Novel Program Method of String Select Transistors for Layer Selection in Channel-Stacked NAND Flash Memory
In this paper, we propose new string select transistors (SSTs)/dummy SSTs (DSSTs) threshold voltage (Vth) setting methods in simplified channel-stacked array with layer selection by multilevel operation (SLSM). In these methods, SSTs/DSSTs on each layer are set to their targeted Vth values by incremental step pulse program/one erase with various erase voltages, respectively. In the fabricated pseudo-SLSM, the validity of the new methods is verified. As a result, it is confirmed that the Vth values of SSTs/DSSTs are set to the targeted Vth values by the new methods and SSTs with extremely narrow Vth distribution can be obtained in the consequence. Moreover, memory operations such as erase, program, and read are performed in the fabricated structure after setting the Vth values of all the SSTs/DSSTs by the new methods. Despite unique LSM operations, stable memory operations are obtained successfully without the interference between stacked layers.
Analysis on Program Disturbance in Channel-Stacked NAND Flash Memory With Layer Selection by Multilevel Operation
Program disturbance is analyzed in a simplified channel-stacked array with layer selection by multilevel operation after setting the threshold voltages (Vth) of string select transistors (SSTs)/dummy SSTs. There are additional unselected cells that should be inhibited in different ways, and they have the worse disturbance characteristics compared with conventional NAND arrays. Technology computer-aided design simulations and measurements are performed to investigate the disturbance mechanism of the additional cases. It is found that initially nonprecharged channel and large leakage current flowing from channel to bitline degrade the disturbance. New program method is proposed along with low gate bias of dummy wordline. As a result, program disturbance is significantly improved and reliability is also enhanced by reducing the potential difference between the SST gate and the channel.
A 3.3 V 128 Mb multi-level NAND flash memory for mass storage applications
The NAND flash memory was originally designed to target solid-state mass storage applications. Key requirements of mass storage, low cost and high serial access throughput, have been achieved by sacrificing a non-critical feature, fast random access. For a quantum step in cost reduction, the multi-level cell is combined with NAND flash memory. This 128 Mb multi-level NAND flash memory stores two bits per cell by tight programmed cell threshold voltage (Vth) control and is made practical by significantly reducing program disturbs.