Long-Term Nuclear Industry Outlook - 2004
The nuclear industry has become increasingly efficient and global in nature, but may now be poised at a crossroads between graceful decline and profound growth as a viable provider of electrical energy. Predicted population and energy-demand growth, an increased interest in global climate change, the desire to reduce the international dependence on oil as an energy source, the potential for hydrogen co-generation using nuclear power reactors, and the improved performance in the nuclear power industry have raised the prospect of a “nuclear renaissance” in which nuclear power would play an increasingly more important role in both domestic and international energy market. This report provides an assessment of the role nuclear-generated power will plan in the global energy future and explores the impact of that role on export controls.
Economic Globalization and a Nuclear Renaissance
The phenomenon of globalization has become increasingly well recognized, documented, and analyzed in the last several years. Globalization, the integration of markets and intra-firm competition on a worldwide basis, involves complex behavioral and mindset changes within a firm that facilitate global competition. The changes revolve around efficient information flow and rapid deployment of technology. The objective of this report is to examine the probable characteristics of a global nuclear renaissance and its broad implications for industry structure and export control relative to nuclear technology. The question of how a modern renaissance would affect the trend toward globalization of the nuclear industry is addressed.
Chip scale packaging using chip-on-flex technology
An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability.