Response of Composite Fuselage Sandwich Side Panels Subjected to Internal Pressure and Axial Tension
The results from an experimental and analytical study of two composite sandwich fuselage side panels for a transport aircraft are presented. Each panel has two window cutouts and three frames and utilizes a distinctly different structural concept. These panels have been evaluated with internal pressure loads that generate biaxial tension loading conditions. Design limit load and design ultimate load tests have been performed on both panels. One of the sandwich panels was tested with the middle frame removed to demonstrate the suitability of this two-frame design for supporting the prescribed biaxial loading conditions with twice the initial frame spacing of 20 inches. A damage tolerance study was conducted on the two-frame panel by cutting a notch in the panel that originates at the edge of a cutout and extends in the panel hoop direction through the window-belt area. This panel with a notch was tested in a combined-load condition to demonstrate the structural damage tolerance at the design limit load condition. Both the sandwich panel designs successfully satisfied all desired load requirements in the experimental part of the study, and experimental results from the two-frame panel with and without damage are fully explained by the analytical results. The results of this study suggest that there is potential for using sandwich structural concepts with greater than the usual 20-in.-wide frame spacing to further reduce aircraft fuselage structural weight. in the airframe industry. Structural trade studies for
Numerical Modelling of a Composite Fuselage Manufactured by Liquid Resin Infusion
FUSCOMP (FUSelage COMPosite) is a Research & Development program which has received the label from the Aerospace Valley competitiveness cluster. It will lead to a test of a composite fuselage demonstrator manufactured by the Liquid Resin Infusion (LRI) process. LRI is based on the moulding of high performance composite parts by infusing liquid resin on dry fibers instead of prepreg fabrics. The study of this proof of concept is based on the TBM 850 airframe, a pressurized business turboprop aircraft currently produced by DAHER-SOCATA. Technical achievements will concern numerical methods and finite elements analysis to be used for the modelling of this aircraft composite fuselage structure. Actual industrial projects face composite integrated structure issues as a number of structures (stiffeners,...) are more and more integrated onto the skins of aircraft fuselage. Indeed the main benefit of LRI is to reduce assembly steps which lead to cycle time gain and thus cost reduction. In particular, infusing components and sub-components at the same time avoids riveting parts altogether. However it is necessary to validate the dimensioning of the studied composite structure.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.