Reducing contact resistance of high current connectors on electric vehicle by controlling contact pressure and addition of plating material
This paper studies on contact resistance on copper busbar connection relative to plating materials, plating thickness, and contact pressure. This study is important because busbar connection plays an important role on electric distribution performance. A good busbar connection would have low contact resistance, therefore low energy losses and better reliability. In this study, the sample are busbar connection without plating, busbar connection with zinc plating, busbar connection with nickel plating, and busbar connection with silver plating. First aspect that is going to be tested is contact resistance measurement without load on each. The next test is contact resistance measurement with DC load of 9, 18, and 27 A. Each test is conducted with the contact pressure variation of 5.6, 7.0, dan 8.4 MPa, and with plating thickness of 5, 15, and 25 μm. The result shows that busbar connection with 5 μm silver plating have much lower contact resistance compared to all the other configuration.
Study on the Performance of Liquid-Solid Contact Resistance Based on Magnetohydrodynamic Micro-Angular Vibration Sensor
In this paper, the influence of the contact resistance between the conductive fluid and the metal electrode on the output characteristics of the magnetic fluid micro-angular vibration sensor (MHD sensor) is theoretically analyzed. The contact resistance models based on the solid-solid electric contact theory are established based on the resistivity, temperature, pressure and angular vibration of the materials between the conductive fluid and the metal electrode. The contact resistance was tested by setting up an experimental platform and making conductive fluid rings with electrode materials of Ag, Cu and Ti. The results show that the static contact resistance between the conductive fluid and the metal electrode is positively correlated with the material resistivity and temperature, and negatively correlated with the surface roughness and contact pressure of the metal electrode. The dynamic contact resistance fluctuation is proportional to the amplitude of the input voltage of the angle shaker and inversely proportional to the square of the input frequency. At the same time, reducing contact resistance can improve the MHD sensor’s performance.
Structural and mechanical properties of TiC and Ti–Si–C films deposited by pulsed laser deposition
TiC and Ti–Si–C films have been deposited by pulsed laser deposition at substrate temperatures ranging from room temperature to 600 °C onto (111) silicon wafers and 440C stainless steel substrates. X-ray diffraction, x-ray photoelectron spectroscopy, and electron microscopy were employed for structural and compositional evaluation of the films, and nano-indentation hardness testing and pin-on-disk wear tests were used to evaluate the mechanical and tribological properties. All the TiC films were highly crystalline except the one deposited at room temperature, whereas for the Ti–Si–C films the degree of crystallinity increased with temperature, ranging from amorphous for the room temperature deposit to about 50% crystalline at 600 °C. The hardness of the TiC films was relatively constant with deposition temperature at about 25 GPa, whereas the hardness of the Ti–Si–C films increased with deposition temperature from 11 to 33 GPa. The temperature dependence of the hardness is attributed to the degree of crys...