Quality and reliability of high aspect-ratio blind microvias formed by laser-assisted seeding mechanism in PCB
The laser-assisted seeding (LAS) mechanism should be able to plate microvias with a high aspect ratio that may not be feasible by conventional electroless plating due to the small via geometry. In particular, the plating of microvias with a high aspect ratio close to one is difficult due to the limited accessibility of chemical solution to the via internal wall surface in conventional plating technology. LAS is a promising alternative. The objectives of this paper are to report the deposition mechanism of a thin copper film layer (laser-assisted seeding) on printed circuit board (PCB) microvias dielectric and to study the quality and reliability of the microvias produced by this mechanism. Results find that the microvias produced by LAS have acceptable quality and are as reliable as that formed by conventional electroless plating technology. The hole wall of the microvia was covered with deposited copper, and the thickness of which was found related to some LAS parameters. A set of experimental best LAS processing conditions is also given.
Limits of copper plating in high aspect ratio microvias
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Liquid ejection and possible nucleate boiling mechanisms in relation to the laser drilling process
The laser drilling process is a complex phenomenon. This is especially true after the evaporation process starts. It is experimentally evident that liquid ejection occurs due to drag forces developed around the solid cavity and/or explosion resulting from nucleation of vapour bubbles in the liquid zone. Therefore, study into the ejection of liquid due to vapour bubble formation is necessary. Consequently, the present study examines the liquid ejection mechanism experimentally and possible saturated nucleate boiling is treated theoretically. In the experimental study, streak photography is introduced while a kinetic theory is adopted for the heat transfer model. This enables us to obtain the surface and internal temperature rise due to the laser heating pulse. It is found that the time measured for the liquid expulsion from the heated zone is identical with the time computed corresponding to possible saturated nucleate boiling.