Using DOE to improve COB bonbability
In recent years, the Chip-on-Board (COB) package technology has become popular in semiconductor industries. The COB technology, in which the dies are directly mounted onto a printed circuit board (PCB) with bonding wires connecting the die and leads. Besides solder bumps, wire bonding is still the most popular interconnect method. With the development of wire bonding technology in the COB package, we can realize advanced processes with good performance by new wire bonding equipment and more powerful software. However, there are still many challenges to be overcome in the bonding process. In this paper, we did experiments to optimize the bonding parameter using 1.0mil Au wire on COB and successfully found the optimal range of bonding parameters through DOE (Design Of Experiment). By the optimal solution, we further improved the bondability; the second bonding quality was also improved by using BSOB (Bond Stitch On Ball) bonding.
Optimizing process conditions using design of experiments - A wire bonding, semiconductor assembly process case study
The striking competitiveness of modern-day companies is more than ever a direct function of their ability to implement high yielding processes and continuous optimization. Such optimization, however, is becoming increasingly harder to realize, due to the growing complexities of processes, networks, manufacturing system structures as well as business processes. The limitation of optimization tools exacerbates the difficulties in achieving competitiveness. The objective of this work is to investigate the merits and demerits of integrating systems tools for optimizing breakthroughs in manufacturing or business processes using DMAIC and DOE. The application and power of process optimization are examined using the semiconductor manufacturing industry. We seek to demonstrate that “integrated methodology” application to process optimization can enable enterprises to achieve substantial innovation and contribute to their quality standards, lower their cost and boost their competitiveness irrespective of the limitations that current tools may have.
Simulation and control of hybrid renewable energy system connected to the grid
This paper presents a control and simulation of hybrid renewable energy system connected to the grid. The studied system includes a photovoltaic panel, synchronous permanent magnet generator based wind turbine, and a battery for storage energy. The PV array and wind systems are connected to the common DC bus by a boost converter. The battery is connected by a bi-directional DC/DC converter, and then integrated into the AC utility grid via a common DC/AC inverter. In order to extract the maximum energy, a simulation study has been carried out according to the meteorological conditions (wind speed and variable solar irradiance) while maintaining power quality at a satisfactory level. In order to capture the maximum power, a MPPT algorithm is applied for both wind turbine and photovoltaic panel. The modeling and simulation of the whole system has been performed under Matlab/Simulink environment. The obtained results show that the current and the voltage of grid side are sinusoidal and alternative forms, and the power injected to the grid is around the power produced by the hybrid system.