FIELD OF THE INVENTION

The present disclosure relates to a voltage regulator module, and more particularly to a voltage regulator module capable of reducing loss, increasing heat dissipation efficiency, withstanding increased pressure, disposing more output capacitors therein and/or decreasing the volume thereof.

BACKGROUND OF THE INVENTION

Please refer toFIGS. 1A and 1B.FIG. 1Aschematically illustrates the structure of a conventional electronic device.FIG. 1Bschematically illustrates the structure of a voltage regulator module of the electronic device as shown inFIG. 1A. As shown inFIGS. 1A and 1B, the electronic device1includes a central processing unit (CPU)11, a voltage regulator module12and a system board13. The voltage regulator module12is used for converting an input voltage into a regulated voltage and providing the regulated voltage to the central processing unit11. The voltage regulator module12and the central processing unit11are disposed on a first surface of the system board13. For meeting the load dynamic switching requirements, the output terminal of the voltage regulator module12is located near the input terminal of the central processing unit11.

Moreover, the voltage regulator module12further includes an output capacitor14, a printed circuit board15and a magnetic element16. The output capacitor14is disposed on a second surface of the system board13. The first surface and the second surface of the system board13are opposed to each other. The output capacitor14is located beside the input terminal of the central processing unit11. The magnetic element16is disposed on the printed circuit board15. Moreover, a switch element is disposed in a vacant space between the printed circuit board15and the magnetic element16. The printed circuit board15is disposed on the first surface of the system board13. The heat from the voltage regulator module12can be transferred to the system board13through the printed circuit board15. Moreover, the heat is dissipated away through a heat dissipation mechanism (not shown) of the system board13.

Recently, the required current for the central processing unit11is gradually increased. In addition, the trend of the volume of the electronic device is toward miniaturization. Since the central processing unit11and the voltage regulator module12are located at the same side of the system board13, the electronic device cannot meet the load dynamic switching requirements.

For reducing the volume of the electronic device and effectively enhancing the dynamic switching performance of the voltage regulator module, another electronic device is disclosed.FIG. 2schematically illustrates the structure of another conventional electronic device. In the electronic device1′ ofFIG. 2, the voltage regulator module12is disposed on the second surface of the system board13. That is, the voltage regulator module12is located at the position of the output capacitor14as shown inFIG. 1A. Under this circumstance, the voltage regulator module12and the central processing unit11are located at opposite sides of the system board13. Correspondingly, the layout of the inner components of the voltage regulator module12needs to be adjusted. For example, the installation position of the output capacitor is changed from the second surface of the system board13to the inner space of the voltage regulator module12. Consequently, the volume of the electronic device1′ is effectively reduced. Moreover, the output capacitor14is located near the output terminal of the voltage regulator module12and the input terminal of the central processing unit11, the dynamic switching performance of the voltage regulator module12is enhanced.

Although the dynamic switching performance of the voltage regulator module12of the electronic device1′ as shown inFIG. 2is enhanced, there are still some drawbacks. For example, the first side of the voltage regulator module12is welded on the system board13, and the second side of the voltage regulator module12is fixed on the casing of the electronic device1′ through a heat sink and spring screws. Firstly, the heat from the voltage regulator module12cannot be effectively transferred to the casing of electronic device1′ and dissipated away through the casing of the electronic device1′. Secondly, the voltage regulator module12is unable to withstand the pressure from the heat sink and the spring screws. As mentioned above, the output capacitor is disposed within the voltage regulator module. Thirdly, a plurality of ball grid arrays are usually mounted on the printed circuit board of the voltage regulator module12. In case that the force applied to the ball grid arrays is not uniform, the soldering material is possibly cracked or detached and the product reliability is impaired. For solving this problem, the surface of the printed circuit board of the voltage regulator module12has to provide a large space for improving the force on the ball grid arrays. However, the installation space of the output capacitor is restricted. That is, the voltage regulator module12cannot be equipped with more output capacitors according to the practical requirements. Fourthly, the voltage regulator module includes a plurality of components for transferring signals. For example, a signal communication part composed of a plurality of pins is disposed within the voltage regulator module12. The plurality of pins of the signal communication part are mounted on the printed circuit board of the voltage regulator module12. Since the gap between every two pins of the signal communication part is large, the number of pins mounted on the given area is limited. That is, the distribution density of the pins is low. Moreover, since the cross-section area of each pin is small, the reliability of mounting the pin is usually unsatisfied. In case that the soldering materials between the pins are connected, a short-circuited problem occurs.

Therefore, there is a need of providing an improved voltage regulator module in order to overcome the drawbacks of the conventional technologies.

