TECHNICAL FIELD

The present invention relates to an electrical connection device and a method for producing an electrical connection device, and further relates to a wiring structure.

BACKGROUND ART

A film-type electrical connection device is well known, andFIG. 1illustrates a configuration of an electrical connection device described in Japanese Registered Patent No. 4519011 as a prior art example of the film-type electrical connection device.

This electrical connection device10includes a base11made of a film having flexibility and an insulation property, a medium layer12that is arranged on the base11and is made of a gluing agent or an adhesive, reinforcing films13and13′ that are arranged in a pattern shape on the medium layer12, and conductors14and14′ that are arranged on the reinforcing films13and13′ and are fixed on the reinforcing films13and13′.

When the electrical connection device10is pressed on a connection object, the medium layer12is bonded or adheres to the connection object to be mechanically fixed to the connection object and the conductors14and14′ are pressed onto wiring (conductor part) of the connection object by elastic force of the medium layer12to obtain electrical connection.

The reinforcing films13and13′ are provided to enhance durability of the conductors14and14′, that is, the conductors14and14′ are hardly broken because the conductors14and14′ are fixed on the reinforcing films13and13′ which hardly stretch even when the medium layer12deforms.

This electrical connection device10is manufactured in the process described below.

(1) A metal thin film is formed on a film material15serving as a reinforcing film by sputtering, the metal thin film is further thickened by plating, an etching treatment is then applied to the metal thin film so as to obtain a wiring pattern shape, and plating is further applied to the wiring pattern, obtaining a wiring pattern16including the conductors14and14′ illustrated inFIG. 2A.

(2) Subsequently, exposed portion of the film material15, on which the wiring pattern16is not formed, is drilled with laser so as to form holes17illustrated inFIG. 2B.

(3) Then, the film material15which is drilled is fixed to the medium layer12which is arranged on the base11and unnecessary portion is cut out.

Thus, the electrical connection device10illustrated inFIG. 1is obtained.

As described above, the electrical connection device10which is in the prior art film type is manufactured in a manner in which the wiring pattern16is formed through a film forming process such as sputtering and plating and an etching process, and a drilling process with laser and a cutting process are further performed. Thus, manufacturing of the electrical connection device10of prior art is not simple and is accordingly inferior in mass productivity and customizability conforming to a design.

BRIEF SUMMARY OF THE INVENTION

An object of the present invention is to provide a film type electrical connection device which is easily manufactured, exhibiting excellent mass productivity and customizability and further exhibiting superior bending resistance and reliability, a method for producing the electrical connection device, and a wiring structure having these advantageous characteristics.

Effects of the Invention

According to the present invention, an elastomer pattern and a conductor pattern included in an electrical connection device are formed by printing.

According to the present invention, the electrical connection device is manufactured by printing and thus can be easily manufactured and exhibits excellent mass productivity and customizability, dissimilar to a prior art film-type electrical connection device which is manufactured through steps of sputtering, plating, etching, and laser processing.

Further, stress exerted on the conductor pattern in bending is reduced by the elastomer pattern, being able to suppress a phenomenon in which the stress increases a resistance value of the conductor pattern and further causes breakage of the conductor pattern. Thus, an electrical connection device exhibiting superior bending resistance and reliability can be obtained.

Furthermore, according to the present invention, a structure of a flexible wiring board that is easily manufactured and exhibits excellent bending resistance can be realized.

