as shown in fig1 and according to a first embodiment of the invention , an interconnect assembly 1 includes a prefabricated interconnect structure 10 attached to a conductive terminal 22 accessible on a face 21 of the larger structure 20 . prior to attachment , the interconnect structure 10 is prefabricated with an attachment base 15 , a suspension element 13 and a contacting end 12 . the attachment base 15 has an access face 18 and an attachment face 17 that substantially opposes the access face 18 . rigid connection between the interconnect structure 10 and the attachment terminal 22 is provided by metallurgical bonding in an attachment interface between the attachment face 17 and a terminal face 23 . metallurgical bonding in context with the present invention includes soldering , brazing and welding . the metallurgical bonding provides a connection that is electrically conductive and structurally substantially rigid opposing at least a bending stress resulting in the attachment interface from an operational spring force at the contacting end 12 . the metallurgical bonding may be established along the entire attachment interface or within region of the attachment interface . the attachment interface may be defined in conjunction with well - known particularities of well - known attachment techniques and / or in conjunction with the forces resulting in the interface from the spring force to minimize stress within the regions as may be appreciated by anyone skilled in the art . in the exemplary case of utilizing laser energy as bonding energy for establishing a metallurgical bonding , the attachment interface may include a number of dot like weld points distributed in a suitable fashion between an attachment face 17 , 117 ( see fig1 ) and a terminal face 22 , 82 ( see fig8 ). in another exemplary case where sonic energy is utilized as bonding energy for establishing a metallurgical bonding , the attachment interface may include a friction weld area distributed between an attachment face 17 , 117 and a terminal face 22 , 82 in accordance with well - known particularities of sonic friction welding . the suspension element 13 protrudes from the attachment base 15 adjacent the attachment face 17 and adjacent the access face 18 such that the attachment of the attachment face 17 to the terminal face 23 and an access to the access face 18 are substantially unimpeded . the suspension element 13 has a deformation characteristic resulting in a bending movement 143 in responds to a positioning movement 142 induced to the larger structure 20 relative to a contacting terminal 151 , 162 ( see fig1 ) while the contacting end 12 is held in a fashion opposing the positioning movement 142 . the bending movement translates into a well - known scribing movement 144 along the contacting terminal &# 39 ; s 151 , 162 surfaces and a spring force forcing the contacting end 12 towards the contacting terminals 151 , 162 . the spring force in turn causes an internal bending stress along the suspension element 13 as is well - known in the mechanical arts . the suspension element 13 may be configured to provide the spring force with a substantially constant internal bending stress along its length between the base 15 and the contacting end 12 . in such configuration and for a required spring force and suspension element material , a maximum deflection is provided with a minimum length of the suspension element 13 . constant internal stress may be accomplished by adjusting the cross section of the suspension element 13 along the length of the suspension element 13 as it is well appreciated in the art . the main purpose of the interconnect structure 10 is to establish a conductive contact between the attachment terminal 22 and a contact terminal 151 , 162 . for that purpose , the contacting end 12 is configured for an eventual removing of an oxide layer form the contact terminals 151 , 162 during the scribing . configurations of the contacting end 12 may include a sharp edge , a pointed edge , an inverted v - shape terminating in a pointed edge , a tip protruding from a face , or the like . the contacting end 12 may be specially coated , solution treated and / or heat treated for an increased wear resistance and metal - to - metal electrical contact performance . the larger structure 20 extends substantially within a assembly plane 24 with a number of terminal faces 23 being preferably parallel and in plane with the assembly plane 24 ( see also fig3 ). at this point it is noted that in context with the present invention , the term “ larger structure ” defines any structure having at least one attachment terminal 22 , 82 ( see fig8 ) and having an extension substantially larger than the extension of the attachment terminal 22 , 82 within the attachment plane 24 , 84 ( see fig8 ). the interconnect structure 10 is shaped preferably along a contour plane 11 that is preferably about perpendicular to the assembly plane 24 . in the context of the present invention , the contour plane 11 is a plane perpendicular to the