Hot-stage transmission electron microscopy study of phase transformations in hexacelsian (BaAl2Si2O8)
Phase transformations in synthetic hexacelsian were investigated by hot-stage transmission electron microscopy. A second phase transformation from an orthorhombic to hexagonal structure was identified in the synthetic hexacelsian at approximately 700 °C. The hexacelsian was found to exhibit a sequence of phase transformations on heating of hexagonal (P6 3 /mcm)-orthorhombic (Immm)-hexagonal (P6/mmm). Antiphase domain boundaries, which were observed in P6 3 /mcm and Immm phases, were absent in the P6/mmm phase. Crystal symmetries of the three phases were determined by convergent beam electron diffraction, and space group symmetries were derived by comparison of experimental selected area electron diffraction patterns with computer-simulated patterns.
Hexagonal-Orthorhombic Phase Transition and Ferroelasticity in K2SO4 and K2SeO4
It is shown that (011) and (031) twin planes can be introduced in the orthorhombic phase of K 2 SO 4 and K 2 SeO 4 , and both twin planes can be moved smoothly through crystals by appropriate external stress in the temperature range from about 300°C to the orthorhombic-hexagonal phase transition point. It is inferred from the crystal structure in the orthorhombic phase that SO 4 - (or SeO 4 - ) radicals must have two stable states (the up and down states), and change from one state to another during the passage of twin planes. It is suggested that the space group of the hexagonal phase is D 6h 4 –P6 3 /mmc, and the hexagonal-orthorhombic phase transition is essentially due to the ordering of SO 4 - (or SeO 4 - ) radicals.
Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder
Abstract In order to obtain high-strength aluminum joints, ultrasonic soldering of 1070 aluminum was conducted under liquidus temperature of Sn–Zn hypereutectic solder. A device for ultrasonic soldering was assembled, which propagated ultrasonic vibrations in a direction perpendicular to joining surfaces. This device joined 1070-Al using quasi-melting Sn–Zn hypereutectic solder without using any artificial spacers. The strength of the solder joints was evaluated by tensile tests. The optimum joining conditions were determined, and the effects of solder compositions and soldering temperature on the joint strength and the solder layer thickness were examined. In this ultrasonic soldering process, the highest tensile strength was obtained for the solder joints fabricated at 220 °C for the Sn–23Zn and Sn–40Zn solder compositions. The joint strength was equivalent to that of 1070-Al heat treated at 220 °C. The sound joints were obtained at 300 °C using Sn–82Zn solder, the liquid phase volume fraction of which was theoretically only 0.24. The present work also revealed that the thickness of retained solder layer in the joint after ultrasonic soldering could be estimated. Accordingly, ultrasonic soldering under the liquidus temperature of Sn–Zn hypereutectic solder could be a spacer-free soldering method to obtain high-strength aluminum joints.