Formation and microstructure of thin Ti silicide films for advanced technologies
We report on the solid-state reaction of thin PVD Ti films with in-situ doped Si & SiGe alloys using a combination of in-situ x-ray diffraction, sheet resistance, laser light scattering measurements and ex-situ x-ray pole figure analysis. Thin Ti films or thin bilayer films (Ni/Ti or NiPt/Ti) are found to be much more aligned with the underlying substrates. Millisecond laser anneals also lead to the introduction of strong in-plane texture.
High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization
We present a fully integrated 14nm CMOS technology featuring finFET architecture on an SOI substrate for a diverse set of SoC applications including HP server microprocessors and LP ASICs. This SOI finFET architecture is integrated with a 4th generation deep trench embedded DRAM to provide an ultra-dense (0.0174um2) memory solution for industry leading `scale-out' processor design. A broad range of Vts is enabled on chip through a unique dual workfunction process applied to both NFETs and PFETs. This enables simultaneous optimization of both lowVt (HP) and HiVt (LP) devices without reliance on problematic approaches like heavy doping or Lgate modulation to create Vt differentiation. The SOI finFET's excellent subthreshold behavior allows gate length scaling to the sub 20nm regime and superior low Vdd operation. This leads to a substantial (>35%) performance gain for Vdd ~0.8V compared to the HP 22nm planar predecessor technology. At the same time, the exceptional FE/BE reliability enables high Vdd (>1.1V) operation essential to the high single thread performance for processors intended for `scale-up' enterprise systems. A hierarchical BEOL with 15 levels of copper interconnect delivers both high performance wire-ability as well as effective power supply and clock distribution for very large >600mm2 SoCs.
Fluid to liquid membrane energy exchanger for simultaneous liquid desiccant regeneration and desalination applications–Theoretical and experimental analyses
Abstract In this paper, a thermal model developed for assessing the performance of the fluid to liquid membrane energy exchanger based liquid desiccant regenerator is presented. The model was validated with the experimental data and found accurate. Using the experimental inlet conditions reported in the literature for the structured packing chamber, the performance of the fluid to liquid membrane energy exchanger based liquid desiccant regenerator was theoretically predicted choosing water and air as working fluids and Lithium Chloride as a liquid desiccant. Further, studied the influence of inlet parameters such as working fluid and desiccant inlet temperature’s, hot liquid desiccant to cold working fluid ratio and desiccant concentration on vapour absorption rate. From this analysis, it is observed that membrane based liquid desiccant regenerator using water as a working fluid is best suitable for converting the weak desiccant into strong desiccant and for generating the pure water simultaneously (co-generation process). An experimental investigation was carried out for assessing the energy exchange process across the membrane based liquid desiccant regenerator using water as a working fluid. From the experimental analysis, it was found that desiccant temperature has a significant impact on the energy exchange process. The pressure drop across the membrane based liquid desiccant regenerator was also measured at different desiccant flow rates and concentration.