fig1 ( a ) illustrates one preferred embodiment of the presently invented process and apparatus for fabricating passive or active components onto a substrate surface to make a micro - electronic device , preferably on a point - by - point basis . the process begins with the creation of a computer - aided design ( cad in the form of a drawing , image , or geometry representation ) of the device using a computer 50 . this method further involves the operation of a system that includes computer software and control hardware , e . g ., motion controller / indexer / servo 54 . the system includes a support member 44 by which the device substrate 43 is supported while the device components are being deposited . the system also has an inkjet printhead - based dispensing head 38 for dispensing liquid droplets from a precursor fluid material 26 . this material includes a liquid ingredient that helps to make the material in a flowable state while still residing in a chamber 32 of the dispensing head 38 , which has a discharge orifice 41 . the inkjet printhead - based dispensing head 38 may be equipped with a piezoelectric actuator ( such as in a piezo - ceramic based inkjet printer ), thermal actuation element ( such as in a bubble jet based printer ), or an electromagnetic - driven coil and magnetic piston ( such as in a miniature solenoid valve ) as a control valve means for micro - dispensing . a fluid material delivery assembly 27 ( fig1 ( b )) supplies a precursor fluid material of constant but adjustable back pressure to a chamber inside the inkjet printhead ( e . g ., ink container in an ink cartridge of an office color printer ). the assembly 27 has optional heating elements 25 a , 25 b to help the fluid material in the reservoir 24 and chamber 32 maintain a desired constant temperature . this back pressure makes it possible for an inkjet printhead to eject droplets of highly viscous fluids . i a precursor fluid material is dispensed onto a surface of the device substrate 43 to form a desired pattern of the deposited material 42 . a material treatment means 80 is used to convert the precursor fluid material into the component of a desired material composition and cause the material to become sufficiently rigid , solid state , so that the material can support its own weight and , in a multiple - layer device , the weight of other layers subsequently added to this layer . this material treatment means 80 could include using ( 1 ) a ventilation fan , air blower or cooling device to cool down a hot melt material , ( 2 ) a vacuum pump or an air blower to facilitate vaporization of any volatile ingredient that makes up the fluent portion of the material ( e . g ., to vaporize water in a water soluble polymer ), ( 3 ) a heater , ultra - violet light , or other high - energy sources to chemically cure a hardenable resin , and combinations thereof . this treatment means could involve simply leaving the material dispensed onto the support member surface in the ambient temperature to naturally solidify or become rigid . in one preferred embodiment , these procedures are repeated to deposit a second ( and third , fourth , etc .) passive or active component of a device onto the same substrate surface to form a first layer of the device . once the first layer becomes sufficiently rigid , a second layer of fluid materials is dispensed and deposited onto the first layer and adhered thereto . once the second layer of material becomes sufficiently rigid , a third layer is deposited . these procedures are repeated until a multi - layer device is formed . the precursor fluid material in a chamber 32 is supplied , intermittently or continuously , from a material delivery assembly 27 containing a device such as a screw extruder , gear pump , metering pump , positive displacement valve , and air pump ( pneumatically operated pump ) to maintain a constant but adjustable pressure in the chamber 32 . shown in fig1 ( a ) and fig1 ( b ) is an example of such a delivery means which includes a gear pump 28 a , 28 b that is driven through a drive shaft by an electric motor ( not shown ). when driven in motion , the gear pump delivers a controlled rate of the precursor fluid material 26 from a material reservoir 24 through an outlet 30 into the chamber 32 . when the control valve means inside the inkjet printhead 38 is switched on ( e . g ., by sending a train of high - voltage pulses to the piezo - ceramic actuator element attached to the printhead body ), a desired amount of fluid material is discharged out of the orifice 41 in the form of minute droplets . these droplets are deposited onto a surface of the device substrate 43 disposed on a support member 44 . the flow direction of the precursor fluid material from the chamber 32 to the dispensing head is referred to as forward flow , designated by the letter f in fig2 and fig3 , when the control valve means ( e . g ., based on a piezo - ceramic actuator ) is switched on . if the control valve means is switched off , at least a portion of this fluid material in chamber 32 will flow through a channel 34 a , 34 b and an outlet 36 back into the