the material according to the present invention is produced according to methods presented in wo99 / 12866 and wo0018702 . these methods include the following steps : 1 . forming a porous workpiece out of a mixture , containing diamond particles . 2 . heat treating the work piece and controlling the heating temperature and heating time so that a certain desired amount of graphite is created by graphitization of diamond particles , thereby creating an intermediate body . 3 . infiltrating melted silicon or alternatively a silicon alloy into the intermediate body . 4 . reacting of the molten silicon and graphite to form sic . by the manufacturing process described above an article with a predetermined shape is formed . no shrinking , swelling or warpage occur on a macroscopic level during the process from the forming of the workpiece to the finished product . the above mentioned publications wo99 / 12866 and wooo / 18702 are referred to for further details of the methods and the contents thereof are incorporated herein . the workpiece is formed out of a mixture of diamond particles having a minimum size of 6 μm ; the workpiece being formed with a relative green density of at least 60 %. the diamond mixture consists of at least two different fractions with different diamond particle sizes . of the diamond content in the workpiece at least 50 weighty / should have a diameter of 80 μm or above . the use of at least two different fractions with different diamond particle sizes is necessary in order to reach a packing degree in the work piece that in the sintered compact gives a high enough diamond concentration ( i . e . a short path for the phonons to travel between the diamonds ) to reach the required levels of thermal diffusivity and thermal conductivity . the content of diamond in the workpiece is at least 95 % w %, that is a small amount of binder can be used . forming of the workpiece is carried out by known methods such as pressing tape casting , slurry casting or gel casting using conventional equipment . the total duration of the heat treatment of the diamond body is as long as is needed for the diamond mass in the body to have decreased by a desired amount due to graphitization of the diamond particles . an example of heat treatment is heating the workpiece to temperatures between 1000 and 1900 ° c . in vacuum or an inert atmosphere . the infiltration of molten si or silicon alloy is carried out by such known methods as melting a solid piece on the surface of the workpiece , feeding already molten si or silicon alloy on to the surface of the workpiece or by dipping the workpiece into a melt of si or silicon alloy . as the melt infiltrates the workpiece it reacts with graphite and form sic or a sic phase including elements from the alloying elements . the formed silicon carbide phase and a small amount of un - reacted silicon or silicon alloy phase fill up the porous space of the workpiece . the heat treatment and infiltration can advantageously be carried out in the same furnace . the infiltrating melt used can be a silicon alloy comprising at least one metal from the group consisting of ti , zr , hf , v , nb , ta , cr , mo , w , mn , re , fe , co , ni , cu , ag , at or ge . in this case small amounts of secondary phase compounds may form , such as metal silicides , metal carbides , etc . the sintered composite material thus consists of three major phases , a diamond phase , a silicon carbide phase around the diamond particles and un - reacted silicon or silicon alloy phase between areas of silicon carbide . fig1 shows an overview of a typical cross section of a material produced with the method described above in accordance with an embodiment of the present invention seen by back - scattered electron in scanning electron microscopy . dark particles are diamond , gray skeleton is sic and white spots are silicon areas . the initial composition was : 75 wt % d8 ( 150 μm )+ 20 wt % d31 ( 20 μm )+ 5 wt % d32 ( 7 μm ), where the denotations d8 , d31 and d32 are short names for different diamonds used and the different used mean particle sizes are indicated in the parenthesis . the silicon