reference will now be made in detail to the preferred embodiments of the present invention , examples of which are illustrated in the accompanying drawings , wherein like reference numerals refer to like elements throughout . explanations of the following embodiments of a vibration actuator are provided by way of example to an ultrasonic actuator that uses an ultrasonic vibration range . the configuration of an ultrasonic vibration actuator is disclosed , for example , in the above &# 34 ; 222 piezoelectric linear , flat plate motors for application to driving a light pick - up element &# 34 ;, 5th symposium on dynamics related to electromagnetic force , collected papers , and japanese laid - open patent publication no . 7 - 143770 . fig1 a - 1c illustrate biquadratic vibration on an elastic member 11 and piezoelectric member 12 according to a preferred embodiment of the present invention . piezoelectric member 12 is an electro - mechanical converting element . as illustrated , vibration actuator 10 is a ultrasonic actuator using degenerate vibration modes of different form , wherein linear , longitudinal , a biquadratic , and bending vibrations harmoniously occur on elastic member 11 . vibration actuator 10 includes elastic member 11 , which is formed in a rectangular , flat plate configuration using an elastic material such as metal or plastic . piezoelectric member 12 is adhered to flat plane 11a of elastic member 11 using , for example , an adhesive . piezoelectric member 12 is preferably made of lead zirconate titanate (&# 34 ; pzt &# 34 ;) and is formed in a thin , rectangular , plate - like configuration . two anti - node locations 11c and 11d , among six locations for the anti - nodes of generated biquadratic bending vibrations , and located on a second flat plane 11b of elastic member 11 , function as driving force output members to transfer a driving force to a relative moving member ( not shown ) in compressive contact therewith . as illustrated in fig1 b and 1c , independent , rectangular electrodes 13a , 13b , 13c , and 13d are preferably formed through a screen printing process onto a surface of piezoelectric member 12 . an a / c voltage &# 34 ; x &# 34 ; is applied to electrodes 13a and 13c . furthermore , an a / c voltage &# 34 ; y &# 34 ; having a phase approximately π / 2 different from a / c voltage x is applied to electrodes 13b and 13d . it is also acceptable to provide electrodes 13a , 13b , 13c , and 13d as separate members which are affixed to piezoelectric member 12 with an adhesive , instead of the screen printing process . moreover , according to another embodiment of the present invention , the phase difference between the a / c voltage x and the a / c voltage y is not limited to π / 2 . piezoelectric member 12 excites elastic member 11 as a / c voltage x and a / c voltage y are applied to electrodes 13a and 13c , and electrodes 13b and 13d , respectively . subsequently , a biquadratic bending vibration is generated on elastic member 11 , as indicated by the illustrated vibration waveform in fig1 a . additionally , a linear , expansion and contraction vibration ( i . e . longitudinal vibration ) is generated on elastic member 11 with the nodes located in a central section in a length - wise direction along elastic member 11 . due to the generation of the above bending and longitudinal vibrations , an elliptical motion occurs on driving force output members 11c and 11d that are formed on the second flat plane 11b of elastic member 11 . lead wires ( not shown ), which are electrical energy delivery members , are soldered to solder locations a , b , c , and d of the surface of electrodes 13a - 13d . in this preferred embodiment , solder locations a - d are the centers of lead wire connecting sections 14a - 14d , which approximately correspond to the locations of nodes in the biquadratic bending vibration on elastic member 11 . by soldering the lead wires at solder locations a - d , a dampening of vibration caused through mounting of the lead wires can be minimized . solder locations a , b , c , and d may correspond to the locations of the nodes in the biquadratic bending vibration occurring on elastic member 11 instead of the central positions in lead wire connecting sections 14a - 14d . further , solder locations a , b , c , and d may be a place where the amplitude of the biquadratic bending vibration is within 1 / 20 of the maximum amplitude of the biquadratic bending vibration occurring on elastic member 11 . fig2 a , 2b , and 2c are elevated top views depicting an example for lead wire connecting sections 14a - 14d where the lead wires are attached to electrodes 13a - 13d on vibration actuator 10 . as the shapes of the lead wire connecting sections 14a - 14d are identical in this preferred embodiment , an explanation is provided by referring to lead wire connecting section 14a at location a on electrode 13a as an example . as particularly illustrated in fig2 a - 2c , lead wire connecting section 14a is formed in a round shape . soldering is performed while maintaining an end of the lead wire in contact with lead wire connecting section 14a . as a result , the soldering position does not shift during connection , thereby