Multi-trench-based technique to improve amorphous SiGe thin-film solar cell performance
In order to improve the electrical performance of the conventional amorphous SiGe thin-film solar cells, a new multi-trench technique has been proposed. In this method, the multi-trench is created in the intrinsic SiGe layer and filled with p-type doped Si. The p-type trenches in the intrinsic SiGe layer improve the electrical performance of the proposed design. Electrical characteristics of the proposed structure are analyzed and optimized by 2-D numerical modeling and compared with conventional amorphous SiGe thin-film solar cell characteristics. The extracted results show that the multi-trench-based technique has excellent effect on the fill factor and efficiency of the device.
Numerical Simulations of Amorphous and Polycrystalline Silicon Thin-Film Transistors
In this paper we present results of two-dimensional numerical simulations of both amorphous silicon and NMOS and PMOS polycrystalline silicon thin-film transistors. Both types of devices are modeled using an effective medium approach whereby the defects and grain boundaries in the material are treated as a spatially uniform density of localized states in the band gap. The field-effect mobility is self-consistently calculated from the appropriate band mobility and using one set of parameters for each material we obtain very good agreement between simulations of both output and transfer characteristics and experimental data. The experimental activation energy of the source-drain current for the polycrystalline devices is also found to be in excellent agreement with the numerical simulations.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.