Solderability Characteristics of Palladium , Palladium Nickel , Hard and Soft
Palladium and palladium alloys are the only serious ahematives to gold as an "electronic finish". In the past, the major impetus for such a substitution has been economic; however, today palladium's technological advantages are generally recognized. This is especially true in the connector markets where the material properties (e.g. hardness, ductility, thermal stability, etc.) of palladium are in many instances superior to hard gold. Recent advances in plating technologies coupled with a m r e thorough understanding of the materials properties have expanded the use of electroplated palladium and palladium alloys in the PCB, semiconductor and optoelectronic packaging markets. To assess the suitability for such applications, the wire bondability and solderability of these finishes need to be investigated.
WEAR RELIABILITY OF GOLD-FLASHED PALLADIUM VS. HARD GOLD ON A HIGH-SPEED DIGITAL CONNECTOR SYSTEM
Analyse par microscopie optique, microscopie electronique a balayage et fluorescence RX de la resistance a l'usure des depots electrolytiques de palladium destines a la fabrication de contacts electriques.
Enhancement of surface properties on Low Density Polyethylene packaging films using various fluorination routes
Nowadays, packaging market deployment requires an important attention. Influence of treatment with molecular (F2) or atomic (Fradical dot) fluorine on properties of Low Density Polyethylene (LDPE) films was investigated. The films were treated using direct fluorination conditions with F2 or a specific reagent XeF2, which releases atomic fluorine Fradical dot. Changes of LDPE chemical composition were investigated by FTIR and solid state NMR. Surface morphology was studied by several microscopy techniques (SEM and AFM). Finally to further characterize film properties after treatments, surface energy measurements and electron paramagnetic resonance (EPR) analyses were also carried out. An upper fluorinated layer, which contains mainly high amount of single bondCF2single bond, was formed during the direct fluorination conditions (F2). For the process performed with XeF2, specific groups single bondCHFsingle bond were detected not only on the polymer surface but also in the bulk. The final CHF/CF2 ratio depended on the fluorination route. Treatment with Fradical dot (originated from XeF2 decomposition) resulted in single bondCHFsingle bond groups in bulk prevailing formation whereas F2 formed mainly single bondCF2single bond groups. Regardless to the reactive species, radicals (dangling bonds) appeared during the fluorination and reacted with oxygen during the exposition to air after the treatment. Such a process resulted in oxygenated polar groups formation and consequently in the surface energy increase.