Ar-Rahnu (Islamic Pawning Broking) Opportunities and Challenges in Malaysia
This paper aims to identify the key factors that have contributed to the existence and the growth of Ar-Rahnu (Islamic pawn broking scheme) in Malaysia. Based on the previous studies and cost of borrowing analysis, this paper found that the need for interest (riba) free, transparent transaction and low cost short-term cash borrowing scheme is much preferred by the pawning customers. Besides that the cost of borrowing in this scheme is the lowest compared to the conventional pawn broking scheme. However, the Ar-Rahnu scheme needs to address central issues such as the marketing, public awareness and the locations of this scheme.
The Development Of Islamic Pawnbroking in Malaysia, Application and ITS Challenges
Islamic Pawn Broking industry, known as Ar Rahnu, have since received tremendous support in the Malaysian market, especially amongst micro, small and medium entrepreneurs. The pioneer of Ar Rahnu in Malaysia was Muassasah Gadaian Islam Terengganu(MGIT) introduced in 1992. This paper aims to provide a review on the development of Ar Rahnu and discuss on the application of Ar Rahnu in Bank Rakyat Malaysia Berhad. The study employs the previous studies and engages an interview session with the staff of Ar Rahnu Bank Rakyat. In the early stage of ArRahnu establishment, the demand was influenced by the Muslim societies to obtain financing based on the Shariah principle. Simultaneously, with the effort of the Malaysian government to promote the development of Islamic pawn broking industry, the demand for Ar-Rahnu services increase continuously. The industry has tremendously contributed to the Muslim economy because it plays an important role as a means of community service that fulfil the desperate needs of low income families. It also acts as a source of capital to small businesses that provides quick and easy source of financing as compared to loans from commercial banks. More importantly, this paper also attempts to highlight on the existing challenges of Ar Rahnu,with respect to its growth and development.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.