Polymer waveguide end facet roughness and optical input/output coupling loss for OPCB applications
Electro-optical printed circuit board technology (EOCB) based on integrated planar polymer optical waveguides has been the subject of research and development for many years to provide a cost viable, fully integrated system embedded optical interconnect solution, however a number of constraints of this technology have yet to be overcome. Optical coupling loss at the input and output of the waveguides is one of the major issues and waveguide end facet roughness is one of the main sources of the coupling loss which is investigated in this paper. The results of a comprehensive investigation of the end facet roughness of multimode polymer waveguides, fabricated on FR4 printed circuit boards, PCBs, and its effect of optical loss are presented theoretically and experimentally. The waveguide end facet roughness was measured using an atomic force microscope, AFM, when the waveguides were cut using a milling router with various numbers of cutting edges called flutes. The optimized cutting parameters are derived and the optical coupling loss, between the laser source and the waveguide, due to the different roughness magnitudes is measured by experiment for the first time. To improve the surface quality and decrease the waveguide optical loss, a new fabrication technique for reducing the end facet roughness after cutting is proposed and demonstrated. The insertion loss was reduced by 2.60 dB ± 1.3 dB which is more than that achieved by other conventional methods such as index matching fluid.
Integrated optical and electronic interconnect PCB manufacturing research
Purpose – The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.Design/methodology/approach – Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator.Findings – Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides...
Study on Transmission Characteristics of Vertical Rail Vibrations in Ballast Track
A plane half-track model and a periodic track-substructure model are established. The spectral element method and spectral transfer matrix method are developed and applied to investigate the track decay rate (TDR) and transmission rate (TR) of the vertical rail vibrations, which can reflect the transmission characteristics in the longitudinal and downward directions, respectively. Furthermore, the effects of different track parameters on TDR and TR are investigated. The results show that the antiresonance frequency of the rail and the out-of-phase resonance frequency of the rail and sleeper form the boundary frequencies of the high-attenuation zone for longwise vibration transmission, where the vibration absorption of the sleeper is significant. The downward transmissibility of vertical rail vibrations is greatest around the antiresonance frequency of the rail. Vertical rail vibrations are primarily transmitted in the downward direction at low frequencies, while they are mainly transmitted along the rail at high frequencies. Stiffer rail pads can make more vibrations transmitted downwards to the sleeper above the antiresonance frequency of the rail, while the changes of other track parameters have different effects on the transmission characteristics. Additionally, a field measurement is performed for verification, and the simulations are well consistent with measurements.