3D integration technologies for MEMS
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography.
Research on Effect of Annealing on Copper Deposited by Electroplating in High Density TSV
Through silicon via (TSV) has proved to be a vital interconnection component in three dimensional circuit intergration and advanced packaging, for it has incomparable superiorities in device miniaturization, high density and multifunction. However, in TSV structure, the stress of thermal mismatch between silicon and electroplating deposition(ECD) copper and the accumulated residual stress in process make thermal-mechanical reliability become a main factor affecting the development of TSV technology, which may perhaps result in serious reliability problems once an appropriate destressing treatment is not taken. In order to improve the reliability of TSV, annealing is used to facilitate the recrystallization of ECD copper and reduce structure stress. In this article, a large size TSV in which the diameter is 30µm and the depth is 200µm with a high density of 0.59% was fabricated and then filled with ECD copper. After a pre-CMP process, annealing experiments at different conditions were designed to get a less residual stress structure. TSV pumping was measured by Step Profiler. Scanning Electronic Microscopy (SEM) and Electron Backscattered Diffraction (EBSD) were used to characterize ECD copper after annealing. Effect of annealing on ECD copper was studied and appropriate annealing parameters were acquired according to the measured results above.
Project management education: The human skills imperative
Abstract This paper is intended to provide an insight into the importance of human skills in project management success and the apparent lack of emphasis placed on this within the context of university education. The discussion will call upon the viewpoints of many notable authors in respect to the human or ‘soft’ skills that are necessary in the management of projects. Against this background a review will be conducted into how well project management literature and university education equips potential project managers in the area of human skills. As the PMBOK ® Guide is one of the major recommended texts in Australian universities offering project management education, the paper will identify that it predominantly emphasises the required ‘hard (technical) skills’ at the expense of the ‘soft (human) skills’. Subsequent discussion will highlight the need for a balance between hard and soft skills within project management education in universities. It will conclude that educators within this discipline should recognise the importance of incorporating greater human skills aspects into their educational programs.