the invention is described more fully hereinafter with reference to the accompanying drawings , in which exemplary embodiments of the invention are shown . this invention may , however , be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein . rather , these embodiments are provided so that this disclosure will be thorough and complete , and will fully convey the scope of the invention to those skilled in the art . in the drawings , the size and relative sizes of layers and regions may be exaggerated for clarity . the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention . as used herein , the singular forms “ a ”, “ an ” and “ the ” are intended to include the plural forms as well , unless the context clearly indicates otherwise . it will be further understood that the terms “ comprises ” and / or “ comprising ,” when used in this specification , specify the presence of stated features , integers , steps , operations , elements , and / or components , but do not preclude the presence or addition of one or more other features , integers , steps , operations , elements , components , and / or groups thereof . embodiments of the invention are described herein with reference to illustrations that are schematic illustrations of idealized embodiments ( and intermediate structures ) of the invention . as such , variations from the shapes of the illustrations as a result , for example , of manufacturing techniques and / or tolerances , are to be expected . thus , embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result , for example , from manufacturing . unless otherwise defined , all terms ( including technical and scientific terms ) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs . it will be further understood that terms , such as those defined in commonly used dictionaries , should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein . fig1 is a perspective view of a display case having an exemplary sealed transparent lcd assembly 200 . generally , the display case includes a housing 105 , to which a door frame assembly 100 is fastened . in this embodiment , a cavity 110 is provided below the door frame assembly 100 where various electronic devices 111 for operating the transparent lcd assembly 200 can be located . the electrical devices 111 may include any or all of the following : timing and control board ( tcon ), video player , hard drive / storage , microprocessor / cpu , wireless transmitter / receiver , cellular data transmitter / receiver , and internet connectivity . at least some of the electrical devices 111 are in electrical communication with the transparent lcd 230 . fig2 is a perspective view of the display case of fig1 where the door has been opened . fig3 is a perspective view of the sealed transparent lcd assembly 200 of fig1 - 2 . generally speaking , the assembly includes a spacer 300 which is sandwiched between a front glass 225 and rear glass 205 . these components are preferably sealed together with an inert gas filling the sealed enclosure . although not required for every embodiment , argon gas has been found to be preferred in the exemplary embodiments . for sealing these components together , it is preferable to use a hot melt polyurethane . preferably , the spacer 300 is the super spacer ® standard from quanex in cambridge , ohio . www . quanex . com . in an exemplary embodiment , the spacer 300 would be a flexible foam that contains a desiccant and has a pressure sensitive acrylic adhesive on the front and back edges of the spacer which would be used to bond with the front and rear glass . fig4 is a front planar view of the sealed transparent lcd assembly , showing the section lines a - a and b - b . fig5 is a section view taken along the section line a - a shown in fig4 and indicating detail a and detail b . fig6 is a section view taken along the section line b - b shown in fig4 and indicating detail c . fig7 is a detailed section view of detail a shown in fig5 . a top thermal plate 216 is preferably bonded to the rear glass 205 . in an exemplary embodiment , the top thermal plate 216 is preferably bonded to the rear glass 205 through adhesive transfer tape . an exemplary adhesive transfer tape for this purpose would be 468 mp , available commercially from 3m ™ of st . paul , minn . www . 3m . com / converter . a printed circuit board ( pcb ) 246 containing a plurality of leds 276 is preferably attached to the top thermal plate 216 and is preferably in conductive thermal communication with the top thermal plate 216 as well . in this way , heat that is generated by the leds 276 can be transmitted to the pcb 246 , top thermal plate 216 , and eventually transferring to the rear glass 205 where the heat can dissipate through natural or forced convection . the leds 276 are placed adjacent to the edge of a light guide 220 which is sandwiched between a rear bracket 211 and a front bracket 236 . generally speaking , the light guide 220 is only constrained from movement towards the front or back of the assembly , but is not constrained from movement towards the top or sides of the assembly . in other words , the light guide 220 is secured such that it is capable of thermal expansion / contraction in the x - y direction ( horizontal and vertical when observing the lcd ), but is fixed in the z direction ( into / out of the assembly when observing the lcd ). it could also be said that the light guide 220 is constrained so that it cannot move towards the front or rear glass but otherwise is permitted to float between the rear bracket 211 and front bracket 236 . in an exemplary embodiment , the light guide 220 would be the acrylite ® led endlighten