A matched expansion probe card for high temperature LSI testing
This paper describes the fabrication process and mechanical properties of a novel probe card were described. To match the thermal expansion between the probe card and a silicon wafer in wafer-level burn-in test, a Pyrex glass substrate with feedthrough connections was used to support the probes. To make the slantwise probe contactors, spray coating was used to form a uniform photoresist film on a deeply-wet-etched silicon wafer. The fabricated probe card has 13185 p/sup +/ silicon probe contactors at a pitch of 150 /spl mu/m on an area of 44.0 mm /spl times/ 45.7 mm. The rigidity of the probes is approximately 91.45 N/m. The planarity of the probe tips is within /spl plusmn/ 1 /spl mu/m from the base level.
Glass Substrate with High Density Electrical Feedthroughs
This paper reports a novel method to produce high density feedthrough glass wafers with sufficient thickness for the packaging and interconnection of high density array micro electromechanical systems (MEMSs). Pyrex glass wafers with thin film metal lines on the surface are stacked and bonded with each other using phenyl methyl siloxane-based adhesive. The stacked glass wafer block is then sliced using a wire saw as the slicing surfaces vertically cross the adhesive bonding interfaces. Prototyped feedthrough glass wafers were subjected to anodic bonding to a silicon wafer with diaphragms. The anodic bonding was successful, but hermetic sealing was not achieved. Also, the bending of the bonded sample is large in the direction of stacking of the original glass wafers. The causes of these problems were investigated, and the solution was proposed.
Improvement Of Solder Joint Reliabilty Between Multilayer Ceramic Package And Printed Wiring Board
Ball grid array (BGA) packages for MPU semicondactor device arc conside:-cd as r-epLacements of pin grid array packages, looking for smaller size, thinner thick:less, higiier wiriig density and higher performance. A thermal coefficient of expansioi-.(TCl<) xi.smaich between the A I , O , ceramic BGA and the printed wiring board(PWB) during a thermal faLigue cdLsed a large s t r e s s at solder joints. According to the result. or ficite elercent ) sin~uia~bior:, we conf.rmed that a minimum stress value was obtained when t k e target TCE LC wds 3-14po1n;~L'. wc developed a high TCE new ceramic material. eriaiare ?i.Sppn/'C and 114GPa,respectively. By the temperature c y c l ir.9 test, we hdve con a, tP.at 6 relaxation of the thermal stress drastically increased t h e solder j o i n t r ng ';ho big?. TCD ceramic package. The TCE and the Young's Kodu .us of ~ l i l