CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a national phase entry under 35 U.S.C. § 371 of International Application No. PCT/US2017/052489, filed Sep. 20, 2017, entitled “LEADFRAME IN PACKAGES OF INTEGRATED CIRCUITS”, which designated, among the various States, the United States of America. The disclosure of International Application No. PCT/US2017/052489 is hereby incorporated by reference in its entirety.

FIELD

Embodiments of the present disclosure relate generally to the technical field of electronic circuits, and more particularly to integrated circuit (IC) packages.

BACKGROUND

An integrated circuit (IC), often called a silicon chip, a computer chip, an IC chip, or a chip, may be a piece of silicon or another semiconductor into which an electronic circuit is etched using photographic techniques or other techniques. ICs may be produced in batches on a wafer. A wafer may be cut (“diced”) into pieces along dicing streets. Each of these pieces may be called a die. An IC, e.g., a die or a wafer, may be assembled into a circuit package. A circuit package may be an interface between an IC and a printed circuit board (PCB). A circuit package may be attached either to a PCB or to another substrate, to be coupled with other circuits to form an electronic system. An electronic system may become smaller with higher density, driving by the desire of size reduction for the end products, and the technology improvement in continual reductions in minimum feature size. ICs in a smaller and higher density electronic system may have increased thermal output. Thick die attach film (DAF) may be used as an insulation layer to increase thermal resistance between a hot IC that generates heat and adjacent ICs. DAF insulation layers may help preventing or delaying the direct thermal conduction from a hot IC to adjacent ICs. Unfortunately, DAF insulation layers may also prevent the heat generated by the hot IC dissipating to a substrate.