enabling the precise execution of soldering at a designated location . a thermal energy non - conductive section 15a is preferably formed around each lead wire connecting section 14a . thermal energy non - conductive section 15a is formed , for example , as an opening created by the above screen printing process . lead wire connecting section 14a is connected to electrode 13a by electrically conductive section 16a that is formed radially about lead wire connecting section 14a . thermal energy non - conductive section 15a may be formed by , for example , an etching process . fig2 a illustrates an example having six electrically conductive sections 16a , as well as six thermal energy non - conductive sections 15a partitioned by the electrically conductive sections 16a . fig2 b illustrates an example having three electrically conductive sections 16a , as well as three thermal energy non - conductive sections 15a partitioned by the respective electrically conductive sections 16a . fig2 c illustrates an example of three electrically conductive sections 16a , as well as three thermal energy non - conductive sections 15a and lead wire connecting section 14a , all formed near the edge of electrode 13a . as illustrated , an electrical energy supply portion is a connecting section where electrical energy flows in the electrodes . according to the above configurations , it is possible to substantially control the conduction of thermal energy applied between thermal energy non - conductive sections 15a and electrode 13a during the soldering process . additionally , as lead wire connecting section 14a has a small configuration , the heat capacity of this connecting section is low . when a lead wire is connected to lead wire connecting section 14a , the lead wire connecting section 14a ( itself having a low heat capacity ) is heated . a corresponding temperature of the lead wire connecting section 14a increases to the soldering temperature in a short period of time . this is due to the quantity of heat received during the soldering process . moreover , as the thermal energy non - conductive section 15a is provided around lead wire connecting section 14a , only the quantity of heat transferred through the electrically conductive section 16a is provided to electrode 13a . of course , electrode 13a itself does not require independent heating . consequently , the temperature increase at electrode 13a is substantially restricted and deterioration of piezoelectric member 12 is prevented . in lieu of the provision of thermal energy non - conductive section 15a , another preferred embodiment provides a section having a lower conductivity rate of thermal energy than electrically conductive section 16a . in this case , it is also possible to control an amount of temperature increase at electrode 13a . the temperature of lead wire connecting section 14a easily and assuredly increases to the specified soldering temperature during soldering . therefore , the soldering process is assuredly executed , thereby solving the problem of soldering failure . as a result , it is possible to control a decrease in the driving efficiency of the vibration actuator 10 caused by the soldering process . fig3 is an elevated perspective view of vibration actuator 10 including a grounded elastic member 11 . fig4 a is a cross sectional view of a grounding area of elastic member 11 according to a preferred embodiment of the present invention . fig4 b is a cross sectional view of a grounding area of elastic member 11 according to another preferred embodiment of the present invention . in fig4 a and 4b , electrodes 13a - 13d are not shown . in the subsequent figures lead wire connecting sections 14a - 14c are not shown in order to simplify the explanation of the configuration . as illustrated in fig3 and fig4 a , penetrating hole 11e is formed through a central section of elastic member 11 in a thickness direction . ground pin 17 is inserted into penetrating hole 11e . at this point , it is also acceptable to fasten ground pin 17 by placing a tap at penetrating hole 11e and providing a threaded section in a lower part of ground pin 17 for insertion . penetrating hole 17a is provided about a head of ground pin 17 in order to connect a grounding lead wire . instead of providing a separate penetrating hole 17a , the grounding lead wire may be directly connected on the surface of the head of ground pin 17 . as illustrated in fig3 a pair of semi - circle shaped concave sections are created at the edges of electrodes 13b and 13c about ground pin 17 . in addition , as illustrated in fig3 a and 4b , an opening 18 is maintained between piezoelectric member 12 and ground pin 17 . consequently , contact between piezoelectric member 12 and ground pin 17 is prevented and ground pin 17 is conductive only through elastic member 11 . with reference to fig4 b , it is also possible to use ground pin 17 - 1 in lieu of ground pin 17 . ground pin 17 - 1 is tapered in an area to be inserted into elastic member 11 in order to snugly fit with tapered penetrating hole 11e - 1 . as illustrated in fig3 a groove 11f is provided about a central section of a long side of elastic member 11 . a second groove 11g ( shown in fig6 ) is also provided about a central section of a second long side of elastic member 11 opposite to groove 11f . each of the grooves preferably has a semi - circle cross sectional shape passing through a thickness direction of elastic member 11 . fig5 is an elevated perspective view of a transfer device 20 including relative moving member 25 in cooperation with the vibration actuator 10 of fig3 and 4a . likewise , fig6 is a cross sectional view taken along line vi -- vi of fig5 . electrodes 13a - 13d are omitted in fig5 and 6 . with reference to fig6 the position of elastic member 11 is restricted from movement in a lateral direction by a support pin 24a inserted into groove 11f and a support pin 24b inserted into groove 11g . support pins 24a and 24b are supported by being fastened to the ceiling of frame 21 covering elastic member 11 . coil spring 22 is mounted as a press member inside penetrating hole 21a of frame 21 . screw 23 , which adjusts the spring force of coil spring 22 , is also fastened to frame 21 by way of insertion into screw portion 21b inside penetrating hole 21a . the spring force is regulated by adjusting the fastening location of screw 23 . coil spring 22 makes contact with the head formed on the upper portion of ground pin 17 . this head also functions as a spring washer for coil spring 22 , thereby contributing to a reduction of the numbers of parts . vibration actuator 10 is pressed against relative moving member 25 , which is a board - like member , by coil spring 22 . the bottom of relative moving member 25 is supported by transfer rollers 26 . subsequently during operation , relative moving member 25 is transferred in a longitudinal direction by vibration actuator 10 . pressure between vibration actuator 10 and relative moving member 25 may be regulated by screw 23 as set forth above . as illustrated , grounding lead wire 27 is mounted through penetrating hole 17a ( see fig4 a ) in ground pin 17 . in lieu of coil spring 22 , other spring members such as a board spring , or a plate spring , may be used according to additional preferred embodiments of the present invention . in the above preferred embodiments , a vibration actuator performs as an ultrasonic actuator while using an ultrasonic vibration range . however , the vibration actuator relating to the present invention is not limited to this style . it is equally applicable to vibration actuators using other vibration ranges . likewise , in the above preferred embodiments , a piezoelectric member is preferably used as an electro - mechanical converting element . however , the vibration actuator relating to the present invention is not limited to this style and other types of electro - mechanical converting elements which are capable of converting electrical energy into mechanical displacement may be used . for example , an electrostriction element or magnetostriction element may be used . moreover , with regard to the shape of lead wire connecting sections , various modifications may be adopted as long as a non - conductive section for the thermal energy is present . these modifications are also deemed to be included in the range of embodiments of the present invention . furthermore , as set forth above , preferred embodiments of a vibration actuator in the form of an ultrasonic actuator ( commonly referred to as an &# 34 ; l1b4 mode &# 34 ; vibration actuator ) that generates a linear , longitudinal vibration and a biquadratic bending vibration on an elastic member have been provided as examples . however , the vibration actuator of the present invention is not limited to this style . the novel features and advantages of the present invention are equally applicable to ultrasonic actuators that use other vibration modes . fig7 a is a schematic diagram illustrating a biquadratic bending vibration of an elastic member of fig7 b , according to a preferred embodiment of the present invention . fig7 b is an elevated side view of the elastic member according to a preferred embodiment of the present invention . fig7 c is an elevated top view of the elastic member of fig7 b . as illustrated , vibration actuator 30 , including piezoelectric member 32 , is mounted onto one plane of a rectangular , flat , plate - like , elastic member 31 . vibration generating electrodes 33a and 33b , as well as vibration detecting piezoelectric members 34a and 34b , are mounted at specified locations on the surface of piezoelectric member 32 . this type of vibration actuator 30 is known as an &# 34 ; l2b2 mode &# 34 ; that generates a linear , longitudinal vibration and secondary bending vibration on elastic member 31 . further , a detailed explanation is omitted regarding this type of vibration actuator 30 , as it is available through the above collected papers from &# 34 ; 5th symposium on dynamics related to electromagnetic force .&# 34 ; the novel concepts of the present invention may be applied to vibration actuators that gain their driving force through other modes . although a few preferred embodiments of the present invention have been shown and described , it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention , the scope of which is defined in the claims and their equivalents .