CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2020-169683, filed Oct. 7, 2020; the entire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to an ultrasonic bonding apparatus, a control device, and a control method.

BACKGROUND

In ultrasonic bonding, a bonding target member is arranged between a stage and a bonding tool, and ultrasonic vibration is transmitted from the bonding tool to the bonding target member in a state where the bonding tool presses the bonding target member, thereby bonding the bonding target member. Ultrasonic bonding requires that even if, for example, the bonding target members used vary in shape, the bonding strength of the bonding target members does not decrease in bonding by ultrasonic bonding.

