INNOVASIEKENMERKE WAT DIE BYWONING VAN NIE-FORMELE BOERDERYBESTUURSKURSUSSE BEINVLOED / Innovation characteristics which influence the attendance of non-formal farm management courses
Abstract This article considers the innovation characteristics which influence the attendance of non-formal farm management courses. These characteristics are the relative advantage, compatibility, complexity, trialability and observability. Results show that the relative advantage which could be obtained by attending a non-formal farm management course is the most significant characteristic which influences the attendance of non-formal farm management courses.
Farm Management In South Africa: The State Of The Art
ABSTRACT The purpose of this article is to evaluate the present situation of farm management (FM) in South Africa in its professional context. The evolution of FM in the USA, the UK and Australia has been used as the norm to evaluate the progress of FM teaching and research in South Africa. In order to review the development of FM in South Africa over the past 60 years, the period has been divided into three phases. The outstanding feature of FM in Phase I (1925—1950) was its multidisciplinary nature in contrast with the dominating role of production economics in FM in Phase II (1950—1970). The last 15 years (Phase III) in the evolution of FM is typified by the greater role played by management science in FM. As in the USA, the UK and Australia, it can be said that FM is regarded basically as FM economics (narrower approach) in South Africa today, but attempts are being made to integrate the various disciplines. As far as FM teaching is concerned, the integration is accomplished in two alternative ways. I...
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.