Three dimensional packaging and interconnecting techniques for microwave modules
Three dimensional (3D) packaging and interconnecting techniques can greatly reduce the weight and volume of conventional planar microwave modules. The objective of this study was to employ a novel 3D structure with simple manufacturing process to develop 3D microwave modules. Many advanced 3D packaging and interconnecting methods, such as LTCC microwave multichip modules, vertical interconnects, and 3D electromagnetic field analyzing and optimizing, were applied to increase the package density and improve the electric performance. Test method and test results of 3D microwave modules were introduced. These techniques are very useful to many types of modern active phased array radar systems and communication systems.
Advanced interconnecting techniques of integrated T/R modules
The basic requirements for transmit/receive(T/R) modules of active phased array radar systems are small volume and light weight with excellent microwave performance and uniformity. The objective of this study was to employ new interconnecting techniques to develop high density, integrated T/R modules. Many advanced interconnecting methods were applied to increase the package density and improve the electric performance. High density, integrated T/R modules with good microwave performance and uniformity were manufactured successfully. These techniques are very useful to many types of modern active phased array radar systems.
Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability
The operation frequency of Transmit/Receive (T/R) module for active phased-array radar is very high (at least above 1000 MHz). The ground connection between the back side metal plating of the functional elements and the substrate carrier of the T/R module is so important that it can directly affect the performance and reliability of the functional elements and T/R module. In this paper, the following techniques are studied: conduction and reliability of the via hole between top side and back side of the thin film or thick film microwave circuit substrate, control of soldering stress and deformations; solderability of available materials; and soldering processing technology. Highly reliable T/R modules are successfully manufactured by using soldering in place of screws.