in order to understand the technical content of the present invention clearly , the present invention is further exemplified by reference to the following embodiments . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 1 of the present invention are exemplified by reference to fig1 a ˜ fig . 1 i . fig1 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 1 of the present invention . in fig1 a , the conductive polymer chip 3 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on , the metal foils 2 are coated evenly on the upper and lower surfaces of the above - mentioned conductive polymer chip 3 with ptc property ; the insulating films 1 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 ; the insulating glue 4 is applied on the left and right sides of the above - mentioned conductive polymer chip 3 with ptc property , the insulating glue 4 on the two sides is divided into four parts totally ; the plating resistant films 5 are coated tightly and evenly on the middle areas of the above - mentioned insulating films 1 on the upper and lower surfaces , and the plating resistant films 5 on the upper and lower surfaces are divided into two parts totally ; one physical processing grooving area is formed in the gap of the insulating glue 4 at each of the left and right sides , the plating conductive metal layers 6 at two ends are attached well to the surfaces of the insulating glue 4 , the insulating films 1 and the metal foils 2 in the physical processing grooving areas , making the plating conductive metal layers 6 at two ends the left end and the right end and the above - mentioned two metal foils 2 maintain a good electrical connection . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 1 of the present invention is exemplified by reference to fig1 a ˜ fig . 1 i . firstly , the raw materials such as one or more crystalline polymers , conductive fillers , processing aids and so on were mixed and passed through a twin - screw extrusion and rolling mill to manufacture the core conductive module with the total thickness of 0 . 10 ˜ 5 mm , as shown in fig1 b , the feature of the core conductive module obtained by the above processes is that the metal foils 2 are laminated tightly on the upper and lower surfaces of the conductive polymer chip 3 ; then , two insulating films 1 are coated on the upper and lower surfaces of the above - mentioned core conductive module respectively , to form the sheet shown in fig1 c ; then it is cut into bar - shaped sheets with prescribed width , as shown in fig1 d ; or the cutting is made before coating the insulating films 1 ; and if the sheet shown in fig1 c has been the right size , it does not need to be cut ; then , two layers of insulating glue 4 are applied on the left and right sides of one of the above - mentioned bar - shaped sheets respectively and solidified , to make four sides , the left , right , upper and lower sides of the core conductive module be coated with the insulating layer , so as to form the conductive module precursor , as shown in fig1 e ; then on the left side and the right side of the above - mentioned conductive module precursor , the surfaces of the outside insulating coating layers are grooved through physical processing methods ( such as laser processing , etc . ), to expose the inner metal foils partially , to form the conductive module with physical processing grooving areas ( as shown in the circles of fig1 f ), as shown in fig1 f ; subsequently , two plating resistant films 5 are applied on the middle areas of the upper and lower surfaces of the above - mentioned conductive module , to form the sheet , as shown in fig1 g ; then it is plated as a whole , to form the bar - shaped sheet having the conductive metal layers 6 , as shown in fig1 h ; finally , the bar - shaped thin sheet as shown in fig1 h is cut into single smd - type elements with prescribed size , as shown in fig1 i , if the bar - shaped thin sheet as shown in fig1 h has been the size of the single smd - type element , it does not need to be cut , please refer to fig1 a for its specific structure . in the above - mentioned processes , the sequence of the process of applying the plating resistant films 5 and the process of grooving through physical processing can be changed , which does not affect the manufacturing of the smd - type thermistor with ptc property . here , only the manufacturing processes are illuminated according to the specific structure of the product , specific parameters of the various processes are not described in details , however the processes of radiation cross - linking and heat treatment can be added into the above - mentioned various processes , according to the requirements of electrical properties ( such as resistance - temperature property , current property , voltage — current property ) of specific elements . it is same to the following various embodiments , and would not be repeated . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 2 of the present invention are exemplified by reference to fig2 a ˜ fig . 