Fabrication and Characterization of Si Substrate-Free InGaN Light-Emitting Diodes and Their Application in Visible Light Communications
Visible light communications with InGaN-based light-emitting diodes (LEDs) grown on large-diameter (6-inch) and cost-effective Si (111) substrates are investigated experimentally. During epitaxial growth, the transition layers consisted of the step-graded AlGaN buffers incorporated with three low-temperature-grown (∼900 °C) AlN interlayers on AlN/Si substrates that are used to compensate for thermally induced tensile stress and to maintain a reasonable crystalline quality of GaN-on-Si LEDs. Strong light absorption from Si can be prevented by fabricating a Si substrate-free InGaN LED with a composite metal coating of Al/Ag/Al multilayer, providing improved adhesive strength and reflectivity comparable to the unitary Ag film. In comparison with GaN-on-Si LEDs, stripping Si substrates combined with the use of a highly reflective bottom mirror (Al/Ag/Al multilayer) reflected a more intense emission pattern corresponding to a 2.2 times (@ 190 mA) increase in light output power in thin-film LEDs. In addition, a 1.8 times (@ 160 mA) increase in optical channel bandwidth is achieved by using thin-film LEDs as optical transmitters. A direct line-of-sight optical link using the proposed thin-film LEDs achieved data transmission rates of up to 100 Mb/s over a distance of 100 cm, indicating that the proposed LEDs have potential for use as optical transmitters in indoor visible light communications.
High-Efficiency and Crack-Free InGaN-Based LEDs on a 6-inch Si (111) Substrate With a Composite Buffer Layer Structure and Quaternary Superlattices Electron-Blocking Layers
In this paper, a composite buffer layer structure (CBLS) with multiple AlGaN layers and grading of Al composition/u-GaN1/(AlN/GaN) superlattices/u-GaN2 and InAlGaN/AlGaN quaternary superlattices electron-blocking layers (QSLs-EBLs) are introduced into the epitaxial growth of InGaN-based light-emitting diodes (LEDs) on 6-inch Si (111) substrates to suppress cracking and improve the crystalline quality and emission efficiency. The effect of CBLS and QSLs-EBL on the crystalline quality and emission efficiency of InGaN-based LEDs on Si substrates was studied in detail. Optical microscopic images revealed the absence of cracks and Ga melt-back etching. The atomic force microscopy images exhibited that the root-mean-square value of the surface morphology was only 0.82 nm. The full widths at half maxima of the (0002) and (101̅2) reflections in the double crystal X-ray rocking curve were ~330 and 450 respectively. The total threading dislocation density, revealed by transmission electron microscopy, was <; 6× 108 cm-2. From the material characterizations, described above, blue and white LEDs emitters were fabricated using the epiwafers of InGaN-based LEDs on 6-inch Si substrates. The blue LEDs emitter that comprised blue LEDs chip and clear lenses had an emission power of 490 mW at 350 mA, a wall-plug efficiency of 45% at 350 mA, and an efficiency droop of 80%. The white LEDs emitter that comprised blue LEDs chip and yellow phosphor had an emission efficiency of ~110 lm/W at 350 mA and an efficiency droop of 78%. These results imply that the use of a CBLS and QSLs-EBL was found to be very simple and effective in fabricating high-efficiency InGaN-based LEDs on Si for solid-state lighting applications.
Branch-point energies and the band-structure lineup at Schottky contacts and heterostrucures
Empirical branch-point energies of Si, the group-III nitrides AlN, GaN, and InN, and the group-II and group-III oxides MgO, ZnO, Al2O3 and In2O3 are determined from experimental valance-band offsets of their heterostructures. For Si, GaN, and MgO, these values agree with the branch-point energies obtained from the barrier heights of their Schottky contacts. The empirical branch-point energies of Si and the group-III nitrides are in very good agreement with results of previously published calculations using quite different approaches such as the empirical tight-binding approximation and modern electronic-structure theory. In contrast, the empirical branch-point energies of the group-II and group-III oxides do not confirm the respective theoretical results. As at Schottky contacts, the band-structure lineup at heterostructures is also made up of a zero-charge-transfer term and an intrinsic electric-dipole contribution. Hence, valence-band offsets are not equal to the difference of the branch-point energies ...