one embodiment of the invention relates to a contact smart card having a single input / output that is inserted directly into a device and data is transferred through the single input / output of the contact smart card . additionally , blocks having integrated circuits are placed onto a substrate for forming a contact , contactless , or dual smart card which provides a distributed intelligence . by fabricating a flexible smart card using fluidic self assembly ( fsa ) described in u . s . pat . no . 5 , 545 , 291 , the cost of producing the smart card is reduced . the smart card has a smart card chip that contacts the display . the smart card also has a molded display cavity with a power , ground , single input / output interconnect formed in the backside of the display . this device may then receive signals and update data that is displayed . the backplane of the display may be comprised of a plurality of blocks in which each block has a circuit element thereon . the blocks are contained in a slurry that is deposited onto the flexible layer . although blocks may be comprised of a single crystal silicon or other like material that makes the block rigid , the flexible layer may still be flexible because the size of these blocks ( 50 × 100 microns or 100 × 100 microns ) is so small in comparison to the flexible layer . the flexible layer forms part of a display backplane . flexible displays may be either an active matrix or a passive matrix displays . in the following description , numerous specific details such as specific materials , processing parameters , processing steps , etc ., are set forth in order to provide a thorough understanding of the invention . one skilled in the art will recognize that these details need not be specifically adhered in order to practice the claimed invention . in other instances , well known processing steps , materials , etc . are not set forth in order not to obscure the invention . fig6 a - 6e illustrate the assembly of a contact smart card in accordance with one embodiment of the invention . fig6 a illustrates substrate 50 that is used in this process . the substrate may be either flexible or rigid . a rigid substrate may comprise glass , metal borosilicate glass , plastic , or silicon soda lime glass , or quartz . a flexible substrate may comprise flexible substrates or layers may include polyether sulfone ( pes ), polyester terephthalate , polycarbonate , polybutylene terephthalate , polyphenylene sulfide ( pps ), polypropylene , polyester , aramid , polyamide - imide ( pai ), polyimide , aromatic polyimides , polyetherimide , metallic materials , acrylonitrile butadiene styrene , polyvinyl chloride , polypropylene sulfate ( pps ) or other suitable material . fig6 b illustrates substrate 50 with different sized recessed regions for receiving objects that have the electrical circuitry for the assemblies . these recessed regions may be created by a variety of methods such as using a template or roller that have a protruding structure for creating recessed regions in the substrate . heat may be transferred to the substrate before and / or during the time in which a template or roller are used to create the recessed regions . fig6 c illustrates a random placement technique used such as fsa to place driver blocks 59 into recessed regions . driver blocks constitute electrical interface to the display ( e . g ., smart switches ). fig6 d illustrates blocks 14 with integrated circuits thereon placed into recessed regions of the substrate 50 using fsa . it will be appreciated that other techniques may be used to transfer blocks ( e . g ., display blocks and driver blocks ) such as through template transfer . the display blocks are coupled to a metallic lead with an epoxy other suitable adhesive used to ensure that blocks are fixed in their location . display blocks that have the integrated circuit thereon also may have bond pad . a wire lead may be formed between a bond pad and at least one display block . a bonding agent may be dispensed over the display blocks . the bonding agent is a conductive material such as solder paste or a conductive resin formed of metallic particles dispensed in a polymeric matrix . the bonding agent is disposed by screen printing , syringe dispensing , jetting , or the like . fig6 e illustrates a flexible layer 52 before it is coupled to the device in fig6 d . fig7 illustrates the top view of a substrate that has blocks deposited thereon having an integrated circuit thereon with power , ground , and data input / output leads coupled to a bank chip that transmits information such as bank account information . in one embodiment , a display interface may be manufactured with four leads or less for the transmission of data on , for example , on a smart card . a variety of data may be transmitted on the same lead such as instruction data , display data , clock , and orientation data . in another embodiment , three or more functional data such as data which is described above , are transmitted on the same lead . fig8 a and 8b illustrate the power , ground , and i / o leads coupled to a smart card chip and a display . the power , ground , i / o are connected to the smart card chip and to the display . the single i / o is used to transfer data from the smart card to a card reader . by using a single i / o , techniques of the invention offer improvements over conventional smart cards because a single i / o reduces the chances that an unscrupulous individual may breach the security of the data contained in the smart card . fig9 illustrates a contact smart card in which the top and bottom layers of the smart card are shown . the top layer has a face portion with a large receptor region for the display . in this embodiment , the