as shown in fig1 a , the current assembly technique requires an insulator ( 80 ) and pad stack ( 81 ) under the lga ( 30 ) contact pattern field that is between the system board ( 20 ) and the stiffener ( 10 ). the pcb board ( 20 ) in this example has a concave or dish shape ( 21 ) in the lga mounting area . this unevenness or dish shape ( 21 ) is created during the manufacture process of the board and it &# 39 ; s shape and size is partially due to the board &# 39 ; s power / signal cross section . the change in thickness is also dependent on the number of vias ( 25 ) and cross supports designed into the board . as can be seen in the detail fig1 c there is a stair case effect as the insulators are stack upon each other . as the density of the vias ( 25 ) increase , so will change the height of the gap . the solution to the previously described problem would be to replace the insulator ( 80 ) and pad stack ( 81 ) with a non - compressible gel package ( 60 ) as shown in fig1 b . this would then insulate the system board ( 20 ) from the stiffener ( 10 ) as well as to provide a mechanical supporting structure that conforms to all irregularities between the system board ( 20 ) and the stiffener ( 10 ). with the proposed solution , the gap ( 21 ) between the stiffener ( 10 ) and the system board ( 20 ) is filled with a self - conforming insulator structure ( 60 ) shown in fig2 that is shaped like a cushion . this cushion ( 60 ) comprises of two separate layers ( 64 , 65 ) of insulating material . in fig2 this insulating material is a material such as mylar or kapcon envelope is filled with non - compressible gel paste material such as a silicon gel , thermo - conducting paste , or epoxy resin like substance ( 63 ) that conforms to all the irregularities and applies equal contact pressure on the board surface after assembly . the gel or resin material ( 63 ) can in a preferred embodiment be comprised of a low temperature - curing epoxy so that it would harden when it is heated by the temperature rise of the board in the powered on system . at a later time , a new cushion ( 60 ) would be used if the board ( 20 ) were to be removed from the stiffener ( 10 ). the advantage of this embodiment , in it &# 39 ; s several alternative embodiments is to enhance the overall structure of the mcm - lga - system board - stiffener design such that there was an enhancement to the electrical properties of the interconnects , and an enhancement for the removal of heat generated under the mcm . the application will also reduce the costly sorting the pbc boards and at the same time , the costly machining of the mcm structures of the tolerances needed for assembly could be relaxed . thus the total cost for the completed system would be reduced . as will be seen in various embodiments of the non - compressible gel paste formulated for the purpose from non - compressible gel paste material such as a silicon gel , thermo - conducting paste , or epoxy resin like substance ( 63 ) that conforms to all the irregularities and applies equal contact pressure on the board surface after assembly , the gel paste ( could be a gel or pasty viscosity ) compensates for the irregular thickness changes due to the design of the system board . with the gel package we fill the resulting gap between the system board and its supporting mechanical stiffener with a package of non - compressible gel or suitable insulating substance . this insulator package consists of a lamination of two sheets of films to form the envelope , such as films of kapcon or mylar materials that encompasses and envelopes a non - compressible insulating substance such as the thermo paste . in the preferred embodiment this is held within a supporting frame . the resulting package is used between the system board and the supporting mechanical hardware presently known as a stiffener or mechanical stiffener . the advantage of this solution is the fact that all the gaps created by the design of the system board are filled independent of a fixed separation dimension or if there are multiple gaps of different sizes . as the preferred embodiment illustrated in fig2 shows , in order to compensate for the irregular thickness changes due to the design of the system board , we provide the package ( 60 ) which still comprises two laminates ( 64 , 65 ) that are supported and held together using a frame ( 66 ). between the two insulating layers there is a deposit of a non - compressible material ( 63 ) such as thermo paste or an uncured epoxy . the design of this fig2 package ( 60 ) can use the same design as that of the lga connector system shown in fig1 b and fig3 to help facilitate assembly with this embodiment &# 39 ; s application . the frame ( 66 ) ( one or two elements of the framework ) can have an squeeze zone within the weld area to provide a small relief area for the gel paste when compression occurs . this alternative is shown by the line in fig2 around the gel paste area of frame ( 66 ). the application is in support of