Use of thermal sieve to allow optical testing of cryogenic optical systems.
Full aperture testing of large cryogenic optical systems has been impractical due to the difficulty of operating a large collimator at cryogenic temperatures. The Thermal Sieve solves this problem by acting as a thermal barrier between an ambient temperature collimator and the cryogenic system under test. The Thermal Sieve uses a set of thermally controlled baffles with array of holes that are lined up to pass the light from the collimator without degrading the wavefront, while attenuating the thermal background by nearly 4 orders of magnitude. This paper provides the theory behind the Thermal Sieve system, evaluates the optimization for its optical and thermal performance, and presents the design and analysis for a specific system.
Large-aperture space optical system testing based on the scanning Hartmann.
Based on the Hartmann testing principle, this paper proposes a novel image quality testing technology which applies to a large-aperture space optical system. Compared with the traditional testing method through a large-aperture collimator, the scanning Hartmann testing technology has great advantages due to its simple structure, low cost, and ability to perform wavefront measurement of an optical system. The basic testing principle of the scanning Hartmann testing technology, data processing method, and simulation process are presented in this paper. Certain simulation results are also given to verify the feasibility of this technology. Furthermore, a measuring system is developed to conduct a wavefront measurement experiment for a 200 mm aperture optical system. The small deviation (6.3%) of root mean square (RMS) between experimental results and interferometric results indicates that the testing system can measure low-order aberration correctly, which means that the scanning Hartmann testing technology has the ability to test the imaging quality of a large-aperture space optical system.
Finite Difference Modeling on the Temperature Field of Substrate in Friction Surfacing
Friction surfacing is an advanced process of great potential, especially in the field of repair and reclamation of worn and damaged components. As a kind of thermal processing technology, the temperature profile and changes of the substrate in friction surfacing are important factors to get coatings of high quality. In this paper, the temperature field of the substrate during the process is simulated by finite difference method. The results are consistent with experiments, reappearing the temperature change of the substrate during friction surfacing, allowing further study on figuration and quality of coatings.