“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Planar glass waveguides for ffigh performance electrical-optical-circuit-boards (EOCB) - the glass-layer-concept
Io this paper a new concept for Electrical-Optical Circuit Boards (EOCB) using thin glass sheets with integrated multimode optical waveguides will be presented. The thin glass is promising an improvement of the thermal-mechanical behaviour of a PCB as well it provides suitable optical properties. Efforts were therefore hegun to develop a base material that can be laminated in between or on the outside with a thm layer of glass that in subsequent process steps can be structured providing optical waveguides to implement multimodal transmission of light. It will be shown that such glass layers can be handled by standard lamination technology of the PCB fabrication process. This means, that planar glass waveguides can be incorporated into the circuit board package. Concerning the waveguide structuring several subconcepts are described with focus on ion exchange in molton salt. First experimental results are shown and discussed. Introduction Electrical transmission of signals will presumably soon run up against its limits. A Pentium 4 processor of today runs with 2,4 GHz but the bus speed is only 400 MHz. The reason for this bottleneck in computing systems (Figure 1) are the limitations of electrical interconnects on PCB (loss, crosstalk, EMV-sensitivity, reflections). PW51 PPXDU PtCO'3 Pllliml P B a PI lWO Pa
Interviewing In Context
PART ONE: PRELIMINARY CONSIDERATIONS. An Introduction to Interviewing. Understanding Contextual Factors. PART TWO: BASIC CONSIDERATIONS: FOUNDATIONS FOR COMMUNICATION. Developing the Structure of the Interview. Understanding Questions. Using Questions. PART THREE: ORGANIZATIONAL CONTEXTS. The Selection Interview: The Interviewer's Perspective. The Selection Interview: The Applicant's Perspective. The Performance Appraisal Interview. PART FOUR: PROFESSIONAL CONTEXTS. The In-Depth Information Gathering Interview. The Survey Interview. The Problem-Solving Interview. The Persuasive Interview