114 untethered UUV dives: lessons learned
The Ocean Engineering Division at the Naval Command Control and Ocean Surveillance Center RDT&E Division (NRaD) has developed and field tested two successive untethered, supervisory controlled UUV systems: a prototype, and an improved model. These robotic vehicle systems were part of the Advanced Unmanned Search System (AUSS) programme. It was only after the prototype was fielded, many lessons were learned. As a consequence of the prototype experience, the improved model was developed. The second system was a complete redesign, using state-of-the-art subsystems and technologies. The resulting product was both capable and reliable, yet flexible, creating a plethora of system evolutionary possibilities. Sea tests, improved tactics, and systems engineering became synergistic and interactive. AUSS involved pioneering research in underwater search and in UUV systems. Important knowledge was also gained in systems analysis, system engineering, and program evolution. Invaluable experience was gained from 114 successful untethered dives. The purpose of this paper is to share many of the lessons learned during the AUSS program.
Unmanned Ground Vehicle (UGV) Lessons Learned
Abstract : The purpose of this effort is to compile Lessons Learned from the unmanned ground vehicle (UGV) programs that could be relevant to the objectives of the Very Shallow Water (VSW) Mine Countermeasures (MCM) and Explosive Ordnance Disposal (EOD) Unmanned Underwater Vehicle (UUV) program. Even though the operational environments of the UGV programs and the UUV program are significantly different, Lessons Learned could save the VSW MCM UUV program considerable time and resources. The domain of relevant Lessons Learned could include program management and contracting, operational concepts, sensor processing and navigation control software, multivehicle coordination processes, and other related robotics technologies.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.