Building Energy Analysis Programs
Building Energy Analysis Computer Programs consist of Loads, Systems, Plant, and Economic sub-programs. They are used by engineers and architects in the design and analysis of energy efficient building envelopes, heating, ventilating, and air conditioning, electrical and other service systems. The historical development of energy analysis programs is presented, the methodologies used in various programs are compared, and areas for future improvements are discussed.
Bibliography on available computer programs in the general area of heating, refrigerating, air conditioning and ventilating. Research project
The descriptions of computer programs included in this bibliography were developed to inform potential program users of the programs available, what the programs do, and who to contact for more information. The computer programs described are arranged alphabetically by sections according to the type of computation being performed: (1) Heating and/or Cooling Load Calculation Programs containing the calculation of heating and/or cooling loads for a building or zone; (2) Energy Analysis Programs concerning the estimation of the annual energy consumption of buildings; (3) Duct Design Programs used to assist in the areas of duct sizing, cost estimating, and sound analysis; (4) Piping Design Programs classified either as pipe sizing programs or as pipe flexibility programs; (5) Equipment Selection Programs containing the selection of HVACR equipment; and (6) Solar Programs that include collector area and performance characteristics, storage capacity, building load, and weather data to predict the performance of the solar heating and/or cooling system.
Fully Integrated Bidirectional CMOS-MEMS Flow Sensor With Low Power Pulse Operation
Leveraging More-than-Moore technology, we demonstrate an integrated CMOS MEMS flow sensor via a very compact system on chip (SoC) that can sense the bidirectional N2 gas flow. Our SoC features a very low-noise instrumentation amplifier that is implemented on a CMOS wafer and serves as a readout integrated circuit for a thermoresistive micro-calorimetric flow sensor which is fabricated on a MEMS wafer. A compact heterogeneous integration is achieved by combining the two wafers via the proprietary InvenSense AlN process. The measured sensitivity of our CMOS MEMS flow sensor is 98 mV/sccm which is three times better than the state-of-the-art counterpart. The flow range measured by our SoC is from −26 to 26 m/s (from −50 to 50 sccm). Moreover, the pulsed heater operation makes this proposed SoC flow sensor a very low power (<9 mW) and, thus, a promising candidate for the Internet-of-Things applications in smart home/green buildings.