This application is a 35 U.S.C. § 371 National Phase of PCT Application No. PCT/EP2019/053033, filed Feb. 7, 2019, which claims priority to German Patent Application No. 102018105653.2, filed Mar. 12, 2018, the disclosures of which are hereby incorporated by reference herein in their entireties.

The invention relates to a method for producing an arrangement, an arrangement and an array according to aspects of the present disclosure.

A flexible, light-emitting textile display is known from EP 2 784 198 A1.

It is an object of the invention to provide an improved method for producing an arrangement and an improved arrangement.

This object is achieved by means of a method and an arrangement according to aspects of the present disclosure. Advantageous embodiments are specified below.

It has been recognized that an improved method for producing an arrangement may be provided by virtue of the fact that a structured contact layer and an elastic carrier layer arranged at a first side of the structured contact layer and connected to the structured contact layer by means of a cohesive connection are provided, wherein on a second side of the structured contact layer located opposite the first side, at least one optoelectronic semiconductor component is arranged on the structured contact layer and is electrically and mechanically connected to the structured contact layer, wherein a conversion layer comprising an elastic matrix material is applied to the structured contact layer and the elastic carrier layer in such a way that the optoelectronic semiconductor component is embedded in the conversion layer at least in sections.

This configuration has the advantage that the arrangement is producible particularly simply and cost-effectively. Furthermore, a stiff circuit board material is dispensed with, such that the arrangement produced by means of the method is particularly pliable and flexible and is suitable in particular for garments or banners.

In a further embodiment, a mold is heated to a predefined temperature, wherein a first reactant and a second reactant are introduced into a mold space of the mold, wherein at least a first portion of the first reactant and of the second reactant crosslink with one another to form an elastic first material of the elastic carrier layer, wherein temporally following the crosslinking of the first portion of the first reactant and second reactant, the structured contact layer is applied to the partly crosslinked elastic carrier layer, wherein temporally following the application of the structured contact layer to the elastic carrier layer, a second portion of the first reactant and of the second reactant crosslink to form the first material of the elastic carrier layer and the cohesive connection to the structured contact layer is formed. As a result, a number of method steps for production may be kept particularly small, such that the method for producing the arrangement is particularly cost-effective.

In a further embodiment, the structured contact layer is cut or stamped from a metal film, wherein temporally following the at least partial removal of the elastic carrier layer from the mold, the first side of the structured contact layer is placed areally onto the elastic carrier layer, wherein the structured contact layer and the elastic carrier layer are pressed together. As a result, a particularly flexible arrangement is achieved and at the same time a particularly simple production method is provided.

In a further embodiment, a mold is heated to a predefined temperature, wherein a first reactant and a second reactant are introduced into a mold space of the mold, wherein at least a first portion of the first reactant and of the second reactant crosslink with one another to form an elastic first material of the elastic carrier layer, wherein at least one first cavity of the elastic carrier layer is formed, wherein a third reactant and a fourth reactant are introduced into the first cavity, wherein the third reactant and the fourth reactant crosslink with one another and form the structured contact layer in the first cavity. This configuration has the advantage that the conductive layer and the first material may be cured simultaneously, such that the required time for producing the arrangement is particularly short and such that a particularly high number of arrangements is producible within a predefined time interval in mass production.

In a further embodiment, temporally following the introduction of the third reactant and the fourth reactant into the first cavity, a second portion of the first reactant and of the second reactant crosslink to form the first material of the elastic carrier layer and at the same time the third reactant and the fourth reactant crosslink with one another and form the structured contact layer in the first cavity.

In a further embodiment, the first reactant and the third reactant and/or the second reactant and the fourth reactant are identical. As a result, a particularly good cohesive connection between the structured contact layer and the elastic carrier layer may be achieved.

In a further embodiment, the third reactant and/or the fourth reactant are introduced into the first cavity by means of screen printing or by means of a dispenser.

In a further embodiment, a layer of a conductive adhesive is applied to the second side of the structured contact layer, wherein the optoelectronic semiconductor component is placed onto the layer by way of at least one first contact pad. Alternatively, a layer of a conductive adhesive is applied on a first contact pad of the optoelectronic semiconductor component, wherein the optoelectronic semiconductor component is placed onto the second side of the conductive layer by way of the layer, wherein the conductive adhesive is cured to form an electrically conductive, elastic connecting layer.

