This application claims priority from Korean Patent Application No. 10-2020-0014665 filed on Feb. 7, 2020 in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

The present disclosure relates to a semiconductor package including a heat spreader.

2. Description of the Related Art

Recently, with a requirement for implementation of high-performance semiconductor chips, the size of semiconductor chips has increased and the size of semiconductor packages has increased accordingly. On the other hand, the thickness of the semiconductor package has been rather reduced according to the tendency of slimness of an electronic device.

On the other hand, the semiconductor package is developed in a direction that satisfies demands for multi-functionality, high capacity, and miniaturization. For this reason, by integrating a plurality of semiconductor chips into one semiconductor package, it has become possible to provide a semiconductor package having a high capacity and multi-functionality, while significantly reducing the size of the semiconductor package.

In particular, in order to achieve the high capacity, more semiconductor chips need to be stacked than before. In this case, since an overall thickness of the semiconductor chip increases, a difference in thickness occurs between the semiconductor chip and an adjacent logic chip, and the heat dissipation characteristics of the semiconductor package are degraded.

Therefore, there is a need to effectively dissipate heat generated from the semiconductor chip.

SUMMARY

It is an aspect to provide a semiconductor package that effectively controls heat generated from a semiconductor chip.

It is another aspect to provide a semiconductor package with improved product reliability.

According to an aspect of an embodiment, there is provided a semiconductor device comprising a substrate including a first surface and a second surface facing each other; a first semiconductor chip and a second semiconductor chip disposed on the first surface of the substrate; a first heat spreader formed on the first semiconductor chip and the second semiconductor chip; and a second heat spreader which protrudes from the first heat spreader and covers the first semiconductor chip, wherein the first semiconductor chip includes a first side wall extending in a first direction, the second semiconductor chip includes a second side wall extending in the first direction and facing the first side wall of the first semiconductor chip in a second direction intersecting the first direction, and an area of the second heat spreader at a boundary between the first heat spreader and the second heat spreader is smaller than or equal to an area of an upper surface of the first semiconductor chip.

According to another aspect of an embodiment, there is provided a semiconductor package comprising a substrate including a first surface and a second surface facing each other; a first semiconductor chip disposed on the first surface of the substrate; a second semiconductor chip and a third semiconductor chip disposed on the first surface of the substrate with the first semiconductor chip interposed therebetween; a first heat spreader formed on the first semiconductor chip, the second semiconductor chip and the third semiconductor chip; and a second heat spreader which protrudes from the first heat spreader and covers an upper surface of the first semiconductor chip, wherein the first semiconductor chip includes a first side wall and a second side wall extending in a first direction, the first side wall and the second side wall being on opposite sides of the first semiconductor chip in a second direction intersecting the first direction, the second semiconductor chip includes a third side wall facing the first side wall of the first semiconductor chip, the third semiconductor chip includes a fourth side wall facing the second side wall of the first semiconductor chip, and at a boundary between the first heat spreader and the second heat spreader, a width of the second heat spreader in the second direction is smaller than a distance between the third side wall of the second semiconductor chip and the fourth side wall of the third semiconductor chip.

According to another aspect of an embodiment, there is provided a semiconductor package comprising a substrate; a heat spreader on the substrate, a packaging space being defined between the substrate and the heat spreader; a first connection terminal disposed on the substrate inside the packaging space; an interposer substrate disposed on the first connection terminal inside the packaging space; a second connection terminal disposed on the interposer substrate; a first semiconductor chip disposed on the second connection terminal; a second semiconductor chip and a third semiconductor chip disposed on the second connection terminal with the first semiconductor chip interposed therebetween; a first heat transfer component disposed on the first semiconductor chip; a second heat transfer component disposed on the second semiconductor chip; and a third heat transfer component disposed on the third semiconductor chip, wherein the first semiconductor chip includes a first side wall and a second side wall extending in a first direction and on opposite sides of the first semiconductor chip in a second direction intersecting the first direction, the second semiconductor chip includes a third side wall facing the first side wall of the first semiconductor chip, the third semiconductor chip includes a fourth side wall facing the second side wall of the first semiconductor chip, the first side wall and the third side wall are spaced apart from each other, the second side wall and the fourth side wall are spaced apart from each other, the heat spreader surrounding the packaging space, and including a first heat spreader formed on the first heat transfer component, the second heat transfer component, and the third heat transfer component, a second heat spreader protruding from the first heat spreader and covering an upper part of the first heat transfer component, and a third heat spreader and a fourth heat spreader each extending from the first heat spreader to a surface of the substrate, a width of the second heat spreader in the second direction at a boundary between the first heat spreader and the second heat spreader is smaller than a distance between the third side wall of the second semiconductor chip and the fourth side wall of the third semiconductor chip, and the third heat spreader and the fourth heat spreader are each spaced apart from the first to third semiconductor chips and an outer wall of the interposer substrate.

According to another aspect of an embodiment, there is provided a semiconductor package comprising a substrate; a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip disposed on the substrate, the first semiconductor chip being disposed between the second semiconductor chip and the third semiconductor chip; a first heat transfer component, a second heat transfer component and a third heat transfer component disposed on the first semiconductor chip, the second semiconductor chip, and the third semiconductor chip, respectively; and a first heat spreader formed on the first heat transfer component, the second heat transfer component and the third heat transfer component and directly contacting the second heat transfer component and the third heat transfer component; and a second heat spreader which protrudes from the first heat spreader and directly contacts the first heat transfer component, wherein the second heat spreader is spaced apart from the second semiconductor chip and the second heat transfer component, and from the third semiconductor chip and the third heat transfer component.

