A simulation of air bearing surface materials with copper substrate for corrosion investigation
Corrosion defect is one of the important defects found in hard disk drive manufacturing. Fail to detect this defect might lead to fatal hard disk drive failure. In general, corrosion defect was found after the end of process. The fundamental methodology used to measure corrosion defect in head magnetic process of hard disk drive manufacturing is Electrochemical impedance spectroscopy (EIS). This method applies a low frequency voltage to a chemical cell in order to measure corrosion rate which is defined as a reaction of material in aqueous solution. The data obtained from EIS measurement method are complex and thus hard to analyze. Furthermore, EIS method is destructive materials measurement and the obtained results cannot well predict corrosion behavior of the system. However, head magnetic materials/slider is a stack of three materials in layers i.e. soft magnetic layer, diamond like carbon (DLC) layer, and photoresist layer respectively. These three stack layer of slider can be replaced by R-C equivalent circuit. Nyquist plot and Bode plot are used to observe the frequency response of the equivalent circuit. This observation can help in prediction of corrosion behavior before starting of mass fabrication or transferring to new materials. This work shows that the results obtained from an equivalent R-C circuit model of copper substrate coated with photoresist and the one obtained from EIS method are comparable. It should be noted that the parameters of R-C equivalent circuits are modified for corrosion behavior studying according to two different types of photoresists.
Polymer film selection for corrosion protection of data storage magnetic material
The prevention of soft magnetic material from corrosion in hard disk drive is very concern due to high magnetic moment come with high corrosion sensitivity. Photoresist that is used for read/write head fabrication is important to protect magnetic element. Good photoresist should not found porosity and low water adsorption. This investigation was methodology to classify 5 conditions of photoresist which is used in fabrication at lithography process. Potentiostat/Galvanastat is selected technique by applying external voltage for current response. The result suggested proper photoresist was wet photoresist type, AZP4999. There is no degradation after lithography process had finished. Chemical wear resistance still maintain at same level of magnitude since first step (coating) till last step (developing).
Synthesis and chemical recycling of novel poly(ester-urethane)s using an enzyme.
A series of enzymatically recyclable poly(ester-urethane)s consisting of a biodegradable diurethane moiety as a hard segment and an ester moiety as an enzymatically cleavable linkage was chemo-enzymatically prepared by two routes. The poly(ester-urethane) was prepared by a) the ring-opening polymerization of a cyclic ester-urethane monomer synthesized via the transesterification reaction of biodegradable diurethanediol and dicarboxylate ester using lipase and b) the direct polycondensation of a diurethanediol and a dicarboxylate ester. A significantly higher molecular-weight poly(ester-urethane) having the highest molecular weight (Mw) of 101,000 was produced by the ring-opening polymerization of the cyclic ester-urethane monomer when compared with that produced by the polycondensation of the dicarboxylate ester with diurethanediol. The poly(ester-urethane) was readily degraded by lipase into the corresponding cyclic oligomers; the oligomers were readily repolymerized by the ring-opening polymerization using lipase for chemical recycling.