TECHNICAL FIELD

The present invention relates to a three-dimensional electronic device manufactured through a polymer frame organic-solvent-plasticizing process and a method for manufacturing the three-dimensional electronic device, and more specifically, to a method for enabling a planar electronic device to be three-dimensionally transformed.

BACKGROUND ART

A demand for development of a three-dimensional electronic device increases in many fields such as the display field, the sensor field, the energy conversion and storage field, and the circuit design field. The three-dimensional electronic device is more advantageous in optical, electrical, and engineering aspects than a planar device is.

There are two approaches to a technology for manufacturing a three-dimensional device. One is a direct manufacturing method of directly manufacturing a three-dimensional structure and an electronic device by 3D printing or the like, and the other is an indirect manufacturing method of transforming a planar electronic device to have a three-dimensional structure. Despite the advanced development of the processing technology, it is difficult for a device manufactured by the direct manufacturing method to have as high performance as a planar device has, whereas in the indirect manufacturing method, an existing planar semiconductor process is introduced such that a high-performance electronic device can be developed to have a three-dimensional structure.

An existing planar electronic device is put on a hard substrate; however, recently, an acceleration in fusion or convergence between technologies such as the nanotechnology, the biotechnology, the information and communication technology, or the energy and environmental technology causes the electronic device to be developed to have a shape of a human-friendly head-mounted display, electronic paper, a flexible display, or a skin-like electronic device which are bendable and foldable and are as lightweight and soft as possible to be wearable on a human body.

Up to recently, a flexible electronic device has been developed by a method in which a material is subjected to thinning to have a thin film shape or the electronic device is manufactured of a solution which forms a thin film on a substrate through a method of coating, printing, or the like. The flexible electronic device is manufactured of a fragile ceramic material subjected to thinning to have a thin film shape; however, a problem arises in that the flexible electronic device is bendable only to a certain extent and a lack of mechanical and electrical characteristics thereof is too remarkable to be used as an electronic device.

In order to solve the problem, a thin film can be manufactured of graphene as a material to have maximum softness, the graphene being obtained by thinning graphite to a level of atomic layer. Hence, when the graphene is folded, the curvature radius of the graphene at a folded part can be reduced to 0.4 mm. A C—C bond of graphene is expected not to be broken, even when the curvature radius of the folded part is reduced to a level of angstrom; however, actually, softness of a thin film is rapidly degraded due to stress generated at an interface between a substrate and a graphene thin film.

Specifically, even when a solid material such as graphene is subjected to thinning to become an ultra-thin film as thin as an atomic layer, this needs to be laminated on the substrate so as to be used, and at that point, a problem arises in that softness and electrical characteristics of the ultra-thin film are remarkably degraded due to stress generated at the interface of the folded part by interaction between the substrate and the ultra-thin film.

Korean Patent No. 10-1767245 provides an attempt to solve the problem of degradation of softness and electrical characteristics such as a signal transmission delay by providing a liquid film between a substrate and a thin film so as to further improve softness and electrical characteristics and to suppress interface stress at a folded part when a composite thin film is bent.

However, in order to three-dimensionally transform a planar electronic device, a substrate and the device having a ultra-thin film structure are folded at a certain angle or larger.

The problem of degradation of conductance due to breaking of the substrate or fractures in the device which are produced depending on the folding angle is not solved.

CITATION LIST

Patent Literature

[Patent Literature 1]

SUMMARY OF INVENTION

Technical Problem

An object of the present invention to solve the problem is to provide a method for three-dimensionally transforming a polymer frame and an electronic device deposited on the polymer frame by exposing the polymer frame to organic solvent vapor.

Technical objects to be achieved by the present invention are not limited to the technical object mentioned above, and the following description enables additional unmentioned technical objects to be clearly understood by a person of ordinary skill in the art to which the present invention belongs.

