second substrate plates and an adhesive layer sandwiched between the first and second plates, comprises:
a plate moving member for bringing the first and second plates closer to each other with the interposition of adhesive to produce the bonded plate; and
an electric circuit for producing an electric field in an interspace between the first and second plates.
A plate bonding method according to the present invention comprises:
an overlapping step of overlapping first and second plates by bringing the first and second plates closer to each other with the interposition of adhesive to produce the bonded plate; and
an electric field producing step of producing an electric field in an interspace between the first and second plates during a period in the overlapping step.defendant, McDonnell Douglas Corporation (hereinafter "McDonnell"), is a corporation organized and existing under and by virtue of law. McDonnell is an employer, is engaged in an industry affecting commerce, and employs at least twenty-five persons.
3. Plaintiff was hired by defendant McDonnell on or about July 6, 1966, as a T.D.P.M. Operator A in Department 676, defendant's scientific computer operations department. Plaintiff worked in Department 676 until he was transferred to Department 674, defendant's business or administrative computer operations department, on May 10, 1971. Plaintiff worked in Department 674 until he resigned his employment with defendant McDonnell on or about February 25, 1972.
4. Plaintiff served in the Marine Corps from January 20, 1960, to May 19, 1966, a period of six years and four months. He took IBM data