but not limited to the presently described alternative embodiment . it is anticipated that also , as an example , it could be used as an insulating shock mount between dissimilar structures to compensate for mechanical movement and design mismatching . fig3 shows the exploded view of the complete structure of board ( 20 ), stiffener ( 10 ), mcm ( 40 ) and one example of the compliant gel package structure ( 60 ). for the design of the load - compensating gel package ( 60 ), attention must be given on how the excess volume of non - compressible material ( 63 ) is handled as well as providing structural integrity of the gel package ( 60 ). there are several methods that can be used . the first is as follows . referring to fig4 a , the construction of the package is such that the outer frame of the package is designed to be slightly less in height as the crown of the gel compensator . the frame design ( 50 ) is such that the thickness of the frame is equal on both sides of the gel package ( 60 ). when the gel compensator ( 60 ) is installed between the stiffener ( 10 ) and the system board ( 20 ) and is compressed by the combination of the mcm ( 40 ) and the lga ( 30 ), the excess gel will expand to the stop plates ( 52 ) on the outer frame ( 50 ). the over all design of this frame is such that a stand off of 0 . 008 inches is pre - determined . thus , the gel package with a total height of 0 . 010 inches at its center is used ; the elliptical shape of the package ( 61 ) seen in fig2 would then re - form into the shape shown in fig4 b . the stiffener ( 10 ) would be machined such that there was a small step down ( 12 ) in the lga area to house the gel package ( 60 ) and so that support would be provided to the system board ( 20 ) wherever it was needed . another design would use a gel package ( 60 ) that is constructed in a manner with the frame ( 51 ) on one side of the gel package ( 60 ) for support as shown in fig5 a . the advantage of this design would be for overall manufacturing considerations . the stiffener ( 10 ) would then be milled such that a channel ( 11 ) is formed in the area between the lga connector area and the outer most clamping area of the frame as shown in fig5 b . the step ( 15 ) created with the milling of the small channel ( 11 ) would act as part of the gel package &# 39 ; s ( 60 ) frame . as shown in fig5 c the gel package ( 60 ) is compressed during the mounting of the mcm ( 40 ), the excess gel material ( 62 ) would self level and fill the void ( 14 ) of the channel ( 11 ). the final results would also provide a solid backing to the system board ( 20 ). one advantage for the use of the channel would be to reduce the height needed between the stiffener ( 10 ) and the system board ( 20 ) and to permit a larger volume of gel ( 62 ) in the package ( 60 ). a third anticipated design shown in fig6 would be to use the double frame compensator ( 50 ) as described in fig4 a , b and the use of a channel ( 11 ) cut into the stiffener ( 10 ). the stiffener ( 10 ) is machined in such a manner that the system board ( 20 ) is supported outside of the lga area , and a channel ( 11 ) is cut to completely frame the lga support area . the frame ( 50 ) on the gel package ( 60 ) would then reside within this channel ( 11 ) and its height would be the same as the height of the stiffener ( 10 ) to the system board ( 20 ). when the mcm ( 40 ) is compressed to the front side of the system board ( 23 ), the gel would compensate for the uneven surface of the bottom side of the system board ( 22 ). the excess gel ( 62 ) would then fill the cavity ( 14 ) between the gel package frame ( 50 ) and the cut channel ( 11 ). again a larger volume of material could be used in the design to cover a larger gap and thus permit a significant easement of the mechanical tolerances . an added embodiment to control the pressure and volume of the gel package is shown in fig7 . an adjustment screw ( 70 ) is incorporated in the stiffener ( 10 ) at one or at various locations around the gel package placement area . this would permit micro adjustments to the fluid system to insure that the gel or other such material is optimized for supporting the system board to stiffener interface . this technique would insure that a positive pressure of the gel package would be maintained . to accommodate , if needed , the removal of excess heat generated under the mcm , the gel package could contain a thermo - conducting paste similar to the paste , which is used to interface the chips to the heat sink . when used with any of the previously defined applications , the paste would help to maintain a thermo - path to remove the excess heat to the stiffener . the reliability of the system of the system would be enhanced because the operational temperature of the mcm in the connector area would be in better control and therefore system speeds and reliability could be enhanced . in certain applications , there might be an advantage to cause the gel package to form a permanent seal to