Critical Temperature to Dielectric Degradation of Printed Circuit Board
Dielectric degradation of printed circuit board based on the thermal properties in an open-air environment was investigated. With increase of the temperature, the copper electrodes were oxidized from Cu 2O to CuO; the base material of epoxy laminate was thermally affected to the change of molecular structure and degradation of dielectric properties. With increase of the temperature, the capacitance and surface resistance decreased, the thermal stimulated current increased and showed a valley value near 450 K and a peak value near 490 K
New high-density multilayer technology on PCB
We have developed a new high-density multilayer technology on PCB (Printed Circuit Board), named DSOL (Deposited Substrate On Laminate) technology. The first characteristic of the DSOL technology is the dielectric fabrication, which uses a new photosensitive material, a bulky fluorene unit bonded epoxy acrylate resin. The fluorene based resin has interesting properties such as good electrical properties, low curing temperature (160/spl deg/C) for a heat-resistant resin (glass transition temperature: 230/spl deg/C), low coefficient of thermal expansion (40 ppm), and high resolution. In particular, the dielectric formation process has the advantage that fine and high-aspect-ratio via holes are formed on FR-4 laminates through exactly the same process and manufacturing facilities as a conventional photosensitive epoxy resin. The second characteristic is the technology which patterns fine-pitch copper conductors using a semi-additive process with a sputtering method. This technology makes 40 /spl mu/m pitch lines on large-area laminates possible, as this process consists of flash wet etching of only 0.3 /spl mu/m thick sputtered thin-films. We have successfully developed a high-density packaging substrate for high-pin-count area array ASIC (Application Specific Integrated Circuit) chips (3828 pins). A high-density substrate based on the DSOL technology is the most suitable for achieving high-density packages (MCMs, CSPs, and BGAs) using fine-pitch and area array interconnection technologies.
Professional support in rural New South Wales: perceptions of new graduate occupational therapists.
OBJECTIVE
To explore the experiences of professional support among new graduates working in rural New South Wales, including the current availability of professional support and the impact of support levels on professional practice.


DESIGN
Qualitative, using semistructured face-to-face or telephone interviews.


SETTING
New graduate occupational therapists employed in public and private hospitals and community health services in rural New South Wales.


SUBJECTS
Nine new graduate occupational therapists within their first year of practice.


MAIN OUTCOME
A description of participant experiences of professional support and strategies to enhance the recruitment and retention of occupational therapists in rural areas.


RESULTS
Participants reported varied experiences of professional support and emphasised the importance of having access to a wide variety of resources. Participants highlighted that professional support could assist in developing independence and other skills. However, ultimately a lack of support resulted in decreased confidence and subsequent decreased job satisfaction among participants.


CONCLUSIONS
The findings suggest that greater effort should be directed to ensuring that all new graduates have access to professional support, including structured supervision, and that strategies be explored and adopted to ensure that this occurs.