Electric-motion in Romania — Overview: Study on machining parameters of EV charging station mechanical components
This paper presents some relevant aspects of charging infrastructure for electric vehicles in Romania. It evidences the charging station and fast charging stations designed and installed by the first Romanian company dedicated 100% to e-mobility, E-Motion Electric. Also, a study on machining (milling) parameters of some mechanical components of electric vehicle (EV) charging station is done and, finally, the regression model for these parameters is determined. This model would be further used for machining process optimization.
Electric-Motion Infrastructure in Romania - Research on Machining Processes of Mechanical Components of e-Motion Charging Station
Aspects of electric vehicles specific infrastructure in Romania are evidenced by this paper. The focus is on charging station and fast charging stations designed and installed by the first Romanian company dedicated 100% to e-mobility, E-Motion Electric. Research on machining processes, milling and drilling, of the mechanical components of these stations is also presented. A system for measuring the values of machining forces, data acquisition and processing, as well as real time control scheme does also represent innovation in this paper. The regression models, determined by statistical data processing, should be applied in optimization of machining process.
Simplified impedance design and control for low-cost high-speed channels
Impedance design is the fundamentals of signal integrity at the very beginning, but controlled impedance is always costly or time-consuming for the high-speed channels. In this paper, many simulations of channel parasitics were taken and calculated that met with the specified impedances and correlated to the measurements very well. Selection of the different substrate stack-up without any layout modification in the BGA package reversed from the failed verification to pass the differential return loss. Adjustment of lead widths and spaces in the limited room of leadframe package improved 6 Ω of differential-mode impedance compared to the conventional leadframe packages. The differential pairs with wider traces routed on the 2-layer PCB are more robust for over-etching effects whose impedance errors are less than 5% without special impedance control. Moreover, those pairs inserted with a thin ground trace achieved 90 Ω differential-mode impedance and 28.2 Ω common-mode impedance simultaneously with 35% less routing area for MHL application and reserved a 10 Ω series resistor for ESD protection. With those diligent designs, the leadframe package and the 2-layer PCB can be still adopting in the consumer electronics for high-speed applications.