Trends in the Development of Machinery and Associated Technology ” TMT 2010 , Mediterranean Cruise , 11-18 September 2010 ANNEAL HARDENING EFFECT IN SINTERED COPPER ALLOYS DEPENDENCE ON ALLOYING ELEMENTS AND DEFORMATION
This paper reports results of investigation carried out on sintered copper alloys: Cu-8at%Ni, Cu8at %Zn, Cu-8at%Al, Cu-8at%Ag, Cu-4at%Ni-4at%Sn, Cu-4at%Ni-4at%Zn and Cu-4at%Au. For comparison, investigation carried out on the sintered copper. The sintered alloys, as well as pure copper, were subjected to the same thermomechanical treatment. Thermomechanical treatment included cold rolling of 30,50 and 70% in reduction. Isochronal and isothermal annealing up to the recrystallization temperature were performed, followed with hardness and electrical conductivity measuring. This investigation shows that hardness and electrical conductivity of cold deformed copper-alloys increase after annealing in the temperature range of 160 400°C, due to anneal hardening effect. Electrical conductivity decreases with increasing the amount of alloying elements. During the annealing the electrical conductivity slowly increases for both set of the samples copper and alloys due to recovery and recrystallization
Anneal hardening effect in sintered copper alloys
Samples of copper and copper alloys CuNi and CuNiAl were prepared by a powder metallurgical method and were then subjected to cold rolling with different degrees of deformation. Copper and copper alloys in the cold-rolled state were isochronally annealed up to the recrystallization temperature during which hardness and electrical conductivity were measured. This investigation shows that the anneal hardening effect occurs in a temperature range of 450 - 650 K, followed with an increase in hardness of alloys.
Traceability strategy for gear-pitch-measuring instruments: development and calibration of a multiball artifact
There is a strong demand to ensure the traceability of gear-measuring instruments (GMIs). We propose a multiball artifact (MBA) for the evaluation of pitch-measuring accuracy. The aim of the MBA is to transfer the minimum uncertainty from a calibrated value at the National Metrology Institute of Japan (NMIJ) to a measured value of GMIs at a shop floor. The MBA is composed of equally spaced high-accuracy balls around an axis. The pitch-measuring accuracy of GMIs is evaluated by measuring the angular pitch deviation of the balls instead of the angular pitch deviation of a gear. We calibrated the angular pitch deviation using a coordinate measuring instrument (CMM) at the NMIJ and adapting a multiple-orientation technique. We proposed a calibration strategy of the angular pitch deviation. The calibration value of the pitch deviation for the MBA at the NMIJ was obtained with a measurement uncertainty (U95) of 0.2 µm. We evaluated the pitch-measuring accuracy of a GMI using the calibrated MBA. Each value of U95 for the cumulative and single pitch deviations for the left and right flanks was less than or equal to 0.5 µm. The small uncertainty was transferred from the NMIJ to the GMI.