the present invention provides a method to increase yield and reduce down time in semiconductor fabrication units . semiconductor manufacturers have been on a pathway to shrinking device geometries by approximately 50 % every eighteen months for the last twenty years . as the critical dimensions shrink , which are symbolized by the vertical stripes of fig1 , the size of critical defects becomes relatively more important . while the defect shown in fig1 is the same absolute size for both sides , the defect on the right side is relatively large enough to cause catastrophic bridging or blocking failures due to the half - pitch critical dimension . as such , maintaining a defect - free environment near silicon work surfaces has gained increasing importance as demands on yield and cost move higher , and particles that were once acceptable are becoming unacceptable . as noted early , components manufactured for semiconductor substrate processing equipment tend to show high , defect - driven particulation rates early on in their lifetime , followed by a period of low particulation , then finally by a high failure rate during their later life . fig2 illustrates typical defect rates vs . time on a log - log scale and is an example of a bathtub curve known in the art of reliability engineering that follows this general life cycle . the horizontal dashed line represents the maximum acceptable particle count , while the vertical dashed lines represent the useful life of a particular component . in one embodiment of the present invention , the fabrication component is milled and / or grinded as part of a dry mechanical manufacturing process . the fabrication component then undergoes a first preconditioning step , wherein the fabrication component is subjected to a plasma process . the plasma process etches small particles from the porosity of the fabrication components . in one embodiment , the plasma system is controlled by a cnc system . fig3 shows one embodiment of a reactive atom plasma system that can be used in accordance with the present invention . fig3 shows an inductively - coupled plasma ( icp ) torch in a plasma box [ 106 ]. the torch consists of an inner tube [ 134 ], an outer tube [ 138 ], and an intermediate tube [ 136 ]. inner tube [ 134 ] has a gas inlet [ 100 ] for receiving a stream of reactive precursor gas [ 142 ] from a mass flow controller [ 118 ]. gas inlet [ 100 ) can also be used for receiving a depositional precursor gas stream [ 140 ], or a material to be deposited on the surface of a component . intermediate tube [ 136 ] has a gas inlet [ 102 ] for receiving an auxiliary gas from flow controller [ 118 ]. outer tube [ 138 ] has a gas inlet [ 104 ] for receiving a plasma gas from mass flow controller [ 118 ]. mass flow controller [ 118 ] receives the necessary gasses from a number of gas supplies [ 120 ], [ 122 ], [ 124 ], [ 126 ], and controls the amount and rate of gasses passed to the respective tube of the icp torch . the icp torch generates a plasma discharge [ 108 ], which can be used to precondition a component [ 110 ] located on a chuck [ 112 ] in a component box [ 114 ]. in this embodiment , plasma box [ 106 ] and component box [ 114 ] are separate , allowing the plasma discharge [ 108 ] and / or torch to pass at least partially between plasma box [ 106 ] and component box [ 114 ]. component box [ 114 ] has an exhaust [ 132 ] for carrying away any process gases or products resulting from , for example , the interaction of plasma discharge [ 108 ] and component [ 110 ]. in other embodiments , there may not be separate boxes for the plasma torch and the component . chuck [ 112 ] in this embodiment is in communication with a translation stage [ 116 ], which is adapted to translate and / or rotate component [ 110 ] on chuck [ 112 ] with respect to plasma discharge [ 108 ]. translation stage [ 116 ] is in communication with a computer control system ( cnc ) [ 130 ], such as may be programmed to provide the necessary information or control to translation stage [ 116 ] to allow component [ 1101 to be moved along a proper path to achieve a desired removal of particulates of the component . cnc [ 130 ] is in communication with an rf power supply [ 128 ], which supplies power to the icp torch . cnc [ 130 ] also provides the necessary information to mass flow controller [ 118 ]. in one embodiment of the present invention , the fabrication component can be subjected to a second preconditioning step , wherein the fabrication component is subjected to cavitations through the use of ultrasonic / megasonic energy transmitted through a liquid medium . in one embodiment , the fabrication component is subjected to cavitations operating at a frequency of 40 khz . in a more preferred embodiment , the cavitations operate at a frequency of 80 khz . megasonic cleaning uses the piezoelectric effect to enable removal of submicron