BACKGROUND

Field of the Disclosure

Aspects of the present disclosure relate to wireless communications, and more particularly, to glass ceramic antenna packages having a large bandwidth for high frequency applications.

Description of Related Art

Fifth generation cellular networks, commonly referred to as 5G NR, are expected to include frequencies in the range of 24.25 to 86 GHz, with the lower 19.25 GHz (24.25 to 43.5 GHz) more likely to be used for mobile devices. For ease of reference, the waves in this range will be referred to as mmWaves. The 5G mmWave frequency range for mobile devices is expected to be divided into frequency segments depending on the geographic region for wireless communications. For instance, 5G NR capable mobile devices in Europe may be permitted to use a band of 24.25 GHz to 27.5 GHz, whereas 5G NR capable mobile devices in the United States may be permitted to use bands of 27.5 to 28.35 GHz and 37 to 40 GHz. Currently, each frequency segment is handled by a separate radio frequency integrated circuit (RFIC) and antenna package.

Current packaging strategies used for mmWave applications have several key issues. First, the size of the package is dictated by the antenna size, which is related to the frequency. The antenna size can be much larger than the RFIC. A low temperature co-fired ceramic (LTCC) package has good electrical performance, but is also more expensive relative to other packaging options. For an antenna-on-chip (AOC) package, the antenna is limited to the size of the chip, which can limit performance or increase cost if the chip size is increased to accommodate the antenna. For a fan-out wafer level package (FOWLP), the antenna package is aperture- or proximity-fed which can limit performance, e.g., relative to probe-fed packages. For a package-on-package (POP), the antenna and the chip packages are connected using solder balls. The solder balls used for connecting the packages are isotopic in dimension and thus limit the separation between packages. Additionally, the large solder balls also have large insertion losses (e.g., ˜1 dB).

BRIEF SUMMARY

The systems, methods, and devices of the disclosure each have several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of this disclosure as expressed by the claims which follow, some features will now be discussed briefly. After considering this discussion, and particularly after reading the section entitled “Detailed Description” one will understand how the features of this disclosure provide advantages that include improved glass ceramic antenna packages for mmWave applications, for example.

Certain aspects provide an antenna package. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.

Certain aspects provide a device for wireless communication. The device generally includes an antenna package comprising an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna, and a lead frame adjacent to one or more lateral surfaces of the antenna element. The device also includes a radio frequency integrated circuit (RFIC) package electrically coupled to the shielding elements and the feed lines of the antenna package and comprising an RFIC.

Certain aspects provide a method of wireless communication. The method generally includes applying a first signal to an antenna package and receiving a second signal from the antenna package. The antenna package generally includes an antenna element and a lead frame adjacent to one or more lateral surfaces of the antenna element. The antenna element generally includes a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna.

To the accomplishment of the foregoing and related ends, the one or more aspects comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the appended drawings set forth in detail certain illustrative features of the one or more aspects. These features are indicative, however, of but a few of the various ways in which the principles of various aspects may be employed.

