CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No. 2019-133793 filed Jul. 19, 2019, the subject matter of which is incorporated herein by reference in entirety.

TECHNICAL FIELD

The present invention relates to a substrate treating apparatus for treating substrates and a substrate transporting method for the substrate treating apparatus. Examples of substrates include semiconductor substrates, substrates for flat panel displays (FPDs), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of the FPDs include liquid crystal display devices and organic electroluminescence (EL) display devices.

BACKGROUND ART

As shown inFIG. 1, a currently-used substrate treating apparatus201includes an indexer block (hereinafter, appropriately referred to as “ID block”)202and a treating block203. See, for example, Japanese Unexamined Patent Application Publication No. 2014-022570A. The ID block202includes a carrier platform216for placing a carrier C capable of accommodating a plurality of substrates, and a substrate transporting robot (not shown) for transporting a substrate between the carrier C placed on the carrier platform216and the treating block203. The treating block203performs a coating treatment for applying a resist liquid to the substrate, for example.

Moreover, the substrate treating apparatus201includes a stocker device (carrier buffer device)208. See for example, Japanese Unexamined Patent Application Publication No. 2011-187796A. The stocker device208is disposed so as to extend horizontally toward the carrier platform216. The stocker device208includes a carrier transport mechanism261for transporting the carrier C, and a storage shelf263for storing the carrier C.

Japanese Unexamined Patent Application Publication No. 2016-201526A discloses a substrate treating system including a delivery block disposed between the ID block and the treating block. The delivery block includes a plurality of buffer units arranged in the vertical direction, and two transfer mechanisms arranged so as to sandwich the plurality of buffer units. The two transfer devices are arranged in a horizontal direction (Y direction) perpendicular with respect to a direction (X direction) in which the ID block and the treating block are arranged.

Moreover, Japanese Unexamined Patent Application Publication No. H09-045613A discloses a substrate treating apparatus in which a coating-treatment block, a cassette station (corresponding to an ID block), and a developing-treatment block are linearly connected in a horizontal direction in this order. The cassette station is configured so that four cassettes containing either an untreated substrate or a treated substrate can be arranged therein. In addition, a first mounting platform for alignment of the substrate is provided at a boundary between the coating-treatment block and the cassette station, and a second mounting platform for alignment of the substrate is provided at a boundary between the cassette station and the developing-treatment block. One transport mechanism in the cassette station transports the substrates through the mounting platforms to the coating-treatment block and the developing-treatment block.

SUMMARY OF THE INVENTION

Technical Problem

The treating block203of the substrate treating apparatus201includes a plurality of the treatment layers (e.g., the two treatment layers203A,203B ofFIG. 1) stacked one above the other. This enables parallel treatment of substrates in accordance with the number of the treatment layers. However, the height of the substrate treating apparatus201is limited, and the number of the treatment layers to be stacked is also limited.

Thus, the substrate treating apparatus201shown inFIG. 2is applicable, for example. The substrate treating apparatus201shown inFIG. 2includes two treating blocks203,205in a horizontal direction. The treating block203includes two treatment layers203A,203B. The treating block205includes two treatment layer205A,205B.

Such a configuration possesses the following problems. For example, when a substrate is transported from the ID block202to the treatment layer205A, the substrate needs to be passed through the treatment layer203A. Moreover, when a substrate treated in the treatment layer205A is returned to the ID block202, the substrate needs to be passed through the treatment layer203A. Thus, the substrate transportation between the ID block202and the treatment layer205A may cause reduction in throughput of the treatment layer203A. In addition, reduction in entire throughput of the substrate treating apparatus201may be generated. Moreover, the substrate treating apparatus201shown inFIG. 2may have difficulty in control. In addition, reduction in footprint of the substrate treating apparatus1is needed.

The present invention has been made regarding the state of the art noted above, and its object is to provide a substrate treating apparatus and a substrate transporting method capable of preventing reduction in throughput, increasing the number of treatment layers, and further reduction in footprint.

Solution to Problem

To achieve the object, the present invention provides a configuration as follows. One aspect of the present invention provides a substrate treating apparatus including an indexer block where a carrier platform for placing a carrier capable of accommodating substrates is provided, a first treating block, and a second treating block. The first treating block, the indexer block, and the second treating block are linearly connected in this order in a horizontal direction. The indexer block includes a substrate buffer disposed in the middle of the first treating block and the second treating block and configured to place a plurality of substrates. The indexer block takes a substrate from a carrier placed on the carrier platform, and transports the substrate to the substrate buffer. The first treating block receives the substrate from the substrate buffer, performs a first treatment on the received substrate, and transports the substrate, subjected to the first treatment, to the substrate buffer. The second treating block receives the substrate from the substrate buffer, performs a second treatment on the received substrate, and transports the substrate, subjected to the second treatment, to the substrate buffer. The indexer block returns the substrate, transported from at least either the first treating block or the second treating block, from the substrate buffer to the carrier placed on the carrier platform.

