Microstructure and Thermal Behavior of Al-Ti Multilayer Foils for Micro-bonding
In order to make reactive micro-bonding have a better application, 5 types of Al-Ti reactive multilayer foils with different modulation periods and total thicknesses were fabricated by DC magnetron sputtering system. The microstructure and thermal behavior of the foils were characterized using scanning electron microscope,X-ray diffraction and simultaneous thermal analyzer respectively. The results indicate that the reactivity of nano multilayer foils is apparently higher than that of micron ones. The modulation period is found to have a significant influence on the thermal behavior of high period600 nm. As the period decreasing, the initial reaction temperature of multilayer foils drops, the reaction temperature range lessens and the reaction heat decreases, thus the whole reaction is easier to complete. When the modulation period exceeds600 nm, the reaction of Al-Ti multilayer foils is relatively weak. When the modulation period is less than 300 nm, the reaction becomes strong. In order to realize the low temperature reactive micro-bonding, the modulation period should be controlled around 100 nm.