Achievements and challenges in power and signal integrity analyses of Set Top Box products
Electrical Co design of IC package PCB products for Set Top Box applications has been changing quickly in the past years. The new generation of processors (A53, A57. is indeed bringing interesting challenges as the business seems to be looking for the most power efficient CPU architectures (DMIPS/W) Moreover standards of high speed interfaces are being released with increasing speeds (HDMI2.1, USB3.1, LP/DDR4. This paper presents the achievements and the challenges in the field of IC package PCB electrical simulation and co design, based on examples of recent product developments. Correlations between simulations and measurements are presented as it plays an important role in the development of the simulation methodologies. The main focus of this paper is on power analysis, power integrity (PI) studies and performance prediction. Then a case of signal integrity (SI) studies is briefly discussed. Conclusions on links between physical IC package PCB co design and EM/PI/SI are presented.
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)