in the following detailed description of the preferred embodiments , reference is made to the accompanying drawings which form a part hereof , and in which is shown by way of illustration specific preferred embodiments in which the invention may be practiced . these embodiments are described in sufficient detail to enable those skilled in the art to practice the invention , and it is to be understood that other embodiments may be utilized and that logical , mechanical and electrical changes may be made without departing from the spirit and scope of the present inventions . the following detailed description is , therefore , not to be taken in a limiting sense , and the scope of the present invention is defined only by the appended claims . [ 0015 ] fig1 shows an exploded perspective view of some embodiments of chip carrier system 100 which comprises two basic components , module 103 and socket 106 . fig1 also shows printed circuit board 109 on which chip carrier system 100 can be mounted . although chip carrier system 100 is capable of packaging and interconnecting a variety of integrated circuits , such as analog circuits , mixed signal application specific circuits , and digital circuits , it is particularly suited through its modular embodiment to applications involving the packaging of memory circuits . module 103 , in one embodiment , comprises substrate 112 , edges 114 , 115 , 116 , and 117 , chip 118 , and alignment feature 124 . chip 118 is mounted on substrate 112 . substrate 112 , in one embodiment , is made of a conducting material , such as copper , aluminum or gold , or an alloy of such a conducting material . one function of substrate 112 is to transfer heat away from chip 118 . fabricating substrate 112 from a material that is not a good conductor can lead to the catastrophic failure of chip 118 , if the material selected for substrate 112 fails to efficiently transfer heat away from chip 118 . chip 118 , in one embodiment , is mounted face down on substrate 112 , and is secured to substrate 112 using a heat conducting adhesive . the heat conducting adhesive provides a path for the heat generated by chip 118 to flow into substrate 112 . the rate at which heat is removed from chip 118 can be increased by directing air flow across the surface of substrate 112 . chip 118 includes coupling site 127 , which in one embodiment comprises contact pads 130 . contact pads 130 provide a direct connection to the circuits and devices on chip 118 . in an alternate embodiment , coupling site 127 comprises pins or other similar connectors , and these pins or other similar connectors are in turn coupled to contact pads 130 . edges 114 , 115 , 116 and 117 are preferably planar surfaces . a planar surface makes substrate 112 simple to manufacture , easy to grasp , and permits quick insertion of module 103 into socket 106 . alignment feature 124 is used to register module 103 with socket 106 . when module 103 is registered with socket 106 module coupling site 127 is aligned with socket coupling site 133 . alignment of module coupling site 127 with socket coupling site 133 permits communication between chip 118 and the circuits , chips or devices located on circuit board 109 or coupled to circuit board 109 . failure to align module coupling site 127 to socket coupling site 133 may result in the isolation of chip 118 from the circuits , chips or devices located on circuit board 109 . alignment feature 124 , in one embodiment , is a curved indentation or notch capable of interlocking with a half - cylinder , which is the corresponding alignment feature located on socket 106 . this configuration of alignment features permits the insertion of module 103 into socket 106 using a low or zero insertion force , yet restricts the motion of module 103 with respect to socket 106 in the non - lateral direction . restricting the motion of module 103 in the non - lateral direction ensures the continued alignment of coupling site 127 with socket coupling site 133 . socket 106 , in one embodiment , comprises edge 134 , surface 136 , alignment feature 139 , guide 142 , socket coupling site 133 , and retaining feature 147 . socket 106 is preferably an injection molded component made of nylon or any other suitable plastic material . alternatively , socket 106 can be machined from a single piece of plastic or other appropriate material . guide 142 is located along edge 134 of socket 106 . guide 142 , in one embodiment , has the shape of an el , as shown in fig1 and can be fabricated as an integrated component of socket 106 . el shaped guide 142 provides for quick , easy and accurate insertion of module 103 into guide 142 . once inserted into guide 142 , module 103 slides along the inside edge of guide 142 until it is seated in socket 106 . an advantage of this embodiment is that an untrained person can successfully insert module 103 into socket 106 without damaging components of either module 103 or socket 106 . alignment feature 139 interlocks with module alignment feature 124 . in one embodiment , alignment feature 139 has a smooth shape , such as the shape of a half cylinder as shown in fig1 . using a half cylinder shape , which lacks sharp corners , for alignment feature 139 makes the final alignment and interlocking of module 103 with socket 106 an easy operation to perform . module 103 slides easily into place once module alignment feature 124 engages socket alignment feature 139 , since there are no sharp corners to interfere with the interlocking of module alignment feature 124 with socket alignment feature 139 . the present invention is not limited to alignment feature 139 having a half cylinder shape . other shapes will also permit easy insertion of module 103 into socket 106 . socket alignment feature 139 is approximately centered along the longest