referring now to the drawings , the light emitting diode ( led ) lighting assembly of the present invention is illustrated and generally indicated at 10 in fig1 - 5 . further , a schematic diagram is shown in fig6 generally illustrating the present invention incorporated into a flashlight circuit . as will hereinafter be more fully described , the present invention illustrates an led lighting assembly 10 for further incorporation into a lighting device . for the purposes of providing a preferred embodiment of the present invention , the device 10 will be shown incorporated into a flashlight , however , the present invention also may be incorporated into any other lighting device such as architectural specialty lighting or vehicle lighting . in general , the present invention provides a means for packaging a high intensity led lamp that includes integral heat sink capacity , electrical connectivity and an optical assembly for controlling the light output from the led . the present invention therefore provides a convenient and economical assembly 10 for incorporating a high intensity led into a lighting assembly that has not been previously available in the prior art . turning to fig1 and 3 , the led package assembly 10 can be seen in a fully assembled state . the three main components can be seen to include a high intensity led lamp 12 , an inner mounting die 14 and an outer enclosure 16 . in fig1 and 2 , the lens 18 of the led 12 can be seen extending through an opening in the front wall of the outer enclosure 16 . further , in fig3 a rear view of the assembled package 10 of the present invention can be seen with a flexible contact strip shown extending over the bottom of the interior die 14 . turning now to fig4 and 5 , an exploded perspective view and a cross sectional view of the assembly 10 of the present invention can be seen . the assembly 10 of the present invention is specifically configured to incorporate a high intensity led lamp 12 into a package that can be then used in a lighting assembly . the high intensity led lamp 12 is shown here as a luxeon emitter assembly . however , it should be understood that the mounting arrangement described is equally applicable to other similarly packaged high intensity led &# 39 ; s . the led 12 has a mounting base 20 and a clear optical lens 18 that encloses the led 12 emitter chip ( not shown ). the led 12 also includes two contact leads 22 , 24 that extend from the sides of the mounting base 20 , to which power is connected to energize the emitter chip . further , the led lamp 12 includes a heat transfer plate 26 positioned on the back of the mounting base 20 . since the emitter chip in this type of high intensity led lamp 12 is four times the area of a standard emitter chip , a great deal more energy is consumed and a great deal more heat is generated . the heat transfer plate 26 is provided to transfer waste heat out of the led lamp 12 to prevent malfunction or destruction of the chip . in this regard , the manufacturer has provided the heat transfer plate 26 for the specific purpose of engagement with a heat sink . however , all of the recommended heat sink configurations are directed to a planar circuit board mount with a heat spreader or a conventional finned heat sink . neither of these arrangements is suitable for small package integration or a typical tubular flashlight construction . in contrast , the mounting die 14 used in the present invention is configured to receive the led lamp 12 and further provide both electrical and thermal conductivity to and from the led lamp 12 . the mounting die 14 is fashioned from a thermally conductive and electrically conductive material . in the preferred embodiment the mounting die 14 is fashioned from brass , however , the die 14 could also be fabricated from other metals such as aluminum or stainless steel or from an electrically conductive and thermally conductive polymer composition and still fall within the scope of this disclosure . the mounting die 14 has a recess 28 in one end thereof that is configured to frictionally receive and retain the base 20 of the led lamp 12 . while the base 20 and the recess 28 are illustrated as circular , it is to be understood that this recess is intended to receive the housing base regardless of the shape . as can be seen , one of the contact leads 22 extending from the base 20 of the led lamp 12 must be bent against the led lamp 12 base 20 and is thus trapped between the base 20 and the sidewall of the recess 28 when the led lamp 12 is installed into the recess 28 . when installed with the first contact lead 22 of the led 12 retained in this manner , the lead 22 is in firm electrical communication with the mounting die 14 . a channel 30 extends along one side of the mounting die 14 from the recess to the rear of the die 14 . when the led lamp 12 is installed in the mounting die 14 , the second contact lead 24 extends into the opening in the channel 30 out of contact with the body of the mounting die 14 . the heat transfer plate 26 provided in the rear of the led lamp 12 base 20 is also in contact with the bottom wall of the recess 28 in the mounting die 14 . when the heat transfer plate 26 is in contact with the die 14 , the heat transfer plate 26 is also in thermal communication with the die 14 