2 d . fig2 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 2 of the present invention . in fig2 a , the conductive polymer chip 3 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on , the metal foils 2 are coated evenly on the upper and lower surfaces of the above - mentioned conductive polymer chip 3 with ptc property ; the insulating films 1 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 ; the insulating glue 4 is applied on the left and right sides of the above - mentioned conductive polymer chip 3 with ptc property , the insulating glue 4 on the two sides is divided into four parts totally ; one physical processing grooving area is formed in the gap of the insulating glue 4 at each of the left and right sides , the conductive metal layers 6 at the left and right ends and parts of the upper and right surfaces are attached well to the surfaces of the insulating glue 4 , the insulating films 1 and the metal foils 2 in the physical processing grooving areas , making the conductive metal layers 6 and the above - mentioned two metal foils 2 maintain a good electrical connection . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 2 of the present invention is exemplified by reference to fig2 a ˜ fig . 2 d . the same processes corresponding to fig1 b ˜ f of embodiment 1 are used , to form the conductive module with physical processing grooving areas ( as shown in the circles of fig2 b ), as shown in fig2 b ; subsequently , after two sides of the above - mentioned conducive module are sheathed with the conductive metal layers 6 , i . e . u - shaped thin - wall slots ( please refer to fig2 c ), the u - shaped thin - wall slots are connected with the ptc metal foils by methods such as welding , to form the bar - shaped thin sheet having the conductive metal layers 6 , as shown in fig2 d ; finally , the above - mentioned bar - shaped thin sheet is cut into single smd - type elements with prescribed size , as shown in fig2 a , similarly , if the bar - shaped thin sheet as shown in fig2 d has been the size of the single smd - type element , it does not need to be cut . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 3 of the present invention are exemplified by reference to fig3 a ˜ fig . 3 e . fig3 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 3 of the present invention . in fig3 a , the conductive polymer chip 3 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on , the metal foils 2 are coated evenly on the upper and lower surfaces of the above - mentioned conductive polymer chip 3 with ptc property ; the insulating films 1 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 , the insulating films 1 on the two metal foils 2 are divided into four parts totally ; the insulating glue 4 is applied on the left and right sides of the above - mentioned conductive polymer chip 3 with ptc property ; the plating resistant films 5 are coated tightly and evenly on the middle areas of the upper and lower surfaces of the above - mentioned insulating films 1 , and the plating resistant films 5 on the upper and lower surfaces are divided into two parts totally ; one physical processing grooving area with groove is formed in the gap of the insulating film 1 at each of the upper and lower surfaces , the plating conductive metal layers 6 are attached well to the surfaces of the insulating glue 4 , the insulating films 1 and the metal foils 2 in the physical processing grooving areas with groove at the upper and lower insulating films 1 , making the left and right conductive metal layers 6 and the above - mentioned two metal foils 2 maintain a good electrical connection . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 3 of the present invention is exemplified by reference to fig3 a ˜ fig . 3 e . the same processes corresponding to fig1 b ˜ e of embodiment 1 are used , to form the first conductive module precursor , as shown in fig3 b ; then , two plating resistant films 5 are applied on the middle areas of the upper and lower surfaces of the above - mentioned conductive module precursor , to form the second conductive module precursor , as shown in fig3 c , then on the insulating films 1 of the upper and lower surfaces of the above - mentioned second conductive module precursor , the surfaces of the outside insulating coating layers are grooved through physical processing methods ( such as laser processing , etc . ), to expose the inner metal foils partially , so as to form the conductive module with physical processing grooving areas with groove ( as shown in the circles of fig3 d ), as shown in fig3 d ; then the above - mentioned conductive module is plated as a whole , to from the bar - shaped thin sheet having the conductive metal layers 6 , as shown in fig3 e ; finally , the above - mentioned bar - shaped thin sheet is cut into single smd - type elements with prescribed size , whose structural views are as shown in fig3 a , if the bar - shaped thin sheet as shown in fig3 e has been the size of the single smd - type element , it does not need to be cut . in the above - mentioned processes , the sequence of the process of cutting into bar - shaped thin sheets , the process of applying the insulating glue 4 , the process of applying the plating resistant films 5 and the process of grooving through physical processing can be changed , which does not affect the manufacturing of the smd - type thermistor with ptc property . similar to embodiment 1 and embodiment 2 , here , after the process of grooving through physical processing as shown in fig3 d , the following processes can be conducted : after two sides of the conductive module obtained by grooving through physical processing are sheathed with the u - shaped thin - wall slots , the u - shaped thin - wall slots are connected with the ptc metal foils by methods such as welding ; finally , if necessary , the above - mentioned bar - shaped thin sheet formed is cut into single smd - type elements with prescribed size . in this case , there are no above - mentioned upper and lower plating resistant films 5 as shown in fig3 a in the structure of the element obtained . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 4 of the present invention are exemplified by reference to fig4 a ˜ fig . 4 g . fig4 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 4 of the present invention . in fig4 a , the conductive polymer chip 3 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on , as shown in the figure , two conductive polymer chips 3 with ptc property are formed totally ; the metal foils 2 are coated evenly on the upper and lower surfaces of the above - mentioned conductive polymer chip 3 with ptc property , thus there are four metal foils 2 on two conductive polymer chips 3 with ptc property ; the insulating films 1 are coated tightly and evenly on the surfaces of the above - mentioned four metal foils 2 , for the four metal foils 2 , there are three insulating films 1 ; the insulating glue 4 is applied on the left and right sides of the above - mentioned conductive polymer chip 3 with ptc property , the insulating films 1 and the metal foils 2 , the insulating glue 4 on the two sides is divided into five parts totally ; physical processing grooving areas with groove are formed at the joining of the insulating films 1 , the metal foils 2 and the insulating glue 4 at the left and right sides , wherein there are two areas at the left side and one area at the right side ; the plating resistant films 5 are pasted evenly on the middle areas of the above - mentioned insulating films 1 on the upper and lower surfaces , and the plating resistant films 5 on the upper and lower surfaces are divided into two parts totally ; the conductive metal layers 6 at the left and right ends are attached well to the surfaces of the insulating glue 4 , the insulating films 1 and the metal foils 2 in the physical processing grooving areas , making the conductive metal layers 6 at the left and right ends and the above - mentioned two metal foils 2 maintain a good electrical connection . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 4 of the present invention is exemplified by reference to fig4 a ˜ fig . 4 g . the raw materials such as one or more crystalline polymers , conductive fillers and processing aids and so on were mixed and passed through a twin - screw extrusion and rolling mill to manufacture the conductive polymer chip 3 , the metal foils 2 are laminated tightly on the upper and lower surfaces of the conductive polymer chip 3 , to form a single layer ptc thermistor thin sheet ; later , two pieces of the above - mentioned single layer ptc thermistor thin sheets and three insulating films 1 are used to form a laminated two - layer ptc thermistor thin sheet , and its feature is that one insulating films 1 are laminated on each of the upper and lower surfaces of each of the above - mentioned single layer ptc thermistor thin sheet , then it is cut into bar - shaped laminated thin sheets with prescribed width , as shown in fig4 b ; of course , if its size has been appropriate , it does not need to be cut ; then , the insulating glue 4 is applied on the left and right sides of one of the above - mentioned bar - shaped laminated thin sheets respectively and solidified , to form four insulating coating layers on four sides of the thin sheet , so as to form the conductive module precursor , as shown in fig4 c ; then on the left side and the right side of the above - mentioned conductive module precursor , the surfaces of the outside insulating coating layers are grooved through physical processing methods ( such as laser processing , etc . ), to expose the inner metal foils partially , to form the conductive module with three or more physical processing grooving areas ( as shown in the circles of fig4 d , one at the left side , two at the right side ), as shown in fig4 d ; subsequently , two plating resistant films 5 are applied on the middle areas of the upper and lower surfaces of the above - mentioned conductive module , to form the laminated thin sheet , as shown in fig4 e ; then it is plated as a whole , to from the laminated thin sheet having the conductive metal layers , as shown in fig4 f ; finally , the laminated bar - shaped thin sheet as shown in fig4 f is cut into single smd - type elements with prescribed size , as shown in fig4 g , similarly , if the laminated thin sheet as shown in fig4 f has been the size of the single smd - type element , it does not need to be cut , please refer to fig4 a for its specific structure . similar to embodiment 1 and embodiment 2 , here , after the process of grooving through physical processing as shown in fig4 d , the following processes can be conducted : after two sides of the conductive module obtained by grooving through physical processing are sheathed with the u - shaped thin - wall slots , the u - shaped thin - wall slots are connected with the ptc metal foils by methods such as welding ; finally , the above - mentioned bar - shaped thin sheet formed is cut into single smd - type elements with prescribed size . in this case , there are no above - mentioned upper and lower plating resistant films 5 as shown in fig4 a in the structure of the element obtained . in the above - mentioned process of grooving through physical processing such as laser vaporization , the physical processing grooving areas can be formed through other methods , as long as they do not affect the connecting property . for example , similar to the grooving method of grooving through physical processing as shown in embodiment 3 , an innovative structure of the physical processing grooving area formed through other methods