Solution to Problem

According to the present invention to achieve the above-described object, a configuration includes: a polymer frame configured to have a planar figure-like shape to have a polygonal bottom and a plurality of polygonal adjacent surfaces which abut on any one of edges of the bottom; and a flexible electronic device which is transferred to the polymer frame. The polymer frame is exposed to organic solvent vapor and has a change in Young's modulus.

In an embodiment of the present invention, the adjacent surfaces are folded at a predetermined angle.

In the embodiment of the present invention, the adjacent surfaces are formed into a triangular shape and are folded such that the polymer frame is formed into a pyramid shape.

In the embodiment of the present invention, the adjacent surfaces are formed into a polygonal shape similar to the shape of the bottom and are folded such that the polymer frame is formed into a polyhedral shape.

In the embodiment of the present invention, the polymer frame has a difference in thickness distribution, and a thickness of the polymer frame is thinner at a folded portion than a thickness thereof at an unfolded portion.

The present invention to achieve the above-described object is configured to include: a) a step of preparing a flexible electronic device; b) a step of preparing a polymer frame; c) a step of transferring the flexible electronic device to the polymer frame via water-soluble tape; d) a step of plasticizing the polymer frame by dissolving the water-soluble tape and exposing the polymer frame to organic solvent vapor; and e) a step of folding the polymer frame and the flexible electronic device into a three-dimensional shape.

In another embodiment of the present invention, the step of a) includes: f) a step of transferring silicon to a glass substrate by a dry transfer printing method; g) a step of forming an insulation layer by coating the glass substrate with polyimide (PI); h) a step of patterning a via in the polyimide (PI) by a dry etching method; and i) a step of configuring a circuit by performing coating with and depositing of an electrode material.

In the other embodiment of the present invention, the glass substrate is coated with PI and GeOx.

The other embodiment of the present invention further includes j) a step of forming a protective layer by performing coating with PI after the step of i).

The other embodiment of the present invention further includes a step of removing the GeOxlayer after the step of j).

In the other embodiment of the present invention, the electrode material is made of any one of conductive metals or a mixed metal thereof, a metallic element-based material, a carbon-based material, conductive nanomaterial containing graphene, conductive polymers or a mixed material thereof so as to configure an electrode circuit.

In the other embodiment of the present invention, the step of b) includes: a step of manufacturing the polymer frame having a thickness distribution; a step of plasticizing the polymer frame by exposing the polymer frame to organic solvent vapor; and a step of forming a soft layer on a surface of the polymer frame.

In the other embodiment of the present invention, the polymer frame contains any one polymer material selected from the group consisting of acrylonitrile butadiene styrene, poly methyl methacrylate, polyacrylate, polyallylate, polyimide, polyamide, polyamideimide, polycarbonate, polyethylene, polypropylene, polyurethane, polyester, polystyrene, polymethylsilsesquioxane, polyethylene oxide, polyacrylonitrile, polyvinylidene fluoride, polyvinylchloride, polyethersulphone, polyetherimide, polyetheretherketone, polybutadieneterephtalate, polyethylene terephthalate, cellulose triacetate, cellulose acetate propionate, polyisocyanurate, polymethylsilsesquioxane, polyphenylene sulfide, and polyethylene naphthalate.

