Study on Preparation and Properties of SiC_P/Cu Functionally Graded Materials
SiCP /Cu functionally graded materials were fabricated by powder metallurgy.The microstructure,microhardness,conductivity and wear resistance were researched.The results show that,the matrix of the gradient compound material is continuous,microhardness and microstructure of the composites take on gradient distribution.The conductivity and wear resistance become less and better,respectively,with the increase of SiC content.The wear resistance of SiCP /Cu functionally graded materials are more superior to that of Cu based material,and its wearing mechanism is the combined action between micro-cutting wearing and grain wearing.