3D integration technologies for MEMS
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography.
Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
We report about a detailed comparison of the additive manufacturing methods inkjet printing (IJP) and aerosol jet printing (AJP). Both technologies are based on the direct-writing approach enabling the non-contact deposition of various materials in flexible patterns, e.g., for printed electronic applications. The deposited pattern elements were classified as (i) drops (IJP) or splats (AJP), (ii) lines, and (iii) squares. These elements can be considered as basic elements of the deposition systems and also of printed electronics. The pattern elements were deposited with IJP and AJP using the same silver nanoparticle ink. After printing, the layers were characterized regarding their morphology by optical and topographical measurement methods as well as regarding their electrical characteristics. It turned out that drops deposited with IJP and splats deposited with AJP can have similar dimensions. However, the shapes of the deposits differ widely. In the case of lines, AJP enables narrower line widths and th...
Maskless deposition of ZnO films
Maskless Mesoscale Materials Deposition (M3DTM) is a new direct write technique, which is versatile enough to deposit a large variety of precursors and colloidal suspensions. It is a simple and convenient process for rapid prototyping of structures and components. This maskless deposition method operates in air and at room temperature. In this study, a glycerol based polymeric precursor was used for depositing ZnO thin films on surface modified glass substrates. The parameters for deposition using M3DTM were thoroughly examined and optimized.