RELATED APPLICATIONS

The present application is a 35 U.S.C. 371 national stage application of PCT International Application No. PCT/CN2019/102797, filed on Aug. 27, 2019, which claims the benefit of Chinese Patent Application No. 201811141088.3, filed on Sep. 28, 2018, the entire disclosures of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, and particularly to a method and device for modifying a film deposition position in a film deposition process with a mask component.

BACKGROUND

Currently, a Fine Metal Mask (FMM) is usually used, a light emitting material passes through opening regions of FMM and sticks on a substrate on which a Thin Film Transistor (TFT) has been formed, so as to form an Organic Light Emitting Diode (OLED) display panel.

With the continuously increase of the Pixels Per Inch (PPI, pixel density) of an OLED display panel, the requirements for the fabrication accuracy of FMM, stretching accuracy and evaporation accuracy of the light emitting material accordingly increase. In case of low accuracy or poor process stability, various defects occur.

SUMMARY

Embodiments of the present disclosure provide a method for modifying a film deposition position in a film deposition process with a mask component, wherein the mask component comprises a mask frame and a mask body fixed to the mask frame, the method comprising: obtaining a first offset displacement between a plurality of second mark points on the mask component and a plurality of first mark points on the mask body; obtaining a second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component, wherein the plurality of third mark points are formed by the plurality of second mark points on the substrate when a film is evaporated on the substrate with the mask component; determining an actual offset displacement between an actual forming position and a preset forming position of the film, according to the first offset displacement and the second offset displacement; and modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film.

In some embodiments, the step of obtaining the first offset displacement between the plurality of second mark points on the mask component and the plurality of first mark points on the mask body comprises: obtaining first coordinates of the plurality of first mark points on the mask body; measuring second coordinates of the plurality of second mark points on the mask component; and subtracting the first coordinates from the second coordinates, to obtain the first offset displacement between the plurality of second mark points on the mask component and the plurality of first mark points on mask body.

In some embodiments, the step of obtaining the second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component comprises: measuring third coordinates of the plurality of third mark points on the substrate; and subtracting the second coordinates from the third coordinates, to obtain the second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component.

In some embodiments, the step of determining the actual offset displacement between the actual forming position and the preset forming position of the film, according to the first offset displacement and the second offset displacement, comprises: adding the first offset displacement to the second offset displacement, to obtain an actual offset displacement of the plurality of third mark points; as for a first target mark point and a second target mark point of the plurality of third mark points, dividing a difference value between the actual offset displacement of the second target mark point and the first target mark point by a number of actual forming positions of the film between the first target mark point and the second target mark point to obtain a first ratio; and as for the Mth actual forming position of the film between the first target mark point and the second target mark point, adding a product of M and the first ratio to actual offset displacement of the first target mark point, to obtain the Mth actual offset displacement between the actual forming position and the preset forming position of the film, M being a positive integer larger than 0.

In some embodiments, the step of modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film, comprises: when the actual offset displacement between the actual forming position and the preset forming, position of the film lies in a compensable range, modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film; and when the actual offset displacement between the actual forming position and the preset forming position of the film does not lie in the compensable range, and the difference value from the maximum compensation displacement corresponding to the compensable range meets a threshold, modifying the preset forming position of the film, according to the maximum compensation displacement.

In some embodiments, the step of modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film, comprises: determining an offset displacement of the pixel definition layer, according to the actual offset displacement between the actual forming position and the preset forming position of the film; wherein the actual offset displacement between the actual forming position and the preset forming position of the film have a same corresponding distance and a same direction as the offset displacement of the pixel definition layer; and the step of modifying the preset forming position of the film according to the maximum compensation displacement comprises: determining the offset displacement of the pixel definition layer, according to the maximum compensation displacement, wherein the maximum compensation displacement have a same corresponding distance and a same direction as the offset displacement of the pixel definition layer.

In some embodiments, the step of modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film, comprises: determining an offset displacement of corresponding opening regions on the mask component, according to the actual offset displacement between the actual forming position and the preset forming position of the film; wherein the actual offset displacement between the actual forming position and the preset forming position of the film and the offset displacement of corresponding opening regions on the mask component have a same corresponding distance but opposite direction; and the step of modifying the preset forming position of the film according to the maximum compensation displacement comprises: determining the offset displacement of corresponding opening regions on the mask component according to the maximum compensation displacement, wherein the maximum compensation displacement and the offset displacement of corresponding opening regions on the mask component have a same corresponding distance but opposite direction.

