Laser scanning of MOS IC's reveals internal logic states nondestructively
A laser scanning system has been used to observe the internal logic pattern in a MOS LSI device in a nondestructive manner. The laser scanner has also been used to selectively change logic states deep within the device. Pictures of the logic patterns revealed by the scanner are discussed.
Novel failure analysis techniques using photon probing with a scanning optical microscope
Three new failure analysis techniques for integrated circuits (ICs) have been developed using localized photon probing with a scanning optical microscope (SOM). The first two are light-induced voltage alteration (LIVA) imaging techniques that (1) localize open-circuited and damaged junctions and (2) image transistor logic states. The third technique uses the SOM to control logic states optically from the IC backside. LIVA images are produced by monitoring the voltage fluctuations of a constant current power supply as a laser beam is scanned over the IC. High selectivity for localizing defects has been demonstrated using the LIVA approach. Logic state mapping results, similar to previous work using biased optical beam induced current (OBIC) and laser probing approaches, have also been produced using LIVA. Application of the two LIVA based techniques to backside failure analysis has been demonstrated using an infrared laser source. Optical logic state control is based upon earlier work examining transistor response to photon injection. The physics of each method and their applications for failure analysis are described.<<ETX>>
Thermal incompatibility analysis of metal-ceramic systems based on flexural displacement data.
The feasibility of simple tests or analytical methods for prediction of residual stress states in metal-ceramic (MC) prostheses has not been demonstrated. Biomaterial metal-ceramic strips have been proposed to provide sensitive measures of transient and residual stress states through the measurement of midpoint deflection after cooling from the ceramic sintering temperature. The objective of this study was to apply the elastic-viscoelastic analogy to calculate transient and residual midpoint deflections in MC biomaterial strips and to compare these values with deflections measured with a beam-bending viscometer (BBV). Calculations and measurements were made for five MC systems that were found from a clinical study to be "thermally compatible" systems. Metal strips, 64 mm in length, 3 mm wide, and either 0.5 mm, 1.0 mm, or 2.0 mm in thickness, were veneered with four 0.25-mm thick layers of opaque porcelain. Midpoint deflection of the MC strips (ceramic oriented in the posterior position) was measured during cooling from an initial temperature of 700 degrees C. In general, the directions of the measured residual deflections did not agree with the "textbook" convention that negative deflections are associated with positive thermal contraction mismatch (alpha(M) - alpha(c) > 0) regardless of metal thickness. For a metal thickness of 0.5 mm, the residual midpoint deflection for all thermal contraction mismatch cases, except one, was positive (upward deflection) whereas the residual midpoint deflections were all negative when the metal thickness was increased to 1 or 2 mm, independent of the thermal contraction mismatch. The best agreement between calculated and measured values of residual midpoint deflection (+16 microns vs. +14 +/- 2.3 microns, respectively was obtained for MC biomaterial strips with a Ni-Cr alloy (0.5 mm thick) while the largest difference (+346 microns vs. +61 +/- 43.8 microns) was obtained for MC bimaterial strips with a Au-Pd allow (0.5 mm thick). In all but one case, changes in deflection direction as a function of metal thickness were correctly predicted by the viscoelastic analysis. The results of this study indicate that a viscoelastic model is useful for estimating thermal compatibility conditions of MC systems.