Solderability Characteristics of Palladium , Palladium Nickel , Hard and Soft
Palladium and palladium alloys are the only serious ahematives to gold as an "electronic finish". In the past, the major impetus for such a substitution has been economic; however, today palladium's technological advantages are generally recognized. This is especially true in the connector markets where the material properties (e.g. hardness, ductility, thermal stability, etc.) of palladium are in many instances superior to hard gold. Recent advances in plating technologies coupled with a m r e thorough understanding of the materials properties have expanded the use of electroplated palladium and palladium alloys in the PCB, semiconductor and optoelectronic packaging markets. To assess the suitability for such applications, the wire bondability and solderability of these finishes need to be investigated.
WEAR RELIABILITY OF GOLD-FLASHED PALLADIUM VS. HARD GOLD ON A HIGH-SPEED DIGITAL CONNECTOR SYSTEM
Analyse par microscopie optique, microscopie electronique a balayage et fluorescence RX de la resistance a l'usure des depots electrolytiques de palladium destines a la fabrication de contacts electriques.
Comparison of the Stability of Gold and Palladium Alloy Connector Contacts Subjected to Vibration
Printed wiring board connector contacts utilizing gold and various palladium based alloys have been subjected to vibration testing to accelerate degradation caused by fretting or frictional polymer formation. The resistance of each contact was measured before the test and at various intervals throughout the test. The results show that the contacts with the maximum gold content are the most stable in this test. Pure palladium contacts mated with pure palladium contacts are the least stable. Further tests have shown that palladium-based materials covered with thin gold or gold-rich layers perform satisfactorily.