Electrical and thermal transport properties of icosahedral Al70Pd22.5(Re1−xMnx)7.5 quasicrystals
This work presents measurements of the electrical resistivity (ρ), Seebeck coefficient, and thermal conductivity (κ) of icosahedral Al70Pd22.5(Re1−xMnx)7.5 quasicrystals from 10to300K. A series of quasicrystals was prepared with x=0, 0.1, 0.2, 0.3, 0.5, 0.6, 0.8, and 1.0 to systematically study the effect of substitution. The electrical resistivity increases as the temperature decreases, suggesting a semiconductinglike behavior in these alloys. The room-temperature values of the Seebeck coefficient vary from −5μV∕K to +65μV∕K, showing a significant dependence on the value of x. However, κ exhibits a rather weak composition dependence in the temperature range investigated. The room-temperature dimensionless thermoelectric figure of merit (ZT) of this system is optimized at x=0.1. With further appropriate heat treatments, high ZT is presumably available at elevated temperatures in the Al70Pd22.5(Re0.9Mn0.1)7.5 sample.
Transport properties of Ti-Zr-Ni quasicrystalline and glassy alloys
We report on measurements of the temperature dependence of the electrical resistivity (ρ), thermopower (S), and thermal conductivity (κ) of Ti-Zr-Ni alloys between 10 and 300 K. A series of Ti-Zr-Ni quasicrystals (QCs) Ti40Zr40Ni20, Ti45Zr35Ni20, and Ti50Zr30Ni20 and metallic glasses Ti35Zr45Ni20 and Ti40Zr40Ni20 was prepared to systematically study the compositional and structural dependences of their transport properties. The resistivity of all these alloys was found to be very weakly temperature dependent with a negative temperature coefficient of resistance. Further, the observed increase in electrical resistivity with increasing Ti/Zr ratio is most likely due to the increase in disorder. The S/T against temperature curves exhibited a maximum between 20 and 50 K and a noticeable deviation from the expected linear behavior in S(T) at higher temperatures. Such observations in the thermopower of QCs have been attributed to the electron-phonon enhancement and phonon drag effect. The measured thermal condu...
Engineering bio-inks for 3D bioprinting cell mechanical microenvironment
Three-dimensional (3D) bioprinting has become a promising approach to construct­ing functional biomimetic tissues for tissue engineering and regenerative medicine. In 3D bioprinting, bio-inks are essential for the construction of cell microenviron­ment, thus affecting the biomimetic design and regenerative efficiency. Mechanical properties are one of the essential aspects of microenvironment, which can be char­acterized by matrix stiffness, viscoelasticity, topography, and dynamic mechanical stimulation. With the recent advances in functional biomaterials, various engineered bio-inks have realized the possibility of engineering cell mechanical microenviron­ment in vivo. In this review, we summarize the critical mechanical cues of cell micro­environments, review the engineered bio-inks while focusing on the selection princi­ples for constructing cell mechanical microenvironments, and discuss the challenges facing this field and the possible solutions for them.