Wear of Diamond-impregnated Bit in Drilling Engineering Ceramic
This paper describes experimental results using a scanning electron microscope (SEM) to observe the face of diamond-impregnated bit after its drilling engineering ceramic. Wear patterns and mechanisms were analyzed. The results show that several diamond wear patterns are found in the bit face including complete crystal shape, micro fragmentation, extensive fragmentation, whole fragmentation, wearing flat and particle shattered, bond abrasion mainly is in the form of shifting sand pattern, alternating thermal stress and mechanical stress are the main reasons which lead to the diamond wear, extrusion force, friction as well as abrasive debris erosion result in the shifting sand pattern of the bond.
Study on the diamond tool drilling of engineering ceramics
Abstract A method for drilling holes in engineering ceramics by using a diamond tool has been developed. In this method, a drilling tool rotates with fixed abrasives. The machining mechanism of drilling based on the fracture mechanics concept is analyzed, and a new theoretical model of the material removal rate is proposed. According to this model, the material removal rate increases in accordance with the increase of the static load applied, the rotational speed of the drilling tool, and the grain size of the abrasive. Selecting 99.5% Al2O3 ceramics as the workpiece material, experiments have been carried out. The results show that diamond drilling is an effective method for machining engineering ceramics.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.