Three dimensional packaging and interconnecting techniques for microwave modules
Three dimensional (3D) packaging and interconnecting techniques can greatly reduce the weight and volume of conventional planar microwave modules. The objective of this study was to employ a novel 3D structure with simple manufacturing process to develop 3D microwave modules. Many advanced 3D packaging and interconnecting methods, such as LTCC microwave multichip modules, vertical interconnects, and 3D electromagnetic field analyzing and optimizing, were applied to increase the package density and improve the electric performance. Test method and test results of 3D microwave modules were introduced. These techniques are very useful to many types of modern active phased array radar systems and communication systems.
High density packaging of X-band active array modules
A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars. The package used multilayer aluminum nitride (AlN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects. This paper discusses the design tradeoffs, the package construction and assembly, and test results.
The evolution of packages for monolithic microwave and millimeter-wave circuits
The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As-a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas. >