Superconducting Cavity Beam Test in CESR
The first use of a superconducting accelerating structure in a storage ring is described. Two 5-cell 1500 MHz ''muffin tin'' superconducting niobium cavities (1 m active length) were operated in the Cornell 8 GeV e/sup +/e/sup -/ storage ring, CESR. A 6.1 mA beam was captured and stored at 3.5 GeV using only the superconducting cavity. Up to 12.5 kW was transferred to the beam by the cavity. Single bunch currents up to 12 mA were reached in conjunction with the normal 500 MHz RF. Beam induced higher order mode (HOM) powers of 290 W were carried to room-temperature loads by four couplers and waveguides; no HOM-induced cryogenic dissipation was detectable. Q's of the 76 most prominent resonances were measured. Transverse and longitudinal beam instabilities were studied by mechanically sweeping the tune of the cavities; current thresholds are compared to theory. The cavity exhibited the ability to survive breakdown at high incident power without degradation.
Details of the Cryogenic System for the Cornell Superconducting R.f. Beam Tests
During the course of the most recent and past Superconducting R.F. beam tests in CESR, various techniques and concepts were developed in the implementation of the cryogenic system1,2,3,4. Some of these items will be described and will include, the long liquid helium transfer line, the liquid phase separation, the liquid nitrogen cooling system, feeding the wavequide heat exchangers, the JT valve, the temperature regulation and pumping system, the overall control and monitoring system, large and many indium seals, and mechanical details of the cryostat vessel.
Strategies for glass based photonic system integration
There is a clear tendency to integrate more and more opto-electronic and micro-optical components like optical fibers, laser diodes, modulators, isolators, beam-splitting components and micro lenses in also increasingly dense and complex assemblies. The paper will discuss thin glass as a very promising base material for that kind of photonic packaging on interposer and board level including optical interconnection using fibers.