SiGnal Processing Techniques For Nondestructive Evaluation Using Laser Ultrasonics
Laser ultrasonics is a form of ultrasonic evaluation in which a pulsed laser generates an ultrasonic wave in a sample which interrogates a specific feature. When this wave returns to the surface a separate laser interferometer detects the small resulting displacement. This technique is strictly noncontact and is thus suitable for in-process inspection of parts at high temperature or moving at high speed. In many applications the acquired temporal signals have features which differ from those acquired using conventional transducers. In this paper we will describe these features and discuss techniques which have been used to process these signals.
Design and engineering of photorefractive materials for use in adaptive laser ultrasonic receivers
We describe the use of photorefractive material in adaptive interferometers for the detection of small surface displacements generated by ultrasonic waves. Recent results on devices based on two-wave mixing and photo-emf detection will be presented. We will discuss techniques for tailoring materials properties for improved device performance.
Submicron polymer structures with X-ray lithography and hot embossing
This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiOx membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λc ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.