This application claims priority to Korean Patent Application No. 10-2019-0075571, filed on Jun. 25, 2019, and all the benefits accruing therefrom under 35 U.S.C § 119, the content of which in its entirety is herein incorporated by reference.

BACKGROUND

1. Field

Embodiments of the invention relate to a display apparatus, and more particularly, to a display apparatus with improved reliability.

2. Description of the Related Art

A display apparatus may have a structure in which a circuit board is connected to a display panel after its fabrication. In such a display apparatus, for example, a tape automated bonding (“TAB”) scheme, which uses an anisotropic conductive film (“ACF”), may be used to bond the circuit board to the display panel.

SUMMARY

An exemplary embodiment of the invention provides a display apparatus that prevents defects in a circuit board from occurring when an anisotropic conductive film is bonded.

According to an exemplary embodiment of the invention, a display apparatus includes: a display panel including a plurality of first display pads arranged in a first direction and a plurality of second display pads arranged in the first direction, where the second display pads is spaced apart in a second direction from the first display pads, and the second direction intersects the first direction; a main circuit board; a first flexible circuit board which connects the main circuit board to the first display pads; a second flexible circuit board which connects the main circuit board to the second display pads and overlaps at least a portion of the first flexible circuit board; a plurality of heat radiation members on the first flexible circuit board and the second flexible circuit board; and a deformation prevention member spaced apart from the heat radiation members and disposed on at least one of the first flexible circuit board and the second flexible circuit board, where the deformation prevention member includes a metal.

In an exemplary embodiment, the first flexible circuit board may include a first top surface, a first bottom surface opposite to the first top surface, a plurality of first board pads exposed from the first bottom surface and connected to the first display pads and the main circuit board, and a first driver chip on the first bottom surface. In such an embodiment, the second flexible circuit board may include a second top surface, a second bottom surface opposite to the second top surface, where the second bottom surface covers at least a portion of the first top surface, a plurality of second display pads exposed from the second bottom surface and connected to the second display pads and the main circuit board, and a second driver chip on the second bottom surface. In such an embodiment, the first driver chip and the second driver chip may be spaced apart from each other when viewed in a plan view.

In an exemplary embodiment, the deformation prevention member may be disposed on at least one of the first top surface and the second top surface.

In an exemplary embodiment, the deformation prevention member may be disposed on at least one of the first bottom surface and the second bottom surface, and the deformation prevention member may be spaced apart from the first driver chip and the second driver chip.

In an exemplary embodiment, the deformation prevention member may be disposed on a surface the same as a surface on which the heat radiation members are disposed.

In an exemplary embodiment, the deformation prevention member may be disposed on a surface different from a surface on which the heat radiation members are disposed.

In an exemplary embodiment, each of the first flexible circuit board and the second flexible circuit board may include a dielectric layer, a plurality of board signal lines on the dielectric layer, a solder resist layer in which an opening is defined to expose a portion of the board signal lines, and a plurality of board pads, each of which is connected to a portion of a corresponding board signal line of the board signal lines. In such an embodiment, the portion of the corresponding board signal line may be exposed through the opening, and the board pads of the first flexible circuit board and the board pads of the second flexible circuit board may be connected through a plurality of anisotropic conductive films to the first display pads and the second display pads.

In an exemplary embodiment, the board pads of the first flexible circuit board may include a plurality of first output pads connected to the first display pads and a plurality of first input pads connected to the main circuit board, and the board pads of the second flexible circuit board may include a plurality of second output pads connected to the second display pads and a plurality of second input pads connected to the main circuit board.

In an exemplary embodiment, the first flexible circuit board may include a first output segment where the first output pads are disposed, a first input segment where the first input pads are disposed, and a first connection segment which connects the first output segment to the first input segment, and the second flexible circuit board may include a second output segment where the second output pads are disposed, a second input segment where the second input pads are disposed, and a second connection segment which connects the second output segment to the second input segment. In such an embodiment, the first input segment and the second input segment may be spaced apart from each other.

In an exemplary embodiment, the second output segment may cover at least a portion of the first output segment.

In an exemplary embodiment, a sum of a width in the second direction of the first input segment, a width in the second direction of the first connection segment and a width in the second direction of the first output segment may be less than a sum of a width in the second direction of the second input segment, a width in the second direction of the second connection segment and a width in the second direction of the second output segment.

According to an exemplary embodiment of the invention, a display apparatus includes: a display panel including a plurality of first display pads arranged in a first direction and a plurality of second display pads arranged in the first direction, where the second display pads is spaced apart in a second direction from the first display pads, and the second direction intersects the first direction; a main circuit board; a first flexible circuit board including a first output segment including a plurality of first output pads connected to the first display pads, a first input segment including a plurality of first input pads connected to the main circuit board, and a first connection segment which connects the first output segment to the first input segment; a second flexible circuit board including a second output segment including a plurality of second output pads connected to the second display pads, a second input segment including a plurality of second input pads connected to the main circuit board, and a second connection segment which connects the second output segment to the second input segment; a plurality of heat radiation members on the first flexible circuit board and the second flexible circuit board; and a deformation prevention member spaced apart from the heat radiation members and disposed on at least one of the first input segment and the second input segment.

In an exemplary embodiment, the heat radiation members may include polyimide, and the deformation prevention member may include a metal.

In an exemplary embodiment, the first flexible circuit board may include a first top surface, a first bottom surface which is opposite to the first top surface and exposes the first output pads and the first input pads, and a first driver chip on the first bottom surface. In such an embodiment, the second flexible circuit board may include a second top surface, a second bottom surface which is opposite to the second top surface and exposes the second output pads and the second input pads, and a second driver chip on the second bottom surface. In such an embodiment, the first driver chip and the second driver chip may be spaced apart from each other when viewed in a plan view.

In an exemplary embodiment, the deformation prevention member may be disposed on at least one of the first top surface and the second top surface.

In an exemplary embodiment, the deformation prevention member may be disposed on at least one of the first bottom surface and the second bottom surface, and the deformation prevention member may be spaced apart from the first driver chip and the second driver chip.

In an exemplary embodiment, the deformation prevention member may be disposed on a surface the same as a surface on which the heat radiation members are disposed.

In an exemplary embodiment, the deformation prevention member may be disposed on a surface different from a surface on which the heat radiation members are disposed.

In an exemplary embodiment, the first display pads may be connected through a plurality of anisotropic conductive films to the first output pads, and the second display pads may be connected through a plurality of anisotropic conductive films to the second output pads.

In an exemplary embodiment, the second output segment may cover at least a portion of the first output segment, and the first input segment and the second input segment may be spaced apart from each other.

