Solderability Characteristics of Palladium , Palladium Nickel , Hard and Soft
Palladium and palladium alloys are the only serious ahematives to gold as an "electronic finish". In the past, the major impetus for such a substitution has been economic; however, today palladium's technological advantages are generally recognized. This is especially true in the connector markets where the material properties (e.g. hardness, ductility, thermal stability, etc.) of palladium are in many instances superior to hard gold. Recent advances in plating technologies coupled with a m r e thorough understanding of the materials properties have expanded the use of electroplated palladium and palladium alloys in the PCB, semiconductor and optoelectronic packaging markets. To assess the suitability for such applications, the wire bondability and solderability of these finishes need to be investigated.
WEAR RELIABILITY OF GOLD-FLASHED PALLADIUM VS. HARD GOLD ON A HIGH-SPEED DIGITAL CONNECTOR SYSTEM
Analyse par microscopie optique, microscopie electronique a balayage et fluorescence RX de la resistance a l'usure des depots electrolytiques de palladium destines a la fabrication de contacts electriques.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.