The human rights protection regime for afro-descendants the case of latin America ang the Caribbean
"Some states have been proactive in ratifying laws that protect ethnic minorities in Latin America and the Caribbean, but Afro-descendants do not benefit much from these laws. Self-identification as an 'ethnic minority' for Afro-descendants has been problematic. Some Afro-descendants defend the term Afro-descendant peoples whereas others agree with the use of ethnic minority as the ideal concept to identify them as a group or population. In any case, most Afro-descendants support an effective human rights protection regime as a key tool to help overcome their historical problems. This article studies in depth the crucial importance for Afro-descendants of enhancing this ""still-weak"" regime. The text represents one of the few works of its kind that explores in detail the limitations of the Afro-descendants' human rights struggle in the region"
La equidad y la exclusión de los pueblos indígenas y afrodescendientes en América Latina y el Caribe
El proposito de este articulo es mostrar y examinar algunos aspectos basicos de la situacion que viven los pueblos indigenas y afrodescendientes en America Latina y el Caribe. A traves del analisis de factores como el racismo y la discriminacion, se intenta interpretar las causas que han determinado que millones de personas de la region,provenientes de diversos origenes etnico-raciales,vivan en la pobreza y la marginacion. Para enfrentar esta problematica,se plantea la necesidad de transformar las bases de los sistemas (culturales, economicos, legales y politicos);de exclusion y discriminacion, disenando estrategias que vayan desde el reconocimiento formal de las identidades y derechos colectivos hasta la formulacion de po- liticas publicas,fortalecimiento de programas de cooperacion regional e internacional y profundas reformas estatales. El principio activo para la aplicacion de estas medidas debiera ser el de una nueva "ciudadania ", basada en la promocion de la diferencia y la diversidad cultural.
Multilayer high density flex technology
The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densities needed to meet these demands in a wide range of packaging and interconnection technologies. This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 /spl mu/m to 40 /spl mu/m are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential.