Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability
Abstract Manufacturers of electronic components and systems are currently undergoing profound changes. For foundry manufacturers, Moore's law is fast approaching, and they must find technological solutions to further densify their electronic circuits. For PCB (Printed Circuit Board) manufacturers, the change is even more important as they have to bury components inside their circuitry. In this paper we present physics analysis and simulations of copper via to study the impact of this kind of assembly process on the reliability of these new electronic circuits. Manufacturers can head towards the through silicon (TSV) via or embedded components. First, we present analysis made with the SAM (scanning acoustic microscope) using shear wave's generation to extract information about strain induced by the copper via in TSV. Finite element analysis shows the correlation between the two technologies. Secondly, we present finite element analysis made on embedded active components inside PCB and an evaluation of the fatigue lifetime on via. TDM (Topography and Deformation Measurements) are made to calibrate the model generated by finite elements. A discussion is then conducted to determine the weaknesses and strengths of each of these technologies in order to determine their long-term robustness.