the invention provides a method for anchoring the mold cap of a mold compound to the underlying and supporting substrate of the package . the mold anchor of the invention is preferably applied in the creation of relatively thin semiconductor device packages . the mold anchor of the invention secures the mold cap to the substrate . the mold cap of the invention may be provided at the edges or corners of the mold cap . the active area of the mold cap may in this manner by increased . the conventional method of providing a mold cap over the surface of a supporting substrate in a semiconductor device package will first be highlighted , using fig1 a through 1 c for this purpose . shown in fig1 a is a top view 10 of a substrate 12 over the surface of which a mold cap 14 has been deposited using conventional methods of mold cap formation . a film 13 of polyimide has for protective purposes been applied over the surface of substrate 12 prior to the creation of the mold cap 14 . further detail of one of the corners 16 of the substrate 12 with the thereover provided mold cap 14 has been shown in the cross section of fig1 b , the cross section being taken along the line 1 b - 1 b ′ of fig1 a and bounded by the highlighted circle 16 shown in fig1 a . the cross section shown in fig1 b represents a typical substrate 12 design with a mold cap 14 applied over the surface of substrate 12 . not shown in fig1 b is the effect of temperature that is experienced by the substrate / mold cap combination as a result of mold reflow . this effect is shown in the cross section of fig1 c , which shows in this instance a cross section along the line 1 b - 1 b ′ of fig1 a without however being bounded by the circle 16 of fig1 a but being extended between the extremities of the cross section as highlighted with circles 16 and 16 ′ in the cross section of fig1 c . one of the reasons for mold reflow is to assure that the mold 14 properly adheres to the surface of the substrate 12 . this adhesion however tends to warp the substrate 12 due to a combination of contraction of the mold compound 14 and the relative good adhesion that exists between the mold compound 14 and the substrate 12 . this warpage of the substrate 12 is shown in the cross section of fig1 c . it is clear from the cross section of fig1 c that extreme tension of separation will be created between the mold cap 14 at the extremities of the mold cap , that is in cross section areas 16 and 16 ′. this tension or force of separation results in the delamination 18 shown in the cross section of fig1 c , where the mold cap 14 separates from the underlying substrate 12 . this delamination is highly undesirable since it exposes the underlying substrate 12 over the surface areas of the delamination 18 , thereby introducing the possibility of creating deposits over these exposed surface areas which have a negative impact on package performance and reliability . to prevent the delamination 18 that is shown in the cross section of fig1 c , the invention provides anchor points in the four corners of the substrate as has been highlighted in and will be described using fig2 a through 2 d . anchoring can also be provided at any other surface area around the perimeter of the substrate that is sued to create the device package . [ 0022 ] fig2 a shows a top view 20 of the supporting substrate 22 over the surface of which has been applied a mold cap 24 . a polyimide tape 23 has been applied over the surface of substrate 22 prior to the formation of the mold cap 24 , copper interconnect traces 25 created over the surface of substrate 22 have been highlighted in fig2 c and 2 d . of special interest to the invention are the surface areas in the four corners of the substrate 22 , of which one illustrative example has been highlighted by surface area 26 in fig2 a . a cross section , taken along the line 2 b - 2 b ′ of fig2 a , of this surface area 26 is shown in fig2 b and 2 c . specifically notable in the cross section of fig2 b is the opening 28 that has been created through the substrate 22 , an opening that is provided for each of the corners of substrate 22 of which the cross section shown in fig2 b is a representative example . it is clear that the mold compound 24 will , at the time of filling of the mold cavity with mold 24 , penetrate opening 28 and in so doing will , after hardening of the mold , firmly anchor the mold compound 24 in each of the corners of substrate 22 . to further emphasize this anchoring effect , it is beneficial to enable the mold to penetrate underneath the substrate . an example of this is shown in the cross section of fig2 c in which an additional relief or opening 27 is provided for this purpose in the lower part of the mold cavity ( the cavity bar ). this opening 27 is filled with mold compound at the time that the mold compound enters into the mold cavity . this additional relief 27 has been shown in the cross section of fig2 c as being of rounded cross section , resembling a segment of a circle . there is no reason for this additional relief to be limited to such a cross section , any shape or form that further enhances the anchoring of the mold compound to the underlying substrate can be applied for this purpose of anchoring . for instance , a finned cross section , resembling for instance cooling fins of a heatsink , wherein parts of the additional relief fan - out as separate sub - elements from a central part can be envisioned as providing extreme anchoring capabilities . [ 0027 ] fig2 d shows a top view of surface are 26 of fig2 a , more clearly highlighting the location of the anchoring point 26 with respect to both the substrate 22 and the applied mold cap 24 . with the basic concept of the invention in mind , that is providing an anchor that forms a solid interconnection between the supporting substrate and the overlying mold cap , it is clear that a number of variations of this concept can be used . some of these variations are highlighted using fig3 a through 3 d for this purpose . referring first specifically to the cross section that is shown in fig3 a , there is shown a cross section 32 of a top cavity bar , a cross section 30 of a bottom cavity bar , a substrate 34 with copper interconnect traces 35 provided over the surface thereof . anchor opening 37 has been provided through ( each of the four ) corners of substrate 34 , by modifying the contours of the top and bottom cavity bars 32 / 30 where these cavity bars are aligned with the anchor opening 37 , the contours of the applied mold compound can be controlled . in the example that is shown in the cross section of fig3 a , a top cavity relief 36 has been indicated that extends over a distance of substrate 34 , allowing additional mold compound to collect over the surface of the substrate 34 and surrounding the anchor opening 37 . a bottom cavity relief 38 has the same effects as this effect is now introduced for mold collection underneath the substrate 34 . the combined effect of these relief 36 and relief 38 is shown in the completed mold compound 38 as shown in the cross section of fig3 b , where the anchor area 33 is now provided with mold compound 38 that extends above the upper and below the lower surface of substrate 34 . copper traces 35 are also highlighted in the cross sections of fig3 a and 3 b . an additional implementation that closely resembles the implementation shown in fig3 a and 3 b is highlighted in fig3 c and 3 d . in the latter implementation the relief 38 , fig3 a , in the bottom cavity bar 30 ′ is omitted , resulting in a completed mold compound 38 ′ shown in cross section in fig3 d . the anchor area 33 ′ is now provided with mold compound 38 ′ that extends above the upper surface of substrate 34 . additional details relating to the design of the substrate of the invention are shown in fig4 a and 4 b , both fig4 a and 4 b showing a top view of one ( of the four ) corner of substrates 40 and 42 . the difference between substrates 40 and 42 is created by the difference in the creation of the anchor holes 45 ( fig4 a ) and 43 ( fig4 b ). the anchor hole 45 , fig4 a , has been created using a drilling or punch - through process , which as shown in the cross section of fig4 b as not differentiating between the presence or absence or copper 41 . the anchor hole 43 , fig4 b , has been created applying an etch process , which creates the anchor through hole 43 while not affecting copper 46 , creating overhang copper 46 . elements 44 , fig4 a , are copper pads created over the surface of substrate 40 , 48 is polyimide tape applied over the surface of substrate 40 . although the invention has been described and illustrated with reference to specific illustrative embodiments thereof , it is not intended that the invention be limited to those illustrative embodiments . those skilled in the art will recognize that variations and modifications can be made without departing from the spirit of the invention . it is therefore intended to include within the invention all such variations and modifications which fall within the scope of the appended claims and equivalents thereof .