Distributed generation and its impact on power grids and microgrids protection
The National Institute of Standards and Technology, NIST, is assigned by the US Department of Energy, DoE, to drive Smart Grid developments and harmonization efforts in the power industry. Distributed Generation has been identified as one of the important areas for the Smart Grid developments. Multiple generation sources, bi-directional power flow, power flow time co-ordination and management bring significant benefits and challenges for the existing and emerging power grids and microgrids. In particular, the effect of distributed generation on protection concepts and approaches needs to be understood, and accounted for. This paper describes distributed generation concepts, applications and scenarios. Benefits and challenges are discussed and analyzed on a number of real life examples. Special considerations are provided on ensuring security and dependability, as well as on protection parameterization and coordination.
Considerations for connecting photovoltaic solar plants to distribution feeders
This paper discussed challenges faced and lessons learned when integrating distributed generation, in particular exporting photovoltaic solar installations. Challenges discussed are related to protection, modelling, communications and synchronization. Lessons learned from field installations suggest specific test setups and procedures to prevent undesirable behaviors during operation. Given these complexities no ‘one fits all’ solution exists, and each case and application require individual analysis for selecting the best solution. For further enhancements leading to maturity of this technology collective industry-wide knowledge exchange is highly encouraged.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.