The comprehensive study of liquid phase oxidation on GaAs-based transistor applications
The GaAs-based HEMTs with gate oxide and HBTs with surface passivation prepared by liquid phase oxidation (LPO) will be demonstrated. As compared to the Schottky-gate HEMTs, the lower gate leakage currents, higher breakdown voltages, and improved RF performances make the proposed technique suitable for high-power and high-speed applications. Moreover, the HBTs with oxide passivation possess the characteristics of lower surface recombination currents, higher breakdown voltage, and improved higher dc current gain.
A GaAs MOSFET with a liquid phase oxidized gate
Low leakage current density (as low as 10/sup -8/ A/cm/sup 2/ at an applied voltage of 5 V) and high breakdown electrical field (larger than 4.5 MV/cm) of the liquid phase chemical-enhanced oxidized GaAs insulating layer enable application to the GaAs MOSFET. The oxide layer is found to be a composite of Ga/sub 2/O/sub 3/, As, and As/sub 2/O/sub 3/. The n-channel depletion mode GaAs MOSFET's are demonstrated and the I-V curves with complete pinch-off and saturation characteristics can be seen. A transconductance larger than 30 mS/mm can be achieved which is even better than that of MESFET's fabricated on the same wafer structure.
InGaP/InGaAs/GaAs metal-oxide-semiconductor pseudomorphic high electron mobility transistor with a liquid phase oxidized InGaP gate
InGaP/InGaAs/GaAs metal-oxide-semiconductor pseudomorphic high electron mobility transistors (MOS-PHEMTs) are reported. The gate dielectric is formed by oxidizing InGaP material in liquid phase. As compared to its counterpart PHEMTs, it can be observed that the MOS-PHEMT has a larger gate swing voltage, a lower gate leakage current and a higher breakdown voltage. Consequentially, the studied MOS-PHEMT provides the promise for high-power applications.