Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding
With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-to-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. the material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.
Comparison of different flex materials in high density flip chip on flex applications
Abstract This paper presents the results from the evaluation of different types of flexible substrates for high-density flip chip application. In this work four different flexible substrates were used. The flex substrates were Espanex, Upilex and epoxy glass with 80 μm pitch and Upilex with 54 μm pitch. Two different test IC’s were used for both pitches. In test IC1 (80 μm pitch) and IC3 (54 μm pitch) the bumps were in one row and test IC2 (80 μm pitch) and IC4 (54 μm pitch) in two rows. The total amount of contacts in test IC1 was 190, in test IC2 173, in test IC3 293 and in test IC4 270. The anisotropically conductive adhesive that was used in the tests was epoxy based thermosetting adhesive film with conductive particles. The conductive particles in the adhesives were isolated soft metal-coated polymer particles. The contact resistance was measured using Kelvin four-point method and the continuity and series resistance using daisy chain structure. The reliability of the flip chip interconnections was tested in temperature cycling test and environmental test. Cross section samples were made to analyse the possible reason for failures. The results presented in this paper are from FLEXIL development project that is part of European Union IST research program.
Effect of Aeration and Agitation Regimes on Lipase Production by Newly Isolated Rhodotorula mucilaginosa–MTCC 8737 in Stirred Tank Reactor Using Molasses as Sole Production Medium
The influence of media and process parameters (aeration and agitation) on fermentation broth rheology and biomass formation has been studied in 1.5-l stirred tank reactor for lipase production using Rhodotorula mucilaginosa MTCC 8737. Molasses, as sole production medium, is used for lipase production by varying aeration (1, 2, and 3 vvm) and agitation speeds (100, 200, and 300 rpm). Maximum lipase activity of 72 U/ml was obtained during 96 h of fermentation at 2 vvm, 200 rpm, pH 7, and 25 ± 2°C temperature. Lipase production kinetics with respect to dry cell weight of biomass showed YP/S of 25.71 U/mg, specific product formation of 10.9 U/mg DC, and YX/S 2.35 mg/mg. Maximum lipase activity (MC 2) of 56 U/ml was observed at 1% molasses, and a further increase in the molasses concentration of (%) 1.5 and 2 inhibited the product formation of lipase with 15 and 8.5 U/ml, respectively. The production kinetics of molasses media showed YP/X was 14 U/mg DC, YP/S 16 U/mg, and YX/S 1.14 mg/mg during 96 h of bioreactor operation. The kLa values for all batches (MC 1–MC 4) at 96 h of fermentation were 32, 28, 21, and 19/h, and the |oxygen transfer rate were 54.4, 56, 35.7, and 17.29 mg/l h, respectively. Increase in molasses concentration resulted in decreased lipase activity by increase in viscosity of the fermentation broth.