fig1 is a cross sectional view showing a stacked multichip package 10 according to the first embodiment of the present invention . the stacked multichip package 10 of the first embodiment of the present invention comprises a first chip 111 , a first chip carrier 13 , a plurality of first conductive leads 141 , a second chip 112 , an adhesive layer 16 , a second chip carrier 19 , and a plurality of second conductive leads 142 . the first chip 111 comprises a first active surface 1111 and a first rear surface 1112 opposite to the first active surface 1111 . an integrated circuit including a plurality of electronic components and conductive traces connecting the electronic components is formed on the first active surface 1111 . the first chip carrier 13 includes an inner wall 131 defining a first opening 132 . the first active surface 1111 of the first chip 111 faces toward the first opening 132 , and is attached to the first chip carrier 13 . in the present embodiment , the first chip 111 and the first chip carrier 13 can be attached using a die attach paste , a die attach tape , or a die attach film . the plurality of first conductive leads 141 pass through the first opening 132 of the first chip carrier 13 , electrically coupling the first active surface 1111 of the first chip 111 to the surface of the first chip carrier 13 opposite to the surface attached to the first chip 111 . the adhesive layer 16 is disposed on the surface of the first chip carrier 13 opposite the surface attached to the first chip 111 and is deposited into the first opening 132 of the first chip carrier 13 , surrounding the plurality of first conductive leads 141 . in the present embodiment , the adhesive layer 16 can be an fow ( film over wire ) film , which can allow the height of a package to be decreased and protects the conductive leads to improve the stability thereof . the second chip 112 comprises a second active surface 1121 and a second rear surface 1122 opposite to the second active surface 1121 . an integrated circuit including a plurality of electronic components and conductive traces connecting the electronic components is formed on the second active surface 1121 . the second chip carrier 19 includes an inner wall 191 defining a second opening 192 . the second active surface 1121 of the second chip 112 faces toward the second opening 192 , and is attached to the second chip carrier 19 . in the present embodiment , the second chip 112 and the second chip carrier 19 can be attached using an adhesive 122 such as a die attach paste , a die attach tape , or a die attach film . the plurality of second conductive leads 142 pass through the second opening 192 of the second chip carrier 19 , electrically coupling the second active surface 1121 of the second chip 112 to the surface of the second chip carrier 19 opposite to the surface attached to the second chip 112 . the adhesive layer 16 disposed on the first chip carrier 13 and the first chip 111 is attached to the second rear surface 1122 of the second chip 112 , and the plurality of third conductive leads 15 electrically couples the first chip carrier &# 39 ; s surface attached to the first chip 111 to the second chip carrier &# 39 ; s surface attached to the second chip 112 . the encapsulation body 18 encloses the first chip 111 , the first chip carrier 13 , the second chip 112 , and the third conductive leads 15 ; the encapsulation body 18 is filled into the second opening 192 of the second chip carrier 19 and encloses the second conductive leads 142 so as to form the stacked multichip package 10 of the first embodiment of the present invention . preferably , in the present embodiment , between the adhesive layer 16 , which is disposed on the first chip carrier 13 and the first chip 111 , and the rear surface 1122 of the second chip 12 , a dielectric layer 17 can be disposed to prevent the first conductive leads 141 from contacting the second chip 112 to cause short - circuiting , and simultaneously to bond the first chip 111 to the second chip 112 . in the present embodiment , the first chip carrier 13 can be a printed circuit board or a lead frame , and the second chip carrier 19 can be a printed circuit board , a lead frame or a flexible circuit board . in addition , on the surface of the second chip carrier 19 opposite to the surface attached to the second chip 112 , a plurality of external contacts 21 such as solder balls can be disposed . fig2 is a cross sectional view showing a stacked multichip package 20 according to the second embodiment of the present invention . referring to fig1 and 2 , the stacked multichip package 20 of the first embodiment of the present invention comprises a first chip 111 , a first chip carrier 13 ′, a plurality of first conductive leads 141 , a second chip 112 , an adhesive layer 16 , a second chip carrier 19 , and a plurality of second conductive leads 142 . the first chip 111 comprises a first active surface 1111 and a first rear surface 1112 opposite to the first active surface 1111 . an integrated circuit including a plurality of electronic