1. Field of the Invention
The present invention generally relates to film stress measurement systems and, more particularly, to systems that measure stresses in thin films, such as dielectric or metal alloy films, that are coated onto semiconductor wafers.
2. State of the Art
During the manufacture of semiconductor wafers that serve as substrates for integrated circuits, it is usual practice to form thin films onto the surfaces of the wafers. The surface films can comprise, for example, silicon dioxide, AlSi, Ti, TiN, PECVD Oxide, PECVD Oxynitride, Doped Glasses, silicides, and so forth. The thickness of such films usually ranges from about 500 to about 12,000 Angstroms. Often, three or more film layers are formed on the surface of a single semiconductor wafer.
In the art of fabricating semiconductor wafers, it isSend this page to someone via email

A B.C. woman has found her biological parents more than 30 years after being abandoned in a Calgary parking lot.

In November 1987, a newborn was discovered in a garbage bag in the city’s southeast. She was lovingly named “Baby Mary” by the public.

The baby was adopted, given the name Teanna and moved to Kelowna with her family.

While Teanna Elliot always knew she was adopted, it wasn’t until she turned 16 that she was told the entire story by her adoptive parents.

“It took an emotional toll and it was really hard to process,” Elliot said. “I felt unloved and unwanted.”

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In 2017, Elliot made the tough decision to step back into the spotlight in an attempt to find her biological family.