fig1 a through 1c illustrate the structure and operation of a tip assembly 100 for a data storage device including the data storage medium according to the embodiments of the present invention . in fig1 a , probe tip assembly 100 includes a u - shaped cantilever 105 having flexible members 105 a and 105 b connected to a support structure 110 . flexing of members 105 a and 105 b provides for substantial pivotal motion of cantilever 105 about a pivot axis 115 . cantilever 105 includes an indenter tip 120 fixed to a heater 125 connected between flexing members 105 a and 105 b . flexing members 105 a and 105 b and heater 125 are electrically conductive and connected to wires ( not shown ) in support structure 110 . in one example , flexing members 105 a and 105 b and indenter tip 120 are formed of highly - doped silicon and have a low electrical resistance , and heater 125 is formed of lightly doped silicon having a high electrical resistance sufficient to heat indenter tip 120 , in one example , to between about 100 ° c . and about 500 ° c . when current is passed through heater 125 . the electrical resistance of heater 125 is a function of temperature . also illustrated in fig1 a is a storage medium ( or a recording medium ) 130 comprising a substrate 130 a , and a cured polyaryletherketone resin layer 130 b . in one example , substrate 130 a comprises silicon . in one example , curing is performed at a temperature between about 300 ° c . and about 400 ° c . cured polyaryletherketone resin layer 130 b may be formed by solution coating , spin coating , dip coating or meniscus coating polyaryletherketone copolymer and reactive diluent formulations and performing a curing operation on the resultant coating . in one example , cured polyaryletherketone resin layer 130 b has a thickness between about 10 nm and about 500 nm . the composition of cured polyaryletherketone resin layer 130 b is described infra . an optional penetration stop layer 130 c is shown between cured polyaryletherketone resin layer 130 b and substrate 130 a . penetration stop layer 130 c limits the depth of penetration of indenter tip 120 into cured polyaryletherketone resin layer 130 b . turning to the operation of tip assembly 100 , in fig1 a , an indentation 135 is formed in cured polyaryletherketone resin layer 130 b by heating indenter tip 120 to a writing temperature t w by passing a current through cantilever 105 and pressing indenter tip 120 into cured polyaryletherketone resin layer 130 b . heating indenter tip 120 allows the tip to penetrate the cured polyaryletherketone resin layer 130 b forming indentation 135 , which remains after the tip is removed . in a first example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip being not greater than about 500 ° c ., to form indentation 135 . in a second example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip being not greater than about 400 ° c ., to form indentation 135 . in a third example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip being between about 200 ° c . and about 500 ° c ., to form indentation 135 . in a fourth example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip being between about 100 ° c . and about 400 ° c ., to form indentation 135 . as indentations 135 are formed , a ring 135 a of cured polyaryletherketone resin is formed around the indentation . indentation 135 represents a data bit value of “ 1 ”, a data bit value of “ 0 ” being represented by an absence of an indentation . indentations 135 are nano - scale indentations ( several to several hundred nanometers in width ). fig1 b and 1c illustrate reading the bit value . in fig1 b and 1c , tip assembly 100 is scanned across a portion of cured polyaryletherketone resin layer 130 b . when indenter tip 120 is over a region of cured polyaryletherketone resin layer 130 b not containing an indentation , heater 125 is a distance d 1 from the surface of the cured polyaryletherketone resin layer ( see fig1 b ). when indenter tip 120 is over a region of cured polyaryletherketone resin layer 130 b containing an indentation , heater 125 is a distance d 2 from the surface of the cured polyaryletherketone resin layer ( see fig1 c ) because the tip “ falls ” into the indentation . d 1 is greater than d 2 . if heater 125 is at a temperature t r ( read temperature ), which is lower than t w ( write temperature ), there is more heat loss to substrate 130 a when indenter tip 120 is in an indentation than when the tip is not . this can be measured as a change in resistance of the heater at constant current , thus “ reading ” the data bit value . it is advantageous to use a separate heater for reading , which is mechanically coupled to the tip but thermally isolated from the tip . a typical embodiment is disclosed in patent application ep 05405018 . 