Field of the Invention
The present invention relates to a wafer thinning method for thinning a wafer composed of an SiC substrate and a plurality of devices formed on the front side of the SiC substrate.
Description of the Related Art
Various devices such as integrated circuits (ICs) and large-scale integrations (LSIs) are formed by forming a functional layer on the front side of a wafer formed from a silicon substrate and partitioning this functional layer into a plurality of regions along a plurality of crossing division lines. The back side of the wafer is ground by a grinding apparatus to thereby reduce the thickness of the wafer to a predetermined thickness. Thereafter, the division lines of the wafer are processed by a processing apparatus such as a cutting apparatus andThe earthquake in Nepal in May exposed the national government’s unpreparedness to deal with the aftermath of a huge natural disaster, but it also gave rise to a movement of young Nepalese people with the skills required to help their country in its hour of need.

Quakemap.org invited people to report earthquake damage in real-time and list what kind of aid was required around the country.

For example: someone in contact with, or living in, an affected community might mark on the map that 50 tents were needed in a certain district.

People could also mark areas where people were trapped, where roads were blocked and where shelters had been set up.

There were over 2,000 reports made on the map, from all across Nepal.

While phone networks were sketchy in the days