Package and solder joint reliability analysed by FEM simulation and experiments
In the electronic packaging world, thermal, mechanical and thermo-mechanical issues are playing a dominant role as they are more and more influencing the reliability of an electronic system. To analyse the reliability on chip, package and assembly level, finite element simulation becomes increasingly popular and proves to be useful to optimise the designs of the structures in an early design phase. The final objective is to move to virtual prototyping, where designs are tested based on simulations, thus reaching first time right solutions. However there is still a long way to go before reaching this final goal. Besides advanced finite element modelling (FEM) techniques (three dimensional, complex and coupled loading, strong non-linear material behaviour), there is also important need for validation of these FEM results by dedicated experiments.