A new high capacity compact power modules for high power EV/HEV inverters
This paper presents a new power semiconductor IGBT module family dedicated for Electric Vehicle (EV) and Hybrid Electric Vehicle (HEV) power train inverter applications, especially for higher power requirements. The new IGBT module family adopts a 6 in 1 circuit configuration with an optimized internal layout, Direct Lead Bond (DLB) structure and an integrated Al fin for direct liquid cooling. As a result, this new power module family has simultaneously achieved high performance, low self inductance, small size and light weight. Compared to conventional products with similar power capabilities, the adoption of these innovative technologies has led to a 20% improvement in thermal performance, 30% reduction of self inductance, 50% reduction of the module's footprint, and a 70% reduction of the module's weight.
2016 IEEE Applied Power Electronics Conference and Exposition (APEC)