fig1 shows a standard prior art fluorescent fixture 10 mounted to ceiling 12 within opening 14 in ceiling 12 . fixture 10 includes a plurality of fluorescent tubes 16 . ballast 18 is provided within fixture 10 to control fluorescent tubes 16 . as can be seen , the entire fixture 10 , including fluorescent tubes 16 , is mounted above the plane of ceiling 12 . thus , light does not spread evenly from top to bottom of the walls within the room , nor does light impinge upon the ceiling . in addition , the standard fluorescent fixture is rather unattractive . applicant &# 39 ; s designs illustrated in fig2 - 10 , solve the problem of the lack of even light dispersion from floor to ceiling as well as the lack of aesthetics associated with prior art fixtures . applicant has created an entirely new alternative to standard , every day , run - of - the - mill recessed drop - in troffers - type fixtures . applicant has developed a three dimensional multi - plate multi - lens drop - in fixture built for various panel openings , including one foot by four foot , two foot by four foot , and two foot by two foot openings . at least a portion of applicant &# 39 ; s fixtures protrude below the plane of the ceiling , thus allowing for a very uniform and evenly dispersed light output . referring now more particularly to fig2 , applicant provides a multi - level led light fixture 20 having mounting plate 22 which is attached to ceiling 12 by the drop - ceiling cross members 24 and 26 . mounting plate 22 provides support for fixture 20 and further operates as a secondary thermal dissipater . ac to dc power supply 28 is mounted on top of mounting plate 22 . ac to dc power supply is electrically connected to leds 29 which are attached to a circuit board which is received within or adjacent to dome lens 30 . dome lens 30 are attached to lens plate 32 . a thermal plate 34 is located between mounting plate 22 and lens plate 32 . the base plate , lens mounting plate and thermal plate are spaced apart and are held in place by spacers 36 and 38 . heat sink 40 combined with a divider or thermal plate 34 , also referred to as thermal pump component cooler , is located between mounting plate 22 and lens plate 32 and is adjacent and aligned to opening , or vent hole 42 in thermal plate 34 , as best illustrated in fig8 . as will be described below in more detail , thermal pump component cooler thermal plate 34 acts as a thermal separator while the opening 42 , in the plate 34 allows heat to pass through , from the lower plane to the upper plane , creating a void in the air space of the lower heat sink 62 , due to the heated air moving upward and away from the lower plane via the vent hole 42 . as the heat is transferred from the lower heat sink 62 , cool air is drawn into the void thus , accelerating the thermal exchange cycle . since the leds 29 are in contact with the lower portion of the thermal pump component cooler , the leds 29 are effectively thermally connected to thermal plate 34 . lens plate 32 is preferably not a thermal conductor . preferably , lens plate 32 is constructed of material , such as plexiglas , lexan , acrylic or polycarbonate . openings are provided in the lens plate 32 which incorporate domed or flat or optic lenses , but may be left open for light to pass unobstructed . in the embodiment where the lens plate is made of an acrylic resin or other clear or semi - clear material , it is preferred that the material be modified to be translucent so as to help evenly spread the light while hiding the components behind the lens plate 32 . however , it is not required that the lens plate 32 be translucent and it may be transparent if desired . as can be seen , domed lens 30 is located below the plane of ceiling 12 . this location of the domed lens 30 and the led lights 29 received therein will help create a uniform evenly spread light within the area to be illuminated , including light on the ceiling 12 and the walls of the room from top to bottom . as can be seen in fig2 - 4 , in one embodiment of the invention there are three lighting units associated with fixture 20 . referring now more particularly to fig5 and 6 , there is provided a two plate lighting fixture 43 , including thermal plate 44 which also serves as a mounting plate and lens plate 46 . the mounting plate / thermal plate 44 is the size of an opening in ceiling 12 . the mounting plate / thermal plate 44 is utilized as the primary thermal mounting plate as well as the thermal pump divider . the power supply 28 is mounted on top of mounting plate / thermal plate 44 and is electrically connected to leds 48 which are situated closely behind the dome lens 50 . the dome lens 50 is mounted to lens plate 52 . thermal pump component cooler 40 is thermally connected with leds 48 and is connected to an opening in mounting plate / thermal plate 44 . spacers 54 maintain separation between mounting plate / thermal plate 44 and lens plate 52 . lens plate 52 can be made of several materials including plexiglas , lexan , acrylic or polycarbonate . if a solid , non - light transmitting material is used such as fiberglass , openings are preferred at any light emitting zone and it is advisable to incorporate dome , flat , optic or other lenses in the openings . if a transparent or translucent lens plate is used , domed , flat or optic lenses can be utilized to direct the light output . however , it is not required to have lenses . in the embodiment of fig5 and 6 , once again the lens 52 and leds 48 are located below the plane of ceiling 12 so that light is evenly and uniformly dispersed over the lighted area , including the ceiling and side walls . in one aspect of the invention , there is provided multi - level plates forming a 3d architecture using two or three levels . this fixture is primarily designed for led light applications and the upper level plate or plates are utilized as the mounting plate and can also be utilized as a thermal dispenser . when combined with the cooling system referred to below , the fixture becomes a highly efficient ultra - bright replacement or option versus fluorescent drop - in fixtures and led retrofit and replacement kits . in another aspect of the invention , there is provided a thermal air pump component cooling system to address the cooling issues in an led lighting fixture . this cooling system allows a heat sink to be of minimal size and will out perform a standard convection heat sink . this further allows for far more applications at smaller scale and still allows excellent thermal dissipation . applicant &# 39 ; s heat sink takes advantage of the physical law that heat rises and that if a substance such as a gas , vapor , air or liquid is moved out of an area , a void is created . this void creates a partial vacuum with pulling power and the surrounding substance , e . g . cool air , will be sucked into the void thus , creating a thermal pump system . these concepts are illustrated schematically in fig7 which shows the thermal air pump cooling system 40 mounted to a thermal plate , which may be thermal plate 34 of fig2 or mounting plate / thermal plate 44 of fig5 . the lower thermal sink 56 is mounted to the bottom of thermal plate 34 . the upper thermal sink 58 is mounted to the top of thermal plate 34 . as illustrated in fig8 , there is an opening 42 in thermal plate 34 . the area around the thermal plate heats up while the led lights are in operation . heat will rise from the lower thermal sink 56 to the upper thermal sink 58 causing a partial vacuum in lower heat sink 56 . as illustrated by line 60 , cool air will flow from the outside of the thermal sink into the center void of the lower thermal sink 56 then through opening 42 in thermal plate 34 and out openings in upper thermal sink 58 . the leds are cooled without the use of any fan or other mechanical devices . the thermal air pump component cooling system 40 includes four primary sections / levels . lower heat sink 56 includes multi - vein thermal transfer activator 62 , also referred to as the primer or primary heat sink , and is located below thermal plate 34 . as previously indicated , there is an opening 42 in thermal divider plate 34 above the multi - vein thermal transfer activator 62 . this opening helps create the desired thermal pump process . as seen in fig1 , the center of thermal transfer activator 62 in this embodiment includes a circular thermal transfer guide 64 . this circular thermal transfer guide 64 is ring - shaped , however , the void can be substituted with an array of other thermal designs such as , thermal posts vertical fins , and so on as , it has been found to accelerate the thermal cycle and create more surface area for heat transfer . as can be seen in fig9 , upper thermal sink 58 includes cavity 76 in its center . the thermal air pump acts as a thermal chimney . this thermal chimney helps accelerate the heat upwardly within the system , that is to accelerate heat through the center of thermal divider 34 in a thermal pump affect . the thermal pump affect pulls surrounding air into the lower heat sink void 70 and up toward the upper level 74 of upper thermal sink 58 . as heat and adjacent air move from the lower heat sink 56 to the upper level 74 through the hole 42 in the thermal plate 34 , a void or partial vacuum is created within the lower section 56 . as the heat and air is transferred upward and out , the void in the lower section must be filled . surrounding cool fresh air is then pulled into this lower section , thus creating a thermal pump cycle and removing more heat . the cycle creates a very efficient cooling system that can be developed in a small package . while the invention has been described in terms of the above embodiments , those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the appended claims .