CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-173456, filed on Sep. 24, 2019; the entire contents of which are incorporated herein by reference.

FIELD

An embodiment relates to a power module.

BACKGROUND

A power module has been developed in which a semiconductor chip for power control is provided in a housing, and electrical power is input and output by connecting terminal plates to the semiconductor chip from outside the housing. In such a power module, the housing is filled with an insulative gel material to maintain the insulated state of the internal circuit, the terminal plates, etc. It is anticipated that the conduction amount of power modules will increase further hereafter, and countermeasures for the heat generation due to the conduction will be challenging.

