Adhesion evaluation of adhesiveless metal/polyimide substrate for MCM and high density packaging
Directly metallized polyimide films are being widely used as advanced high-density packaging substrates. Adhesion of metal to polyimide is a key performance requirement of the film. Excellent initial adhesion and good retention after severe process steps and reliability stresses are required. In this paper, the adhesion performances of films with different types of polyimide and tie layer from multiple vendors have been evaluated. The interface failure mechanisms are also examined via SEM micrographs and XPS survey scans. Peel strength and its retention behaviour are characterized in term of tie layer materials, environmental stresses and surface analysis results. The object of this work is to select the proper base material for high-density flexible multilayer substrates, a technology which is under development by FCPT.
Oxygen induced adhesion degradation at metal/polyimide interface
The role of oxygen in affecting the adhesive bonding at the metal/polyimide (polyimide‐on‐metal) interface has been studied. Both pyromellitic dianhydride (PMDA) ‐oxydianiline (ODA) and biphenyl‐tetracarboxylic dianhydride(BPDA) ‐p‐phenylene diamine (PDA) based poly(amic acid) precursors were cast and fully imidized on metal surfaces of Cr, Cu, Ni, Co, Cu/Ni, and Cu/Co in a nitrogen atmosphere. The peel strengths at the polyimide‐on‐metal interface were measured, using a 90° peel test, immediately after curing, and then remeasured after annealing in either nitrogen (N2−≤100 ppm O2 ) or air (N2 –21% O2 ) at 350 °C for 1 h. Very little or no change in peel strength was measured after these samples were annealed in nitrogen, while significant adhesion degradations were measured on all metals after annealing in air. The loss of polyimide (PI) adhesion to the Cu or Co surface is attributed to metal catalyzed thermal–oxidative degradation of the PI at the metal/PI interface, as characterized by polyimide thickn...
A study of the adhesion of copper to polyimide foils using surface analytical techniques
SummaryThe adhesion of chemically and electrochemically deposited copper films on commercial polyimide foils has been studied using scanning electron microscopy, photoelectron spectroscopy, EDX and IR reflection-absorption spectroscopy. Experiments have been carried out on the bare surface and the deposited layers as well as on surfaces prepared by peeling off the deposits. The results show that, at least for the case considered here, poor adhesion is caused by cohesion failure in the foil itself, and that a thin surface layer of the polyimide foil is important for the interface bond. IR spectroscopy was used to study the molecular nature of this surface layer.