referring now to fig8 a semiconductor tape - peeling apparatus in accordance with a preferred embodiment of the invention includes a first cassette 1 , a second cassette 2 , a robot arm 3 , a flat positioner 6 , and a tape - peeling device 5 . the robot arm 3 includes a suction means 7 for sucking a wafer 4 and transfers the wafer 4 to a predetermined position for peeling . referring to fig9 both of the first cassette 1 and the second cassette 2 include 25 wafer storage slots s 25 to s 01 ( slots s 20 to s 01 are not shown ) for storing the wafers w 25 to w 01 ( wafers w 21 to w 01 are not shown ). in fig8 and 9 , the first cassette 1 , the second cassette 2 , the robot arm 3 , the wafers w 25 to w 01 , the tape - peeling device 5 , the flat positioner 6 , the suction means 7 , and the wafer storage slots s 25 to s 01 are similar to those in fig2 and 3 . therefore , a detail description is omitted . by comparing fig8 and 2 , it can be known that the embodiment of the invention is characterized in that the front - sides of the wafers are sucked by the suction means 7 . this characteristic is described hereinbelow . referring to fig9 again , in order to prevent the suction means 7 from crashing any of the wafers w 25 to w 01 , the method for transferring wafers w 25 to w 01 includes the steps of : ( 1 ) activating the robot arm 3 to the first cassette 1 so that the suction means 7 enters the first cassette 1 ; ( 2 ) sucking the front - side of the wafer wi ( i = 25 to 01 ) by the suction means 7 ( it should be noted that the wafer wi corresponds to the wafer 4 in fig8 at this moment ); ( 3 ) activating the robot arm 3 to unload the wafer wi from the first cassette 1 ; ( 4 ) transferring the wafer wi to the flat positioner 6 ; ( 5 ) positioning the wafer wi by the flat positioner 6 so that the flat side or notch of the wafer wi directs to a predetermined direction ; ( 6 ) activating the robot arm 3 to suck the back - side of the wafer wi by the suction means 7 ; ( 7 ) transferring the wafer wi to the tape - peeling device 5 ; ( 8 ) peeling the tape on the wafer wi by the tape - peeling device 5 ; ( 9 ) activating the robot arm 3 to suck the back - side of the wafer wi by the suction means 7 ; ( 10 ) transferring the wafer wi to the second cassette 2 ; ( 11 ) storing the wafer wi to the wafer storage slot si ( i = 25 to 01 ) of the second cassette 2 ; and ( 12 ) repeating steps ( 1 ) to ( 11 ) for 24 iterations with i = i − 1 until the tapes on all the wafers w 25 to w 01 are peeled and the wafers w 25 to w 01 are stored in the wafer storage slots s 25 to s 01 , respectively . by comparing the wafer transfer methods of the invention and the prior art , it can be known that the difference between the methods lies in step ( 2 ). by making a start - up from the uppermost wafer to the lowermost wafer , and by sucking the front - side of the wafer and transferring the wafer to the flat positioner 6 , the undesired effect that the suction means 7 crashes the wafer can be entirely avoided . furthermore , the positioning processes of the robot arm 3 only need to be done once so that the positioning points of the robot arm need not to be adjusted frequently . referring to fig1 , the suction means 7 also includes a plurality of vacuuming conduits 71 . by making use of the vacuuming conduits 71 , the wafer w 25 can be sucked and unloaded , and the deformation of the wafer w 25 can be reduced . therefore , the excessive deformation and destruction can be avoided . when sucking the wafer by the suction means 7 of the vacuum type , the suction means 7 must be reversible so as to selectively suck the front - side or the back - side of the wafer in the above steps ( 1 ) to ( 12 ). the reversibility is easily achieved in the conventional robot arm . therefore , the present invention can be easily carried out . while the invention has been described by way of example and in terms of a preferred embodiment , it is to be understood that the invention is not limited to the disclosed embodiment . to the contrary , it is intended to cover various modifications . therefore , the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications .