AVD® technology for deposition of next generation devices
Abstract One of the main challenges in semiconductor industry today is the problem that arises with the performance of Moore’s Law, doubling every 18 months. For instance, the device shrinking of CMOS based devices calls for new material candidates to replace conventional dielectrics and electrodes. Here, an advanced technology called Atomic Vapour Deposition (AVD®) is presented, which combines the MOCVD advantages of high throughput with atomic layer control and excellent material properties. The discussion is based on high-k oxides and conductive materials.