Structural and Electrical Characterizations of CuNi Thin Film Resistors
Abstract This work studied the development of Cu Ni for thin film resistor; specifically reported in this paper is the surface morphology and resistance. Films were deposited on the substrate of commercialized flame retardant (generally known as FR4) printed circuit board by using thermal evaporator. The thickness of the film was set to 100 nm and the dc current was maintained at 26 A. The sheet resistance and bulk resistivity of the thin films were measured via four point probe test. The stability of thin film resistor was measured through temperature coefficient of resistance (TCR) According to the experimental results, it can be seen that the sheet resistance of the thin film resistor decreased with increasing copper composition.