Enhanced contamination control methods in advanced wafer processing
Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control. Methods for detection of airborne and surface molecular contaminants were enhanced to meet the increasing requirements for future More Moore and More than Moore applications. Improved qualitative and quantitative contamination analysis methods of organic and inorganic compounds allow exact monitoring of contamination in front- as well as back-end processes. By the use of state-of-the-art analytical systems combined with validated analytical procedures and advanced sample preparation techniques contamination analytical results with higher reproducibility and reliability are being ensured.
Advanced contamination control methods for yield enhancement
Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and inorganic compounds allows monitoring of contamination in front- as well as back-end processes. In this way, cross contaminations including precious metals, e.g. Au, Ag, Pd, organic and inorganic compounds e.g. sulfur, fluorine can be avoided. By the use of state-of-the-art analytical systems, a contamination control for any cleanroom and all wafer sizes could be implemented.
Use of simulation studies to overcome key challenges in the fab automation of a 300 mm power semiconductor pilot line comprising thin-wafer processing
Infineon Technologies Dresden establishes the worldwide first highly automated high volume production for power semiconductors based on 300 mm thin wafer technologies. For this special manufacturing platform, there are a lot of challenges for manufacturing and automation. During the research phases in preparation for the future 300 mm pilot lines different simulation studies for wafers, substrates and the existing transportation system are powerful methods to get out the best manufacturing and automation concepts for the future fabs. This article gives an overview of key challenges and shows ways how to overcome the obstacles using innovative manufacturing and automation applications optimized through smart simulation.