fiber mount coupled to the cylindrical member, wherein the first fiber mount is disposed in the groove. The temperature-compensated optical fiber device further includes a second fiber mount coupled to the cylindrical member, wherein the second fiber mount is disposed in the groove and is spaced apart from the first fiber mount. The temperature-compensated optical fiber device further includes an optical fiber device coupled to the first fiber mount and the second fiber mount, wherein the portion of the optical fiber device disposed between the first fiber mount and the second fiber mount is under tension. The cylindrical member, the first fiber mount and the second fiber mount each have a respective coefficient of thermal expansion. The respective coefficients of thermal expansion of the cylindrical member, the firstthe wafer over the polishing surface. The polishing head is forced downwardly onto the polishing surface by a pressurized air system or, similar arrangement. The downward force pressing the polishing head against the polishing surface can be adjusted as desired. The polishing head is typically mounted on an elongated pivoting carrier arm, which can move the pressure head between several operative positions. In one operative position, the carrier arm positions a wafer mounted on the pressure head in contact with the polishing pad. In order to remove the wafer from contact with the polishing surface, the carrier arm is first pivoted upwardly to lift the pressure head and wafer from the polishing surface. The carrier arm is then pivoted laterally to move the pressure head and wafer carried