Investigating Reliability Attributes of Silicon Photovoltaic Cells: An Overview
Reliability attributes are being developed on a wide variety of advanced single-crystal silicon solar cells. Two separate investigations: cell-contact integrity (metal-to-silicon adherence), and cracked cells identified with fracture-strength-reducing flaws are discussed. In the cell-contact-integrity investigation, analysis of contact pull-strength data shows that cell types made with different metalization technologies, i.e., vacuum, plated, screen-printed and soldered, have appreciably different reliability attributes. In the second investigation, fracture strength was measured using Czochralskli wafers and cells taken at various stages of processing and differences were noted. Fracture strength, which is believed to be governed by flaws introduced during wafer sawing, was observed to improve (increase) after chemical polishing and other process steps that tend to remove surface and edge flaws.
Accelerated Stress Testing of Terrestrial Solar Cells
The development of an accelerated test schedule for terrestrial solar cells is described. This schedule, based on anticipated failure modes deduced from a consideration of IC failure mechanisms, involves bias-temperature testing, humidity testing (including both 85-85 and pressure cooker stress), and thermal-cycle thermal-shock testing. Results are described for 12 different unencapsulated cell types. Both gradual electrical degradation and sudden catastrophic mechanical change were observed. These effects can be used to discriminate between cell types and technologies relative to their reliability attributes. Consideration is given to identifying laboratory failure modes which might lead to severe degradation in the field through second quadrant operation. Test results indicate that the ability of most cell types to withstand accelerated stress testing depends more on the manufacturer's design, processing, and workmanship than on the particular metallization system. Preliminary tests comparing accelerated test results on encapsulated and unencapsulated cells are described.
Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder
Abstract In order to obtain high-strength aluminum joints, ultrasonic soldering of 1070 aluminum was conducted under liquidus temperature of Sn–Zn hypereutectic solder. A device for ultrasonic soldering was assembled, which propagated ultrasonic vibrations in a direction perpendicular to joining surfaces. This device joined 1070-Al using quasi-melting Sn–Zn hypereutectic solder without using any artificial spacers. The strength of the solder joints was evaluated by tensile tests. The optimum joining conditions were determined, and the effects of solder compositions and soldering temperature on the joint strength and the solder layer thickness were examined. In this ultrasonic soldering process, the highest tensile strength was obtained for the solder joints fabricated at 220 °C for the Sn–23Zn and Sn–40Zn solder compositions. The joint strength was equivalent to that of 1070-Al heat treated at 220 °C. The sound joints were obtained at 300 °C using Sn–82Zn solder, the liquid phase volume fraction of which was theoretically only 0.24. The present work also revealed that the thickness of retained solder layer in the joint after ultrasonic soldering could be estimated. Accordingly, ultrasonic soldering under the liquidus temperature of Sn–Zn hypereutectic solder could be a spacer-free soldering method to obtain high-strength aluminum joints.