outside the counter substrate in the plan view, the counter substrate includes a first plate surface on an opposite side of the counter substrate to the protective layer, a second plate surface of the counter substrate on the protective layer side, and a side surface including four faces connecting the first plate surface and the second plate surface, and the surface closest to the terminal among the four faces is an inclined surface inclined with respect to the first plate surface in a direction such that an area of the first plate surface is smaller than an area of the second plate surface.

