3D integration technologies for MEMS
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography.
Low-Temperature Cu-Cu Wafer Bonding
Metal thermo-compression bonding is a process suitable for 3D interconnects applications at wafer level. The process requires typically bonding temperatures of ~400{degree sign}C and high contact pressure applied during bonding. Temperature reduction below such values is required in order to solve some issues regarding wafer-to-wafer misalignment after bonding and to minimize thermo-mechanical stresses. Low-temperature (LT) Cu-Cu wafer bonding was successfully demonstrated at 175{degree sign}C. The bond quality, bond strength, metal interface layers microstructure and chemical composition of Cu-Cu wafer pairs bonded under different process conditions were investigated. Experimental results on various Cu native oxide methods evaluation as well as results obtained for various bonding and annealing temperatures are presented.
Experimental study of water fluxes in a residential area: 2. Road infiltration, runoff and evaporation
Lack of accurate data has led some hydrologists and city planners to assume that urban infiltration is zero and runoff is 100% of the rainfall. These assumptions lead to an over estimation of road runoff volume and an underestimation of direct recharge to groundwater, which is already rising under some UK cities. This study investigates infiltration and runoff processes and quantifies the percentage of rainfall that contributes to storm drainage, and that which infiltrates through different types of road surface. Access tubes were installed for measuring soil water content using a neutron probe in three car parks, a road and a grass site at the Centre for Ecology and Hydrology, Crowmarsh Gifford, Wallingford. Storm drainage was recorded at the exit of the Thamesmead Estate in Crowmarsh Gifford, just before the drain joins the River Thames at Wallingford. Rainfall and water table depth were also recorded. Weekly measurements of soil moisture content indicated that the top 40 cm layer is not influenced by water‐table fluctuations and, therefore, positive changes in soil moisture could be attributed to infiltration of rainfall through the surface. Depending on the nature of the surface, subsurface layers, level of traffic, etc., between 6 and 9% of rainfall was found to infiltrate through the road surfaces studied. The storm drainage generated by road runoff revealed a flow pattern similar to that of the receiving watercourse (River Thames) and increased with the increase of infiltration and soil water content below the road surface. The ratio of runoff to rainfall was 0·7, 0·9 and 0·5 for annual, winter (October–March) and summer (April–September) respectively. As the results of the infiltration indicated that 6 to 9% of annual rainfall infiltrates through the road surface, this means that evaporation represents, 21–24% of annual rainfall, with more evaporation taking place during summer than winter. Copyright © 2003 John Wiley & Sons, Ltd.