Influence of reinforcement arrangement in flexural fire behavior of hollow core slabs
Abstract This paper describes standard scale fire tests conducted on four precast prestressed hollow core slabs configurations under flexure. The influence of the reinforcement arrangement was investigated using two test parameters: the average axis distance (from 30.1 to 46.7 mm), and the type of reinforcement (5 mm diameter wires and 9.5 mm diameter strands). An ISO 834 standard fire was applied maintaining the load level in a four-point test arrangement constant. The results presented different failure mechanisms, types of cracks, spalling patterns, and fire resistance ratings and it was shown that wires displayed optimal behavior as opposed to strands. A comparison was carried out with the current verification methods provided in Eurocode 2 part 1–2, and showed that verification methods tend to overestimate the calculation of fire resistance when both wire and strands are moved away from the exposed surface.
Finite-shell-element models for the dynamic analysis of hollow-core concrete floor
Precast and prestressed hollow-core concrete slabs are widely used in construction. The combination of low self-weight and high strength of such slabs makes it possible to design floors with long s...
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.