Application of Acoustic Agglomeration to Reduce Fine Particle Emissions from Coal Combustion Plants
Removal of fine particles (smaller than 2.5 μm) from industrial flue gases is, at present, one of the most important problems in air pollution abatement. These particles, which are hazardous because of their ability to penetrate deeply into the lungs, are difficult to remove by conventional separation technology. Sonic energy offers a means to solve this problem. The application of a high-intensity acoustic field to an aerosol induces agglomeration processes which changes the size distribution in favor of larger particles, which are then easier to precipitate with a conventional separator. In this work, we present a semiindustrial pilot plant in which this process is applied for reduction of particle emissions in coal combustion fumes. This installation basically consists of an acoustic agglomeration chamber with a rectangular cross-section, driven by four high-power and highly directional acoustic transducers of 10 and/or 20 kHz, and an electrostatic precipitator (ESP). In the experiments, a fluidized be...
Acoustic separation and electrostatic sampling of submicron particles suspended in air
We investigate experimentally the effects of acoustic forces on submicron aerosol in a channel flow. This technique can potentially overcome some of the limitations of conventional separation syste ...
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.