Full Color AM-LCDs on Flexible Glass Substrates
We have realized a full color 4-inch quarter-VGA amorphous Silicon AM-LCD on 75 μm flexible glass substrates. The overall thickness of the LC cell is <170 μm. With this work we demonstrate that the incorporated ultra-thin glass substrates have suitable properties to be compatible with a standard color AM-LCD process and achieve active matrix backplanes with reliable
Active Matrix Color-LCD on 75  $\mu$m Thick Flexible Glass Substrates
We have demonstrated a full color 4-in quarter-VGA amorphous silicon active-matrix (AM) LCD (AM-LCD) with 75 μm thick flexible glass backplane and frontplane substrates. The device was built directly on the flexible glass without using a processing carrier or additional protective layers. The overall thickness of the LC cell is <; 170 μ m. Process modifications were made to accommodate the flexibility and reduced thickness of the substrate. These process changes were related to: thin film deposition, photolithography, cell assembly and filling, glass scribing, and driver bonding. The achieved results indicate that the incorporated flexible glass substrates are compatible with the fabrication of high quality color AM-LCDs.
A flexible 2.1‐in. active‐matrix electrophoretic display with high resolution and a thickness of 100 μm
Abstract— A paper‐thin QVGA, flexible 2.1‐in. active‐matrix electrophoretic display (AMEPD) that features 100‐μm thick and a 192‐ppi resolution has been developed. An LTPS‐TFT backplane with integrated peripheral driver circuits was first fabricated on a glass substrate and then transferred to a very thin (30‐μm) plastic film by employing surface‐free technology by laser ablation/annealing (SUFTLA®). A micro‐encapsulated electrophoretic imaging sheet was laminated on the backplane. A supporting substrate was used to support the LTPS‐TFT backplane. Fine images were successfully displayed on the rollable AM‐EPD. The integrated driver circuits dramatically reduce the number of external connection terminals, thus easily boosting the reliability of electrical connections even on such a thin plastic film.