Transport properties and the large anisotropic magnetoresistance of CuxNbS2 single crystals
The transport properties of CuxNbS2 (x = 0.09, 0.44 and 0.55) single crystals were systematically studied. The in-plane and out-of-plane resistivities decrease with increasing Cu content, and a transition with hysteresis shows up for the crystals with x = 0.44 and 0.55. The thermopower and Hall coefficient of CuxNbS2 show opposite signs, indicating that there are two kinds of carriers in this system. The angular dependences of the in-plane magnetoresistance (MRab = (ρab(H)−ρab(0))/ρab(0) × 100%) at different temperatures were also studied. The single crystals with x = 0.44 and 0.55 show a strong anisotropic MRab. For the x = 0.55 sample, MRab reaches 80% with a magnetic field of 14 T applied along the c-axis, while MRab is less than 5% for the magnetic field applied within the ab-plane. These results can be well understood in the light of the anisotropic Fermi surface in the multiband system.
Spontaneous self-intercalation of copper atoms into transition metal dichalcogenides
Bulk Cu transforms into Cu atoms that spontaneously self-intercalate into specific 2D layer TMDs under ambient conditions. Intercalated transition metal dichalcogenides (TMDs) have attracted substantial interest due to their exciting electronic properties. Here, we report a unique approach where copper (Cu) atoms from bulk Cu solid intercalate spontaneously into van der Waals (vdW) gaps of group IV and V layered TMDs at room temperature and atmospheric pressure. This distinctive phenomenon is used to develop a strategy to synthesize Cu species–intercalated layered TMD compounds. A series of Cu-intercalated 2H-NbS2 compounds were obtained with homogeneous distribution of Cu intercalates in the form of monovalent Cu (I), occupying the tetrahedral sites coordinated by S atoms within the interlayer space of NbS2. The Fermi level of NbS2 shifts up because of the intercalation of Cu, resulting in the improvement of electrical conductivity in the z-direction. On the other hand, intercalation of Cu into vdW gaps of NbS2 systematically suppresses the superconducting transition temperature (Tc) and superconducting volume fraction.
Finite Difference Modeling on the Temperature Field of Substrate in Friction Surfacing
Friction surfacing is an advanced process of great potential, especially in the field of repair and reclamation of worn and damaged components. As a kind of thermal processing technology, the temperature profile and changes of the substrate in friction surfacing are important factors to get coatings of high quality. In this paper, the temperature field of the substrate during the process is simulated by finite difference method. The results are consistent with experiments, reappearing the temperature change of the substrate during friction surfacing, allowing further study on figuration and quality of coatings.