Development of Mine Detection Robot System
The Mine Detection Robot supports the mine removal work in countries where mines are buried, such as Afghanistan. The development started from September, 2003. Considering running on rough terrains, the robot has four crawlers, and hydraulic motors in front and rear were serially connected by piping so that they could rotate synchronously. Two work arms were mounted on the robot, one was a horizontal multi-joint SCARA type with motorized 2-link arm, while the other was a vertical multi-joint manipulator with 6 degrees of freedom. Also, domestic evaluation tests were carried out from February to March, 2005, followed by overseas validation tests in Croatia from February to March, 2006. These tests were conducted with a mine detecting senor mounted on the Robot, and the detection performance was evaluated by its mine detection rate.
Land Mine Detecting Robot Capable of Path Planning
The Landmine detecting robots are designed to cover maximum possible area of landmine field for detection of landmines. The detected landmines along with scanned and leftover area are represented on a visual map with accuracy in millimeters. This paper presents a prototype model of land mine detecting robot that is powerful yet low cost and easily controllable. A graphical user interface is developed for plotting the landmines, scanned & leftover area presentation, PID tuning and camera alignment. Emphasis is placed on the control of the differential drive robot in auto mode, semi-auto mode and the manual mode. Image processing technique is employed to find the accurate position of robot which provides the live reckoning feedback to the dead reckoning servo control of the robot. Metal detector is the sensor used to detect landmines. The graphical user interface for the remote terminal computer provides the effective control for the robot. The system is simple but powerful and intelligible to achieve the required results.
New approach to vision-based BGA package inspection
Ball grid array (BGA) techniques have developed very fast due to the advantages of more I/O ports, small size, and so on. In this paper, a vision-based algorithm for BGA package inspection is proposed to accurately estimate center and diameters of solder-balls of BGA packages, so that defects of BGA packages, such as missing or extra balls, oversize or undersize balls, over-height or under-height balls, and pitch can be detected for ensuring the quality of BGA packages.