CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No. 2019-066970, filed on Mar. 29, 2019, contents of which are incorporated herein by reference.

TECHNICAL FIELD

The technology disclosed herein relates to a semiconductor device.

BACKGROUND

Japanese Patent Application Publication No. H11-040728 describes a semiconductor device. The semiconductor device includes a semiconductor element including an electrode on a surface of the semiconductor element, and a terminal bonded to the electrode via a bonding material. The terminal includes a convex portion. The terminal is bonded to the electrode at the convex portion.

SUMMARY

In the above-described semiconductor device, the convex portion of the terminal is bonded to the electrode of the semiconductor element via the bonding material such as solder. However, the electrode of the semiconductor element has a relatively small size. Therefore, unintentional displacement of the terminal during the bonding of the convex portion of the terminal to the electrode would lead to contact of the terminal and/or the bonding material with an unintended part of the semiconductor element, for example. The disclosure herein provides a technology capable of solving or at least mitigating such a problem.

A semiconductor device disclosed herein may comprise: a semiconductor element comprising an electrode on a surface of the semiconductor element; and a terminal bonded to the electrode via a bonding material, wherein the electrode may comprise a protrusion portion that protrudes toward the terminal and is in contact with the bonding material.