Examples of a plasticizing solvent includes any one selected from the group consisting of acetaldehyde, acetic acid, acetone, acetonitrile, acetophenetidin, acetophenone, acetylacetone, acetyl chloride, acetyl nitrite, acetylnitrile, acetylonitrile, allyl alcohol, allyl chloride, amines, ammonia, ammonium fluoride, amyl acetate, amyl chloride, aniline, aniline chlorohydrate, aqua regia, aromatic hydrocarbons, asphalt, benzaldehyde, benzene, benzenesulfonic acid, benzyl acetate, benzyl alcohol, benzyl chloride, bromine, butadiene, butane, butyl acetate, butyl acrylate, butyl alcohol, butyl chloride, butyl ether, butyl phenol, boron fluids, bromoform, bromotoluene, butadiene-2,4-p-methoxy, butyl phthalate, butylene, butyric acid, calcium bisulfide, calcium chloride, calcium hydroxide, calcium hypochlorite, camphor oil, carbon monoxide, carbon disulfide, carbon tetrachloride, caustic soda, chloric acid, chlorine, chloroacetic acid, chlorobenzene, chloroform, chlorosulfonic acid, chrome alum, chromic acid, copper cyanide, copper fluoborate, creosols, creosylic acid, cresol, cyclohexane, cyclohexanol, cyclohexanone, decahydronaphthalene, di(butoxyethyl) phthalate, dibutyl phthalate, dichloroethane, dichlorobenzene, dichloroethylene, diethyl ether, diethylamine, dimethylamine, dimethylformamide, dioctyl phthalate, ethers, ethyl acetate, ethyl alcohol, ethylbenzene, ethyl ether, ethylene chloride, ethylene chlorohydrin, ethylenediamine, ethylene glycol, ethylene oxide, fatty acids, fluorine gas, formaldehyde, Freon 12, furfuryl alcohol, gasoline, gelatin, glucose, glycerine, heptane, hydrobromic acid, hydrochloric acid, hydrocyanic acid, hydrofluoric acid, hydrogen peroxide, hydrogen sulfide, iodine, isobutane, isopropyl acetate, isopropyl alcohol, isopropyl ether, lactic acid, lanolin, lead acetate, linseed oil, magnesium chloride, magnesium salts, mercury salts, methane, methyl acetate, methyl alcohol, methylamine, methyl bromide, methylene chloride, methylsulfuric acid, morpholine, naphtha, naphthalene, nickel nitrate, nitric acid, nitrobenzene, oleic acid, olive oil, oxygen gas, ozone, palmitic acid, paraffin, perchloric acid, perchloroethylene, petroleum, phenylhydrazine, phosgene gas, phosgene liquid, phosphoric acid, phosphorus trichloride, phosphorus oxychloride, phosphorus pentachloride, potassium bicarbonate, potassium borate, potassium bromate, potassium bromide, potassium carbonate, potassium chloride, potassium cyanide, potassium ferricyanide, potassium perchlorate, potassium permanganate, potassium persulfate, potassium sulfate, propane, propanol, propargyl alcohol, propionic acid, propyl alcohol, propylene oxide, pyridine, silicone oil, silver nitrate, sodium acetate, sodium benzoate, sodium bicarbonate, sodium bisulfate, sodium bisulfite, sodium chlorate, sodium chloride, sodium chromate, sodium ferrocyanide, sodium hypochlorite, sodium iodide, sodium oxalate, sodium phosphate, sodium sulfide, stannous chloride, stearic acid, sulfur dioxide, sulfuric acid, sulfurous acid, tartaric acid, tetrachloroethane, tetraethyl lead, tetrahydrofuran, thionyl chloride, toluene, transformer oil, trichloroacetic acid, trichloroethylene, triethanolamine, triethylamine, turpentine, urea, uric acid, Vaseline, vinyl acetate, deionized water, xylene, and zinc salts, and a solvent containing any one thereof as a component.

Advantageous Effects of Invention

According to the configurations described above, the present invention has the following effects. The Young's modulus of a polymer frame is temporarily changed through an organic solvent-based plasticization process such that the polymer frame can have both hardness suitable for maintaining a shape and softness for preventing the polymer frame from being broken even with a change in shape.

In addition, when the plasticized polymer frame is transformed, the polymer frame functions as a mechanical buffer layer and absorbs stress applied to a device during transformation so as to protect the device during the transformation.

Since the polymer frame protects the device during the transformation, it is possible to prevent conductance of the device from being lowered and maintain electrical characteristics thereof.

A surface of the polymer frame is exposed to organic solvent vapor, and the polymer frame is plasticized before the polymer frame and the device are coupled to each other. In this manner, a soft layer generated on the surface can improve adhesive strength between the electronic device and the polymer frame.

The effects of the present invention are construed not to be limited to the above-mentioned effects but to include every effect that can be derived from the configurations of the invention described in the detailed description of the embodiments or claims of the present invention.

