referring now to the drawings , wherein like components are designated by like reference numerals , fig1 schematically illustrates a water - cooled heat - sink 20 for a diode - laser bar stack in accordance with the present invention . heat - sink 20 includes a copper cooling - unit 22 including elongated rectangular cooling - members ( mounting - members ) 24 spaced apart and parallel to each other , extending upward from the cooling - unit in a width - direction of the cooling - members , as illustrated . diode - laser bars , not shown in this view , are mounted between the cooling - members . preferably , the cooling - members 24 are an integral part of cooling - unit 22 , i . e ., the cooling - unit including the cooling - members is machined from a single piece of copper . cooling - unit 22 is attached by screws 26 to a base 28 including conduits 30 for introducing cooling - water into and out of the heat - sink . the choice of which conduit is an input conduit and which conduit is an output conduit , here , is somewhat arbitrary . base 28 is preferably made from a material which is easily machined . one preferred material is stainless steel . in operation of heat - sink 20 , cooling - water flows into base 28 through a selected one of conduits 30 , through each of cooling - members 24 ( in parallel ) in cooling - unit 22 and out of the other conduit 30 . a description of a preferred arrangement for this cooling - water flow is set forth below with reference to fig1 a , fig1 b , and fig1 c . fittings or coupling units for connecting to conduits 30 to supply water and disposal hoses or tubes are not shown for simplicity of illustration . such fittings can be selected from several well - known and commercially available fittings . fig1 a is an exploded view from above of heat - sink 20 of fig1 schematically illustrating an integral manifold arrangement 31 in the base 28 cooperative with conduits 30 , and cooperative with cooling - members 24 in cooling - unit 22 . manifold 31 includes elongated plenums 36 machined into surface 32 of base 28 . here , the input plenum is designated as plenum 36 a and the output plenum is designated as plenum 36 b , corresponding to the designation of the input and output conduits with which the plenums connect . screws 26 for attaching unit 22 to base 28 are not shown in this view . the screws extend through holes 27 , here countersunk , in unit 22 , and are received by threaded holes 29 in base 28 . between plenums 36 a and 36 b is an array of boat - shaped fins 34 ( fins with quarter - rounded ends ). the fins are spaced apart and parallel to each other with a center - to - center spacing equal to the center - to - center spacing of cooling - members 24 in unit 22 . surrounding the manifold arrangement of plenums and fins is a trench or groove 40 configured for accommodating a water - seal ( not shown in this view ) such as an elastomer ring or the like . it is preferable that the base , including plenums , fins , and the water - seal groove are machined from a single piece of material . fig1 b is an exploded view from below schematically depicting slots 42 extending into cooling - members 24 of cooling - unit 22 . also depicted are threaded holes 46 in base 28 . these are provided for attaching the heat - sink unit to a base , walls , or a support structure of a housing in which the inventive heat - sink will be used . fig1 c is a cross - section view seen generally in the direction 1 c - 1 c of fig1 . this view depicts a longitudinal aspect of slots 42 in unit 22 . here , the slots have a bathtub - like longitudinal shape , cooperative with the boat - shape of fins 34 such that , when each fin is inserted into a corresponding slot , a macro - channel 50 , having a height h , is formed in each cooling - member 24 . height h , of course results from a difference in the depth of the slot and the height of the fin being less than the depth of the slot ). macro - channel 50 has rounded corners resulting from the longitudinal shape selection of the fins and slots . the ends of channel 50 align with plenums 36 a and 36 b in base 28 . the plenums are in fluid communication with conduits 30 via ducts 46 a and 46 b in base 28 . fig1 d is a cross - section view seen generally in the direction 1 d - 1 d of fig1 c schematically depicting a lateral aspect of cooling - members 24 of cooling - unit 22 with macro - channels 50 having a width w . a particular advantage of this inventive , two - piece construction for providing cooling macro - channels 50 is that surfaces that form the channels can be plated , for example gold - plated , by conventional electroplating methods . the plating can be inspected before heat - sink 22 is assembled . preferably , at least those surfaces provided by copper cooling - unit 22 should be plated . surfaces of the channels provided by base 28 may be plated if the selected base material is not inherently corrosion resistant . regarding dimensions of macro - channels 50 , for a cooling - member 24 having a width of about 1 . 0 mm , each macro - channel preferably has a height h of between about 3 . 