the system board . this could be accomplished by using a low temperature curing epoxy as part of the gel package design . this could actually be a thermo - conducting epoxy . when the system is powered on , the temperature of the bottom side of the board will increase due to current through the vias and the heat sinking effects of the contacts between the mcm and the system board . this heat increase will then cause the resin to cure and harden in the conformed shape of the gap between the stiffener and the board providing for both an enhanced mechanical and thermo structure . in addition , the amount of the epoxy hardness could be regulated such that the epoxy could be as hard as possible or very elastic in nature . the higher the elasticity , the more rubber like the bond and thus the more flexible the adhesion . this would permit different applications of the epoxy when used in the proposed solution . this is especially important when the surfaces flex from the effects of temperature , or stress . one concept would be to use an adjustment screw ( 71 ) as shown in fig8 to activate a small package ( 72 ) of curing agent within the larger gel package . this could be accomplished by the use of a small sharp point attached to the inside of the outer layer ( 65 ) of the gel package ( 60 ). the curing agent package ( 72 ) would be placed as a decal over the sharp point during the assembly of the overall package ( 60 ). the decal could also contain the sharp activation point to enhance the assembly of the epoxy package ( 60 ). when the screw ( 71 ) is adjusted inward , the sharp point would then puncture the small package ( 72 ) of curing agent and thereby releasing it into the epoxy filled package ( 60 ). this would then cause the epoxy to harden and form a solid interface between the system board ( 20 ) and the stiffener ( 10 ). the epoxy could also have thermo conductive properties similar to that of a thermo conductive paste . this would permit the removal of excess heat from under the mcm during system operation and at the same time form a ridged support between the system board ( 20 ) and the stiffener ( 10 ). another concept , as shown in fig9 , would be to include within the gel package ( 60 ) an activation agent package ( 74 ) that would contain an epoxy - curing agent ( 75 ). this package ( 74 ) could be designed to rupture when the compression forces exceed a predetermined value during the assembly of the mcm to the system board ( 20 ) and stiffener ( 10 ). the agent ( 75 ) would then be injected into the epoxy package ( 60 ) and thereby causing the epoxy to harden into a solid form that would conform to the system board ( 20 ) irregularities . a third concept would be to use a pressure sensitive curing epoxy that would self activate when subjected to pressure such as that created when the mcm ( 40 ) is compressed to the system board ( 20 ). in addition to the mechanical activation of the curing agent as described in fig8 and fig9 , the enclosed active curing agent ( 75 ) could be dispensed into the gel package ( 60 ) by physical manipulation of the gel package ( 60 ) by the assembler . that is to say , the operator would squeeze the gel package ( 60 ) by hand to cause the enclosed curing agent package ( 74 ) to rupture . this would permit the operator to inter mix the epoxy and curing agent together just before assembly , thereby insuring that the curing agent was well mixed with the epoxy . the electrical interface between the mcm and the lga connector is significantly enhanced due to the fact that the system board is uniformly supported in the lga area . because no movement is possible of the system board due heat flux of the pcb material , the lga connectors are in the best possible contact with the mcm . with better contact of the lga connectors being made , the contact resistance of the inner most lga connections of the array will be lowered . with a lower signal amplitude loss for the signal nets and a lower drop in voltage and better power distribution for the power connections , the system performance can be improved . at the transmission rates for current and future machines , every impact due to power loss or signal integrity has an effect on the delivered system performance and thus the improvements made by this application will enhance system performance . the retro fitting of the computer systems using an lga connection interface could be accomplished through the use of any one of the described methods with little or no modifications . ideally , the insulator that is presently being used on all lga system designs would be replaced by a self - compensating gel package . while the preferred embodiments to the invention has been described , it will be understood that those skilled in the art , both now and in the future , may make various improvements and enhancements which fall within the scope of the claims which follow . these claims should be construed to maintain the proper protection for the invention first described .