CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority under 35 U.S.C. § 119 from Korean Patent Application No. 10-2018-0165370, filed on Dec. 19, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.

BACKGROUND

1. Field

The disclosure relates to methods of manufacturing a display apparatus having a small pixel size and the display apparatus having the small pixel size.

2. Description of the Related Art

Liquid crystal displays (LCD) and organic light-emitting diode (OLED) displays are widely used as display apparatuses. Recently, the technique of manufacturing a high-resolution display apparatus by using a micro-light-emitting diode (LED) has been drawing attention. However, highly efficient compact LED chips are needed for the manufacture of high-resolution display apparatuses, and a difficult transfer technique is required to arrange compact LED chips at appropriate positions.

SUMMARY

Provided are methods of manufacturing a display apparatus, in which a color conversion layer is formed by using light emission in the display apparatus itself.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

According to an aspect of the disclosure, there is provided a method of manufacturing a display apparatus, the method comprising: forming an emissive layer on a first area of a substrate; forming, on the emissive layer, a driving layer comprising a plurality of driving elements used to emit light from the emissive layer; forming an exposure line on a second area of the substrate, the exposure line being electrically connected to the driving layer; and forming a color conversion layer on the driving layer by emitting the light from the emissive layer by using the exposure line.

The forming of the emissive layer may comprise forming a plurality of light-emission areas respectively corresponding to a plurality of pixels, and connecting the plurality of light-emission areas to each other via dummy areas of the emissive layer.

The forming of the driving layer may comprise forming a plurality of scan lines extending in a first direction; and forming a plurality of data lines extending in a second direction intersecting the first direction, wherein the plurality of driving elements are respectively connected to the plurality of scan lines and the plurality of data lines, and the plurality of data lines are electrically connected to the exposure line.

The exposure line may extend in a direction intersecting the second direction.

The exposure line may extend in the first direction.

The forming of the exposure line may comprise forming a first exposure line for forming a first color conversion layer; and forming a second exposure line for forming a second color conversion layer, wherein the first exposure line is connected to a first group data line from among the plurality of data lines, and the second exposure line is connected to a second group data line from among the plurality of data lines.

The forming of the color conversion layer may comprise forming a first color conversion material on the driving layer; applying a first signal to the first exposure line to emit first light from a first area of the emissive layer corresponding to the first group data line; forming a first color conversion layer by hardening a portion of the first color conversion material that overlaps the first area of the emissive layer based on the first signal applied to the first exposure line; and removing a portion of the first color conversion material that is not hardened.

The method may further comprise forming a second color conversion material on the driving layer; applying a second signal to the second exposure line to emit second light from a second area of the emissive layer corresponding to the second group data line; forming a second color conversion layer by hardening a portion of the second color conversion material that overlaps the second area of the emissive layer based on the second signal applied to the second exposure line; and removing a portion of the second color conversion material that is not hardened.

When an on signal is applied to the first exposure line, an off signal is may be applied to the second exposure line, and when an on signal is applied to the second exposure line, an off signal may be applied to the first exposure line.

The method may further comprise applying a third signal to the first exposure line and the second exposure line to discharge a charge in the emissive layer and the plurality of driving elements.

The forming of the color conversion layer may be performed while a scan signal is applied to the plurality of scan lines.

The forming of the color conversion layer may be performed while an on signal is applied to the plurality of scan lines.

The exposure line may be directly connected to one or more of the plurality of data lines.

The exposure line may be electrically connected to the plurality of data lines via a switching device.

The switching device may comprise a plurality of transistors which electrically connect each of the plurality of data lines to the exposure line.

The switching device may comprise a multiplexer.

The method may further comprise, after forming the color conversion layer, separating the substrate into a third area including the emissive layer and fourth area including the exposure line, and removing the fourth area from the third area.

The method may further comprise, before forming the color conversion layer, forming a plurality of barriers defining a pixel on the driving layer.

At least one of the plurality of barriers may have a tapered shape with a width decreasing from a lower portion to an upper portion thereof.

A size of the pixel may be 500 ppi or more.

The emissive layer, the driving layer, the exposure line, and the color conversion layer may be monolithically formed.

According to another aspect of the disclosure, there is provided a display apparatus comprising: a plurality of scan lines extending in a first direction; a plurality of data lines extending in a second direction intersecting the first direction; a plurality of pixels respectively corresponding to the plurality of scan lines and the plurality of data lines; a plurality of first electrode pads electrically connected to the plurality of scan lines; a plurality of second electrode pads electrically connected to the plurality of data lines; a scan driver configured to apply a scan signal to the plurality of scan lines through the first electrode pads; a data driver configured to apply a data signal to the plurality of data lines through the plurality of second electrode pads; and a plurality of first dummy lines protruding from the second electrode pads in a same direction as the plurality of data lines.

The display apparatus may further comprise a plurality of second dummy lines protruding from the first electrode pads in a same direction as the plurality of scan lines.

According to another aspect of the disclosure, there is provided a semiconductor device comprising: a substrate; an emissive layer provided on a substrate; a driving layer provided on the emissive layer; a semiconductor layer self-formed on the driving layer, the semiconductor layer hardened based on light emitted from the emissive layer.

The self-formed layer may be a color conversion layer.

The semiconductor layer may comprise quantum dots.

According to another aspect of the disclosure, there is provided a method of manufacturing a semiconductor device comprising: providing an emissive layer on a substrate; providing a driving layer provided on the emissive layer; providing a semiconductor layer formed on the driving layer; and hardening the semiconductor layer based on light emitted from the emissive layer.

The semiconductor layer may be a color conversion layer.

The semiconductor layer may comprise quantum dots.

