FIELD OF THE DISCLOSURE

This disclosure generally relates to information handling systems, and more particularly relates to creating an air flow map and detecting air recirculation in an information handling system.

BACKGROUND

As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software resources that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.

SUMMARY

An information handling system may include a memory module having a first temperature sensor collocated with first memory devices associated with a first memory channel, and a second temperature sensor collocated with second memory devices associated with a second memory channel. A processor may receive a first temperature from the first temperature sensor and a second temperature from the second temperature sensor, receive a first power level associated with the first memory channel and a second power level associated with the second memory channel from the memory module, calculate a first thermal resistance of the first memory devices based upon the first temperature and the first power level, and calculate a second thermal resistance of the second memory device based upon the second temperature and the second power level

