Three dimensional packaging and interconnecting techniques for microwave modules
Three dimensional (3D) packaging and interconnecting techniques can greatly reduce the weight and volume of conventional planar microwave modules. The objective of this study was to employ a novel 3D structure with simple manufacturing process to develop 3D microwave modules. Many advanced 3D packaging and interconnecting methods, such as LTCC microwave multichip modules, vertical interconnects, and 3D electromagnetic field analyzing and optimizing, were applied to increase the package density and improve the electric performance. Test method and test results of 3D microwave modules were introduced. These techniques are very useful to many types of modern active phased array radar systems and communication systems.
Advanced interconnecting techniques of integrated T/R modules
The basic requirements for transmit/receive(T/R) modules of active phased array radar systems are small volume and light weight with excellent microwave performance and uniformity. The objective of this study was to employ new interconnecting techniques to develop high density, integrated T/R modules. Many advanced interconnecting methods were applied to increase the package density and improve the electric performance. High density, integrated T/R modules with good microwave performance and uniformity were manufactured successfully. These techniques are very useful to many types of modern active phased array radar systems.
Representation of systems disturbed by wide band noise
In this paper, a method of handling and working with wide band noise is developed. We represent wide band noise as a distributed delay of white noise and use it to reduce a nonlinear system disturbed by wide band noise to a nonlinear system disturbed by white noise. An application of this reduction to a nonlinear filtering problem under a wide band noise disturbance is discussed.