Use of Probability Distribution Matching in H.26L For Adaptive Configuration of UVLC -A Novel Approach
A method for improving the print quality of ink used in ink-jet printers, particularly thermal ink-jet printers, is provided. For an ink typically comprising about 90 to 98 wt % water and about 10 to 2 wt % diethylene glycol plus about 0.1 to 12 wt % dye, the improvement is achieved by adding an additive consisting essentially of about 1 to 30 wt % ethanol, about 1 to 30 wt % n-propanol, about 1 to 10 wt % iso-propanol, or about 0.002 to 0.05 wt % of 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol.
Bi-directional motion vector coding using Universal VLC
Abstract In this paper an error resilient motion vector coding which employs two-way decodable Universal VLC is presented. With this scheme, a part of a bitstream which cannot be decoded in the forward direction due to errors can be recovered by backward decoding. Based on the observation that motion compensated signals are visually more important than residual signals, motion vectors are better protected so that they can be recovered even in the presence of errors. Besides being bi-directionally decodable, Universal VLC has been designed to allow easy encoding and decoding. It has been shown through simulations that the proposed scheme outperforms the conventional method (i.e, non-bi-directional) in terms of PSNR under various error conditions.
Submicron polymer structures with X-ray lithography and hot embossing
This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiOx membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λc ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.