Three Dimensional Integrated Circuits (3D IC) offer lower power consumption, higher performance, higher bandwidth, and scalability over the conventional two dimensional ICs. Through-Silicon Via (TSV) is one of the fabrication mechanisms that connects stacked dies to each other. The large size of TSVs and the proximity between them lead to undesirable coupling capacitance. This interference causes mutual influences between adjacent TSVs and produces crosstalk noise. Furthermore, this effect threats the reliability of data during traversal between layers. This paper proposes a mechanism that efficiently reduces crosstalk noise between TSVs with lower area overhead as compared to previous works. This mechanism revolves around the fact that retaining TSV value in current state can reduce coupling in some cases. To evaluate the mechanism, gem5 simulator is used for data extraction and several benchmarks are taken from the SPEC2006 suite. The simulation results show that the proposed mechanism reduces crosstalk noise with only 30 imposed TSV overhead while delay decreased up to 25.7 as compared to a recent related work.
RTL mechanisms in 3D IC have been proposed and experimented recently. @cite_12 proposed a coding scheme that reduces the maximum crosstalk about 28 The authors in @cite_8 introduce use of less adjacent transition code along with transition signaling to minimize the number of transitions. Furthermore, 3DLAT reduces higher crosstalk class frequency. This scheme has a significant TSV overhead which is not negligible. According to the authors' report, TSV overhead of 3DLAT is about 80
@cite_12 @cite_8
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3D integration is one of the promising solutions to overcome the interconnect bottleneck with vertical interconnect through-silicon vias (TSVs). This paper investigates the crosstalk in 3D IC designs, especially the capacitive crosstalk in TSV interconnects. We propose a novel ω-LAT coding scheme to reduce the capacitive crosstalk and minimize the power consumption overhead in the TSV array. Combining with the Transition Signaling, the LAT coding scheme restricts the number of transitions in every transmission cycle to minimize the crosstalk and power consumption. Compared to other 3D crosstalk minimization coding schemes, the proposed coding can provide the same delay reduction with more affordable overhead. The performance and power analysis show that when ω is 4, the proposed LAT coding scheme can achieve 38 interconnect crosstalk delay reduction compared to the data transmission without coding. By reducing the value of ω, further reduction can be achieved1. In 3D VLSI, through-silicon vias (TSVs) are relatively large, and closely spaced. This results in a situation in which noise on one or more TSVs may deteriorate the delay and signal integrity of neighboring TSVs. In this paper, we first quantify the parasitics in contemporary TSVs, and then come up with a classification of crosstalk sequences as OC, 1C,... 8C sequences. Next, we present inductive approaches to quantify the exact overhead for 8C, 6C and 4C crosstalk avoidance codes (CACs) for a 3 x n mesh arrangement of TSVs. These overheads for different CACs for a 3 x n mesh arrangement of TSVs are used to calculate the lower bounds on the corresponding overheads for an n x n mesh arrangements of TSVs. We also discuss an efficient way to implement the coding and decoding (CODEC) circuitry for limiting the maximum crosstalk to 6C. Our experimental results show that for a TSV mesh arrangement driven by inverters implemented in a 22nm technology, the coding based approaches yields improvements which are in line with the theoretical predictions. As the CMOS technology scaled down, the horizontal coupling capacitance between adjacent wires plays a dominant part in wire load, crosstalk interference becomes a serious problem for VLSI design. We focused on the delay increase caused by crosstalk. On-chip bus delay is maximized by the crosstalk effect when adjacent wires simultaneously switch for opposite signal transition directions. This paper proposes a bus delay reduction technique by intentional skewing signal transition timing of adjacent wires. An approximated equation of bus delay shows our delay reduction technique is effective for a repeater-inserted bus. The result of SPICE simulation shows that the total bus delay reduction by from 5 to 20 can be achieved. Interconnect delay has become a limiting factor for circuit performance in deep sub-micrometer designs. As the crosstalk in an on-chip bus is highly dependent on the data patterns transmitted on the bus, different crosstalk avoidance coding schemes have been proposed to boost the bus speed and or reduce the overall energy consumption. Despite the availability of the codes, no systematic mapping of data words to codewords has been proposed for CODEC design. This is mainly due to the nonlinear nature of the crosstalk avoidance codes (CAC). The lack of practical CODEC construction schemes has hampered the use of such codes in practical designs. This work presents guidelines for the CODEC design of the ldquoforbidden pattern free crosstalk avoidance coderdquo (FPF-CAC). We analyze the properties of the FPF-CAC and show that mathematically, a mapping scheme exists based on the representation of numbers in the Fibonacci numeral system. Our first proposed CODEC design offers a near-optimal area overhead performance. An improved version of the CODEC is then presented, which achieves theoretical optimal performance. We also investigate the implementation details of the CODECs, including design complexity and the speed. Optimization schemes are provided to reduce the size of the CODEC and improve its speed.