The Politics of the Census: Lessons from Abroad
I late June, Minister of Industry Tony Clement announced the government’s decision to eliminate the mandatory long form of the 2011 Census and replace it with a voluntary survey to be sent to one-third of Canadian households. The decision was reportedly made by Prime Minister Stephen Harper last December and has largely been framed by Conservative cabinet ministers as an important change to safeguard the privacy of Canadians. They maintain that the state has no business in the bedrooms of society, or, more specifically, that the state has no business asking Canadians how many bedrooms they have in their places of residence. The Prime Minister ’s Office has stated, “The government made this decision because we do not believe Canadians should be forced, under threat of fines, jail, or both, to disclose extensive private and personal information” (Valpy 2010). Clement, the minister responsible for Statistics Canada, argued before a parliamentary committee on 27 July that though the information gathered in the long form is “valuable,” a “balance must be drawn” between collecting data and the privacy rights of Canadians.
The Creation of the Office for National Statistics
A new Office for National Statistics was created in the United Kingdom in 1996 following a series of developments designed to strengthen the relevance and integrity of statistics. This paper describes these fundamental changes and sets out a blueprint for future progress. It also sets current developments in the United Kingdom in an historical and international context.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.