BACKGROUND

1) Field

Embodiments relate to the field of semiconductor manufacturing and, in particular, to systems and methods for monitoring processing parameters of semiconductor fabrication operations. Embodiments include arrays of micro resonators that are monitored for changes in resonance frequency at various resonance modes.

2) Description of Related Art

The scale of critical dimension (CD) and other feature sizes in many semiconductor devices is continually shrinking. Extensive process development is needed in order to develop reliable processes with high repeatability. Typically, a process is developed by running the process on test substrates. The test substrates are then analyzed with various metrology tools in order to determine the results of the process. For example, cross-sections of the substrate may be analyzed to determine the amount of material removed with an etching process or material added with a deposition process.

The use of such test substrates and post processing metrology has several drawbacks. One drawback is that the cross-sectioning and analysis takes significant time (e.g., days or longer). Additionally, the cross-sectioning requires significant work for each location. As such, only a limited number of cross-sections can be analyzed for each process. Another drawback is that only the end result of the process is able to be analyzed. This limits the information that may be obtained about the process. For example, the rate of change of a process is not determinable from the end result of cross-sections of the test substrate.

SUMMARY

Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.

Additional embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, and a cavity in the circuit layer. In an embodiment, a capping layer is over the circuit layer. In an embodiment, the cavity is sealed by a portion of the capping layer. In an embodiment, the diagnostic substrate further comprises a micro resonator in the cavity. In an embodiment, the micro resonator comprises a resonating body that is mechanically coupled to the portion of the capping layer sealing the cavity and one or more electrodes for inducing resonance in the resonating body.

Additional embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a plurality of sensing regions across the diagnostic substrate. In an embodiment, each sensing region comprises a plurality of cavities formed into the circuit layer, a plurality of electrodes formed in each of the cavities, and a resonating body over or within each of the cavities.

