Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules
Abstract This paper presents a study of the optimization of the gold plating thickness for the use of both wire bonding and soldered interconnects on a flexible printed circuit board sample module. Wire bondability is typically better, when the gold plating thickness is greater than 30 μin.; however, the risk of problems with solder joint embrittlement becomes a concern with thick gold plating. In order to better understand the effect of the gold plating thickness on wire bondability and solder joint embrittlement, an evaluation was performed on samples with three ranges of gold plating thicknesses (10–20 μin., 20–30 μin., and 30–45 μin.), on flexible printed circuit board (PCB), substrates. Mechanical shear testing and metallurgical analyses were conducted on chip component solder joints in this three thickness gold study. Thermal shock and drop testing were conducted to evaluate the reliability of the sample modules. Drop testing is especially critical for determining the reliability of the sample modules, which are used in portable consumer electronics products. Reliability testing and metallurgical analyses have been performed to characterize the effect of gold embrittlement on the mechanical integrity of the solder joints with a gold content ranging from 1 to 4 wt.%.