Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs
Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.
Advantages of embedded decoupling capacitance in high speed compact board design
This paper provides an introduction about embedded capacitance technology and its implementation on printed circuit board (PCB). The advantages of implementing embedded decoupling capacitance in compact PCB with high speed signal transmission are also explained. The advantages in terms of power and signal integrity are discussed in detail by performing analysis in 2 phases. In phase one, the computation of power distribution network (PDN) impedance of the conventional PCB with discrete decoupling capacitors and the PCB with embedded decoupling capacitance is performed. Meanwhile in phase two, co-analysis of power and signal integrity (PI/SI) on test cases with decoupling conditions mentioned in phase one is conducted to observe the power rail noise and quality of signal transmission. The analysis results are further discussed in the later section of this paper.
Barium titanate/epoxy composite dielectric materials for integrated thin film capacitors
Integration of passive components into electronic packaging will lead to further structural miniaturization, performance and reliability improvements, as well as cost reduction in the microelectronics industry. To replace the discrete capacitors currently employed in packages with the embedded ones, suitable dielectric materials and thin film processes compatible with the PWB technology are desired. Toward this end, we have been investigating a thin film technology based on barium titanate (BaTiO/sub 3/)/epoxy composites, whose advantages in terms of processability, low processing temperature, and versatility make it quite promising. In this process, the homogeneous dispersion of fine-grained barium titanate into the epoxy matrix was achieved through the surface functionalization of the ceramic powders with a silane coupling agent. Particulate coatings were formulated using the functionalized barium titanate powders, bisphenol A epoxy resin, dicyandiamide, and 2-methylimidazole in an organic solvent. The composite dielectric thin layers were processed on Cu substrates by spinor dip-coating followed by curing at 175/spl deg/C. Electrical measurements on these capacitors demonstrate that, for composite dielectric films containing 60 vol% of barium titanate, a dielectric constant of about 40 at 1 kHz and low loss factors of less than 0.035 over a wide frequency region have been obtained.