the current invention proposes a process for preserving and enhancing the solderability of a metal surface , particularly copper surfaces . the proposed process comprises the following steps : a ). cleaning the metal surface ; b ). optionally , etching the metal surface ; c ). treating the metal surface with an immersion silver plating solution , said solution comprising : 1 . a soluble source of silver ions ; 2 . an acid ; 3 . an additive selected from the group consisting of fatty amines , fatty amides , quaternary salts , amphoteric salts , resinous amines , resinous amides , fatty acids , resinous acids , and mixtures of the foregoing ; 4 . optionally , an imidazole , benzimidazole , or imidazole derivative ; and 5 . optionally , an oxidant . a ). cleaning the metal surfaces ; b ). optionally , etching the metal surfaces ; c ). treating the metal surface with an immersion silver plating solution ; d ). treating the immersion silver plated surface with a solution which comprises an additive selected from the group consisting of fatty amines , fatty amides , quaternary salts , amphoteric salts , resinous amines , resinous amides , fatty acids , resinous acids and mixtures of the foregoing . it has been discovered that immersion silver deposits provide excellent solderability preservatives , which are particularly useful in the fabrication of printed circuit boards . the solderability achievable with a simple immersion silver deposit in printed circuit applications has unexpectedly been found to exceed that achievable with prior art nickel - gold plating processes such as described in u . s . pat . no . 5 , 235 , 139 and unexpectedly exceeds that achievable with other immersion deposits . as can be seen in the examples to follow , the processes of the current invention yield surfaces which are very solderable under adverse conditions . in printed circuit applications the surfaces are wire bondable . to addition the incorporation of an additive , selected from the group consisting of fatty amines , fatty amides , quaternary salts , amphoteric salts , resinous amines , resinous amides , fatty acids , resinous acids and mixtures of the foregoing , into the immersion silver deposit by incorporation in the plating bath or subsequent treatment of the plated surface greatly reduces the tendency of the silver deposit to electromigrate . immersion plating is a process which results from a replacement reaction whereby the surface being plated dissolves into solution and at the same time the metal being plated deposits from the plating solution onto the surface . the immersion plating initiates without prior activation of the surfaces . the metal to be plated is generally more noble than the surface metal . thus immersion plating is usually significantly easier to control and significantly more cost effective than electroless plating , which requires sophisticated auto catalytic plating solutions and processes for activation of the surfaces prior to plating . the soluble source of silver ions can be derived from a variety of silver compounds . the inventors have found silver nitrate to be most preferable . the concentration of silver in the plating solution can range from 0 . 1 to 25 grams per liter , but is most preferably present in a concentration of 0 . 5 to 2 grams per liter . although a variety of acids are suitable for use in this formulation , the inventors have found that methane sulfonic acid or nitric acid is most preferred . the concentration of acid in the plating solution can range from 1 to 150 grams per liter but is preferably in the range of 5 to 50 grams per liter . in order to prevent or significantly reduce the tendency for immersion silver plates to electromigrate in the application proposed , the inventors have found it necessary to incorporate certain additives into the plated deposit , either by incorporation of the additives in the plating bath itself or by subsequent treatment of the plated surface with the additives . incorporation of the additives into the plating bath itself is the preferred method . the additives may be selected from the group consisting of fatty amines , fatty acids , fatty amides , quaternary salts , amphoteric salts , resinous amines , resinous amides , resinous acids and mixtures of the foregoing . examples of suitable fatty amines are tallowamine and cocoamine . examples of suitable fatty acids are stearic acid , oleic acid , palmitic acid and acids derived from the distillation of tall oil . examples of suitable fatty amides are cocamide and tallowamide . examples of suitable quaternary salts are ( stearamidopropyl ) dimethyl hydroxyethylammonium dihydrogen phosphate . examples of suitable amphoteric salts are alkyliminodipropionic acid monosodium salts wherein the alkyl portion may be coco , tallow or similar organic alkyl chains . examples of suitable resinous amines are amines derived from tall oil acids . examples of suitable resinous amides are cocoamide , tallow amide and amides derived from tall oil acids . examples of suitable resinous acids are acids derived from the distillation of tall oil such as abetic acid . also suitable are ethoxylated and / or propoxylated versions of any of the foregoing materials such as ethoxylated or propoxylated fatty amines , ethoxylated or propoxylated fatty acids , ethoxylated air propoxylated quaternary salts , ethoxylated or propoxylated amphoteric salts , ethoxylated or propoxylated resinous amines , ethoxylated or propoxylated resinous amides , and ethoxylated or propoxylated resinous acids . preferred additives include ethoxylated tallowamine , cyastat ls ( quaternary ammonium methylsulfate of a fatty amidoalkyl amine ) and ethoxylated cocoamine . the concentration of the foregoing additives in the immersion silver plating bath or in the subsequent surface treatment composition may range from 0 . 