Method for manufacturing metal led circuit board integrating power and light sources
A method for manufacturing a metal LED circuit board integrating power and light sources. The method comprises: performing a surface treatment on a metal board; coating a thermally conductive adhesive; covering with copper foil and laminating; board cutting, drilling tooling holes, and performing a pre treatment; forming a circuit pattern; performing etching and coating removal; punching tooling registration holes and performing circuit continuity testing; coating a white solder resist ink; exposing; developing; performing character printing and curing; punching; performing V cutting; and performing an anti oxidation treatment. The thermally conductive adhesive is coated using a curtain formed by air knives to spray and coat the thermally conductive adhesive, or by overlaying a thermally conductive insulation film onto the metal board. The circuit pattern is formed by using a printing process or an exposing process. The method can be used to mass produce a metal circuit board having integrated power and light sources, and the produced LED and power supply have good heat dissipation.