Positron-defect profiling in Cd1−xZnxTe wafers after saw cutting
Near-surface damage induced by saw cutting of ingots of Cd1−xZnxTe was investigated by positron-defect depth profiling. The damage extends to several micrometers depth and depends on the cutting apparatus. The samples were polished and etched repeatedly, followed each time by positron-depth profiling. New subsurface damage created during the polishing process is observed. No new damage is observed after etching. Positron-depth profiling is suggested as a diagnostic tool to monitor the quality of sample surfaces.