In a further embodiment, the conversion layer is applied to the elastic carrier layer in such a way that at least one connection region of the conductive layer on a side of the conductive layer facing away from the elastic carrier layer is not covered by the conversion layer and the optoelectronic semiconductor component is preferably completely embedded into the conversion layer. This ensures that the optoelectronic semiconductor component is protected against external environmental influences. Furthermore, a high luminous efficiency of the arrangement is ensured.

The arrangement produced by means of the method described above comprises an elastic carrier layer, a structured contact layer, at least one optoelectronic semiconductor component and a conversion layer, wherein the elastic carrier layer comprises an electrically nonconductive, elastic first material, wherein the elastic carrier layer is connected to a first side of the structured contact layer by means of a cohesive connection, wherein the structured contact layer comprises an electrically conductive and elastic second material, wherein on a second side of the structured contact layer located opposite the first side, the conductive layer is electrically and mechanically connected, preferably by means of an elastic connecting layer, to a first contact pad of the optoelectronic semiconductor component, wherein at least the optoelectronic semiconductor component is embedded in the conversion layer and a connection region of the conductive layer, for the contacting of the structured contact layer, is not covered by the conversion layer.

This configuration has the advantage that the arrangement comprises a particularly high mechanical moldability and bendability. Furthermore, when the arrangement is used in a garment, the arrangement adapts flexibly to a body shape and may follow a movement of the body.

In a further embodiment, the structured contact layer comprises at least one first conductive layer and one second conductive layer, wherein the second conductive layer is arranged offset with respect to the first conductive layer, wherein the elastic carrier layer electrically insulates the first conductive layer from the second conductive layer, wherein the optoelectronic semiconductor component comprises the second contact pad, wherein the second contact pad is arranged offset with respect to the first contact pad, wherein the first contact pad is connected to the first conductive layer by means of the elastic connecting layer, wherein the second contact pad is mechanically and electrically connected to the second conductive layer.

In a further embodiment, at least one first cavity is arranged in the elastic carrier layer, wherein the first cavity is filled, preferably completely, with the first conductive layer of the structured contact layer, wherein the first cavity comprises a cavity base, wherein the cavity base fluidically separates the first cavity from a side of the elastic carrier layer facing away from the structured contact layer. Alternatively, the first cavity extends over an entire thickness of the elastic carrier layer and is open on a side facing away from the optoelectronic semiconductor component.

In a further embodiment, at least one second cavity is arranged in the elastic carrier layer, wherein the second cavity is arranged offset with respect to the first cavity, wherein a web of the elastic carrier layer for fluidically separating the first cavity from the second cavity is arranged between the first cavity and the second cavity, wherein the second cavity is filled, preferably completely, with the second conductive layer of the structured contact layer.

In a further embodiment, the elastic carrier layer comprises a carrier matrix, wherein the carrier matrix comprises one of the following elastic first materials: elastic plastic, silicone, LRI silicone (LRI=low refractive index), HRI silicone (HRI=high refractive index), wherein the structured contact layer comprises at least one of the following second materials: silver, crosslinked conductive adhesive, crosslinked silver adhesive, aluminum, steel, gold, film material, silver film, steel film, gold film, copper, nickel, tin, copper film, nickel film, tin film, and/or wherein the elastic connecting layer is electrically conductive and comprises a further carrier matrix, wherein the further carrier matrix comprises one of the following elastic further materials: elastic plastic, silicone, LRI silicone (LRI=low refractive index), HRI silicone (HRI=high refractive index), wherein the further material and the first material are identical, and/or wherein the optoelectronic semiconductor component comprises an LED or a laser diode.

An improved array may be provided by virtue of the fact that the array comprises a plurality of arrangements formed as described above, wherein the elastic carrier layers of the arrangements are formed integrally and material-uniformly, wherein the optoelectronic semiconductor components are arranged at a distance from one another in a predefined pattern.

