Thermo-mechanical characterisation of a nanosized particle filled underfill
This paper describes work carried out as part of a larger project aimed at the development of nanosized particle filled underfill material. Several characterisation experiments have been applied to study the influence of these particles on the curing behaviour and the thermomechanical properties such as the coefficient of thermal expansion, geltime, glass transition temperature, and modulus. Constitutive models are assessed for their ability to describe the observed behaviour
Prediction of mechanical stresses induced by flip-chip underfill encapsulants during cure
A constitutive model is presented for predicting the stresses in thermosetting resins during and after cure. An overview is given of the experimental techniques used for estimating the parameters in this model. The model is validated by comparing its predictions to a second set of measurements that has not been used for the actual parameter estimation. This validation shows that the model is capable of giving fair predictions of the measured stresses. The model is implemented in a commercially available finite element package and its use is demonstrated by applying it to the study of a flip-chip underfilling process.
SR topography of plastically deformed Fe-Si bicrystals - observation in situ and post mortem
SR reflection topography was applied to study the interaction of slip dislocations with the grain boundaries in Fe-4at%Si bicrystals deformed by compression. Three experimental settings with either a white or monochromatic beam were used and the corresponding orientation contrast analysed. Dislocation transmission through the grain boundary was observed in bicrystals with favourable geometry of the slip systems.