it will be appreciated that for simplicity and clarity of illustration , where appropriate , reference numerals have been repeated among the different figures to indicate corresponding or analogous elements . in addition , numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein . however , it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details . in other instances , methods , procedures , and components have not been described in detail so as not to obscure the related relevant feature being described . also , the description is not to be considered as limiting the scope of the embodiments described herein . the drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure . several definitions that apply throughout this disclosure will now be presented . the term “ coupled ” is defined as connected , whether directly or indirectly through intervening components , and is not necessarily limited to physical connections . the connection can be such that the objects are permanently connected or releasably connected . the term “ inside ” indicates that at least a portion of a region is partially contained within a boundary formed by the object . the term “ substantially ” is defined to be essentially conforming to the particular dimension , shape , or other feature that the term modifies , such that the component need not be exact . for example , “ substantially cylindrical ” means that the object resembles a cylinder , but can have one or more deviations from a true cylinder . the term “ comprising ” when utilized , means “ including , but not necessarily limited to ”; it specifically indicates open - ended inclusion or membership in the so - described combination , group , series , and the like . fig1 illustrates an embodiment of a frame 100 which is configured both to protect the internal electronic components and to function as part of an electronic device . the frame 100 can include a first conductive sheet 111 , a second conductive sheet 121 , and a support portion 131 . the first conductive sheet 111 and the second conductive sheet 121 can be electrically connected to different places of an inside surface of the frame 100 , and the support portion 131 can extend from the inside surface of the frame 100 . the first conductive sheet 111 and the second conductive sheet 121 can be conductive materials and can be coupled to the inside surface of the frame 100 by soldering . in another embodiment , the first conductive sheet 111 and the second conductive sheet 121 can be integrated with the inside surface of the frame 100 . the first conductive sheet 111 and the second conductive sheet 121 can be configured as an electrical connection between the frame 100 and inner circuitry of the electronic device . the support portion 131 can be configured to support internal electronic components . fig2 illustrates that the frame 100 can include a first conductive frame 110 , a second conductive frame 120 , and an insulating frame 130 . the first conductive frame 110 and the second conductive frame 120 can be made of conductive materials and be annular structures . a predetermined gap can be formed between the first conductive frame 110 and the second conductive frame 120 . the insulating frame 130 can be made of insulating materials and be of annular structures . the insulating frame 130 can be sandwiched between the first conductive frame 110 and the second conductive frame 120 . the insulating frame 130 can be coupled to the first conductive frame 110 and the second conductive frame 120 throughout the entire annular surface to increase contact surface area and enhance the strength of the connection . fig3 illustrates that the first conductive frame 110 can include a first main body 112 and a first extending portion 113 extending inward from the first main body 112 . the first main body 112 and the first extending portion 113 can form a substantially “ l ”- shaped semi - closed space to receive the insulating frame 130 . the first extending portion 113 can increase the contact area between the insulating frame 130 and the first conductive frame 110 to enhance the structural strength of the insulating frame 130 and the first conductive frame 110 . the second conductive frame 120 can include a second main body 122 and a second extending portion 123 extending inwardly from the second main body 122 . the second main body 122 and the second extending portion 123 can form a substantially “ l ”- shaped semi - closed space to receive the insulating frame 130 . the second extending portion 123 can increase the contact area between the insulating frame 130 and the second conductive frame 120 to enhance the structural strength of the insulating frame 130 and the second conductive frame 120 . that is , a part of the insulating frame 130 can be sandwiched between the first main body 112 of the first conductive frame 110 and the second main body 122 of the second conductive frame 120 . an extended part of the insulating frame 130 can be located between the first extending portion 113 of the first conductive frame 110 and the second extending portion 123 of the second conductive frame 120 . the insulating frame 130 can include a support portion 131 extending from an inner surface thereof and a through hole 132 defined on the support portion 131 . the support portion 131 can locate and support the internal electronic components , and the through hole 132 can be coupled to a fastener configured to tighten the internal electronic components . fig4 illustrates that the first conductive sheet 111 and the second conductive sheet 121 can be substantially “ l ”- shaped . one end