Nanomechanical properties of Ag solder bumps doped with Pd and Au
Abstract As an approach to increasing their reliability, we doped Ag solder bumps with Pd and Au alloys to enhance their creep resistance, which we characterized using a nanoindentation technique. The hardnesses of the pure Ag and the Ag solders doped with Pd:3%, Pd:5%, and Pd:2%-Au:3% were 0.6 ± 0.1, 1.8 ± 0.2, 2.8 ± 0.3, and 3.1 ± 0.5 GPa, respectively. Although the hardness of the Ag solder was enhanced significantly when it contained Pd:2%-Au:3%, it exhibited a lower creep exponent (n > 2). The mechanism of the thermal recovery of the sample appears to be associated with activation of dislocation sources—also the reason for the decrease in hardness. The compounds doped with Pd:2%-Au:3% displayed significantly greater bond strengths and creep exponents, whereas the Pd-only compounds exhibited poorer reliability.