컨벤션 정보원천 및 정보내용탐색이 컨벤션목적지 방문만족도 및 충성도에 미치는 영향
This study was to investigate information sources and a degree of information search of convention destination that affect convention destination visitors" satisfaction and loyalty. From the literature revew the survey questionnaire was developed and data were collected from 344 useful samples at KINTEX & COEX. The target sample were visitors who had the convention destination information search experience. Factor and multiple regression were performed the factor analysis delineated 7 underlying factors related to information source such as outdoor advertisement, a public institution guide & travel agency, internet advertisement & specialized magazine, blog & SNS, mass media, organizer homepage/institution site & brochure, personal information source. And 4 different convention information search were confirmed such as convention destination service information, the background & introduce of convention or organizer, agenda & schedule, program. The resutls showed that information sources and search influence covention destination visitors" satisfaction and loyalty. More theorectical and practical implication were discussed in the conclusion section.
Traditional Culture Experience Art Research
This thesis is about studying work on interactive media art painting bamboo by playing the daegeum making daegeum, traditional korean musical instrument, as a new interface based on digital. Noble men of the Chosun Dynasty painted Mookjookdo for correcting land building spirit. Daegeum is also called as an instrument for spiritual exercising as it has fine and full sound to comfort joys and sorrows of noble men. The symbolization which matches with daegeum works well together continuously in Mookjookdo and finishes the work. In this painting, breathing(daegeum performance) leads aloof mind state for approaching nature of the art. The purpose of this art is to have international communication between cultures by reinterpreting traditional culture content to digital. Therefore, with the result of this art, it proves that it is the interactive work as a new form to enjoy internationally through international exhibition and thesis.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.