Distribution automation: Applications to move from today's distribution system to tomorrow's smartgrid
In 2008 the Hydro-Québec Distribution roadmap was completed. The resulting roadmap is based on customers' expectations, Hydro-Québec's business drivers, available technologies, Hydro-Québec's context and electrical distribution industry trends. This paper will present the distribution roadmap and then will focus on application and technology strategy to move from today's distribution network to tomorrow's Smartgrid.
Hydro-Québec's distribution vision and roadmap 2008–2023
This paper presents Hydro-Quebec's distribution vision and roadmap. First a quick overview of the inputs (industry benchmark, customers' expectations, Quebec's contex…) that were used to build the vision and roadmap will be described. Then from these inputs, business objectives were stated by Hydro-Quebec's management. To meet these objectives, the vision selected a set of applications and technologies. It covers the overall evolution of the distribution system by proposing strategies for asset management, data management and technology management. Finally to move from today's distribution network to tomorrow's Smartgrid, the vision and roadmap shall evolve to consider influence factors in the years to come.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.