connecting portion of the exposed conductor portion. Large stress is concentrated especially on a exposed conductor portion at a covering material end portion or an upper end portion of a solder connection fillet at the tip of the exposed conductor portion.
When mechanical load, especially high amplitude mechanical load in a thickness direction of the flat cable (a direction to separate a connection interface between the electrode section of the printed wiring board and the exposed conductor portion of the flat cable) acts on the connecting portion between the electrode section of the printed wiring board and the exposed conductor portion of the flat cable, fracture or separation of the connecting portion or breaking of the exposed conductor portion of the flat cable may occur.
As a method of reducingboard by the flat wiring material restricting clip in a state that the conductor of the flat wiring material is connected to the circuit board as disclosed in JP-A-2001-143784, when an external mechanical force in a separating direction is applied to the connecting portion of the flat wiring material, it is possible to prevent the external mechanical force from acting on the connecting portion by restriction of the flat wiring material restricting clip. As a result, it is possible to prevent damage to the connecting portion between the circuit board and the flat wiring material.
Meanwhile, as a means of reinforcing a connecting portion between a conductor of a flat cable and a circuit of a printed wiring board, a method is suggested in which adhesion between the flat