BACKGROUND OF THE DISCLOSURE

Technical Field

The disclosure relates to an impact resistant structure and an electronic device.

Description of Related Art

After electronic component (for example, flexible electronic component, flexible SiP) is lighted and thinned, its own mechanical strength and hardness are inadequate, and it is easily scratched, worn by an external force to cause damage in manufacture, handling and use, so that component reliability is decreased.

SUMMARY

An embodiment of the disclosure provides an impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film. The support film is disposed between the soft film and the electronic component.

Another embodiment of the disclosure provides an impact resistant structure adapted to an electronic component, where the electronic component has a first surface and a second surface opposite to the first surface. The impact resistant structure includes a damping laminate disposed on the second surface of the electronic component. The damping laminate includes a soft film and a support film. The support film is disposed between the soft film and the electronic component.

Another embodiment of the disclosure provides an electronic device including an electronic component and the aforementioned impact resistant structure disposed on the electronic component.

To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.