7 mm and about 4 . 0 mm , and a width w of about 0 . 5 mm . these dimensions are provided for guidance only and should not be considered limiting . the shape of the rounded corners of the macro - channels is not critical , but is provided to ensure that there is free flow of cooling - water as depicted , avoiding any sharp corners or recesses in which water could be trapped . suitable channel - dimensions and corner - shape can be readily determined , by trial and error , for any predetermined range of pressure difference between inlet and outlet , using commercially available thermal - analysis software such as solidworks , from dassault systèmes of vélizy — villacoublay , france . the channel - width should bring cooling - water close enough to the surface of the cooling - members to optimize cooling while still leaving the cooling - member sufficiently rigid to support bonding operations for diode - laser bars . continuing with reference to fig1 d , a lateral aspect of a particularly preferred mounting scheme in accordance with the present invention for a diode - laser bar in a space 25 between adjacent cooling - members 24 is depicted . here , a diode - laser bar 60 is solder - bonded between metallized surfaces 64 a and 64 b of two ceramic ( insulating ) sub - mounts 62 a and 62 b . the ceramic material of the sub - mounts is preferably relatively highly thermally conductive . another factor influencing the choice of ceramic material is the cte , which should be compatible with substrate material of the diode - laser bar , the solder used for the bonding and the diode - laser bar substrate material . for gallium arsenide ( gaas ) substrates , suitable ceramic materials include beryllium oxide ( beo ) and aluminum nitride ( aln ). these materials permit that a hard solder such as gold / tin ( au / sn ) solder can be used to bond the diode - laser bar to the sub - mount without inducing intolerable stress on the diode - laser bar due to thermal cycling ( on and off operation ) during normal use . one advantage of bonding the diode - laser bar between two ceramic sub - mounts is that whatever stress is produced is balanced , thereby minimizing distortion of the diode - laser bar and alignment of emitters thereof . slow axis misalignment of emitters in a diode - laser bar is whimsically termed ‘ smile ” by practitioners of the art . one of the sub - mounts , between which diode - laser bar 60 is bonded , has a metallized surface 66 solder - bonded to one of the cooling - members . in fig1 d sub - mount 62 a is bonded to the cooling - member . preferably a thermally conductive packing 68 , such as a shim or plated solder material , is inserted between the “ un - bonded ” sub - mount ( here , sub - mount 62 b ) and the cooling - member to put the sub - mount in thermal communication with a cooling - member . clearly , a better thermal communication is established between the bonded sub - mount and the cooling - member to which it is bonded . accordingly , it is preferable that the epitaxial - layers side ( p - side or anode - side ) of the diode - layer bar is bonded to the “ bonded sub - mount ”. however , with a sufficiently thin sub - mount , for example less than about 0 . 4 mm thick , and the inclusion of shim 68 , there is still effective cooling of the n - side of the epitaxial layers of the diode - laser bar . fig2 is a fragmentary plan view from above of the cooling - unit of fig1 schematically illustrating three diode - laser bars mounted between ceramic sub - mounts mounted in - turn between cooling - members of the cooling - unit as discussed above with reference to fig1 d . it should be noted in particular that the cooling - members are sufficiently long that the entire length of a diode - laser bar can be in communication with the straight portion ( between rounded corners ) of the cooling - channels in the cooling - members . further , ceramic sub - mounts 62 a and 62 b are sufficiently long to permit a partial overlap of a length equal to or greater than the length of the diode - laser bar . the partial overlapping is done with the non - overlapped portions of the sub - mounts at opposite ends of the diode - laser bar , and in this instance , the overlapping is sequentially alternated between adjacent pairs of sub - mounts . this alternate partial overlapping arrangement of the metallized sub - mounts permits convenient connection of the diode - laser bars in series . in this arrangement , reading from left to right , a positive ( pos ) lead is connected to the non - overlapped part of sub - mount 62 a at one end of diode - laser bar 60 and a negative ( neg ) lead is connected to the non - overlapped part of sub - mount 62 b at the other end of the diode - laser bar . the negative lead from sub - mount 62 a is connected to a positive lead attached to sub - mount 62 a of the next - diode - laser bar , and so on . the connecting leads ( sheet or strip electrodes ) are made sufficiently rigid that the shape of the electrodes is retained in normal use , and cannot accidentally