The electrical properties of vacuum and chemically deposited thin and thick resistive films
Abstract A survey is given of the electrical properties of thin and thick resistive films, both vacuum deposited and non-vacuum deposited by chemical and firing processes. Films of metals, metal alloys and metal-insulator mixes, ranging in thickness from less than 100 A to several microns, are considered. A very considerable effort has been devoted to thin film development in recent years as a result of the requirements of a rapidly expanding microelectronic industry. It is concluded that these requirements are not yet completely satisfied for resistive films, particularly the requirement for high resistivity films.