BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a method of manufacturing an electronic module, a method of manufacturing an optical module, an electronic module, an optical module, and a device.

Description of the Related Art

An electronic module used in an image capturing apparatus, a display apparatus, or the like generally includes an electronic device including an element substrate on which electronic elements and the like are formed and a substrate which faces the element substrate and is used to protect the element substrate, and a package member for containing the electronic device.

Japanese Patent Laid-Open No. 2001-83901 discloses that a display panel which is formed by bonding a pair of panel materials together is mounted onto a spacer portion which forms a holding frame. By causing only the panel material, which is in contact with the spacer portion, to be in contact with a holding wall of the holding frame, the generation of a foreign object due to scraping of the holding wall is suppressed.

In image capturing apparatuses and display apparatuses, an electronic module may need to be installed with high accuracy respect to the housing. To install the electronic module with high accuracy, an electronic device needs to be installed accurately with respect to the package member in which the electronic module is to be contained.

SUMMARY OF THE INVENTION

The present invention has been made in consideration of the above situation, and provides an advantageous technique to install accurately the electronic device to the package member.

According to an aspect of the invention, the present invention provides a method of manufacturing an electronic module that comprises preparing an electronic device in which a first substrate and a second substrate have been joined and coupling the electronic device to a package member, wherein the first substrate includes a front surface on a side of the second substrate, a back surface on an opposite side of the front surface, and a first side surface between an edge portion of the front surface and an edge portion of the back surface, the second substrate includes a first main surface on a side of the first substrate, a second main surface on an opposite side of the first main surface, and a second side surface between an edge portion of the first main surface and an edge portion of the second main surface, the package member includes a first portion that includes an opening and a second portion that is arranged at a position which does not overlap the opening, and the coupling includes bringing the first side surface into contact with the second portion in a state in which the second substrate is positioned between the first portion and the first substrate, and fixing the package member and the electronic device in a state in which the first side surface is in contact with the second portion.

Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings).

