Advanced Plasma Nitriding for Aluminum and Aluminum Alloys
Low hardness and wear resistance of aluminum alloys limit their use in practical application to automotive parts. Formation of hard aluminum nitride (AlN) layer on the surface can prolong the life time of aluminum automotive parts. Plasma nitriding was selected in the present study to form AlN layer on aluminum alloys. This processing is an environmental friendly method because of its low gas and energy consumption. Normal plasma nitriding requires long processing time to successfully form AlN layer. For advancing this surface treatment, refining microstructure and micro-alloying processes are proposed to activate the formation of AlN by plasma nitriding. Bulk Mechanical Alloying is used not only to make grain-size refinement but also to carry out micro alloying with addition of 1 mass%Ti. The formation rate of AlN layer is improved from 4:2 � 10 � 5 mm/s to 20:8 � 10 � 5 mm/s by microstructure refining. In particular, since the co-formed TiN with AlN works as a template in the initial state nitriding, the micro-alloyed aluminum can be nitrided even without pre-sputtering.
Novel adhesion promotion of aluminium for aerospace environments
This study focuses on analysing the durability of adhesive bonds formed in samples of Aluminium 6063, Titanium Nitride deposited Al 6063 and Anodized Al 6063 using epoxy adhesive Weicon A. Two types of studies are performed, first, samples of Aluminium 6063, Titanium Nitride deposited Al 6063 and Anodized Al 6063, are bonded by an epoxy adhesive Weicon A. Second, the samples are bonded by the adhesive with reinforcement of Ca2SiO4 nanoparticles in different proportions. The samples are examined using the scanning electron microscopy to study the morphology of the coating. A lap shear test is performed to determine the strength of the adhesive after the specimens were subjected to harsh chemical environments. A thermogravimetric analysis is performed on the adhesive to understand the effect of nanoparticles in the thermal stability in the Weicon A. It is understood from the tests that the titanium nitride coated Al 6063 samples bonded with Weicon A exhibited greater bond strength and also retained the strength when exposed to harsh environments. The inclusion of calcium silicate nano-particles showcased a considerable reduction in the bond strength. The thermal stability of Weicon A seems to be unaffected by the inclusion of calcium silicate nanoparticles.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.