The NASA In-Space Propulsion Technology project's current products and future directions
Since its inception in 2001, the objective of the In-Space12 Propulsion Technology (ISPT) project has been developing and delivering in-space propulsion technologies that enable or enhance NASA robotic science missions. These in-space propulsion technologies are applicable, and potentially enabling for future NASA flagship and sample return missions currently under consideration, as well as having broad applicability to future Discovery and New Frontiers mission solicitations. This paper provides status of the technology development, applicability, and availability of in-space propulsion technologies that recently completed, or will be completing within the next year, their technology development and are ready for infusion into missions. The paper also describes the ISPT project's future focus on propulsion for sample return missions.
Mars Ascent Vehicle technology planning
For many years, NASA and the science community have been asking for a Mars Sample Return (MSR) mission. There have been numerous studies to evaluate MSR mission architectures, technology needs and development plans, and top-level requirements. Because of the challenges, technologically and financially, of the MSR mission, NASA initiated a study to look at MSR propulsion technologies through the In-Space Propulsion Technology (ISPT) project office. The objective of the ISPT project is to develop propulsion technologies that enhance or enable NASA science missions, specifically for the planetary science division, by increasing performance while reducing cost, risk, and/or trip times. The largest propulsion risk element of the MSR mission is the Mars Ascent Vehicle (MAV). In preparation for the procurement of the MAV system development and flight tests, a survey of the propulsion options was conducted and a technology development approach has been established. The results of the MAV system trades and development plan are presented.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.