Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices
Abstract Commercial-grade plastic encapsulated semiconductor devices are now widely used in space and military equipment for their cost-per-performance and availability advantages over military type ceramic parts. However, many equipment manufacturers still perceive risks in their deployment, and conduct expensive and time-consuming screening and qualification programs to mitigate the potential risks associated with their use. This paper discusses the limitations of the screening and qualification approach currently employed by space equipment manufacturers to assess the long-term reliability of commercially-available plastic encapsulated semiconductor devices (PEDs) in deep space missions. In addition, the paper presents the value of the high temperature operating life (HTOL) data published by manufacturers of PEDs for mitigating the risks associated with the use of such devices in long-duration space applications, where steady-state temperature is the significant stress parameter.
Mechanism analysis of plastic encapsulated DC/DC converters with unweldable pins
The plastic encapsulated DC/DC converters have been widely used in data communication, oa equipment, industrial instruments etc. in these years. One of the fundamental problem which obstacle to its further application is the unreliability of the pins. In light of a batch of plastic encapsulated DC/DC converters with unweldable pins, four group contrast experiments are designed to analyze the failure mechanism. The four group components have the same type, the same manufacturer and different batches. The experiment consists of external inspection, SEM, energy spectrum analysis, solderability test and burn-in test. The results show that the inadequate storage during the past 6 years causes the pins' corrosion of the plastic encapsulated components. Then the corrosion becomes serious in the follow-up series of experiments, and leads to a decrease of the components' solderability. Eventually the batch of plastic encapsulated DC/DC converters fail. From the comparison, the direct cause of the failure is wet storage environment.
Long-Term Non-Operating Reliability of Electronic Products
Non-operating reliability assessment electrical failure mechanisms corrosion failure mechanisms corrosion failure mechanisms radiation failure mechanisms mechanical failure mechanisms lon-term non-operating reliability of selected electonic products testing and maintenance a framework for non-operating relaibilty assessment.