an exemplary embodiment of the present invention will now be described in detail with reference to the drawings . fig1 is a perspective view of a plasma display device according to an exemplary embodiment of the present invention , fig2 is a partially exploded perspective view of the plasma display device of fig1 , fig3 is front view of a structure of an epoxy resin deposited on a driver ic of fig2 , and fig4 is a sectional view taken along line a - a of fig2 . referring to fig1 , fig2 , fig3 and fig4 , a plasma display device according to an exemplary embodiment of the present invention includes a plasma display panel (“ panel ”) 12 and a chassis base 16 . the panel 12 and the chassis base 16 each have a substantially rectangular , planar shape with opposing inner and outer surfaces . the panel 12 is mounted substantially parallel to the chassis base 16 such that their inner surfaces are adjacent to one another . drive circuits 18 may be mounted on an outer surface of the chassis base 16 . a thermal conducting medium ( not shown ) may be interposed between the panel 12 and the chassis base 16 . a front cover ( not shown ) is positioned at the outer surface of the panel 12 , and a back cover ( not shown ) is positioned at the outer surface of the chassis base 16 . the front cover is connected to the back cover to house the plasma display device . electrodes of the panel 12 may be coupled to the drive circuits 18 through fpcs 21 to thereby receive signals required for operation . specifically , driver ics 23 on the fpcs 21 may selectively apply voltages to the electrodes of the panel 12 according to signals controlled by the drive circuits 18 . in an exemplary embodiment of the present invention , the driver ics 23 may be packaged in tcps 25 for coupling to the fpcs 21 and the drive circuits 18 . further , the driver ics 23 may be positioned on an optional reinforcing member 28 , which may be mounted to the chassis base 16 , and a heat dissipating plate 29 may cover the tcps 25 . the heat dissipating plate 29 may contact an outer surface of the driver ic 23 and press the driver ic 23 toward the reinforcing member 28 . additionally , the heat dissipating plate 29 dissipates heat generated by the driver ic 23 . a thermal conductor 35 may be interposed between the heat dissipating plate 29 and the driver ic 23 . each heat dissipating plate 29 includes a first surface 29 a , which covers the driver ics 23 and has upper and lower ends , and a second surface 29 b , which extends from the lower end of the first surface 29 a in a direction toward the panel 12 until reaching an outer surface thereof , thereby acting as a support for the fpcs 21 . the heat dissipating plate 29 may be made of a conductive material such as aluminum , copper , or steel , and it is fixed to the chassis base 16 through connectors ( not shown ). an epoxy resin 30 is deposited in a connecting region between the fpcs 21 and the driver ics 23 , and it covers a rear surface of each of the driver ics 23 . an outer surface of the epoxy resin 30 may contact the reinforcing member 28 , and it may be formed with indentations and protrusions to thereby form an uneven region 40 , as shown in fig3 and fig4 . a depth of the indentations may be 0 . 1 mm or greater . each of the tcps 25 may have a structure in which at least one of the driver ics 23 is mounted on the corresponding fpc 21 . an upper end of the tcps 25 may be coupled to a corresponding drive circuit 18 , and a lower end may be coupled to the panel 12 . further , the epoxy resin 30 may be deposited in the connecting region of the driver ics 23 , as described above , and the uneven region 40 may be formed having protrusions and indentations that are substantially uniformly distributed thereon . the tcps 25 , the driver ics 23 , and the connecting structure between the tcps 25 and the chassis base 16 will be described in greater detail with reference to fig4 . the connections associated with only one of the driver ics 23 will be described in the following by way of example to illustrate such connections for all of the driver ics 23 . in the tcp 25 , a beam lead 31 is formed in a circuit pattern , and a solder register layer 32 protects the fpc 21 . the beam lead 31 extends into a window area defined by the fpc 21 , and a bump 33 is interposed between the beam lead 31 and the driver ic 23 . the epoxy resin 30 is deposited and cured in the window area , and it protects the extended portion of the beam lead 31 and the driver ic 23 . the uneven region 40 may be formed on an outer surface of the epoxy resin 30 . the uneven region 40 may contact the reinforcing member 28 , which may be optionally mounted on the chassis base 16 , and a thermal grease 45 may be applied between the contacting surfaces of the uneven region 40 and the reinforcing member 28 . the heat dissipating plate 29 may be positioned to cover a side of the driver ic 23 away from the epoxy resin 30 . as noted above , a thermal conductor 35 may be interposed between the heat dissipating plate 29 and the driver ic 23 . manufacturing the tcp 25 will now be described . first , a copper film is attached to a thick polyimide film ( 75 μm or greater ) to produce an fpc with a desired circuit pattern . next , a bump of a driver ic is thermally compressed onto a portion of a beam lead extending into a window area of the fpc . an epoxy resin is deposited in the window area to cover the extended portion of the beam lead and an adjacent area of the driver ic . an uneven region is formed on a surface of the epoxy resin away from the driver ic before the epoxy resin is fully cured . the uneven region may be formed such that protrusions and indentations are uniformly present on the surface of the epoxy resin . the epoxy resin is then cured . following curing , an electrical test , and marking and printing processes , may be performed . since these subsequent processes are well known to those skilled in the art , a detailed description thereof will not be provided herein . the uneven region 40 of the epoxy resin 30 may provide specific benefits . namely , when the driver ic 23 is pressed toward the reinforcing member 28 , the thermal grease 45 deposited between the reinforcing member 28 and the epoxy resin 30 , as described above , may be forced into the indentations of the uneven region 40 , and the amount of the thermal grease 45 forced outward and away from the area of the epoxy resin 30 may be minimized . this may prevent the formation of an air gap between the reinforcing member 28 and the epoxy resin 30 . further , when re - installing the driver ic 23 after removing it , the thermal grease 45 in the indentations of the uneven area 40 may remain therein . therefore , an air gap may also be prevented from forming between the epoxy resin 30 and the reinforcing member 28 when the driver ic 23 is re - attached . it will be apparent to those skilled in the art that various modifications and is variation can be made in the present invention without departing from the spirit or scope of the invention . thus , it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents .