fig4 shows a schematic representation of a side view of the dual mr sensor assembly 33 of this invention . the mr data sensor 34 is disposed immediately to the left of the mr servo sensor 36 . servo sensor 36 is offset by about 0 . 72 microns from data sensor 34 along the direction of recording medium motion . thus , dual sensor assembly 33 can be used to read two side - by - side data and servo tracks on a magnetic recording medium ( not shown ) where the servo signal output is offset from the data signal output by the temporal equivalent of 0 . 72 microns . the 1 . 0 micron separation from the p 1 shield substrate 38 achieves a more uniform microtrack profile in servo sensor 36 to ensure high accuracy servoing of the tape head ( not shown ). in comparison to servo sensor 36 , data sensor 34 is a high - resolution broadband read element that is separated from p 1 shield substrate 38 by only 0 . 28 microns of alumina ( al 2 o 3 ) insulating material in the i 1 layer 40 . the p 2 shield layer 42 is similarly spaced from the mr stripe 44 by the 0 . 32 micron alumina i 2 insulating layer 46 . thus , data sensor 34 includes a double - shielded mr stripe 44 essentially centered in a shield gap ( b ) of 0 . 68 microns . this narrow gap between shields 38 and 42 gives good high frequency performance in support of high density recording on the data track ( not shown ). servo sensor 36 can be operated at a lower frequency because it need provide only a signal for mechanically positioning sensor assembly 33 in response to a previously recorded servo track ( not shown ). the outer ( p2 ) shield is absent in servo sensor 36 . by elevating the mr stripe 48 from substrate shield 38 and removing the p 2 shield ( not shown ), the effects of both the soft film biasing ( sfb ) element ( fig6 ) underlaying mr stripe 48 and the hard film stabilizing magnets 50 and 52 can be dramatically improved , as shown in fig7 . referring to fig7 three longitudinal magnetic field profiles are shown as a function of position along the longitudinal axis of mr stripe 48 . each of the three curves in fig7 represents the magnetic field profile for a different thickness of i 1 layer 40 separating stripe 48 from p 1 shield substrate 38 . at 0 . 28 microns separation , the longitudinal field magnitude is inadequate for modern servo - positioning applications because the longitudinal magnetic field biasing in mr stripe 48 varies by a 20 : 1 ratio from center to ends of mr stripe 48 . by adding a 0 . 72 micron insulating layer 54 under stripe 48 , the separation from p 1 substrate 38 is increased to one micron , which improves the longitudinal field profile by over 500 % to a 4 : 1 ratio . a two micron separation improves the field profile ratio to less than 3 : 1 , which is a mere 30 % additional improvement . an additional improvement in microtrack uniformity and noise levels results from adding the grating pattern under mr stripes 48 and 44 in fig4 . the top view of the grating pattern preferred for this invention is shown in fig5 . referring to fig5 a single thin film sensor is illustrated . either data sensor 34 or servo sensor 36 can be understood from fig5 the precise structure preferred for the hard - film stabilized soft - film biased mr sensor 55 of this invention . these details are further described in fig6 for single mr sensor 55 . the preferred grating pattern 56 consisting of a series of grooves , exemplified by groove 68 , oriented at approximately 45 degrees with respect to the longitudinal axis of sensor 55 . fig6 shows a section through sensor 55 . the hard film stabilizing magnets 74 and 76 are deposited in the passive end regions of sensor 55 . region 78 also contains a layer of soft film biasing ( sfb ) magnetic material 80 that is spaced from the magnetoresistive material layer 82 by a thin spacing layer 83 . the active central region 78 is the only region containing magnetoresistive material 82 . in the preferred embodiment of sensor 55 , sfb layer 80 consists of niferh and thin spacing layer 83 consists of ta . the grating notches are not shown to scale in fig6 . fig5 shows the typical dimensions for preferred sensor 55 . central active region 78 is 36 microns long and each of the passive end regions 74 and 76 contains a hard film biasing magnet layer of coptcr that is also 36 microns long . hard film stabilizing magnets 74 and 76 are equipped with tabs for contact with the gold lead films 82 and 84 shown . the gold tabs are recessed from the abs to avoid corrosive interaction with other metal alloys at the abs . these tabs are approximately 13 microns in length . note that the grooves exemplified by groove 68 are disposed at a center - to - center separation of three microns and are separated by ridges of approximately 1 . 