Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages
Ablation was carried out on high voltage Schottky rectifiers at 25°C and −5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 µA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.
Design of Automatic Temperature Control System on Laser Diode of Erbium-Doped Fiber Source
Designed an automatic temperature control (ATC) system to arise the stability of laser diode (LD). Established a mathematical model of thermoelectric cooler (TEC) based on the peltier cooling principle. Simulated ATC by MATLAB and analyzed on the simulation results. Designed ATC circuit driver of the TEC of LD. Obtain high speed and high precision ATC system in the room temperature environment. Its temperature precision is lower than 0.1%.
Fabrication of multilayered microfluidic 3D polymer packages
The realization of microfluidic packages by stacking and bonding several layers of microstructured polymer films opens up the potential of creating complex three-dimensional microfluidic structures based on relatively simple two-dimensional manufacturing processes. Whereas a multitude of microstructuring techniques have been developed, packaging and bonding technologies for multilayer microfluidic devices are still underrepresented. Bulk bonding processes like thermal diffusion bonding fit well into a lab environment, but feature extensive bonding times. With increasing fluidic complexity, bonding technologies that enable selective bonding and sealing at pre-selected areas (e.g. around channel walls or process chambers) are required. Selective bonding technologies enable a localized heat generation exactly at the desired bond position and thus significantly reduce the risk of structure deformation and channel clogging. In this paper, experimental results for a variety of bulk and selective bonding methods are reported and compared. Surface modification of polymers and lasers welding of polymer sheets are identified as suitable technologies for integration with high-throughput production environments.