CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of China application serial no. 201911013323.3, filed on Oct. 23, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The disclosure relates to an electronic device, and particularly relates to an electronic device with openings disposed in a peripheral region.

Description of Related Art

Electronic products have become indispensable necessities in modern society. Along with rapid development of the electronic products, consumers have high expectations for qualities, functions or prices of the products.

Therefore, the electronic products need to be improved, such as improving reliability of electronic devices, but there are still some problems to be solved.

SUMMARY

The disclosure is directed to an electronic device having better reliability or display quality.

According to an embodiment of the disclosure, the electronic device has a peripheral region, and includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

Based on the above description, based on the planarization layer having the openings and configuration of the first portions between the openings, structural reliability, reliability, performance or display quality of the electronic device may be improved.

