BACKGROUND OF THE DISCLOSURE

1. Field of the Disclosure

This disclosure is directed to a high power multilayer module having low inductance and fast switching for paralleling power devices. Moreover, the disclosure is directed to a process of configuring a high power multilayer module having low inductance and fast switching for paralleling power devices.

2. Related Art

As will be appreciated by those skilled in the art, power modules are known in various forms. Power modules provide a physical containment for power components, usually power semiconductor devices. These power semiconductors are typically soldered or sintered on a power electronic substrate. The power module typically carries the power semiconductors, provides electrical and thermal contact, and includes electrical insulation.

Current trends in electrification are placing increasing demands on power modules including the power semiconductor devices, power electronics, and/or the like associated with the power modules. For example, improved efficiency and higher power density. These demands extend from the system level down to the component level. However, operation of the power modules to meet these demands results in increased generation of heat within the power module. The increased generation of heat limits the ability of the power modules to operate due to physical limitations of the power semiconductor devices, the power electronics, and/or the like. In particular, the various components of the power modules including the power semiconductor devices, power electronics, and/or the like typically have operational temperature limitations.

Additionally, parasitic impedances in the power module limit the practical implementation of these devices in current technologies. Specifically, the loop inductance during switching events can result in a voltage overshoot and ringing. This reduces stability, increases switching losses, creates Electromagnetic Interference (EMI), and stresses system components. Ultimately, these factors may limit the maximum switching frequency, which is desirable to reduce the size of external filters in a power conversion system.

Accordingly, what is needed is a power module configured to address the additional generation of heat.

Additionally, what is needed is a power module configured to address parasitic impedances, such as loop inductance, to increase stability, decrease switching losses, reduce EMI, and/or limit stresses on system components.

SUMMARY OF THE DISCLOSURE

One general aspect includes a power module, including: at least one electrically conductive power substrate, a housing arranged on the at least one electrically conductive power substrate, a first terminal electrically connected to the at least one electrically conductive power substrate, the first terminal including a contact surface located on the housing, a second terminal including a contact surface located on the housing, a third terminal electrically connected to the at least one electrically conductive power substrate, a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate, the third terminal being electrically connected to at least one of the plurality of power devices, a base plate, and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

One general aspect includes a power module, including: a base plate, at least one power substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal, a third terminal electrically connected to the at least one power substrate, a plurality of power devices electrically connected to the at least one power substrate, a gate-source board electrically connected to the plurality of power devices, a plurality of pin fins arranged on the base plate and the plurality of pin fins are configured to provide direct cooling for the power module.

One general aspect includes a process of configuring a power module, including: providing at least one power substrate, arranging a housing on the at least one power substrate, connecting a first terminal to the at least one power substrate, providing a second terminal, electrically connecting a third terminal to the at least one power substrate, connecting a plurality of power devices to the at least one power substrate, mounting a gate-source board electrically connected to the plurality of power devices, the gate-source board configured to receive at least one electrical signal, providing a plurality of pin fins arranged on the base plate, and configuring the plurality of pin fins to cool at least one component of the power module.

Additional features, advantages, and aspects of the disclosure may be set forth or apparent from consideration of the following detailed description, drawings, and claims. Moreover, it is to be understood that both the foregoing summary of the disclosure and the following detailed description are exemplary and intended to provide further explanation without limiting the scope of the disclosure as claimed.

