Design of Wind Turbine Blade with Thick Airfoils and Flatback and its Aerodynamic Characteristic
large-scaled blade has posed many problems related to design and production. After introducing the features of blade with thick airfoils and flatback, based on relevant parameters of Huaren 100 kW wind turbine, the paper designed blade with thick airfoils and flatback, introduced blade parameter design, and analyzed the aerodynamic performance of blades using GH bladed software, obtaining the relationship between power output of wind turbine with blade tip speed ratio Cp. Furthermore, it analyzed the aerodynamic performance of original design blades, modified blades and Huaren 100 kW blades, and assessed the aerodynamic performance of modified blade.
An Improved BEM Model for the Power Curve Prediction of Stall-regulated Wind Turbines
Blade element momentum (BEM) theory is the standard computational technique for the prediction of power curves of wind turbines; it is based on the two-dimensional aerodynamic properties of aerofoil blade elements and some corrections accounting for three-dimensional wing aerodynamics. Although most BEM models yield acceptable results for low-wind and pitch-controlled regimes where the local angles of attack are small, no generally accepted model exists up to date that consistently predicts the power curve in the stall regime for a variety of blade properties and operating conditions. In this article we present a modified BEM model which satisfactorily reproduces the power curves of four experimental wind turbines reported in the literature, using no free fit parameters. Since these four experimental cases comprehend a great variety of conditions (wind tunnel vs field experiments, different air densities) and blade parameters (no twist and no taper, no taper but twist, both twist and taper, different aerofoil families), it is believed that our model represents a useful working tool for the aerodynamic design of stall-regulated wind turbines. Copyright © 2004 John Wiley & Sons, Ltd.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.