FIELD OF THE DISCLOSURE

Embodiments of the present invention relate generally to data centers. More particularly, embodiments of the invention relate to holistic optimal performance control for liquid cooled electronic racks in data centers.

BACKGROUND

Thermal management of high power density chips and processors are critical problems, especially with the increasing of power density of high end chips, such as CPUs (central processing units) and GPUs (general-purpose processing units). Cooling devices are utilized in cooling system designs are used for maintaining the thermal conditions of the chips by removing the heat generated by the chips. If the temperature exceeds the limitation of the thermal specification, the chips may not function properly and throttling may happen. In addition, by providing proper or better thermal conditions for the chip when it is working, better performance or less power consumption can be achieved.

High performance machine learning computing is enabled by high power density processors, such as data center GPUs. The conventional air-cooling solution is struggling to handle the thermal management challenge in such GPU racks. Instead, cold plate liquid cooling solution provides much better cooling performance and saves energy consumption in cooling infrastructure.