product available from evonik industries . www . acrylite - shop . com . preferably , the light guide 220 would contain microscopic diffuse particulate that is homogeneously scattered throughout the sheet . also preferably , the light emitted from the leds 276 and 275 is permitted to exit both the front and rear surfaces of the light guide 220 ( in this way , the light guide 220 could be referred to as a ‘ two way light guide ’). in an exemplary embodiment , the light is permitted to exit the rear of the light guide 220 so as to illuminate the products within the display case . thus , it is preferable that the amount of light permitted to exit the rear surface of the light guide 220 is at least 20 % of the amount of light permitted to exit the front surface of the light guide 220 . the transparent lcd 230 is preferably attached to a front surface of the front bracket 236 through a layer of adhesive 241 which would preferably be applied around the perimeter of the lcd 230 . in an exemplary embodiment , the adhesive 241 would be vhb tape and preferably 5052 vhb tape available commercially from 3m ™ of st . paul , minn . www . 3m . com . fig8 is a detailed section view of detail b shown in fig5 . a bottom thermal plate 215 is preferably bonded to the rear glass 205 . in an exemplary embodiment , the bottom thermal plate 215 is preferably bonded to the rear glass 205 through adhesive transfer tape . an exemplary adhesive transfer tape for this purpose would be 468 mp , available commercially from 3m ™ of st . paul , minn . www . 3m . com / converter . a printed circuit board ( pcb ) 245 containing a plurality of leds 275 is preferably attached to the bottom thermal plate 215 and is preferably in conductive thermal communication with the bottom thermal plate 215 as well . in this way , heat that is generated by the leds 275 can be transmitted to the pcb 245 , bottom thermal plate 215 , and eventually transferring to the rear glass 205 where the heat can dissipate through natural or forced convection . the leds 275 are placed adjacent to the edge of a light guide 220 which is sandwiched between a rear bracket 211 and a front bracket 236 . as discussed at length above , the light guide 220 is preferably only constrained from movement towards the front or back of the assembly , but is not contained from movement towards the top or sides of the assembly . fig9 is a detailed section view of detail c shown in fig6 . fig1 is a perspective view of a partially assembled exemplary embodiment of a sealed transparent lcd assembly . this view shows the rear glass 205 with the spacer 300 attached around the perimeter of the glass 205 . also shown is the rear bracket 211 which may be attached to the rear glass 205 as well . fig1 is a simplified partial view of an exemplary embodiment of the lower thermal plate 215 . in a preferred embodiment , the lower thermal plate 215 would extend horizontally as far as possible , preferably to the same horizontal width as the lcd 230 and may extend 4 - 14 inches in vertical width , depending on the application . in this embodiment , electrical devices 400 are mounted to the thermal plate 215 and can include , but are not limited to : power modules , wireless or satellite receiver / transmitter , video player , hard drive , microprocessor , and printed circuit boards . although shown attached to the lower thermal plate 215 , electrical devices 400 could also be mounted to the upper thermal plate 216 . preferably , the electrical devices 400 are also in conductive thermal communication with the thermal plate 215 / 216 so that heat which is generated by the electrical devices 400 can be transferred to the thermal plate 215 / 216 and eventually to the rear glass 205 , where it can be removed by natural or forced convection . fig1 is a simplified partial view of an exemplary embodiment of the upper thermal plate . again , in a preferred embodiment , the upper thermal plate 216 would extend horizontally as far as possible , preferably to the same horizontal width as the lcd 230 . the upper thermal plate 216 may also extend 4 - 14 inches in vertical width , depending on the application . while not required , it is also preferred that the lower thermal plate 215 and the upper thermal plate 216 are within 15 % of the same surface area . in other words , it is preferred that the plates 215 / 216 are substantially the same surface area . this is not required , however , as some embodiments may require a larger surface area for the plate which would contain the electrical devices 400 , or a larger surface area for the top plate 216 as compared to the bottom plate 215 . it is preferred that the thermal plates are both metallic , and most preferably aluminum , but they can be any material that has good thermal conductivity . the embodiments of the cooling system described herein can be used with any number of display case designs , either temperature controlled or not , and with doors that open , or glass that remains stationary . although shown here with a transparent lcd , the cooling system could be used with a traditional backlit lcd as well . having shown and described a preferred embodiment of the invention , those skilled in the art will realize that many variations and modifications may be made to affect the described invention and still be within the scope of the claimed invention . additionally , many of the elements indicated above may be altered or replaced by different elements which will provide the same result and fall within the spirit of the claimed invention . it is the intention , therefore , to limit the invention only as indicated by the scope of the claims .