is illustrated by fig5 . obviously , it is not limited to the grooving method described in this case . in fig5 , the conductive polymer chip 3 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on , as shown in the figure , two conductive polymer chips 3 with ptc property are formed totally ; the metal foils 2 are coated evenly on the upper and lower surfaces of the above - mentioned conductive polymer chip 3 with ptc property , thus there are four metal foils on two conductive polymer chips 3 with ptc property ; the insulating films 1 are coated tightly and evenly on the surfaces of the above - mentioned four metal foils 2 , for the four metal foils 2 , there are three insulating films 1 which are divided into five parts ; the insulating glue 4 is applied on the left and right sides of the above - mentioned conductive polymer chips 3 with ptc property , the insulating films 1 and the metal foils 2 , the insulating glue 4 on the two sides is divided into three parts totally ; physical processing grooving areas with groove are formed at the joining of the insulating films 1 , the metal foils 2 and the insulating glue 4 at the left and right sides , wherein there is one area at each of the upper and lower surfaces and one area at the right side ; the plating resistant films 5 are pasted evenly to the middle areas of the above - mentioned two insulating films 1 , and the plating resistant films 5 are divided into two parts totally ; the conductive metal layers 6 are attached well to the surfaces of the insulating glue 4 , the insulating films 1 and the metal foils 2 in the physical processing grooving areas , making the conductive metal layers 6 at the left and right ends and the two metal foils 2 at the upper and lower surfaces of each of the above - mentioned conductive polymer chips 3 maintain a good electrical connection . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 6 of the present invention are exemplified by reference to fig6 a ˜ fig . 6 f . fig6 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 6 of the present invention . in fig6 a , the conductive polymer chip 1 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on ; one metal foil 3 with double matt sides is sandwiched between the above - mentioned upper and lower conductive polymer chips 1 with ptc property and coated evenly on the lower and upper surfaces of them respectively ; two metal foils 2 with single matt side are coated evenly on the upper and lower surfaces of the above - mentioned two conductive polymer chips 1 with ptc property ; the insulating films 4 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 with single matt side , the insulating films 4 on the two metal foils 2 with single matt side are divided into two parts totally ; the insulating glue 6 is coated on the left and right sides of the above - mentioned assembly , there are three physical processing grooving areas with groove are existed in the gaps between the insulating films 4 on the upper and lower sides and the metal foils , wherein there are two areas at the left side and one area at the right side ; the conductive metal layers 7 at the left and right ends and parts of the upper and lower surfaces are attached well to the surfaces of the insulating films 4 , the insulating glue 6 and the metal foils 2 in the physical processing grooving areas with groove , making the conductive metal layers 7 and the above - mentioned metal foils maintain a good electrical connection . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 6 of the present invention is exemplified by reference to fig6 a ˜ fig . 6 f . ( 1 ) the raw materials such as one or more crystalline polymers , conductive fillers and processing aids and so on were mixed and manufactured to be a thin sheet with the total thickness of 0 . 05 ˜ 5 mm by processing methods such as twin - screw extrusion and rolling , then , the thin sheet as shown in fig7 b is formed by the hot pressing method , the feature of the thin sheet obtained by the above processes is that one metal foil 3 with double matt sides is sandwiched between the above - mentioned upper and lower conductive polymer chips 1 with ptc property and coated evenly on the lower and upper surfaces of them respectively ; two metal foils 2 with single matt side are laminated evenly on the upper and lower surfaces of the two conductive polymer chips 1 ; the insulating films 4 are coated tightly on the above - mentioned two metal foils 2 with single matt side ; ( 2 ) two layers of insulating glue 6 are coated on the left and right sides of the above - mentioned thin sheet respectively and solidified , to form four insulating coating layers on four sides of the thin sheet , so as to form the thin sheet , as shown in fig6 c ; ( 3 ) on the left side and the right side of the above - mentioned thin sheet , the surfaces of the outside insulating coating layers are grooved through physical processing methods ( such as laser processing , etc . ), to expose the inner metal foils partially , to form the thin sheet with three physical processing areas , the feature of the physical processing areas of the thin sheet is that there are two areas at the right side and one area at the left side ; ( 4 ) after two sides of the above - mentioned thin sheet are sheathed with the u - shaped thin - wall slots ( please refer to fig6 e ), the u - shaped thin - wall slots are connected with the ptc metal foils by methods such as welding , to from the bar - shaped thin sheet having the conductive metal layers 7 , as shown in fig6 f , and its process is shown in fig6 e ; ( 5 ) the above - mentioned bar - shaped thin sheet is cut into single smd - type elements with prescribed size , as shown in fig6 a . