X-ray diffraction study of K3NdSi7O17: a new framework silicate with a linear Si-O-Si bond.
Hydrothermal investigations in the high-silica region of the K(2)O-Nd(2)O(3)-SiO(2) system, carried out in a search for novel fast-ion conductors (FICs), yielded the new compound tripotassium neodymium heptasilicate, K(3)NdSi(7)O(17). Single-crystal X-ray methods revealed that K(3)NdSi(7)O(17) crystallizes in space group P3, has lattice constants a = 16.131 (2) and c = 7.7146 (19) A, Z = 4, and 22 atoms in the asymmetric unit. Refinement was carried out to a residual, R(F), of 0.0253 and a weighted residual, wR(F(2)), of 0.0702 using anisotropic displacement parameters for all atoms. The silicate anion forms an interrupted framework, within which both Nd octahedra and K polyhedra are situated. The structure is unusual in that it contains a symmetry-constrained Si-O-Si bond angle of 180 degrees. No isomorphs to K(3)NdSi(7)O(17) are known.
The dehydrated copper silicate Na2[Cu2Si4O11]: a three-dimensional microporous framework with a linear Si—O—Si linkage
The structure of the title dehydrated copper silicate, disodium dicopper undecaoxide tetrasilicate, Na2(Cu2O11Si4), was determined by single-crystal X-ray diffraction from a non-merohedral twin. It exhibits an effective three-dimensional microporous framework with the major channels, in which the Na+ cations are placed, running along the a-axis direction and smaller channels observed along the b-axis direction. The structure is unusual in that it contains a symmetry-constrained Si—O—Si angle of 180°. The Cu centre is coordinated to five O atoms, exhibiting a slightly distorted square-pyramidal coordination geometry. The Na cation is interacting with five neighbouring O atoms, exhibiting an uncharacteristic coordination environment.
Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder
Abstract In order to obtain high-strength aluminum joints, ultrasonic soldering of 1070 aluminum was conducted under liquidus temperature of Sn–Zn hypereutectic solder. A device for ultrasonic soldering was assembled, which propagated ultrasonic vibrations in a direction perpendicular to joining surfaces. This device joined 1070-Al using quasi-melting Sn–Zn hypereutectic solder without using any artificial spacers. The strength of the solder joints was evaluated by tensile tests. The optimum joining conditions were determined, and the effects of solder compositions and soldering temperature on the joint strength and the solder layer thickness were examined. In this ultrasonic soldering process, the highest tensile strength was obtained for the solder joints fabricated at 220 °C for the Sn–23Zn and Sn–40Zn solder compositions. The joint strength was equivalent to that of 1070-Al heat treated at 220 °C. The sound joints were obtained at 300 °C using Sn–82Zn solder, the liquid phase volume fraction of which was theoretically only 0.24. The present work also revealed that the thickness of retained solder layer in the joint after ultrasonic soldering could be estimated. Accordingly, ultrasonic soldering under the liquidus temperature of Sn–Zn hypereutectic solder could be a spacer-free soldering method to obtain high-strength aluminum joints.