Packaging technology by Liquid Mold-UnderFill (MUF) material for the advanced mobile devices
As one approach of advanced packaging technologies, high reliability Liquid Mold UnderFill (Liquid MUF) materials and unique process will be presented here. Liquid MUF materials have the features of high adhesion, low CTE and low modulus. It is possible to alleviate the stress of the solder of each device mounted in the package, and they have excellent reliability too. These materials are adjusted the workability depending on the application. Moreover, because of low viscosity, the Liquid MUF material could be mold-underfilled with relatively lower stress to large Flip Chip devices with small gap and narrow pitch compared to the conventional solid materials. As for the processes of the liquid materials, printing, dispensing and compression molding are applicable. In this paper, the printing process, especially vacuum printing encapsulation systems (VPES) and pressure curing systems, will be mainly discussed. In addition, module package structure that achieved by these material and process development will be also explained in detail.
New Encapsulation Process for the SIP (System in Package)
System-in-Package (SiP) is a promising concept of system integration. Different semiconductor technologies, integrated passives, and other components can be integrated into a single package, without compromising the performance of separate functional blocks. However, the increase of packaging density increases the complexity of structures. Therefore, new processes and materials are needed to achieve high reliable SiP module pkg. So in this test, we tried VPES (vacuum printing encapsulation system) as underfill and encapsulation process of SiP module. The size of SiP module package is 4.84(L) times 6.15(W) times 1.32(H) mm. It contains an IC chip and several passive components such as crystals, filters, register, capacitor, etc. IC chip size is 3.5 mm SQ, thickness 0.45 mm, and the standoff height is almost 0.06 mm. In this test we compared VPES and conventional underfill and molding process. During the VPES process we used pressure cure system to reduce the internal void size. SAT (scanning acoustic transmitter), 3D optical microscope, and shadow moire analysis were done. And reliability test such as MRT and T/C was performed.
LABORATORY AND FIELD TESTING OF SEED SPACING UNIFORMITY FOR SUGARBEET PLANTERS
Five planter configurations were evaluated for seed spacing uniformity at three field speeds using a seed 
location method in the field and a laboratory method involving an opto-electronic sensor system. Planter seed spacing 
uniformity was described using the Coefficient of Precision (CP3) measure. Results showed that CP3 measures 
determined using the laboratory test method were significantly different from those determined using the field test method. 
This indicated the laboratory test method cannot be used to predict planter seed spacing uniformity in the field. Seed 
spacing uniformity determined in laboratory tests was higher than, or equal to, seed spacing uniformity determined in 
field tests. This indicated the laboratory test method may be useful to screen out planters or planter units with poor 
uniformity of seed metering. Field testing of the planters that perform well in laboratory tests must be conducted to 
adequately determine the seed spacing uniformity of those planters in the field. Results from laboratory and field tests 
could be useful in determining areas for improvement of planters or planter units.