carbide that has formed from the reaction between the graphitized diamond and the melt is coating and surrounding each individual diamond particle . the sic phase forms an interconnected skeleton structure , which is enclosing the diamond particles . fig2 shows a more enlarged view of a typical cross section of a second embodiment of a material according to the invention containing 200 - 250 μm diamonds ( diameters of the largest particles ) to illustrate the close bond the diamonds and the sic surrounding the diamonds . there is virtual no diamond - diamond contact in the composite material . due to the fact that sic has a thermal expansion coefficient larger than the thermal expansion coefficient of diamond , the sic strives to contract more than the diamond particles during cooling after the termination of the heat treatment . at temperatures below the temperature at which the sic was formed , the sic surrounding the individual diamond particles will exert a compressive force on each particle . this is believed to contribute in some extent to the surprisingly good thermal conductivity of the material according to the invention . the silicon - or unreacted silicon alloy together with the possible small amounts of secondary phase compounds , such as metal carbides , metal silicides , etc , are located in the areas in - between the silicon carbide that enclose the diamond particles . the sintered composite material contains said phases in the following proportion : diamond 58 - 81 volume %, si or si alloy max 39 volume % and sic 3 - 41 volume % the limits of the diamond content have been determined empirically . a diamond concentration below 58 volume % in the finished body renders a too low thermal conductivity . a diamond concentration above 79 volume % is hard to achieve with the forming technique used . moreover a diamond concentration above 79 volume % cause problems during the infiltration of the melt , the whole workpiece will not be completely filled by the melt , this leads to poor properties of the finished composite , both thermal and mechanical . however , with special forming techniques and moderate pressure - aided infiltration technique the diamond concentration in the finished body might be slightly increased , a diamond content of 81 volume % may be obtained . to provide a high value of thermal conductivity to a composite material it is crucial to have good adhesion between the different phases , see handbook of industrial diamonds and diamond films , page 184 . the graphite layer formed on the surface of the diamond particles has a very good adhesion to the diamond since the graphite is transformed diamond . when silicon melt reacts with the said graphite the silicon carbide formed inherit the very good adhesion to the diamond and a strong bond between the carbide and diamond is formed . when nucleation of silicon carbide takes place on a graphite surface that has been formed trough graphitization of diamond the formed silicon carbide grows epitaxially , i . e . the growth of silicon carbide on the diamond follows the crystallographic orientation of the diamond the manner in which silicon carbide is formed and the strong bond between the diamond particles and the surrounding silicon carbide are believed to be decisive factors for obtaining the surprisingly high thermal conductivity of a material according to the present invention . a long free path for the phonon transport is obtained in the material according to the present invention . it is shown in table 3 that the thermal conductivity is dependent on how the carbon that form silicon carbide has been provided in materials with otherwise identical initial compositions . a good quality of the raw materials , diamonds as well as silicon is essential in order to reach the maximum levels of thermal diffusivity and thermal conductivity . examples of important diamond quality parameters are low cobalt , nickel and nitrogen bulk levels . it is well known that a low level of nitrogen gives good thermal conductivity . it is an advantage if the nitrogen content of the large sized diamond particles is 300 ppm or below , preferably 