Influence of hydrogen on magnetic properties of soft magnetic amorphous alloys
The influence of electrolytic hydrogenation on the magnetic properties of three different kinds of amorphous alloys has been investigated. The alloys studied were Fe/sub 83.3/Si/sub 3.5/B/sub 11.2/C/sub 2/, Fe/sub 38/Ni/sub 38/Mo/sub 2/Si/sub 8/B/sub 14/, and (Co/sub 86/Fe/sub 5/Cr/sub 9/)/sub 75/Si/sub 10/B/sub 15/. The experimental results showed that after hydrogenation the samples became very brittle and the soft magnetic properties degraded dramatically, but saturation magnetization sigma /sub s/ and average hyperfine field increased markedly. As hydrogen evolved from the charged samples which were placed in air at room temperature, the magnetic properties, toughness, and average hyperfine field were gradually recovered. >
Soft magnetic properties of hydrogenated, compositionally modulated, amorphous, Fe-Zr thin films
Magnetic properties and stability of hydrogenated, amorphous, compositionally modulated (CM) Fe-Zr thin films were studied in this work. These films had average compositions Fe/sub x/Zr/sub 100-x/ with x=80, 82, 85, modulation periods of /spl sim/10 /spl Aring/, and total thicknesses of /spl sim/1000 /spl Aring/. In comparison with results obtained for similar homogeneous films, the CM films could be electrochemically charged with larger amounts of hydrogen in much shorter times. The hydrogen induced increases (HIC) in the Curie temperatures of CM films were compatible to those reported for homogeneous films, but the increases in the magnetizations were greater. While the HIC in the magnetic state of homogeneous films are reversed by hydrogen effusion, in CM films they relax to a stable, irreversible, soft magnetic state with interesting magnetic properties.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.