CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan Patent Application No. 109111734, filed on Apr. 8, 2020. The entire content of the above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a chip structure, a chip transferring system and a chip transferring method, and more particularly to an LED chip structure, an LED chip transferring system and an LED chip transferring method.

BACKGROUND OF THE DISCLOSURE

A light-emitting diode (LED) chip can be transferred from a carrier to a printed circuit board by a nozzle, but the conventional LED chip transferring method still has room for improvement.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the present disclosure provides an LED chip structure, a chip transferring system and a chip transferring method.

In one aspect, the present disclosure provides an LED chip structure, including an LED chip, a removable connection layer and a magnetic material layer. The LED chip has two electrode contacts disposed on a top side thereof. The removable connection layer is disposed on a bottom side of the LED chip. The magnetic material layer is disposed on the removable connection layer. The removable connection layer is connected between the LED chip and the magnetic material layer, so that when the removable connection layer is removed, the magnetic material layer is separated from the LED chip.

In another aspect, the present disclosure provides a chip transferring system, including a liquid receiving tank, an electromagnetic field generating module and a connection layer removing module. The liquid receiving tank has a liquid substance disposed therein, and a plurality of LED chip structures are randomly distributed in the liquid substance of the liquid receiving tank. The electromagnetic field generating module is movably disposed inside the liquid receiving tank or removed from the liquid receiving tank. The electromagnetic field generating module includes a movable carrier board and a plurality of electromagnetic heads disposed on the movable carrier board, and the LED chip structure is transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module. The connection layer removing module is disposed above the circuit substrate. Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer, the LED chip has two electrode contacts disposed on a top side thereof, the removable connection layer is disposed on a bottom side of the LED chip, and the magnetic material layer is disposed on the removable connection layer.

In yet another aspect, the present disclosure provides a chip transferring method, including: randomly distributing a plurality of LED chip structures in a liquid substance of a liquid receiving tank, wherein each of the LED chip structures includes an LED chip, a magnetic material layer and a removable connection layer connected between the LED chip and the magnetic material layer; transferring the LED chip structure from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module; electrically connecting the LED chip to the circuit substrate; and then removing the removable connection layer by the connection layer removing module so as to separate the magnetic material layer from the LED chip.

Therefore, by virtue of “the removable connection layer being disposed on a bottom side of the LED chip” and “the magnetic material layer being disposed on the removable connection layer”, the magnetic material layer can be separated from the LED chip while the removable connection layer is removed.

Furthermore, by virtue of “the LED chip structures being randomly distributed in the liquid substance of the liquid receiving tank”, “the electromagnetic field generating module being movably disposed inside the liquid receiving tank or removed from the liquid receiving tank” and “the connection layer removing module being disposed above the circuit substrate”, the LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.

Furthermore, by virtue of “randomly distributing a plurality of LED chip structures in a liquid substance of a liquid receiving tank”, “transferring the LED chip structure from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module”, “electrically connecting the LED chip to the circuit substrate” and “removing the removable connection layer by the connection layer removing module so as to separate the magnetic material layer from the LED chip”, the LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.

These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.

