Fault tree analysis on kinematic accuracy of wafer stage using BDD and DFTA technique
Based on the structure and operation mechanism of the dual-stage lithographic system, fault tree analysis for the key subsystem, wafer stage, is performed. Since the system is very complexity, the BDD (binary decision diagram) and DFTA (dynamic fault tree analysis) technique are introduced to make up the disadvantages of the traditional static FTA (fault tree analysis) method. Event “The kinematic accuracy of wafer stage can't meet the goal” is installed as the top event of the fault tree. Central factors affecting the kinematic accuracy of the wafer stage is identified through the study.
Reliability Analysis of Satellite System Based on Dynamic Fault Tree
As a high reliability product,satellite system has very complicated redundancy structures.This paper investigated reliability analysis of satellite system with Dynamical Fault Analysis(DFT),especially the processing method of static subtree and dynamic subtree in DFT analysis.Binary Decision Diagram and Markov method are applied in the DFT modeling of satellite key devices to process static subtree and dynamic subtree,respectively.The results are compared with those using other methods,such as Reliability Block Diagram,Markov,etc.
The interaction of low energy ion beams with surfaces
Abstract Four of the most important physical processes which occur during ion plating and allied techniques are (1) ion-induced (and energetic-atom-induced) desorption of adsorbed impurities from the substrate surface, (2) ion penetration and entrapment in the substrate and coating, (3) ion-induced sputtering of substrate and coating atoms and (4) recoil displacement of substrate and coating atoms leading to their intermixing. The ion and energetic atom energy range of importance is from thermal energies to the order of 1 keV. Current understanding of these processes, supported by discussion of available experimental data, is reviewed in this paper.