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 7 of the present invention are exemplified by reference to fig7 a ˜ fig . 7 e . fig7 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 7 of the present invention . in fig7 a , the conductive polymer chip 1 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on ; one metal foil 3 with double matt sides is sandwiched between the above - mentioned upper and lower conductive polymer chips 1 with ptc property and coated evenly on the lower and upper surfaces of them respectively ; two metal foils 2 with single matt side are coated evenly on the upper and lower surfaces of the above - mentioned two conductive polymer chips 1 with ptc property ; the insulating films 4 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 with single matt side , the insulating films 4 on the two metal foils 2 with single matt side are divided into two parts totally ; the insulating glue 6 is coated on the left and right sides of the above - mentioned assembly , there are three physical processing grooving areas with groove are existed in the gaps between the insulating films 4 , the insulating glue 6 and the metal foils , wherein there are two areas at the left side and one area at the right side ; the conductive metal layers 5 at the left and right ends and parts of the upper and lower surfaces are attached well to the surfaces of the insulating films 4 , the insulating glue 6 and the metal foils 2 in the physical processing grooving areas with groove , making the conductive metal layers 5 and the above - mentioned metal foils maintain a good electrical connection ; the plating resistant films 8 are pasted evenly and tightly on the middle areas of the upper and lower surfaces of the above - mentioned insulating films 4 , and the plating resistant films 8 on the upper and lower surfaces are divided into two parts totally ; the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 7 of the present invention is exemplified by reference to fig7 a ˜ fig . 7 e . ( 1 ) the same processes corresponding to fig6 b ˜ 6d of embodiment 6 are used , to form the thin sheet , as shown in fig7 b ; ( 2 ) two plating resistant films 8 are applied on the middle areas of the upper and lower surfaces of the above - mentioned thin sheet , to form the laminated thin sheet , as shown in fig7 c ; ( 3 ) the above - mentioned thin sheet is plated as a whole , to from the bar - shaped thin sheet having the conductive metal layers 5 , as shown in fig7 d ; ( 4 ) the above - mentioned bar - shaped thin sheet is cut into single smd - type elements with prescribed size , as shown in fig7 a , please refer to fig7 e for the procedure . the sequence of some processes ( such as the process of grooving through physical processing and the process of applying the plating resistant films 8 ) in the above - mentioned various processes can be changed , as long as they do not affect the manufacturing of the smd - type thermistor with ptc property . the laminated smd - type thermistor with ptc property and manufacturing method thereof of embodiment 8 of the present invention are exemplified by reference to fig8 a ˜ fig . 8 e . fig8 a is the structure view of the laminated smd - type thermistor with ptc property of embodiment 8 of the present invention . in fig8 a , the conductive polymer chip 1 with ptc property is a macromolecular polymer sheet formed by a mixture including one or more crystalline polymers , conductive fillers , processing aids and so on ; one metal foil 3 with double matt sides is sandwiched between the above - mentioned upper and lower conductive polymer chips 1 with ptc property and coated evenly on the lower and upper surfaces of them respectively ; two metal foils 2 with single matt side are coated evenly on the upper and lower surfaces of the above - mentioned two conductive polymer chips 1 with ptc property ; the insulating films 4 are coated tightly and evenly on the surfaces of the above - mentioned two metal foils 2 with single matt side , the insulating films 4 on the above - mentioned two metal foils 2 with single matt side are divided into four parts totally ; the insulating glue 6 is coated on the left and right sides , there are three physical processing grooving areas with groove existed in the gaps between the insulating films 4 on the upper and lower sides , the insulating glue 6 at the left and right sides , and the above - mentioned metal foil with double matt sides and the above - mentioned metal foils with single matt side , wherein there is one area at each of the upper and lower surfaces and one area at the right side ; the conductive metal layers 5 at the left and right ends and parts of the upper and lower surfaces are attached well to the surfaces of the insulating films 4 , the insulating glue 6 and the metal foils in the physical processing grooving area with groove , making the conductive metal layers 5 and the above - mentioned metal foils maintain a good electrical connection ; the plating resistant films 8 are coated tightly and evenly on the middle areas of the upper and lower surfaces of the above - mentioned insulating films 4 , and the plating resistant films 8 on the upper and lower surfaces are divided into two parts totally . the manufacturing method of the laminated smd - type thermistor with ptc property of embodiment 8 of the present invention is exemplified by reference to fig8 b ˜ fig . 