CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan Patent Application No. 109113133, filed on Apr. 20, 2020. The entire content of the above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a probe card, and more particularly to a split thin-film probe card and an elastic module thereof.

BACKGROUND OF THE DISCLOSURE

When conductive protrusions of a conventional thin-film probe card are used to abut against a device under test (DUT) to perform testing thereof, the conductive protrusions are likely to be in a linkage relationship (e.g., a two-dimensional linkage), so that the conductive protrusions would be acted upon by a non-uniform force. Moreover, the conductive protrusions of the conventional thin-film probe card need to be coplanar with each other, so that a distribution range (or a test region) of the conductive protrusions in the conventional thin-film probe card cannot be too large, which limits the development of the thin-film probe card.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the present disclosure provides a split thin-film probe card and an elastic module thereof to effectively improve on the issues associated with conventional thin-film probe cards.

In one aspect, the present disclosure provides a split thin-film probe card, which includes a supporting member, an elastic cushion disposed on the supporting member, and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet defines an outer region, an inner region spaced apart from the outer region along a height direction, and an extension region that is connected to the outer region and the inner region. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions. The carrier has a portion arranged in the inner region, and the portion of the carrier has a plurality of grooves so as to divide the portion of the carrier into a plurality of action segments respectively disposed on the independent elastic segments. Moreover, portions of the signal circuits arranged in the inner region are respectively disposed on the action segments. The conductive protrusions are arranged in the inner region and are respectively formed on the signal circuits. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

In another aspect, the present disclosure provides an elastic module of a split thin-film probe card, which includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet defines an outer region, an inner region spaced apart from the outer region along a height direction, and an extension region that is connected to the outer region and the inner region. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions. The carrier has a portion arranged in the inner region, and the portion of the carrier has a plurality of grooves so as to divide the portion of the carrier into a plurality of action segments respectively disposed on the independent elastic segments. Moreover, portions of the signal circuits arranged in the inner region are respectively disposed on the action segments. The conductive protrusions are arranged in the inner region and are respectively formed on the signal circuits. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Therefore, in the split thin-film probe card and the elastic module of the present disclosure, by virtue of “when any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment,” a movement linkage of the conductive protrusions of the split thin-film probe card (or the elastic module) can be reduced. Accordingly, the conductive protrusions can be acted upon with a more uniform force, and can firmly abut against metal pads of a DUT. Specifically, the test region (or the distribution range of the conductive protrusions) of the split thin-film probe card can be widened.

These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.

