Coupled Simulative Analysis for Drive Characteristic of Micro-Comb Structure
A model considering electrostatic-structural coupling is established for a micro-comb drive. The finite element method is applied to solve tiie electro static field distribution and the structural displacement. The coupled effect of electrostatic potential distribution and structure displacement was taken into account by an iterative solving process. The drive performances of the micro-comb are analyzed for the diverse of structures, including the ground plane effect and fabrication errors. The results show that levitation caused by the ground plane reduced the driving capacity. The fabrication sloping error of finger will also reduce the (hiving force. The fabrication offset error of finger will cause the horizontal instability.