Multilayer integration and packaging on substrate integrated waveguide for next generation wireless applications
This paper presents the design techniques and realization examples of innovative multilayer substrate integrated waveguide (SIW) structures for integrated wireless system applications. Such multilayered SIW implementation presents numerous advantages such as low profile, light weight, wideband characteristics, and easy integration with other devices and components. In this paper, the state of the art of multilayer SIW passive components for low cost high density integrated transceiver design are presented. Filters, couplers, phase shifters, power dividers, and antenna arrays designed for specific applications are discussed and the advantages gained from multilayer schemes are described. Despite their easy fabrications and outstanding performances, these technologies are still struggling to compete with others for potential mainstream solutions. In this paper, we also discuss challenging issues in the development of multilayer SIW integrated modules that should enable a near future successful widespread deployment.
2016 46th European Microwave Conference (EuMC)