hereinafter , the present invention will be described in further detail with reference to examples according to the present invention and comparative examples not according to the present invention , but the scope of the present invention is not limited to the following examples . a moisture adsorbent solution was prepared by adding 100 g of calcined dolomite as a moisture adsorbent and toluene as a solvent to have a solid content of 50 wt %. 50 g of a polyisobutene resin ( weight average molecular weight : 450 , 000 ) as an encapsulating resin of a first layer , and 50 g of a hydrogenated dicyclopentadiene - based resin ( softening point : 125 ° c .) as a tackifier were added , and 20 g of a multifunctional acryl monomer ( tmpta ) and 1 g of a photoinitiator were diluted with toluene to have a solid content of approximately 25 wt %. the moisture adsorbent solution previously prepared was mixed thereto to homogenize . an encapsulating layer was formed to have a thickness of 40 μm by coating the previously prepared solution on a releasing surface of releasing pet and drying the coated surface at 110 ° c . for 10 minutes . an encapsulation film was manufactured by laminating the encapsulating layer on a cu side of a 12 μm copper film one side of which is coated with 15 μm polyimide , and wooden - pattern punching the laminated product in a size to be tested . here , the punching was performed on the releasing pet surface on which the encapsulating layer was formed . the encapsulation film manufactured as described in ( 1 ) was thermally laminated in vacuum on a glass substrate on which an organic electronic diode was deposited , and aged in an oven at 100 ° c . for 1 hour . an encapsulating layer was formed to have a thickness of 40 μm by coating the solution previously prepared in example 1 on a releasing surface of releasing pet and drying the coated surface at 110 ° c . for 10 minutes . an encapsulation film was manufactured by laminating the encapsulating layer on a cu side of a 12 μm copper film one side of which is coated with 15 μm polyimide , and wooden - pattern punching the laminated product in a size to be tested . here , the punching was performed on a metal side . except these , the process was performed as described in example 1 . an encapsulation film was manufactured by the same method as described in example 1 , except that 200 g of a silane - modified epoxy resin ( ksr - 177 , kukdo chemical co ., ltd .) and 150 g of a phenoxy resin ( yp - 50 , tohto kasei co ., ltd .) were added to a reaction vessel at room temperature , and diluted with methylethylketone ( mek ), and a first layer solution was prepared by adding 4 g of imidazole ( shikoku chemicals co ., ltd .) as a curing agent to the homogenized solution , and stirring the resulting solution at a high speed for 1 hour . an encapsulating layer was formed to have a thickness of 40 μm by coating the previously prepared solution on a releasing surface of releasing pet and drying the coated surface at 110 ° c . for 10 minutes . each of the encapsulating layer and the copper thin film used in example 1 was punched in a size of 5 cm × 5 cm , and the encapsulating layer was thermally laminated on a cooper side of the copper thin film sample . failures due to a tolerance generated in the lamination were evaluated . a moisture adsorbent solution was prepared by adding 100 g of calcined dolomite as a moisture adsorbent and toluene as a solvent to have a solid content of 50 wt %. 200 g of a silane - modified epoxy resin ( ksr - 177 , kukdo chemical co ., ltd .) and 150 g of a phenoxy resin ( yp - 50 , tohto kasei co ., ltd .) were added to a reaction vessel at room temperature , and diluted with mek . a solution for a moisture barrier layer was prepared by adding 4 g of imidazole ( shikoku chemicals co ., ltd .) as a curing agent to the homogenized solution , and stirring the resulting solution at a high speed for 1 hour . a solution for a second layer was prepared by adding the previously prepared moisture adsorbent solution to the solution for a moisture barrier layer to have a content of the calcined dolomite of 50 parts by weight relative to 100 parts by weight of the encapsulating resin of the second layer . an encapsulation film was manufactured by the same method as described in example 1 , except that an encapsulating layer was formed only of the second layer . an encapsulation film was manufactured by the same method as described in example 1 , except that 50 g of a polyisobutene resin ( weight average molecular weight : 450 , 000 ) as an encapsulating resin of an encapsulating layer and 60 g of a hydrogenated dicyclopentadiene - based resin ( softening point : 125 ° c .) as a tackifier were added into a reaction vessel at room temperature , and diluted with toluene to have a solid content of approximately 30 wt %. when an encapsulation film including a metal layer and an encapsulating layer was applied to an organic electronic diode , a difference in distance between the metal layer and the encapsulating layer was measured . when the metal layer was longer , it was represented as (+), and when the encapsulating layer was longer , it was represented as (−). throughout a process of removing a release film of an encapsulation film , and a process of laminating the encapsulation film on an organic electronic diode , when failure of removing the release film or contamination of laminating equipment due to the encapsulating layer occurred , it was represented as o . a sample was manufactured by laminating the film manufactured in the example or comparative example on a cover substrate , and thermal pressing the resulting substrate on a substrate in which ca was deposited on a center 3 mm inside from the outermost glass . afterward , the sample was maintained in a constant temperature and constant humidity chamber at 85 ° c . and a relative humidity of 85 % for approximately 300 hours . when the sample became transparent due to oxidation of calcium , it was represented as x , and when the sample was not transparent , it was represented as o .