come into contact with an exposed part of a cooling - member . because of this , and because of there being an electrically insulating sub - mount on each side of the diode - laser bars , cooling - water in the heat - sink is electrically isolated from the diode - laser bars . for convenience of illustration , optical axes ( well - known fast - and slow - axes ) of the diode - laser bars are shown inset in fig2 . the emission direction of the emitters of the diode - laser bars is as indicated , i . e ., perpendicular to the plane of the drawing , in the extension - direction of the cooling members . a plurality of diode - laser bars arranged in this manner is typically referred to as a vertical - stack or fast - axis stack of diode - laser bars . exemplary dimensions in the arrangement of fig2 are as follows . the length of cooling - members 24 is about 20 mm ; the thickness of the cooling - members is about 1 mm ; the width (“ thickness ”) of spaces 25 between the cooling - members is about 1 mm . here again , these dimensions are provided for guidance only , and should not be considered as limiting the present invention . principles of the invention described above in the context of cooling a fast - axis stack of diode - laser bars are equally applicable to cooling a single diode - laser bar . by way of example , fig3 schematically illustrates a preferred embodiment of a diode - laser bar package 70 including water - cooled heat - sink in accordance with the present invention . the diode - laser bar is in a “ sandwich ” 90 between metallized , ceramic , electrically insulating sub - mounts as described above for the inventive fast - axis stack arrangement . the diode - laser bar axes are shown inset in fig3 . the heat - sink of package 70 includes a copper cooling - unit 72 on which the diode - laser bar sandwich is mounted . the copper cooling - unit is attached to a steel base 74 with a conduit 76 for introducing water into the package and a conduit 77 for delivering water from the package . details of the conduit arrangements ( not shown ) within base 74 and cooling - channels or macro - channels ( also not shown ) are discussed in detail further hereinbelow . continuing with reference to fig3 , and with reference in addition to fig3 a , and fig3 b , diode - laser bar sandwich 90 , comprising diode - laser bar 60 bonded between ceramic sub - mounts 62 a and 62 b is bonded to cooling - unit in the form of an integral mounting - platform 73 of cooling - unit 72 . the emission direction of the diode - laser bar is parallel to surface 73 a of the mounting platform . the diode - laser bar is bonded epitaxial - side ( p - side or anode - side ) down on sub - mount 62 a , which is the sub - mount in contact with platform 73 . a separate cathode - side cooling - block ( cooling - unit ) 80 is bonded to ceramic sub - mount 62 b . a thermally conductive packing or shim 92 of solder material , such as indium ( in ) or the like , places cathode - side cooling - block in thermal communication with a raised portion 75 of the cooling - unit ( see fig3 a ). extended end - portions 80 a ( see fig3 b ) of the cathode - side cooling - block are provided for mounting collimating optics ( not shown ) for the diode - laser bar . cooling - water flows in contact with platform 73 and part of raised portion 75 as outlined in phantom in fig3 b . terminal blocks 82 and 84 ( anode and cathode respectively ) are attached to raised portion 75 of cooling - unit by screws and insulating bushings ( not shown ), with insulating pads 86 placed between the blocks and the raised portion of the cooling - unit . this is important in preventing any electrical contract between the terminal blocks and the cooling - unit . electrical contact with the diode - laser is made from electrical leads clamped at one end thereof between terminal blocks 82 and 84 and corresponding insulators 86 , and bonded the opposite end thereof to the ( metallized ) diode - laser sides of ceramic sub - mounts 62 a and 62 b . in fig3 a , a cathode lead is depicted symbolically as a wire - lead 94 . in practice , this is a sheet electrode ( for current carrying capacity ) but is not depicted as such in fig3 a to avoid obscuring other details of the heat - sink - assembly . in fig3 b , examples 87 a and 87 b of such sheet - electrodes are depicted . dashed lines indicate the connection of electrodes 87 a and 87 b to sub - mounts 62 a and 62 b , respectively . here again , this method of electrical connection to the diode - laser by metallized sides of the ceramic sub - mounts is for avoiding any electrical contact between the diode - laser bar and the heat - sink . details of cooling - arrangements for the inventive heat - sink are next described with reference to fig3 c , fig3 d and fig3 e . fig3 c is a three - dimensional view from below illustrating a recess 96 formed in cooling - unit 72 . the recess includes spaced - apart grooves 98 which form macro - cooling - channels when cooling - unit 72 is assembled onto the base of the heat - sink . ridges 100 separate grooves 98 ( except for end ones 98 ′ thereof ). the grooves terminate in raised ( less deep ) portions 102 at each end of the groves ( only one visible in fig3 c ). regarding exemplary dimensions in fig3 c , the grooves ( between portions 102 ) are preferably about 0 . 