TECHNICAL FIELD

The present invention relates to a substrate processing device.

BACKGROUND

In a substrate processing device for performing vacuum processing such as film formation, etching, or the like on a semiconductor wafer (hereinafter, referred to as “wafer”), an atmosphere transfer device includes a plurality of processing chambers to perform the vacuum processing while ensuring a high throughput. Further, in the substrate processing device provided with the processing chambers, the processing chambers are separated from the atmospheric transfer device at the time of maintenance.

For example, Patent Document 1 discloses a multi-chamber system including a plurality of processing modules, each having a load-lock chamber and a processing chamber. In the structure shown in FIG. 9 of Patent Document 1, the processing modules are arranged side by side at opposite sides of a wafer transfer device. Further, in the structure shown in FIG. 5 of Patent Document 1, the processing modules are arranged in two stages in a vertical direction of the wafer transfer device.

PRIOR ART

Patent Document 1: Japanese Patent Application Publication No. 2012-186506, FIGS. 5 and 9

However, when the processing module is separated from the atmosphere transfer device at the time of maintenance, particles flow into the atmosphere transfer device from a connection portion between the processing module and the atmosphere transfer device, so that a wafer to be transferred to another processing chamber through the atmosphere transfer device or the processing module where the wafer from the atmosphere transfer device will be processed may be contaminated. Further, it is required to stop the operation of the substrate processing device even when maintenance of merely some of the processing modules is being performed.

In view of the above, the present invention provides a substrate processing device capable of preventing the inflow of particles into the device at the time of maintenance of the processing module and continuing the operation of the substrate processing device even during the maintenance of the processing module.

SUMMARY

In accordance with an aspect of the present invention, there is provided a substrate processing device including: a transfer chamber configured to transfer a substrate under an atmospheric atmosphere; and a plurality of processing units each including at least one processing chamber for processing the substrate under a vacuum atmosphere and at least one load-lock chamber connected to the processing chamber to switch an inner atmosphere thereof between the atmospheric atmosphere and the vacuum atmosphere. Further, the transfer chamber has a connection unit configured to connect the transfer chamber and the load-lock chamber, and each of the processing units is detachably attached to the transfer chamber by the connection unit. The connection unit includes an opening that allows the transfer chamber to communicate with the load-lock chamber, and an opening/closing mechanism configured to open and close the opening.

In accordance with the aspect of the present invention, it is possible to provide the substrate processing device that is capable of preventing the inflow of particles into the device at the time of maintenance of the processing unit and continuing the operation of the substrate processing device while maintenance of the processing unit is being performed.

