CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a371National Stage of International Application No. PCT/KR2018/011257, filed Sep. 21, 2018, which claims priority to Korean Patent Application No. 10-2017-0127552, filed Sep. 29, 2017, the disclosures of which are herein incorporated by reference in their entirety.

BACKGROUND

1. Field

The disclosure relates to a printed circuit board including a plurality of layers, and a device for measuring the quality of a printed circuit board.

2. Description of Related Art

In order to meet the demands for compactness of electronic devices, parts included in the electronic devices have also been made compact and integrated. Accordingly, most of electronic devices include a printed circuit board (PCB) that is capable of stably connecting components included in the electronic devices within a limited space. In particular, recently, a multilayer printed circuit board including a plurality of layers has been used for more efficient space utilization.

SUMMARY

Because the multilayer printed circuit board includes the plurality of layers, a manufacturing process may be complex, and there may be a high probability that a defect is caused by a manufacturing tolerance. In particular, in the case where the multiplayer printed circuit board includes an antenna therein, the performance of the antenna may be affected by a manufacturing tolerance.

Accordingly, the manufacturing tolerance may be managed when the printed circuit board is manufactured, and the quality of the printed circuit board depending on the manufacturing tolerance between the plurality of layers included in the printed circuit board may be measured by sampling some products and performing a fracture analysis or by coupling the printed circuit board and other parts and thereafter testing the performance of a specific function.

Various embodiments of the disclosure provide a printed circuit board for more accurately and rapidly measuring the quality of the printed circuit board, a manufacturing method thereof, and a method for measuring the quality of a printed circuit board.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A device for measuring quality of a printed circuit board according to various embodiments of the disclosure includes communication circuitry that communicates with an external electronic device, a memory, and a processor electrically connected with the communication circuitry and the memory, and the processor is configured to measure the quality of the printed circuit board using at least one opening that is formed in the printed circuit board and that is empty inside.

A method for manufacturing a printed circuit board according to various embodiments of the disclosure includes a process of forming a first non-conductive layer on a first conductive layer, a process of forming a second conductive layer on the first non-conductive layer, a process of forming an oxide on a surface of the second conductive layer, a process of forming at least one first opening through the second conductive layer and the first non-conductive layer, a process of removing the oxide formed on the surface of the second conductive layer, and a process of forming at least one antenna pattern on the second conductive layer. The first opening is formed within a specified distance from the at least one antenna pattern.

According to the various embodiments of the disclosure, the quality of the printed circuit board may be accurately and rapidly measured in the process of manufacturing the PCB or by the manufactured printed circuit board itself. Accordingly, product yield and manufacturing cost may be reduced, and stable performance may be ensured.

