Ultra low power consumption operation of SOA assisted extended reach EADFB laser (AXEL)
We propose a novel structure to reduce the power consumption and extend the transmission distance of a 10-Gbit/s, 1.55-µm EADFB laser. The power consumption is reduced by 1/2 and the transmission distance is extended.
Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/ $\lambda $  Transmitter
We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulseamplitude modulation operation after a 10-km single-mode fiber transmission.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.