Improving the reliability of radar T/R module with precise cleaning technology
Because we adopt high precision microelectronic assembly technologies during the manufacturing of radar T/R modules, these modules are complex and delicate. Common cleaning technologies such as ultrasonic cleaning can't satisfy the requirement of high precision cleaning of these modules. This article introduces some precise cleaning technologies, these cleaning technologies not only can make T/R module achieve a high cleanness, but also does little harm to them, and they will greatly improve the reliability of T/R module.
A new bumping process using lead-free solder paste
In this paper, we report development of a new process for lead-free solder bumping with no flux residues, using stencil printing and hydrogen radicals, which can lessen both the environmental load and the manufacturing cost of solder bumping. In this process the reduction of the hydrogen radicals, instead of the flux, will eliminate the surface oxides of the stencil printed lead-free solder paste. Sn-3.0Ag-0.5Cu lead-free solder paste, which contains no residue flux was printed on an 8-in wafer. Hydrogen plasma was radiated for a minute during the reflow process, and the printed paste formed a bump. Reflow experiments without hydrogen radicals treatment were also carried out for comparison, where no successful reflow could be observed.
The Alzheimer's Disease Home Hospice Knowledge Scale: development, validity and reliability.
BACKGROUND
Several instruments are available to assess knowledge about hospice care, but none specifically address knowledge about home hospice for persons with Alzheimer's disease (AD).


AIM
To develop and validate the Alzheimer's Disease Home Hospice Knowledge Scale (AD-HHK-S).


METHODS
A total of 107 Israeli family caregivers of persons with dementia (mean age=71.2; 73% female) participated in the study.


RESULTS
The AD-HHK-S included 28 true/false items assessing 3 areas of knowledge: knowledge about hospice, knowledge about home hospice, and knowledge about home hospice for AD. Good internal reliability was found, with Cronbach alpha ranging from 0.72 to 0.85. Good face, construct and predictive validity were found.


CONCLUSIONS
The AD-HHK-S proved to be a valid and reliable tool to assess knowledge about hospice care in the area of AD. It might provide an effective tool for palliative care nurses to communicate with family caregivers of persons with AD at the end of life.