5 microns in width . following completion of the assembly fabrication , magnets 74 and 76 are then initialized with an external magnetic field to achieve very high linearity and low barkhausen noise levels . the depth of the etched pattern is adjusted to the thickness of sfb layer 80 in mr stripe 44 , which is typically 30 to 60 nm . electrical contact is made through the junctions between gold layers 83 and magnetic layers 74 and 76 and the junctions between magnetic layers 74 and 76 and mr stripe 78 . the depth of the etched pattern is nominally 45 nm with a lower limit of about 30 nm and an upper limit of about 80 nm . beyond the sfb trilayer thickness of 246 mm ( fig6 ), the portions of the mr elements that switch against the grooves and ridges begin to infringe on the linear operating region of the sensor . in fig5 a lap line 66 marks the eventual air bearing surface ( abs ) of the completed sensor assembly 55 . following completion of the thin film processing of this invention , the edge of completed assembly 33 ( fig4 ) is lapped or ground down to expose the edges of data sensor 34 and servo sensor 36 at abs 66 where the assembly contacts the magnetic storage medium . as already discussed , a grating pattern is provided under both mr strips 44 and 48 as well as all hard bias magnets 50 , 52 , 58 and 60 ( fig4 ). after complete head surface fabrication , hard bias magnets 50 , 52 , 58 and 60 are initialized with an external magnetic field of over 300 ka / m to achieve very high linearity and low barkhausen noise in both respective mr sensors 34 and 36 . the grating patterns act to trap domain walls mechanically between the grating edges and thereby reduce or eliminate barkhausen noise arising from rapid and unpredictable domain wall shifts during changes in external magnetic field in the manner known in the art . the effects of a 45 nm pattern groove depth compared with those of an 84 . 5 nm pattern groove depth in mr elements are shown in fig9 for a sfb trilayer thickness of 246 mm . fig9 a shows eight measured samples from a prototype substrate having 45 nm groove depths and fig9 b shows eight such sample measurements from a prototype having 84 . 5 nm groove depths . note that several of the quasi - static loops in fig9 b are open very close to the sensor biasing point , which can cause unstable and non - linear operation for large driving signals ( e . g ., sample numbers 24 and 32 ). the effects of a 45 nm groove depth in comparison with those of no grating pattern in mr elements can be appreciated with reference to fig1 . fig1 a provides eight samples from a prototype having no grating pattern and fig1 b provides eight examples with 45 nm groove depth . note that the mr element response is very nonlinear in fig1 a , leading to unacceptable distortion . the results in fig1 b clearly show the linearizing effect of adding a 45 nm grating pattern under the sensing element . to produce the elevated grating pattern under servo sensor 36 , a novel replication technique is employed . the pattern is replicated by depositing second insulating layer 54 on top of a first grating pattern 70 ( fig4 ). the unexpectedly advantageous results of this replication method are illustrated in fig8 wherein fig8 a shows the measured vertical elevation of grating pattern 70 on i 1 layer 40 and fig8 b shows the measured vertical elevation of the elevated grating pattern under mr sensor 48 ( fig4 ). the groove depth in fig8 a is approximately 45 nm and the groove depth in fig8 b is approximately 50 nm , showing no significant deterioration resulting from the growth of second insulating layer 54 . these results confirm that mr stripe 48 and mr stripe 44 both obtain equally effective grating patterns through the simplified fabrication method of this invention . the i 2 insulating layer 41 is capped before final deposition of p 2 shield layer 42 with a 100 nm silicon dioxide layer 72 over servo sensor 36 only . following deposition of p 2 layer 42 , that portion of layer 42 over servo sensor 36 is removed by etching down to barrier layer 72 . the 0 . 1 micron sio 2 layer 72 acts as a superior etch stop during p 2 removal because of the deposition parameters allowing minimal pinhole formation and maximum coverage of the numerous i 2 alumina pinholes and structural topographies . thus , barrier layer 72 allows production yield improvements without significant increase in the number of processing steps unique to the servo sensor 36 . fig1 a - 11c , 11e , 11g , 11i , 11k , 11l , 11o , 11t and 11v , hereinafter referred to as fig1 group , show twenty - three fabrication processing steps as explained in fig1 a - 12w for the sensor fabrication methods of this invention . steps in fig1 a - 12w are not all accompanied with a separate figure in the fig1 group . the process begins with a nizn substrate 86 shown in fig1 a and 12a , which constitutes the p 1 shield substrate . in fig1 b and 12b , the first i 1 layer 92 is formed by sputtering 0 . 28 microns of alumina on top of substrate 38 . in fig1 c and 12c , a grating or chevron pattern is milled into the top of layer 92 at two locations . the first pattern is milled in the data sensor region 94 and the second pattern is milled in the servo sensor region 96 . the grooves in patterns 94 and 96 are masked and milled to a depth of 45 nm plus or minus 15 nm . the milled patterns are then cleaned and a resist layer ( not shown ) is added in the step of fig1 d . fig1 e and 12e show the deposition of the 0 . 