Effect of sleeve length on deformation properties of grouted splices
Tests on 12 grouted splices were performed to investigate their deformation properties under tensile loading. Test variables included diameter and type of spliced bars and the size of splicing sleeves. Finite element method based models of the splices were built, verified and used to investigate the effect of sleeve length on the deformation properties of the grouted splices. The sleeve length significantly affected the failure modes and further affected the splices’ deformation properties. A recommendation was proposed to maximize deformation properties of a specific splice by using a critical sleeve length associated with failure mode of bar fracture.
Experimental study on bond behavior between high-strength grout and deformed steel bars
Abstract Engineers use high-strength grout to connect precast concrete members for its low shrinkage and good fluidity. This paper designed 87 central pull-out specimens using the control variable method to investigate the influence of factors on the rebar-grout bond property such as compressive strength, steel grade, bar diameter, transverse stirrups, and bond length. The test result showed that improving grout compressive strength (85.8 MPa–122.7 MPa) cannot improve the bond strength, which was different from the previous conclusions of concrete pull-out tests. Simplified formulas were presented for calculating the characteristic values of bond strength, residual strength, peak slip, and relative slip of load-holding platform based on parameter analysis. Then, a constitutive model was proposed to predict the full-range bond stress-slip curve of high-strength grout and steel bar specimens from bearing to failure. Finally, FEA models were established to evaluate the applicability and accuracy of the constitutive model.
Fully Integrated Bidirectional CMOS-MEMS Flow Sensor With Low Power Pulse Operation
Leveraging More-than-Moore technology, we demonstrate an integrated CMOS MEMS flow sensor via a very compact system on chip (SoC) that can sense the bidirectional N2 gas flow. Our SoC features a very low-noise instrumentation amplifier that is implemented on a CMOS wafer and serves as a readout integrated circuit for a thermoresistive micro-calorimetric flow sensor which is fabricated on a MEMS wafer. A compact heterogeneous integration is achieved by combining the two wafers via the proprietary InvenSense AlN process. The measured sensitivity of our CMOS MEMS flow sensor is 98 mV/sccm which is three times better than the state-of-the-art counterpart. The flow range measured by our SoC is from −26 to 26 m/s (from −50 to 50 sccm). Moreover, the pulsed heater operation makes this proposed SoC flow sensor a very low power (<9 mW) and, thus, a promising candidate for the Internet-of-Things applications in smart home/green buildings.