Effects of Silicon Oxide Filler Material and Fibre Orientation on Erosive Wear of GF/EP Composites
Materials added to the matrix help improving operating properties of a composite. This experimental study has targeted to investigate this aim where Silicon Oxide particles were added to glass fibre and epoxy resin at an amount of 15% to the main material to obtain a sort of new composite material. Erosive wear behavior of epoxy-resin dipped composite materials reinforced with glass fibre and Silicon Oxide under three different impingement angles (30°, 60° and 90°), three different impact velocities (23, 34 and 53 m/s), two different angular Aluminum abrasive particle sizes (approximately 200 and 400 μm) and the fibre orientation of 45° (45/-45) were investigated. In the test results, erosion rates were obtained as functions of impingement angles, impact velocities, particle sizes and fibre orientation. Moreover, materials with addition of Silicon Oxide filler material exhibited lower wear as compared to neat materials with no added filler material. In addition, SEM views showing worn out surfaces of the test specimens were scrutinized. Keywords—Erosive wear, fibre orientation, GF/EP, silicon oxide
Role of Process Variables on the Solid Particle Erosion of Polymer Composites: A Critical Review
This paper presents a review of the reported research investigations that are related to the solid particle erosion behavior of polymers and polymeric composites. Attention is paid to the effects of test parameters such as erodent type, size of the erodent, impingement angle, impact velocity and stand of distance. On the erosion wear rate of polymer composites. Various predictions and models proposed by different authors to describe and quantify the erosion rate are discussed and their suitability is checked. Recent findings on the erosion response of multi-component hybrid composites are also presented. Lastly the implementation of the design of experiments and statistical techniques in making a parametric appraisal of the erosion processes of composites is discussed.
Bevel RIE application to reduce defectivity in copper BEOL processing
Bevel etch used during wafer fabrication for semiconductor devices is discussed. In this case, the bevel etch process was utilized in middle of the line processing (MOL) to reduce back end of line (BEOL) defectivity. Tungsten and titanium nitride films, from the formation of contacts to the transistors, extend into the bevel region of the wafer and have been shown to initiate arcing. This can spread foreign material defects on the front side of the wafer in various BEOL post processing steps including subsequent reactive ion etching, SEM metrology and film depositions. The bevel etch tool confines a plasma etch to the outer edge of the front side of the wafer (which can be individually adjusted) and can remove dielectric, organic and Ti/TiN/W films using a fluorine based chemistry.