Dissolution of electrically inactive phosphorus by low temperature annealing
In this study we investigate the dissolution of electrically inactive phosphorus complexes by low temperature annealing after the POCl3 diffusion process. This has the immediate consequence that the existing near-surface emitter volume SRH recombination can be reduced. Thereby, a significant reduction of emitter saturation current density j0E is achieved without driving the emitter further into the silicon substrate. For short-term temperature treatments well below the POCl3 diffusion temperature, a reduction of up to -60 fA/cm2 has been achieved. This study increases our understanding of the formation and dissolution of electrically inactive phosphorus complexes during post-annealing processes.
Impact of Extended Contact Cofiring on Multicrystalline Silicon Solar Cell Parameters
During the temperature spike of the contact cofiring step in a solar cell process, it has been shown that the concentration of lifetime-killer dissolved metallic impurities increases, while adding an annealing after the spike getters most of the dissolved impurities toward the phosphorus emitter, where they are less detrimental. The contact cofiring temperature profile, including the after-spike annealing, has been called extended contact cofiring, and it has also been proposed as a means to decrease the emitter saturation current density of highly doped emitters, thus benefiting a wide range of materials in terms of detrimental impurity content. The aim of the present work is to determine the effect of performing this additional annealing on contact quality and solar cell performance, looking for an optimal temperature profile for reduction of bulk and emitter recombination without affecting contact quality. It presents the effect of the extended cofiring step on fill factor, series resistance, and contact resistance of solar cells manufactured with different extended cofiring temperature profiles. Fill factor decreases when extended cofiring is performed. Series resistance and contact resistance increase during annealing, and this happens more dramatically when the temperature peak is decreased. Scanning electron microscopic images show silver crystallites in contact with silver bulk before the annealing that allow a direct current path, and silver crystallites totally surrounded by glass layer (>100 nm thick) after annealing. Glass layer redistribution and thickening at low temperatures at the semiconductor-metal interface can be related to the series resistance increase. Degradation of series resistance during the temperature spike, when it is below the optimum one, can also be attributed to an incomplete silicon nitride etching and silver crystallite formation. To make full use of the beneficial effects of annealing, screen-printing metallic paste development supporting lower temperatures without a thick glass layer growth is needed.
The Meaning of Wisdom in James: Examination of a Hypothesis
The following essay is an attempt to examine the manner in which the writer of the Epistle of James uses the concept of Wisdom; and to study the suggestion that the way in which he uses it is more or less interchangeable with that in which other writers of the New Testament use the concept of the Holy Spirit.