Copper(I) electrode function of two types of copper(II) ion-selective electrodes.
The response of two types of solid-state copper ion-selective electrodes with homogeneous membranes of CuAgSe and Cu(2-x)Se has been investigated in copper(I) solutions, prepared electrochemically by insitu generation from a copper anode in chloride medium. The selectivity coefficient K(pot)(Cu+, Cu(2+)) both types of electrodes has been determined. It is 10(-5.7) for the copper selenide sensor, and 10(-6.2) for the copper silver selenide one. These values are very close to that calculated for an exchange reaction proceeding on the electrode surface. The similarity in K(pot)(Cu+ ,Cu(2+)) values for different chalcogenidebased sensors suggests a common potential-generating mechanism. High chloride concentration does not interfere with the electrode response towards Cu(I), but distorts the electrode response to Cu(II).
The chalcocite copper membrane electrode.
The membrane electrode based on a synthetic chalcocite (Cu(2)S) single crystal responds primarily to the activity of copper(I) ions in solution. The experimental selectivity coefficient with respect to copper(II) ions is in good agreement with the value calculated on the basis of solubility products of both sulphides. The electrode has been calibrated with metal-ion buffers containing a strongly complexing ligand. TETREN, and can be used as an indicator in titrations of copper with EDTA and TETREN. Comparison of an experimental titration curve with one calculated with the aid of the program HALTAFALL showed good agreement in the case of TETREN, but there were discrepancies for the EDTA titration, which are attributed to the presence and complexation of copper(I) ions. The electrode has also been applied in metal titrations with Cu(2+) as indicator ion, though the potential changes observed were smaller than predicted. All titrations showed errors less than 1%.
Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder
Abstract In order to obtain high-strength aluminum joints, ultrasonic soldering of 1070 aluminum was conducted under liquidus temperature of Sn–Zn hypereutectic solder. A device for ultrasonic soldering was assembled, which propagated ultrasonic vibrations in a direction perpendicular to joining surfaces. This device joined 1070-Al using quasi-melting Sn–Zn hypereutectic solder without using any artificial spacers. The strength of the solder joints was evaluated by tensile tests. The optimum joining conditions were determined, and the effects of solder compositions and soldering temperature on the joint strength and the solder layer thickness were examined. In this ultrasonic soldering process, the highest tensile strength was obtained for the solder joints fabricated at 220 °C for the Sn–23Zn and Sn–40Zn solder compositions. The joint strength was equivalent to that of 1070-Al heat treated at 220 °C. The sound joints were obtained at 300 °C using Sn–82Zn solder, the liquid phase volume fraction of which was theoretically only 0.24. The present work also revealed that the thickness of retained solder layer in the joint after ultrasonic soldering could be estimated. Accordingly, ultrasonic soldering under the liquidus temperature of Sn–Zn hypereutectic solder could be a spacer-free soldering method to obtain high-strength aluminum joints.