BACKGROUND

Vehicle driver assistance systems utilize controllers, such as a multi-domain controllers, that have multiple integrated circuit (IC) chips. The IC chips often generate significant amounts of waste heat. Removal of the waste heat to ensure reliable operation is challenging, and next-generation IC chips are expected to generate even greater amounts of waste heat.

One approach to removing the waste heat involves use of a heat sink on the topside of the IC chip. In order to enhance heat transfer a thermal interface material is used between the IC chip and the heat sink. Thermal interface materials typically include metals or graphite for high thermal conductivity. Such materials, however, are also electrically conductive and can cause electrical short circuits if they migrate from the interface.

SUMMARY

An electronic device according to an example of the present disclosure includes a printed circuit board that supports an integrated circuit (IC) chip, and a thermal interface layer that is configured to transfer thermal energy from the IC chip. The thermal interface layer includes a containment frame that is non-electrically conductive, and a thermal conductance pane inset in the containment frame.

In a further embodiment of any of the foregoing embodiments, the containment frame includes a porous structure.

In a further embodiment of any of the foregoing embodiments, the porous structure is a mesh.

In a further embodiment of any of the foregoing embodiments, the containment frame includes a composite material disposed in pores of the porous structure.

In a further embodiment of any of the foregoing embodiments, the composite material includes a polymer.

In a further embodiment of any of the foregoing embodiments, the composite material includes non-electrically conductive particles.

In a further embodiment of any of the foregoing embodiments, the non-electrically conductive particles are selected from the group consisting of alumina, boron nitride, aluminum nitride, and combinations thereof.

In a further embodiment of any of the foregoing embodiments, the composite material includes, by weight, less than 5% of the non-electrically conductive particles.

In a further embodiment of any of the foregoing embodiments, the composite material has a softening point of 40° C. to 70° C.

In a further embodiment of any of the foregoing embodiments, the thermal conductance pane is composed of a thermally conductive material selected from the group consisting of copper metal, aluminum metal, graphite, and combinations thereof.

In a further embodiment of any of the foregoing embodiments, the thermal conductance pane defines side edges, the containment frame defines inside edges that circumscribe an interior opening, the thermal conductance pane is inset in the interior opening, and the side edges of the thermal conductance pane are secured to the inside edges of the containment frame.

In a further embodiment of any of the foregoing embodiments, the porous structure is a mesh, the containment frame includes a composite material disposed in pores of the mesh, and the thermal conductance pane is composed of a thermally conductive material selected from the group consisting of copper metal, aluminum metal, graphite, and combinations thereof.

A thermal interface layer for transferring thermal energy from an integrated circuit chip according to an example of the disclosure includes a containment frame that is non-electrically conductive; and a thermal conductance pane inset in the containment frame.

In a further embodiment of any of the foregoing embodiments, the containment frame includes a porous structure and a composite material disposed in pores of the porous structure.

In a further embodiment of any of the foregoing embodiments, the composite material has a softening point of 40° C. to 70° C.

In a further embodiment of any of the foregoing embodiments, the thermal conductance pane is composed of a thermally conductive material selected from the group consisting of copper metal, aluminum metal, graphite, and combinations thereof, the thermal conductance pane defines side edges, the containment frame defines inside edges that circumscribe an interior opening, the thermal conductance pane is inset in the interior opening, and the side edges of the thermal conductance pane are secured to the inside edges of the containment frame.

In a further embodiment of any of the foregoing embodiments, the porous structure is a mesh, the containment frame includes a composite material disposed in pores of the mesh.

A method for fabricating a thermal interface layer according to an example of the present disclosure includes providing a containment frame that is non-electrically conductive, and insetting a thermal conductance pane in the containment frame.

In a further embodiment of any of the foregoing embodiments, the providing includes introducing a composite material into pores of a porous structure to form a blank frame.

In a further embodiment of any of the foregoing embodiments, the providing further includes removing an interior region from the blank frame to form the containment frame with inside edges that circumscribe an interior opening.

In a further embodiment of any of the foregoing embodiments, the insetting includes mounting the thermal conductance pane in the interior opening.

