The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure
Abstract Gold electrode is preferable in extreme environments, but few reports focus on gold electrode for LTCC application. In this article, CaO–B2O3–SiO2 glass powder used in the gold paste with different particle size was prepared. The sintering shrinkage behavior of CaO–B2O3–SiO2 green tapes and gold paste were investigated. The blisters of gold electrode and corresponding mechanism during sintering process were studied. The sheet resistivity and wire bonding strength of gold electrode were connected with glass particle size strongly. When the D50 of CaO–B2O3–SiO2 glass powder was 2.61 μm, the wire bonding performance of gold electrode was excellent, of which the average strengths and standard deviation of wire bonding were 10.30 g and 0.66 g, respectively. These results would have a positive effect on guiding the select of glass particle size in gold paste.