“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards
Due to ever-faster processor clock speeds, there is a rising need for increased bandwidth to transfer large amounts of data, noise-free, within computer and telecommunications systems. A related requirement is the demand for high bit-rate, short-haul links. Here, optical transmission paths are a viable alternative to high-frequency electrical interconnections, whereby layers with integrated waveguides are particularly suitable. The reasons for this include that a higher connection density can be achieved and the power dissipation, as well as interference from electromagnetic radiation, are significantly lower. The article presents general considerations and the results of research conducted by the German BMBF Project NeGIT, into the manufacture of circuit boards with embedded polymer optical waveguides. The electrical-optical boards were fabricated using precise photolithographic processes and standard lamination methods. They possess the thermal stability necessary for manufacturing processes and operational conditions, in terms of both bond strength and the stability of the optical properties. As part of this project, a design of an optical coupling in the daughter card and board backplane interfaces was developed and is presented as the centerpiece of this study.
Polymer-based optical waveguides: Materials, processing, and devices
Polymer optical waveguide devices will play a key role in several rapidly developing areas of broadband communications, such as optical networking, metropolitan/access communications, and computing systems due to their easier processibility and integration over inorganic counterparts. The combined advantages also makes them an ideal integration platform where foreign material systems such as YIG (yttrium iron garnet) and lithium niobate, and semiconductor devices such as lasers, detectors, amplifiers, and logic circuits can be inserted into an etched groove in a planar lightwave circuit to enable full amplifier modules or optical add/drop multiplexers on a single substrate. Moreover, the combination of flexibility and toughness in optical polymers makes it suitable for vertical integration to realize 3D and even all-polymer integrated optics. In this review, a survey of suitable optical polymer systems, their processing techniques, and the integrated optical waveguide components and circuits derived from these materials is summarized. The first part is focused on discussing the characteristics of several important classes of optical polymers, such as their refractive index, optical loss, processibility/mechanical properties, and environmental performance. Then, the emphasis is placed on the discussion of several novel passive and active (electro-optic and thermo-optic) polymer systems and versatile processing techniques commonly used for fabricating component devices, such as photoresist-based patterning, direct lithographic patterning, and soft lithography. At the end, a series of compelling polymer optical waveguide devices including optical interconnects, directional couplers, array waveguide grating (AWG) multi/demultiplexers, switches, tunable filters, variable optical attenuators (VOAs), and amplifiers are reviewed. Several integrated planar lightwave circuits, such as tunable optical add/drop multiplexers (OADMs), photonic crystal superprism waveguides, digital optical switches (DOSs) integrated with VOAs, traveling-wave heterojunction phototransistors, and three-dimensionally (3D) integrated optical devices are also highlighted.