the connector wafer 201 and/or 202, rather than on the board 30, 40 so that the capacitors 101, 102 are not needed. As illustrated in the wafer 20 of FIGS. 2A and 2B, openings 22 are provided in the wafer housing (over mold 23) to expose a conductor 24 of the lead frame. A gap 26 is created in the conductor 24, resulting in two conductor ends 24a, 24b, and the package 10 is placed across the gap to connect with the conductor ends 24a, 24b. The bottom face 16 of the end members 121, 122 are adhered to the top surface of the exposed ends 24a, 24b of the conductor 24, such as by an adhesive or solder. As best shown in FIG. 2B, the wafer 20includes a top layer 27 of the over mold 23, a bottom layer 28 of the over mold 23, and the conductors 24a, 24b of the lead frame positioned there between. The opening 22 is provided in the top layer 27 and the bottom layer 28 that exposes the conductor leads 24a, 24b. The package 10 is positioned inside the opening 22 in the top layer 27 to connect with the two conductors 24a, 24b of the lead frame. Packages are also shown in the connector of U.S. Pat. No. 8,382,524 to Khilchenko, which is hereby incorporated by reference.
The conductor 24 has a thickness T and the gap 26 has a width W. The width W of the gap 26 can be larger than or equal to the