Structural and luminescent properties of terbium doped strontium titanate xerogel
We report on synthesis and photoluminescence of sol-gel derived terbium doped strontium titanate on monocrystalline silicon and in the porous anodic alumina matrix. The microstructure and morphology of the samples are analyzed by X-ray diffraction and scanning electron microscope analyses. The thickness of the spin-on films deposited on silicon is about 115 and 170 nm due to the annealing temperature 750 and 1000 °C respectively. The samples reveal terbium luminescence in the visible range.
Inhomogeneous nanostructured honeycomb optical media for enhanced cathodo- and under-x-ray luminescence
Photo-, radio-, and pulse cathodoluminescence spectra from sol-gel derived titania, doped with strontium and terbium, deposited on porous anodic alumina (PAA) films are reported. The morphology and qualitative elemental depth distributions have been examined by transmission electron microscopy, scanning electron microscopy, and radio-frequency glow discharge optical emission spectroscopy. PAA films with pore and cell sizes ranging from 170 to 190 and 240 to 270 nm, respectively, have been generated on aluminum and monocrystalline silicon substrates followed by spin-on sol-gel derived coating with the subsequent thermal treatment. The resultant PAA surface is not coated with a continuous xerogel film; the xerogel is mainly distributed near the pore bases, leaving much of the pore volume unfilled. The xerogel/PAA structures reveal terbium-related luminescence under x-ray excitation and cathodoluminescence. The same xerogels generated on monocrystalline silicon revealed no cathode- or under-x-ray luminescence. Thus, PAA enhances strongly the cathode- and under x-ray luminescence from terbium and strontium-doped titania xerogels confined in the porous matrix. The fabricated structures are considered as a type of low-cost, thin-film convertor of x-rays, and cathode ray irradiation into visible light, with an average cell size of the convertor of about 250 nm.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.