Effect of Buffer Agent on Property of Electroless Plating of Ni-P Alloy on Al Alloy Surface
The influences of buffering agent concentration in electroplating on electroless plating on Al alloy surface were studied.Through measuring deposition speed,SEM,EDS and polarization curve etc,the plating speed,morphology,composition and corrosion resistance of the plating were characterized.The results show that the plating speed is soonest when using succinic acid as buffering agent and its concentration is 16 g/L.At this time,not only the plating is homogeneous,compaction and has small grain,but also phosphorus contents is maximum and the corrosion resistance is greatest.