Comparative study of tri-gate flash memories with split and stack gates
The functional tri-gate flash memories with splitgate have been demonstrated for the first time, and its Vt variabilities before and after one P/E cycle have be systimetically compared with stack-gate ones. It was confirmed that split-gate shows smaller Vt distribution after erase and excellent over-erase immunity compared to those of stack-gate. Moreover, it was found that BVDS is higher than 3.2 V even Lgc was down to 76 nm. This indictes that tri-gate is useful for scaled NOR flash.
Comparative Study of Charge Trapping Type SOI-FinFET Flash Memories with Different Blocking Layer Materials
The scaled charge trapping (CT) type silicon on insulator (SOI) FinFET flash memories with different blocking layer materials of Al2O3 and SiO2 have successfully been fabricated, and their electrical characteristics including short-channel effect (SCE) immunity, threshold voltage (Vt) variability, and the memory characteristics have been comparatively investigated. It was experimentally found that the better SCE immunity and a larger memory window are obtained by introducing a high-k Al2O3 blocking layer instead of a SiO2 blocking layer. It was also confirmed that the variability of Vt before and after one program/erase (P/E) cycle is almost independent of the blocking layer materials.
Frequency selective surface design for blinds applications
In this paper, the reconfigurable blind structure with frequency selective surfaces(FSS) for the building applications are presented. Frequency transmission characteristics for different angles of the proposed blind-FSSs are investigated and verified through simulation and measurement. The simulation results show that we can implement the reconfigurable blind-FSS for multiband wireless applications. To verify the proposed paper, two kinds of blind-FSSs, crossed dipole FSS and circular ring FSS are fabricated and measurements are performed for different angles. The proposed structure in this paper which is very simple, can be easily applied to any planar surface for wireless security applications at low cost.