Optimizing Wet Clean operations in an established manufacturing environment
Embedded contamination at the gate sector is considered a significant source of yield loss. By its nature, embedded contamination is not observed at the point of cause, making it more difficult to find its source. We discuss our efforts to find the point of cause through partitioning. Through a combination of several improvements in Wet Clean steps we demonstrate significant reduction of the defect. We show how we leverage the toolset in an established Fab and discuss the implications of qualifying these changes in a mature environment.
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)