BACKGROUND

1. Technical Field

The present disclosure relates to a semiconductor packaging process, and more particularly, to an electronic package with a shielding structure.

2. Description of Related Art

With the rapid growths in the electronic industry, high integration (e.g., compact, light, thin, etc.) is one of the goals for many high-end electronic products. The advancements in packaging technology have brought about a myriad of chip packaging techniques as well as semiconductor packages with ever smaller sizes or volumes to meet the goals of compact, thin, light semiconductor packages.

In order to satisfy these goals, packages are disposed more densely on the electronic products. However, this may lead to electromagnetic interference (EMI) between the packages.

In order to address the EMI issue between the various electronic packages, an outer shield is usually disposed during the packaging process of a package to avoid the EMI between various packages.

As shown inFIG.1, a conventional semiconductor package1includes at least one semiconductor component11,11′ disposed on a package substrate10. The semiconductor components11,11′ are then encapsulated by an encapsulant13. Thereafter, a shield12is bonded onto the package substrate10via a conductive adhesive120, so that the semiconductor components11,11′ can be covered by the shield12.

However, in the conventional semiconductor package1, the adhesiveness of the conductive adhesive120may be degraded due to temperature, humidity or other environmental factors, and the shield12may easily peel off or fall off from the package substrate10.

Furthermore, when the shield12is secured on the encapsulant13, the size and shape of the shield12has to conform with the size and shape of the encapsulant13with high accuracy. As a result, there needs to be a certain level of accuracy in the relative positions of the shield12and the encapsulant13during the manufacturing process. This leads to higher cost and longer manufacturing time.

In addition, since the sizes and the shapes of the shield12and the encapsulant13have to match, if semiconductor components11,11′ of different sizes and shapes are present, then a new shield of a different size and shape may be needed. In this case, a new mold needs to be made to produce an encapsulant13of a different size and shape, thus increasing manufacturing cost and time.

Therefore, there is a need for a solution that addresses the aforementioned issues in the prior art.

SUMMARY

In view of the aforementioned shortcomings of the prior art, the present disclosure provides an electronic package, which may comprise: a carrier; an electronic component disposed on the carrier; and a shielding structure including a plurality of bonding wire portions, each of the bonding wire portions being provided on the carrier by continuous wire bonding, wherein the bonding wire portion has an arc line shape and is defined with a first line segment, a second line segment and a curved segment connected with the first and second line segments.

In the aforementioned electronic package, a length of the first line segment and a length of the second line segment are not equal.

In the aforementioned electronic package, the bonding wire portion is a single line segment.

In the aforementioned electronic package, the shielding structure forms a closed loop.

The aforementioned electronic package may further include a packaging layer encapsulating the electronic component and the shielding structure. For example, the shielding structure is partially exposed from the packaging layer. The aforementioned electronic package may further include a shielding layer formed on the packaging layer. Furthermore, the shielding layer is electrically connected with the carrier. The shielding layer is in contact with the shielding structure. Alternatively, the shielding layer is not in contact with the shielding structure.

In the aforementioned electronic package, all of the plurality of bonding wire portions are continuously wire bonded to integrally form the shielding structure.

In the aforementioned electronic package, the wire bonding between two adjacent ones of the plurality of bonding wire portions is interrupted to form a plurality of discontinuous segments of the shielding structure.

The present disclosure further provides an electronic package, which may include: a carrier; an electronic component disposed on the carrier; and a shielding structure including a plurality of bonding wire portions, each of the bonding wire portions being provided on the carrier by continuous wire bonding, wherein the bonding wire portion has a first bonding wire and a second bonding wire, the first bonding wire is in an arc line shape and one end of the first bonding wire is disposed correspondingly with the second bonding wire, and the second bonding wire is a single line segment and disposed on the carrier.

In the aforementioned electronic package, a height of the first bonding wire relative to the carrier is lower than a height of the second bonding wire relative to the carrier.

In the aforementioned electronic package, the first bonding wire is defined with a first line segment, a second line segment and a curved segment connected with the first and second line segments.

In the aforementioned electronic package, the second bonding wire has one end bonded to a location to which the first bonding wire is connected.

The aforementioned electronic package may further include a packaging layer encapsulating the electronic component and the shielding structure. For example, the shielding structure is partially exposed from the packaging layer. The aforementioned electronic package may further include a shielding layer formed on the packaging layer. Furthermore, the shielding layer is electrically connected with the carrier. The shielding layer is in contact with the shielding structure. Alternatively, the shielding layer is not in contact with the shielding structure.

As can be seen from the above, the electronic package of the present disclosure employs the bonding wire portions bonded on the carrier as the shielding structure to prevent the influences of temperature, humidity and other environmental factors. Thus, compared to the prior art, the electronic package of the present disclosure effectively prevents the shielding structure from peeling off or falling off from the carrier.

