CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority under 35 USC 119 from Japanese Patent Application No. 2020-086888 filed on May 18, 2020, the contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a circuit connection module.

BACKGROUND ART

Conventionally, a circuit connection module in which a terminal block or the like that holds a terminal and an electronic component or the like are fixed to a board has been proposed. For example, one of conventional circuit connection modules includes a board including a conductor pattern, an electronic component mounted on the board and connected to the conductor pattern, and a terminal block that holds a plurality of terminals connected to the conductor pattern. The circuit connection module is used as a connector unit mounted on an in-vehicle ECU or the like (see, for example, Patent Literature 1).

CITATION LIST

Patent Literature

Patent Literature 1: JP-A-2019-197696

Heat generated by the electronic component during an operation of the electronic component as described above is dissipated, for example, from an outer surface of the electronic component into surrounding air. However, since thermal resistance of air is large, sufficient heat dissipation may not be achieved depending on a heat generation amount of the electronic component.

SUMMARY OF INVENTION

One of objects of the present invention is to provide a circuit connection module having excellent performance of dissipating heat generated by an electronic component.

In order to achieve the above object, a circuit connection module according to the present invention includes a board, an electronic component mounted on the board; and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

