Effect of Rare Earth Upon As-Cast Microstructure and High Temperature Performance of ZA40 Alloy
In testing comparison, this study is made on the modification effect of 0.05 wt.% La-rich rare earth (RE) upon as-cast microstructure, mechanical properties of materials at high temperatures (100, 150, 200°C) and wear resistance under different temperatures (100and 200°C) of ZA40 alloy containing Si. The addition of RE shows that it can not only effectively refine Al-rich and Cu-rich phase, but also reduce the amount of needle-like eutectic silicon, and then make the size of massive primary silicon phase smaller. Thus, there are the improvement of strength, ductility and wear resistance of materials at high temperature. The analyses are also conducted on the mechanism of underlying RE elements.
Research on the wear characteristics of hypereutectoid steel
Abstract In this research, the wear behavior of hyper-eutectoid steel was examined at ambient temperature ranging from room temperature to a high temperature of 400 °C. A common asymmetric test rig was used, where a pin specimen of hyper-eutectoid steel is pressed against a disk of carbon steel for machine structure use. Two types of pin specimen were prepared: an as-received specimen and a quenched specimen.. As a result, the following was clarified. The protective surface film of iron oxide is not a main factor in determining the wear behavior of the hyper-eutectoid steel of as-received pin specimens. The wear behavior is closely related to the separation of the oxide film from bulk material when the sliding conditions are severe. The wear behavior of a quenched pin specimen is strongly influenced by a microstructural transition and a reduction in hardness of the pin specimen at elevated temperature.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.