Interaction of Rayleigh Waves Induced by Interdigital Transducer with Fatigue Crack
Compared to bulk waves, Rayleigh waves can propagate much longer distances with lower signal attenuation levels, which are nominally pro portional to r / 1 for a given frequency (r=distance). In addition to the small attenuation, Ra yleigh waves are also non-dispersive and sensitive to surface-breaking defects. The surface penetra tion depth of Rayleigh waves is also approximately one wavelength, which can be beneficial for many NDT applications. However, one major drawback of using Rayleigh waves for nondestructive testing has been the difficulty of generating Rayleigh waves, where the most commonly used method involves the combination of a plastic wedge and a conventional longitudinal mode trans ducer. Unfortunately, a number of wedges with different angles are needed to generate Rayl eigh waves in different materials or at different operating frequencies to satisfy the critical Rayleigh launch angle requirement. In this study, instead of using wedge transducers, we have designed, fab ricated, and tested narrow-band Interdigital Transducers (IDTs), where precision elect rode patterns were etched on piezoelectric ceramic substrate materials using micro laser machining t echniques. These IDTs can be directly applied to the surface of test specimens to generate Rayle igh waves in MHz range. A laser interferometry system was used to characterize the I DT sensors, where a well-defined and directional Gaussian beam profile was observed. Inves tigations were also made for Rayleigh waves interacting with fatigue cracks in aircraft qualifi ed metallic alloys. It was observed that some of the Rayleigh wave energy can propagate through a tight crack at both normal and oblique incidence.
Interferometric and holographic imaging of surface-breaking cracks
Two advanced nondestructive evaluation systems are developed for imaging surface-breaking cracks in aerospace materials. The systems use scanning heterodyne interferometry and frequency-translated holography principles to image ultrasonic displacement fields on material surfaces with high resolution and sensitivity. Surface-breaking cracks are detected and characterized by visualizing near-field ultrasonic scattering processes, which in turn results in local intensification of ultrasonic displacement fields in the immediate vicinity of a crack. The local intensification permits cracks to be easily distinguished from background levels, and creates unique displacement field images that follow the contours and morphology of the cracks with microscopic precision. The interferometric and holographic imaging approaches each provide noncontact and near optical-diffraction-limited measurement capabilities that are essential for probing ultrasonic displacement fields in the immediate vicinity of cracks. Several representative crack-imaging results are provided, along with detailed descriptions of both experimental techniques, and the capabilities and limitations of each method. The resulting systems provide simple yet very powerful tools for evaluating surface-breaking cracks in detail.
Submicron polymer structures with X-ray lithography and hot embossing
This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiOx membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λc ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.