All photonic drying and sintering process via flash white light combined with deep UV and near infrared irradiation for highly conductive copper nano ink
We developed an ultra high speed photonic sintering method involving flash white light (FWL) combined with near infrared (NIR) and deep UV light irradiation to produce highly conductive copper nano ink film. Flash white light irradiation energy and the power of NIR/deep UV were optimized to obtain high conductivity Cu films. Several microscopic and spectroscopic characterization techniques such as scanning electron microscopy (SEM) a x ray diffraction (XRD) and Fourier transform infrared (FT IR) spectroscopy were employed to characterize the Cu nano films. Optimally sintered Cu nano ink films produced using a deep UV assisted flash white light sintering technique had the lowest resistivity (7.62 m*cm) which was only 4.5 fold higher than that of bulk Cu film (1.68 m*cm)
Scientific reports