TECHNICAL FIELD

The present disclosure relates to a variable loop control feature, and, more particularly, a variable loop control feature for substrate processing.

BACKGROUND

Products are produced by performing one or more manufacturing processes using manufacturing equipment. For example, substrate processing equipment is used to produce substrates via substrate manufacturing processes. Substrate manufacturing processes include depositing layers on a substrate.

SUMMARY

The following is a simplified summary of the disclosure in order to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure. It is intended to neither identify key or critical elements of the disclosure, nor delineate any scope of the particular implementations of the disclosure or any scope of the claims. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

In an aspect of the disclosure, a method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes a plurality of iterations of a set of one or more processes. Each iteration of the plurality of iterations is for depositing at least one layer of the plurality of layers. The method further includes determining a plurality of iteration adjustments to cause uniformity of the plurality of layers. Each iteration adjustment of the plurality of iteration adjustments corresponds to a respective iteration of the plurality of iterations. The method further includes determining one or more multipliers to cause an adjustment in thickness of one or more layers of the plurality of layers. Each multiplier of the one or more multipliers corresponds to a corresponding iteration of the plurality of iterations. The method further includes storing the plurality of iteration adjustments and the one or more multipliers as a stored plurality of iteration adjustments and one or more stored multipliers. The plurality of layers are deposited on one or more substrates based on the recipe and the stored plurality of iteration adjustments and the one or more stored multipliers.

In another aspect of the disclosure, a non-transitory machine-readable storage medium storing instructions which, when executed cause a processing device to perform operations including identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes a plurality of iterations of a set of one or more processes. Each iteration of the plurality of iterations is for depositing at least one layer of the plurality of layers. The operations further include determining a plurality of iteration adjustments to cause uniformity of the plurality of layers. Each iteration adjustment of the plurality of iteration adjustments corresponds to a respective iteration of the plurality of iterations. The operations further include determining one or more multipliers to cause an adjustment in thickness of one or more layers of the plurality of layers. Each multiplier of the one or more multipliers corresponds to a corresponding iteration of the plurality of iterations. The operations further include storing the plurality of iteration adjustments and the one or more multipliers as a stored plurality of iteration adjustments and one or more stored multipliers. The plurality of layers are deposited on one or more substrates based on the recipe and the stored plurality of iteration adjustments and the one or more stored multipliers.

In another aspect of the disclosure, a system including memory and a processing device coupled to the memory. The processing device is to identify a recipe for depositing a plurality of layers on a substrate in a processing chamber. The recipe includes a plurality of iterations of a set of one or more processes. Each iteration of the plurality of iterations is for depositing at least one layer of the plurality of layers. The processing device is further to determine a plurality of iteration adjustments to cause uniformity of the plurality of layers. Each iteration adjustment of the plurality of iteration adjustments corresponds to a respective iteration of the plurality of iterations. The processing device is further to determine one or more multipliers to cause an adjustment in thickness of one or more layers of the plurality of layers. Each multiplier of the one or more multipliers corresponds to a corresponding iteration of the plurality of iterations. The processing device is further to store the plurality of iteration adjustments and the one or more multipliers as a stored plurality of iteration adjustments and one or more stored multipliers. The plurality of layers are deposited on one or more substrates based on the recipe and the stored plurality of iteration adjustments and the one or more stored multipliers.