attach face 17 and parallel to the scribing movement 144 . the suspension element 13 protrudes in an angle relative to the attachment face 17 such that sufficient clearance is maintained between the suspension element 13 on one side and the larger structure 20 and eventually adjacent interconnect structures 10 on the other side during operational resilient deformation of the suspension element 13 and the contacting end 12 . the terminal 22 may be conductively connected to a conductive lead 27 for communicating an electric signal towards and / or away from the interconnect structure 10 . the conductive lead 27 may propagate within the larger structure 10 or on its face 21 . in case the terminal 22 protrudes all through the larger structure 20 , the conductive lead 27 may also be connected to the terminal 22 on an opposite face ( not shown ) of the larger structure 20 . as shown in fig2 , the terminal 22 may be embedded in the larger structure 20 for an increased structural interlocking between the larger structure 20 and the attachment terminal 22 . forces and momentum eventually resulting from the spring force are thereby transmitted from the base 15 onto the larger structure 20 with a reduced risk of well - known delamitation between the terminal 22 and the larger structure 20 . fig3 depicts a perspective view of an extended portion of the larger structure 20 in a first configuration in which a dependent terminal spacing 28 and 29 are defined by a fabrication spacing 31 and 32 , which will be explained in the following under fig4 . there , a portion of a first carrier structure 19 is positioned on top of the larger structure 10 as depicted in fig3 . each of a number of interconnect structures 10 is connected to the first carrier structure 19 via a cutoff bridge 16 . the first carrier structure 19 may be positioned with respect to the larger structure 10 in a well - known fashion . for example , well - known reference holes ( not shown ) may be placed correspondingly in the larger structure 20 and the first carrier structure 19 such that well - known alignment pins ( not shown ) snuggly and perpendicularly protruding through the reference holes may align the first carrier structure 19 with respect to the larger structure 20 . in aligned position , each attachment face 17 is placed adjacent and at least partially overlapping a terminal face 23 . each interconnect structure 10 is fabricated and held within the first carrier structure 19 such that each attachment face 17 is substantially in plane with a fabrication plane 14 of the first carrier structure 19 . hence , all interconnect structures 10 within the first carrier structure 19 may be brought simultaneous into attachment position by merely positioning the first carrier plate 19 with respect to the larger structure 20 . for that purpose , the terminal spacing 28 , 29 is selected in correspondence with the fabrication spacing 31 , 32 . in attachment position , assembly plane 24 and fabrication plane 14 are substantially parallel and substantially coincident . the fabrication spacing 31 , 32 is defined to provide sufficient separation for the fabrication steps of the individual interconnect structures 10 . fabrication steps of the interconnect structures 10 include a partial separation and contouring of an interconnect structure blank , shaping of the interconnect structure blank and eventual finishing operations . the fabrication spacing 31 , 32 is further influenced by a required minimum stiffness of the first carrier structure 19 . the minimum stiffness may be defined for handling the first carrier structure 19 between fabrication steps and / or for positioning the first carrier structure 19 onto the larger structure 20 . partial separation may be accomplished with well - known techniques such as photolithographic etching , stamping , laser cutting , plasma cutting and the like . shaping may be accomplished by well - known techniques such as bending , forging , deep - drawing and the like . finishing operations may include coating , surface finishing , contour finishing , solution treatment , and heat treatment . fabrication steps may be performed simultaneously and / or sequentially . the simultaneously positioned interconnect structures 10 may be simultaneously attached by a number of attachment tools 50 . in such case , the attachment tools 50 may be spaced apart in accordance with the spacing of the access faces 18 within the first carrier structure 19 . each attachment tool 50 is configured to excerpt a bonding energy via the access face 18 through the base 15 onto the attachment face 17 and the terminal face 23 . the bonding energy is of well - known nature to cause a heating of and / or between the attachment face 17 and the terminal face 23 to a level , where metallurgical bonding in the interface between attachment face 17 and the terminal face 23 occurs . bonding energy may include thermal energy , electrical energy and / or mechanical energy . correspondingly , the attachment tool 50 may be part of a soldering apparatus , a laser welding apparatus , an electrical welding apparatus , or a friction welding apparatus . soldering , bracing or welding may accomplish metallurgical bonding between the attachment face 17 and the terminal face 23 . metallurgical bonding may be further accomplished without use of an attachment tool like , for example with well - known fabrication techniques in which the terminal faces 23 and the attachment faces 17 are immersed in a liquid solder bath . following the attachment operation , the interconnect structures 10 may be separated from the first carrier structure 19 . as illustrated in fig6 , a number of cutoff tools 60 may simultaneously cut through a number of cutoff bridges 16 . well - known electric pulse melting , laser cutting and so forth may accomplish the cutoff operation . the cutoff operation is preferably performed in a fashion that avoids or minimizes debris . separation may be further accomplished by temporarily fully separating the interconnect structure 10 from the first carrier structure 19 followed by press fitting the interconnect structure 10 back into a friction based fit within the first carrier structure 19 . in that fashion , the interconnect structure 10 may be finally separated from the first carrier structure 10 by merely pressing it out of its press fit . the attachment tool 50 may be utilized for pressing the interconnect structure 10 out of its press fit . as shown in fig7 , a final interconnect assembly 1 according to the first configuration features interconnect structures 10 simultaneously attached to the terminals 22 with a spacing substantially equal to the fabrication spacing 31 , 32 . fig8 - 12 show a second configuration of the interconnect assembly 2 and its fabrication steps in which the interconnect structures 10 are sequentially assembled with an assembly spacing 41 , 42 that is substantially independent from fabrication spacing 31 , 32 . according to fig8 , a larger structure 80 has a number of attachment terminals 82 arrayed on the larger structure 80 with spacing 41 , 42 . a number of interconnect structures 10 are attached to the terminal faces 83 . the interconnect assembly 2 is shown in fig8 in an intermediate fabrication state to illustrate the differences to the interconnect assembly 1 . a final interconnect assembly 2 may feature interconnect structures 10 attached to each of the attachment terminals 82 . the sequential attachment is explained in the following for a single interconnect structure 10 . fig9 depicts a fabrication step in which an interconnect structure 90 is brought with its attachment face 17 into proximity of an unpopulated terminal face 83 . the interconnect structure 90 is held within a second carrier structure 90 such that the positioning of the interconnect structure 90 is unimpeded by prior attached interconnect structures 10 that are already part of the interconnect assembly 2 . the fabrication position of the interconnect structure 90 within the second carrier structure 99 is defined in a fashion that takes into account the spatial limitation at the attachment position of the interconnect structure 90 . this is an important fact for selecting the spacing 41 , 42 and / or selecting an assembly orientation of the interconnect structures 10 independently from the fabrication spacing 31 , 32 and independently from an eventual fabrication orientation of the interconnect structure 90 within the second carrier structure 99 . as shown in fig9 , the fabrication position of the interconnect structure 90 is selected such that the second carrier structure 99 remains sufficiently above the interconnect structures 10 while the attachment face 17 is brought into attachment position . to accomplish this , the cutoff bridge 16 holds the interconnect structure 90 at its contacting tip 12 . as it may be appreciated by anyone skilled in the art , the cutoff bridge 16 may be placed at any location suitable for 6 fabrication of the interconnect structure 10 , 90 and for positioning the attachment face 17 with respect to the terminal face 23 , 83 . in a following step illustrated in fig1 , the interconnect structure 90 is attached to the unpopulated terminal 83 by the attachment tool 50 in a fashion similar as described for the interconnect assembly 1 . the attachment tool 50 may also operate to push onto the access face 18 such that an eventual gap remaining after initial attachment positioning between the attachment face 18 and the terminal face 83 is closed . the resilience of the suspension element 13 may assist thereby to absorb for the resulting offset between the base 15 and the carrier structure 99 . after attachment , the interconnect structure 90 is separated by the cutoff tool 60 in a fashion similar to that explained for the interconnect assembly 1 . in the case , where the attachment face 18 was forced into contact with the terminal face 83 by the attachment tool 50 , the internal stress of the suspension element 13 is released as soon as the cutoff operation is completed . consequently , the cutoff