2 , 13 jan . 2005 . “ erasing ” ( not shown ) is accomplished by positioning indenter tip 120 in close proximity to indentation 135 , heating the tip to a temperature t e ( erase temperature ), and applying a loading force similar to writing , which causes the previously written indent to relax to a flat state whereas a new indent is written slightly displaced with respect to the erased indent . the cycle is repeated as needed for erasing a stream of bits whereby an indent always remains at the end of the erase track . t e is typically greater than t w . the erase pitch is typically on the order of the rim radius . in a first example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip is not greater than about 500 ° c ., and the erase pitch is 10 nm to eliminate indentation 135 . in a second example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip is not greater than about 400 ° c ., and the erase pitch is 10 nm to eliminate indentation 135 . in a third example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip is between about 200 ° c . and about 400 ° c ., and the erase pitch is 10 nm to eliminate indentation 135 . in a fourth example , the cured polyaryletherketone resin layer 130 b is heated by heated indenter tip 120 , the temperature of the indenter tip is between about 200 ° c . and about 500 ° c ., and the erase pitch is 10 nm to eliminate indentation 135 . fig2 is an isometric view of a local probe storage array 140 including the data storage medium according to the embodiments of the present invention . in fig2 , local probe storage array 140 includes substrate 145 having a cured polyaryletherketone resin layer 150 ( similar to cured polyaryletherketone resin layer 130 b of fig1 a , 1 b and 1 c ), which acts as the data - recording layer . an optional tip penetration stop layer may be formed between cured polyaryletherketone resin layer 150 and substrate 145 . in one example , substrate 145 comprises silicon . cured polyaryletherketone resin layer 150 may be formed by solution coating , spin coating , dip coating or meniscus coating uncured polyaryletherketone resin formulations and performing a curing operation on the resultant coating . in one example , cured polyaryletherketone resin layer 150 has a thickness between about 10 nm and about 500 nm and a root mean square surface roughness across a writeable region of cured polyaryletherketone resin layer 150 of less than about 1 . 0 nm across the cured polyaryletherketone resin layer . the composition of cured polyaryletherketone resin layer 150 is described infra . positioned over cured polyaryletherketone resin layer 150 is a probe assembly 155 including an array of probe tip assemblies 100 ( described supra ). probe assembly 155 may be moved in the x , y and z directions relative to substrate 145 and cured polyaryletherketone resin layer 150 by any number of devices as is known in the art . switching arrays 160 a and 160 b are connected to respective rows ( x - direction ) and columns ( y - direction ) of probe tip assemblies 100 in order to allow addressing of individual probe tip assemblies . switching arrays 160 a and 160 b are connected to a controller 165 which includes a write control circuit for independently writing data bits with each probe tip assembly 100 , a read control circuit for independently reading data bits with each probe tip assembly 100 , an erase control circuit for independently erasing data bits with each probe tip assembly 100 , a heat control circuit for independently controlling each heater of each of the probe tip assembles 100 , and x , y and z control circuits for controlling the x , y and z movement of probe assembly 155 . the z control circuit controls a contact mechanism ( not shown ) for contacting the cured polyaryletherketone resin layer 150 with the tips of the array of probe tip assemblies 100 . during a write operation , probe assembly 155 is brought into proximity to cured polyaryletherketone resin layer 150 and probe tip assemblies 100 are scanned relative to the cured polyaryletherketone resin layer . local indentations 135 are formed as described supra . each of the probe tip assemblies 100 writes only in a corresponding region 170 of cured polyaryletherketone resin layer 150 . this reduces the amount of travel and thus time required for writing data . during a read operation , probe assembly 155 is brought into proximity to cured polyaryletherketone resin layer 150 and probe tip assemblies 100 are scanned relative to the cured polyaryletherketone resin layer . local indentations 135 are detected as described supra . each of the probe tip assemblies 100 reads