Influence of PCBs coatings wettability on lead-free SMT solder joints reliability
The paper presents results of wettability study of PCBs with immersion Sn, Ni/Au and SnCu coatings before reflow soldering process. Furthermore the solder joints were made in the optimal lead-free reflow soldering conditions using chosen materials with different wettability value of PCBs coatings and their reliability assessment was executed. The results of investigations have shown that exist direct influence PCBs coatings wettability on reliability of solder joints. It was find also that by using special procedure of PCBs coatings wettability assessment it is possible to predict future solder joints reliability.
Material-Dependent Reliability Characteristics of Lead-Free Solder Joints
Solder joints of lead-free electronic assemblies are characterized by a high material diversity due to different finish types of component terminations and also pad finishes of PCB's used. Besides this various lead-free solder alloys are available. During the soldering process all the different materials interacting with each other in relation the soldering conditions forming intermetallic layers at the interface. Thus different material qualities of solder joints are generated and the reliability is material-dependent. Varying intermetallics have different brittle properties. Therefore the materials used have significant influence on the reliability besides certainly constructive properties of the packages and boards especially in the case of miniaturized solder joints. The selection or modification of the materials used is important to affect the metallurgical properties of solder joints including the intermetallic formation, i.e. type and quantity of intermetallics. Application-related development results within the research project InnoLot regarding high temperature applications are presented. Results of board level reliability are shown
ATP-dependent S-(2,4-dinitrophenyl)glutathione transport in canalicular plasma membrane vesicles from rat liver.
Uptake of the thioether S-(2,4-dinitrophenyl)glutathione (DNPSG) in canalicular plasma membrane vesicles from rat liver is enhanced in the presence of ATP and exhibits an overshoot with a transient 5.5-fold accumulation of DNPSG. Stimulation by ATP is not caused by the generation of a membrane potential, based on responses of the indicator dye oxonol V. ATP-dependent uptake has an apparent Km of 71 microM for DNPSG and a Vmax of 0.34 nmol.min-1.mg of vesicle protein-1. Protein thiol groups are essential for transport activity as indicated by the sensitivity of DNPSG transport to sulfhydryl reagents. There is competitive inhibition with other thioethers, S-hexylglutathione (Ki = 66 microM), the photoaffinity label S-(4-azidophenacyl)glutathione (Ki = 56 microM), as well as with glutathione disulfide (Ki = 0.44 mM) and with the bile acid taurocholate (Ki = 0.61 mM). GSH (2 mM) or cholate (0.4 mM) does not inhibit. Both glutathione disulfide and taurocholate show ATP-dependent transport in the canalicular membrane vesicles which is inhibited by DNPSG. No ATP-dependent transport is found for GSH. Transport of DNPSG is also inhibited competitively by alpha-naphthyl-beta-D-glucuronide (Ki = 0.42 mM) but not by alpha-naphthylsulfate (2 mM), and there is substantial inhibition with the glucuronides from ebselen and p-nitrophenol. The results indicate that the canalicular transport system for DNPSG is directly driven by ATP and that the biliary transport of other classes of compounds may also proceed via this system.