CROSS-REFERENCE TO RELATED APPLICATION

The present application is the U.S. national phase of PCT Application PCT/JP2017/018835 filed on May 19, 2017, the disclosure of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present invention relates to an electronic module having a plurality of electronic elements.

BACKGROUND ART

An electronic module in which a plurality of electronic elements are provided in a sealing resin has been conventionally known (for example, see Japanese Patent Application Laid-open No. 2014-45157). It is desired to downsize such an electronic module.

As one means for downsizing, it is conceivable to employ an aspect in which electronic elements are stacked in layers. In such a case, it is conceivable to provide another electronic element (second electronic element) on one side (for example, on the front side) of an electronic element (first electronic element).

According to such an aspect, the first substrate on the first electronic element side and the second substrate on the second electronic element side sometimes become larger as the number of electronic elements is increased due to wiring routing. When the sizes of the first substrate and the second substrate become large in this manner, the first substrate and the second substrate are sometimes warped or distorted in a heat treatment process such as a soldering process and a reflowing process. It is conceivable to provide a post or the like between the first substrate and the second substrate in order to prevent such warpage or distortion, but the number of parts increases according to such an aspect.

SUMMARY OF INVENTION

Technical Problem

The present invention provides an electronic module that can prevent warpage or distortion of a first substrate or a second substrate without increasing the number of parts.

Solution to Problem

An electronic module according to the present invention may comprise:a first substrate;a first electronic element provided on one side of the first substrate;a first connection body provided on one side of the first electronic element;a second electronic element provided on one side of the first connection body;a second substrate provided on one side of the second electronic element; andan abutment body that abuts on a face on one side of the second electronic element and is capable of imparting a force toward one side with respect to the second substrate,wherein the abutment body may electrically connect the second electronic element and a terminal part which is connectable to an external device.

The electronic module according to the present invention may further comprise:a first conductor layer provided between the first substrate and the first electronic element; anda second conductor layer provided on the other side of the second substrate, whereinthe abutment body may have a first abutment body, andthe first abutment body may have an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts on the second conductor layer or the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first conductor layer or the first substrate.

In the electronic module according to the present invention,the first substrate may be a metal substrate,the second substrate may be a metal substrate,the abutment body may have a first abutment body, andthe first abutment body may have an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts on the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first substrate.

In the electronic module according to the present invention,the second-substrate-side abutment part may have a first convex part protruding to one side, andthe second-substrate-side abutment part may abut on the second conductor layer via conductive adhesive.

In the electronic module according to the present invention,the first abutment body may have one or more leg parts extending to the other side andthe leg part may abut on the first conductor layer or the first substrate.

In the electronic module according to the present invention,area where the leg part abuts on the first conductor layer or the first substrate may be smaller than area of the first-substrate-side abutment part abuts on the first conductor layer or the first substrate.

In the electronic module according to the present invention,the abutment body may have a second abutment body, andthe second abutment body may have a first abutting member abutting on a face on one side of the second electronic element, a second abutting member provided on one side of the first abutting member, and a connecting member that connects the first abutting member and the second abutting member and can impart a force toward one side with respect to the second abutting member.

Advantageous Effects of Invention

As one aspect of the present invention, when adopting an abutment body that abuts on a face on one side of a second electronic element and can impart a force toward one side with respect to a second substrate, the abutment body electrically connecting the second electronic element and a terminal which is Connectable to an external device, warpage or distortion of a first substrate or the second substrate can be prevented without increasing the number of parts.

