Growth study of chemical beam epitaxy of GaNxP1−x using NH3 and tertiarybutylphosphine
Abstract A study in the growth of GaN x P 1 − x epilayers by chemical beam epitaxy using tertiarybutylphosphine (TBP), ammonia (NH 3 ), and elemental Ga or triethylgallium is reported. Monitoring reflection high-energy electron diffraction (RHEED) intensity oscillations, we observe that both group-III- and group-V-induced incorporation rates are increased when NH 3 is introduced into a single cracker with TBP. From the difference in the periods of group-V-induced RHEED intensity oscillations, a 16% N incorporation is expected, but X-ray rocking curve measurement shows only 0.08% N. Using separate TBP and NH 3 crackers results in no enhancement in incorporation rates. We conclude that the cracking efficiency of TBP is increased with NH 3 co-injection.
Investigation of the thermal dissociation of PH3 and NH3 using quadrupole mass spectrometry
The thermal dissociation of PH3 and NH3 injected through a Ta‐based high‐pressure gas‐injection cell were studied. Using a quadrupole mass spectrometer, the Ta was found to effectively dissociate the PH3 into primarily P2, P4, and H2 molecules with an injector temperature as low as 550 °C. The introduction of NH3 through this same injector resulted in dissociation into N2 and H2 for an injector temperature greater than 900 °C. When NH3 and PH3 were coinjected, again P2, P4, N2, and H2 were the primary molecules produced; however, an additional dimer, PN, was also detected. The PN concentration was maximum at a cell temperature of 700 °C. This dimer was found to be an effective source for introducing nitrogen as an isoelectronic trap in GaP.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.