the embodiments of this invention will be described with reference to the drawings . in this description , &# 34 ; metallic powder &# 34 ; and &# 34 ; paste &# 34 ; have many of the same features so where necessary for the purposes of explanation , the metallic powder will be described as &# 34 ; solder powder &# 34 ;, and the paste as &# 34 ; solder paste &# 34 ;. in the above and in the description which follows , the term &# 34 ; powder &# 34 ; is used in the broad sense of the word , meaning both one particle and a collection of multiple particles . when molten solder is extruded through microscopic nozzle holes of less than 100 μm in size , for example 18 μm , in an inert gas atmosphere , that molten solder forms extremely small long vertical conical shapes , continuously hanging from the nozzle holes , and at the tip of these continuous shapes , molten solder changes from droplet shapes to microscopic spherical shapes , of 44 μm in size at that point , which continue falling and solidifying to form the desired powder . as shown in fig1 the molten solder ( powder ) 1 in this spherical forms a non - oxidisable sphere , as internal oxidation is avoided through the cooling and solidifying of the outer layer 2 . examination and enlargement of this sphere ( powder ) 1 under a microscope indicates that for some reason not entirely clear , part of the curved surface 3 ( the surface drawn in a smooth curve ) has a non - curved surface part 4 ( non - smooth surface with a flat or ridged surface ). through the provision of this non - curved surface 4 on part of the curved surface 3 , when a solder paste 6 made by kneading this powder 1 into a flux 5 is used to print onto a printed circuit board 7 , the solder does not indicate &# 34 ; dulling &# 34 ; and further when a chip package 8 is placed on top ( in fig3 ), the fact that solder balls do not occur after solder heating and melting ( reflow ) can be verified . the flux 5 includes flux for dissolving evenly such elements as rosin for purification of the metal surface and prevention of re - oxidation during heating ; an activator for purification of the metal surface ; and a viscosity agent for regulation of viscosity . a powder 1 of the said content , and of the desired small size and uniformity , with an even size distribution , can be efficiently obtained from molten solder extruded from numerous microscopic nozzle holes . further , the powder 1 thus obtained has no fine , and if kneaded into the said flux 5 and used as a paste 6 , solder balls do not occur after reflow . this situation is demonstrated in the microscope photographs . fig2 demonstrates , at 1000 times magnification , that the powder 1 contains no fine , and that parts of the curved surface have non - curved surfaces . fig4 is a photograph at 150 times magnification , with the powder obtained through sifting to the 37 - 90 μm range being extremely evenly sized . fig5 is a a photograph taken at 200 times magnification , indicating that solder balls do not occur after solder heating and melting ( reflow ). the &# 34 ; metallic powder and paste made from it &# 34 ; of this invention , does not apply only to the solder powder and solder paste as described above , but may also apply to copper alloy powder and its copper paste , gold alloy paste and its gold wax , silver alloy powder and its silver wax , or zinc powder , indium alloy powder , and its paste . however , description of these additional types has been omitted in order to reduce redundancy . in describing the device used to obtain powder 1 with reference to the drawings fig6 and 7 , the device is constructed serially , from top to bottom , of a pressure vessel 10 used to contain the molten metal 9 and to heat it and maintain its temperature ; an extrusion nozzle 12 , provided with multiple microscopic nozzle holes 11 arranged at the bottom of the said pressure vessel 10 ; a case 15 with a processing space 14 , on the exit side of the nozzle holes 11 , and in which the molten metal 13 which is extruded from the nozzle holes 11 continuously falls and is cooled ; and a powder extraction vessel 16 provided at the bottom of the case 15 . within the case 15 is provided a cooling jacket 17 as a cooling means , and a cooled water inlet and outlet 18 , with the inert gas introduction means 19 connected to both the said pressure vessel 10 and the case 15 , and the inert gas discharge means 20 connected at the bottom of the case 15 . the metallic powder and paste , along with the metal powder manufacture device , of this invention , as described above , have the following benefits . a . because parts of the curved surface of the powder are non - curved , the powder is internally stable and paste made using this powder will not &# 34 ; dull &# 34 ; after printing or painting . b . the molten metal extruded from the nozzle holes of microscopic size , forms hanging continuous shapes , microscopic long vertical conical shapes , which change from droplet to spherical shape ( powder ), producing shapes microscopic in size . c . the spherical molten metal becomes powder as designed as the microscopic spheres solidify while falling , and because the outer layer hardens through cooling processing , oxidation of the inside is prevented , and further since it does not oxidise , the paste made from the powder can be preserved for long periods , without deterioration in the solderability of the paste , making use very economical since the whole amount can be used until it runs out , there being no need to dispose of it in the meantime . d . through use of nozzles holes of different sizes , the size of the powder can be regulated easily , and powder of uniform size can be obtained in large amounts . e . where nozzle holes of around 18 μm in size are used , the average size of the powder is 55 - 60 μm , providing a very uniform powder without any fine . f . since an extremely evenly sized powder is obtained , solder paste made using this powder performs well in painting ( printing ) on printed circuit boards and is ideal for high - density ( narrowly spaced ) patterns .