we disclose a method for fast , symmetrical , and simultaneous texturing of both sides of a glass or glass - containing substrate , such as a magnetic disk substrate . we demonstrate the method with reference to texturing of a magnetic disk , as an example . the method uses a laser . short pulses from the laser beam are serially sliced out , for example , by collecting the first order diffraction from two acousto - optic modulators in series . the beam path length for each beam is identical and the active optics are the same in order to produce equal texturing on both sides of the substrate , such as both sides of a magnetic disk . the invention uses two acousto - optic modulators , referred to as mod - a and mod - b , arranged in a series , to slice out &# 34 ; equal &# 34 ; laser pulses from a &# 34 ; mother &# 34 ; laser beam . a master square - wave oscillator of 50 -- 50 duty cycle is generated to make this possible . a 20 khz rep rate is suitable for the oscillator . mod - a and mod - b are triggered by two independent pulse trains , each triggered by the rising and falling edges of the oscillator , respectively . all pulse widths are less than half of the master oscillator &# 39 ; s period . assuming a 20 khz rep rate for the oscillator , this means that the pulse width for texturing the glass substrate typically is less than ten microseconds . a first order diffracted beam is collected from each of mod - a and mod - b . there is some beam divergence in the two laser beams , so it is necessary to make the beams equal in propagation distance before each beam enters a beam expander . if the propagation distance is not equal , it is difficult to achieve the same beam profile in each beam , which is necessary to produce symmetrical , simultaneous texturing on each side of the target substrate . once the beams are made equal in propagation distance , each beam enters a beam expander . to texture each side of the substrate , two alternative techniques are possible . one technique involves moving the two laser beams across the substrate . this technique uses a galvo mirror pair and an imaging lens with sufficient clear aperture to &# 34 ; telecentrically &# 34 ; scan each of the two focused laser spots on their respective sides of the stationary substrate to form the matrix of bumps ( shown in fig3 ) known as texturing . one bump is generated per laser pulse . the simultaneous nature of the two pulse trains and the equalization of the propagation distance results in texturing of both sides of the substrate . an alternative technique to texturing each side of the substrate simultaneously , is to use rotation / translation stages to move the disk , while leaving the two laser beams focused to fixed locations . the first option of using a stationary substrate and moving the laser beams provides the following advantage . well - defined patterns can be written onto the substrate . the two galvo scanners are independently controlled , so the texturing patterns can differ on the two sides of the substrate . that is , although the texturing is performed simultaneously on both sides of the substrate , the texture patterns do not have to be identical . serialization and side - dependent identification is possible . moreover , the first option generally permits faster throughput of the textured substrates and can be implemented at lower cost . a disadvantage of the first option is the need for a good , large - aperture focusing lens system . fig1 is a schematic showing one particular embodiment of the laser texturing tool of the present invention . this embodiment of the invention uses a temperature - stabilized carbon dioxide laser 10 . temperature stabilization is provided by temperature controller 11 . the laser 10 has a range of 1 - 12 watts , and operates in this embodiment at approximately ten watts . the laser 10 may be enclosed in a temperature controlling enclosure 12 . the laser 10 produces a parent beam 14 at typical 9 . 25 micrometers wavelength . the parent beam 14 as it leaves the laser 10 passes through a shutter 13 , then through a collimating lens 16 . the parent beam 14 then passes through a variable attenuator 18 . parent beam 14 then passes through a first acousto - optic modulator 20 ( mod - a ) which has attached first modulator driver 22 . as shown in fig2 modulator 20 is triggered by a pulse train 82 produced by slave waveform generator 76 which in turn is triggered by the rising edge of the square wave 80 provided by the master waveform generator 74 . both the voltage and the width of the pulse train 82 are used to control the intensity and pulse length of the first order laser beam 35 produced by modulator 20 . the 0 th order beam 24 that leaves modulator 20 enters a second acousto - optic modulator 26 ( mod - b ) with attached second modulator driver 28 . as shown in fig2 modulator 26 is triggered by a pulse train 84 produced by the second slave waveform generator 78 which in turn is triggered by the falling edge of the square wave 80 produced by master waveform generator 74 . all pulse widths from modulator 20 and modulator 26 are less than half of the pulse width of the square wave 80 . for example , if the square wave 80 is at a twenty khz rep rate with a pulse width of 25 micro seconds , a pulse width of ten microseconds or less is produced