Patterning issues for the fabrication of sub-micron memory capacitors' electrodes
This paper describes some of the key issues associated with the patterning of metal electrodes of sub-micron (especially at the critical dimension (CD) of 0.15 μm) dynamic random access memory devices. Due to reactive ion etching lag, the Pt etch rate decreased drastically below the CD of 0.20 μm and thus K-th storage node electrode with the CD of 0.15 μm could not be fabricated using the Pt electrodes. Accordingly, we have proposed novel techniques to surmountly-the above difficulties. The Ru electrode cannot for the stack-type structure is introduced and alternative multischemes based on the introduction of the concave-type selfstructure upto using semi-Pt or Ru as an electrode material are outlined respectively.
Thin film deposition on plastic substrates using silicon nanoparticles and laser nanoforming
Abstract Reduced melting temperature of nanoparticles is utilized to deposit thin polycrystalline silicon (c-Si) films on plastic substrates by using a laser beam without damaging the substrate. An aqueous dispersion of 5 nm silicon nanoparticles was used as precursor. A Nd:YAG (1064 nm wavelength) laser operating in continuous wave (CW) mode was used for thin film formation. Polycrystalline Si films were deposited on flexible as well as rigid plastic substrates in both air and argon ambients. The films were analyzed by optical microscopy for film formation, scanning electron microscopy (SEM) for microstructural features, energy dispersive spectroscopy (EDS) for impurities, X-ray photoelectron spectroscopy (XPS) for composition and bond information of the recrystallized film and Raman spectroscopy for estimating shift from amorphous to more crystalline phase. Raman spectroscopy showed a shift from amorphous to more crystalline phases with increasing both the laser power and irradiation time during laser recrystallization step.
Plasma etching : an introduction
D.L. Flamm and G.K. Herb, Plasma Etching Technology. An Overview. D.L. Flamm, Introduction to Plasma Chemistry. S.A. Cohen, An Introduction to Plasma Physics for Materials Processing. D.M. Manos and H.F. Dylla, Diagnostics of Plasmas for Materials Processing. A.R. Reinberg, Plasma Etch Equipment and Technology. J.M.E. Harper, Ion Beam Etching. G.K. Herb, Safety, Health, and Engineering Considerations for Plasma Processing.