Growth of Shockley type stacking faults upon forward degradation in 4H SiC p i n diodes
The growth of Shockley type stacking faults in p i n diodes fabricated on the C face of 4H SiC during forward current operation was investigated using Berg Barrett X ray topography and photoluminescence imaging. After forward current experiment, Shockley type stacking faults were generated from very short portions of basal plane dislocations lower than the conversion points to threading edge dislocations in the epitaxial layer. The growth behavior of Shockley type stacking faults was discussed. Growth of stacking faults in the substrates was not observed.