reservoir 24 . the back flow direction is designated by a letter b in fig2 and fig3 . the back flow rate of the precursor fluid material is adjustable by a pressure - regulating means , such as a needle - like valve 46 that is inserted into the back - flow channel 34 a , 34 b to a desired position . the cross - section area of channel 34 a , 34 b through which the material can back flow is effectively adjusted by this position , which can be readily changed by using an actuator , e . g ., a linear motion device 53 powered by a stepper motor 52 . with a larger cross - section area ( the needle 46 being inserted into the channel 34 a , 34 b to a shallow position ) the material back - flow rate from 34 a to 34 b , and re - entering the reservoir , is higher . with the pumping of a given volume rate of fluid material into chamber 32 , this higher back - flow rate produces a lower cumulative pressure differential for the fluid material in chamber 32 . this pressure differential relative to the ambient pressure serves as the driving force for dispensing the fluid material through the head 38 when the control valve is open . with a given orifice size , a lower pressure differential leads to a lower flow rate and smaller droplet size of the fluid material discharged from the orifice . this feature of a smaller droplet size and a lower flow rate is desirable when a higher component accuracy is required . in contrast , if the cross - section area is smaller ( with the needle 46 being deep into the channel 34 a , 34 b , leaving behind a smaller gap ) the material back - flow rate from 34 a to 34 b , and re - entering the reservoir , is lower . this lower back - flow rate produces a higher cumulative pressure differential for the fluid material in chamber 32 . the driving force for dispensing the fluid material through the head 38 , when the control valve is open , is now higher , resulting in an increase in the droplet size and the fluid material flow rate through the orifice 41 . the component - depositing rate can be easily enhanced in this manner . it should be noted that such a pressure change can be readily changed instantaneously , on demand , at any time during the device - fabricating process without having to replace the orifice with a larger - diameter one . there is , therefore , no need to use more than one discharge orifice to deposit a component material with an improved rate . it may also be noted that a smaller droplet size ( lower pressure differential ) may be used when building the boundary areas ( e . g ., near a wall or a surface ) or where finer features are desired . the pressure can be instantaneously increased to enhance the volume flow rate when filling an internal space with the material . as opposed to prior - art direct write techniques where the component accuracy and component - depositing rate are mutually exclusive , the present invention provides an effective and convenient way to achieve both accuracy and fabrication rate with a non - complicated material dispensing system design . the present process includes operating a cad computer 50 for generating control signals in response to coordinates of the design of this object and operating the controller / indexer 54 for controlling the position of the dispensing head relative to the support member in response to the control signals . the movements of the dispensing head relative to the support member preferably are executed to move first in an x - y plane defined by a first ( x -) direction and a second ( y -) direction . during the steps of moving the dispensing head relative to the support member , the dispensing head 38 is also controlled to dispense the fluid material , continuously or intermittently , for depositing a portion of a component while the substrate is supported with the support member 44 . the procedures are repeated to complete the deposition of a component in a desired pattern and then , in a multi - component layer , the deposition of all other components in a layer . once a layer of the device is built , the head and the support member are moved away from each other by a predetermined thickness distance in a third direction ( or z - direction , orthogonal to both x - and y - directions ) to get ready for fabricating a second layer . these procedures are repeated for fabricating successive layers of a multiple - layer device . fig3 schematically shows another example of how the back - flow rate or the fluid material pressure in chamber 32 can be regulated . a spring 60 with a desired spring force is used to provide a counteracting pressure against the back flow pressure when the needle valve 46 is in a “ closed ” position . with continued pumping of the fluid material into chamber 32 , the pressure therein is cumulated until the resulting back - flow force exceeds the imposing spring force . at this moment , the needle valve is pushed open , allowing material back flow to occur . this constant pressure can be readily adjusted by adjusting the spring force , for instance , through compressing the spring 60 to a different extent . fig4 schematically shows another fluid material