911230 to form prearranged cut lines 911251.
When using the cutting device of the related art, after the bonded first and second mother substrates 911220 and 911230 having a plurality of liquid crystal display panels are loaded on the table 911242, the cutting wheel 911255 positioned at an upper side of the first and second mother substrates 911220 and 911230 is lowered and rotated to apply a certain pressure against the second mother substrate 911230 to form prearranged cut lines 911251 or grooves on the surface of the second mother substrate 911230.
The prearranged cut lines are also formed on the first mother substrate 911220. The first mother substrate 911220 is processed with the cutting wheel 911255 to form prearranged cut lines at the same positions as the prearranged cutlines 911251 of the second mother substrate 911230. Accordingly, in the liquid crystal panel cutting process of the related art, since the first and second mother substrates 911220 and 911230 are to be processed to form corresponding prearranged cut lines, after the second mother substrate 911230 is processed with the cutting wheel 911255, the liquid crystal panel is reversed to have the first mother substrate 911220 face upward and the first mother substrate 911220 is processed with the cutting wheel 911255.
Thereafter, pressure is applied to the prearranged cut lines 911251 formed on the first and second mother substrates 911220 and 911230 to separate the first and second mother substrates 911220 and 911230 along the prearranged cut lines 911251. The first and second mother substrates 911220 and 911230 are