The Impact of Surface Defects on SiC Schottky and Ohmic Contact Formation
Silicon carbide is a leading semiconductor for high power, high temperature electronics, yet SiC devices still face problems of electrical contact control and reproducibility. Recent work worldwide shows that point and extended defects in SiC as well as chemical reactions at metal-SiC interfaces can influence contact transport properties. Yet Schottky barrier and ohmic contact formation at the intimate metal-SiC junction are relatively unexplored on the microscopic level. We have used depth-resolved cathodoluminescence spectroscopy (DRCLS) and Auger electron spectroscopy (AES) to measure the optical emissions of defects near 4H-SiC surfaces and metallized interfaces on a nanometer scale. These techniques reveal that a variety of metals on clean 4H-SiC surfaces in ultrahigh vacuum (UHV) promote the formation of mid-gap defects extending only nanometers away from the junction. These states vary in their ranges of depth and depend sensitively on interface reactivity and subsequent UHV annealing
Thermal and doping dependence of 4H-SiC polytype transformation
We have observed characteristic temperatures, anneal times, and doping densities that lead to stacking faults and 3C-SiC-like bands in 4H-SiC epilayers. Low energy cathodoluminescence spectroscopy measurements reveal a temperature threshold of 800 °C for emergence of these features in thermally oxidized or argon annealed 4H-SiC with an activation energy ≈2.5 eV. Stacking fault generation and polytype transformation exhibits a strong doping dependence, appearing only in a range of highly doped n-type 4H-SiC. Systematics of these strain and/or electronic effects induced by high N concentrations can be used to control structural instabilities during SiC device fabrication.
Morphological study of the Al–Ti ohmic contact to p-type SiC
Abstract The composition 70 wt.% Al was recently reported to provide low resistance Al–Ti ohmic contacts with excellent electrical uniformity on p-type SiC. Using scanning electron microscopy and atomic force microscopy, an investigation of the surface morphology and edge definition of the annealed contacts was conducted, and the morphology of the buried metal/semiconductor interface was examined by etching away the contact metallization and imaging the freshly exposed SiC surface. This information provides guidance on the suitability of the contact for devices with small feature sizes and shallow p-type epilayers. Patterned contacts exhibited good edge definition, a root-mean-square surface roughness of 11 nm, and a root-mean-square interfacial roughness of 12 nm. The deepest observed penetration of the metallization into the SiC was 65 nm, and the lateral length scale of the morphological features at the buried metal/semiconductor interface was sufficiently small compared to the active area of the contact to allow good contact-to-contact reproducibility. The interfacial reactions and ohmic contact formation mechanism are considered from the point of view of the materials characterization study presented here and the binary Al–Ti and quaternary Al–C–Si–Ti phase diagrams.