Thermally conditioned placement optimization of elements in hybrid microcircuits
Abstract The paper presents some of the problems in using thermal simulation for the placement optimization of elements, which are heat sources in hybrid microcircuits. The analysis of heat exchange mechanisms in thick film circuits has been carried out and the mathematical model for circuits with single-layer and non-homogenous substrates has been elaborated. Analytical solution for determination of the temperature distribution in the form of single Fourier series has been utilized in optimization process. In the proposed procedure based upon the temperature criterion of optimization and the gradient method, technological and constructional constraints have been taken into consideration. The examples of computation results have been included and the conclusions useful in the process of computer-aided hybrid microcircuit design have been presented.