BACKGROUND

Current electronics systems are creating thermal loads that exceed the capabilities of thermal dissipation techniques/technologies. For example, in some cases, higher performance requirements are driving localized thermal loads that exceed the capacity to move the heat away from a thermal generation point creating an excess buildup of localized heat that exceeds the performance rating of an electrical device. Once the thermal rating is exceeded the electrical device may no longer operate at anticipated performance levels resulting in loss of product performance, reduced life and possible system failure. Current products are driven by increased performance requirements along with size and weight limitations that are further limiting the ability to control thermal performance. Consequently, there is a need for improved systems/techniques for controlling thermal loads and/or their distribution within an electrical device.

SUMMARY

An electrical device with thermally controlled performance is disclosed. In one or more embodiments, the electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. In embodiments, the electrical device further includes a plurality of signal paths interconnecting the plurality of device components. In embodiments, the electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. In embodiments, the electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by throttling a clock speed of at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by limiting a bandwidth of at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by at least partially disabling at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by reprogramming at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by transferring at least one function from a device component to another device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the controller is configured to adjust the one or more operating parameters for the one or more device components by redirecting at least one signal from a signal path to another signal path based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the electrical device, the plurality of temperature sensors may include thermocouples and/or thermistors.

In some embodiments of the electrical device, one or more of the temperature sensors are printed on the die.

In some embodiments of the electrical device, the electrical device includes a field programmable gate array (FPGA), a system on a chip (SoC), an application-specific integrated circuit (ASIC), a memory device, a central processing unit (CPU), and/or a microcontroller.

A system for thermally controlled performance of at least one electrical device is also disclosed. In one or more embodiments, the system includes a plurality of temperature sensors disposed upon or at least partially embedded within at least one die. The plurality of temperature sensors are configured to detect thermal loads at respective portions of the die. In embodiments, the system further includes at least one controller communicatively coupled to the temperature sensors. The controller is configured to adjust one or more operating parameters for one or more device components disposed upon or at least partially embedded within the die based on the thermal loads detected by the sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by throttling a clock speed of at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by limiting a bandwidth of at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by at least partially disabling at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by reprogramming at least one device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by transferring at least one function from a device component to another device component based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the controller is configured to adjust the one or more operating parameters for the one or more device components by redirecting at least one signal from a signal path to another signal path based on at least one of the thermal loads detected by the temperature sensors.

In some embodiments of the system, the plurality of temperature sensors may include thermocouples and/or thermistors.

In some embodiments of the system, one or more of the temperature sensors are printed on the die.

A method for thermally controlled performance of at least one electrical device is also disclosed. In one or more embodiments of the method, thermal loads are detected at respective portions of at least one die with a plurality of temperature sensors disposed upon or at least partially embedded within the die. One or more operating parameters for one or more device components disposed upon or at least partially embedded within the die are then adjusted based on the thermal loads detected by the plurality of temperature sensors.

This Summary is provided solely as an introduction to subject matter that is fully described in the Detailed Description and Drawings. The Summary should not be considered to describe essential features nor be used to determine the scope of the Claims. Moreover, it is to be understood that both the foregoing Summary and the following Detailed Description are example and explanatory only and are not necessarily restrictive of the subject matter claimed.

