Such bottom-up approaches should be capable of producing devices in parallel and be much cheaper than top-down methods, but could potentially be overwhelmed as the size and complexity of the desired assembly increases.
Chund tazujicht tn santit ɣur ider s afalla ilzam tat a tudabat eɣan n isuj izlaynen tolas raqqos nen fal top-down methods ,mucham addobat nen at-w-aɣabal alwaq wa id iddikud d tahrike n asidu wa eqqal derhan aw-id