FIELD OF THE INVENTION

Embodiments of the present disclosure relate generally to airflow management in a data center. More particularly, embodiments of the disclosure relate to cooling systems and methods of designing and configuring cooling systems for a data center.

BACKGROUND

With the booming of AI applications, high performance computing, cloud computing and data-driven applications, data centers as well as the compute and storage infrastructures have becoming increasingly critical for a company to maintain its competitive edges. Maintaining a data center is expensive and part of the expenses is related to cooling the data center.

A data center may keep growing in size, and serving and maintaining cooling systems in the data center may become expensive. In some data centers, all the cooling hardware units are integrated as an inseparable unit. If a particular component becomes defective, the whole cooling system may need to be replaced or redesigned, which greatly increases the service and maintenance cost of the data center. In addition, as more efficient cooling hardware becomes available, it would be hard to plug in the new hardware into the existing cooling system. Therefore, designing a cooling solution and an IT enclosure in a combined manner may benefit the modern IT cluster and hardware.

