Integration of Building Information Modeling (BIM) and LEED's Location and Transportation Category
The selection and development of a project location is critical to the success of a green building project. LEED (Leadership in Energy and Environmental Design) is one of the most popular Green Building certification systems in the world. Traditionally in LEED design, architects and designers have to analyze project location based on traditional maps with manual calculations, which require a significant amount of time and effort. In the meantime, the advent of Building Information Modeling (BIM) has brought about a promising new way of improving Green Building’s location analysis. This research presents an integration model of BIM in LEED certification to improve the efficiency of LEED’s location and transportation analysis. The framework of the integration model is introduced and demonstrated using a user interface for LEED’s analysis under the Autodesk Revit environment.
LEED Public Transportation Accessibility and Its Economic Implications
AbstractThe LEED (Leadership in Energy and Environmental Design) environmental certification system has developed as a standard for sustainable project planning, though research into its economic impacts have been limited. The main objective of this study is to investigate the economic impacts that two LEED public transportation access (PTA) components, a bus and a light rail system, have on appraised values of land parcels. This study developed a predictive model to quantify the impacts that the two LEED PTA components would have on the appraised unit values of unimproved land parcels. First, a LEED PTA indication map using geographical information system (GIS) was created to randomly select unimproved parcels. Second, the PTA-qualified parcels were selected from the unimproved parcels to use for this study. Lastly, a multiple linear regression method with a one-way ANOVA analysis was performed to predict the unit value of selected parcels by analyzing how the appraised unit value ($ft2) of parcels was a...
Fully Integrated Bidirectional CMOS-MEMS Flow Sensor With Low Power Pulse Operation
Leveraging More-than-Moore technology, we demonstrate an integrated CMOS MEMS flow sensor via a very compact system on chip (SoC) that can sense the bidirectional N2 gas flow. Our SoC features a very low-noise instrumentation amplifier that is implemented on a CMOS wafer and serves as a readout integrated circuit for a thermoresistive micro-calorimetric flow sensor which is fabricated on a MEMS wafer. A compact heterogeneous integration is achieved by combining the two wafers via the proprietary InvenSense AlN process. The measured sensitivity of our CMOS MEMS flow sensor is 98 mV/sccm which is three times better than the state-of-the-art counterpart. The flow range measured by our SoC is from −26 to 26 m/s (from −50 to 50 sccm). Moreover, the pulsed heater operation makes this proposed SoC flow sensor a very low power (<9 mW) and, thus, a promising candidate for the Internet-of-Things applications in smart home/green buildings.