Electrical Breakdown of Ice at Cryogenic Temperatures
An ice or ice-silica compound system is attractive for electrical insulation at cryogenic temperatures. A sample of ice without silica was found to have a breakdown strength of 0.3 MV/cm for ac voltages, and 0.6 MV/cm for impulse voltages. The breakdown strength of an ceicesilica compound system was 0.7 MV/cm for ac voltages. There were no visible macroscopic cracks in the sample, but microscopic cracks and voids may exist, since partial discharges were observed at about half the value of the ac breakdown voltage. The relationship between partial discharges and microscopic voids, and the voltage-time characteristics of this insulation system were studied.
Electrical treeing in hexagonal ice crystals under applied impulse voltage
Using two hexagonal samples of ice, polycrystalline and single-crystalline, the electrical treeing has been investigated under an applied impulse voltage. The crystallinity and temperature of the ice play an important role in the events of the treeing. In the single-crystalline ice, the tree in the samples at -25 /spl deg/C always progressed along the basal plane of the ice crystal, but at -196 /spl deg/C, it progressed along the c-axis. These distinctive patterns of the tree progression were attributed to the crystal axis dependence on the electrical conductivity and the relative permittivity at each temperature. The current accompanying the trees were detected by means of an electro-optic coupling with light emitting diodes and photodiodes. After the large current pulses which occur just after voltage application, small intermittent current pulses were visible in the wave tail of the applied voltage. These intermittent pulses appear to generate by the movement of accumulated charges after the formation of tree channels. The electrical breakdown strength of ice at -25 C was large for the electric field parallel to the c-axis of the single-crystalline ice.
Monte Carlo Study of the Effect of Backscatter Materail Thickness on 99 mTc Source Response in Single Photon Emission Computed Tomography
Introduction SPECT projections are contaminated by scatter radiation, resulting in reduced image contrast and quantitative errors. Backscatter constitutes a major part of the scatter contamination in lower energy windows. The current study is an evaluation of the effect of backscatter material on FWHM and image quality investigated by Monte Carlo simulation. Materials and Methods SIMIND program was used for simulation of a Siemen’s dual-head variable angle scintillation gamma camera. Planar and SPECT scanning of a 99m Tc source and a Jaszczak phantom for varying thicknesses of Perspex slabs, as a backscatter media, were analyzed using the photopeak and scatter windows. Simulated planar images and reconstructed tomographic images were evaluated qualitatively, by two nuclear medicine specialists, and quantitatively, by Structural Similarity (SSIM) Index. Results In the 99m Tc photopeak window, no significant change in total counts due to backscatter material was measured. In the scatter windows, scattering was overestimated compared with a simulated backscatter free SPECT system. For instance, at a thickness of 10 cm, total counts of a 99m Tc source detected in the 72 keV windows eventually doubled with increasing backscatter material, compared with the situation without backscatter material. The backscatter contribution plateaued when more than 7 cm of scatter material was placed but there were optimized results for a backscatter thickness of 4.5 cm. Better image quality for the thickness was confirmed by the results of eye interpretation and also by SSIM algorithm. Conclusion Backscatter should be taken into account, particularly in model-based scatter correction methods in SPECT for an accurate simulation system optimization.