Electro thermal Stress Comparison between Full Pressure and Silver Sintered Package Press Pack IGBT
In order to analyze the reliability difference of different package IGBT, the electro thermal stress of full pressure and silver sintered package Press Pack IGBT (PP IGBT) are compared by using Finite Element Method (FEM) in this paper. Based on the actual structure and material physical properties of a 3300V/50A Press pack IGBT, a machine thermal electrical multi coupling field finite element model is eatablished and verified by the power cycling test platform. The simulation results show that, the silver sintered package could improves the heat dissipation capability of IGBT, while reduces the junction temperature and the saturation voltage of the device. However, the silver sintered package increases the von mises stress of PP IGBT.
2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)