SUMMARY OF THE INVENTION

An object of the present disclosure provides a voltage regulator module capable of effectively transferring the heat to a casing of an electronic device, dissipating the heat through the casing and effectively withstanding the pressure from a heat sink and spring screws.

Another object of the present disclosure provides a voltage regulator module. The printed circuit board of the voltage regulator module is equipped with ball grid arrays. The printed circuit board has a sufficient space for effectively installing output capacitors. Consequently, more output capacitors can be disposed on the printed circuit board.

A further object of the present disclosure provides a voltage regulator module. The voltage regulator module has a conduction circuit board and a plurality of conduction fingers disposed on the conduction circuit board for transferring signals so as to replace the pins employed in prior arts. Consequently, the pin distribution density formed by the conduction fingers is increased, the volume of the voltage regulator module is decreased, and the power density of the voltage regulator module is increased. In addition, more space is provided to mount more separate components.

In accordance with an aspect of the present disclosure, a voltage regulator module is provided. A voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board and a plurality of switch elements. The first printed circuit board includes a first surface and a second surface. The second circuit board assembly includes a second printed circuit board, at least one output capacitor and a plurality of ball grid arrays. The second printed circuit board includes a first surface and a second surface. The second surface of the first printed circuit board faces to the first surface of the second printed circuit board. The plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The magnetic core assembly is arranged between the first surface of the first printed circuit board and the first surface of the second printed circuit board. The magnetic core assembly includes a magnetic core portion and at least one first copper structure. The magnetic core portion includes a plurality of openings, and each of the at least one first copper structure is penetrated through corresponding openings. A first terminal of the at least one first copper structure and the corresponding switch element are electrically connected, and a second terminal of the at least one first copper structure and a part of the plurality of ball grid arrays are electrically connected. The second terminal of the at least one first copper structure and a terminal of the at least one output capacitor are electrically connected, and the other terminal of the at least one output capacitor is electrically connected with another part of the plurality of ball grid arrays.

In accordance with another aspect of the present disclosure, a voltage regulator module is provided. The voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board and a plurality of switch elements. The first printed circuit board includes a first surface and a second surface, and the plurality of switch elements are disposed on the first surface of the first printed circuit. The second circuit board assembly includes a second printed circuit board, at least one output capacitor and a plurality of ball grid arrays. The second printed circuit board includes a first surface and a second surface. The second surface of the first printed circuit board faces to the first surface of the second printed circuit board, and the plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The magnetic core assembly is arranged between the plurality of switch elements and the at least one output capacitor. The the magnetic core assembly includes a magnetic core portion and at least one first copper structure. The magnetic core portion includes a plurality of openings, and each of the at least one first copper structure is penetrated through corresponding openings. A first terminal of the at least one first copper structure and the corresponding switch element are electrically connected, and a second terminal of the at least one first copper structure and a part of the plurality of ball grid arrays are electrically connected.

From the above descriptions, the present disclosure provides a voltage regulator module. The U-shaped copper structures are penetrated through the magnetic core portion to define the inductors. Since the U-shaped copper structure has good supporting property and thermal conductivity, the U-shaped copper structure can be arranged between the first circuit board assembly and the second circuit board assembly to support the first circuit board assembly and the second circuit board assembly. Consequently, the capability of the voltage regulator module to withstand the pressure from the casing of the electronic device will be enhanced. Due to the good thermal conductivity of copper, the heat from the inductor can be transferred rapidly and effectively. Consequently, the thermal resistance in the thermal conduction path is decreased.

Moreover, the output capacitor is embedded within the second printed circuit board or encapsulated on the second printed circuit board. Consequently, the areas of the bonding pads on the second printed circuit board to weld the magnetic core assembly will be increased. Since the pressure applied to the ball grid arrays of the second printed circuit board is distributed more uniformly, the product reliability is enhanced and more output capacitors can be mounted on the second printed circuit board. The signal communication part includes a conduction circuit board with a plurality of conduction fingers and a plurality of surface pins. While the signal communication part is welded on the bonding pads of the first circuit board assembly or the second circuit board assembly, the lateral solder wicking efficacy is achieved and the soldering material is not spread to the adjacent pins. Since the soldering materials between the two surface pins are not connected, the short-circuited problem is avoided. Under this circumstance, the gap between the adjacent surface pins of the signal communication part is reduced, and the pins distribution density is increased. Consequently, the volume of the voltage regulator module is reduced, and power density of the voltage regulator module is enhanced.

The above contents of the present disclosure will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:

