according to an embodiment of the present disclosure , cmos with embedded source / drain stressors and cmos with raised source / drain may be formed having substantially equal distances d nfet or d pfet . in fig1 a - l the cmos devices are denoted as fet - 1 and fet - 2 . if fet - 1 is nfet , then fet - 2 will be pfets . similarly , if fet - 1 is pfet , then fet - 2 will be nfet . given a wafer , conventional cmos processing up to reox spacer 102 formation on a silicon - on - insulator ( soi ) substrate 101 leads to a thick - body pdsoi structure shown in fig1 a . an exemplary process for the formation of the structure of fig1 a includes an active area definition using pad oxidation , pad nitride deposition , active area lithography , active area etch , resist strip , optional shallow trench isolation ( sti ) liner deposition , sti oxide deposition , optional sti oxide densification anneal , and sti chemical mechanical polish ( cmp ); removal of any remaining sti oxide on active areas followed by removal of pad nitride ; channel implants ( also known as well implants ) using lithography , ion implantation , and resist strip ( performed once for nfets and once for pfets ); gate stack formation using pad oxide removal , oxidation to form the gate dielectric , poly si deposition to form the gate electrode , oxidation to form poly si screen oxide for gate ion implants ; optional gate pre - doping using photolithography , ion implantation , and resist strip ( performed once for nfets and once for pfets ); nitride and oxide cap layer deposition ( needed for selective epitaxy ); gate definition using lithography , gate stack etch , and resist strip ; and oxidation to form reox spacer 102 . after the formation of reox spacer 102 , a triple dielectric layer 103 , such as , nitride / oxide / nitride , is deposited , leading to the structure shown in fig1 b . photolithography is performed to cover fet - 1 in a photoresist 104 and expose fet - 2 . ion implantation is performed on a top layer of the exposed portion of the triple dielectric layer 103 to create implanted nitride top layer 105 . the implantation step modifies the etch properties of the top nitride layer . for example , a bf 2 implanted nitride can be etched by hydrofluoric acid while unimplanted nitride does not etch in hydrofluoric acid . the wafer is etched in an etchant that can etch both implanted nitride and the oxide beneath it but is selective to photoresist and unimplanted nitride , leading to the structure shown in fig1 d . one such etchant is hydrofluoric acid . nitride rie is performed with the photoresist intact and the photoresist 104 is then removed , leading to the structure shown in fig1 e . fet - 2 now has a nitride spacer with width d sp1 . a width of an inner nitride layer 103 ′ on fet - 1 sidewall is also d sp1 . a recess is created in fet - 2 sd regions and is followed by selective epitaxy of embedded sd stressor 105 , leading to the structure shown in fig1 f . the embedded sd stressor 105 for fet - 2 is denoted as six - 2 . six - 2 may be formed of sic when the fet - 2 is nfet and formed of sige when fet - 2 is pfet . the proximity of six - 2 sd to fet - 2 channel is d fet2 = d sp1 . the channel is formed directly below the respective gate electrode in the soi . having formed the embedded sd stressor 105 for fet - 2 , a single dielectric layer 106 , such as , nitride , is deposited , leading to the structure shown in fig1 g . photolithography is then performed to cover fet - 2 in a photoresist 107 and expose fet - 1 . ion implantation performed on a top nitride layer on fet - 1 to create implanted nitride top layer 108 , leading to the structure shown in fig1 h . the implantation modifies the etch properties of the top nitride layer . for example , as mentioned herein , bf 2 implanted nitride can be etched by hydrofluoric acid while unimplanted nitride does not etch in hydrofluoric acid . the wafers are etched in an etchant that can etch both implanted nitride and the oxide beneath it but is selective to photoresist and unimplanted nitride , leading to the structure shown in fig1 i . one such etchant is hydrofluoric acid . nitride rie is then performed with the photoresist intact and the photoresist 107 is then removed , leading to the structure shown in fig1 j . fet - 1 now has a nitride spacer with width d sp1 . a recess is then created in fet - 1 sd regions and is followed by selective epitaxy of an embedded sd stressor 109 , leading to the structure shown in fig1 k . the embedded sd stressor 109 for fet - 1 is denoted as six - 1 . six - 1 109 may be formed of sic if fet - 1 is nfet and formed of sige if fet - 1 is pfet . the nitride layers are removed using a nitride etchant , leading to the structure shown in fig1 l . the proximity of embedded six - 1 109 sd to fet - 1 channel ( d fet1 ) and embedded six - 2 105 sd to fet - 2 channel ( d fet2 ) are both substantially equal to d sp1 . thin - body fets can be similarly fabricated with a substantially equal proximity of the nfet and pfet raised source / drains ( rsd ) to the respective channels , leading to the thin - body field - effect transistor structure shown in fig2 . according to an embodiment of the present disclosure , a proximity of a rsd , e . g ., 201 , to a channel region directly below the gate electrode 202 plays a role in thin - body field - effect transistors ( fets ). as shown in fig2 , a soi region 203 underneath a disposable nitride spacer remains thin after rsd epitaxy because the soi region is covered by nitride during rsd epitaxy . this thin region of soi , referred to as the source / drain extension ( sde ) region 204 , is a source of series resistance for thin - body fets . the resistance of a region is directly proportional to its length . for thin - body fets , the length of the resistive sde region is the proximity of the rsd to the channel . a closer proximity , that is , smaller d nfet or d pfet , leads to lower series resistance , thereby leading to higher fet drive current and improved fet performance . having formed embedded sd or raised sd with equal proximity for both nfets and pfets , one can follow conventional processing for chip fabrication . having described embodiments for a system and method of discovering a network topology from routing information , it is noted that modifications and variations can be made by persons skilled in the art in light of the above teachings . it is therefore to be understood that changes may be made in the particular embodiments of the invention disclosed which are within the scope and spirit of the invention as defined by the appended claims . having thus described the invention with the details and particularity required by the patent laws , what is claimed and desired protected by letters patent is set forth in the appended claims .