The Seven Worthies of the Bamboo Grove
Although Shan Tao, Ruan Ji, Xiang Xiu, Liu Ling, Ji Kang, Ruan Xian, and Wang Rong were historical figures, their identity as a group of like-minded iconoclasts who flouted Confucian ideology and norms of behavior has been questioned in modern scholarship. Even their epithet Zhulin qixian (The Seven Worthies of the Bamboo Grove), as some scholars argued, was retrospectively coined. This chapter argues that not only were the Seven Worthies historical figures in the third century, but they were also famously known by their epithet in their own time. Further, the political significance of their domicile in Shanyang District is explained. Yet the Seven Worthies were not a homogenous group because their political aspirations and philosophical inclinations were quite diverse and dissimilar, as the analysis of the philosophical thinking of Ruan Ji, Ji Kang, and Xiang Xiu in this chapter demonstrates.
NEO-TAOISM AND THE SEVEN SAGES OF THE BAMBOO GROVE IN CHINESE PAINTING
DANS UNE 1 PARTIE, L'ETUDE DONNE UNE EXPLICATION DE L'ATTITUDE DU NEO-TAOISME ENVERS L'HOMME ET LA CONTRIBUTION A LA PEINTURE CHINOISE DE PORTRAIT QUI EN RESULTE, PRINCIPALEMENT A LA PERIODE WEI-CHIN (220-470 APR. J.-C.). L'A. DEMONTRE QUE LA POSE TRADITIONNELLE CHIN NE FUT PAS ECLIPSEE PAR LES STYLES ULTERIEURS| ELLE ETAIT CONNUE PAR DES ARTISTES ACTIFS AU XVII S. ET MEME PLUS TARD, ET ILS L'UTILISAIENT POUR REPRESENTER LES SAGES DE L'ANTIQUITE. LA SECONDE PARTIE DE L'ARTICLE CONCERNE LES REPRESENTATIONS DANS LA PEINTURE CHINOISE DES 7 SAGES DU BOSQUET DE BAMBOUS.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.