FIELD OF THE DISCLOSURE

This document pertains generally, but not by way of limitation, to patch antennas and related fabrication techniques, and more particularly to a meandering patch antenna, such as for operation in radio-frequency (RF) or microwave ranges of frequencies.

BACKGROUND

Planar antennas can include patch structures comprising a conductive region and a dielectric material. Such planar antennas can be fabricated as a portion of a printed circuit assembly for use on or within a device such as a mobile or portable device, or in other applications such as vehicular or aerospace applications. Generally, one or more resonant frequencies can be established for such a planar antenna by various geometrical parameters defined by the antenna structure. For example, a circular patch antenna can include a planar, circular conductive region, such as formed upon a dielectric substrate. The circular conductive region can include a radius, and a resonant frequency of the circular patch antenna can be established in part by a value of the radius.

SUMMARY OF THE DISCLOSURE

The present inventors have recognized, among other things, that a planar antenna configuration, such as a circular patch antenna as mentioned above, may be difficult to miniaturize. For example, simply reducing a radius of the circular patch will generally increase a resonant frequency, which can be undesired. The present inventors have recognized, among other things, that a meandering antenna structure can be established, such as defining a conductive path extending in three dimensions (e.g. within and out of a two-dimensional plane). The present inventors have also recognized, among other things, that such a meandering structure can provide a lower resonant frequency than a purely planar structure, while providing the same mechanical footprint. In addition, or instead, a meandering structure can provide other benefits such as one or more of reduced weight, reduced footprint, improved radiation characteristics such as directivity or efficiency, or improved bandwidth, as illustrative examples.

Such a configuration can be referred to as a “Z-axis meandering” configuration or “Z-meandering” configuration. The present inventors have also recognized, among other things, that fabrication of a Z-meandering structure can present challenges. Generally, planar antennas fabricated using printed circuit board fabrication techniques include use of planar dielectric substrate materials, such as a glass-epoxy laminates or other planar materials (e.g., rigid materials in sheet form). By contrast, a Z-meandering configuration can include use of a substrate having an undulating (e.g., ribbed) pattern extending in an out-of-plane direction. Establishing such an undulating structure can present challenges, along with related challenges in establishing one or more conductive layers upon or within such a dielectric material.

To remedy such challenges, the present inventors have also recognized, among other things, that various deposition techniques can be used to form one or more of a dielectric layer or a conductive region. For example, a dielectric substrate can be formed using fused deposition of a polymer material (e.g., using an additive manufacturing approach such as a three-dimensional printing or “3D printing” approach). One or more conductive regions can be formed such as using a conductive ink deposited on a dielectric layer. In this manner, complex shapes extending in three dimensions can be formed in a repeatable manner, such as to facilitate rapid prototyping or production. Other fabrication techniques can be combined with techniques recited herein, such as including stamping or hot-forming of a dielectric or conductive material, as illustrative examples.

In an example, an antenna can include a dielectric substrate extending in two dimensions and defining an undulating region extending out of a plane defined by the two dimensions, and at least one conductive region following a contour of the dielectric substrate including at least a portion of the undulating region. The at least one conductive region can include a first conductive region on a first layer, and a second conductive region on another layer separate from the first conductive region of the first layer. For example, the dielectric substrate comprises a material deposited using fused deposition and the at least one conductive region comprises a cured conductive ink. In an example, a method for fabricating an antenna can include forming a dielectric substrate extending in two dimensions and defining an undulating region extending out of a plane defined by the two dimensions, and forming at least one conductive region following a contour of the dielectric substrate including at least a portion of the undulating region. For example, the at least one conductive region following the contour of the dielectric substrate can include a first conductive region on a first layer, and a second conductive region on another layer separate from the first conductive region of the first layer. In an example, the forming the dielectric substrate includes depositing a dielectric substrate material using fused deposition. In an example, the forming the dielectric substrate includes at least one of stamping or hot-forming the dielectric substrate. In an example, the forming the at least one conductive region comprises depositing a conductive ink. In an example, the forming the at least one conductive region comprises printing a conductive ink.

In an example, an antenna fabrication system can include an additive fabrication means (e.g., a three-dimensional printer such as providing fused deposition printing as an illustrative example) for forming a dielectric substrate, the dielectric substrate extending in two dimensions and defining an undulating region extending out of a plane defined by the two dimensions, and a printing means (e.g., an ink-jet or screen printing apparatus, as an illustrative example) for forming at least one conductive region following a contour of the dielectric substrate including at least a portion of the undulating region.

This summary is intended to provide an overview of subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention. The detailed description is included to provide further information about the present patent application.

