Underwater sound radiation by a layered infinite elastic plate with discontinuity
The underwater sound radiation from layered structu re is determined by the properties of elastic waves in the structure and by interaction between structural/structur al waves and between structural/fluidal waves. In t his paper, a model of a layered infinite plate is used to addres s how the properties and interaction influence the near field and far field characteristics of the radiated sound. In par ticular, the effect of structural discontinuity int roduced to the layered plate by a finite signal conditioning plate on unde rwater sound radiation is investigated. The scatter ing of structural waves in the layered plate by the signal conditioni ng plate is used to explain the changes in the radi ated sound due to the discontinuity.
Three-dimensional elasticity model for a decoupling coating on a rectangular plate immersed in a heavy fluid.
This paper presents an analysis of the vibroacoustic response of a finite, simply supported rectangular plate covered by a layer of decoupling material and immersed in a heavy fluid. An exact formulation using the three-dimensional theory of elasticity for the decoupling material is derived for this problem, thereby extending previous studies that were limited to infinite plates. The paper details the constitutive equations of the problem and the analytical method of solution. Numerical results show that shear waves in the decoupling material generally have little influence on the sound radiation in the heavy fluid. Comparisons with a locally reacting model of the decoupling material and with the simple model of House [Proc. I.O.A. 13(3), 166-173 (1991)] are also presented.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.