components and conductive traces connecting the electronic components is formed on the first active surface 1111 . the first chip carrier 13 ′ includes an inner wall 131 ′ defining a first opening 132 ′. the first active surface 1111 of the first chip 111 faces toward the first opening 132 ′, and is attached to the first chip carrier 13 ′. in the present embodiment , the first chip 111 and the first chip carrier 13 ′ can be attached using an adhesive 121 such as a die attach paste , a die attach tape , or a die attach film . the plurality of first conductive leads 141 pass through the first opening 132 ′ of the first chip carrier 13 ′, electrically coupling the first active surface 1111 of the first chip 111 to the surface of the first chip carrier 13 ′ opposite to the surface attached to the first chip 111 . the adhesive layer 16 is disposed on the surface of the first chip carrier 13 ′ opposite the surface attached to the first chip 111 and is deposited into the first opening 132 ′ of the first chip carrier 13 ′, surrounding the plurality of first conductive leads 141 . in the present embodiment , the adhesive layer 16 can be an fow ( film over wire ) film , which can allow the height of a package to be decreased and protects the conductive leads to improve the stability thereof . the second chip 112 comprises a second active surface 1121 and a second rear surface 1122 opposite to the second active surface 1121 . an integrated circuit including a plurality of electronic components and conductive traces connecting the electronic components is formed on the second active surface 1121 . the second chip carrier 19 includes an inner wall 191 defining a second opening 192 ′. the second active surface 1121 of the second chip 112 faces toward the second opening 192 ′, and is attached to the second chip carrier 19 . in the present embodiment , the second chip 112 and the second chip carrier 19 can be attached using an adhesive 121 such as a die attach paste , a die attach tape , or a die attach film . the plurality of second conductive leads 142 pass through the second opening 192 ′ of the second chip carrier 19 , electrically coupling the second active surface 1121 of the second chip 112 to the surface of the second chip carrier 19 opposite to the surface attached to the second chip 112 . the adhesive layer 16 disposed on the first chip carrier 13 ′ and the first chip 111 is attached to the second rear surface 1122 of the second chip 112 , and the two lateral end portions of the first chip carrier 13 ′ can be deformed so that the contacts ( not shown ) on each lateral end portion 133 can electrically connect to the second chip carrier 19 . the encapsulation body 18 encloses the first chip 111 , the first chip carrier 13 ′, the second chip 112 , and the third conductive leads 15 ; the encapsulation body 18 is filled into the second opening 192 ′ of the second chip carrier 19 and encloses the second conductive leads 142 so as to form the stacked multichip package 20 of the first embodiment of the present invention . in the present embodiment , the first chip carrier 13 ′ includes a flexible circuit board and a lead frame . in another embodiment , between the adhesive layer 16 , which is disposed on the first chip carrier 13 ′ and the first chip 111 , and the rear surface 1122 of the second chip 12 , a dielectric layer ( not shown ) can be disposed , as shown in the first embodiment , to prevent the first conductive leads 141 from contacting the second chip 112 to cause short - circuiting , and simultaneously to bond the first chip 111 to the second chip 112 . the second chip carrier 19 can be a printed circuit board , a lead frame or a flexible circuit board . in addition , on the surface of the second chip carrier 19 opposite to the surface attached to the second chip 112 , a plurality of external contacts 21 such as solder balls can be disposed . in the present embodiment of the invention , the first chip 111 and the second chip 112 can be matched in size such that the stacked multichip packages 10 and 20 are chip packages of multiple single size chips . in the present embodiment of the invention , the first chip 111 and the second chip 112 can be dynamic random access memories . the adhesive layer 16 utilized in the present invention can be an fow ( film over wire ) film , which can allow the height of a package to be decreased and protects the conductive leads to improve the stability thereof . simultaneously , a dielectric layer 17 can further be disposed to prevent the first conductive leads 141 from contacting the second chip 112 to cause short - circuiting , and to bond the first chip 111 to the second chip 112 . the above - described two assemblies can be tested before assembly . as such , the risk of discarding high - priced chips can be reduced and the manufacturing yield can be increased . the above - described embodiments of the present invention are intended to be illustrative only . numerous alternative embodiments may be devised by persons skilled in the art without departing from the scope of the following claims .