Interferometric microscope with true color imaging
Optical 3D profilers based on Coherence Scanning Interferometry (CSI) provide high-resolution non-contact metrology for a broad range of applications. Capture of true color information together with 3D topography enables the detection of defects, blemishes or discolorations that are not as easily identified in topography data alone. Uses for true color 3D imaging include image segmentation, detection of dissimilar materials and edge enhancement. This paper discusses the pros and cons of color capture using standard color detectors and presents an alternative solution that does not rely on color filters at the camera, thus preserving the high lateral and vertical resolution of CSI instruments.
3D Interferometric Microscope for Topography and Real Color Imaging in Industrial Applications
This paper describes an application for 3D microscopes based on white light interferometry as a metrology tool for certain applications in the semiconductor industry. One application is the measurement of narrow and high aspect ratios through silicon vias. Another application has more visual and detection aspects of sample evaluation based on a real color image of a measured sample as obtained with white light interferometry.
Microstructure of the solder-casting zone in bridges of dental gold alloys.
The composition and structure were studied in the cast and in the solder of bridges which had failed clinically. Both materials were gold alloys but with different contents of Pt, Ag and Zn. The metallographic investigation revealed defects mostly in the solder, situated in the subsurface layer. SEM studied of the fracture surface revealed large porosites and a structure of dense parallel lines--striations--, indicating that the material had failed from fatigue. The materials in the fractured bridges were identified by micro-probe measurements. It was stated that cast material and solder material used together, were of different composition.