Microstructure and creep of eutectic indium/tin on copper and nickel substrates
The behavior during creep in shear of eutectic indium-tin joints on copper and nickel substrates was examined in order to determine the effect of creep deformation on the microstructure of the alloy. Primary creep was absent in all the samples tested. The stress exponent at 20° C was much higher for samples on nickel than for those on copper, indicating a different creep deformation mechanism. Also, the microstructure within the indium-tin joints differed significantly with a change of substrate. Samples with a nickel substrate showed a colony microstructure that was not observed in those with a copper substrate. Thus, eutectic morphology is important in determining deformation mechanism during creep. The microstructure within the joints in tested and untested regions of the samples was effectively the same. This is quite distinct from the behavior of eutectic lead-tin observed in previous work. Lead-tin formed a recrystallized band of material along a region of concentrated shear deformation. While the deformation pattern in the indium-tin samples appeared to be the same as for lead-tin, the microstructural changes did not occur. This implies that the behavior observed in lead-tin is not universal to eutectic alloys.