CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Japanese Patent Application No. 2019-112207, filed Jun. 17, 2019, the entire content of which is incorporated herein by reference.

BACKGROUND

Technical Field

The present disclosure relates to an inductor component.

Background Art

As described in Japanese Patent No. 6024243, an inductor component that is installed in an electronic device includes, for example, a pair of magnetic layers that include a resin and a metal magnetic powder contained in the resin and a spiral wiring line sandwiched between the pair of magnetic layers.

In the inductor component described in Japanese Patent No. 6024243, it is preferable that the content of the metal magnetic powder in each of the magnetic layers be 90 wt % to 97 wt % and that the content of the resin in each of the magnetic layers be 3 wt % to 10 wt %. The spiral wiring lines are each formed on one of the two surfaces of a substrate and are each covered with an insulator, which contains a resin and has an insulating property. Each of the insulators prevents the corresponding spiral wiring line and one of the magnetic layers from being electrically connected to each other. The pair of magnetic layers cover the insulators from opposite sides in a thickness direction.

SUMMARY

In recent years, electronic devices such as laptop personal computers and smartphones have been reduced in size and thickness. With reduction of the sizes and the thicknesses of electronic devices, inductor components that are installed in such electronic devices also have been desired to be smaller and thinner.

A spiral wiring line, an insulator, and a resin or a metal magnetic powder that is included in a magnetic layer expand and contract due to temperature changes, and the degrees of their expansion and contraction are different from one another. Thus, stress such as deformation due to heat may sometimes be accumulated. In particular, when an inductor component is mounted on a mounting substrate, stress is further accumulated due to the differences in the degrees of expansion and contraction between the mounting substrate, solder that joins the mounting substrate and the inductor component to each other, and the inductor component, and cracks may sometimes be generated in the inductor component or the solder.

Here, as in Japanese Patent No. 6024243, when the content of metal magnetic powder in a magnetic layer is set to 90 wt % to 97 wt %, the degrees of expansion and contraction of the magnetic layer becomes closer to the degrees of expansion and contraction of a piece of glass cloth included in a mounting substrate and to the degrees of expansion and contraction of a spiral wiring line made of a metal, and thus, stress reduction can be achieved. However, in this case, the insulating property of the magnetic layer deteriorates, and thus, it is necessary to, for example, coat the magnetic layer, the metal magnetic powder, and the spiral wiring line with an insulator. This leads to undesirable effects such as increase in the manufacturing costs due to an increase in the workload or increase in size and thickness due to an additional structure.

Accordingly, the present disclosure provides an inductor component capable of achieving stress reduction and improvement in an insulating property.

An inductor component according to preferred embodiments of the present disclosure includes a multilayer body including a magnetic layer and an inductor wiring line disposed in the multilayer body. The magnetic layer includes a base resin, a metal magnetic powder, and a non-magnetic powder, the base resin having voids, and the metal magnetic powder and the non-magnetic powder being contained in the base resin. The metal magnetic powder has a particle that is in contact with at least one of the voids and with the non-magnetic powder.

According to the above-described preferred embodiments, stress reduction and improvement in an insulating property can be achieved by at least one of the voids that is in contact with the metal magnetic powder and the non-magnetic powder that is in contact with the metal magnetic powder.

Note that, in the present specification, the term “inductor wiring line” refers to a wiring line that gives an inductance to the inductor component by generating a magnetic flux in the magnetic layer when a current flows therethrough, and the structure, the shape, the material, and so forth of the inductor wiring line are not particularly limited.

An inductor component according to an aspect of the present disclosure can achieve stress reduction and improvement in an insulating property.

Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of the present disclosure with reference to the attached drawings.

