TECHNICAL FIELD

The present disclosure relates to high speed signal communications implemented in a printed circuit board for electronic devices.

BACKGROUND

High speed digital communications, error correction techniques, coding methods, and the copper medium they travel through has finally reached a limit. In particular, at speeds up to 112 Gbps, it may be difficult for such high speed signals to effectively travel for run lengths more than 2 inches, making conventional copper based signal traces impractical and forcing the migration to fiber. It is desirable to provide enhanced copper based signal traces having sufficient conductivity to support high speed communication signals.

