Effect of nano Co reinforcements on the structure of the Sn 3.0Ag 0.5Cu solder in liquid and after reflow solid states
Abstract Sn Ag Cu (SAC) alloys are commonly recognized as lead free solders employed in the electronics industry. However, some disadvantages in mechanical properties and their higher melting temperatures compared to Pb Sn solders prompt new research relating to reinforcement of existing SAC solders. One of the ways to reinforce these solder materials is the formation of composites with nanoparticles as filler materials. Accordingly, this study presents structural features of nanocomposite (Sn 3.0Ag 0.5Cu)100 x(nanoCo)x solders with up to 0.8 wt% nano Co. The effect of nano sized Co particles was investigated by means of differential thermal analysis (DTA) X ray diffraction (XRD) in both liquid and solid states, and scanning electron microscopy (SEM) The experimental data of DTA are compared with available literature data for bulk Sn 3.0Ag 0.5Cu alloy to check the capability of minor nano inclusions to decrease the melting temperature of the SAC solder. The combination of structural data in liquid and solid states provides important information about the structural transformations of liquid Sn 3.0Ag 0.5Cu alloys caused by minor Co additions and the phase formation during crystallization. Furthermore, scanning electron microscopy has shown the mutual substitution of Co and Cu atoms in the Cu6Sn5 and CoSn3 phases, respectively.