Improvements in method and apparatus for determining minority carrier diffusion length
The constant-magnitude steady-state surface photovoltage (SPV) method for determining the minority carrier diffusion length L is in principle an excellent technique. It has, however, recevied relatively limited use because of practical difficulties in carrying out the required measurements. This paper describes an improved measurement system that virtually eliminates these difficulties and allows a rapid straightforward determination of L. These measurements in silicon monitor wafers have enabled a routine quality control check on many factory processing steps, particularly those that are carried out at high temperature and have the potential for significantly degrading L.
Silicon-wafer-surface damage revealed by surface photovoltage measurements
Anomalous results of surface photovoltage (SPV) measurements on Si wafers are shown to be associated with a damaged region beneath the illuminated surface of the wafer being measured. The anomaly is a concave‐upward curvature of the I0(α−1) plot with an r2 value, derived from linear regression analysis, less than the normally observed minimum value (∼0.98). Removal of the damaged region by an appropriate etching procedure allows subsequent SPV measurements whose results are substantially free of the previously observed anomaly. The qualitative character of the anomaly can be reproduced by a simple theoretical model in which only one effect of the damage is considered; this effect is a diminished quantum efficiency for hole‐electron pair generation by photon absorption in the damaged region. The results suggest the use of SPV measurements as a test procedure for revealing the presence of surface damage in Si wafers.
A New Vacuum Pressure Infiltration CFRP Method and Preparation Experimental Study of Composite
In order to prepare a carbon-fiber-reinforced polymer composite (CFRP) with ideal microstructure and properties, a new vacuum pressure infiltration CFRP method is proposed based on an analysis of existing CFRP preparation process methods. Research on composite material preparation systems was carried out by using this new method principle. The system mainly includes a fiber pre-forming module, a vacuum heating infiltration module, a hot-press curing molding module, and a data acquisition control module. Under the conditions of natural curing at 0 MPa + 6 h + 25 °C, vacuum heating curing at –0.05 MPa + 30 min + 80 °C, and hot-press curing at 0.7 MPa + 5 min + 50 °C, a two-dimensional (2D) CFRP with excellent microstructure and properties was successfully prepared. Observing the microstructure of the prepared composite material, it can be found that the inside of the composite material was sufficiently and uniformly infiltrated, and common preparation defects such as holes and delamination were effectively controlled. Through the performance test, the bending strength of the material reached 790 MPa.