Governing in a post-conflict society social fit
Abstract : The growing interconnectedness of nations through globalization, and the threat of international terrorism as a destabilizing force, has increased the international community's concern for stable governance in the developing world. In an era of globalization, with near instantaneous information flow, and a global court of international opinion, the options for governing a society in a post-conflict environment are limited. History is filled with rebellions, insurgencies, coups, invasions, and occupations that result in regime change or some sort of post-conflict intervention by the international community. In each case, prior to conflict there was an established order, or form of governance. After conflict, a new order or form of governance has to emerge. In these societies, a preconflict political and social order was disrupted, and a new post-conflict political and social order established. Ideally, the crafting of a new political and social order into effective governance requires the acceptance of the governed. As the United States remains committed to assisting nations with establishing governance and fostering stability, policy makers should consider the social acceptance of a post-conflict government by the people.
Afghanistan: Politics, Elections, and Government Performance
This report discusses the current political state of Afghanistan, as well as the Afghan government. This report also discusses Afghanistan's relationship with the United States, particularly U.S. efforts to urge President Hamid Karzai to address corruption within the Afghan government.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.