Behaviour of Normal Concrete Us ing Superplasticizer under Different Curing Regimes
The performance of concrete primarily depends upon the type and ratio of its constituents, compaction, curing conditions and admixtures used during curing process. Part of this research emphasis to calculate the consequences on strength of concrete when water-cement ratio is constant and the increase in slump occurs with the increase in amount of superplasticizer by percentage. The rest of the investigation is carried out to study the effects of superplasticizer with different dosages under different curing regimes at an ambient field temperature ranges between 45°C-50°C. For this purpose, a concrete mix at 20MPa with all parameters constant was prepared by using an ASTM C494 type A, and F, anionic melamine polycondensate non-toxic superplasticizer with no chlorides. Different dosages of superplasticizer were used in different batches of all 95 specimens, and cured under different curing conditions and then tested for compressive and tensile strengths following ASTM standards. In all cases, th e water curing up to 28 days testing showed maximum strength. The highest and lowest values of compressive strength were obtained with the addition of 0.5% and 1% superplasticizer respectively. It was found that without increasing the W/C ratio, the addition of superplasticizer exhibits increase in strength.
Effect of addition time of a superplasticizer on cement adsorption and on concrete workability
Abstract The effect of addition time of a naphthalene-based superplasticizer (SNF) on the adsorption behavior on type I Portland cement slurries and on the concrete workability was studied. Test results indicate that the adsorption behavior of SNF on cement particles follows a Langmuir isothermal adsorption model. As the addition time increases, the saturated adsorption amount of SNF decreases sharply at the beginning and then more slowly. In comparison, the concrete workability decreases slightly in the early phase and then falls off abruptly. Most importantly, the transition points in both cases appear to be the same, at about 10–15 min. This strongly suggests that a close relationship exists between the SNF adsorption behavior on cement particles and the workability of concrete. In addition, the optimum addition time of SNF to concrete should be in this period, which corresponds to the beginning of the dormant period of the cement hydration process.
Bevel RIE application to reduce defectivity in copper BEOL processing
Bevel etch used during wafer fabrication for semiconductor devices is discussed. In this case, the bevel etch process was utilized in middle of the line processing (MOL) to reduce back end of line (BEOL) defectivity. Tungsten and titanium nitride films, from the formation of contacts to the transistors, extend into the bevel region of the wafer and have been shown to initiate arcing. This can spread foreign material defects on the front side of the wafer in various BEOL post processing steps including subsequent reactive ion etching, SEM metrology and film depositions. The bevel etch tool confines a plasma etch to the outer edge of the front side of the wafer (which can be individually adjusted) and can remove dielectric, organic and Ti/TiN/W films using a fluorine based chemistry.