1 to 15 grams per liter but is preferably from 1 to 5 grams per liter the inventors have discovered that the inclusion of imidazole or imidazole derivative of the following formula has a significant positive impact upon the plate produced by immersion plating solutions , particularly immersion silver plating solutions used in the processes of this invention : wherein r 1 , r 2 , r 3 and r 4 are independently selected from the group consisting of substituted or unsubstituted alkyl groups , substituted or unsubstituted aryl groups , halogens , nitro groups and hydrogen . the inclusion of an imidazole as described above brightens the plated deposit and improves the integrity and physical properties of the resultant plated deposit . in addition , the imidazole also extends the useful life of the immersion plating solution . the inventors have found that histidine is a particularly preferred imidazole for the purposes of these processes . the inclusion of imidazoles provides significant advantages in immersion plating solutions in general , but is particularly useful and advantageous in immersion silver plating . the inventors have found that immersion silver deposits resulting from plating baths containing imidazoles are brighter , smoother and more cohesive than immersion silver deposits plated from baths which do not have imidazoles . in addition the immersion plating baths with imidazoles have longer effective lives than comparable baths without imidazoles . these same advantages are achievable by the inclusion of imidazoles in other immersion plating baths , including copper , palladium , gold , ruthenium and rhodium . with respect to the immersion silver compositions useful in the present invention , the plating solution may , optionally , advantageously also contain an oxidant . the inventors have found that nitro aromatic compounds most preferably dinitro compounds , such as 3 , 5 dinitrohydroxybenzoic acid are preferred in this regard . the concentration of such an oxidant in the solution can range from 0 . 1 to 25 grams per liter , but is preferably from 0 . 5 to 2 grams per liter . the immersion silver solution can be used in the processes of the current invention at temperatures ranging from room temperature to 200 ° f . but is preferably used at from 80 to 120 ° f . the time for immersion in the plating solution can range from 1 to 30 minutes but is preferably from 1 to 5 minutes . the immersion silver solution of the current invention is thus used to plate a thin layer of silver onto the surface to be soldered . it is believed that the resultant silver coating should be from 1 to 100 micro inches thick , preferably from 10 to 60 micro inches thick for effective enhancement and preservation of the solderability of the surface . although this process is effective in soldering many surfaces , it is particularly useful in soldering copper surfaces , such as areas of connection on printed circuit boards . although this technique may be utilized advantageously over almost any surface , it is most useful in the fabrication of printed circuit boards , particularly solder mask over bare copper ( smobc ) boards . thus , in fabricating smobc boards , the solder mask is applied to the surfaces of the board then exposed and developed to reveal the areas of connection . these areas of connection are then essentially the only exposed areas of copper on the board , with the remainder essentially being covered by solder mask . these exposed areas of connection are thus destined to be points of attachment , in most cases by soldering , when the electronic components are later placed on the board later in the fabrication cycle . therefore , the solderability of these exposed points , generally copper , must be enhanced and preserved . thus according to the current invention these areas are then preferably cleaned , using an acid cleaner , and subsequently microetched to prepare the surface for acceptable immersion plating . following this preferred preparation , the board is immersed in the immersion silver plating solution , such that a silver deposit of appropriate thickness is achieved . the invention is further described for illustrative purposes only in the following examples which are in no way limiting of the invention itself . in each of the examples standard ipc - b - 25 test circuit boards are utilized in order to provide consistency . ipc - b - 25 standard is incorporated herein by reference in its entirety . a ). acid cleaner , 5 minutes , 120 ° f . b ). water rinse c ). sodium persulfate / sulfuric acid microetch , 1 minute , 95 ° f . d ). water rinse e ). water rinse f ). immersion silver plate using the following composition the circuit boards were then tested according to the bellcore gr - 78 - core ( 13 . 2 . 5 , 13 . 2 . 7 ) standard test method and the results are recorded in table 1 . ipc - b - 25 test circuit boards were treated as noted in example i except that in this case the immersion silver plating bath also contained 5 . 0 gr / l of tallow amine ethoxylated with 15 moles of ethylene oxide . the circuit boards were then tested according to the belcore gr - 78 - core ( 13 . 2 . 5 , 13 . 2 . 7 ) standard test method and the results are recorded in table 1 . ipc - b - 25 test circuit boards were treated as noted in example i except that in this case the immersion silver plating bath also contained 1 . 1 g / l of pamak 25 - s which is available from hercules , incorporated of wilmington , del . and is a blend of fatty and resinous acids . the circuit boards were then tested according to belcore gr - 78 - core ( 13 . 2 . 5 , 13 . 2 . 7 ) standard test method and the results are recorded in table 1 . ipc - b - 25 test circuit boards were treated as noted in example i except in this case after step ( g ) the circuit boards were further processed as follows : h ). treatment with an aqueous solution containing : 5 . 0 gr / l cyastat l5 ( quaternary ammonium methylsulfate of a fatty amidoalkyl amine ) 32 ml / l nitric acid ( 70 %) balance - water . i ). water rinse . the circuit boards were then tested according to belcore gr - 78 - core ( 13 . 2 . 5 , 13 . 2 . 7 ) standard test method and the results are recorded in table 1 . ipc - b - 25 test circuit boards were treated as noted in example iv except that in this case the crystat ls was replaced with 5 . 0 gr / l cocoamie ethoxylated with 2 moles of ethylene oxide . the circuit board were then tested according to belcore gr - 78 - core ( 13 . 2 . 5 , 13 . 2 . 7 ) standard test method and the results are recorded in table 1 .