BACKGROUND OF THE DISCLOSURE

Field of the Disclosure

The present disclosure relates to an electronic component package and a method for manufacturing the same.

Background Art

Examples of an electronic component package that includes an electronic component, a resin layer, and a conductor film without including a support board include an electronic component package described in International Publication No. 2016/092633 (Patent Document 1).FIG. 14is a cross-sectional view of an electronic component package described in Patent Document 1.

An electronic component package200includes an electronic component210, a resin layer240, a conductor film250, a lead frame280, and wires290without including a support board. The electronic component210, the lead frame280, and the wires290are embedded in the resin layer240.

The lead frame280includes a first portion281, second portions282, and third portions283disposed to surround the second portions282. The second portions282are internal wirings, and the third portions283are ground terminals. The electronic component210is fixed onto the first portion281, and connected to the second portions282via the wires290. The conductor film250is applied to the outer surface of the resin layer240, and connected to portions of the third portions283exposed from the resin layer240.

Each ofFIGS. 15A, 15B and 15Cis a cross-sectional view illustrating part of a process for manufacturing the electronic component package200. As illustrated inFIG. 15A, in the process for manufacturing the electronic component package200, first, a package aggregate is manufactured. In the package aggregate, the electronic component210is connected to each of the lead frames280and an aggregate of the lead frames280is embedded in a coupled resin layer240A. In the package aggregate, the third portions283correspond to a coupled unit283W containing adjacent two third portions283.

Subsequently, as illustrated inFIG. 15B, the package aggregate is cut with, for example, a dicing saw. Here, each coupled unit283W is cut into two third portions283. Then, as illustrated inFIG. 15C, the conductor film250is applied to each cut semifinished product to complete the electronic component package200. The conductor film250is connected to portions of the third portions283exposed from the resin layer240.Patent Document 1: International Publication No. 2016/092633

BRIEF SUMMARY OF THE DISCLOSURE

One of the characteristics of the above electronic component package200is that the electronic component package200is manufactured using an aggregate of the lead frames280each including the first portion281, the second portions282, and the coupled unit283W for the third portions283. Thus, in the manufacturing process, the coupled resin layer240A and the coupled units283W made of metal are concurrently cut with, for example, a dicing saw.

Normally, cutting starts from the coupled resin layer240A. When the dicing saw blade cuts in from the coupled resin layer240A and reaches the coupled unit283W made of metal, the hardness of an object to be cut changes abruptly. This abrupt change may require replacement of the dicing saw blade due to acceleration of a wearing out of the dicing saw blade that is to further cut the object or distortion and breakage. This replacement of the blade may hinder smooth manufacturing.

In addition, the dicing saw blade that pushes the coupled unit283W may separate the coupled unit283W from the coupled resin layer240A. This separated portion may cause a structural defect that degrades the electronic component package200in view of, for example, moisture resistance.

Specifically, an object of the present disclosure is to provide an electronic component package that prevents occurrence of structural defects, and a method for manufacturing the same.

An electronic component package according to a first aspect of the present disclosure includes a resin layer, an electronic component, a grounding member, and a conductor film. The electronic component is partially covered with the resin layer, and includes an external terminal. The grounding member is partially covered with the resin layer. The conductor film is disposed on a surface of the resin layer. The grounding member includes a multilayer body and an outer conductor disposed at an end portion of the multilayer body in a lamination direction. The multilayer body includes at least one resin film and at least one pattern conductor laminated one on another, and at least one via conductor extending in the lamination direction and connected to the outer conductor. The multilayer body includes a first surface, a second surface disposed opposite to the first surface in the lamination direction, and a third surface, which connects the first surface and the second surface. In the multilayer body, at least one of the pattern conductor has at least part of a circumference connected to the conductor film at the third surface, and electrically connected to a via conductor. Part of the external terminal and part of the outer conductor are exposed from an identical surface of the resin layer.

A method for manufacturing an electronic component package according to a second aspect of the present disclosure is a method for manufacturing an electronic component package including a resin layer, an electronic component, a grounding member, and a conductor film. The electronic component is partially covered with a resin layer, and includes an external terminal. The grounding member is partially covered with the resin layer. The grounding member includes a multilayer body, and an outer conductor disposed at an end portion of the multilayer body in a lamination direction. The multilayer body includes at least one resin film and at least one pattern conductor laminated one on another. A conductor film is disposed on a surface of the resin layer. The method for manufacturing an electronic component package includes a holding step, a resin-layer application step, a removal step, a cutting step and a conductor-film application step. In the holding step, a base including a base member and an adhesive layer applied to a first main surface of the base member, the electronic component, and a coupled grounding member including a coupled multilayer body obtained by coupling a plurality of the multilayer bodies are manufactured or prepared, and the external terminal of the electronic component and the outer conductor of the coupled grounding member are arranged on the adhesive layer to allow the electronic component and the coupled grounding member to be held on the base. In the resin-layer application step, the resin layer is applied to the adhesive layer to cover a surface of the electronic component excluding an area over which the external terminal is in contact with the adhesive layer and a surface of the coupled grounding member excluding an area over which the outer conductor is in contact with the adhesive layer. In the removal step, the base is removed to expose, from an identical surface of the resin layer, at least part of the external terminal of the electronic component and at least part of the outer conductor of the coupled grounding member. In the cutting step, together with the resin layer, the coupled grounding member is cut into a plurality of the grounding members and exposing part of a circumference of the pattern conductor. In the conductor-film application step, the conductor film is applied to a surface of the resin layer to connect the conductor film with the exposed part of the circumference of the pattern conductor.

The present disclosure can prevent occurrence of structural defects in an electronic component package.

