Quantitative modelling of nucleation kinetics in experiments for poly-Si growth on SiO2 by hot wire chemical vapor deposition
Abstract We apply a rate-equation pair binding model of nucleation kinetics to the nucleation of Si islands grown by hot wire chemical vapor deposition on SiO 2 substrates. The grain size of poly-Si films increases with H 2 dilution, which is attributed to atomic H etching of Si monomers rather than stable Si clusters during the early stages of nucleation. The nucleation density increases sublinearly with time at low coverage, implying a fast nucleation rate until a critical density is reached, after which grain growth begins. The nucleation density decreases with increasing H 2 dilution (H 2 :SiH 4 ) due to etching, and with increasing temperature, due to enhanced Si monomer diffusivity on SiO 2 . From temperature-dependent measurements, we estimate the activation energy for surface diffusion of Si monomers on SiO 2 to be 0.47±0.09 eV. Simulations of the temperature-dependent supercritical cluster density lead to an estimated activation energy of 0.42±0.01 eV and an estimated surface diffusion coefficient prefactor of 0.1±0.03 cm 2 /s.
Polycrystalline silicon films obtained by hot-wire chemical vapour deposition
Silicon films were deposited at moderate substrate temperatures (280–500° C) from pure silane and a silane-hydrogen mixture (10% SiH4, 90% H2) in a hotwire CVD reactor. The morphology, structure and composition of the samples were studied with scanning electron microscopy, transmission electron microscopy, transmission electron diffraction, X-ray diffraction, Raman spectroscopy and secondary ion mass spectrometry. The sample deposited at 500° C with pure silane has an amorphous structure, whereas the samples obtained from silane diluted in hydrogen have a polycrystalline structure, even that grown at the lowest temperature (280° C). Polycrystalline samples have a columnar structure with 0.3–1 μm crystallite sizes with preferential orientation in [220] direction. Deposition rates depend on the filament-substrate distance and range from 9.5 to 37 Å/s for the polycrystalline samples. The high quality of the polycrystalline samples obtained makes the hot-wire technique very promising. Moreover, it is expected to be easily scaled up for applications to large-area optoelectronic devices and to photovoltaic solar cells.
Low temperature, defect-free silicon epitaxy using a low kinetic energy particle process
Concurrent bombardment of a growing film surface by Ar ions having low kinetic energies comparable to typical inter-atomic binding energies has been utilized to activate the film surface. It has been shown that such activation is quite effective and can be substituted for substrate heating during crystal growth. As a result, high quality, device grade epitaxial silicon films have been successfully grown at very low temperatures of 250°–300° C. In this epitaxial growth process, dopant impurities in the target are fully incorporated into the grown film and 100% electrically activated at such low temperatures. The direction for further reducing the epitaxial silicon growth temperature has been examined experimentally, and it is shown that the establishment of anultra clean processing environment andultra clean wafer surface as well asperfect process parameter control are quite essential for very low temperature silicon epitaxy.