TECHNICAL FIELD

This disclosure relates to a method of producing an optoelectronic semiconductor device.

BACKGROUND

WO 2011/015449 A1 discloses a method of producing an optoelectronic semiconductor device. There is nonetheless a need to provide a method with which optoelectronic semiconductor devices can be produced in a particularly short time and at reduced costs.

SUMMARY

We provide a method of producing an optoelectronic semiconductor device including providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.