delivery assembly in which the dispensing pressure can be maintained constant and can be readily changed . a compressed air source 70 supplies pressurized air through an adjustable valve 66 into the upper portion of a sealed container 62 . the lower portion of this container 62 is a reservoir 63 , which supplies a fluid material to a chamber 65 . a safety valve 68 is installed in the pipe line for releasing the pressure when needed . the precursor fluid material may be replenished into the reservoir through a feed - through access 64 when needed . optional heating elements may be provided to maintain the material in the reservoir in a fluid state of a proper viscosity valve . when the pressure - regulating valve 66 is switched open , the fluid material is under a constant pressure . when the control valve in the inkjet printhead 38 is turned on , a constant flow of droplets is discharged through an orifice 41 . a needle - valve 46 and a back - flow channel 67 are used to readily adjust the back pressure in chamber 65 any time before , during or after the liquid dispensing step . again , with a lower air pressure , the flow rate is smaller with smaller - sized liquid droplets coming out of the orifice , resulting in a higher part accuracy . if the air pressure is increased on demand , a higher flow rate leads to a greater over - all component - depositing rate . in another preferred embodiment , at least another dispensing head may be installed for dispensing a different fluid material . this second head may be of the same type as or different from the first head . such a second head ( or a plurality of heads ) may be desirable when an operator chooses to use different materials to fabricate different components or to combine different materials to produce a component of a device . a dispensing head of multiple orifices may also be used in practicing the present invention . the substrate may be selected from the group of flexible materials consisting of a plastic , elastomer , fabric , paper , composite , and combinations or mixtures thereof . advantageously , the substrate may be prepared in a roll form . the invented process further includes the steps of continuously or intermittently moving a substrate from a roll of substrate supply disposed at one side of the support member into a fabrication zone above the support member and then out of the fabrication zone upon deposition of the component ( s ). preferably , the process further includes a step of collecting the substrate at another side of the support member to complete a roll - to - roll fabrication process . another preferred embodiment of the present invention is an inkjet printhead - based fluid dispensing apparatus which includes ( a ) a fluid material reservoir ; ( b ) an inkjet printhead body comprising therein a chamber having a first end in flow communication with the reservoir and l l receiving a fluid material therefrom and on a second end a discharge orifice for ejecting droplets of a fluid material therethrough ; ( c ) a valve means in control relation to the discharge orifice ; and ( d ) a back - flow channel having one end in flow communication with the chamber and another end in flow communication with the reservoir . the printhead body may comprise a solenoid valve body and the valve means comprises an electromagnetic valve . the printhead body may contain a conventional office inkjet printhead with the valve means comprising either a piezo - electric actuator or a thermal actuation element . the back - flow channel may be controlled by a flow - rate regulator means , such as a needle valve . still another preferred embodiment of the present invention is a direct write apparatus for fabricating a desired active or passive component onto a substrate surface of a microelectronic device according to a computer - aided design ( cad ). the apparatus comprises : ( a ) a support member for supporting thereon the device substrate ; ( b ) a fluid material delivery assembly comprising a chamber at a distance from the support member for containing a precursor fluid material under a substantially constant but adjustable pressure differential relative to the ambient pressure ; ( c ) an inkjet - based dispensing head in flow communication with the chamber , where the head comprises on one end at least a discharge orifice of a predetermined size and a valve means in control relation to the at least a discharge orifice for dispensing droplets of the precursor fluid material through the orifice onto the substrate surface ; and ( d ) machine control means in electronic communication with a computer and in control relation to both the support member and the dispensing head for generating control signals in response to coordinates of the design of the device and for controlling the position of the dispensing head relative to the support member in response to the control signals to control dispensing of the precursor fluid material for fabricating the component . preferably , the fluid material delivery assembly further comprises : ( i ) a fluid material reservoir containing therein a desired amount of the