Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding
With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-to-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. the material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.
Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems
In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests.
Hygroscopic Expansion of some Casting Investments
CREDIT is generally given to Taggart1 for introducing the cast gold inlay to the dental profession. Although he realized that gold shrinks when cooled from molten state to solid state of room temperature, the investment available to him did not supply sufficient compensation. In 1910, Van Horn2 published a paper dealing with a method by which he obtained the compensation by means of wax expansion. The next major research in connection with this problem was the work of Coleman3 at the National Bureau of Standards. He determined the gold shrinkage to be 1.25 per cent and presented a casting technic with compensation values of quantitative nature. The total compensation for the gold shrinkage was obtained by the combination of the setting and thermal expansion of the mold. This procedure is the general practice followed at the present time for compensation. There are some disadvantages to this method. Skinner has indicated the difficulty of obtaining smooth castings and the improper compensation for the casting shrinkage.4 It has been found by Hollenback5 and Scheu6a that castings made at a high temperature are rougher than those made at a low temperature (450° C.), depending upon the great difference in thermal expansion between plaster of Paris and silica, which causes a poor union of the fine particles. This may also result in friability and there may be some warpage due to the differential expansion. A method which provides sufficient compensation at a low mold temperature is the hygroscopic casting technic.b Wilson7 showed that certain plasters expand as much as 0.0044 inch to the inch by taking up moisture from the air. With this information at hand, Scheula, b tested some commercial investment to determine what results the addition of moisture would have. He found6b: (1) All of the casting investments that were tested expanded. (2) The thicker the mix, the greater the expansion. (3) A mix with hot water expanded more than one with cold water. (4) The time at which the mix is placed in the water is of great importance. It was found that if the mix is placed in the water early, it would not expand so much as when placed in a little later. It was also found that if the mix was placed in the water after a certain time, it could not expand to the maximal amount. (5) The temperature of the water in which the mix is placed is important, for two reasons; (a) the temperature of the water controls slightly the expansion of the investment, and (b) water at a temperature of 1000 F. slightly softens the wax pattern so that the fine margins are not marred while expansion is taking place. The mix should remain in the water at least 20 minutes to obtain the full expansion, after which time no further expansion is obtained.