BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an electronic component including an electronic substrate and a circuit member, an apparatus and a camera.

Description of the Related Art

An electronic component installed in an imaging apparatus, a display apparatus and the like normally includes: an electronic substrate on which an electronic element is disposed; a circuit member that supplies power to the electronic substrate from an external power supply; and a package member that protects the electronic substrate and the circuit member from moisture and dust.

The electronic substrate includes an element region where the electronic element is formed, and a peripheral region which is created on the outer edge side of the element region. In the peripheral region, an external connection terminal is disposed so as to bond the circuit member, such as a flexible printed circuit (FPC). The package member is disposed so as to enclose at least an element formed surface of the electronic substrate.

In order to decrease the size of an electronic substrate, minimizing the width of the peripheral region on the electronic substrate is demanded. To minimize the width of the peripheral region, the area of the external connection terminal may be decreased, but decreasing the bonding area between the external connection terminal and the circuit member decreases the bonding strength (reliability of the bonding).

In Japanese Patent Application Publication No. 2016-111676, on the other hand, the side face of a package member34(frame) and a circuit member36a(FPC leading portion) are joined by an adhesive member37(reinforcing resin), as illustrated inFIG.6. Thereby an improvement in the reliability of the bonding between the electronic substrate36and the circuit member36a(rigid flexible member) is attempted.

SUMMARY OF THE INVENTION

In the case of Japanese Patent Application Publication No. 2016-111676, however, if a force that pulls the electronic substrate36is applied in a direction vertical to the principal surface of the circuit member36a, a shearing stress is applied to an adhesive member37on the side face of the package member34. As a result, the adhesive member37is peeled off along the side face of the package member34.

Furthermore, a gap51(air hole) is formed between the bonding portion of the electronic substrate36and the circuit member36aand the package member34without disposing the adhesive member37. Therefore, if the circuit member36ais pulled in the vertical direction, the adhesive member37is deformed, and a force to lift the bonding portion in the vertical direction is activated, whereby the circuit member36ais easily peeled off.

With the foregoing in view, it is an object of the present technique to provide an electronic component which allows downsizing the electronic substrate while maintaining the reliability of the bonding between the electronic substrate and the circuit member.

A first aspect of the technology of the present disclosure is:an electronic component comprising:an electronic substrate that includes an electronic element and a first connection terminal;a package member that is disposed on the electronic substrate;a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and the circuit member extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate;a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal;an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; anda light-transmitting member that faces the electronic substrate via a space, whereinthe connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate,the package member encloses the space, the package member has a side face which faces the space, andthe adhesive member covers the side face of the package member.

A second aspect of the technology of the present disclosure is:an electronic component comprising:an electronic substrate that includes an electronic element and a first connection terminal;a package member that is disposed on the electronic substrate;a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate;a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal;an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; andan opposing substrate that faces the electronic substrate, whereinthe connecting member, the circuit member and the adhesive member are located between the package member and the electronic substrate;the opposing substrate and the electronic substrate are bonded together by a bonding member; andthe opposing substrate and the circuit member are joined together by the adhesive member.

Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.

