CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0126603, filed on Oct. 23, 2018, in the Korean intellectual Property Office, the disclosure of which is incorporated by reference herein its entirety.

BACKGROUND

1. Field

Embodiments disclosed in the disclosure relate to technique(s) for providing an antenna structure that may be capable of increasing a bandwidth to transmit signals in a plurality of frequency bands and isolating signals of different frequencies from each other.

2. Description of Related Art

An electronic device (e.g., a smartphone or a wearable device) that supports wireless communication transmits and receives radio frequency (RF) signals. The printed circuit board (PCB) of the electronic device may have one or more circuit board layers. The electronic device transmits and receives an RF signal using a plurality of patch antenna elements provided on the circuit board layers. When the electronic device receives the RF signal by the plurality of patch antenna elements, the communication module provides the information content of the RF signal to a processor.

The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.

SUMMARY

In accordance with an aspect of the disclosure, an electronic device comprising a Printed Circuit Board (PCB) including a first circuit board plane including a plurality of first patch antenna elements and a second circuit board plane including a plurality of second patch antenna elements, a communication module that transmits and receives a signal of a first frequency band using the plurality of first patch antenna elements, and transmits and receives a signal of a second frequency band higher than the first frequency band using the plurality of second patch antenna elements, a processor connected to the communication module, wherein central points of the plurality of first patch antenna elements are spaced apart from one another to have a first distance and central points of the plurality of second patch antenna elements are spaced apart from one another to have a second distance shorter than the first distance, and wherein the plurality of second patch antenna elements are arranged such that the central points of the plurality of second patch antenna elements are disposed to be closer to a central axis connecting a first central point that is a center of gravity of the first circuit hoard plane and a second central point that is a center of gravity of the second circuit hoard plane in a direction passing through the printed circuit board from a first surface to a second surface of the printed circuit board, than central points of the plurality of first patch antenna elements.

In accordance with another aspect of the disclosure, an antenna structure comprises a Printed Circuit Board (PCB), wherein the PCB includes a first circuit board plane including a plurality of first patch antenna elements formed to have a first size enabling transmission and reception of a signal of a first frequency band, a second circuit board plane including a plurality of second patch antenna elements formed to have a second size enabling transmission and reception of a signal of a second frequency band, wherein the plurality of first patch antenna elements are disposed such that central points of the plurality of first patch antenna elements are spaced apart from one another by a first distance related to a first wavelength of the first frequency band and the plurality of second patch antenna elements are disposed such that central points of the plurality of second patch antenna elements are spaced apart from one another by a second distance related to a second wavelength of the second frequency band, and wherein the plurality of second patch antenna elements are disposed above the first circuit board plane to overlap at least some of the plurality of first patch antenna elements.

In accordance with another aspect of the disclosure, an electronic device includes a Printed Circuit Board (PCB) including a first circuit board plane including a plurality of first patch antenna elements and a second circuit board plane including a plurality of second patch antenna elements, a communication module that transmits and receives a signal of a first frequency band using the plurality of first patch antenna elements, and transmits and receives a signal of a second frequency band using the plurality of second patch antenna elements, and a processor connected to the communication module. Wherein the plurality of first patch antenna elements include a first central patch disposed on a central axis of the PCB and first side patches spaced apart from each other on both sides of the first central patch, wherein the plurality of second patch antenna elements include a second central patch disposed on a central axis of the PCB and second side patches spaced apart from each other on both sides of the second central patch, and wherein the second side patches are arranged to be closer to the central axis connecting a first central point that is a center of gravity of the first circuit board plane and a second central point that is a center of gravity of the second circuit board plane in a direction passing through the printed circuit board from a first surface to a second surface of the printed circuit hoard, than central points of the first side patches, and the first central patch and the second central patch are fed using central feed terminals formed in difference directions.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses certain embodiments of the disclosure.

