Effective annealing and crystallization of si film for advanced TFT system
Abstract The effect of the crystallization and activated annealing of Si films using an excimer laser and the new CW blue laser are described and compared with furnace annealing for application in advanced TFTs and for future applications. Pulsed excimer laser annealing (ELA) is currently being used extensively as a low‐temperature poly‐silicon (LTPS) process on glass substrates as its efficiency is high in the ultra‐violet (UV) region for thin Si films with thickness of 40–60 nm. ELA enables extremely low resistivity relating to high crystallinity for both the n‐ and p‐type Si films. On the other hand, CW blue laser diode annealing (BLDA) enables the smooth Si surface to have arbitral crystal grains from micro‐grains to an anisotropic huge grain structure only by controlling its power density. Both annealing techniques are expected to be applied in the future advanced TFT systems.
Sequential lateral solidification of thin silicon films on SiO2
We report on a low‐temperature excimer‐laser‐crystallization process that produces a previously unattainable directionally solidified microstructure in thin Si films. The process involves (1) inducing complete melting of selected regions of the film via irradiation through a patterned mask, and (2) precisely controlled between‐pulse microtranslation of the sample with respect to the mask over a distance shorter than the single‐pulse lateral solidification distance, so that lateral growth can be extended over a number of iterative steps. Grains up to 200 μm in length were demonstrated; in principle, grains of unlimited length can be produced. We discuss how the technique can be extended to produce large single‐crystal regions on glass substrates.
Single-Shot Excimer Laser Annealing and In Process Ellipsometry Analysis for Ultra Shallow Junctions
Single-shot Excimer Laser Annealing (ELA) was performed onto Si surface that was previously B + implanted with or without Ge + pre-amorphization. As a result, p + type USJ (Ultra-Shallow Junction) has been formed. In process analysis, using Infrared Spectroscopic Ellipsometry (IR-SE) has been performed and compared with conventional 4-point probe method. Also, the corresponding crystallinity for the USJ of Si surface has been studied using Ultraviolet-Visible (UV-Vis) Spectroscopic Ellipsometry. In the case of pre-amorphization by Ge + implantation, the laser energy density threshold required for melting the surface, and therefore for electrical activation, decreased drastically because of the difference in the thermodynamic properties of the amorphized Si. Estimation of the junction depth shows a shallower junction when using UV-SE, as compared to IR-SE. This can be explained by the fact that, in the UV range, the crystallinity of the top layer is predominant while IR-SE is more sensitive to dopant activation. This efficient single-shot ELA is a candidate for the USJ formation for sub-0.1 νm CMOS transistors. The effective method for investigating the activation state related to the crystallinity by using UV-SE and IR-SE is expected to apply as a non-contact analytical tool for USJ formation.