top and bottom layer are comprised of a flexible material such as plastic . the large receptor region display in the top layer of the smart card may be used for the window of the display . when the contact smart card is inserted into a device that is capable of electrically mating with the contact smart card , data may be electronically transferred over the single input / output of the contact smart card discussed above . this data then is stored in a memory ( not shown ) within the blocks or coupled to the blocks . the display is the updated on the contact smart card . this is accomplished by the chip being coupled to the display and to a power , ground , and a single i / o lead as illustrated in fig1 . fig1 illustrates a planar side view of a smart card with at least two layers that are laminated together . electrical components are located between the two polymeric materials . for example , in a contactless smart card , a receiver such as an antenna is embedded on the face of the bottom layer . the antenna may be formed by winding an insulated copper wire on the surface of one of the layers . the antenna may be formed of insulated metallic wire comprising a metal core surrounded by an insulating coating . alternatively , the electrical element may be a conductive trace , a jumper trace , a capacitor , a resistor , or any electrical element that is able to send or receive signals . a smart card chip module is embedded in the top layer and the bottom layer of the smart card . the top layer and the bottom layer may be comprised of either a rigid or a flexible substrate . fig1 a and fig1 b illustrate a flow diagram for forming a contact smart card in accordance with one embodiment of the invention . at block 200 , blocks having integrated circuits thereon are placed onto a first substrate using a random method such as fsa . at block 210 , a single i / o , a power lead , and a ground lead are placed onto one of a first substrate and a second substrate . any conventional method may be used to perform this task . at block 220 , a display is placed onto one of a first or a second substrate . it will be appreciated that a display may be placed onto the first or second substrate before the i / o , power , or ground leads are placed onto one of the substrates . at block 230 , the blocks are electrically connected to the single i / o and to the display by placing , for example , an interconnect onto either the first substrate or the second substrate . at block 240 , n bits of data are transferred on a single i / o on a smart card . at block 250 , n bits of data are displayed on the display . fig1 a - 13b illustrate a flow diagram for forming a contactless smart card in accordance with one embodiment of the invention . at block 300 , blocks having integrated circuits thereon are deposited onto either a first substrate of a second substrate suing fsa . at block 310 , a receiver , power lead and a ground lead are placed onto either a first substrate or a second substrate . at block 320 , a display is placed onto either a first substrate or a second substrate . at block 330 , the blocks are connected to a receiver . at block 340 , n bits of data are transferred to a receiver on the contactless smart card . at block 350 , n bits of data are displayed . fig1 a - 14b illustrate a flow diagram for forming a dual smart card in accordance with one embodiment of the invention . at block 400 , blocks are placed onto a first substrate using random placement methods . at block 410 , a receiver such as an antenna , a power lead , and a ground lead are placed onto a first substrate . at block 420 , a display is placed onto a first or second substrate . dual smart cards generally use lcds , contact smart cards may be used with a variety of displays such as lcds , el displays , leds , oleds , u / dcp displays , and ep displays . at block 430 , the blocks are connected to the receiver and to a display using conventional means . at block 440 , n bits of data are transferred to a receiver such as an antenna on a dual smart card . at blocks 450 , n bits of data are displayed . listed below are related u . s . patent applications that describe various improvements to the methods and devices of the invention described herein . these patent applications are incorporated by reference . co - pending u . s . provisional patent application ser . no . 60 / 118 , 887 entitled “ apparatuses and methods for forming assemblies ”, filed by jeffrey jay jacobsen and assigned to the same assignee as the present invention , describes the formation of electronic assemblies . this co - pending application is hereby incorporated herein by reference . co - pending u . s . patent application ser . no . 09 / 270 , 157 entitled “ methods for transferring elements from a template to a substrate ”, filed by jeffrey j . jacobsen , mark a . hadley , and john s . smith and assigned to the same assignee of the present invention , describes transferring elements from a template . this co - pending application is hereby incorporated herein by reference . co - pending u . s . patent application ser . no . 09 / 270 , 165 entitled “ apparatus and methods for forming assemblies ”, filed by jeffrey jay jacobsen and assigned to the same assignee of the present invention , describes rolling or pressing blocks into a substrate . this co - pending application is hereby incorporated herein by reference . in the preceding detailed description , the invention is described with reference to specific embodiments thereof . it will , however , be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention as set forth in the claims . the specification and drawings are , accordingly , to be regarded in an illustrative rather than a restrictive sense .