by the two slave waveform generators 76 and 78 for modulator 20 and modulator 26 . as for mod - a 20 , both the voltage and the width of the pulse train 84 are used to control the intensity and pulse length of the laser beam 35 produced by modulator 26 . fig2 described below , provides detail of the pulse widths . the 0 th order beam 30 that leaves modulator 26 is directed to protected gold mirror 32 , from which the beam reflects and is available for optical spectrum analysis to monitor the wavelength of the carbon dioxide laser beam , as indicated generically by box 34 of fig1 . a first order diffracted beam 35 is captured from modulator 20 . diffracted beam 35 is reflected off of protected gold mirror 36 . correspondingly , first order diffracted beam 38 is captured from modulator 26 and is reflected off of protected gold mirror 40 . specifically , the intensity and laser beam pulse width of the diffracted beams 35 and 38 are controlled by the pulse height and pulse width of the electrical pulse trains 82 and 84 produced by the two slave waveform generators 76 and 78 . beams 42 and 44 , leaving mirrors 36 and 40 , respectively , must be made equal in propagation distance . this is necessary due to unavoidable beam divergence in the laser beams . if the propagation distance is not made equal , it would be difficult to get the same beam profile in each of the two beams used to produce the texturing of the glass substrate 64 . to make the propagation distance equal , beams 42 and 44 are reflected off of mirrors 46 and 48 , respectively . mirrors 46 and 48 are made of zinc selenide . for a 9 . 25 micrometer wavelength beam , mirrors 46 and 48 are approximately 90 % reflective . mirrors 46 and 48 are positioned at a 45 ° angle to beams 42 and 44 , respectively . two 675 nanometer wavelength diode lasers 49 and 50 are positioned behind each of mirrors 46 and 48 . the red diode lasers 49 and 50 provide an indicator beam . the carbon dioxide laser 10 produces an invisible beam , so a collinearized visible beam is useful for alignment and diagnostics . mirrors 46 and 48 are dielectrically coated to combine the red diode laser beams 53 and 55 from red diode lasers 49 and 50 with beams 42 and 44 to produce beams 58 and 66 . two power meters 54 and 56 receive beams 51 and 52 , respectively , which are the transmitted portions of beams 42 and 44 , through mirrors 46 and 48 , respectively . the reflected beam of beam 42 at mirror 46 combines with the beam 53 from red diode laser 49 to form beam 58 . beam 58 enters beam expander 60 . beam expander 60 produces an expanded and collimated beam . the expansion is required to reduce the diameter of the ultimately focused beam used to do the texturing of the glass substrate 64 . the galvo controller 62 controls the galvo mirror pair which steers the beam 58 as it leaves the beam expander 60 . the beam 58 then passes through a zinc selenide lens 63 . the lens 63 has a 50 mm clear aperture , with 50 mm focal length . lens 63 serves to focus the beam 58 . beam 58 , upon leaving the lens 63 , is focused on a target substrate 64 and textures the surface of substrate 64 . target substrate 64 is made of glass or glass - containing substance . in the described implementation of the invention , the target substrate 64 is a magnetic disk substrate . simultaneously , the other side of target substrate 64 is textured by beam 66 . beam 66 is a beam that has passed through beam expander 68 and , subject to a second galvo mirror pair and controller 70 , has been focused by zinc selenide lens 72 onto the target substrate 64 . the laser texturing tool of fig1 is one embodiment of the invention . other embodiments of the invention are possible without departing from the spirit and scope of the invention . fig1 implements a texturizing method that relies on moving the beams 58 and 66 across the surface of the substrate 64 . substrate 64 itself remains stationary . an alternative embodiment of the invention would be to move the substrate 64 and hold the beams 58 and 66 stationary . turning now to fig2 fig2 shows detail of the pulse widths mentioned in fig1 . fig2 shows the waveform 80 produced by the master waveform generator 74 . the waveform 80 is a square wave with pulse widths of twenty - five microseconds . variable attenuator 18 alternates the intensity of beam 14 . waveforms 82 and 84 are generated by two slave waveform generators 76 and 78 , each triggered by the rising and falling edge of waveform 80 , respectively . the pulse widths of waves 82 and 84 are typically ten microseconds or less . fig3 shows a textured disk 90 . fig3 shows the disk 90 . fig3 a is an expanded view of the textured portion 92 of the disk 90 . the texturing process creates a matrix of rounded bumps which , in the disk 90 shown , will act as a dedicated landing zone for a slider or head / suspension assembly in a disk drive ( not shown ) that transmits information to and from the disk 90 . fig3 b is an expanded view of a cross - section of a single bump 94 in the textured portion 92 of the disk 90 . the invention has been described with particularity as to one embodiment . those skilled in the art will know that variations are possible that do not depart from the spirit and scope of the inventor . accordingly , the invention is limited only by the following claims .