precursor fluid material , ( ii ) a pump means to deliver the precursor fluid material from the reservoir to the chamber ; ( iii ) a back flow channel having a first end in flow communication with the chamber and a second end in flow communication with the reservoir ; and ( iv ) a flow - regulating means in control relation to the channel to adjust the material back - flow rate through the channel for maintaining a desired fluid material pressure inside the chamber . the process involves intermittently or continuously dispensing droplets of a precursor fluid material through an orifice of a dispensing head to deposit onto a substrate surface on a support member . during this dispensing procedure , the support member and the dispensing head are moved ( preferably under the control of a computer and a controller / indexer ) with respect to each other along selected directions in a predetermined pattern on an x - y plane defined by first ( x -) and second ( y -) directions and along the z - direction perpendicular to the x - y plane . the three mutually orthogonal x -, y - and z - directions form a cartesian coordinate system . these relative movements are effected so that the fluid material can be deposited essentially point by point and layer by layer to build a multiple - layer device according to a computer - aided design ( cad ) drawing of a device . in one preferred embodiment , an optional heating provision ( e . g ., heating elements ) is attached to , or contained in , the dispensing head to control the physical and chemical state of the material ; e . g ., to help maintain it in a fluent state . a temperature sensing means ( e . g . a thermocouple ) and a temperature controller can be employed to regulate the temperature of the nozzle . heating , cooling , or energy means ( uv , ir , electron beam , laser beam , ion beam , x - ray , gamma - ray , etc .) may be used to induce physical changes ( e . g ., vaporization or solidification ) or chemical reactions ( e . g ., curing , polymerization , hardening , etc .). heating , cooling , and energy means are well known in the art . referring again to fig1 , the support member 44 is located in close , working proximity to , but at a predetermined initial distance from , the dispensing head 38 . the support member and the dispensing head are equipped with mechanical drive means for moving the support member relative to the movable dispensing head in three dimensions along “ x ,” “ y ,” and “ z ” axes in a predetermined sequence and pattern , and for displacing the nozzle a predetermined incremental distance relative to the support member . this can be accomplished , for instance , by allowing the support member and the dispensing head to be driven by three linear motion devices powered by three separate stepper motors . linear motion devices or x - y - z gantry tables are well known in the art . a preferred embodiment of the present invention is a direct write process in which the execution of various steps is controlled by a cad computer . the device fabrication process begins with the creation of a mathematical design or model ( e . g ., via computer - aided design , cad ), which is a data representation of a device . this model is stored as a set of numerical representations of layers which , together , represent the whole device . a series of data packages , with each data package containing information ( segments or data points ) related to the physical dimensions , shape and material composition of an individual component in a layer , is stored in the memory of a computer in a logical sequence . the three - dimensional motion controller is electronically linked to the mechanical drive means and is operative to actuate the mechanical drive means ( e . g ., those comprising stepper motors ) in response to “ x ”, “ y ”, “ z ” axis drive signals for each layer received from the cad computer . controllers that are capable of driving linear motion devices are commonplace . examples include those commonly used in a milling machine . by slicing through a cad model of a device , one can obtain coordinate points that define the boundaries of each cross section . it is therefore convenient for a dispensing head to follow these coordinate points to trace out the perimeters of a component in a layer or the peripheral contour lines in a layer cross section . these perimeters may be built with high accuracy by setting the material chamber pressure at a relatively low value to ensure smaller - size droplets of material being discharged out of the orifice at a lower volume flow rate . these considerations have led to the development of another embodiment of the present invention . this is a process as set forth in the above - cited process , wherein the moving step includes the step of moving the dispensing head and the support member relative to one another in a direction parallel to the x - y plane according to a first predetermined pattern to form an outer boundary of one selected material composition or a distribution pattern of different material compositions onto the support member . the outer boundary defines an exterior