BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an object, a method, or a manufacturing method. In addition, the present invention relates to a process, a machine, manufacture, or a composition of matter. One embodiment of the present invention relates to a semiconductor device, a light-emitting device, a display device, an electronic device, a lighting device, and a manufacturing method thereof. In particular, one embodiment of the present invention relates to a light-emitting device utilizing organic electroluminescence (EL), and a method for manufacturing the light-emitting device.

2. Description of the Related Art

Recent light-emitting devices and display devices are expected to be applied to a variety of uses and become diversified.

For example, light-emitting devices and display devices for mobile devices and the like are required to be thin, lightweight, and unlikely to be broken.

Light-emitting elements utilizing EL (also referred to as EL elements) have features such as ease of thinning and lightening, high-speed response to input signal, and driving with a direct-current low voltage source; therefore, application of the light-emitting elements to light-emitting devices and display devices has been suggested.

For example, Patent Document 1 discloses a flexible active matrix light-emitting device in which an organic EL element and a transistor serving as a switching element are provided over a film substrate.

However, an organic EL element has a problem in that entry of impurities such as moisture or oxygen from the outside erodes the reliability.

In addition, when impurities such as moisture or oxygen enter an organic compound or a metal material contained in an organic EL element from the outside of the organic EL element, the lifetime of the organic EL element is significantly shortened in some cases. This is because an organic compound or a metal material contained in the organic EL element reacts with the impurities such as moisture or oxygen and thus deteriorates.

Thus, a technique to seal an organic EL element for preventing entry of impurities has been researched and developed.

REFERENCE

[Patent Document]

[Patent Document 1] Japanese Published Patent Application No. 2003-174153

SUMMARY OF THE INVENTION

An object of one embodiment of the present invention is to provide a highly reliable flexible device such as a light-emitting device, a display device, an electronic device, or a lighting device.

An object of one embodiment of the present invention is to improve the yield of a manufacturing process of a highly reliable flexible light-emitting device. An object of one embodiment of the present invention is to prevent entry of impurities in the manufacturing process of the light-emitting device.

An object of one embodiment of the present invention is to provide a novel device such as a light-emitting device, a display device, an electronic device, or a lighting device. An object of one embodiment of the present invention is to provide a light device such as a light-emitting device, a display device, an electronic device, or a lighting device. An object of one embodiment of the present invention is to provide a device that is less likely to be broken, such as a light-emitting device, a display device, an electronic device, or a lighting device. An object of one embodiment of the present invention is to provide a thin device such as a light-emitting device, a display device, an electronic device, or a lighting device.

Note that the descriptions of these objects do not disturb the existence of other objects. In one embodiment of the present invention, there is no need to achieve all the objects. Other objects will be apparent from the description of the specification, the drawings, the claims, and the like and other objects can be derived from the description of the specification, the drawings, the claims, and the like.

A light-emitting device of one embodiment of the present invention includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer, and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

A light-emitting device of one embodiment of the present invention includes a first flexible substrate, a second flexible substrate, a transistor between the first flexible substrate and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, an adhesive layer between the first flexible substrate and the transistor, a first bonding layer, and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

A light-emitting device of one embodiment of the present invention includes a first flexible substrate, a second flexible substrate, an insulating layer having a high gas barrier property between the first flexible substrate and the second flexible substrate, a light-emitting element between the insulating layer and the second flexible substrate, an adhesive layer between the first flexible substrate and the insulating layer, a first bonding layer, and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

A light-emitting device of one embodiment of the present invention includes a first flexible substrate, a second flexible substrate, a first insulating layer having a high gas barrier property between the first flexible substrate and the second flexible substrate, a transistor between the first insulating layer and the second flexible substrate, a light-emitting element between the transistor and the second flexible substrate, a coloring layer between the light-emitting element and the second flexible substrate, a second insulating layer having a high gas barrier property between the coloring layer and the second flexible substrate, a first adhesive layer between the first flexible substrate and the first insulating layer, a first bonding layer, a second bonding layer in a frame shape surrounding the first bonding layer, and a second adhesive layer between the second insulating layer and the second flexible substrate. The first bonding layer and the second bonding layer are between the coloring layer and the light-emitting element. The light-emitting element includes a layer containing a light-emitting organic compound between a pair of electrodes. The first bonding layer, the coloring layer, the second insulating layer, the second adhesive layer, and the second flexible substrate transmit light emitted from the light-emitting element. The second bonding layer has a higher gas barrier property than the first bonding layer.

An electronic device including the light-emitting device with the above structure in a display portion is also one embodiment of the present invention.

A lighting device including the light-emitting device with the above structure in a light-emitting portion is also one embodiment of the present invention.

Note that the light-emitting device in this specification includes, in its category, a display device using a light-emitting element. Furthermore, the category of the light-emitting device in this specification includes a module in which a light-emitting element is provided with a connector such as an anisotropic conductive film or a TCP (tape carrier package); a module having a TCP at the tip of which a printed wiring board is provided; and a module in which an IC (integrated circuit) is directly mounted on a light-emitting element by a COG (chip on glass) method. The light-emitting device also includes the one used in lighting equipment and the like.

One embodiment of the present invention can provide a novel device such as a light-emitting device, a display device, an electronic device, or a lighting device. One embodiment of the present invention can provide a highly reliable flexible device such as a light-emitting device, a display device, an electronic device, or a lighting device.

One embodiment of the present invention can improve the yield of a manufacturing process of a highly reliable flexible light-emitting device. One embodiment of the present invention can prevent entry of impurities in the manufacturing process of the light-emitting device.

Note that the descriptions of these effects do not disturb the existence of other effects. In one embodiment of the present invention, there is no need to have all the effects. Other effects will be apparent from the description of the specification, the drawings, the claims, and the like and other effects can be derived from the description of the specification, the drawings, the claims, and the like.

