SOFT LAW SEBAGAI SEBUAH STRATEGI : STUD KASUS PIAGAM ASEAN (ASEAN CHARTER)
Abstrak One indicator of the effectiveness of cooperation can be seen from: whether the agreement is soft law or hard law. Cooperation with soft law form  tends to be ineffective because there is no binding consequences, while  hard law form tend to be effective because the consequences are binding. Interestingly, countries drafting their cooperation in the form of soft law, at the expense of the effectiveness of their cooperation. By taking a case study of the ASEAN  Charter, this article came to the conclusion that soft law chosen as a strategy to secure national interests when cooperation assessed no longer profitable. Key Word: Hard Law, Soft Law, Strategy
Legal Issue in the Matter of Cross-Border Insolvency in Indonesia Based on Law No. 37 Of 2004 on the Insolvency and Postponement of Debt Payment Obligation
The issue of cross-border insolvency is growing rapidly in line of the global economic movement. The foreign elements on insolvency process raises question on the States’ jurisdiction, the Court’s authority to adjudicate the case of cross-border insolvency, the recognition of Indonesia’s court decision on insolvency in another State, as well as the issue of Curator’s authority to cooperate with another State officials. In Indonesian insolvency law, the issue of cross-border insolvency is limitedly regulated and unable to resolve the arising legal issues. The inconsistency of the application on territoriality and universality principle in Law No. 37 of 2004 on the Insolvency and Postponement of Debt Payment Obligation causes the difficulty on executing the insolvency assets in another State’s territory and vice versa. Thus, an adequate cross-border insolvency legal framework is required to provide legal certainty for the business actors in Indonesia by adopting the existing legal framework through international agreements and reforming the Indonesian insolvency law.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.