With the substrate treating apparatus according to the present invention, the first treating block and the second treating block are not arranged so as to stack, but are arranged horizontally. Accordingly, the number of the treatment layers is increasable while the height of the substrate treating apparatus is suppressed. Moreover, when the indexer block, the first treating block, and second treating block are arranged in this order, for example, the operation of passing through the first treating block without performing any treatment on the substrate is required in order to perform a treatment on the substrate in the second treating block. In this regard, the first treating block and the second treating block are each connected directly to the indexer block. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput.

Moreover, it is assumed that a first substrate buffer is provided between the indexer block and the first treating block, and a second substrate buffer is provided between the indexer block and the second treating block. In this case, two substrate buffers are arranged on both sides of the indexer block, and also in the direction where the two treating blocks are arranged. Accordingly, the substrate treating apparatus1may be elongated in that direction. According to the present invention, the substrate buffer is disposed in the middle of the two treating blocks. Both of the two treating blocks transport substrates to the substrate buffer. That is, the first substrate buffer and the second substrate buffer are stacked at the same position in plan view (i.e., at one position). Therefore, the possibility of elongating the substrate treating apparatus1is reducible. In other words, reduction in footprint of the substrate treating apparatus is obtainable.

Moreover, it is preferred in the substrate treating apparatus described above that the carrier platform is disposed on an upper surface of or above at least one of the indexer block, the first treating block and the second treating block. For instance, if a carrier platform is disposed on the side of the indexer block, the footprint of the substrate treating apparatus increases because the carrier platform is disposed. In this regard, with the configuration of the present invention, the carrier platform overlaps with at least one of the indexer block, the first treating block and the second treating block in plan view. As a result, suppressed increase in footprint of the substrate treating apparatus is obtainable.

Moreover, the following is preferred in the substrate treating apparatus described above. The substrate treating apparatus further includes a carrier storage shelf and a carrier transport mechanism. The carrier storage shelf is mounted on at least one of the indexer block, the first treating block, and the second treating block, and is configured to store the carrier. The carrier transport mechanism is mounted on at least one of the indexer block, the first treating block, and the second treating block, and is configured to transport the carrier between the carrier platform and the carrier storage shelf.

If the carrier storage shelf and the carrier transport mechanism are provided horizontally with respect to the indexer block and two treating blocks, the footprint of the substrate treating apparatus increases accordingly. In this regard, the carrier storage shelf and the carrier transport mechanism are arranged so as to overlap at least one of the indexer block and the two treating blocks in plan view. As a result, suppressed increase in footprint of the substrate treating apparatus is obtainable. This allows the substrate treating apparatus to fit in a limited footprint.

Moreover, it is preferred that the substrate treating apparatus described above further includes a carrier storage shelf configured to store the carrier, and a carrier transport mechanism configured to transport the carrier between the carrier platform and the carrier storage shelf. The carrier storage shelf and the carrier transport mechanism are mounted on one lower block of the first treating block and the second treating block.

If the carrier storage shelf and the carrier transport mechanism are provided horizontally with respect to the indexer block and two treating blocks, the footprint of the substrate treating apparatus increases accordingly. In this regard, the carrier storage shelf and the carrier transport mechanism are arranged so as to overlap one of the two treating blocks in plan view. As a result, suppressed increase in footprint of the substrate treating apparatus is obtainable. Moreover, the carrier storage shelf and the carrier transport mechanism are mounted on the lower block of the first treating block and the second treating block. Therefore, the height of the substrate treating apparatus is suppressible.

Moreover, it is preferred in the substrate treating apparatus described above that the second treating block performs a treatment equal to a treatment by the first treating block. This yields increase in number of substrates subjected to parallel treatment.

Moreover, it is preferred in the substrate treating apparatus described above that the indexer block further includes an indexer substrate transport mechanism therein, and the indexer substrate transport mechanism transports a substrate between a carrier placed on the carrier platform and the substrate buffer. This enables the indexer substrate transport mechanism to transport substrate between a carrier placed on the carrier platform and the substrate buffer. In addition, both the first treating block and the second treating block are capable of taking substrates placed on the substrate buffer by the indexer substrate transport mechanism.

Moreover, it is preferred in the substrate treating apparatus described above that the indexer block includes another indexer substrate transport mechanism therein in addition to the indexer substrate transport mechanism, and the two indexer substrate transport mechanisms are arranged across the substrate buffer perpendicularly with respect to a direction in which the first treating block and the second treating block are arranged. That is, the two treating blocks are arranged so as to sandwich the substrate buffer. Moreover, the two indexer substrate transport mechanisms are arranged so as to sandwich the substrate buffer perpendicularly with respect to a direction in which the two treating blocks are arranged. This enables taking of the substrates from four directions horizontally with respect to the substrate buffer.

