CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean Patent Application No. 10-2017-0067570, filed in the Korean Intellectual Property Office on May 31, 2017, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

Embodiments of the invention relate to a solar cell module, and, more particularly, to a solar cell module having an improved structure.

Description of the Related Art

Recently, as energy resources such as oil and coal are expected to be depleted, interest in alternative energy to replace them is increasing. Among them, solar cells are attracting attention as a next generation battery which converts solar energy into electric energy. Since a solar cell is exposed to an external environment for a long time, it is manufactured in a form of a solar cell module by a packaging process for protecting the solar cell.

A solar cell module includes a solar cell panel including a solar cell, and a wiring box having members, circuits, and the like connected to the solar cell panel. Conventionally, in consideration of a sealing property and structural stability, the wiring box is entirely fixed or adhered to the solar cell panel so that a path through which air flows is not provided between the solar cell panel and the wiring box. According to this, since heat generated by the wiring box is not smoothly discharged during an operation of the solar cell panel, the heat may be concentrated in a portion where the wiring box is positioned. Thus, output and efficiency of the solar cell module may be lowered due to a temperature increase. In order to prevent this, a structure in which a wiring box is separated from a solar cell panel by using a separate structural member has been suggested. However, due to the separate structural member, a process may be complicated, a cost may be increased, and fixing stability of the wiring box may be deteriorated. Alternatively, a structure has been proposed in which a recess portion, a protruding portion, or the like is formed at a mounting surface of a wiring box to separate a part of the wiring box from a solar cell panel. Such a recess portion, a protruding portion, or the like may undesirably affect members, circuits, and the like provided in the wiring box, and heat radiation effect may be not excellent because a part of the wiring box is still in contact with the solar cell panel.

SUMMARY OF THE INVENTION

Therefore, embodiments of the invention have been made in view of the above problems, and embodiments of the invention are to provide a solar cell module having improved output and reliability by enhancing heat radiation effect.

A solar cell module according to an embodiment of the invention includes a solar cell panel; a wiring enclosure electrically connected to the solar cell panel and mounted on or at a back surface of the solar cell panel; and an adhesive member disposed between the wiring enclosure and the solar cell panel to attach the wiring enclosure and the solar cell panel. An air gap opened to an outside and having a thickness corresponding to a thickness of the adhesive member is provided between the solar cell panel and the wiring enclosure by the adhesive member.

According to an embodiment, convection cooling is performed between a solar cell panel and a wiring enclosure using an air gap opened to an outside when a solar cell module is operated. Thus, temperature at a portion where the wiring enclosure is positioned can be prevented from increasing. Accordingly, output and efficiency of the solar cell module can be prevented from being lowered due to heat generated by the wiring enclosure, and thus, output and reliability of the solar cell module can be improved. In this instance, the air gap opened to the outside can be formed by a simple structure using an adhesive member for attaching the wiring enclosure. Thus, compared with the conventional case of using a separate structure or forming a recess portion, a protruding portion, or the like at a wiring enclosure, design freedom and stability can be improved, a manufacturing process can be simplified, and a manufacturing cost can be reduced.

