BACKGROUND

Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. However, engineering semiconductors to achieve higher and higher performance results in designs that have grown ever more complicated. This complication results in ever increasing design file sizes. In addition, with the advent of cloud service providers, designers and engineers have the potential to increase productivity by leveraging external processing resources from cloud service providers.

However, use of external processing resources presents some issues particular to cloud environments. For example, design data needs to be transferred to cloud service provider resources before the design data can be operated upon, but providing this design data to an external source also presents a security concern.

Transferring design files can be very time consuming. For instance, a 1 TB design file of may take over 24 hours to transfer with current techniques. Additionally, if a transfer fails partway through, then all the time already spent on the transfer may be wasted. Similarly, if a change needs to be made to the design (e.g. because an error is found), then the transfer may need to be restarted wasting even more time.

Security is also a concern for most, if not all, semiconductor device designers. This is because digital data is easily reproducible, but detection/identification of a reproduction in an actual semiconductor is so costly as to be essentially impossible. However, transfers that use standard hypertext transfer protocol secure (HTTPS) require sharing information with a receiver (e.g. cloud provider) that would make the data easily readable.

Additionally, these issues are further exacerbated by the different tools used to interface with different cloud providers and their lack of specific tailoring to the electronic design environment. In particular, current tools merely provide support for transferring files without any features specific to an electronic design environment.

Therefore, what is needed is improve approach for orchestrating uploads of very large design files to selected cloud providers in a multi-cloud arrangement.

SUMMARY

Embodiments of the present invention provide a method, system, and product for orchestrating uploads of very large design files to selected cloud providers in a multi-cloud arrangement.

According to some embodiments, the approach includes a multi-cloud orchestrator that manages interfacing with multiple cloud service providers on behalf of a user. In some embodiments, the multi-cloud orchestrator includes a client interface layer for each cloud provider supported, where each cloud provider is associated with a set of management data for tracking transfers and a set of mapping data for scheduling sequences of commands to satisfy user requests. In some embodiments, the process is tightly coupled with an electronic design system at the client side and circuit verification and processing tools in cloud provider provided computing environments.

Other additional objects, features, and advantages of the invention are described in the detailed description, figures, and claims.

