MECHANICAL PROPERTIES OF GYPSUM BOARD AT ELEVATED TEMPERATURES
Gypsum board is a common fire barrier used in house and general building construction. Recently, evaluation of the collapses of the World Trade Center Towers highlighted the potential role and failure of gypsum board in containing the fires and resisting damage. The use of gypsum board as primary fire protection of light-flame wood or steel construction is ubiquitous. Yet knowledge of the common engineering mechanical properties of this construction product is nearly nonexistent. Gypsum board is used in a prescriptive manner with little or no rational design. Summarized here are the results of a study examining the mechanical properties of Type X gypsum board at elevated temperatures. These properties are needed to contemplate the engineering design of gypsum board fire barriers. Tests were undertaken with a small oven within a test machine measuring mass loss, shrinkage, bending strength and modulus of elasticity at elevated temperatures to 400°C. The research showsthat shrinkage and calcination of the gypsum board appear complete between 20 to 30 minutes of exposure at a uniform 400°C. Only after complete calcination, where all moisture is driven off, does the bending strength approach 0. Strength appeared to decrease linearly with increasing temperature. Mass loss and modulus of elasticity exhibited similar trends with the greatest decreases occurring from 100°C to 200°C followed by more gradual decrease to 400°C. The surface paper plays significant stiffening and strengthening roles up to 60 minutes at temperatures as high as 200°C.
A model for predicting heat transfer through gypsum‐board/wood‐stud walls exposed to fire
To facilitate the development of cost-effective and flexible design options there is a need to develop models to predict the fire resistance of wood-frame building assemblies. Such assemblies often derive much of their fire resistance from a protective membrane composed of gypsum board. A simple two-dimensional computer model is presented to predict heat transfer through gypsum-board/wood-stud walls exposed to fire. Input data for the thermophysical properties of gypsum board were measured exploying standard bench-scale tests. Input data for wood were selected from the literature. Small-and full-scale fire resistance tests were conducted on gypsum-board/wood-stud wall assemblies to provide data for the validation of the model. The model is shown to predict heat transfer through these walls rather well.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.