Cost-Effective TiAl based Materials
Because of their inherent low ductility, TiAl-based materials are difficult to fabricate, especially thin gage titanium gamma aluminide (TiAl) sheet and foil. In this paper, an innovative powder metallurgy approach for producing cost-effective thin gage TiAl sheets (with 356 mm long and 235 mm wide, and a thickness of 0.74, 1.09, 1.55, and 2.34 mm, respectively) is presented. The microstructures and tensile properties at room and elevated temperatures of the thin gage TiAl are studied. Results show that these TiAl sheets have a relatively homogenous chemistry, uniform microstructure, and acceptable mechanical properties. This work demonstrates a cost-effective method for producing both flat products (sheet/foil) and complex chunky parts of TiAl for various advanced applications including aerospace and automotive industries.
Alloying mechanism of beta stabilizers in a TiAl alloy
The effects of beta stabilizers such as Fe, Cr, V, and Nb on the microstructures and phase constituents of Ti52Al48-xM (x=0, 1.0, 2.0, 4.0, or 6.0 at. pct and M=Fe, Cr, V, and Nb) alloys were studied. The dependence of the tensile properties and creep resistance of TiAl on the alloying elements, especially the formation of B2 phase, was investigated. Fe is the strongest B2 stabilizer, Cr is second, V is an intermediate stabilizer, and Nb is the weakest stabilizer. The composition partitioning of Fe, Cr, V, and Nb in the γ phase is affected by the formation of B2 phase. The peaks of the tensile strengths and creep rupture life of Ti52Al48-xM generally occur at the maximum solid solution of these elements in the γ phase, which is just before the formation of B2 phase. Ti52Al48-0.5Fe shows an attractive elongation of 2.5 pct at room temperature, and the Ti52Al48-1V, Ti52Al48-Cr, and Ti52Al48-2Nb alloys have about 1.1 to 1.3 pct elongation at room temperature. The increase of tensile strengths and creep resistance with increasing Fe, Cr, V, and Nb contents is chiefly attributed to the solid-solution strengthening of these elements in the γ phase. The appearance of B2 phase deteriorates the creep resistance, room-temperature strengths, and ductility. With respect to the maximum solid-solution strengthening, an empirical equation of the Cr equivalent [Cr] is suggested as follows: [Cr]=Cr+Mn+3/5V+3/8Nb+3/2 (W+Mo)+3Fe=1.5 to 3.0. The solid-solution strengthening mechanism of Fe, Cr, V, and Nb at room temperature arises from the increase of the Ti 3s and Al 2s binding energies in Ti-Ti and Al-Al bonds, and the retention of the strength and creep resistance at elevated temperatures in Ti52Al48-xM is mainly attributed to the increase of the Ti 3s and Al 2s binding energies in Ti-Al bonds in γ phase. The decrease of the Ti 3p and Al 2p binding energies in Ti-Ti, Ti-Al, and Al-Al bonds benefits the ductility of TiAl.
Failure analysis for poor solderability of Au surface of PCB
Nonwetting is one of the common problems and is always rejected in electronic assemblies. ENIG pads of a PCBA exhibited nonwetting after lead-free reflow soldering. With the aid of stereomicroscope, SEM&EDS and XRF, a series of analysis was performed. And after visual inspection, surface and cross section analysis, thickness measurement and solderability test, it can be inferred that oxidation of plating surface was the main reason for nonwetting, and corrosion in Ni plating caused an adverse impact on solderalibity.