Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets.
The vibration characteristics of an aluminum surface subjected to ultrasonic waves were investigated with a combination of numerical simulation and experimental testing. The wetting behavior of solder droplets on the vibrating aluminum surface was also examined. The results show that the vibration pattern of the aluminum surface is inhomogeneous. The amplitude of the aluminum surface exceeds the excitation amplitude in some zones, while the amplitude decreases nearly to zero in other zones. The distribution of the zero-amplitude zones is much less dependent on the strength of the vibration than on the location of the vibration source. The surface of the liquid solder vibrates at an ultrasonic frequency that is higher than the vibration source, and the amplitude of the liquid solder is almost twice that of the aluminum surface. The vibration of the surface of the base metal (liquid solder) correlates with the oxide film removal effect. Significant removal of the oxide film can be achieved within 2s when the amplitude of the aluminum surface is higher than 5.4 μm or when the amplitude of the liquid solder surface is higher than 10.2 μm.
Wetting mechanism of Sn to Zr50.7Cu28Ni9Al12.3 bulk metallic glass assisted by ultrasonic treatment.
In this work, pure Sn was used to wet Zr50.7Cu28Ni9Al12.3 bulk metallic glasses (BMGs) assisted by ultrasonic treatment. Without ultrasonic treatment, pure Sn showed a non-wetting condition to BMG. Ultrasonic vibration facilitated the wetting of Sn to BMG. Prior to ultrasonication for 30 s, only physical adsorption formed at the Sn/BMG interface. Increasing ultrasonic time led to the alteration of the bond at the Sn/BMG interface from point contact to local surface contact, and to diffusion layer. Two bonding modes of order-order and order-disorder were discovered at the Sn/BMG interface. Cu content was higher than the other elements near the bonding interface. Longer diffusion distances of Sn into the BMG were obtained at high ultrasonic power, high temperature and large dip depth.
The crystal structure of stilpnomelane. Part II. The full cell
Summary The structural formula of stilpnomelane averaged from 37 representative literature analyses and based on the determined structure is (Ca,Na,K)4(Ti0·1Al2·3Fe35·5Mn0·8Mg9·3)[Si63Al9](O,OH)216·nH2O. Ferrostilpnomelanes have up to 12 R 3+ cations in the octahedral sheet, ferristilpnomelanes commonly have between 24 and 30 R 3+ cations, rarely up to 37. The two groups can be distinguished by accurate X-ray powder diffraction, ferrostilpnomelanes having d 001 less and a greater than have ferristilpnomelanes. The unit cell is triclinic, a = b∼21·8 Å, γ = 120°, d 001∼12·2 Å, P . Hexagonal groups or ‘islands’ of 24 silicon-oxygen tetrahedra co-ordinate to the octahedral sheet, the centres of the ‘islands’ are displaced by 5a/12, 8b/12 on either side of the octahedral sheet as a result of warping of this sheet to permit articulation with the smaller tetrahedral sheet. The 24-tetrahedra ‘islands’ are linked laterally by 6-member rings of inverted tetrahedra, which in turn link at their apices to like rings connecting the next sheet of ‘islands’. Thus a single tetrahedral layer is 4 tetrahedra thick and has symmetry 6/m. The 6-member rings of tetrahedra act as hinges permitting up to 0·5 Å extension or contraction of the tetrahedral sheet to accommodate variations in the octahedral sheet dimensions with varying R 2+/R 3+ ratio.