CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of Japanese Patent Application No. 2019-197445, filed on Oct. 30, 2019, the entire contents of which are incorporated herein by reference.

BACKGROUND

Field

Embodiments described herein relate to a semiconductor device.

Description of the Related Art

There has been known a semiconductor device that includes a substrate, a plurality of first wiring layers laminated in a first direction intersecting with a surface of the substrate, and a second wiring layer that is farther from the substrate than the plurality of first wiring layers and includes a bonding pad electrode.