6 mm deep ( as defined by the height or depth difference between the grooves and ridges 100 ). the grooves are preferably about 1 . 2 mm wide . the length of recess 96 including the grooves is preferably long enough to extend along most of the length of platform 73 of cooling - unit 72 , and wide enough to extend partially under raised portion 75 of the cooling - unit , as can be seen in the phantom outline in fig3 b . the total depth of recess 96 ( at the groves ) is preferably selected such that grooves 98 are within about 0 . 3 mm of the surface of platform 73 ( see fig3 b ) of the cooling - unit . fig3 d is an enlarged three - dimensional view of the base 74 of the inventive heat - sink . a footprint of cooling - unit 72 is depicted in phantom . water conduits within the base are also depicted in phantom . continuing reference is made to fig3 c . base 74 , here , is assumed to be machined from a single piece of metal such as stainless - steel . a mating - block portion 104 of the base is configured to engage raised portions 100 in recess 96 of fig3 c for closing grooves 98 to form macro - channels . in that regard , mating - block 104 is a close fit in the length of the recess and a close fit between raised portions 102 in the recess . on opposite sides of block 104 are machined elongated plenums 106 a and 106 b . the block and plenums are surrounded by a machined groove 108 for accommodation a sealing ring . plenums correspond in position to raised ( channel - terminating ) portions 102 in recess 96 of fig3 c . plenum 106 a is in fluid communication with a straight portion 76 a of inlet conduit 76 . plenum 106 b is in fluid communication with a straight portion 77 a of outlet conduit 77 . the selection of conduit 76 for inlet , and conduit 77 for outlet , is somewhat arbitrary , and should not be considered as limiting the present invention . fig3 e is a hypothetical three - dimensional view of the system ( 100 ) of conduits , plenums , and grooves of fig3 c and 3d , with surrounding parts of the base and cooling - unit removed to reveal details of the system . here it can be seen that the engagement of block 104 ( in the base ) of fig3 d with the recess ( in the cooling - unit ) of fig3 c , when the base and cooling - unit are assembled together , causes the grooves to become macro - channels ( macro - conduits ) 102 , which link inlet and outlet plenums 106 a and 106 b , respectively , and corresponding inlet and outlet conduits 76 and 77 respectively . flow though the macro - channels is as indicated . the present invention is described above in terms of two embodiments . in one aspect of the invention a heat - sink includes a single - piece copper cooling - unit , and a single - piece base - unit , which , when assembled together , form macro - channels in the cooling - unit through which water can be circulated . the term “ macro - channel ” as used herein implies that the channel preferably has a minimum dimension not less than about 0 . 2 mm . one embodiment of the inventive heat - sink is configured for mounting a fast - axis stack of diode - laser bars . the other is configured for mounting a single diode - laser bar , however , a slow - axis ( horizontal ) array of bars could utilize a plurality of these heat - sinks on a common platform . in either embodiment , the two - piece construction allows corrosion - resistant plating of the copper portions of the macro - channels before the heat - sink is assembled . in another aspect of the invention , a diode - bar is solder - bonded between an overlapping region of two metallized , ceramic sub - mounts before being mounted on the cooling - unit of the heat - sink . each of the ceramic sub - mounts is in thermal communication with the cooling - unit for cooling the diode - laser bar . electrical connection is made to non - overlapping portions of the metallized ceramic sub - mounts for making electrical connection to the diode - laser bar . this arrangement has an advantage that the diode - laser bar , and electrical connections thereto , are electrically isolated from the cooling - unit and the cooling - water therein , for resisting corrosion of macro - channels in the cooling - unit by the water . the arrangement also has an advantage that stresses induced in the diode - laser bar due to cte mismatch between the material of the diode - laser bar and the ceramic are balanced out , minimizing slow - axis misalignment of emitters in the diode - laser bar and providing for increased reliability under temperature cycling . this latter advantage can be enjoyed even with heat - sink arrangements that are not water - cooled , i . e ., passively or conductively cooled . the present invention is not limited to the above - described embodiments . rather the invention is limited only by the claims appended hereto .