surface of the object . another embodiment of the present invention includes a process as set forth in the above paragraph , wherein the outer boundary defines an interior space of a component in the device , and the moving step further includes the step of moving the dispensing head and the support member relative to one another in one direction parallel to the x - y plane according to at least one other predetermined pattern to partially or completely fill this interior space with a selected material composition at a higher chamber pressure for an improved component - depositing speed . the interior space does not have to have the same material composition as the exterior boundary . this process may further comprise the steps of ( 1 ) creating a geometry of the device on a computer with the geometry including a plurality of segments or data points defining the device and material compositions to be used ; and ( 2 ) generating program signals corresponding to each of these segments or data points in a predetermined sequence , wherein the program signals determine the movement of the dispensing head and the support member relative to one another in the first predetermined pattern and at least one other predetermined pattern . the precursor fluid material can be selected from a wide variety of material compositions , including organic , polymeric , metallic , ceramic , carbonaceous , glass , organo - metallic , and combinations thereof . the fluid material may be in a hot melt ( e . g ., thermoplastic ), a liquid containing a liquid soluble second component ( e . g ., a water - soluble polymer dissolved in water or a mixture or water and alcohol ), or a liquid containing a non - soluble second component ( e . g ., ceramic powder dispersed in a polymer melt ). the fluid material may contain a thermosetting resin that , once dispensed and deposited , can be cured by using a heat source , an ultra violet light , and / or other high energy source . thermoplastic and lower - melting metallic melts are particularly easy to handle . they can be readily heated to become a melt and cooled to rapidly solidify . in the case of polymer - containing solution , a portion of the volatile liquid component ( e . g ., water and / or alcohol ) may be removed after the fluent material is dispensed onto the substrate . the fluid material does not have to be a hot melt . it may be composed of a liquid ingredient , a primary component - building material , and other optional additives or co - reactants . the material may contain a primary component - building material that is soluble in a volatile liquid ingredient : e . g ., a polymer soluble in a solvent . the solvent will keep the material composition in a fluid state inside the chamber of the dispensing head . part of this solvent can be rapidly removed after the material is discharged out of the orifice . removal of this solvent can be facilitated by subjecting the device fabrication zone to a ventilation treatment ( e . g ., using a ventilation fan to blow the solvent off or a vacuum pump to pump out the solvent ). when a certain amount of the solvent is removed , polymer molecules are precipitated out to form a cohesive phase , making the material composition thick and consistent ( with a sufficiently high viscosity to become rigid ). the material may contain a primary device component - building material in the form of discrete particles that can be dispersed , but not dissolved in the volatile liquid ingredient : e . g ., conductive graphite powder dispersed in acetone . the solvent , acetone , will keep the material composition in a fluent state inside the chamber of a dispensing head . part of this solvent can be rapidly removed after the material composition is discharged out of the orifice . when a majority of the solvent is removed , the particles make the material composition thick and consistent ( with a sufficiently high viscosity to become rigid ). in these materials , the volatile ingredient is preferably a fast vaporizing liquid such as ethanol , methanol , and acetone ; a non - toxic material ( e . g ., alcohol ) having a high vapor pressure at room temperature is most desirable . the substrate surface can be any material , planar or non - planar onto which one may wish to deposit liquid droplets . the device substrate may be any solid material including , but not limited to , silicon , glass , plastics , fabric , cloth , paper , metals , and ceramics . the present invention is particularly useful in creating electronic devices such as passive and active components of printed circuit boards ( pcbs ) or in creating chemo - selective coatings for chemical sensors such as surface acoustic wave ( saw ) resonators . specific to various applications , the material for direct write manufacturing of a device can be any material that one may wish to deposit on a substrate in a defined pattern , including , but not limited to the following : ( a ) metals , including , but not limited to silver , nickel , gold , copper , chromium , titanium , aluminum , platinum , palladium , etc ., and alloys thereof . these materials are particularly