Role of Hydrogen in Polycrystalline Si by Excimer Laser Annealing
The role of hydrogen in the Si film during excimer laser annealing (ELA) has been successfully studied by using a novel sample structure, which is stacked by a-Si film and SiN film. Hydrogen contents in the Si films during ELA are changed by preparing samples with hydrogen content of 2.3-8.2 at.% in the SiN films with a use of catalytic (Cat)-CVD method. For the low concentration of hydrogens in the Si film, the grain size increases by decreasing hydrogen concentration in the Si film, and the internal stress of the film decreases as increasing the shot number. For the high concentration of hydrogens in the Si film, hydrogen burst was observed at 500 mJ/cm 2 and the dependence of the internal stress on the shot number becomes weak even at 318 mJ/cm 2 . These phenomena can be understood basically using the secondary grain growth mechanism, which we have proposed.
Stress Relaxation of Poly-Si Film Formed by Excimer Laser Annealing
We investigated the low-temperature processed polycrystalline-silicon (poly-Si) film formed by carrying out low-energy-density and multishot excimer laser annealing (ELA) of amorphous Si (a-Si) film on a glass or quartz substrate. The influence of secondary grain growth which grain size becomes larger than the film thickness on the tensile stress relaxation of the poly-Si film was clarified. Relationship between hydrogens which are supplied to the melt-Si from the bottom catalytic-chemical vapor deposition (Cat-CVD) SiN film and the stress relaxation was also examined. The tensile stress in the poly-Si film relaxes upon the appearance of the secondary grains, and the stress decreases with increasing diameter of the secondary grains. However, the hydrogen supply to melt-Si suppresses the secondary grain growth and the stress relaxation becomes marked as the hydrogen concentration decreases. Furthermore, the relationship between the dangling bond density corresponding to the crystal defect density and grain size was investigated, and the defect site was clarified. Lastly, the recrystallization model by ELA at low energy densities was discussed. The model was constructed based on the experimental data that the secondary grain growth occurs suddenly at the critical energy density and the critical shot number, and it was shown that the present model is consistent with the results related to the hydrogen concentration and the secondary grain growth.
Surface‐energy‐driven secondary grain growth in ultrathin (<100 nm) films of silicon
Growth of grains with sizes many times (>50×) larger than the film thickness and with uniform (111) texture, has been achieved in ultrathin (<100 nm) films of Si on SiO2. Growth of these secondary grains is driven by minimization of anisotropic surface energy. As a result, the secondary grain growth rate increases with decreasing film thickness. The time required for growth of large secondary grains decreases with increasing temperature.