Influence of Interface Heat Transfer Coefficient and Thermal Physical Parameters of Mold Sand on Solidification Process
The interface transfer coefficient obtained by inverse calculation was used to calculate the temperature field of an ingot produced by a sand mold. The calculated results show that the influence of the interface transfer coefficient on the ingot solidification was very weak. Then a set of modified thermal physical parameters was used to simulate the temperature field of the ingot, which was compared with the measured temperature field of the ingot casted by a sand mold. It is found that the modified thermal physical parameters greatly increase the precision of the simulation temperature field. Through the comparison of the average errors of the ingot's temperature field led by the interface transfer coefficients before and after the modification, and the average errors of the ingot's temperature field arisen from the thermal physical parameters before and after the modification, it is show that the most precise simulation temperature field can be gotten by adopting both the interface transfer coefficient by inverse calculation and the modified thermal physical parameters of mold sand, and the effect of the latter is more great.