Improving the reliability of radar T/R module with precise cleaning technology
Because we adopt high precision microelectronic assembly technologies during the manufacturing of radar T/R modules, these modules are complex and delicate. Common cleaning technologies such as ultrasonic cleaning can't satisfy the requirement of high precision cleaning of these modules. This article introduces some precise cleaning technologies, these cleaning technologies not only can make T/R module achieve a high cleanness, but also does little harm to them, and they will greatly improve the reliability of T/R module.
A new bumping process using lead-free solder paste
In this paper, we report development of a new process for lead-free solder bumping with no flux residues, using stencil printing and hydrogen radicals, which can lessen both the environmental load and the manufacturing cost of solder bumping. In this process the reduction of the hydrogen radicals, instead of the flux, will eliminate the surface oxides of the stencil printed lead-free solder paste. Sn-3.0Ag-0.5Cu lead-free solder paste, which contains no residue flux was printed on an 8-in wafer. Hydrogen plasma was radiated for a minute during the reflow process, and the printed paste formed a bump. Reflow experiments without hydrogen radicals treatment were also carried out for comparison, where no successful reflow could be observed.
The measuriment of ferromagnets magnetic characteristics using Labview software
The digital method of measurement and registration of dynamic loops hysteresis family of magneto-soft materials where, along with known analogues from electro-technical steel, magnetic materials with considerably smaller specific magnetic losses such as amorphous alloys on the basis of iron, is offered. Tests of magnetic properties of materials are carried out on the base of the hardware-software measuring complex in which along with the standard established electric equipment and USB oscillograph for realization of a digital method, the software for the personal computer developed in the environment of visual programming of Borland Delphi 7.0, connected through the ActieveX technology with the Labview 7.0 environment, is applied. The software allows carrying out input of basic data concerning geometry of prototypes of cores from magnetic materials and numbers of rounds of the magnetizing and measuring windings located on their surface. Experimental data on voltage at measuring winding terminals are processed by means of the virtual integrator in a Labview package. The developed software provides the possibility of saving the obtained hysteresis loop in the form of a text file, and creation of the hysteresis loops family on the virtual oscillograph screen.