The Political Issue of the Ascension of Isaiah: A Response to Enrico Norelli
Enrico Norelli argued in 2003 that the references to martyrdom in the Ascension of Isaiah are symbolic rather than actual. This article challenges his reliance on the Mishnah in support of the assertion that Isaiah dies as a martyr in the contest between true and false prophecy in the second-century church. It argues that the progress of thought in chs. 1–5 suggests that martyrdom is more obviously an actual and recent feature of the authors’ experience than a merely symbolic entity. The martyrdom of Ignatius is further considered in this context. This result is the insistence that the Ascension of Isaiah has a strong ‘political’ dimension in both of its halves. Such evidence must be inserted into the evaluation of the emerging Christian movement, not least in its response to both Jews and the Romans as factors external to, yet bearing on, the church, at the time of writing.
Disciples of the beloved one : the christology, social setting and theological context of the ascension of Isaiah
This is the most thorough investigation yet published on the early Christian apocalypse called the 'Ascension of Isaiah'. Knight examines all the critical issues in the study of this document, including matters of date, provenance and purpose. Particular attention is paid to the book's concepts of christology (with a view both to that christology's Jewish mediatorial background and to its relationship with wider Christianity) and millenarianism (with a view to the social setting of the writer and his readers). Questions concerning the author as haggadist and exegete are also addressed.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.