this invention discloses a low - cost , easily assembled micromirror package . the packages of this invention use fiberglass printed circuit board substrates , molded plastic parts , and lightweight plastic windows instead of ceramic parts and glass windows . the details of the two embodiments are discussed below . fig3 a shows a first embodiment of the micromirror package 300 of this invention . the package is comprised of a printed circuit board ( pcb ) base ( substrate ) 30 , a molded plastic case 33 , a top window - retaining ring 37 , and a plastic optical window 36 , enclosing a micromirror 38 . this invention also allows for the attachment of an optical aperture in the window area of the package , which will prevent stray light from entering around the edge of the package where it can bounce around and contaminate the light coming from the micromirror mirrors . the high cost ceramic used in many conventional packages is replaced by the lower cost pcb 30 ( example — fr4 ) and molded plastic 33 assembly . the pcb substrate 30 contains circuit traces 31 , which are used to bond out the micromirror &# 39 ; s 38 leads to the outside by means of either side contacts 32 or a grid - pad matrix ( not shown ) on the bottom of the package 300 . bond wires 39 are shown connecting the micromirror 38 to the pcb traces 31 . a thermal ground plane is also included on the bottom surface of the pcb 30 , which is in effect the bottom of the package 300 . the plastic case 33 is molded around the pcb 30 substrate to form a seal at the bottom of the package . there is an o - ring mating flange 34 , shown in fig3 b , located on the top of the plastic case 33 . the plastic case 33 also has snap - pockets where the window 36 mounting - clamp 37 attaches to the assembly . fig3 b is a sectional view of one side of the package showing the top window 36 mounting and clamping mechanism . as shown , the plastic case 33 has snap - pockets 40 molded into it to contain the optical plastic window - clamping ring 37 . an o - ring 35 sits on the o - ring - seal flange 34 and then the optical plastic window 36 sits on top of the o - ring . finally , the mounting clamp 37 is placed over and around the perimeter of the top window 36 and pressed down , compressing the o - ring 35 , locking the snap - hooks 41 into the snap - pockets 40 formed in the molded plastic case 33 , sealing the top portion of the package . fig4 is an exploded view of the micromirror package of the first embodiment of this invention . the pcb 30 and the molded plastic case 33 are mated together in the mold when the plastic case is manufactured , with the pcb 30 becoming the bottom of the package . the micromirror 38 is attached to the pcb 30 and bonded out to the circuit interconnect traces 31 , shown in fig3 a , using standard semiconductor processes . an o - ring 35 is then placed on the o - ring - seal flange 34 surface , shown in fig3 a , of the package . finally , the window 36 , preferably an optically clear plastic window or a glass window , is placed on top of the o - ring 35 , the mounting clamp 37 is place over and around the edges of the window 36 , and the snap - hooks of retaining ring 37 are snapped into the snap - pockets 40 in the plastic case 33 , compressing the o - ring , to provide a lightweight , sealed assembly . fig5 a is a drawing showing a second embodiment of the micromirror package 500 of this invention , which uses an adhesive to attach the optically clear top window 56 . the package is comprised of a printed circuit board ( pcb ) base 50 , a molded plastic case 53 having an adhesive - seal flange ( surface ) 54 , and an optical window 56 , and encloses a micromirror 57 . this package is similar to that of the first embodiment except for the way the optical window 56 is attached . the bottom of the package is a pcb 50 with circuit traces 51 bringing the micromirror leads out to edge pads 52 or to a bottom grid - pad matrix . as in the earlier case , the micromirror is attached to the pcb and bond wires 58 are attached between the micromirror input / output pads and the pcb traces 51 . a thermal ground plane is also included on the bottom surface of the pcb 50 , which is in effect the bottom of the package 500 . the primary difference in this embodiment is that the o - ring mating flange of the earlier embodiment is replaced with an adhesive - seal flange 54 , which is an integral part of the molded plastic case 53 . in this case , the snap pockets in the plastic case are no longer required . this package has all the benefits of the earlier package ; low - cost , lightweight , easy assembly , and good reliability . fig5 b is a sectional view of the optical plastic window 56 mounting technique for the package in the second embodiment of the invention . as shown , the plastic case 53 has an adhesive - seal flange 54 built into it . the adhesive 55 is dispensed on top of the seal flange 54 surface and the plastic window 56 sits on top of the adhesive 55 . the adhesive is then activated and cured to bond the window 56 to the molded case 53 to provide a completely sealed package . fig6 is an exploded view of the low - cost micromirror package of the second embodiment of this invention . the pcb 50 and the molded plastic case 53 are mated together in the mold when the plastic case is manufactured , with the pcb 50 becoming the bottom of the package . the micromirror 57 is attached to the pcb 50 and bonded out to the circuit interconnect traces 51 ( fig5 a ) using standard semiconductor processes . an adhesive 55 is then dispensed on to the adhesive - seal flange 54 surface of the molded plastic case 53 and the optically clear plastic window 56 is placed on top of the adhesive 55 . finally , the adhesive is activated and cured to properly seal the package . fig7 shows the micromirror packages of this invention with flexible interconnect cables integrally built into the package . although fig7 shows the first embodiment of the invention , either of the two packages discussed above can be configured with flexible interconnect cables . the package shown in fig7 with flex - cable interconnect capability , is comprised of a printed circuit board base 30 with pcb leads 31 , a molded case 33 with a snap connected optical plastic window 36 , a mounted micromirror 38 , bonding wires 39 connecting the micromirror 38 to the pcb traces 31 , and flexible cables 70 ( two shown ) with lead traces 72 and attached connectors 71 . this configuration can have up to 4 flex - cables . the connectors 71 are used to connect the micromirror ( s ) into a motherboard or other bus . fig8 shows a system level block diagram for a single micromirror projection display system . the system is comprised of a light source 80 , a first condenser lens 81 , a motor / color filter wheel assembly 82 , a second condenser lens 83 , a low - cost micromirror in the package of this invention 84 , a fixed or zoom projection lens 85 , and a viewing screen 86 . another example of a high - brightness micromirror projection display , which uses three of the low - cost micromirror packages of this invention , is shown in fig9 . this system is comprised of a lamp ( light source ) and reflector assembly 90 , a condenser lens 91 , a turning mirror 92 , a total internal reflective ( tir ) prism 93 , three micromirrors ( for red , green , and blue light ) in the low - cost package of this invention 94 , color splitting / color combining prisms 95 , a fixed or zoom lens 96 , and a viewing screen 97 . while this invention has beer described in the context of two preferred embodiments , it will be apparent to those skilled in the art that the present invention may be modified in numerous ways and may assume embodiments other than that specifically set out and described above . accordingly , it is intended by the appended claims to cover all modifications of the invention that fall within the true spirit and scope of the invention .