Thermally stable Cu3Sn/Cu composite joint for high temperature power device
Abstract This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn coated micro sized Cu particles for high temperature power device packaging. When used as die attach materials for Cu Cu bonding, a thermally stable joint comprising a Cu 3 Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 degC for 30 s, and a shear strength equivalent to that of conventional Pb 5Sn solder could be achieved. After isothermal aging at 300 degC for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged.