CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2020-160230, filed Sep. 24, 2020, the entire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor module.

BACKGROUND

In a power semiconductor module of the related art, a semiconductor device is mounted, via a solder, on a ceramic board with, for example, copper foils attached onto front and rear surfaces. The power semiconductor module is capable of dissipating heat from the ceramic board. Releasing more heat emitted from the semiconductor device improves reliability of the power semiconductor module.

