TECHNICAL FIELD

This application relates to the field of electronic technologies, and in particular, to a heat-conducting assembly and a terminal.

BACKGROUND

With development of the times, mobile phones gradually become an indispensable part of people's lives.

A mobile phone includes a housing, a middle frame located in the housing, and a battery, a central processing unit (CPU), and another component that are disposed on the middle frame. When the mobile phone is used by a user, the CPU becomes a relatively large heat source in the mobile phone.

Therefore, how to conduct heat emitted by the heat source in the mobile phone becomes an urgent problem to be resolved.

SUMMARY

This application provides a heat-conducting assembly and a terminal, to resolve a problem of how to dissipate heat emitted by a heat source. The technical solutions are as follows.

According to a first aspect, a heat-conducting assembly is provided. The heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, the middle frame has a first side surface and a second side surface that are opposite to each other, and the middle frame is provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor and a heat insulator. The conductor is connected to the heat dissipation part, and the conductor is fastened in the first through hole through the heat insulator, and is in contact with a heat source. The heat source is close to one end that is of the first through hole and that is located on the first side surface.

The middle frame in the heat-conducting assembly is provided with the first through hole, and at least one part of the conducting part in the heat-conducting structure is fastened in the first through hole. In addition, the conducting part includes the conductor that can conduct heat with the heat source such that heat generated by the heat source can be conducted to the conductor, and then conducted by the conductor to the heat dissipation part for heat dissipation, to dissipate heat from the heat source. In addition, the conductor is fastened on the middle frame through the heat insulator, and the heat insulator can insulate from heat of the conductor. Because the heat source is in contact with the conductor, a contact area between the heat source and the middle frame is reduced, to reduce heat conducted from the heat source to the middle frame. This reduces a temperature of a part that is of the middle frame and that is close to the heat source, and reduces impact on a component that is on the middle frame and that is disposed close to the heat source.

Optionally, the heat insulator is disposed on an outer side of the conductor, and a region, on the outer side of the conductor, other than a region in contact with the heat insulator is disposed at a spacing from an inner wall of the first through hole. In this case, the conductor is not in direct contact with the middle frame. This greatly reduces heat conducted between the conductor and the middle frame, and further reduces a temperature of a part that is of the middle frame and that is close to the heat-conducting structure.

Optionally, a region that is of the middle frame and that is close to the heat dissipation part is further provided with at least one second through hole. Because there is the second through hole in the region that is of the middle frame and that is close to the heat dissipation part, a contact area between the heat dissipation part and the middle frame is reduced, to reduce heat conducted between the heat dissipation part and the middle frame.

Optionally, the region that is of the middle frame and that is close to the heat dissipation part includes at least one part of an orthographic projection region of the heat dissipation part on the middle frame.

Optionally, the heat dissipation part is strip-shaped, a length of the second through hole in a width direction of the heat dissipation part is a first length, and the first length is greater than the width of the heat dissipation part. In this case, the second through hole is relatively large such that a part of the heat dissipation part can be effectively isolated from the middle frame, to reduce heat conducted between the part of the heat dissipation part and the middle frame.

Optionally, the first through hole communicates with the second through hole. In this way, when the middle frame is manufactured, the first through hole and the second through hole can be simultaneously manufactured. Therefore, efficiency of manufacturing the middle frame is relatively high.

Optionally, the heat-conducting assembly further includes a first phase change structure. The first phase change structure is attached to an outer side of a part that is of the heat-conducting structure and that is not in contact with the middle frame and the heat source, and is configured to absorb heat of the heat-conducting structure, to reduce heating on a side of a terminal in which the heat-conducting assembly is located.

Optionally, the first through hole is a stepped hole. The stepped hole includes a small hole close to the second side surface and a large hole close to the first side surface, and a step is formed between the large hole and the small hole. The heat insulator is disposed on the step.

Optionally, the conductor includes a metal sheet and at least one part of an evaporator section in a heat pipe, one side of the metal sheet is in contact with the heat source, and the other side of the metal sheet is in contact with the at least one part of the evaporator section.

Optionally, the metal sheet is lapped on the heat insulator.

Optionally, the conductor includes at least one part of an evaporator section in a heat pipe, and the at least one part of the evaporator section is in contact with the heat source.

Optionally, the conductor further includes a plurality of metal rods. One end of each metal rod is fastened to the at least one part of the evaporator section, and the other end of the metal rod is lapped on the heat insulator.

Optionally, there are four metal rods. The four metal rods are divided into two groups of metal rods, and each group of metal rods includes two metal rods. The two groups of metal rods are respectively located on two sides of the at least one part of the evaporator section, and the heat source is located between the two metal rods.

Optionally, the heat-conducting structure is a heat pipe. The heat pipe includes an invalid section, an evaporator section, and a condenser section, and the evaporator section and the condenser section are sequentially connected. The heat dissipation part is the condenser section, the conducting part is the evaporator section, and the invalid section is fastened to the second side surface.

Optionally, the second side surface is in a rectangle shape, the heat source is close to one endpoint of any diagonal of the second side surface, and the heat dissipation part is close to the other endpoint of the any diagonal.

Optionally, the heat-conducting assembly further includes a second phase change structure, where the second phase change structure is located on a side that is of the heat source and that is away from the middle frame, and is configured to absorb heat of the heat source.

According to a second aspect, a terminal is provided. The terminal includes a heat source, housings, and the heat-conducting assembly according to the first aspect. The heat-conducting assembly includes a middle frame and a heat-conducting structure, and the heat-conducting structure is configured to dissipate heat from the heat source. The housings include a front housing and a rear housing, and the front housing and the rear housing are fastened on two sides of the middle frame. The heat source is located between the front housing and the middle frame, or the heat source is located between the rear housing and the middle frame.

Optionally, the heat-conducting assembly includes the middle frame, and further includes a second phase change structure. The second phase change structure is disposed on an inner side of the housing, and the heat source is located between the second phase change structure and the middle frame.