100 ppm and below . very high thermal conductivity values are reached when the nitrogen content is 80 ppm and below . the graphitization of the diamond surfaces has a positive effect with regards to physical surface defects on the diamond particles , caused by mechanical treatments like crushing or sieving . the graphitization transforms defective layers on the diamond surface , resulting in improvement of the phonon transport path . surprisingly we have found that a direct bonding between diamonds is not needed to achieve good thermal conductivity . to have a phonon transport path of high quality is more essential . it is being illustrated in the examples given below . in table 1 and 2 thermal diffusivity and thermal conductivity values for a number of different phase compositions are shown . table 1 stress the stated diamond levels , and table 2 the importance of diamond particle sizes . the denotations d1 , d2 etc are short names for different diamonds used and mean particle size is indicated in the parenthesis . the phase composition of the sintered samples given in table 1 and 2 are calculated values . the following four equations were used . where ε 0 is the starting porosity , ρ scd , ρ d and ρ sic are the densities of sintered composite , diamond and silicon carbide , m sic and m c are the molecular masses of silicon carbide and carbon and finally α is the graphitization degree . [ 0054 ] table 2 phase composition of particle size relative the sintered initial for each green c p composite α ± 5 % λ composition diamond type density density ( j / kgk ) ( vol . fraction ) ( cm 2 / s ) ( w / mk ) ( wt %) ( μm ) (%) ( g / cm3 ) calculated d sic si measured calculated 65 % d4 ( 500 ), 79 3 , 345 545 0 , 75 0 , 15 0 , 10 3 , 590 657 d4 + 25 % d24 ( 50 ), d24 + 10 % d32 ( 7 ) d32 65 % d1 ( 420 ), 79 3 , 318 541 0 , 77 0 , 09 0 , 14 4 , 076 732 d1 + 25 % d28 ( 53 ), d28 + 10 % d27 ( 6 ) d27 65 % d3 ( 420 ), 79 3 , 339 544 0 , 75 0 , 14 0 , 11 3 , 372 613 d3 + 25 % d24 ( 50 ), d24 + 10 % d32 ( 7 ) d32 50 , 7 % d3 ( 420 ), 74 3 , 361 558 0 , 66 0 , 29 0 , 05 2 , 851 535 d3 + 49 , 3 % d29 ( 10 ) d29 65 % d34 ( 300 ), 79 3 , 332 544 0 , 75 0 , 13 0 , 12 3 , 408 618 d34 + 25 % d24 ( 50 ), d24 + 10 % d32 ( 7 ) d32 65 % d12 ( 160 ), 75 3 , 329 553 0 , 69 0 , 21 0 , 10 2 , 993 551 d12 + 35 % d31 ( 20 ) d31 75 % d8 ( 150 ), 74 3 , 369 558 0 , 66 0 , 30 0 , 04 3 , 362 632 d8 + 20 % d31 ( 20 ), d31 + 5 % d32 ( 7 ) d32 65 % d14 ( 180 ), 74 3 , 307 554 0 , 69 0 , 19 0 , 12 2 , 822 517 d14 + 35 % d31 ( 20 ) d31 65 % d13 ( 160 ), 77 3 , 364 551 0 , 71 0 , 23 0 , 06 2 , 793 517 d13 + 25 % d31 ( 20 ), d31 + 10 % d32 ( 7 ) d32 70 % d15 ( 150 ), 70 3 , 314 565 0 , 62 0 , 29 0 , 09 2 , 182 408 d15 + 30 % d35 ( 8 ) d35 75 % d36 ( 125 ), 74 3 , 332 557 0 , 68 0 , 24 0 , 08 2 , 562 475 d36 + 20 % d31 ( 20 ), d31 + 5 % d32 ( 7 ) d32 75 % d22 ( 125 ), 32 3 , 273 565 0 , 61 0 , 25 0 , 14 2 , 351 435 d22 + 25 % d29 ( 10 ) d29 70 % d17 ( 125 ), 69 3 , 311 566 0 , 61 0 , 30 0 , 09 2 , 230 418 d17 + 30 % d29 ( 10 ) d29 70 % d16 ( 106 ), 70 3 , 322 565 0 , 62 0 , 30 0 , 08 2 , 226 418 d16 + 30 % d35 ( 8 ) d35 75 % d26 ( 91 ), 70 3 , 265 561 0 , 65 0 , 20 0 , 15 2 , 228 408 d26 + 20 % d31 ( 20 ), d31 + 5 % d32 ( 7 ) d32 75 % d9 ( 88 ), 72 3 , 306 559 0 , 65 0 , 24 0 , 11 2 , 642 488 d9 + 15 % d31 ( 20 ), d31 + 10 % d32 ( 7 ) d32 70 % d10 ( 80 ), 66 3 , 290 570 0 , 58 0 , 32 0 , 10 2 , 300 449 d10 + 25 % d31 ( 20 ), d31 + 5 % d32 ( 7 ) d29 70 % d18 ( 75 ), 71 3 , 315 562 0 , 64 0 , 27 0 , 09 2 , 020 376 d18 + 30 % d30 ( 5 ) d30 70 % d19 ( 63 ), 70 3 , 340 566 0 , 60 0 , 34 0 , 06 2 , 036 385 d19 + 30 % d30 ( 5 ) d30 60 % d24 ( 50 ), 65 3 , 295 578 0 , 55 0 , 36 0 , 09 1 , 762 336 d24 + 40 % d29 ( 10 ) d29 70 % d20 ( 45 ), 70 3 , 318 564 0 , 62 0 , 30 0 , 08 1 , 948 365 d20 + 30 % d33 ( 3 ) d33 70 % d21 ( 38 ), 70 3 , 328 564 0 , 62 0 , 30 0 , 08 1 , 946 365 d21 + 30 % d33 ( 3 ) d33 the materials according to the invention exhibit a thermal expansion rate in the interval between 1 . 8 * 10 − 6 to 2 . 