Interconnections in Multilayer PCBs Based on Microvias Metallized by Magnetron Sputtering Deposition
The high advanced miniaturization of electronic components determines designers and producers of PCBs (printed circuit boards) to search the new constructions and technologies of HDI (high density interconnect) PCBs manufacturing. The researches are concentrated on the problems of miniaturization of PCBs interconnections. Many possibilities in this area are created by using microvia technology. The microvias can be made by using several techniques of drilling, but the great problem in this aspect is connected with possibilities of proper and repeatable metallization of microvias. Wide practical techniques of metallization allow to properly metallize of blind microvias which aspect ratio (deep/diameter of microvia) is about 1 or less. In the paper we propose the use of the magnetron sputtering deposition of copper to metallize the high aspect ratio blind microvias. During tests the use of magnetron self-sustaining mode also was investigated. This special mode allow to deposit of thin and very clear (without labour gas particles) electro-conductive layers which can be grown in electroplating processes
Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's
At last years the extreme demand on miniaturized, functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends on scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). The high level of integration of electronic components, such as Chip Size Packages (CSPs) or micro scale Ball Grid Arrays (μBGAs) determines the designers of electronic devices to create modern layouts. The using of appropriate materials on PCBs and using of newest techniques of manufacture creates the new possibilities of electronics application. At present, the polymers plays more and more important role in electronics, especially in flexible electronics. The big challenge is manufacture of connections and interconnections in polymer PCBs. In the paper the idea of interconnections metallization by using of magnetron sputtering deposition of copper is presented. Such process permits to metallize of interconnections based on microvias with high aspect ratio (deep/diameter) even about 5:1. The realized investigations show that the mentioned technology is the big success in domain of techniques of interconnections metallization and it is very promising for High Tech PCBs manufacturers.
Use of laser scanning confocal microscopy for morphological taxonomy and the potential for digital type specimens (e-types)
The use of laser scanning confocal microscopy (LSCM) for creating taxonomic descriptions of copepods is investigated. A new technique is described, which employs a contour filter to process digital LSCM images, allowing taxonomic information to be quickly and accu- rately distilled into a simple illustration. LSCM allows the imaging of whole specimens, which can be rotated and viewed from any angle—a major benefit over light microscopy. Using this tech- nique, it is suggested that taxonomic descriptions can be rapidly produced in a fraction of the time required to produce similar descriptions using traditional light microscopy and hand drawing techniques. Good staining of specimens is, however, essential to produce accurate descriptions and more research is required in this area. The use of LSCM for morphological taxonomy shows great potential, not only for producing taxonomic descriptions, but also providing a comple - mentary adjunct to traditional type specimens in the form of 3D digital 'e-types' deposited in recognised international databases.