CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Chinese Patent Application No. 201910817020.0 filed on Aug. 30, 2019, the content of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method of manufacturing the display panel, and a display apparatus including the display panel.

BACKGROUND

The technologies of manufacturing display panels have advanced with the continuous development of display technologies. On the one hand, however, the display panel has a relatively fragile edge, collisions more frequently occur on the edge, and stress concentration is more likely to occur, and thus cracks may occur at the edge. On the other hand, in a manufacturing process of the display panel, multiple display panels are manufactured simultaneously in one mother panel. Next, the mother panel is cut to form multiple separate display panels after the manufacturing process is finished. At the time of cutting, the current techniques include mechanical cutting and laser cutting. The mechanical cutting, due to the pressure applied by the cutter head on the panel, may result in a cracking of a thin film encapsulation layer from the edge, while the laser cutting method may also lead to cracks due to thermal effect. Thus formed cracks can form paths for water vapor and oxygen penetration from the side edge. In addition, cutting stress also causes certain damage to display layer devices and thin film encapsulation layer.

SUMMARY OF THE INVENTION

In view of the above, the present disclosure provides a display panel having a display area and a non-display area surrounding the display area, the display panel includes a substrate; an array layer located on the substrate, wherein the array layer includes a first inorganic insulating layer, and the first inorganic insulating layer includes a first recess located in the non-display area; a light-emitting function layer located on the array layer; a thin film encapsulation layer located on the light-emitting function layer; and an organic auxiliary layer, the organic auxiliary layer being filled in the first recess. The thin film encapsulation layer includes an inorganic encapsulation layer covering the display area and extending to contact and cover the organic auxiliary layer in the first recess. The at least one inorganic encapsulation layer includes a first opening penetrating through the at least one inorganic encapsulation layer, and the first opening is located on the organic auxiliary layer in the first recess.

The present disclosure also provides a method of manufacturing a display panel having a display area and a non-display area surrounding the display area. The method includes: providing a substrate; manufacturing an array layer on one side of the substrate, wherein said manufacturing the array layer includes manufacturing a first inorganic insulating layer, the first inorganic insulating layer including a first recess in the non-display area; manufacturing a light-emitting function layer on a side of the array layer facing away from the substrate; manufacturing a thin film encapsulation layer on a side of the light-emitting function layer facing away from the substrate; manufacturing an organic auxiliary layer after the first inorganic insulating layer is manufactured, the organic auxiliary layer being filled in the first recess, in which said manufacturing the thin film encapsulation layer includes: manufacturing at least one inorganic encapsulation layer covering the display area and extending to contact and cover the organic auxiliary layer in the at least one first recess; and forming, in the at least one inorganic encapsulation layer, a first opening penetrating through the at least one inorganic encapsulation layer, the first opening is located on the organic auxiliary layer in the first recess.

The present disclosure also provides a display apparatus including the above display panel.

