referring in particular to detailed aspects , diagrammatically illustrated in fig1 is a lidless module 10 , pursuant to the prior art , including a chip 12 mounted on a laminate or substrate 14 , representing an unshielded emi structure , wherein no emi protection is afforded . in that instance , emi radiation radiates from the electrical components 16 in multiple wavelengths and directions , as shown by the arrows 18 , in the absence of any protection . similarly , pursuant to the prior art , in the event of utilizing a lidded module 20 where the lid 22 is electrically grounded , as shown in fig2 of the drawings , the laminate 26 with the lid having an aperture 27 equal in size to the package , including the chip structure thereon , there is produced radiation by the chip and electrical components 24 along arrows 28 in fewer wavelengths and directions , although still not affording an adequate shielding against emi . as shown in the prior art configuration of fig3 , representing a lidded module 30 with ( conductive ) posts 32 , which are aligned with grounded bgas 34 , in that instance , eight ( 8 ) posts 32 grounded in nature are shown for the chip on laminate structure . this structure blocks radiation of shorter wavelengths than the configuration of fig2 , as shown by arrows 36 , but still does not provide for full protection against unwanted emi radiation . pursuant to the known technology , as also shown in fig4 , only applicable components are described hereinbelow , a side view of a module 50 shows the lid 52 with a grounded electrical connection 54 between the lid and a stiffener , a die or chip structure 58 being supported on a laminate carrier 60 having an adhesive 62 interposed thereon , and where the lid is grounded to an adhesive , which is of a thermal nature . again , there is inadequate structure provided in that module to implement a solid barrier against emi radiation , particularly that derived from external sources . pursuant to the present invention , as illustrated in fig5 of the drawings , a module 70 has a laminate or substrate 72 with a die or chip 74 positioned thereon . a lid bond 76 connects a one - piece lid 78 , which is superimposed thereon , and is encompassed , or partially encompassed , by a conductive shield 80 . adhesive conductive material 82 interposed between the conductive shield 80 , the laminate 72 , and the lid 78 , so to sealingly form , or partially sealingly form , a closed structure . the adhesive conductive material 82 may be in the form of a tape , creates a faraday cage , wherein the maximum frequency is limited by the size of the gap , or gaps , in the conductive shield 80 . thus , a 1 mm gap in the conductive shield will block radiation of wavelength longer than 2 mm , or 150 ghz in air . any electrically conductive lid 78 can be used , such as a one - piece lid . the sides of the faraday cage can be made with a precut adhesive - backed conductive tape . for example , these tapes are available from 3m in ⅛ inch widths ; commercially designated as material 1126 , 35 μm cu , 88 μm with adhesive , material 1170 , 50 μm al , 81 μm with adhesive , material 1181 , 35 μm cu , 66 μm with adhesive , or alternatively , fabric - backed materials are readily available for providing an enhanced durability . moreover , the sides of the faraday cage can also be produced by being dispensed as a viscous fluid that cures into a conductive solid state . also , tape - based conductors can be cut and then placed into position with a rolling toolhead . the sides of the faraday cage contact the laminate electrically through landing pads or strips on the laminate surface . these sides can be connected locally to the ground plane of the card or a third - level package through local package vias and the package - card interconnect . even with a 1 mm gap , there is obtained a shielding , which extends well beyond 100 ghz , in effect , more than an order of magnitude improvement in bandwidth . from the foregoing , it becomes readily apparent that there is provided an advantageous structure in em protection and forming an emi barrier . while the present invention has been particularly shown and described with respect to preferred embodiments thereof , it will be understood by those skilled in the art that the foregoing and other changes in forms and details may be made without departing from the scope and spirit of the present invention . it is therefore intended that the present invention not be limited to the exact forms and details described and illustrated , but fall within the scope of the appended claims .