particles from substrates . a ceramic piezoelectric crystal is excited by high - frequency ac voltage , causing it to vibrate . this vibration generates an acoustic wave that is transmitted through a cleaning fluid , producing controlled cavitation . as the wave passes across the surface of an object , it causes particles to be removed from the material being cleaned . the difference between ultrasonic and megasonic lies in the frequency that is used to generate the acoustic waves . ultrasonic uses lower frequencies and produces random cavitation . megasonic uses higher frequencies at 1000 khz and produces controlled cavitation . an important distinction between the two methods is that the higher megasonic frequencies do not cause the violent cavitation effects found with ultrasonic frequencies . this significantly reduces or eliminates cavitation erosion and the likelihood of surface damage to the fabrication component . parts that would be damaged by ultrasonic frequencies or cavitation effects can often be preconditioned without damage in a megasonic bath using the same solution with ultrasonics , cavitation occurs throughout the tank , and all sides of submerged parts are preconditioned . with megasonics , only the side of the part that is facing the transducer ( s ) is preconditioned . fig4 illustrates an apparatus for preconditioning the fabrication component in accordance with an embodiment of the present invention . the apparatus can be divided into two major portions . the first portion generates ultrasonic / megasonic waves for removing unwanted particles on the fabrication component . a second portion is a circulation system for controlling the flow of liquid used to speed up the rate of preconditioning the fabrication component . as described in more detail below , the portions can be used simultaneously or individually , as appropriate . the first portion of the system in accordance with the present invention includes a container [ 230 ] for storing liquid and holding at least one fabrication component [ 110 ]. container [ 230 ] is preferably made of quartz . the system further includes an ultrasonic / megasonic generator [ 234 ] connected to a transducer [ 236 ]. ultrasonic / megasonic generator [ 234 ] generates ultrasonic / megasonic waves for removing particles stuck on , or otherwise securely attached to , the component [ 110 ]. transducer [ 236 ] is positioned at the top of container [ 230 ] to transfer the ultrasonic / megasonic waves generated by ultrasonic / megasonic generator [ 234 ] to container [ 230 ]. a drain [ 238 ] is located at the bottom of container [ 230 ] to drain the liquid out of container [ 230 ]. preferably , a drain valve [ 239 ] controls the flow of drain [ 238 ]. drain valve [ 239 ], as well as other valves described below , each can be set to an on and an off position . initially , drain valve [ 239 ] is set to the off position to close drain [ 238 ]. in an embodiment of the present invention , at least one outlet opening [ 240 ] is located at the bottom of container [ 230 ]. container [ 230 ] further includes liquid inlets [ 242 ] to provide liquid to container [ 230 ]. nozzles [ 244 ], connected to liquid inlets [ 242 ], spray liquid , e . g ., deionized ( dt ) water , on the surface of the component [ 110 ] in container [ 230 ]. the liquid is injected into container [ 230 ] through liquid inlets [ 242 ] and nozzles [ 244 ]. further , nozzles [ 231 ] are set at the top of container [ 230 ] to perform the same function of nozzles [ 244 ]. liquid inlets [ 242 ] can optionally include a plurality of pipes [ 241 ] situated along the bottom surface of container [ 230 ]. pipes [ 241 ] have a plurality of openings [ 243 ] for spraying liquid into container [ 230 ]. alternately , a plurality of pipes can be used to replace liquid inlets [ 242 ]. the pipes can be defined along the inner side wall of container [ 230 ]. the second portion of the apparatus in accordance with the present invention includes a liquid supply element [ 246 ] used to ultimately provide the liquid to container [ 230 ]. liquid supply element [ 246 ] provides the liquid to transducer [ 236 ]. a first valve [ 2481 is located between liquid supply element [ 246 ] and transducer [ 236 ] to control the amount of the liquid flow . first valve [ 248 ] allows the liquid to flow to transducer [ 236 ] for generating ultrasonic / megasonic wave liquid when first valve [ 248 ] is set to the on position . the liquid in liquid supply element [ 246 ] is also fed into container [ 230 ] via liquid inlets [ 242 ] and nozzles [ 244 ]. a plurality of second valves [ 250 ], controlling the amount of flow of liquid through liquid inlets [ 242 ], are located between liquid inlets [ 242 ] and liquid supply element [ 246 ]. second valves [ 250 ] allow the liquid to flow when they are set to the on position . liquid supply element [ 246 ], container [ 230 ], and liquid inlets [ 242 ] form a flow circulation path . liquid supply element [ 246 ] is connected to liquid inlet [ 242 ] by a pipe [ 252 ]. drive means [ 254 ], such as a pump , is connected to outlet openings [ 240 ] of container [ 230 ] using pipe [ 252 ]. preferably , one end of a filter [ 256 ] is connected to pump [ 254 ] to filter out residue from the liquid . a second end of filter [ 256 ] is connected to liquid inlet [ 242 ]. an operational sequence of the system of the present invention will now be described . component [ 110 ] is appropriately placed at a predetermined position in container [ 230 ]. first and the second valves [ 248 ], [ 250 ] are set to the on position , providing liquid to transducer [ 236 ] and liquid inlets [ 242 ]. further , drain valve [ 239 ] for controlling drain [ 238 ] is set to the off position . the liquid is injected into container [ 230 ] to a desired level through liquid inlets [ 242 ], nozzles [ 244 ], nozzles [ 231 ] and openings [ 243 ] if present . at the same time , ultrasonic / megasonic generator [ 234 ] is turned on to generate ultrasonic / megasonic waves . pump [ 254 ] is also turned on . pump [ 254 ] drives the liquid to circulate in the system . solenoid valve [ 239 ] is turned on and the liquid is quickly drained out of container [ 230 ] by drain [ 238 ]. the aforementioned steps can be repeated to remove unwanted particles on component [ 110 ]. the first and second portions of the system can be implemented either individually or concurrently to remove the unwanted particles . eight samples of an idm - defined critical component were used for an investigation of preconditioning techniques . all of these electrodes were manufactured from poco graphite &# 39 ; s zee - 2 material , of which two ( 2 ) were preconditioned using standard swept 50 khz ultrasonics , two ( 2 ) using the plasma processing described above , two ( 2 ) using a combination of plasma processing and standard swept 40 khz ultrasonics , and two ( 2 ) using a combination of plasma processing and the enhanced ultrasonic / megasonic described above . for the two ( 2 ) samples undergoing a combination treatment of plasma processing and standard swept 40 khz ultrasonics , the samples were placed in ultra pure water ( having a resistivity of 17 mω ) that was at 140 ° f . the component samples were exposed to ultrasonic energy operating at a frequency of 40 khz for approximately 30 minutes . the energy was then turned off to allow the components to soak for an additional 30 minutes prior to drying with clean , dry air . the dried component samples were then placed in an oven operating at 215 ° f . for approximately one ( 1 ) hour and then subsequently heated for an additional two ( 2 ) hours at 425 ° f . the component samples were removed from the oven and blown off with nitrogen before being double vacuum bagged for storage prior to testing . the process was the same for the two samples that were preconditioned with plasma processing and enhanced ultrasonic / megasonic energy with the exception that they were exposed to a second round of ultrasonic energy operating at 80 khz rather than 40 khz . the eight component samples were then measured for remaining particulates using a tape method in comparison to a gray scale . fig5 is a graphical representation of the results . fig6 is a graphical representation of a model developed to predict useful lifetimes for fabrication components based upon particulate counts . the data collected from the tape test was used to predict the expected lifetime values for a fabrication component preconditioned in accordance with the aforementioned examples . the enhanced ultrasonic samples and samples preconditioned in accordance with an embodiment of the present invention indicate that no “ seasoning ” would be necessary as the starting particle counts for each are well below the allowable levels . however , the fabrication component made in accordance with an embodiment of the present invention is not only superior at the front end of the life cycle , but it also unexpectedly maintains its usefulness longer during the “ wear - out ” phase period . this unexpected result not only decreases downtime at the front end of replacement , but it also increases the lifetime of the component thereby reducing the overall downtime of the fabrication unit . as will be readily apparent to those skilled in the art , the present invention may easily be produced in other specific forms without departing from its spirit or essential characteristics . the present embodiments are , therefore , to be considered as merely illustrative and not restrictive , the scope of the invention being indicated by the claims rather than the foregoing description , and all changes which come within the meaning and range of equivalence of the claims are therefore intended to be embraced therein .