A solution to the MCSP problem considering physical layer degradations in transparent optical networks
In all-optical networks, the physical layer impairments cause a degradation in the transmitted signal. Sometimes, the degradation causes an inadmissible Optical Signal to Noise Ratio (OSNR), which is translated into blocking due to low quality of transmission. The Impairment Aware -- Routing and Wavelength Assignment (IA-RWA) should choose the route and wavelength considering the physical layer impairments. The Choice of the Best Combination among M Combinations of Shortest Paths (MCSP) problem consists of choosing the best of the shortest paths for a network topology aiming to reduce the blocking probability. This paper presents a pioneer study of the MCSPs problem assuming Amplified Spontaneous Emission (ASE), co-wavelength crosstalk, self-wavelength crosstalk, neighbor wavelength crosstalk, Polarization Mode Dispersion (PMD) and attenuations caused by fiber and devices. In this context, we propose a new routing algorithm that aims to resolve the MCSP problem considering the physical impairments.
The choice of the best among the shortest routes in transparent optical networks
This work introduces the problem of the best choice among M combinations of the shortest paths for dynamic provisioning of lightpaths in all-optical networks. To solve this problem in an optimized way (shortest path and load balance), a new fixed routing algorithm, named Best among the Shortest Routes (BSR), is proposed. The BSR's performance is compared in terms of blocking probability and network utilization with Dijkstra's shortest path algorithm and others algorithms proposed in the literature. The evaluated scenarios include several representative topologies for all-optical networking and different wavelength conversion architectures. For all studied scenarios, BSR achieved superior performance.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.