formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad. A wire bonding process is carried out to electrically connect the bonding pads to the nodes. A molding process is carried out in which a mold has at least a cavity that corresponds to the packaging unit of the substrate. The packaging unit of the substrate and the multimedia chip are located in the cavity, and a molding compound is filled into the cavity. The molding compound encapsulates the first surface of the substrate unit, the multimedia chip, the conductive wires, and exposes the second surface of the substrate unit and the external nodes. A singulating process is carried out to separate the package unit ofwith the purpose of the present invention, another multimedia chip package is provided, which comprises: a substrate unit having a first surface and a corresponding second surface, wherein a plurality of first nodes, at least a die pad and a plurality of external nodes are formed on the first surface of the substrate unit, and a plurality of second nodes and at least a second die pad are formed on the second surface of the substrate unit, and the external nodes are electrically connected to the first nodes and the second nodes; at least a first multimedia chip having a first active surface and a corresponding first back surface, wherein a plurality of first bonding pads is formed on the first active surface of the first multimedia chip,