“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Ray-Tracing Studies on Optical Periscopes Suitable for Out-of-Plane Interconnects on Optical Backplanes
Micro-periscopes suitable for out-of-plane optical interconnects in multi-mode optical waveguide systems are investigated by ray-tracing simulations. Various parameter setups, e.g., curved mirrors and add-on lens systems, were investigated by applying methods of statistical design of experiments, such as fractional factorial design and surface response analysis. The optimum optical net-loss was found to be in the order of magnitude of 3.5 dB for such periscopes. Furthermore, misplacement analysis' for these periscopes were performed in respect to a connection line of two tentative waveguides. The position of a -3 dB loss-line, was found to be as close as 35 ¿m and as far as 70 ¿m parallel to the ideal connection line of the waveguides.
Demonstration of 2.5Gb/s optical interconnection using 45/spl deg/-ended connection blocks in fiber- and waveguide-embedded PCBs
A simple method for fabricating fiber- and waveguide-embedded boards for optical interconnects is described. It is quite cost effective and fully compatible with conventional PCB processes. On-board optical link of 2.5Gb/s signals between the transmitter and the receiver modules. was demonstrated by placing connecting blocks having 45/spl deg/-mirror planes at the ends of the fiber and waveguide-embedded boards.