A batch-mode assembly and packaging technology for 3-axis tri-fold inertial measurement units
This paper reports a batch-mode generic 3-D precision assembly and wafer-level packaging technology for 3-axis tri-fold inertial measurement units (IMUs) using silicon mounting jig wafers with embedded vacuum channels. This approach allows use of optimized single-axis IMUs without manufacturing and structural constraints of forming 3-axis in a chip, and improving the overall yield by testing the chips prior to 3-D assembly. The 3-D chip assembly is performed by a controlled sequence of vacuum through the channels and bottom access holes, ambient pressurization, and raise of temperature to form permanent rigid tri-fold bond to the jig wafer.
A tri-fold inertial measurement unit fabricated with a batch 3-D assembly process
This paper reports a tri-fold inertial measurement unit (IMU) that is fabricated with a batch-mode 3-D assembly process. Each chip of a tri-fold die includes a single axis z-gyroscope and 0-2 lateral-accelerometers. The tri-fold dies are batch-mounted on sidewalls of silicon cavities on a wafer to form 6-axis IMUs. The accelerometer has a measured bias instability of 6.8 μg and a noise floor of 66 μg/rt-Hz. The gyroscope has a measured bias instability of 29 °/hr and an angle random walk of 0.020 °/s/rt-Hz (1.2 °/rt-hr).
The Problems and Opportunities in Developing International Business Programs
This paper discusses the results of a survey conducted among AACSB member schools. The survey dealt with two major topical areas. These were (a) what types of International Business programs currently exist in AACSB Schools, and (b) problems associated with these programs. The paper also suggests countries that offer opportunities to Colleges of Business to pursue countty-specific programs.