“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Thin Film Technology Handbook
Contributors. Preface. Film Deposition Techniques and Processes. Pattern Generation Techniques. Properties of Thin film Materials. Principles and Properties of Semiconductor Thin Films. Design Guidelines for Thin film Components and Construction of Thin Film Modules. Characterization of Semiconductor Thin Films: A Compendium of Techniques. Diamond Films. Thin Film Optical Materials. Thin Film Packaging and Interconnect. Thin Film for Microwave Hybrids. Yield, Testing, and Reliability.
Optical interconnection technology on the printed circuit board level: technology - design - application
Most important manufacturing and design issues of optical interconnections on the printed circuit board level are introduced. Moreover, robust and applicable concepts for the coupling of optical transmitters and receivers to board-integrated waveguides are discussed.