72 micron servo elevation layer 98 , which may include either silicon dioxide or alumina . in the step of fig1 f , the masked region ( not shown ) is lifted off to leave layer 98 over servo sensor region 96 only as shown in fig1 e . the specific lift - off technique prevents action on adjacent structural areas that may cause performance instability . sputtered elevation layer 98 replicates the grating pattern virtually unaltered , thereby allowing formation of all grating patterns in the assembly through the single step in fig1 c . fig1 g and 12g show the sputtering of the soft film biasing ( sfb ) and magnetoresistive ( mr ) layers in the central active regions 100 and 102 . the details of these layers 100 and 102 can be appreciated with reference to the above discussion in connection with fig6 . sfb layer 80 ( fig6 ) is deposited first to a thickness of 27 nm . separation layer 84 ( fig6 ) is then deposited to a thickness of 20 nm followed by mr film layer 82 ( fig6 ) to a thickness of 35 nm . the sfb layers in the central active regions 100 and 102 are preconditioned by exposure to a magnetic field and heat in a manner known in the art for aligning magnetic domains . the total layer thickness of the sfb layers in the central active regions 100 and 102 is approximately 82 nm following completion of the step in fig1 g . in the step of fig1 h , a sputter etching technique is used to remove material from a masked area ( not shown ) preparatory to the next step . fig1 i and 12i show the depositing of the hard bias film layer in the passive end regions 104 and 106 of data sensor region 94 and the passive end regions 108 and 110 of servo sensor region 96 . the hard film stabilizing magnetic layer 104 , 106 , 108 and 110 consists of 15 nm of cr followed by 105 nm of coptcr for a total layer thickness of about 120 nm . the step of fig1 j is a second sputter etching of a masked area ( not shown ) that defines the final mr and hard film magnet geometries . fig1 k and 12k show the deposition of the gold conductors 112 , 114 , 116 and 118 at each end of both mr sensors . the gold conductor layer consists of 15 nm of ti followed by 200 nm of gold topped off with another 5 nm of ti for a total layer thickness of 220 nm . these initial gold lead structures are formed using a lift - off technique and evaporative deposition and are recessed from the abs to avoid corrosive reactions upon exposure to air . in fig1 l and 12l , the alumina i 2 insulating layer 120 is deposited to a depth of 0 . 32 microns plus or minus 10 % over the entire assembly . the steps in fig1 m and 12n represent the usual subsequent masking , etching , cleaning and resist steps preparatory to the deposition of a 100 nm silicon dioxide etch stop layer 122 in fig1 o . note that etch stop layer 122 is deposited only over servo sensor region 96 . etch stop layer 122 is patterned over the servo sensor region 96 alone by a lift off and sputter deposition technique . this step is very important ; without layer 122 , the pinholes through the alumina layer 120 may lead to later etching of the sensor element 102 during removal of p 2 layer 124 in the step of fig1 t . the silicon dioxide material in layer 122 is a superior etch stop because of deposition parameters permitting minimal pinhole formation and maximum coverage of the numerous alumina pinholes and structure topographies in layer 120 . thus , etch stop layer 122 allows yield improvements without significantly increasing the number or cost of the process steps needed for the servo sensor alone , which is an important feature of the fabrication method of this invention . the step in fig1 d is another routine cleaning and resist step ( not shown ) followed by deposition of a second gold conductor layer ( not shown ) in the step of fig1 q . these conductors are 2 . 5 microns in thickness and represent the primary electrical interconnections necessary between the sensing elements and the external package contacts . the step in 12r is yet another cleaning and resist step ( not shown ) preparatory to the subsequent shield deposition step in fig1 s . in the step in 12s , the p 2 shielding layer 124 is deposited over the entire assembly to a total thickness of 3 . 5 microns . p 2 layer 124 consists of 89 separate sputter depositions . the first of these is a 35 nm layer of nife . subsequent depositions include 44 alternative layer pairs of fe and nife deposited in nitrogen . during sputtering of p 2 layer 124 , a magnetic field is applied to the assembly to prealign the p 2 magnetic domains in a manner known in the art . following deposition of p 2 layer 124 , the step in fig1 t provides for the routine cleaning , masking , ion milling , etching , masking and chemical removing steps leading to removal of much of p 2 layer 124 , leaving the p 2 data sensor shield 126 shown in fig1 t . in fig1 u and 12u , an alumina overlayer 128 is deposited over the entire assembly to a thickness of 23 . 5 microns or more . the fabrication steps in fig1 v include the finishing , lapping and deposition of a 200 nm cr layer ( not shown ). finally , the step in fig1 w provides electrical interconnections between sensors and external package controls ( not shown ). the assembly is cut back to the abs line 66 shown in fig5 during the lapping operation of the step in fig1 v . fig1 shows a schematic representation of a magnetic tape data storage device 180 employing the magnetic head 182 of this invention to read data and servo signals recorded on the magnetic tape medium 184 . clearly , other embodiments and modifications of this invention will occur readily to those of ordinary skill in the art in view of these teachings . therefore , this invention is to be limited only by the following claims , which include all such embodiments and modifications when viewed in conjunction with the above specification and accompanying drawing .