CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application Serial No. 201911317642.3, filed Dec. 19, 2019, the entire content of which is incorporated herein by reference.

Background of the Disclosure

1. Field of the Disclosure

The present disclosure relates to a flexible display device and a method for manufacturing the flexible display device, and more particularly to a flexible display device having a flexible substrate and a method for manufacturing the flexible display device.

2. Description of the Prior Art

Flexible display devices are widely used in daily life, and display panels of the flexible display devices may be driven by integrated circuit chips and flexible circuit boards. Therefore, how to improve a quality of electrical connections between the integrated circuit chips and the display panels or between the flexible circuit boards and the display panels in the flexible display device or a display quality or a reliability of the flexible display device is one of many topics required for discussion and further research in the field.

SUMMARY OF THE DISCLOSURE

According to an embodiment of the present disclosure, a method for manufacturing a flexible display device is provided. First, a flexible substrate and a bonding structure are provided, wherein the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Next, a driving circuit is provided on the anisotropic conductive film. Then, the anisotropic conductive film is cured, wherein a bonding temperature of the anisotropic conductive film is greater than or equal to 140° C. and less than or equal to 165° C.

According to another embodiment of the present disclosure, a flexible display device is provided, including a flexible substrate, a bonding structure group, a driving circuit and an anisotropic conductive film. The bonding structure group is disposed on the flexible substrate, and the bonding structure group has a first width in a direction that is, for example, parallel to an edge of the flexible substrate, wherein the bonding structure group includes a plurality of bonding structures. The driving circuit is disposed on the bonding structure group and includes a plurality of bonding pads, each bonding pad corresponds to one of the plurality of bonding structures, and one of the bonding pads has a second width in the direction. The anisotropic conductive film is disposed between the bonding structure and the driving circuit. The flexible display device satisfies the following expression: (140−Trt)×CTE×W2<W1, wherein Trt is room temperature with a unit in degrees Celsius (° C.), CTE is a coefficient of thermal expansion of the flexible substrate with a unit of 10−6/° C., W1is the first width, W2is the second width, and units of W1and W2are micrometers.

These and other objectives of the present disclosure will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the embodiment that is illustrated in the various figures and drawings.