Moreover, it is preferred in the substrate treating apparatus described above that the first treating block includes a first transport mechanism, the second treating block includes a second transport mechanism, the first treating block receives a substrate from the substrate buffer via the first transport mechanism, performs a first treatment on the received substrate, and transports the substrate, subjected to the first treatment, to the substrate buffer via the first transport mechanism, and the second treating block receives the substrate from the substrate buffer via the second transport mechanism, performs a second treatment on the received substrate, and transports the substrate, subjected to the second treatment, to the substrate buffer via the second transport mechanism.

This allows performance of the first treatment and the second treatment on the substrate. The substrates are transportable from the first treating block to the second treating block through the substrate buffer without using the substrate transportation by the indexer block. Accordingly, the burden of the substrate transportation by the indexer block is reducible. Therefore, the substrate transportation is performable efficiently, leading to prevention of reduction in throughput.

Moreover, it is preferred in the substrate treating apparatus described above that at least either the first treating block or the second treating block includes a plurality of treatment layers arranged to be stacked, the substrate buffer includes a plurality of buffer units provided respectively corresponding to levels of the treatment layers, and each of the buffer units is configured to be detachable and attachable from and to the indexer block. The substrate buffer is provided with a plurality of buffer units. The buffer units are individually configured to be detachable and attachable. Therefore, since the buffer units are individually transportable, the substrate buffer is easily transportable.

Moreover, the following is preferred in the substrate treating apparatus described above. The substrate buffer includes a plurality of substrate platforms arranged vertically. Each of the substrate platforms includes three support pins disposed about a vertical axis and configured to support one substrate. The three support pins are configured to be detachable and attachable from and to each of the substrate platforms. The three support pins of each of the substrate platforms are arranged so as not to overlap the three support pins of the substrate platforms immediately above and below in plan view.

If the two support pins overlap in plan view, the tool may touch the lower support pin in attaching and detaching the upper support pin. In contrast to this, if the two support pins do not overlap in plan view, the possibility that the tool will touch the lower support pin is reduced in attaching and detaching the upper support pin. Accordingly, this makes it easy to attach and detach the support pins. Therefore, enhanced maintainability of the buffer units is obtainable.

Another aspect of the present invention provides a substrate transporting method for a substrate treating apparatus. The substrate treating apparatus includes an indexer block where a carrier platform for placing a carrier capable of accommodating substrates is provided, a first treating block, and a second treating block. The substrate transporting method includes a first taking and transporting step of causing the indexer block to take a substrate from a carrier placed on the carrier platform and to transport the substrate to a substrate buffer provided inside the indexer block, a first treating and transporting step of causing the first treating block to receive the substrate from the substrate buffer, to perform a first treatment on the received substrate, and to transport the substrate, subjected to the first treatment, to the substrate buffer, a second treating and transporting step of causing the second treating block to receive the substrate from the substrate buffer, to perform a second treatment on the received substrate, and to transport the substrate, subjected to the second treatment, to the substrate buffer, and a returning step of causing the indexer block to return the substrate, transported from at least either the first treating block or the second treating block, from the substrate buffer to the carrier placed on the carrier platform. The first treating block, the indexer block, and the second treating block are linearly connected in this order in a horizontal direction, and the substrate buffer is disposed in the middle of the first treating block and the second treating block, and places a plurality of substrates therein.

With the substrate transporting method of the substrate treating apparatus according to the present invention, the first treating block and the second treating block are not arranged so as to stack, but are arranged horizontally. Accordingly, the number of the treatment layers is increasable while the height of the substrate treating apparatus is suppressed. Moreover, when the indexer block, the first treating block, and second treating block are arranged in this order, for example, the operation of passing through the first treating block without performing any treatment on the substrate is required in order to perform a treatment on the substrate in the second treating block. In this regard, the first treating block and the second treating block are each connected directly to the indexer block. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput.

Moreover, it is assumed that a first substrate buffer is provided between the indexer block and the first treating block, and a second substrate buffer is provided between the indexer block and the second treating block. In this case, two substrate buffers are arranged on both sides of the indexer block, and also in the direction where the two treating blocks are arranged. Accordingly, the substrate treating apparatus1may be elongated in that direction. According to the present invention, the substrate buffer is disposed in the middle of the two treating blocks. The two treating blocks each transport substrates to the substrate buffer. That is, the first substrate buffer and the second substrate buffer are stacked at the same position in plan view (i.e., at one position). Therefore, the possibility of elongating the substrate treating apparatus1is reducible. In other words, reduction in footprint of the substrate treating apparatus is obtainable.

Advantageous Effects of Invention

The substrate treating apparatus and the substrate transporting method according to the present invention are capable of preventing a decrease in throughput, increasing the number of the treatment layers, and further reducing the footprint.

