MECHANICAL PROPERTIES OF GYPSUM BOARD AT ELEVATED TEMPERATURES
Gypsum board is a common fire barrier used in house and general building construction. Recently, evaluation of the collapses of the World Trade Center Towers highlighted the potential role and failure of gypsum board in containing the fires and resisting damage. The use of gypsum board as primary fire protection of light-flame wood or steel construction is ubiquitous. Yet knowledge of the common engineering mechanical properties of this construction product is nearly nonexistent. Gypsum board is used in a prescriptive manner with little or no rational design. Summarized here are the results of a study examining the mechanical properties of Type X gypsum board at elevated temperatures. These properties are needed to contemplate the engineering design of gypsum board fire barriers. Tests were undertaken with a small oven within a test machine measuring mass loss, shrinkage, bending strength and modulus of elasticity at elevated temperatures to 400°C. The research showsthat shrinkage and calcination of the gypsum board appear complete between 20 to 30 minutes of exposure at a uniform 400°C. Only after complete calcination, where all moisture is driven off, does the bending strength approach 0. Strength appeared to decrease linearly with increasing temperature. Mass loss and modulus of elasticity exhibited similar trends with the greatest decreases occurring from 100°C to 200°C followed by more gradual decrease to 400°C. The surface paper plays significant stiffening and strengthening roles up to 60 minutes at temperatures as high as 200°C.
THERMAL DEGRADATION AND THERMAL CONDUCTIVITY OF GYPSUM-CEMENT PARTICLEBOARD
Thermal degradation of boards made from wood particles mixed with gypsum and gypsum-cement was determined in air and nitrogen by thermogravimetric analysis. The pure constituents of the boards (wood particles, gypsum, and Portland cement) were characterized separately. The thermal conductivity of the boards was determined using a heat flowmeter apparatus. Commercial gypsum board was used as a control for all the tests performed. Commercial gypsum board, pure gypsum, pure Portland cement, and gypsum-cement mixture showed mass losses between 18 and 22% at 800°C. Conversely, the wood particles were very sensitive to heat in the presence of air. In general, gypsum-cement particleboard exhibited better resistance to thermal degradation than gypsum particleboard, but it has the highest thermal conductivity as a result of its higher density. Thermal conductivity was shown to be strongly dependent on board density.
Submicron polymer structures with X-ray lithography and hot embossing
This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiOx membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λc ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.