Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective
Abstract The journey in the packaging of microelectronics with intense heat transfer rate and miniaturization are continuing. To satisfy the above criteria, the thermal interface materials (TIMs) classified into two categories. One should have high thermal conductivity, high dielectric constant or low electrical conductivity, and high mechanical strength inclusive of processability. Other is high thermal conductivity along with electrical conductivity properties. In this review, we have reported the idea and concept behind TIMs including varieties of TIMs and their significance. We also referred to a few progressive techniques of thermally conductive filler synthesis and preparation of epoxy based thermal conductive TIMs. Some basic thermal conductivity models have been adopted to conceptualize the thermal conductivity mechanism along with various types of thermal conductivity measurement principle. We also explore how the morphological characteristics of different filler system affect the thermal conductivity of the epoxy matrix. In addition to thermal performance and efficiency, the reliability testing of TIM during package development stage is analyzed in which the design iteration has been considered for long term packages and feasibility study. The specified utility of TIMs in different electronics application has been described according to properties of fabricated composite with the high performance interface. The future perspectives of electronics packaging in advanced and miniaturized application for epoxy based TIMs are briefly elaborated. Graphic abstract
Multiscale and Multidisciplinary Modeling, Experiments and Design