CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No. 2018-223920, filed on Nov. 29, 2018, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a substrate processing apparatus.

BACKGROUND

Japanese Patent Application Publication No. 2008-244274 discloses a technique in which an annular peripheral dielectric member having an electrostatic capacitance per unit area larger than that of a dielectric member disposed at a lower part of an electrostatic chuck is disposed under a focus ring to make it relatively difficult for high frequencies to pass through the peripheral dielectric and the focus ring.

SUMMARY

The present disclosure provides a technique capable of driving a consumable part with a simple configuration.

In accordance with an aspect of the present disclosure, there is provided a substrate processing apparatus including: a processing chamber in which a target substrate is disposed and substrate processing is performed on the target substrate; a consumable part disposed in the processing chamber and consumed by the substrate processing; a supply unit configured to supply an ionic liquid in response to a consumption of the consumable part; and a drive unit configured to drive the consumable part by using the ionic liquid supplied from the supply unit.

