fig3 is a plan view showing an outline of the magnetic head slider of the present invention . fig4 is a plan view of the microactuator of the magnetic head slider . fig5 is an enlarged cross - sectional view taken on line b — b in fig4 wherein a lead wire portion drawn out from the head element is also shown in fig5 . as shown in fig5 the entire magnetic head slider 10 is composed in such a manner that a plated layer of ni , which is a slider body layer 42 , is provided on a layer of sio 2 which is a flying layer 41 . as shown in fig4 the electrostatic microactuator 20 is fixed onto a substrate , not shown , when the stationary section 31 , the outer frame of which is formed by plating of ni , is fixed to the substrate . on the inner wall of the stationary section 31 , there are provided teeth 31 a , which are arranged toward the inner circumference in parallel to each other at regular intervals , wherein these teeth 31 a are formed by means of plating of ni simultaneously with the formation of the stationary section 31 . these teeth 31 a may be fixed onto the substrate or arranged such that a gap ( not shown in the drawings ) is left between the teeth and the substrate . a central portion located inside the frame of the stationary section 31 is the movable section 32 which is formed by means of plating of ni simultaneously with the formation of the stationary section 31 . the movable section 32 is arranged so that it can be relatively moved with respect to the stationary section 31 when a gap ( not shown ) is left between the movable section 32 and the substrate . in the movable section 32 , there are provided a plurality of teeth 32 a at positions shifted from the centers of the teeth 31 a , which are arranged in parallel to each other in the stationary section 31 , and these teeth 32 a are arranged in parallel to the teeth 31 a . in the drawing , at an upper portion and a lower portion of the movable section 32 , there are provided supports 33 fixed to the substrate , and also there are provided support springs 34 , by which the movable section 32 can be moved in the upward and downward direction in the drawing and also in the direction perpendicular to the surface of the drawing , between the supports 33 and the movable section 32 . a head element ( not shown ) formed in the movable section 32 can be moved in the tracking direction , which is the upward and the downward direction in the drawing , and in the loading and unloading direction , which is a direction perpendicular to the drawing , by the action of the substantially c - shaped support springs 34 arranged at the four corners of the movable section 32 . in the drawing , lead wires 35 , 36 to be connected to terminals , not shown in the drawings , are formed by means of plating of ni at the right lower portion of the stationary section 31 and at the support on the lower side . when voltage is impressed between the two lead wires 35 , 36 , an electrostatic attraction force generated between the teeth 31 a of the stationary section 31 and the teeth 32 a of the movable section 32 . the movable section 32 is attracted upward by this electrostatic attraction force and is moved to a position at which the electrostatic attraction force is balanced with a restoring force of the support spring 34 . in order to prevent the occurrence of a short circuit of the teeth 31 a of the stationary section 31 with the teeth 32 a of the movable section 32 when an excessively high voltage input is given , a stopper is arranged in a portion of the support 33 by reducing a gap between the support 33 and the movable section 32 . a cross section of the support spring 34 is determined as follows . for example , the width is 5 μm , the heigth is 5 μm , and the length is 100 μm . as shown in fig3 there are provided bent lead wires 22 at the four corners of the movable section 32 . only two bent lead wires 22 are arranged on the lower side shown in fig4 . the shape of the flexible lead wire 22 is formed in such a manner that two u - shape are connected with each other in a space between the movable section 32 and the stationary section 31 . therefore , the rigidity in the upward and the downward direction in the drawings is low , and also the rigidity in the direction perpendicular to the surface of the drawing is low . the flexible lead wires 22 electrically connect the head element 43 ( shown in fig5 ), which is arranged on the movable section 32 , with the terminals 18 ( shown in fig3 ), which are arranged on the slider body . as shown in fig5 the electrostatic microactuator 20 is composed of a plated layer of ni which is thinner than the slider body 42 including the support spring 34 ( not shown in fig5 ). fig6 is a cross - sectional view of the flexible lead wire 22 . as shown in the drawing , the flexible lead wire 22 is composed in such a manner that the conductor layer 23 is sandwiched between the upper flexible insulating layer 24 and the lower flexible insulating layer 25 . the thickness of the flexible lead wire 22 is sufficiently thinner than that of the support spring 34 that supports the movable section 32 so that the motion of the movable section 32 cannot be affected by the rigidity of the flexible lead wire 22 itself . for example , the thickness of the flexible lead wire 22 is determined to be 0 . 1 μm . the width is not more than that of the support spring 34 , for example , the width of which is 2 μm . therefore , even the total rigidity of the four flexible lead wires 22 is sufficiently lower than the rigidity of support spring 34 . accordingly , motion of the movable section 32 is not obstructed by the flexible lead wires 33 . since the flexible lead wire 22 is covered with the insulating layers 24 , 25 from the upper and the lower sides , it is possible to arrange the flexible lead wire 22 to come into contact with the movable section 32 and the stationary section 31 . in the case of an inductive head , the head element 43 mounted on the movable section 32 has two terminals . when mr head is used for reading , two terminals ( not shown ) are further added . these terminals are connected to the terminal section 18 via the flexible lead wire 22 . due to the above arrangement , it is possible to draw out the lead such as signal wires from the head element 43 arranged in the movable section 32 . next , referring to fig7 to 16 , a formation process of the magnetic head slider 10 of the present