Isotropic Conductive Adhesives: Future Trends, Possibilities and Risks
The "Future Trends, Possibilities and Risks" panel discussion on Polymer Electronics has been divided into sub-topics. This brief summary of the questions facing isotropic conductive adhesives (ICAs) will provide the basis for that segment. The impediment to widespread industrial adoption of the technology is a lack of confidence in its reliability, specifically in its drop-test performance. The key to solving any such technical problem is to fully understand the technology, but at this point there are still far too many fundamental questions on multiple aspects of it to inspire confidence. Some basic research questions are identified, the answers to which should lead to improved product performance.