the laminate that includes the green sheet having the through holes filled with the conductor paste is fired. In this manner, the green sheets and the conductor paste are fired simultaneously so as to form an electrode in the via holes. Consequently, the conductive patterns of the desired layers are connected, thereby providing a three-dimensional circuit.
However, in a conventional firing, there are many cases where the firing shrinkage behavior of a conductor differs from that of ceramics. This makes it difficult to produce a large flat substrate. Moreover, a variation in shrinkage during firing also makes it difficult to produce a substrate with high dimensional accuracy.
To solve the above problems, the following method is proposed by JP 2785544 B2. Another green sheet is prepared by using an inorganicceramic substrate can achieve sufficient flatness for mounting semiconductors, chips, etc. and high dimensional accuracy, while preventing defects in the vicinity of electrodes. Therefore, the electrical characteristics of the multilayer ceramic substrate are not degraded, making it highly reliable.
It is preferable that the conductor composition further includes a glass frit in an amount of not more than 10 parts by weight. The addition of the glass frit can increase the adhesive strength in firing the conductor composition and adjust the final contraction of the conductor composition to be produced.
The conductor composition further may include a frit of an inorganic composition used in the glass ceramics in an amount of not more than 10 parts by weight.
The amount of Mo compound or Mo metal included in the conductor composition