of the first conductive sheet 111 and one end of the second conductive sheet 121 can be respectively coupled to different locations of the first main body 112 and the second main body 122 , and the other end of the first conductive sheet 111 and of the second conductive sheet 121 can be extended inside the frame 100 . in another embodiment , the first conductive sheet 111 and the second conductive sheet 121 can be substantially triangular , or rectangular , or other shapes . the insulating frame 130 can extend to partially cover the first conductive sheet 111 and the second conductive sheet 121 . the insulating frame 130 can avoid exposure of the first conductive sheet 111 and the second conductive sheet 121 inside the frame 100 and can enhance the structural and connecting strength of the first conductive frame 110 and the second conductive frame 120 . fig5 illustrates another embodiment of a frame 200 . the frame 200 can include a first conductive frame 210 , a second conductive frame 220 , and a third conductive frame 230 . the insulating frame 240 can be arranged between the first conductive frame 210 , the second conductive frame 220 , and the third conductive frame 230 . a first conductive sheet 211 , a second conductive sheet 221 , and a third conductive sheet 231 can be electrically connected to different locations of the inside surface of the first conductive frame 210 , the second conductive frame 220 , and the third conductive frame 230 . the insulating frame 240 can extend to partially cover the first conductive sheet 211 , the second conductive sheet 221 , and the third conductive sheet 231 . the first conductive frame 210 can include a first main body 212 and a first extending portion 213 extended from the first main body 212 . the first extending portion 213 can increase the contact area between the insulating frame 240 and the first conductive frame 210 . the second conductive frame 220 can include a main body only . in another embodiment , there can be a different or any number of the second conductive frames 220 . the third conductive frame 230 can include a third main body 232 and a third extending portion 233 extended from the third main body 232 . the third extending portion 233 can increase the contact area between the insulating frame 240 and the third conductive frame 230 . the first extending portion 213 and the third extending portion 233 can be arranged to extend along a same direction . the insulating frame 240 can be arranged between the first extending portion 213 and the third extending portion 233 . in another embodiment , the frame 200 can include four or more conductive frames , and an insulating frame can be arranged between any number of conductive frames . fig6 illustrates a flowchart in accordance with an example embodiment . the example method is provided by way of example , as there are a variety of ways to carry out the method . the method described below can be carried out using the configurations illustrated in fig1 , for example , and various elements of the figure are referenced in explaining the example method . each block shown in fig6 represents one or more processes , methods , or subroutines carried out in the example method . additionally , the illustrated order of blocks is by example only and the order of the blocks can change . the example method can begin at block 101 . at block 101 , a plurality of conductive frames can be provided , and each conductive frame can be made with a predetermined shape . the conductive frames can be made , and each conductive frame can include a main body and an extending portion extending from the main body , or just include a simple main body . at block 102 , a plurality of conductive sheets can be provided , and each conductive sheet can be coupled to an inside surface of one of the plurality of conductive frames . each of the plurality of conductive sheets can be electrically connected to different conductive frames . conductive sheets can be coupled to different places inside each conductive frame , thus the frame can electrically connected to the inside circuitry . at block 103 , each conductive frame can be placed in an injection mold and a predetermined gap can be kept between each two conductive frames . at block 104 , the gap between each two conductive frames can be filled with insulating material to form an insulating frame , and the insulating frame can partially cover the conductive sheets . during the forming work , the molten insulating material can be filled in the gap to form the insulating frame and the insulating frame can extend to partially cover the conductive sheets . the insulating frame can also extend to form a support portion in predetermined places . the support portion can be configured to support the internal electronic components . the embodiments shown and described above are only examples . many details are often found in the art such as the other features of a method of manufacturing multi - part frame . therefore , many such details are neither shown nor described . even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description , together with details of the structure and function of the present disclosure , the disclosure is illustrative only , and changes may be made in the details , including in matters of shape , size , and arrangement of the parts within the principles of the present disclosure , up to and including the full extent established by the broad general meaning of the terms used in the claims . it will therefore be appreciated that the embodiments described above may be modified within the scope of the claims .