Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration
Materials with high thermal conductivity and thermal expansion coefficient matching with that of Si or GaAs are being used for packaging high density microcircuits due to their ability of faster heat dissipation. Al/SiC is gaining wide acceptance as electronic packaging material due to the fact that its thermal expansion coefficient can be tailored to match with that of Si or GaAs by varying the Al:SiC ratio while maintaining the thermal conductivity more or less the same. In the present work, Al/SiC microwave integrated circuit (MIC) carriers have been fabricated by pressureless infiltration of Al-alloy into porous SiC preforms in air. This new technique provides a cheaper alternative to pressure infiltration or pressureless infiltration in nitrogen in producing Al/SiC composites for electronic packaging applications. Al-alloy/65vol% SiC composite exhibited a coefficient of thermal expansion of 7/spl times/10/sup -6/ K/sup -1/ (25/spl deg/C-100/spl deg/C) and a thermal conductivity of 147 Wm/sup -1/K/sup -1/ at 30/spl deg/C. The hysteresis observed in thermal expansion coefficient of the composite in the temperature range 100/spl deg/C-400/spl deg/C has been attributed to the presence of thermal residual stresses in the composite. Thermal diffusivity of the composite measured over the temperature range from 30/spl deg/C to 400/spl deg/C showed a 55% decrease in thermal diffusivity with temperature. Such a large decrease in thermal diffusivity with temperature could be due to the presence of micropores, microcracks, and decohesion of the Al/SiC interfaces in the microstructure (all formed during cooling from the processing temperature). The carrier showed satisfactory performance after integrating it into a MIC.
Production and characterization of a three-dimensional cellular metal-filled ceramic composite
Silicon carbide in the form of a foam network was vacuum infiltrated with aluminum alloy A356 to produce a new Interpenetrating Composite material. The foam, once infiltrated with a second phase transforms into a composite where two distinct, continuous, three-dimensional network structures are formed. The advantage of this metal matrix composite is its high strength-to-weight ratio for use in lightweight applications such as electronic packaging materials. The electroless nickel coating and vacuum infiltration procedures are developed. Materials characterization of the composite is evaluated by microstructural and compositional analysis, and density, porosity, and nano-indentation measurements. Selected experimental mechanical and thermal property measurements are performed to understand its properties and compare against theoretical models. Results show the final composite to have lower density than conventional electronic base plate packaging materials with low porosity. The composite has an increased Young's modulus and flexural strength to that of the unreinforced alloy and comparable impact toughness to composites with 50–70 vol% SiC particles but with only 12 vol% SiC. The fracture surface of the matrix illustrates conventional fibrous fracture and brittle cleavage whilst the reinforcement struts show signs of layer de-bonding from their SiC layered structure.
Ignition and burning rates of segregated waste combustion in packed beds.
Recent developments in national recycling and re-use programmes for municipal waste have led to segregation of an increasing proportion of waste to enhance material recovery. Several of the segregated streams contain materials that can not viably be re-used or recycled but can be used for energy recovery. In this study, the combustion of cardboard and waste wood was investigated in a small-scale packed bed reactor in order to provide fundamental data for the design/operation of moving bed furnaces. Key parameters of combustion including the ignition and burning rates were evaluated for various air flowrates and compared to the modelling results. Two successive stages of combustion were identified for both samples: the propagation of ignition front into the bed and combustion of the fuel above the ignition front. The burning rate of cardboard reached a peak of about 300 kg/m(2)h at the air flowrate of 936 kg/m(2)h and decreased at higher air flowrates. For waste wood, both the ignition and burning rates increased in the tested range of the air flowrate up to 702 kg/m(2)h, of which the values were very close to those for the cardboard. The model prediction was in good agreement with the test results for waste wood. However, the burning rate for cardboard was under-predicted due to strongly irregular shapes of the fuel.