Effect of CeO2 particles on the high phosphorus electroless Ni layer
Electroless Ni (EN) technology is widely used in electronic package field and the high phosphorus composite EN technology was studied. In this paper, we discussed the influence of nano-CeO2 and micro-CeO2 particles with different amounts when they were added in high phosphorus content Ni-P composite coating. The microstructure and crystal structure of the coating were observed by scanning electron microscope (SEM) and X-ray diffraction analysis (XRD) respectively. The results showed that whether nano-CeO2 or micro-CeO2, both refined the grain, increased the specific surface area, however the micro-CeO2 particles made more obvious effect. As the XRD result showed, the peak gradually become gentle, the coating turned into amorphous which may cause by the CeO2 particles absorbed in the grain boundary and crystal defects. The results indicated the CeO2 deposited with the coating very well. Finally, the corrosion resistance of the coating was tested with the method of electrochemical impedance (EIS) and linear polarization. The results were unified. When the dosage is 5g/L, the corrosion resistance was the best. However, lower corrosion resistance was got when excessive CeO2 particles were added which may affect by the catalytic property.
Improvement of Wire Bond Strength to Electroless Au/Pd/Ni-P Plating Pads on Printed Wiring Boards by Knocking in Plating Bath
Au wire bond strength on Cu interconnects printed wiring boards was investigated for electroless Au/Pd/Ni-P pads plating prepared with knocking substrates in plating baths. A scanning electron microscope revealed that the surface of Ni-P plating formed with knocking was smoother than that of Ni-P plating formed without knocking. Furthermore, X-ray photoelectron spectroscopy indicated that no a Ni peak was recognized on Au/Pd/Ni-P plating formed with knocking, while a Ni peak was observed on ones formed without knocking. The wire bond strength to Au/Pd/Ni-P plating pads formed with knocking was larger than that to ones formed without knocking. These findings are due to removing hydrogen from a Ni-P surface by knocking substrates during formation of Ni-P plating. © The Electrochemical Society of Japan, All rights reserved.
Beyond East–West: Marginality and National Dignity in Finnish Identity Construction
Since the end of the Cold War it has become common for Finnish academics and politicians alike to frame debates about Finnish national identity in terms of locating Finland somewhere along a continuum between East and West. Indeed, for politicians, properly locating oneself (and therefore Finland) along this continuum has often been seen as central to the winning and losing of elections. For example, the 1994 referendum on EU membership was largely interpreted precisely as an opportunity to relocate Finland further to the West. Indeed, the tendency to depict Finnish history in terms of a series of “Westernizing” moves has been notable, but has also betrayed some of the politicized elements of this view. However, this framing of Finnish national identity discourse is not only sometimes politicized but arguably is also too simplified and results in blindness towards other identity narratives that have also been important through Finnish history, and that are also evident (but rarely recognized) today as well. In this article we aim to highlight one of these that we argue has played a key role in locating Finland in the world and in formulating notions of what Finland is about, what historical role and mission it has been understood as destined to play, and what futures for the nation have been conceptualized as possible and as providing a source of subjectivity and national dignity.