Physical study of the dissipated power area in high electron mobility transistors for thermal modelling
The hot area in power transistors due to the power dissipation is determined from a 2D-hydrodynamic model. The power is calculated everywhere in the device from the knowledge of the physical quantities (current density, electric field). The hot area is determined accurately to be coupled to a thermal modelling giving the temperature everywhere in the device [J. Park, M.-W Shin, C.-C. Lee, Thermal modeling and measurement of GaN-based HFET devices, IEEE Electron Device Lett. 24(7) (2003) 424-426 [1]; J.-C Jacquet, R. Aubry, H. Gerard, E. Delos, N. Rolland, Y. Cordier, A. Bussutil, M. Rousseau, S.L. Delage, Analytical transport model of AlGaN/GaN HEMT based on electrical and thermal measurement, 12th GAAS Symposium, Amsterdam, 2004, pp. 235-238 [2].]. The method is applied to HEMTs (high electron mobility transistors) based on GaAs or GaN. It is shown that the hot area depends on the bias conditions and on the transistor gate recess topology.
Development and characterization of the thermal behavior of packaged cascode GaN HEMTs
Abstract This study investigates the heat generation behavior of packaged normally-on multi-finger AlGaN/GaN high electron mobility transistors (HEMTs) that are cascoded with a low-voltage MOSFET (LVMOS) and a SiC Schottky barrier diode (SBD). By foremost carrying out electro-thermal simulation and related thermal measurements with infrared thermography and Raman spectroscopy for basic 5 mm GaN HEMTs, the location of hot spot in operating device can be obtained. Based on the outcome, further packaged cascode GaN HEMT is analyzed. A hybrid integration of the GaN-HEMT, LVMOS, and SiC SBD are assembled on a directly bonded copper (DBC) substrate in the four-pin metal case TO-257 package. The metal plate is used as both the source terminal and heat sink. The analytical results of thermal investigation are confirmed by comparing them with the infrared thermographic measurements and numerical results obtained from a simulation using Ansys Icepak. For a power dissipation of less than 11.8 W, the peak temperature of the GaN HEMTs is 118.7 °C, obtained from thermal measurements.
Centrifuge modelling of effects of shield tunnels on existing tunnels in soft clay
With the rapid development of the subway network,the phenomena of shield tunnels going across the adjacent tunnels are becoming more and more common.The interaction between shield tunneling and nearby tunnels is more complicated than the ordinary shield tunneling in intact soil strata.Based on the project of Shanghai Bund Passage crossing Metro Line 2,the method of centrifuge modeling together with the field measurement is employed to study the effects shield tunneling on nearby strata and existing tunnels.In centrifugal model tests,the effects simulation techniques considering the unloading of excavation,ground loss and grouting are developed to analyze the longitudinal settlement of the shield tunnel and the existing tunnel induced by the shield tunneling.Besides,the deformation distribution and settlement curves of the existing tunnels during shield construction are studied by using the monitoring data.