BACKGROUND

Design of electronic systems may be based on use of electronic components manufactured by specialized fabrication processes. Traditionally, such systems have been built on a printed circuit board by connecting a number of electronic components together. Systems built using printed circuit board and discrete components may result in bulky, energy inefficient designs, with potential limitations on radio frequency design. Internet-of-Things, Edge Artificial Intelligence (Edge AI), and 5thGeneration wireless communication (5G) application circuits might be disposed to operate with limited energy for an extended period of time, and to do so for radio waves with wavelengths in the range of few millimeters. Such high frequency design may benefit significantly from miniaturized components.

