In situ endpoint detection by pad temperature in chemical-mechanical polishing of copper overlay
As the number of metal levels and the wafer size increase, the global planarity and effective removal of metal overlay across the wafer becomes more crucial. Chemical-mechanical polishing (CMP) has been recognized essential to achieve this goal. Accurate in situ endpoint detection and monitoring method significantly improves the yield and throughput. Previous methods have been proposed, which either require the rearrangement of the machine set-up, or can only be implanted on certain types of machines. In this study, a model for pad temperature capable of predicting the endpoint of CMP in situ is established based on the total consumed kinematic energy between wafer and pad. Limited assumptions of thermal and kinematic conditions are made. The model of temperature rise uses the integral of the relative polishing speed and is verified by on-line measurement. Since the coefficient of friction between the pad and dielectric layer is distinguishably lower than that between the pad and the metal layer, the pad temperature increases milder than polishing the metal layer. In use of the proposed regression method applied to the measured temperature rise, the endpoint of the process can be detected.
Lubricating behavior in chemical–mechanical polishing of copper
Abstract In this work, we simulated the Cu-chemical–mechanical polishing (Cu-CMP) using a laboratory model system. By comparing with the classic lubrication study, a “Stribeck Curve” for CMP was generated. Results indicated that the hydrodynamic lubrication regime was never reached. Based on these results, we propose a contact-polishing mode for CMP.
Evolution of carbide precipitates in Hastelloy N joints during welding and post weld heat treatment
Abstract The effects of welding and post weld heat treatment (PWHT) on the morphology, composition and lattice parameter of the precipitates in the welding joints of Hastelloy N alloy have been investigated. Joint samples were prepared using a gas tungsten arc welding process with ERNiMo-2 fillers, and then solid-solution treated at 1100 °C for 20 min. After welding, eutectic M6C carbides can be observed in the heat affected zones (HAZ) and weld zones (WZ). These eutectic M6C carbides become spheroidized during the following PWHT. The concentration of Si decreases during the transformation from the primary ones to eutectic ones, and then increases during the spheroidizing process. The total concentration of Si + Cr in M6C carbides remains stable during welding and PWHT. At the same time, the heat leads to the outward diffusion of Mo from the M6C carbides, which results in a decrease of the lattice parameter.