Flash Annealing Technology for USJ: Modeling and Metrology
Millisecond annealing either by flash lamp or laser appears to be the leading approach to meet the needs of ultra-shallow junction annealing and polysilicon activation for advanced technology nodes. There are many advantages to this technology including high electrical activation, excellent lateral abruptness, controlled and limited dopant diffusion and the ability to engineer the extended defects remaining from the ion implantation. There are also many challenges such as potential pattern effects, local and global wafer stress and difficulty in process integration. Additional challenges include the need to extend the capabilities of process TCAD to allow accurate simulation and prediction of the ms processes. Modeling of diffusion, activation and defect evolution for a variety of technologically interesting doping conditions must be dependable to allow the device designer and process engineer to predict the device behavior after ms annealing. Existing models fall short or still need to be validated. Metrology for ultra-shallow junctions is also a challenge. The ability to accurately and repeatably measure sheet resistance and junction leakage on junctions of the order of 10nm deep is very difficult. This paper provides an overview of flash lamp annealing and deal with some promising extensions of process simulation to enable the predictive modeling of junction behavior under flash lamp annealing conditions. We also examine some of the new metrology techniques for characterization of these very shallow junctions and look at some of the trends exhibited for different junction formation details
Clusters formation in ultralow-energy high-dose boron-implanted silicon
The formation and evolution of small cluster defects in 500 eV, 1×1015 cm−2 boron-implanted silicon is investigated. These clusters are identified by high-resolution transmission electron microscopy (TEM) as small dislocation loops lying on {100} planes with an interstitial character. Weak-beam dark-field TEM analysis shows that, during annealing at 650 °C, they evolve following an Ostwald ripening mechanism. Spike anneals at high temperatures make them dissolve but an immobile boron peak is still detected in the secondary ion mass spectroscopy profiles. Upon oxidation, the average size of the clusters increases, while boron electrical deactivation occurs. These results strongly indicate that the observed clusters contain both boron interstitials and silicon self-interstitials atoms.
SR topography of plastically deformed Fe-Si bicrystals - observation in situ and post mortem
SR reflection topography was applied to study the interaction of slip dislocations with the grain boundaries in Fe-4at%Si bicrystals deformed by compression. Three experimental settings with either a white or monochromatic beam were used and the corresponding orientation contrast analysed. Dislocation transmission through the grain boundary was observed in bicrystals with favourable geometry of the slip systems.