Metal resin bonding mediated by epoxy monolith layer
An epoxy monolith layer with porous structure is fabricated on the surface of a stainless steel (SUS) plate by polymerization induced phase separation process as the mediator for the bonding of SUS and various thermoplastic resin plates. Bonding strength is evaluated in the presence and absence of the epoxy monolith layer by a tensile lap shear test. The morphology of fracture surfaces is observed by scanning electron microscopy (SEM) in order to clarify the anchor effect of molten resins into the pores of the epoxy monoliths. The bonding strength values are calculated to be 1.2 2.7 MPa based on an apparent adhesion area for the bonding of SUS with polyethylene, polypropylene, polyoxymethylene and acrylonitrile butadiene styrene copolymer in the presence of the epoxy monolith mediator. These values are 2 30 times higher than those for direct metal resin bonding. By the SEM observation, stretched needle like structures were detected on the both fracture surfaces of the resins and the epoxy monoliths. The direct observation of the stretched debris out of the holes located at the monolith surfaces indicates the significant anchor effect for the present metal resin bonding system. The bonding system mediated by the epoxy monolith layer is conveniently used for the bonding of dissimilar materials such as metals and resins without any special process and apparatus.
Applied Adhesion Science