G1 dendrimers-mediated evolution of silver nanostructures from nanoparticles to solid spheres.
With the control of G1 poly(amidoamine) (PAMAM), an evolutionary course of stable colloidal silver from discrete nanoparticles to solid spheres through ultraviolet irradiation reduction of silver nitrate solutions was observed by transmission electron microscopy (TEM). The morphologies of the products depend on the Ag+ concentration. A mechanism of globular assembly was put forward to interpret the evolution of the nanostructures. Powder X-ray diffraction (XRD), electron diffraction (ED) patterns, and X-ray photoelectron spectroscopy (XPS) indicate the presence of cubic symmetry silver. XPS and Fourier transform infrared (FT-IR) spectroscopy confirm that dendrimers have participated in the stabilization and control of Ag nanostructures. In the UV-vis spectra, the intense surface plasmons are centered at 425 and 430 nm corresponding to the shapes of dots and solid spheres, respectively. The solid spheres exhibit excellent catalytic efficiency on the reduction of 2,7-dicholoroflurescein (DCF).
Role of Poly(amidoamine) Dendrimers for Preparing Nanoparticles of Gold, Platinum, and Silver
Nanoparticles of gold, platinum, and silver were prepared by reduction of their metal salts with NaBH4 in the presence of poly(amidoamine) dendrimers. The dendrimers used were generation 3, 4, and 5 having surface amino group (G3, G4, and G5) as well as generation 3.5, 4.5, and 5.5 having surface carboxyl group (G3.5, G4.5, and G5.5). The metal nanoparticles obtained were characterized by UV−vis spectroscopy and transmission electron microscopy. By using G3−G5, gold nanoparticles in the 1.5−4.0 nm size regime were obtained where their size decreased with increasing concentration of the dendrimers as well as the generation of the dendrimers. Similarly, platinum nanoparticles with a diameter of 2.4−3.0 nm were obtained, and their size was insensitive against the concentration as well as the generation of G3−G5. In the case of silver nanoparticles, very small silver particles using G3.5−G5.5 were obtained. In addition, the dendrimer concentration required for obtaining stable nanoparticles was found to be de...
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.