useful for interconnects or conductor elements ; ( b ) ceramics , including , but not limited to alumina ( al 2 o 3 ), silica and other glasses , which are good for insulator elements ; ( c ) dielectrics , including , but not limited to alumina , magnesium oxide ( mgo ), yttrium oxide ( y 2 o 3 ), zirconium oxide ( zro 2 ), cerium oxide ( ceo 2 ), etc ., which are good for insulator or capacitor elements ; ( d ) ferroelectrics , including , but not limited to barium titanate ( batio 3 ), strontium titanate ( srtio 3 ), lead titanate ( pbtio 3 ), lead zirconate ( pbzro 3 ), potassium niobate ( knbo 3 ), strontium bismuth tantalate ( srbi 2 ta 2 o 9 ), ( ba , sr ) tio 3 , and solid solution stoichiometric variations thereof , etc ., which are useful for sensor and capacitor elements ; ( e ) piezoelectrics , including , but not limited to the above mentioned ferroelectrics , quartz , aln , etc ., which are useful for sensor and actuator applications ( e . g ., surface acoustic wave device ); ( f ) ferrites , including but not limited to yttrium iron garnet ( y 3 fe 5 o 12 ), barium zinc ferrite ( ba 2 zn 2 fe 12 o 19 ), hexagonal ferrites such as barium ferrite , spinel ferrites such as nickel zinc ferrites , manganese zinc ferrite , magnetite ( fe 3 o 4 ), etc ., which are useful for magnetic elements ; ( g ) electro - optical ceramics , including , but not limited to lithium niobate ( linbo 3 ), lithium tantalate ( litao 3 ), cadmiun telluride ( cdte ), zinc sulfide ( zns ), etc ., which are useful for electro - optic device elements such as light - emitting diodes and flat panel display substrates ; ( h ) ceramic superconductors , including , but not limited to yba 2 cu 3 o 7 - x ( ybco ), tl 2 caba 2 cu 3 o 12 , la 1 . 4 sr 0 . 6 cuo 3 , bisrcacuo , bakbio , halide doped fullerines , etc . ; ( i ) chalcogenides , including , but not limited to srs , zns , cas , pbs , etc ., which are useful as energy conversion elements such as solar cells ; ( j ) semiconductors , including , but not limited to si , ge , gaas , cdte , etc . ; ( k ) phosphors , including , but not limited to srs : eu , srs : ce , zns : ag , y 2 o 2 : eu , zn 2 sio 4 : mn , etc . and transparent conductive oxides , including , but not limited to indium tin oxide , zinc oxide , etc . ; ( l ) bio - and chemical sensing elements ; ( m ) electronic inks . in an electronic device , the materials to be deposited should have particular desired electronic properties . examples of electronic materials include metals , dielectrics , ferroelectrics , ferrites , ferrimagnets , ferromagnets , semiconductors , phosphors and electrically conducting organic polymers . in the fabrication of a component of a chemical or biological sensor , the materials to be deposited should be able to interact selectively with a particular chemical or biological analyte . it is well known in the art that the chemically selective material may be a polymer with hydrogen bond acidic properties , a polymer with hydrogen bond basic properties , a dipolar polymer , a polarizable polymer , or a non - polar polymer , depending on the characteristics of the analyte of interest . examples of chemo - sensing element materials include sxfa ( poly ( oxy { methyl [ 4 - hydroxy - 4 , 4 , bis ( trifluoromethyl ) but - 1 - en - 1 - yl ] silylene })), p4v ( poly ( 4 - vinylhexafluorocumyl alcohol ). other examples include perfluoro - polyethers terminated with a variety of functional groups such as cf 3 , ch 2 oh , polyethylene imines , polysiloxanes , alkylamino pyridyl substituted polysiloxanes , polytetrafluoroethylene , polysilanes , polyesters , polyvinylaldehydes , polyisobutylene , polyvinylesters , polyalkenes , zeolites , aerogels , porous carbon , metals , silicalites , clay materials , cellulose materials , polyanilines , polythiophenes , polypyrroles , fullerenes , cyclodextrins , cyclophanes , calixeranes , crown ethers , and organic dyes . examples of biochemical species that can be deposited with the present direct write technology include proteins , oligopeptides , polypeptides , whole cells , biological tissue , enzymes , cofactors , nucleic acids , dna , rna , antibodies ( intact primary , polyclonal , and monoclonal ), antigens , oligosaccharides , polysaccharides , oligonucleotides , lectins , biotin , streptavidin , and lipids . the substrate may be deposited with a component of a physical sensing device , such as a magnetic sensor , optical sensor , temperature sensor , pressure sensor or gas flow sensor element . the material to be deposited may then be an appropriate sensing material , such as a magnetic sensing material , optical sensing material , temperature sensing material , pressure sensing 16 material or gas flow sensing material . examples of physical sensing materials to be deposited include materials that make up individual layers of magnetic - nonmagnetic multi - layers or resonant magnetic oscillators for magnetic sensing , thin film thermocouples for temperature sensing , piezo - electric films or resonators for pressure sensing and simple resistive heater - thermocouple combinations for gas flow sensing .