and heat is quickly transferred out of the led lamp 12 and into the body of the die 14 . the die 14 thus provides a great deal of added heat sink capacity to the led lamp 12 . an insulator strip 32 is placed into the bottom of the channel 30 that extends along the side of the mounting die 14 . the insulator strip 30 allows a conductor to be connected to the second contact lead 24 of the led lamp 12 and extended through the channel 30 to the rear of the assembly 10 without coming into electrical contact with and short circuiting against the body of the die 14 . in the preferred embodiment , the insulator strip 32 is a flexible printed circuit strip with circuit traces 34 printed on one side thereof . the second contact lead 24 of the led lamp 12 is soldered to a contact pad 36 that is connected to a circuit trace 34 at one end of the insulator strip 32 . the circuit trace 34 then extends the length of the assembly and terminated in a second contact pad 38 that is centrally located at the rear of the assembly 10 . further , control circuitry 40 may be mounted onto the flexible circuit strip 32 and housed within the channel 30 in the die 14 . the control circuitry 40 includes an led driver circuit as is well known in the art . with the led lamp 12 and insulator strip 32 installed on the mounting die 14 , the mounting die 14 is inserted into the outer enclosure 16 . the outer enclosure 16 is also fashioned from a thermally conductive and electrically conductive material . in the preferred embodiment the outer enclosure 16 is fashioned from brass , however , the outer enclosure 16 could also be fabricated from other metals such as aluminum or stainless steel or from an electrically conductive and thermally conductive polymer composition and still fall within the scope of this disclosure . the outer enclosure 16 has a cavity that closely matches the outer diameter of the mounting die 14 . when the mounting die 14 is received therein , the die 14 and the housing 16 are in thermal and electrical communication with one another , providing a heat transfer pathway to the exterior of the assembly 10 . as can also be seen , electrical connections to the assembly 10 can be made by providing connections to the outer enclosure 16 and the contact pad 38 on the circuit trace 34 at the rear of the mounting die 14 . the outer enclosure 16 includes an aperture 42 in the front wall thereof through which the optical lens portion 18 of the led lamp 12 extends . the aperture 42 is fashioned to provide optical control of the light emitted from the led lamp 12 . the aperture 42 in the preferred embodiment is shaped as a reflector cone and may be a simple conical reflector or a parabolic reflector . the walls of the aperture 42 may also be coated with an anti - reflective coating such as black paint or anodized to prevent the reflection of light , allowing only the image of the led lamp 12 to be utilized in the finished lighting assembly . finally , an insulator disk 44 is shown pressed into place in the open end of the outer enclosure 16 behind the mounting die 14 . the insulator disk 44 fits tightly into the opening in the outer enclosure 16 and serves to retain the mounting die 14 in place and to further isolate the contact pad 38 at the rear of the mounting die 14 from the outer enclosure 16 . turning now to fig6 a schematic diagram of a completed circuit showing the led assembly 10 of the present invention incorporated into functional lighting device is provided . the led assembly 10 is shown with electrical connections made thereto . a housing 46 is provided and shown in dashed lines . a power source 48 such as a battery is shown within the housing 46 with one terminal in electrical communication with the outer enclosure 15 of the led assembly 10 and a second terminal in electrical communication with the circuit trace 38 at the rear of the housing 16 via a switch assembly 50 . the switching assembly 50 is provided as a means of selectively energizing the circuit and may be any switching means already known in the art . the housing 46 of the lighting device may also be thermally and electrically conductive to provide additional heat sink capacity and facilitate electrical connection to the outer enclosure 16 of the led assembly 10 . it can therefore be seen that the present invention 10 provides a compact package assembly for incorporating a high intensity led 12 into a lighting device . the present invention provides integral heat sink capacity and electrical connections that overcome the drawbacks associated with prior art attempts to use led &# 39 ; s of this type while further creating a versatile assembly 10 that can be incorporated into a wide range of lighting devices . for these reasons , the instant invention is believed to represent a significant advancement in the art , which has substantial commercial merit . while there is shown and described herein certain specific structure embodying the invention , it will be manifest to those skilled in the art that various modifications and rearrangements of the parts may be made without departing from the spirit and scope of the underlying inventive concept and that the same is not limited to the particular forms herein shown and described except insofar as indicated by the scope of the appended claims .