Watermark induced High Density Via failures in sub micron CMOS fabrication
High via resistance was detected in the high density via structure in our 0.15 mum BEOL (Back-End-Of-Line) yield monitoring test vehicle. A localized insulating layer was found on top of plug in test vehicle causing high via resistance. The failure was attributed to watermark induced contaminants on top of the W plug. It was shown that the failure could be avoided by eliminating watermark formation on the wafer in the post CMP cleaning process.
Development of spin-on-glass process for triple metal interconnects
Spin-on-glass (SOG), an interlayer dielectric material applied in liquid form to fill narrow gaps in the sub-dielectric surface and thus conducive to planarization, is an alternative to silicon dioxide (SiO2) deposited using PECVD processes. However, its inability to adhere to metal and problems such as cracking prevent the easy application of SOG technology to provide an interlayer dielectric in multilevel metal interconnect circuits, particularly in university processing labs. This paper will show that a thin layer of CVD SiO2 and a curing temperature below the sintering temperature of the metal interconnect layer will promote adhesion, reduce gaps, and prevent cracking. Electron scanning microscope analysis has been used to demonstrate the success of the improved technique. This optimized process has been used in batches of double-poly, triple-metal CMOS wafer fabrication to date.
Damage initiation and propagation in composite shells subjected to impact
Abstract The paper investigates the impact-induced damage initiation and propagation for laminated composite shells under low-velocity impact. A three-dimensional eight-node non-conforming element is described to analyze interlaminar stress distribution, and progressive failure. The damage analysis is performed by using Tsai–Wu quadratic failure criterion, Tsai’s damage modes and an additional delamination formula at all Gaussian points. The damage modes considered are matrix cracking, fiber breakage and delamination. The progressive failure is expressed by reducing stiffness of the material at all failed Gaussian points. Special attention is centered on curved laminates. Impact energy threshold for the onset of damage and transient damage size are predicted for composite shells. The analyses of the flat and curved laminates are compared for discussing their different damage mechanism. In addition, the influence of the stacking sequence, the thickness and the radius of curvature on damage behavior of composite shells are studied.