Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration
Materials with high thermal conductivity and thermal expansion coefficient matching with that of Si or GaAs are being used for packaging high density microcircuits due to their ability of faster heat dissipation. Al/SiC is gaining wide acceptance as electronic packaging material due to the fact that its thermal expansion coefficient can be tailored to match with that of Si or GaAs by varying the Al:SiC ratio while maintaining the thermal conductivity more or less the same. In the present work, Al/SiC microwave integrated circuit (MIC) carriers have been fabricated by pressureless infiltration of Al-alloy into porous SiC preforms in air. This new technique provides a cheaper alternative to pressure infiltration or pressureless infiltration in nitrogen in producing Al/SiC composites for electronic packaging applications. Al-alloy/65vol% SiC composite exhibited a coefficient of thermal expansion of 7/spl times/10/sup -6/ K/sup -1/ (25/spl deg/C-100/spl deg/C) and a thermal conductivity of 147 Wm/sup -1/K/sup -1/ at 30/spl deg/C. The hysteresis observed in thermal expansion coefficient of the composite in the temperature range 100/spl deg/C-400/spl deg/C has been attributed to the presence of thermal residual stresses in the composite. Thermal diffusivity of the composite measured over the temperature range from 30/spl deg/C to 400/spl deg/C showed a 55% decrease in thermal diffusivity with temperature. Such a large decrease in thermal diffusivity with temperature could be due to the presence of micropores, microcracks, and decohesion of the Al/SiC interfaces in the microstructure (all formed during cooling from the processing temperature). The carrier showed satisfactory performance after integrating it into a MIC.
Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION
A method is described whereby SiC preforms may be infiltrated in air by a molten aluminum alloy to yield a metal matrix composite with thermal expansion coefficients that are suitable for electronic packaging, such as in microwave integrated circuits. Crucible geometries and infiltration conditions may be designed to provide inexpensive and reusable containers and useful section thicknesses in ∼1 hr. Intricate geometries may be fabricated in the green state of the ceramic, prior to infiltration, thereby minimizing final machining of the composite.
To Devolve or Not To Devolve? Welfare Reform in the States
This article analyzes variation in the degree to which states have responded to the devolution of welfare at the federal level by devolving authority over welfare policy to local government. I find that to the extent that states have devolved authority to lower levels of government, they tend to be states that already had a high degree of involvement of local government in welfare provision. In states without this record of local government involvement, the devolution that has occurred has not generated greater involvement of local government, but rather responsibility has been devolved to regional entities with ties to workforce development and with a substantial degree of business involvement. As states gain increasing authority over a redistributive policy, they may begin to treat it as a subset of a larger developmental policy—workforce development.