Assessment of Die Attach Film for Thin Die and SiP Applications
The drive for package miniaturization and die thickness reduction has created new challenges for conventional die attach paste materials. Die attach film (DAF) is seen as a potential candidate especially in applications requiring die thickness =100 mum. However, processing of DAF materials also presents certain difficulties especially in dicing of DAF-laminated wafers. This paper outlines the challenges and process optimization carried out for 5 different DAF materials. Process feasibility study and dicing optimization were conducted on 100 mum thick wafers. Subsequently the DAF materials were assembled into a ball grid array (BGA) package and subjected to reliability testing (Moisture Sensitivity Level 3, Unbiased Highly Accelerated Temperature and Humidity Stress Test and Temperature Cycling). Results showed that minimum chipping and whisker formation can be achieved using a 2-step dicing process with optimized cutting depths and feed rate. It was also found that optimum adhesion of the DAF material to both the dicing tape and die backside is necessary to prevent "flying die" during dicing and die pick-up problem during die attachment. Positive results for 2 DAF materials were obtained from reliability performance assessment. These findings show that there is a robust DAF material and process for thin die and System-in-Package (SiP) applications.
Overview and emerging challenges in mechanical dicing of silicon wafers
An overview and emerging challenges in mechanical dicing of silicon (Si) wafer are discussed from view point of narrow kerf, thin wafer, chip strength enhancement, Copper (Cu)/low-k wafers and dicing challenges for emerging technologies.
Phytochemical and FT-IR Spectral Analysis of Certain Bamboo Species of SouthIndia
Bamboo with its varied uses has historically been an integral part of livelihoods and lifestyles in India. The present study was carried out to characterize the bioactive constituents present in the leaf extracts of certain bamboo species using Fourier transform infrared spectroscopic analysis (FT-IR). The various solvent extracts of various bamboo leaves subjected to qualitative analysis showed the availability of phytoconstituents including alkaloids, phenolic compounds, flavonoids, saponins, glycosides, terpenoids, steroids, coumarins and phytosterols. Quinones were completely absent in all the five bamboo species. The FT-IR spectrum confirmed the presence of sulphides (SS), phenols (C-O), aromatic compounds, thiols (S-H), aliphatic compounds (C-Cl) and amines (NH) in different bamboo species. The present investigation has also opened avenues for further research into the development of potent phytomedicines from different bamboo species.