Effect of laminar air flow on probe burn for spring probe
This paper investigates transient heat transfer between a heated spring probe and its air environment. A continuum finite volume simulation is used to analyze of heat flow within and from the resistively heated probe to its environment. Experimental results are conducted for spring probe with laminar air flow and without air flow. The numerical results and experimental results are compared and very good agreement is observed.
Wafer test probe burn modeling and characterization
This study investigates the wafer probe temperature distribution along a probe body in order to model probe burn phenomenon by using computational mechanics techniques. The finite volume software is used to study the effects of different materials and different geometrical factors on the temperature along a special design vertical/spring and cantilever probe. The computation shows higher temperatures towards the probe tip region as a result of Joule heating. The probe burn is also observed at the tip region of spring and cantilever probes in wafer testing. This is believed to be due to very low heat dissipation rates resulting from very small sizes compared to the probe body.
Physical Analysis of Data on Fused-Open Bond Wires
Peddy's experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.