Highly flexible AMOLED integrated with ultrathin on cell touch panel
The flexible universal plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a mechanical debonding method. Based on FlexUP technology, the 5mm bending radius AMOLED is successfully developed and demonstrated with new structure LTPS TFT backplane and ultrathin on cell touch panel.
2016 IEEE Photonics Conference (IPC)