dimension of surface 136 of socket 106 , and is preferably fabricated as an integrated component of socket 106 . centering socket alignment feature 139 makes the operation of inserting module 103 into socket 106 and interlocking module 103 with module 106 easier than if the socket alignment feature 139 is located off center . socket alignment feature 139 also serves to restrict the non - lateral motion of module 103 , which keeps module coupling site 127 aligned with socket coupling site 133 . retaining feature 147 restricts the lateral motion of module 103 . in one embodiment , retaining feature 147 is a lip located along an edge of surface 136 . restricting the lateral motion of module 103 forces module coupling site 127 to stay coupled to socket coupling site 133 . the location of retaining feature 147 and the amount to which the lateral motion of module 103 is restricted is determined by the characteristics of module coupling site 127 and socket coupling site 133 . if module coupling site 127 comprises pads on an integrated circuit chip , and coupling site 133 comprises contacts for those pads , then the proper amount of restriction is achieved by having retaining feature 147 located such that module 103 couples to socket 106 with an amount of force equivalent to a press fit . as with guide 142 , retaining feature 139 is preferably fabricated as an integrated component of socket 106 . printed circuit board 109 provides a platform for mounting socket 106 , and a platform on which other circuit modules , such as circuit module 150 , can be mounted and coupled to socket 106 . the present invention is not limited to a particular type of printed circuit board technology . socket 106 can be mounted on a single or multilayer board , and can be secured to the board using an adhesive . alternatively , socket 106 can be secured to the board using an epoxy . [ 0029 ] fig2 is a side view of some embodiments of an assembled chip carrier system 100 of the present invention . module 103 is assembled with socket 106 using a press fit , and the assembled chip carrier system 100 is mounted on printed circuit board 109 . in the embodiments shown , module 103 is interlocked with socket 106 at module alignment feature 124 and socket alignment feature 139 . the seating and retention of module 103 in socket 106 is best understood by describing the functioning of socket alignment feature 139 , module alignment feature 124 , retaining feature 147 , and guide 142 in the assembled chip carrier system 100 . socket alignment feature 139 and module alignment feature 124 restrict the non - lateral motion of module 103 once socket alignment feature 139 is interlocked with module alignment feature 124 . retaining feature 147 abuts module 103 , and ensures that socket coupling site 133 is in contact with module coupling site 127 by restricting the lateral motion of module 103 after module 103 is seated in socket 106 . guide 142 assists retaining feature 147 in keeping module coupling site 127 in contact with socket coupling site 133 by restricting the lateral motion of the top of module 103 . signals can flow from chip 118 mounted on substrate 103 to circuit module 150 mounted on printed circuit board 109 . the flow of signals between chip 118 and module 150 is best understood by following the conducting pattern from socket coupling site 133 to circuit module 150 . module coupling site 127 is in contact with socket coupling site 133 . conductor 152 couples socket coupling site 133 to socket board contact site 155 . a second conductor 158 couples circuit board contact site 155 to circuit module 150 . referring to fig3 a block diagram of a system level embodiment of the present invention is shown . system 300 comprises processor 305 and memory device 310 , which includes memory cells of one or more of the types described above in conjunction with fig1 - 2 . memory device 310 comprises memory array 315 , address circuitry 320 , and read circuitry 330 , and is coupled to processor 305 by address bus 335 , data bus 340 , and control bus 345 . processor 305 , through address bus 335 , data bus 340 , and control bus 345 communicates with memory device 310 . in a read operation initiated by processor 305 , address information , data information , and control information are provided to memory device 310 through busses 335 , 340 , and 345 . this information is decoded by addressing circuitry 320 , including a row decoder and a column decoder , and read circuitry 330 . successful completion of the read operation results in information from memory array 315 being communicated to processor 305 over data bus 340 . memory circuits or cells , when mounted in the chip carrier system of the present invention , become addressable as elements of memory array 315 in the system shown in fig3 . embodiments of an apparatus and method for packaging circuits has been described . a module and socket capable of being easily aligned , assembled and interlocked has been described . in an alternative embodiment , a substrate , a chip , and a socket also capable of being easily aligned , assembled and interlocked has been described . in addition , a method of aligning a module with the guide feature of a socket , sliding the module along the edge of the guide , and interlocking the module with the socket has been described . although specific embodiments have been illustrated and described herein , it will be appreciated by those of ordinary skill in the art that any arrangement which is calculated to achieve the same purpose may be substituted for the specific embodiment shown . this application is intended to cover any adaptations or variations of the present invention . therefore , it is manifestly intended that this invention be limited only by the claims and the equivalents thereof .