Three dimensional mechanical numerical analyzing on mine pass construction of metal mine
Mine use sublevel caving method, in the production process, the mine pass is an essential ore transport channel, in the production plays an very important role. Therefore the stability of the chute is an important technical support of the mining production and the safety in underground metal mines. Taking a sublevel caving method mining as the research background, Using the MIDAS / GTS finite element software to do numerical analysis of the chute excavation and support of three-dimensional mechanical problems. Results show that: After chute excavation, the wall within 0.3m of a significant displacement, shift several millimeters; different levels of access road excavation, the wall is affected little, But the access road junction with the chute significant displacement, especially with the chute increase the depth of wall the displacement increases; Slip road connecting the wells and different levels of support according to the design parameters, the effect of displacement control of the range of wall displacement and the interchange of access road and chute is significant.
Similar material simulation of time series system for induced caving of roof in continuous mining under backfill
在类似的材料模拟测试的帮助下，在 Tongkeng 锡的矿石身体 No.92 在复杂装填下面在连续采矿为房顶的导致的探穴预定系列系统我的被学习。根据类似理论，一个二维的类似的模拟试验台被构造。与采矿的进展一起变化的压力和排水量被数据系统自动地获得并且分析。在 5 间隔和房顶的人工的导致的探穴的矿石块的连续采矿的过程被模仿。那矿石身体作为安全仍然是的测试表演的结果在 m 保证停止工作脸的安全进展得到的 15 的厚度给装上顶部。当连续采矿的第三间隔被完成时，房顶在开始的二采矿间隔在实践放的安全的探穴，和安全距离应该在停止和探穴之间总是被保留的一间隔。当时在最后间隔的采矿，槽 pre 应该首先被实现，并且最后二采矿间隔的房顶同时是 caved。这种仅仅时间系列系统能是为在连续采矿的房顶的导致的探穴的一个有效、安全的方法。
Testing digital circuits using a Mixed-Signal Automatic Test Equipment
This paper presents the results of parametric testing of digital ICs using a dedicated Mixed Signal Automatic Testing Equipment. Due to the prohibitive price of the ATE equipment and dedicated Device Interface Board (DIB) for digital Integrated Circuits (ICs), a DIB for analog circuits was used to perform the testing. Despite the challenges presented by the experiments, the results prove to be accurate for the performed tests, according to the data sheet of the digital ICs and production test data provided by the manufacturer.