Model Magnet for the Proposed Superconducting Cyclotron at the University of Milan
A project for a superconducting cyclotron for heavy ions has been under study for a couple of years at the Cyclotron Laboratory of the University of Milan. The machine is conceived as a booster for a 16 MV Tandem to be installed at the Laboratories of Legnaro (Padua) of the Italian National Institute for Nuclear Physics (INFN). The K design value is approximately 540, thus allowing maximum energies between approximately 55 MeV/nucleon and approximately 14 MeV/nucleon for light and heavy ions respectively. Pole diameter is 1.8 m and maximum average field should be around 41 Kgauss, to be obtained by a total of 6.5 x 10/sup 6/ Aturns in the superconducting coils. At present a three spiral sector polar configuration is envisaged, with a 7 cm hill gap and 70 cm valley gap. Three dees, in the valleys, should provide a peak accelerating voltage of 100 kV, allowing a 3rd or 9th harmonic operation. While funding for the machine is still under discussion, a program centered upon the construction of a superconducting model magnet and a full scale rf model was started in 1976. The design features of the model magnet, whose construction is now completed, are reported.
The Chalk River Superconducting Heavy Ion Cyclotron
A superconducting heavy ion cyclotron has been chosen as the accelerator to extend the range of the Chalk River MP tandem. The tandem-cyclotron combination will accelerate all ions from Li (to 50 MeV/nucleon) through U (to 10 MeV/nucleon). The design of the integrated accelerator facility is underway as well as a full scale modelling program for both the magnet and RF system - the current status of these programs is reported.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.