TECHNICAL FIELD

The disclosure relates to techniques for verifying structural integrity of conductive or semiconductive materials.

BACKGROUND

Many materials are useful when their mechanical properties remain intact, but less useful when damaged, such as when cracked. Thus, detection of whether these materials are damaged is important. As one example, ceramic body plating is used to protect soldiers, police officers, and other security personnel from projectiles. Ceramic body plating may be useful when undamaged, but may be replaced after being damaged, e.g., after cracking.

X-ray scanning, including X-ray radiography and X-ray computed tomography (CT scanning) may be used to detect cracks or other defects in materials. However, such techniques may utilize large and heavy scanners, which may not be easily portable. Further, X-ray scanning and X-ray CT scanning may be relatively expensive, relatively slow, or both.

SUMMARY

In some examples, the disclosure describes a measurement system for detecting a crack or other defect in a material. The measurement system may include control electronics; an electrical signal source; a plurality of measurement system electrical contacts; at least one feature for repeatably electrically connecting the plurality of measurement system electrical contacts to selected locations of a tested material. The control electronics may be configured to: cause the electrical signal source to output an electrical signal; determine a measured voltage in response to the electrical signal using a measurement electrical contact from the plurality of measurement system electrical contacts. The measurement electrical contact is electrically coupled to the tested material. The control electronics also may be configured to determine whether the tested material includes a crack or other defect based on the measured voltage.

In some examples, the disclosure describes a method for detecting a crack or defect in a material. The method may include coupling a plurality of measurement system electrical contacts of a measurement system to a tested material. The measurement system includes at least one feature for repeatably electrically connecting the plurality of measurement system electrical contacts to selected locations of a tested material. The method also may include causing, by control electronics, an electrical signal source to output an electrical signal. The method further may include determining, by the control electronics, a measured voltage in response to the electrical signal using a measurement electrical contact from the plurality of measurement system electrical contacts; and determining, by the control electronics, whether the tested material includes a crack or other defect based on the measured voltage.

The techniques described herein may provide one or more advantages. For example, using a measurement system in which all electronics are separate from the material being tested may reduce cost associated with the material. As another example, a measurement system that includes at least one feature for repeatably electrically connecting electrical contacts of the measurement system to selected locations of the material being tested may facilitate repeatability of electrical property measurements for the material, which may improve accuracy of determinations of whether the material includes a crack or other defect. Further, a measurement system as described herein may offer improved portability and cost compared to an X-ray radiography or X-ray computed tomography system, while offering sufficient accuracy and detail to enable detection of cracks or other defects in a material being used in the field.

The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.

