FIELD OF THE INVENTION

The present invention relates to a modular connector with reduced crosstalk. In particular, the invention relates to a modular connector with printed circuit board wafer component to optimize impedance and reduce crosstalk.

BACKGROUND OF THE INVENTION

Due to the increasing complexity of electronic components, it is desirable to fit more components in less space on a circuit board or other substrate. Consequently, the spacing between electrical terminals within connectors has been reduced, while the number of electrical terminals housed in the connectors has increased, thereby increasing the need in the electrical arts for electrical connectors that are capable of handling higher and higher speeds and to do so with greater and greater pin densities. It is desirable for such connectors to have not only reasonably constant impedance levels, but also acceptable levels of impedance and cross-talk, as well as other acceptable electrical and mechanical characteristics. Therefore, there remains a need to provide appropriate shielding to preserve signal integrity and to minimize crosstalk as speeds of signals increase and the footprint of the connector remains the same or decreases.

It would, therefore, be beneficial to provide a connector which reduces crosstalk between contact pairs. It would also be beneficial to reduce crosstalk in a backplane connector and in the footprint of the printed circuit board to which the connector is assembled.

SUMMARY OF THE INVENTION

An embodiment is directed to a circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. A plurality of signal pathways is provided on the first surface. A plurality of first ground pathways is provided on the first surface. Each of the plurality of first ground pathways is positioned adjacent at least one of the plurality of signal pathways. A plurality of second ground pathways are provided on the second surface. The plurality of second ground pathways are positioned in line with the plurality of the signal pathways. Vias extend from the first plurality of ground pathways through the circuit board to the second plurality of ground pathways, thereby placing the first plurality of ground pathways in electrical engagement with the second plurality of ground pathways. The first plurality of ground pathways, the vias and the second plurality of ground pathways extend along multiple pairs of the plurality of signal pathways and form cavities around the multiple pairs of the plurality of signal pathways to provide electrical shielding for the multiple pairs of the plurality of signal pathways. The spacing between the ground pathways forming the cavities and the signal pathways is such that impedance is optimized.

An embodiment is directed to a modular electrical connector with a housing having modules positioned therein. The modules have circuit boards. The circuit boards have a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. First ground pathways are provided on the first surface, with each of the first ground pathways positioned adjacent at least one of the signal pathways. Second ground pathways are provided on the second surface, the second ground pathways are positioned in line with the signal pathways. Vias extend from the first ground pathways through the circuit board to the second ground pathways, thereby placing the first ground pathways in electrical engagement with the second ground pathways. The combination of the first ground pathways, the vias and the second ground pathways of the circuit boards of the modules entirely peripherally surround pairs of signal pathways to provide electrical shielding for the pairs of signal pathways. The spacing between the ground pathways forming the cavities and the signal pathways is such that impedance is optimized.

Other features and advantages of the present invention will be apparent from the following more detailed description of the illustrative embodiment, taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.