Embodiments of the present disclosure further provide a device for modifying film deposition position in a film deposition process with a mask component, wherein the mask component comprises a mask frame and a mask body fixed to the mask frame, the device comprising: a first offset displacement obtainer, configured to obtain a first offset displacement between a plurality of second mark points on the mask component and a plurality of first mark points on the mask body; a second offset displacement obtainer, configured to obtain a second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component, wherein the plurality of third mark points are formed on the substrate by the plurality of second mark points when a film is evaporated on the substrate with the mask component; an actual offset displacement determiner, configured to determine an actual offset displacement between the actual forming position and the preset forming position of the film, according to the first offset displacement and the second offset displacement; and a forming position modifier, configured to modify the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film.

In some embodiments, the first offset displacement obtainer comprises: a first coordinate sub-obtainer, configured to obtain first coordinates of the plurality of first mark points on the mask body; a second coordinate sub-measurer, configured to measure second coordinates of the plurality of second mark points on the mask component; and a first offset displacement sub-calculator, configured to subtract the first coordinates from the second coordinates, to obtain the first offset displacement between the plurality of second mark points on the mask component and the plurality of first mark points on mask body.

In some embodiments, the second offset displacement obtainer comprises: a third coordinate sub-measurer, configured to measure third coordinates of the plurality of third mark points on the substrate; and a second offset displacement sub-calculator, configured to subtract the second coordinates from the third coordinates, to obtain the second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component.

In some embodiments, the actual offset displacement determiner comprises: a first actual offset displacement sub-calculator, configured to add the first offset displacement to the second offset displacement, to obtain an actual offset displacement of the plurality of third mark points; a first ratio sub-calculator, configured to, as for a first target mark point and a second target mark point of the plurality of third mark points, divide a difference value between the actual offset displacement of the second target mark point and the first target mark point by a number of actual forming positions of the film between the first target mark point and the second target mark point to obtain a first ratio; and a second actual offset displacement sub-calculator, configured to, as for the Mth actual forming position of the film between the first target mark point and the second target mark point, add a product of M and the first ratio to actual offset displacement of the first target mark point, to obtain the Mth actual offset displacement between the actual forming position and the preset forming position of the film, M being a positive integer larger than 0.

In some embodiments, the forming position modifier comprises: a first forming position sub-modifier, configured to, when the actual offset displacement between the actual forming position and the preset forming position of the film lies in a compensable range, modify the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film; and a second forming position sub-modifier, configured to, when the actual offset displacement between the actual forming position and the preset forming position of the film does not lie in the compensable range, and the difference value from the maximum compensation displacement corresponding to the compensable range meets a threshold, modify the preset forming position of the film, according to the maximum compensation displacement.

In some embodiments, the first forming position sub-modifier comprises: a first offset displacement determiner, configured to determine an offset displacement of the pixel definition layer, according to the actual offset displacement between the actual forming position and the preset forming position of the film; wherein the actual offset displacement between the actual forming position and the preset forming position of the film have a same corresponding distance and a same direction as the offset displacement of the pixel definition layer; and the second forming position sub-modifier comprises: a second offset displacement determiner, configured to determine the offset displacement of the pixel definition layer, according to the maximum compensation displacement; wherein the maximum compensation displacement have a same corresponding distance and a same direction as the offset displacement of the pixel definition layer.

In some embodiments, the first forming position sub-modifier comprises: a third offset displacement determiner, configured to determine an offset displacement of corresponding opening regions on the mask component, according to the actual offset displacement between the actual forming position and the preset forming position of the film; wherein the actual offset displacement between the actual forming position and the preset forming position of the film and the offset displacement of corresponding opening regions on the mask component have a same corresponding distance but opposite direction; and the second forming position sub-modifier comprises: a fourth offset displacement determiner, configured to determine the offset displacement of corresponding opening regions on the mask component according to the maximum compensation displacement; wherein the maximum compensation displacement and the offset displacement of corresponding opening regions on the mask component have a same corresponding distance but opposite direction.

