Research on gas-liquid-solid insulation system in stator slot
In evaporative cooling turbogenerator, all structures are immersing in evaporative cooling medium. Evaporative cooling turbogenerator which is transformed from inner water-cooling turbogenerator has been developed successfully. However, it has not taken full advantage of evaporative cooling medium's superiority in insulation. Besides, the amount of cooling medium is relatively large. This paper redesigns and analyzes gas-liquid-solid insulation system in stator slot from the perspective of the evaporative cooling technology. Furthermore, this paper provides the most appropriate materials and optimum thickness for solid insulation layer and fixed insulation layer in new insulation system. At last, this paper discusses wrapping width and interval of fixed insulation layer by three-dimensional model of new-designed insulation system.
Simulation for researching stator insulation structure of 135MW evaporative cooling turbo-generator by marinating
In order to apply evaporative cooling technical to a high voltage and large capacity turbo-generator that will be used for a main power generator, the problem of designing reasonable insulation structure is needed to be solved. This paper offers immerging evaporative cooling stator, according to its specialties. This paper calculates and analysis the electric field and the temperature field in immerging evaporative cooling stator insulation structure in detail, then summarizes the distribution rules or specialties of these two fields. As results this paper gives the stator insulation thickness which is reduced greatly compared with traditional one and the current density , aiming to 135 MW evaporative cooling turbo-generator. The conclusion has been tested and is worthy of using for reference.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.