CROSS REFERENCE TO RELATED APPLICATIONS

This patent application is a National Stage Entry of PCT/CN2019/088779 filed on May 28, 2019, which claims the benefit and priority of Chinese Patent Application No. 201810960302.1 filed on Aug. 22, 2018, the disclosures of which are incorporated by reference herein in their entirety as part of the present application.

BACKGROUND

Embodiments of the present disclosure relate to a field of displaying technology, in particular, to a display panel and a method for manufacturing a display panel.

With the development of display technology, display devices are developing towards ultra-thin display devices, ultra-narrow frame display devices, or even frameless display devices. However, it is difficult for current narrow frame display devices technology to achieve four-side frames narrowing.

BRIEF DESCRIPTION

Embodiments of the present disclosure provide a display panel and a method for manufacturing a display panel.

One aspect of the present disclosure provides a display panel. The display panel includes a first substrate having a first wiring, a second substrate having a second wiring, the first substrate, and the second substrate being laminated on each other to form a laminated structure, and a third wiring located on a side surface of the laminated structure, wherein the third wiring connects the first wiring and the second wiring.

In an embodiment of the present disclosure, the first wiring is located on a side of the first substrate away from the second substrate, and the second wiring is located on a side of the second substrate away from the first substrate.

In an embodiment of the present disclosure, the first substrate further includes a light emitting device located on the same side as the first wiring located, and the second substrate further includes a flexible printed circuit board located on the same side as the second wiring located.

In an embodiment of the present disclosure, the first substrate and the second substrate have the same size and shape.

In an embodiment of the present disclosure, the first substrate further includes a first protective layer covering the first wiring. The second substrate further includes a second protective layer covering the second wiring. The display panel further includes a third protective layer covering the third wiring.

In an embodiment of the present disclosure, the display panel further includes an adhesive layer located between the first substrate and the second substrate.

In an embodiment of the present disclosure, portions, located at least in an edge region of the display panel, of the first wiring and the second wiring are aligned with each other along a laminated direction.

In an embodiment of the present disclosure, the first wiring and the second wiring have the same line width and spacing.

A second aspect of the present disclosure provides a method for manufacturing a display panel. The method includes providing a first substrate having a first wiring, providing a second substrate having a second wiring, joining the first substrate and the second substrate to form a laminated structure, and forming a third wiring on a side surface of the laminated structure to connect the first wiring and the second wiring.

In an embodiment of the present disclosure, joining the first substrate and the second substrate includes joining a side of the first substrate away from the first wiring and a side of the second substrate away from the second wiring.

In an embodiment of the present disclosure, providing the first substrate further includes disposing a light emitting device on a side of the first substrate on which the first wiring is formed, and providing the second substrate further includes disposing a flexible printed circuit board on a side of the second substrate on which the second wiring is formed.

In an embodiment of the present disclosure, forming the third wiring includes forming a conductive layer on a side surface of the laminated structure, and patterning the conductive layer to form the third wiring.

In an embodiment of the present disclosure, the method further includes grinding the side surface of the laminated structure before forming the third wiring.

In an embodiment of the present disclosure, providing the first substrate further includes forming a first protective layer on a side of the first substrate on which the first wiring is formed. Providing the second substrate further includes forming a second protective layer on a side of the second substrate on which the second wiring is formed. After the third wiring is formed, the method further includes forming a third protective layer covering the third wiring.

In an embodiment of the present disclosure, before joining the first substrate and the second substrate, an adhesive layer is formed on a surface to be joined of at least one of the first substrate and the second substrate.

Adaptive and further aspects and scope will become apparent from the description provided herein. It should be understood that various aspects of this disclosure may be implemented individually or in combination with one or more other aspects. It should also be understood that the description and specific examples herein are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