8 e . ( 1 ) the same processes corresponding to fig6 b ˜ 6c of embodiment 6 are used , to form four insulating coating layers on four sides of the thin sheet , so as to form the thin sheet , as shown in fig8 b ; ( 2 ) on the left side and the right side of the above - mentioned laminated thin sheet , the surfaces of the outside insulating coating layers are grooved through physical processing methods ( such as laser processing , etc . ), to expose the inner metal foils partially , to form the laminated thin sheet with three physical processing grooving areas ( one on each of the upper and lower surfaces , one on the right side ), as shown in fig8 c ; ( 3 ) two plating resistant films 8 are applied on the middle areas of the upper and lower surfaces of the above - mentioned thin sheet , to form the laminated thin sheet , as shown in fig8 d ; ( 4 ) the above - mentioned thin sheet is plated as a whole , to from the laminated thin sheet having the conductive metal layers 5 , as shown in fig8 e ; finally , the above - mentioned laminated bar - shaped thin sheet is cut into single smd - type elements with prescribed size , as shown in fig8 a . similar to embodiment 6 and embodiment 7 , here , after the process of grooving through physical processing as shown in fig8 c , the following processes can be conducted : after two sides of the conductive module obtained by grooving through physical processing are sheathed with the u - shaped thin - wall slots , the u - shaped thin - wall slots are connected with the ptc metal foils by methods such as welding ; finally , the above - mentioned bar - shaped thin sheet formed is cut into single smd - type elements with prescribed size . in this case , there are no above - mentioned upper and lower plating resistant films 8 as shown in fig8 a in the structure of the element obtained . similar to the innovative structures of the laminated smd - type thermistors with ptc property and manufacturing methods thereof of the above - mentioned various embodiments , two , three or more layers of the laminated smd - type thermistors with ptc property are also in the protection scope of the present invention . with the above - mentioned laminated smd - type thermistor and manufacturing method thereof , the laminated smd - type thermistor has a novel structure , a superior performance , a high rate of qualified products and a unique manufacturing process , with the manufacturing method , the etching process is not needed to be performed on the surfaces of the metal foils , only the physical processing ( e . g . laser vaporization ) process is performed on two layers of insulating glue ( or two insulating films , or one layer of insulating glue and one insulating film ) of the conductive module formed having the insulating layer on the upper , lower , left and right surfaces , to expose the metal foils partially and connect them with two plated metal layers coated outside respectively . compared with the traditional process , the above - mentioned laminated smd - type thermistor and manufacturing method thereof of the present invention have the following advantages : ( 1 ) the organic particulate matters produced by grooving through physical processing ( such as laser processing , etc .) can be recycled easily through sealed pipes , so it is environmentally friendly , and there is no shortcoming similar to that of the etching fluid polluting the environmental seriously ; ( 2 ) compared with the cost of chemical etching ( for single layer ptc element , the cost is about 0 . 08 yuan / piece , for multi - layer ptc element , the cost doubles ), the grooving cost ( for single layer ptc element , the cost is about 0 . 01 yuan / piece , for multi - layer ptc element , the cost increases less ) through the physical processing ( eg , laser processing , etc .) is lower , thus saving a lot of production costs ; ( 3 ) it is uneasy to produce abnormal defects similar to those such as shift , dislocation and so on that are produced easily for the etching pattern , thus the grooving process through physical processing ( eg , laser processing , etc .) is more stable ; ( 4 ) the accuracy of grooving through physical processing is high , for example , the straight line accuracy of physical processing and so on can be up to 0 . 05 mm , the width of laser processing also can reach 0 . 05 mm , the yield rate is higher than that of the traditional process ; ( 5 ) the materials required in forming the element are relatively few , making the total cost of the raw materials less than that of the traditional structure ; ( 6 ) for the materials are relatively few , the manufacturing processes required are relatively few , making the total rate of finished products relatively high ; ( 7 ) for the roughness of the surfaces of the metal foil with double matt sides is relatively large , the adhesive force for combining the ptc chip is relatively big , making the combination of the materials more compact , and for the materials are relatively few , the rate to produce abnormal phenomena such as shift , dislocation and so on during carrying out processes such as hot - processing and so on is relatively small , to make the structure more stable and reliable . in the present specification , the present invention has been described according to the particular embodiments . but it is obvious that these embodiments can be modified or changed without departure from the spirit and scope of the present invention . therefore , the specification and drawings described above are exemplary only and not intended to be limiting .