This application is the U.S. national phase of International Application No. PCT/KR2018/008055 filed Jul. 17, 2018 which designated the U.S. and claims priority to KR Patent Application No. 10-2017-0124391 filed Sep. 26, 2017, the entire contents of each of which are hereby incorporated by reference.

TECHNICAL FIELD

The disclosure relates to a display and a method for manufacturing the same, by which pixels are realized by using light-emitting chips.

DESCRIPTION OF RELATED ART

Display industries have continued to develop mainly in the fields of TVs, monitors, and mobile products. The manufacturers have built markets while developing characteristics, such as screen qualities and resolutions, which can appeal to users. As an effort to realize high resolution, high luminance, and low power, the paradigm for realizing displays by using light-emitting elements (or light-emitting chips) in unit of chips in the panel-based display industries based on existing liquid crystal displays (LCDs) or organic light-emitting diodes (OLEDs) has changed.

In recent years, micro LED (or mLED or μLED) that are ultra-mini LED chips have been designed. The micro LED chip may be utilized as one pixel that may emit light without any backlight when being applied to a display. If the micro LED chips are applied to a display, they may have high luminance, quick response speed, excellent contrast, high color reproduction rate, and long lifespan. Further, because the sizes and shapes of the panels are not restricted, it is expected that they will be applied to ultra-large displays of approximately 100 inches or more, including a small-sized display which are mounted on wearable devices and smartphones.

SUMMARY

Displays may be manufactured by mounting micro LED chips on circuit boards (e.g., PCBs) by using a technology (e.g., a surface mounting technology (SMT)) based on soldering. If the micro LED chips can be precisely mounted on pixel areas of a circuit board, yield rate can be enhanced. However, warpage or deformation may occur due to heat and pressure in a process of mounting the micro LED chips on the circuit board, which may deteriorate the yield rate of the display. Further, when the surface flatness of the mounting surface of the circuit board cannot be secured, it also may be difficult to secure the yield rate.

The disclosure may provide a display which includes light-emitting chips and is manufactured differently from a scheme of mounting a plurality of micro LED chips on a circuit board, and a method for manufacturing the same.

The disclosure also may provide a method for embedding a plurality of micro LED chips in a display promptly and precisely, and a display manufactured through the same.

In accordance with an aspect of the disclosure, a display may include: a first layer that is light-transmitting and includes a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips.

According to an embodiment, because a display is manufactured through packaging of a scheme of, after forming a plurality of cavities in a plate formed of a material, such as glass, having thermal resistance and disposing light-emitting chips such as micro LED chips in the cavities, forming a circuit layer, yield rate may be improved as compared with the conventional technology.

