Single crystal growth and phase stability of photovoltaic grade ZnSiP2 by flux technique
ZnSiP2 is a potential optoelectronic material with possible application in lasers, LED's, photonic integrated circuits, and photovoltaics. The development of ZnSiP2 as a photovoltaic material could address the current technological challenge of implementing a monolithic top cell on silicon for tandem photovoltaics. In this work we present a detailed description of the growth of ZnSiP2 single crystals, which has enabled thorough optoelectronic characterization. A flux growth technique was used, under various conditions, to grow ZnSiP2 single crystals in Zn solution. The results of these growth experiments, along with analysis of previously determined phase diagrams, show that three secondary phases form as a result of the Zn flux growth technique: Zn3P2, Si, and the remaining Zn flux. Potential reasons for the formation of these particular phases are discussed, but their presence is found to be non-detrimental, and they can easily be removed. The resulting single crystals are high purity and enable the characterization of the fundamental optoelectronic properties of ZnSiP2.
Preparation and Characterization of ZnSiP2 and ZnGeP2 Single Crystals.
Abstract Single crystals of ZnSiP 2 and ZnGeP 2 have been grown by several techniques and their electronic and optical properties were compared. It was found that Fe(III) could not be substituted for equal amounts of Zn(II) and Ge(IV) in the II–IV–V 2 chalcopyrites. However, 0.5 atomic percent of Mn(II) was successfully substituted in the structure for Zn(II).
Submicron polymer structures with X-ray lithography and hot embossing
This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiOx membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λc ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.