invention , especially , a formation process of its eletrostatic microactuator 29 , will be explained below . ( 1 ) a sacrifice layer ( al layer ) 51 is formed on the overall surface of the glass substrate 50 . this sacrifice layer is provided for separating the slider 10 from the substrate 50 by etching . next , a head element 43 composed of a magnetic film is formed at a predetermined position on the sacrifice layer 51 as shown in fig7 . ( 2 ) a flying surface layer ( sio 2 ) 41 is formed in all regions on the sacrifice layer 51 except for the position at which the head element 43 is formed and also except for the periphery of the head element 43 . further , a second sacrifice layer ( al ) 51 a is formed in a region , in which the electrostatic microactuator 20 is formed , in the periphery of the head element 43 on the surface of the flying surface layer ( sio 2 ) as shown in fig8 . ( 3 ) flying surface layers ( sio 2 ) 41 a , 41 b are respectively formed in a region including the head element 43 in which the movable section 32 of the electrostatic microactuator 20 is formed and also in a region in which the stationary section 31 of the electrostatic microactuator 20 is formed , and these flying surface layers 41 a , 41 b are made thick so that the same thickness can be provided as shown in fig9 . ( 4 ) a conductor layer 53 made of au is formed on the flying surface layer ( sio 2 ) 41 b on which the movable section 32 is formed , and one end of this conductor layer 53 is connected to the head element 43 , and the other end is exposed onto an upper surface of the flying surface layer ( sio 2 ) 41 b which is the movable section 32 as shown in fig1 . ( 5 ) further , a third sacrifice layer ( al ) 51 b is formed on the second sacrifice layer ( al ) 51 a in a recessed portion between the flying surface layer ( sio 2 ) 41 b , which forms the movable section 32 , and the flying surface layer ( sio 2 ) 41 a , which forms the stationary section 31 . the thickness of this sacrifice layer 51 b is increased so that the height of an upper surface of the sacrifice layer 51 b can be the same as the height of the flying surface layers 41 a , 41 b as shown in fig1 . ( 6 ) a flexible conductor layer 22 shown in fig6 is formed . as shown in fig1 and 13 , a lower flexible insulating layer 25 made of polyimide or photoresist is formed into a bent pattern as shown in fig3 and 4 . in this case , a connecting section of the movable conductor layer 22 with the conductor layer 53 of the head element 43 and a connecting section of the movable conductor layer 22 with the terminal 18 on the slider body side are opened by ion milling for the connection with a conductor 23 . next , the conductor 23 is formed on the lower flexible insulating layer 25 . one end of the conductor 23 is electrically connected to the conductor layer 53 of the head element 43 , and the other end is electrically connected to the terminal 18 on the slider body side . next , an upper flexible insulating layer 24 made of polyimide or photoresist is formed on the conductor 23 . in this way , a flexible conductor layer 22 is formed in which the conductor 23 is covered with the flexible insulating layers 24 , 25 being sandwiched as shown in fig1 . in this connection , fig1 is an enlarged view showing a portion c in fig1 . ( 7 ) a plated base ( ni ) 54 is formed on the overall upper surface as shown in fig1 . ( 8 ) further , plating of ni is conducted via the plated base ( ni ) 54 , so that the thickness of the movable section 32 provided with the head element 43 ( ni - plating ) and the thickness of the stationary section 31 in the periphery can be a predetermined value . further , the thickness of the head slider body 42 in the periphery is further increased . in this connection , the teeth 31 a of the stationary section 31 and the teeth 32 a of the movable section 32 of the electrostatic microactuator 20 shown in fig4 are also formed in this process of plating of ni as shown in fig1 . ( 9 ) when the sacrifice layers 51 , 51 a , 51 b are removed by etching in , for example , a solution of koh , the magnetic head slider 10 is separated from the substrate 50 , and the magnetic head slider 10 ( electrostatic microactuator 20 ) of the present invention is completed as shown in fig1 . by the action of the flexible insulating layer 24 , the flexible lead wire 22 is supported in the air between the movable section 32 and the stationary section 31 . next , the operation of the magnetic head slider of the present invention will be explained below . when the movable section 32 of the electrostatic actuator 20 is loaded and unloaded by the magnetic head slider 10 , the head element 43 is made to come close to or contact a recording medium . on the other hand , when the electrostatic actuator 40 a is driven into the tracking direction , the head element 43 can be positioned at a predetermined track position so as to record and reproduce information . fig1 and 18 are views showing another embodiment of the formation process of the magnetic head slider 10 of the present invention , especially the formation process of the electrostatic microactuator 20 . in the formation process of the above embodiment , the third sacrifice layer ( al ) 51 b is formed and the thickness of the sacrifice layer 51 b is made to be the same as the thickness of the flying surface layers 41 a , 41 b in the process shown in fig1 . however , in this embodiment , instead of forming the third sacrifice layer ( al ) 51 b , in the formation process of forming the flying surface layers 41 a , 41 b in fig9 a step portion between the movable section 32 and the stationary section 31 is formed tapered so that the tapered shapes 41 a ′, 41 b ′ can be formed as shown in fig1 . the flexible conductor layer 22 is formed along these tapered portions 41 a ′, 41 b ′ as shown in fig1 . the flexible conductor layer 22 itself is formed by the same method as that of the above embodiment . in this case , the flexible lead wires 22 are formed along the tapered portions 41 a ′, 41 b ′ on the flying surface layer 41 a , 41 b . as explained above , according to the arrangement of the magnetic head slider of the present invention , the lead wires ( flexible lead wires 22 ) such as signal wires drawn out from the head element provided in the movable section of the electrostatic microactuator can be formed in the wafer process in the formation of the magnetic head slider .