Cyclophosphates as ligands for cobalt(III) in water.
Examination of cyclotriphosphate and cyclotetraphosphate as ligands for Co(III) in aqueous solutions revealed that cyclotetraphosphate affords stable complexes as a hemilabile ligand, while cyclotriphosphate exhibits facile hydrolysis.
A rapid synthesis of cobalt cyclotetraphosphate Co2P4O12 at low temperature
Abstract The cobalt cyclotetraphosphate, Co 2 P 4 O 12, was synthesized by evaporating a mixture of cobalt chloride hexahydrate, phosphoric acid and water at 70 °C, with further calcinations at 400 °C, 500 °C and 600 °C for 3 h. XRD results indicated that the Co 2 P 4 O 12 compounds obtained had only monoclinic phase with space group C 2h 6 ( Z =4). From FT-IR spectra, vibrational modes corresponding to internal vibrations of the P 4 O 12 4− anion were identified. The morphologies and crystallite sizes for the Co 2 P 4 O 12 obtained from SEM data and X-ray line broadening showed non-uniform particles and 37–68 nm, respectively. All characterization methods showed that the monoclinic phase of Co 2 P 4 O 12 could be synthesized at the low temperature of 400 °C with short time consumption. The temperature was about 400 °C lower than that used in the previous synthesis method with CoCl 2 as reactant, and resulted in a cost-, energy-, and time-saving method.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.