3 * 10 − 6 k − 1 . it is a very low level of thermal expansion that corresponds well to the thermal expansion rates of integrated circuit boards . as stated earlier creation of the carbon source for the carbide plays an important role in achieving a high level of thermal conductivity . a series of experiment were conducted in order to quantify this phenomenon . carbon was added to the workpieces or formed in the workpiece in three different ways , then the workpieces were infiltrated with silicon melt and the thermal diffusivity of the sintered composite was measured . the diamond mixture forming the work piece was exactly the same , represented by sample composition a . the carbon sources supplied for the carbide formation were graphitization of the diamonds , pyrocarbon deposition in the workpiece and carbon powder mixed together with the diamond powder that forms the workpiece . the set up and results of the experiments are shown in table 3 . it is clearly shown that sample a , where no external carbon source has been provided , has the highest thermal diffusivity . the phase compositions of the samples were in this case determined by sem picture analysis of fractured surfaces to allow a calculated level of the conductivity . there are some variations in the phase compositions between the four different groups of samples . the reason for these differences in the final product is the difficulties to reach the exact same final composition when using different manufacturing routes . when external carbon was added ( b ; c ; d ) the residual amount of silicon in the final sample was reduced from around 10 % ( a ). this was especially the case when adding pyrocarbon ( b ; c ), where less than 1 % silicon was seen . subsequently , the silicon carbide formation increased somewhat , but the overall phase shifts resulted in moderate differences in the c p - values used to calculate the level of thermal conductivity of the different samples , cf . table 3 . the above described variations are not large enough to explain the large difference in measured thermal diffusivity when external carbon is added . the importance of having carbon from diamond forming the surrounding sic - layer that extends into the skeleton structure of the composite allows an optimal lattice mechanism of phonon transport . table 3 shows the large influence of the origin of the carbon source on the thermal diffusivity . when the composite is made according to the present invention , the final level of thermal conductivity exceeds that of metals , one of the best being copper with λ = 400 w / mk and α = 1 , 16 cm 2 / s thermal diffusivity was measured using laser flash technique . the top surface of the sample disc was irradiated with a laser , which provided an instantaneous energy pulse . the laser energy was absorbed by the top surface and traveled through the sample . immediately after the laser flash has been emitted , the temperature of the rear face was monitored for heat radiation , which was detected using a photovoltaic infrared detector . the laser pulse raised the temperature of the sample with only a few degrees . the thermal diffusivity ( α ) was calculated from the thickness ( l ) of the sample and the time required for the temperature of the rear surface to reach half of the total temperature rise ( t 1 / 2 ) using the equation α = kl 2 / t 1 / 2 where k is a constant . the laser flash equipment used was a ulvac sinkt - rilco tc - 700 / melt with neodymium glass laser that has oscillating wavelength 1 . 064 μm and an indium antimony irl detector that was cooled with a liquid nitrogen . the dimensions of the samples were discs with 10 mm diameter and a thickness of 4 - 5 mm . the measurements were done at room temperature , the pulse width 0 . 88 ms , pulse duration 0 . 3 ms , pulse diameter 15 mm , pulse energy 15 j / pulse and voltage 2 . 4 kv . the thermal conductivity λ was then calculated using the equation α = λ / c p ρ , where c p is the thermal capacity and ρ the density . the thermal capacity c p was calculated according to c p = σ ( ρ i φ i c i )/ ρ scd where ρ scd is the density of the sintered composite , ρ i the density of each phase , φ i is the volume part of each phase and c i is the thermal capacity of each phase .