Intense red upconversion emission of Yb/Tm/Ho triply-doped tellurite glasses.
By conventional melting and quenching methods, 3Yb2O3-0.2Tm2O3-xHo2O3 (wt%, x=0.2~1.2) was doped into an easily fiberized tellurite glass with composition of 78TeO2-10ZnO-12Na2O (mol%) to form YTH-TZN78 glasses. Under 976 nm excitation, the direct sensitizing effect of Yb ions (Yb→Ho) and indirect sensitizing and self-depopulating effects of Tm ions (Yb→Tm→Ho) were found to present intense red upconversion emission at 657 nm (Red, Ho:5F5→5I8) and were responsible for the absence of the usually observed 484 nm emission (Blue, Tm:1G4→3H36). Regardless of the dopant concentration of Ho ions, the intensity of the red emission at 657 nm (Red, Ho:5F5→5I8) is about three times stronger than that of the green one at 543 nm (Green, Ho:5S2→5I8). For this certain red emission at 657 nm, 0.4 wt% Ho2O3-doped YTH-TZN78 glass was found to present the highest emission intensity and is therefore determined as a promising active tellurite glass for red fiber laser development.
Visible and near infra-red up-conversion in Tm3+/Yb3+ co-doped silica fibers under 980 nm excitation.
The spectroscopic properties of Tm(3+)/Yb(3+) co-doped silica fibers under excitation at 980 nm are reported. Three distinct up-conversion fluorescence bands were observed in the visible to near infra-red regions. The blue and red fluorescence bands at 475 and 650 nm, respectively, were found to originate from the (1)G(4) level of Tm(3+). A three step up-conversion process was established as the populating mechanism for these fluorescence bands. The fluorescence band at 800 nm was found to originate from two possible transitions in Tm(3+); one being the transition from the (3)H(4) to (3)H(6) manifold which was found to dominate at low pump powers; the other being the transition from the (1)G(4) to (3)H(6) level which dominates at higher pump powers. The fluorescence lifetime of the (3)H(4) and (3)F(4) levels of Tm(3+) and (2)F(5/2) level of Yb(3+) were studied as a function of Yb(3+) concentration, with no significant energy back transfer from Tm(3+) to Yb(3+) observed.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.