only in a corresponding region 170 of cured polyaryletherketone resin layer 150 . this reduces the amount of travel and thus the time required for reading data . during an erase operation , probe assembly 155 is brought into proximity to cured polyaryletherketone resin layer 150 , and probe tip assemblies 100 are scanned relative to the cured polyaryletherketone resin layer . local indentations 135 are erased as described supra . each of the probe tip assemblies 100 erases only in a corresponding region 170 of cured polyaryletherketone resin layer 150 . this reduces the amount of travel and thus time required for erasing data . additional details relating to data storage devices described supra may be found in the articles “ the millipede — more than one thousand tips for future afm data storage ,” p . vettiger et al ., ibm journal of research and development . vol . 44 no . 3 , may 2000 and “ the millipede — nanotechnology entering data storage ,” p . vettiger et al ., ieee transaction on nanotechnology , vol . 1 , no , 1 , march 2002 . see also united states patent publication 2005 / 0047307 , published mar . 3 , 2005 to frommer et al . and united states patent publication 2005 / 0050258 , published mar . 3 , 2005 to frommer et al ., both of which are hereby included by reference in their entireties . turning to the composition of cured polyaryletherketone resin layer 130 b of fig1 a through 1c . it should be understood that for the purposes of the present invention curing a polymer implies cross - linking the polymer to form a cross - linked polymer or resin . the polyaryletherketone resin medium or imaging layer of the embodiments of the present invention advantageously meets certain criteria . these criteria include high thermal stability to withstand millions of write and erase events , low wear properties ( little or no pickup of material by tips ), low abrasion ( tips do not easily wear out ), low viscosity for writing , glassy character with no secondary relaxations for long data bit lifetime , and shape memory for erasability . cured polyaryletherketone resins according to embodiments of the present invention have high temperature stability while maintaining a low glass transition temperature ( tg ). in a first example , cured polyaryletherketone resins according to embodiments of the present invention have a tg of less than about 180 ° c . in a second example , cured polyaryletherketone resins according to embodiments of the present invention have a tg of between about 100 ° c . and about 180 ° c . the glass transition temperature should be adjusted for good write performance . to optimize the efficiency of the write process there should be a sharp transition from the glassy state to the rubbery state . a sharp transition allows the cured resin to flow easily when a hot tip is brought into contact and quickly return to the glassy state once the hot tip is removed . however , too high a t g leads to high write currents and damage to the probe tip assemblies described supra . a formulation of polyaryletherketone copolymer according to embodiments of the present invention comprises one or more polyaryletherketone copolymers , each polyaryletherketone copolymer of the one or more polyaryletherketone copolymers having the structure : ( i ) m repeat units represented by the structure — r 1 — o — r 2 — o — interspersed with n repeat units represented by the structure — r 1 — o — r 3 — o —, and terminated by a first terminal group represented by the structure r 4 — o — and a second terminal group represented by the structure — r 1 — o — r 4 , or ( ii ) m repeat units represented by the structure — r 1 — o — r 2 — o — interspersed with n repeat units represented by the structure — r 1 — o — r 5 — o —, and terminated by a first terminal group represented by the structure r 4 — o — and a second terminal group represented by the structure — r 1 — o — r 4 , or ( iii ) m repeat units represented by the structure — r 1 — o — r 2 — o — interspersed with n repeat units represented by the structure — r 1 — o — r 3 — o —, terminated by a first terminal group represented by the structure r 6 — o — and a second terminal group represented by the structure — r 1 — o — r 6 , or ( iv ) m repeat units represented by the structure — r 1 — o — r 2 — o — interspersed with n repeat units represented by the structure — r 1 — o — r 5 — o —, a first terminal group represented by the structure r 6 — o — and a second terminal group represented by the structure — r 1 — o — r 6 ; wherein o = oxygen , and occurs as a link between all r groups ; wherein r 1 is selected from the group consisting of : wherein r 2 is selected from the group consisting of : wherein r 3 is selected from the