Proposed New Method for Separating Isotopes
RECENTLY1 a double mercury discharge vessel was used (Fig. 1), in which a large current running in the outer vessel irradiated the small current discharge in the inner vessel with 2537 Å resonance radiation. This irradiation caused the running voltage and electron temperature in the inner discharge to be reduced appreciably over the non-irradiated mode of operation. The explanation offered was that the neutral Hg atoms in the inner vessel absorbed the resonance radiation and entered the 63P1 state (see Fig. 2), and from this level the atom was ionized by electron impact. In addition the 63P0 and 63P2 metastable levels are populated from the 63P1 level by electron collisions and by cumulative absorption and radiative decay of higher levels. Because the radiation field is doing approximately half the ionization work, the electron temperature drops correspondingly.
The role of liver stromal cells in dendritic cells development in mice.
The inherent tolerogenicity of liver allografts may be due to tolerogenic dendritic cells (DC) therein. It is not clear whether the unique antigen-presenting function of liver DC is intrinsic or whether it is altered by microenvironmental factors in the liver. In the present study, we investigated the effect of hepatic stellate cells (HSC) on the development and function of DC propagated from bone marrow. DC exposed to HSC or HSC supernates expressed low CD11c, CD86, and major histocompatibility complex class II and elicited inferior allostimulatory function compared with conventional DC. These results suggested that soluble factor(s) secreted from HSC influence DC development.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.