interconnect structure 90 bounces back into its original fabrication shape as is depicted in fig1 . for the purpose of visibility , the interconnect structure 90 is hatched in fig1 . whereas in the first configuration , the interconnect structures 10 are simultaneously attached , in the second configuration the interconnect structures 10 are sequentially attached . the teachings separately presented for the interconnect assembly 1 , 2 may be combined in ways that are well appreciated by anyone skilled in the art . hence , the scope of the invention includes embodiments in which sequential and parallel attachment may be combined to optimize the fabrication process in conjunction with particularities of the interconnect assembly 1 , 2 . for example , an interconnect assembly 1 , 2 may feature a number of distinctly oriented and grouped interconnect structures 10 for contacting a single contact terminal 151 , 162 , with a number of contacting ends 12 . in such a case , sequential attachment may be split into groups of equally oriented interconnect structures 10 . a larger structure 20 , 80 may be consequently populated by a sequential repetition of simultaneous attachment of groups of equally oriented interconnect structures 10 . fig1 depicts another embodiment of an interconnect assembly , in which an interconnect structure 110 has a backwards looping suspension element 113 that positions the contacting end 112 substantially centrally together with the attachment face 117 in direction of the positioning movement 142 . in that fashion , the attachment interface is kept substantially free of bending stress regardless of the spring force . fig1 illustrates a portion of a probe apparatus 140 in testing position after positioning movement 142 towards a tested circuit chip 160 . the larger structure 20 / 80 is a well - known space transformer with interconnect structures 10 attached on top and bottom . the interconnect structures 10 that are attached on the bottom contact the test terminals 162 of the tested chip 160 . the interconnect structures 10 attached on the top of the space transformer 20 / 80 are in contact with terminals 151 of a well - known printed circuit board [ pcb ] transformer 150 . nevertheless , interconnect structures 10 may also be attached to the pcb transformer contacting terminals ( not shown ) on the space transformer 20 / 80 . carrier plates 19 , 99 as well as interconnect structures 10 , 100 are preferably fabricated from sheet metal . the sheet metal is preferably monolithic . in other embodiments , the raw material from which the interconnect structures 10 , 110 are fabricated is a sandwiched compound material including a number of layers specifically configured for their final placement in one or more elements of the interconnect structure 10 , 110 . layers may be selectively removed in well - known fabrication techniques . the carrier structures 19 , 99 are sacrificial and disposed of after attachment of the interconnect structures 10 , 90 , 100 to the attachment terminals 22 , 82 and after completion of the cut off operation . the carrier structures 19 , 99 may be configured as substantially finite elements containing a certain number of interconnect structures 10 , 90 , 100 . the carrier structures 19 , 99 may also be substantially infinite elements configured as a band continuously forwarded as interconnect structure ( s ) 10 , 90 , 100 are used up during the assembly procedure . the term “ substantially finite ” means in context with the present invention a limited area extension selected primarily for a feasible handling of a single carrier structure 19 , 99 within and during the assembly process of the interconnect structures 10 , 90 , 100 . the term “ substantially infinite ” means in context with the present invention a band like configuration in which the length of the band is limited primarily by feasibility of handling outside the assembly process as is well appreciated by anyone skilled in the art . a first fabrication apparatus may prefabricate the interconnect structures 10 , 90 , 100 in a continuous fashion as is well known for progressive dies . such fabrication apparatus may be combined with a second fabrication apparatus for positioning and metallurgical bonding the interconnect structures 10 , 90 , 100 as explained above . the second fabrication apparatus may be configured in a way similar to a well - known tape application bonding apparatus . for an infinite carrier structure , an interconnect assembly may be fabricated by merely providing a roll of sheet metal band on which the interconnect structures 10 , 90 , 100 are prefabricated immediately prior their final assembly . the infinite carrier structure progresses thereby through a number of prefabrication stages in a rate that corresponds to the rate with which the interconnect structures 10 , 90 , 100 are attached to the attachment terminals 22 , 82 . accordingly , the scope of the invention described in the specification above is set forth in the following claims and their legal equivalent :