Compositional Study of Indian Five Rupee Coin by EDXRF Technique
Energy dispersive X-ray Fluorescence technique has been used to study five rupee indian coins of years 1992,1993,1994,1999,2009,2010,2011 and 2012 for their material/ elemental compositions. EDX-720 spectrometer provided with X-ray tube and Si(Li) detector having energy resolution 165 eV at 5.9KeV Mn K X-ray. Different metal compositions like Cupro-Nickel, NickelBrass and Ferritic Stainless-Steel (FSS) with traces of Mn, Cr, S, Si, Cl have been found in present investigation. Modern coins are found with amendment in composition that replaces Cupro-Nickel, Nickel-Brass. Variation in weights of coins have been observed from 9 to 6 gm.
Archaeological applications of spectroscopic measurements. Compatibility of analytical methods in comparative measurements of historical Polish coins
Abstract The ED-XRF (energy-dispersive X-ray fluorescence) compact system was used to analyze selected Polish historical coins. The compact X-ray tube developed in the National Centre for Nuclear Research (NCBJ) was used as an X-ray source in the system designed for the ED-XRF studies. The XRF spectra were recorded with the Amptek SDD spectrometer. The elemental compositions of the coins have been determined using above mentioned system and the results were compared to those obtained with WD-XRF method. Other techniques such as SEM-EDX and XRD were also included into this work for comparison. The experimental data show that the X-ray system with transmission type X-ray tube with silver anode operating at 50 kV/30 µA which was developed in NCBJ together with the Amptek SDD spectrometer is an effective tool for chemical composition analyze of historical coins and can be successfully used in archaeometry.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.