Hygrothermal aging of flip chip assembled MOEMS
Low cost and miniaturized solutions for assembly of optical microelectromechanical systems (MOEMS) are critical for increased exploitation of optical sensors and devices in consumer applications. Examples of applications based on optical sensors and devices already near or on the market are auto focus lenses and pico projectors for mobile phones, physiology measurement units for wearables, and high bandwidth free space optical communication links for our homes. In addition, extensive use of photonic integrated circuits is predicted to be mandatory in order to answer to the future needs for high data transfer rates in data centers. However, the main limitation for several of these applications is the complexity, the related cost of assembly, and the unknown reliability of several lower cost assembly solutions; polymer based solutions are e.g. prone to fail particularly fast in humid and warm conditions. In this work, a part of a European project called Lab4MEMS II, we study the feasibility of reducing the