BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a chip component comprising an LC circuit.

Description of the Prior Art

Patent document 1 discloses an electronic component, which includes an insulating layer, a coil formed in the insulating layer, and a capacitor formed in the insulating layer, wherein the coil and the capacitor form an LC circuit.

PRIOR ART DOCUMENT

[Patent Publication]

[Patent document 1] Japan Patent Publication No. 2016-201517

SUMMARY OF THE INVENTION

Problems to be Solved by the Invention

A chip component that achieves outstanding LC characteristics is provided according to an embodiment of the present invention.

Technical Means for Solving the Problem

A chip component is provided according to an embodiment of the present invention. The chip component includes: a substrate; an inorganic insulating layer, formed on the substrate; an organic insulating layer, formed on the inorganic insulating layer; and an LC circuit, including a capacitor formed in the inorganic insulating layer, and an inductor formed, in a manner of being electrically connected to the capacitor, in the organic insulating layer. The chip component is capable of achieving outstanding LC characteristics.

A chip component is provided according to an embodiment of the present invention. The chip component includes: a substrate; an inorganic insulating layer, formed on the substrate; an organic insulating layer, formed on the inorganic insulating layer; a capacitor, including a lower electrode disposed in the inorganic insulating layer, and an upper electrode disposed in the inorganic insulating layer by facing the lower electrode with a portion of the inorganic insulating layer spaced in between; and an inductor, including a spiral coil conductor disposed in the organic insulating layer, the inductor and the capacitor forming an LC circuit. The chip component is capable of achieving outstanding LC characteristics.

