Formation of Quasicrystalline Phases and Their Close Approximants in Cast Al-Mn Base Alloys Modified by Transition Metals
The aim of the presented research was to study the influence of Cr, Co, Ni, and Cu additions on the formation of quasicrystalline particles in the 94Al-6Mn base alloy during casting at intermediate cooling rates. Based on the obtained results, Cu and Ni enhance quasicrystalline phase nucleation compared to the unmodified binary composition. In the case of Cu addition, formation of a quasicrystalline phase takes place along whole thickness of the prepared casting, but its fraction and morphology depends on the cooling rates present in different parts of the sample. Based on the previous works on the beneficial effect of Fe addition, a quaternary alloy containing both Fe and Cu was prepared to evaluate the effect of the simultaneous presence of these elements on the microstructure of the obtained castings.
Quasi‐crystals and their crystalline homologues in the Al60Mn11Ni4 ternary alloy
The transition quasi‐crystalline→crystalline is found to be very sluggish in the ternary alloy Al60Mn11Ni4. This makes it possible to study in detail the relationship between the decagonal phase, obtained after furnace cooling, and two different crystalline phases, which result after long annealing at 400°C.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.