BACKGROUND

1. Field of the Disclosure

The present disclosure relates to semiconductor package structures and methods of manufacturing the same.

2. Description of Related Art

A multi-row QFN structure has been developing for a requirement of more leads. However, half-etching a supporting bar with a greater length may result in deformation and/or break of the supporting bar. Further, the pitch between the supporting bars has been reducing, which may incur short circuit after solders are formed due to a less pitch between the supporting bars. In order to solve aforementioned problems, a new semiconductor package structure is required.

SUMMARY

According to some embodiments of the present disclosure, a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.

According to some embodiments of the present disclosure, a semiconductor package structure includes a die paddle, an encapsulant, a plurality of first terminals and a plurality of second terminals. The encapsulant covers the die paddle. The encapsulant has a lower surface. The plurality of first terminals are disposed on the lower surface of the encapsulant. Each of the plurality of first terminals is aligned to each other along a first direction. The plurality of second terminals are disposed on the lower surface of the encapsulant. Each of the plurality of second terminals is aligned to each other along the first direction. Each of the plurality of first terminals is positioned farther from the die paddle than each of the plurality of second terminals is. The encapsulant includes a first recess and a plurality of second recesses recessed from the lower surface of the encapsulant, the first recess surrounds the die paddle, and each of the second terminals is aligned to one corresponding second recess along a second direction perpendicular to the first direction.

According to some embodiments of the present disclosure, a method of manufacturing a semiconductor package structure includes: providing a lead frame, wherein the lead frame includes a die paddle, a first linking bar, a first supporting bar and a second supporting bar, wherein the first supporting bar and the second supporting bar connect the first linking bar; forming an encapsulant covering the lead frame, wherein a lower surface of the first linking bar and a portion of the second supporting bar are exposed from the encapsulant; and removing the first linking bar and the portion of the second supporting bar such that the first supporting bar is electrically isolated from the second supporting bar.

