The Struggle toward Equality in Higher Education:The Impact of the Morrill Acts on Race Relations in Virginia, 1872-1958
iv Chapter 1: Background on the Passage of the Morrill Act and its Effect on Virginia 1 Chapter 2: Virginia Tech’s Establishment in Accordance with the 1862 Morrill Act 31 Chapter 3: The Establishment and Operation of Virginia State University 47 Chapter 4: Education, Agriculture, and Race Relations in Virginia 78 Chapter 5: Federal and State Responsibility for the Effects of Segregation in Virginia’s public higher education system 92
The Education of Engineers in America before the Morrill Act of 1862
The traditional view of antebellum colleges, as exemplified by the works of Richard Hofstadter and others, depicts them as dogmatic, elitist, inflexible, and hostile both to science and to more practically oriented subjects, such as engineering. Only in recent decades have scholars disputed this view. Stanley Guralnick in 1975 challenged the contention that antebellum colleges were antagonistic to science, demonstrating that they made extraordinary and successful efforts to modify their curricula and add faculty to increase science offerings. Shortly after, in 1982, Colin Burke published a broadly based, quantitative study of antebellum colleges which revealed that they were far more successful, accessible, adaptable, and progressive than previously recognized.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.