Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs
Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.
Advantages of embedded decoupling capacitance in high speed compact board design
This paper provides an introduction about embedded capacitance technology and its implementation on printed circuit board (PCB). The advantages of implementing embedded decoupling capacitance in compact PCB with high speed signal transmission are also explained. The advantages in terms of power and signal integrity are discussed in detail by performing analysis in 2 phases. In phase one, the computation of power distribution network (PDN) impedance of the conventional PCB with discrete decoupling capacitors and the PCB with embedded decoupling capacitance is performed. Meanwhile in phase two, co-analysis of power and signal integrity (PI/SI) on test cases with decoupling conditions mentioned in phase one is conducted to observe the power rail noise and quality of signal transmission. The analysis results are further discussed in the later section of this paper.
Calculation of Complex Radiant Heat Load From Surrounding Radiator Surface Temperatures
Abstract A method for calculating the radiant heat exchange between an absorber and individual radiating components in its surroundings is reported. Radiator surface temperatures, ambient and absorber temperatures, and configuration factors for radiating components in the surroundings are used in the customary radiant heat exchange formulae. Simplified methods for calculating or estimating configuration factors for radiators of various shapes solely from angles, subtended at the absorber by the radiators are presented. The method has been verified in the laboratory under controlled conditions and has been used to advantage in the field studies. The method has advantages over the globe therometer method in certain applications.