CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent Application No. 10-2020-0145285 filed on Nov. 3, 2020 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a printed circuit board.

BACKGROUND

Due to the recent high-speed data processing and increases in data volume, demand for flip-chip ball grid array (FCBGA) substrates has increased in various markets, even in fields other than that of the existing central processing unit (CPU) market, and product structures have been diversified from a conventional CPU-focused product structures into various product structures. According to the diversification of products, there are demands for package substrates of various designs, and each layer in the substrate also has a higher density in design as compared with that in the conventional product.

Concerning a 2.5D package product that is a server for which demand has recently increased in particular, input/output terminals (I/O) and memories are added thereto, and accordingly, a size of a substrate is increasing. However, the increase in the size of the substrate may cause a problem in which voids may occur.

SUMMARY

An aspect of the present disclosure may provide a printed circuit board that is advantageous in preventing occurrence of voids in a through-hole.

Another aspect of the present disclosure may provide a printed circuit board in which a plating area in a through-hole is increased to improve reliability at the time of transmitting signals.

One of several solutions suggested through the present disclosure may be to provide a printed circuit board having a thick core in which a plug is disposed in a through-hole using a bridge plating technique in order to address voids or unfilled areas that may be generated at the time of plugging the through-hole.

According to an aspect of the present disclosure, a printed circuit board may include: an insulating layer having one surface and the other surface; metal layers respectively disposed on the one surface and the other surface of the insulating layer; a through-hole penetrating through the insulating layer and the metal layers; a first plating layer disposed in the through-hole to divide the through-hole into first and second areas; and a plug disposed in the through-hole.

According to another aspect of the present disclosure, a printed circuit board may include: an insulating layer; a plurality of through-holes penetrating through the insulating layer; a plurality of plugs disposed in the plurality of through-holes, respectively; and a first plating layer penetrating through each of the plurality of plugs.

According to another aspect of the present disclosure, a printed circuit board may include: an insulating layer; a through-hole penetrating through the insulating layer; a conductive layer disposed at least in the through-hole; a first plug and a second plug disposed in the through-hole and separated from each other by the conductive layer; and a metal layer disposed on one or more of the first plug and the second plug.

