Application of Broadcast FM for Utility Energy Management Communications
Technological and economic aspects of various approaches to electric utility Energy Management communications for remote control are discussed. Communication systems employing radio frequency (RF) transmission techniques are treated in some detail with comparisons being made between narrow- band VHF transmitter systems, those systems utilizing a portion of AM broadcast radio channels and systems using a portion of FM broadcast radio channels. Finally, typical utility energy management applications of these-systems are discussed.
Electric power load management: Some technical, economic, regulatory and social issues
This paper provides a review of the subject of electric power load management. In Section I, we briefly introduce the topic and then provide a summary of the current operating characteristics of electric energy production and delivery (EEPD) systems. Section II places load management in the context of the broader set of energy management strategies available to EEPD systems. The organization and rationale of the paper is then explained. In Section III, we review the set of communication/control technologies available or under development for use in the implementation of load management in EEPD systems. We provide an assessment of the relative attractiveness of alternative technologies, a brief summary description of a major field demonstration being jointly funded by EPRI and DOE, and two examples which illustrate the state of the art in modern two-way systems. In Section IV, we review the conventional approach to U.S. electric rate design, describe the current national Electric Utility Rate Design Study, review some important basic ideas of microeconomics, explore the subject of price elasticity of demand, examine the basic ideas underlying marginal cost pricing, discuss some of the practical difficulties of implementing time dependent rates, briefly examine some foreign rate design experience, and conclude by summarizing a number of U.S. rate design experiments sponsored by NSF and by FEA (now DOE). Section V is devoted to an examination of the problems of finding manageable loads in the residential, commercial, industrial, and transportation sectors. Particular attention is given to the development of thermal storage systems for water heating, space heating, and space cooling. Section VI is devoted to summarizing a number of studies which have attempted to assess the short- and long-term economic impacts of load management. The state of the field is such that few definitive cost/benefit statements can be made at this time. A number of potential social impacts are discussed and some broad regulatory policy guidelines are suggested. Finally, in Section VII, we highlight conclusions reached in the five preceeding sections, and identify a number of research and policy needs.
Simplified impedance design and control for low-cost high-speed channels
Impedance design is the fundamentals of signal integrity at the very beginning, but controlled impedance is always costly or time-consuming for the high-speed channels. In this paper, many simulations of channel parasitics were taken and calculated that met with the specified impedances and correlated to the measurements very well. Selection of the different substrate stack-up without any layout modification in the BGA package reversed from the failed verification to pass the differential return loss. Adjustment of lead widths and spaces in the limited room of leadframe package improved 6 Ω of differential-mode impedance compared to the conventional leadframe packages. The differential pairs with wider traces routed on the 2-layer PCB are more robust for over-etching effects whose impedance errors are less than 5% without special impedance control. Moreover, those pairs inserted with a thin ground trace achieved 90 Ω differential-mode impedance and 28.2 Ω common-mode impedance simultaneously with 35% less routing area for MHL application and reserved a 10 Ω series resistor for ESD protection. With those diligent designs, the leadframe package and the 2-layer PCB can be still adopting in the consumer electronics for high-speed applications.