Metallic thermal interface material testing and selection for IC, power, and RF semiconductors
Thermal interface materials (TIM) are integral for adequate heat transfer from a semiconductor source to an external environment. Specialized TIM materials can be characterized as "well performing" when measured against challenging requirements for critical applications. A range of metallic thermal interface materials have been developed and described, for specialized applications requiring performance and reliability in challenging conditions. Selection of a specialized TIM must be considered against a range of specific application requirements, as described.
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM)