Quality and reliability of high aspect-ratio blind microvias formed by laser-assisted seeding mechanism in PCB
The laser-assisted seeding (LAS) mechanism should be able to plate microvias with a high aspect ratio that may not be feasible by conventional electroless plating due to the small via geometry. In particular, the plating of microvias with a high aspect ratio close to one is difficult due to the limited accessibility of chemical solution to the via internal wall surface in conventional plating technology. LAS is a promising alternative. The objectives of this paper are to report the deposition mechanism of a thin copper film layer (laser-assisted seeding) on printed circuit board (PCB) microvias dielectric and to study the quality and reliability of the microvias produced by this mechanism. Results find that the microvias produced by LAS have acceptable quality and are as reliable as that formed by conventional electroless plating technology. The hole wall of the microvia was covered with deposited copper, and the thickness of which was found related to some LAS parameters. A set of experimental best LAS processing conditions is also given.
Limits of copper plating in high aspect ratio microvias
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Study of liquid and vapor ejection processes during laser drilling of metals
In an experimental investigation of laser–metal interaction, one of the important parameters is the propagation velocity of the liquid–vapor interface. The quantity appears as a direct result of the theoretical examination of the interaction and may be used to test the accuracy of the theory. Consequently, in the present study, the nature of the interaction mechanism between a pulsed laser beam and metals is examined using streak photographs of the ejecta from four metals: titanium, tantalum, nickel, and EN58B stainless steel. It appears that the drilling process commences with evaporation and the expulsion of fairly large liquid particles, followed by further liquid ejection by both radial flow and nucleation‐induced explosions, with a reduction in the quantity of vapor ejected.