Electron Air Hypersonic Propulsion
Aviation, in general, and aerospace in particular needs new propulsion systems which allow the craft to reach high speeds by cheaper and more efficient methods. Author offers a new propulsion system using electrons for acceleration of the craft and having a high efficiency. As this system does not heat the air, it does not have the heating limitations of conventional air ramjet hypersonic engines. Offered engine can produce a thrust from a zero flight speed up to the desired space apparatus speed. It can work in any planet atmosphere (gas, liquid) and at very high altitude. The system can use apparatus surface for thrust and braking. For energy the system uses high voltage electricity which is not a problem if you have an appropriate electrostatic generator connected with any suitable engine.
High Speed Catapult Aviation
Current takeoff mass of a long-distance aircraft is made up of approximately 1/3 aircraft body, 1/3 fuel, and 1/3 payload. The aircraft engine needs expensive aviation fuel. The passenger-transport aircraft cannot exceed the speed of sound. The “Concorde” history shows that the conventional passenger supersonic aircraft is unprofitable. The hypersonic aircraft, which is under development by the USA, will be more unprofitable as a passenger long-distance aircraft, because it will use very expensive hydrogen fuel, it is very complex, and it has a high production cost. The hypersonic engine problems have not been solved in spite of spending tens of millions of dollars in research and testing. Aviation needs new ideas that increase speed, load capability, and reduce a delivery cost. The current passenger-transport aviation systems have reached the peak of their development. In the last 30 years, there has been no increase in speed or reductions in trip costs. The aviation industry needs a revolutionary idea that allows jumps in speed and delivery capability, and dramatic drops in trip price. This chapter offers a new idea in aviation in which flight time practically does not depend on distance (it is the same for lines from New York to Washington as from New York to Paris), and vehicle load capability doubles, and which has a drive engine that is located on the ground and can use any cheap source of energy.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.