Twenty barrel in situ pipe gun type solid hydrogen pellet injector for the Large Helical Device.
A 20 barrel solid hydrogen pellet injector, which is able to inject 20 cylindrical pellets with a diameter and length of between 3.0 and 3.8 mm at the velocity of 1200 m/s, has been developed for the purpose of direct core fueling in LHD (Large Helical Device). The in situ pipe gun concept with the use of compact cryo-coolers enables stable operation as a fundamental facility in plasma experiments. The combination of the two types of pellet injection timing control modes, i.e., pre-programing mode and real-time control mode, allows the build-up and sustainment of high density plasma around the density limit. The pellet injector has demonstrated stable operation characteristics during the past three years of LHD experiments.
Injection barrel with a tapered structure for a low speed and small size cryogenic hydrogen pellet in medium-sized plasma fusion devices.
An injection barrel was designed and fabricated for a small size 0.8 mm cryogenic pellet with a low speed of 200-300 m/s in medium-sized plasma fusion devices. Pellet injection with pneumatic acceleration was examined using a conventional in situ technique. A tapered structure was applied in the downstream side of the injection barrel to satisfy the requirement of pellet speed reduction by expansion of the propellant gas. Shadowgraph and light gate measurements show that the intact pellets have speeds of 260 ± 30 m/s and a typical size of 1.1-1.2 mm. The pellet ablation code based on a neutral gas shielding model shows that the penetration depth of the measured pellet parameters does not cross the plasma center, even in medium-sized plasma devices such as the Heliotron J helical device. The injection barrel with a tapered structure developed in this study is feasible for low speed pellet injection.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.