group consisting of mono ( arylacetylenes ), mono ( phenylethynyls ), wherein r 4 is selected from the group consisting of mono ( arylacetylenes ), mono ( phenylethynyls ), wherein r 5 is selected from the group consisting of mono ( arylacetylenes ), mono ( phenylethynyls ), wherein r 6 is selected from the group consisting of mono ( arylacetylenes ), mono ( phenylethynyls ), wherein m is an integer of 2 or more , n is an integer of 1 or more , m is greater than n and m + n is from about 5 to about 50 . the molar ratio of a first repeat unit ( containing r 1 and r 2 groups ) to a second repeat unit ( containing either r 1 and r 5 groups or r 3 and r 2 groups ) in structures ( i ), ( ii ), ( iii ) and ( iv ) is kept greater than 1 , therefore the ratio m / n is greater than 1 . the acetylene moieties in the r 3 , r 4 , r 5 , and r 6 groups , whichever are present , react during thermal curing with each other to cross - link the polyaryletherketone copolymers into a polyaryletherketone resin by cyclo - addition . in a first example , polyaryletherketone copolymers according to embodiments of the present invention advantageously have a molecular weight between about 3 , 000 daltons and about 10 , 000 daltons . in a second example , polyaryletherketone copolymers according to embodiments of the present invention advantageously have a molecular weight between about 4 , 000 daltons and about 5 , 000 daltons . all materials were purchased from aldrich and used without further purification unless otherwise noted . 3 - iodophenol ( 5 . 00 gram , 22 . 7 mmol ), bis ( triphenylphospine ) palladium ( ii ) dichloride ( pdcl 2 ( pph 3 ) 2 ) ( 160 mg ), triphenylphospine ( pph 3 ) ( 420 mg ), and cui ( 220 mg ) were suspended in triethylamine ( net 3 ) ( 150 ml ) under an n 2 atmosphere . phenylacetylene ( 3 . 1 ml , 2 . 9 gram , 28 . 4 mmol , 1 . 25 eq ) was added by syringe . the reaction mixture was then stirred and heated to 70 ° c . using an oil bath for 38 hours . excess net 3 was removed under reduced pressure . the remaining solids were extracted with 3 × 50 ml diethyl ether , which was then filtered and evaporated . the crude product was purified by column chromatography ( silica , 3 : 1 hexanes - ethyl acetate ) to give 4 . 1 gram of an orange solid . further purification was accomplished by sublimation ( 100 ° c ., 28 mtorr ) to give 3 -( phenylethynyl ) phenol as a white solid ( 3 . 3 g , 75 % yield ). to a suspension of 3 - iodophenol ( 3 . 73 gram , 17 mmol ), pdcl 2 ( pph 3 ) 2 ( 120 mg ), cui ( 161 mg ), and pph 3 ( 333 mg ) in net 3 ( 100 ml ) under n 2 was added a solution of 3 - hydroxyphenylacetylene ( 2 . 00 gram , 17 mmol ) in net 3 ( 10 ml ). the mixture was stirred and heated to 70 ° c . using an oil bath for 18 h . excess net 3 was removed under reduced pressure , and the remaining solids were extracted with 4 × 50 ml diethyl ether which was then filtered and evaporated . the crude product was purified by suspending in 80 ml ch 2 cl 2 , stirring for 1 hour , and filtering to give the final product as a yellow powder ( 2 . 96 g , 83 % yield ). in a multi - necked flask equipped with a mechanical stiffing apparatus and a dean - stark trap , 4 , 4 ′- difluorobenzophenone ( 1 . 4187 gram , 6 . 502 mmol ), resorcinol ( 0 . 5326 g , 4 . 838 mmol ), 3 , 3 ′- dihydroxydiphenylacetylene ( 0 . 2540 g , 1 . 209 mmol ), 3 - hydroxydiphenylacetylene ( 0 . 1753 g , 0 . 9037 mmol ), and potassium carbonate ( 3 g , 22 mmol ) were suspended in a mixture of dimethylformamide ( dmf ) ( 10 ml ) and toluene ( 20 ml ). the reaction mixture was vigorously stirred and heated to 130 ° c . for 16 hours under a slow flow of dry nitrogen , and toluene was removed periodically via the dean - stark trap . at the end of the 16 h period , the temperature was increased to 150 ° c . for another 8 hours . the reaction was then cooled and the polymer was isolated by multiple precipitations using thf and methanol . molecular weights were adjusted by using different proportions of ( r 1 + r 2 ) to ( r 3 ) and several different molecular weight polymers were prepared . thus , the embodiments of the present invention provide for compositions of matter for the storage media that operate in the nanometer regime . the description of the embodiments of the present invention is given above for the understanding of the present invention . it will be understood that the invention is not limited to the particular embodiments described herein , but is capable of various modifications , rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention . therefore , it is intended that the following claims cover all such modifications and changes as fall within the true spirit and scope of the invention .