Effect of heterogeneously distributed pre-existing dispersoids on the recrystallization behavior of a cold-rolled Al-Mn-Fe-Si alloy
It is well known that strong concurrent precipitation, mainly located along grain/subgrain boundaries, results in a coarse and elongated grain structure, and unusual sharp P {011} and/or M {113} texture components during annealing of supersaturated AA3xxx-series alloys. In this study, a supersaturated as-cast Al–Mn–Fe–Si alloy was annealed at three temperature–time paths after cold rolling and their effects on the softening behavior have been analyzed and compared in terms of final grain structure and texture. In particular, material conditions with dispersoids located along grain/sub-grain boundaries were produced prior to annealing. The effects of pre-existing dispersoids as well as dispersoids formed during annealing (concurrent precipitation), both of which are heterogeneously distributed along grain/sub-grain boundaries, on the recrystallization behavior of the deformed material were investigated and compared. The results clearly show that, due to their larger sizes, these pre-existing dispersoids do not significantly increase the strength of the P/M texture components as compared to the dispersoids formed during annealing, even though the former can still affect the grain structure. It can be concluded that sharp P/M textures develop when recrystallization takes place at low temperature where nucleation of other orientations, whether from particle stimulated nucleation (PSN) or other nucleation mechanisms are suppressed by concurrent precipitation.
Effect of Heat Treatment Condition on the Flow Behavior and Recrystallization Mechanisms of Aluminum Alloy 7055
The flow behavior and the microstructural evolution of aluminum alloy 7055 in two heat treatment conditions (homogenized vs. pre-rolled, solution treated, stretched and naturally aged (T3)) were investigated for a height reduction of 60% with deformation temperatures ranging from 370 °C to 450 °C and strain rates ranging from 0.01 s−1 to 10 s−1. Flow stress decline ratio maps as a function of deformation temperature and strain rate were produced along with processing maps at a strain of 0.8 to reveal optimum hot-working conditions for deformation at strain rates of 0.01 s−1 to 0.1 s−1. The results showed that the stress drop ratio during deformation is higher for the homogenized condition than for the pre-rolled, T3 condition. A higher degree of recrystallization after deformation was observed in the pre-rolled, T3 condition due to finer second phase particles, smaller grain size, and more numerous sub-grains. The mechanism for deformation softening is discussed in the context of grain boundary characteristics.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.