Method for increase in sensitivity of the ignition center coordinate pyrometric detector
The article describes the method for increase in sensitivity of the pyrometric detector for detection of ignition center based on two-dimensional coordinates by means of the mirrors located behind cylindrical lenses.
Detection time of the explosion initial stage by the electro-optical system with cylindrical lenses
The arcticle is devoted to the experimental investigations of the electro-optical system (EOS) with cylindrical lenses. It was proved the efficiency of the system and defines the detection time of the explosion initial stage.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.