Electroluminescence from Phosphor-doped nanocrystals
Alternating current thin-film electroluminescent (ACTFEL) devices already occupy a segment of the largearea, high-resolution, flat-panel-display market. The AC-TFEL displays, which consist of a phosphor layer, such as manganese doped-zinc sulfide (ZnS:Mn), vertically sandwiched between two insulators that are contacted by electrodes, are robust, possess long lifetimes, and offer high luminance with relatively low power consumption [1], [2]. While fabrication of AC-TFEL devices has been the subject of considerable study over the past three decades, significant challenges remain. Development of multicolor displays with balanced red, green, and blue (RGB) emission has proven difficult as the most efficient red, green, and blue phosphors comprise different materials systems that require different deposition and annealing steps. Transparent AC-TFEL displays have recently been demonstrated by Sharp, Inc.; however, the processing of the phosphor to achieve transparency is difficult and has not yet been developed for phosphors other than ZnS:Mn [3].
ELECTRICAL CHARACTERIZATION OF THIN-FILM ELECTROLUMINESCENT DEVICES
▪ Abstract Electrical characterization methods for the analysis of alternating current thin-film electroluminescent (ACTFEL) devices are reviewed. Particular emphasis is devoted to electrical characterization techniques because ACTFEL devices are electro-optic display devices whose performance is to a large extent determined by their electrical properties. A systematic procedure for ACTFEL electrical assessment is described. The utility of transient charge, voltage, current, and phosphor field analysis is explained. Steady-state electrical characterization methods discussed in this review include charge-voltage (Q-V), capacitance-voltage (C-V), internal charge-phosphor field (Q-Fp), and maximum charge-maximum applied voltage (Qmax-Vmax) analysis. These electrical characterization methods are illustrated by reviewing relevant results obtained from the analysis of evaporated ZnS:Mn and atomic layer epitaxy (ALE) SrS:Ce ACTFEL devices.
A model for predicting heat transfer through gypsum‐board/wood‐stud walls exposed to fire
To facilitate the development of cost-effective and flexible design options there is a need to develop models to predict the fire resistance of wood-frame building assemblies. Such assemblies often derive much of their fire resistance from a protective membrane composed of gypsum board. A simple two-dimensional computer model is presented to predict heat transfer through gypsum-board/wood-stud walls exposed to fire. Input data for the thermophysical properties of gypsum board were measured exploying standard bench-scale tests. Input data for wood were selected from the literature. Small-and full-scale fire resistance tests were conducted on gypsum-board/wood-stud wall assemblies to provide data for the validation of the model. The model is shown to predict heat transfer through these walls rather well.