Three dimensional packaging and interconnecting techniques for microwave modules
Three dimensional (3D) packaging and interconnecting techniques can greatly reduce the weight and volume of conventional planar microwave modules. The objective of this study was to employ a novel 3D structure with simple manufacturing process to develop 3D microwave modules. Many advanced 3D packaging and interconnecting methods, such as LTCC microwave multichip modules, vertical interconnects, and 3D electromagnetic field analyzing and optimizing, were applied to increase the package density and improve the electric performance. Test method and test results of 3D microwave modules were introduced. These techniques are very useful to many types of modern active phased array radar systems and communication systems.
High density packaging of X-band active array modules
A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars. The package used multilayer aluminum nitride (AlN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects. This paper discusses the design tradeoffs, the package construction and assembly, and test results.
Multiconductor transmission line characterization
This paper presents a measurement method that completely characterizes lossy printed multiconductor transmission lines. It determines not only the matrices of impedances and admittances per unit length describing the transmission line in the conductor representation, but also the propagation constants, characteristic impedances, and cross-powers for each mode supported in the line. We apply the method to a pair of lossy coupled asymmetric microstrip lines.