BACKGROUND

1. Technical Field

The present disclosure relates to a package substrate and manufacturing method thereof, and more particularly, to a package substrate with thin thickness and sufficient structural strength and manufacturing method thereof.

2. Description of the Related Art

As compact size and high performance have become typical requirements of consumer electronic and communication products, semiconductor device packages are expected to possess superior electrical properties, thin overall thickness and a large number of I/O ports. In order to provide sufficient structural strength for supporting semiconductor dies and electronic components formed thereon, the package substrate needs to be thick enough. Normally, the thickness of the package substrate needs to exceed 100 micrometers to provide sufficient structural strength. The thick thickness of the package substrate, however, increases the overall thickness of the semiconductor device package.

It is therefore desirable to develop a package substrate with thin thickness but sufficient structural strength to meet the compactness requirement of consumer electronic and communication products.

SUMMARY

One aspect of the present disclosure relates to a package substrate. In some embodiments, the package substrate includes a circuit layer, an optically-cured dielectric layer, a plurality of block layers and a sacrificial layer. The circuit layer includes a plurality of conductive pads. The optically-cured dielectric layer has an upper surface and a lower surface opposite to the upper surface. The optically-cured dielectric layer covers the circuit layer, and first surfaces of the conductive pads are at least partially exposed from the upper surface of the optically-cured dielectric layer. The block layers are respectively disposed on the first surfaces of the conductive pads exposed by the optically-cured dielectric layer. The sacrificial layer is disposed on the optically-cured dielectric layer and covering the block layers.

Another aspect of the present disclosure relates to a method of manufacturing a package substrate. In some embodiments, the method includes the following operations. A circuit layer including a plurality of conductive pads is formed. An optically-sensitive material is formed to cover the conductive pads. The optically-sensitive material is optically cured to form an optically-cured dielectric layer having a plurality of openings partially exposing first surfaces of the conductive pads. A plurality of block layers is formed in the openings on the first surfaces of the conductive pads. A sacrificial layer is formed on the optically-cured dielectric layer and on the block layers.

Another aspect of the present disclosure relates to a method of manufacturing a semiconductor device package. In some embodiments, the method includes the following operations. The above mentioned package substrate is provided. A die is disposed on the optically-cured dielectric layer and the die is electrically connected to the conductive pads. A molding layer is formed on the optically-cured dielectric layer to encapsulate the die. The sacrificial layer is removed from the optically-cured dielectric layer and the block layers. A plurality of electrical conductors is formed on the block layers

