Research and application of the system of electric power engineering in the Huangling Mining 2 × 300MW power plant construction period
A lot of things that need to be managed in the thermal power projects. In this process, many factors are constrained and associated each other, That all aspects of works are plan organize, coordinate, control and management Legitimately are the guarantee of success.In the process of building the Huangling Mining 2 × 300MW power plant, through the use of the electricity project management system, preparation office, supervision, design, construction, and other units gather into a platform. The major event, the document marking, project, contract management, material supply, acceptance settlement integrate information platform. Preparatory Office can control of the project's funding, schedule, quality, safety In every moment. It can easily coordinated, Controled, and managed works.
Study on the Plan and Control Method of Construction Project Progress and Cost Integration
Based on the principle of system integration,this paper analyzes the correlation of progress and cost in the construction process,and the plan and control method of integrating the progress and cost of construction projects,and provides the precondition of applying into the construction practice.The research result can directly guide the construction management practice and also work as the base of the developing the compute aid decision system of construction project cost and progress integration management.
Multilayer high density flex technology
The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densities needed to meet these demands in a wide range of packaging and interconnection technologies. This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 /spl mu/m to 40 /spl mu/m are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential.