The research on phenolic resin modified by nanoparticles and used for magnesite-carbon brick binder
The research method use nanoparticles to modify the phenolic resin binder for magnesite-carbon brick. The normal detection indexes of phenolic resins is suited to used as the binder. FESEM images show that the nanoparticles are distributed uniformly without agglomeration almost. The physical-chemical property analyses show that the magnesite-carbon brick using this modified phenolic resin as binder possesses a low apparent porosity and a high bulk density and compression strength. Especially, the compression strength of the magnesite-carbon bricks after heat treatment for 200°C×12h increase to 43.94MPa and 41.35MPa, respectively. The results also show that with the increase of heat treatment temperature, the compression strength and the bulk density of magnesite-carbon bricks decrease and the apparent porosity magnesite-carbon bricks increases. The physical-chemical property shows a significant change from 200°C to 1100°C. However the change is not obviously from 1100°C to 1550°C and shows worse trend with the increase of heat treatment temperature.
INTERFACIAL STRENGTHES OF GLASS FIBER REINFORCED THERMOPLASTICCOMPOSITES AND ITS EFFECTS ON MECHANICAL PROPERTIES
Interfacial characteristics and effects on material properties as well as controllingof interfacial bonds were studied in the systems of BK-10 glass fiber reinforced PMMA and PCthermoplastic composites.Coating the fibers with organosilane coupling agents improves theinterfacial bonds and thus the mechanical properties of the composites.Four interfacial failuremodes exist in systems of brittle and ductile matrices with strong and weak interfacial bondsrespectively.Optical transparent composites can be made in systems with matching refractiveindices of matrix and reinforcing fiber by proper process controll.
Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners
The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between Tg and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998