Remarks on multimodal nonverbal interface and its application to controlling mobile robot
This paper proposes a multimodal nonverbal interface system using bio-potential signals, such as EOG and EMG, and image processing and investigates its possibility of applying to control a mobile robot. To evaluate the feasibility and the characteristics of the multimodal nonverbal interface system, teleoperation control experiments of the robot are carried out. By comparing the experimental results with those obtained using a conventional keyboard interface, the effectiveness of the proposed interface system is confirmed.
SVM-based Brain-Machine Interface for controlling a robot arm through four mental tasks
Abstract Human–Machine Interfaces can be very useful to improve the quality of life of physically impaired users. In this work, a non-invasive spontaneous Brain–Machine Interface (BMI) has been designed to control a robot arm through the mental activity of the users. This BMI uses the classification of four mental tasks in order to manage the movements of the robot. The high accuracy in the classification of these tasks (around 70%) allows a quick accomplishment of the experiment designed, even with the low signal-to-noise ratio of this kind of signals. The experiment consists of reaching four points in the workspace of an industrial robot in the established order. After a brief training, the volunteers are able to control the robot in a real time activity. The real time test shows that the system can be applied to do more complex activity such as pick and place tasks if a supplementary system is added. These interfaces are very adequate in the control of rehabilitation or assistance systems for people suffering from motor impairment.
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.