“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
An adjoint method based approach for optical waveguide design in thin glass sheets using ion-exchange processes
This work addresses an approach based on adjoint method to calculate a sensitivity matrix for solving the inverse design problem of ion-exchange process for optical waveguide manufacturing. According to Fick's law the ion-exchange process can be mathematically described using diffusion's equation. This partial differential equation (PDE) can be used to derive another PDE of its adjoint state. A sensitivity matrix can be obtained after solving both PDEs using Finite-Element-Method (FEM). Finally, an optimization routine using the sensitivity matrix is developed for the inverse design problem.
5.63 and 5.80 MeV levels of Ne20; de-excitation branching
Abstract The ratio Г γ /Г for the 5.63 and 5.80 MeV levels of Ne 20 has been determined to be 0.077 (±0.008) and −4 , respectively, by using the C 12 (C 12 , α)Ne 20 reaction and determining the fraction of the events in which the alpha-particle and the Ne 20 recoil are present in coincidence at the kinematically correct angles. In both cases these results in themselves are shown to imply radiative E1 transition (5.63→1.63 and 5.80→0, respectively) probabilities ⪡5 × 10 −5 Weisskopf units. When taken together with the life-time for the 5.63 MeV level measured by Evans et al . values of Г( E1 ) ≲ 5 × 10 −6 and Г α ≈ 6% of the particle estimate are obtained for this state.