fig1 - 6 shows one embodiment of the present invention . as seen in fig1 a long flat strip 11 of electrically conductive material such as copper or beryllium copper is stamped into the shape of the intermediate blank shown . this is preferably done by progressive stamping to produce an array of a large number of repeated blanks 17 for one form of clip - holder according to the present invention . alternatively , the strip 11 need not be formed from electrically conductive material , since the solder portions attached to the clips provide the necessary conductivity to electrically connect a terminal to a substrate or other component . the strip 11 is formed with a longitudinally extending carrier section 15 having customary indexing or sprocket holes 13 spaced along its length , to aid in moving the strip in successive steps through a progressive stamping machine . the carrier strip 15 is integral with individual clips 17 extending laterally therefrom at regular intervals therealong , spaced correspondingly to the spacing of terminals or pins on the electrical connectors with which the clips 17 are to be used in the manner described below . by way of example , the clips 17 may be spaced with a pitch of 0 . 05 or 0 . 100 inch . integrally formed with the carrier strip 15 are a pair of spaced fingers 19 on each clip , joined to the carrier strip 15 by a connecting piece 21 , which has a notch 23 formed therein to permit the carrier strip 15 to be readily broken away or otherwise separated from the sequence of clips 17 . the fingers 19 are spaced apart a distance d coordinated with the width of the pins or terminals of the circuit element 31 ( see fig4 to 6 ) with which the clip 17 is used . as seen in fig2 and 3 , a solder mass 25 , preferably in the form of a section of solder wire , is placed across the pairs of fingers 19 , which are then rolled partially around the solder mass 25 , sufficiently to hold the solder in place . this is readily fabricated in the course of the progressive stamping , by laying a solder wire 25 ( which preferably includes a solder flux ) across a number of the clips 17 , curling the fingers 19 around the solder wire 25 as shown in fig2 and 3 , and cutting away the solder in the area between the clips 17 , leaving a solder mass 25 held by each pair of fingers 19 , and of a volume appropriate for the required soldering action . in use , as shown in fig4 and 5 , a connector or other circuit component 31 having a plurality of aligned terminals or pins 33 is passed through correspondingly spaced internally electroplated holes 35 of a substrate 37 . while the substrate 37 is illustrated as oriented vertically in fig5 it will be understood that it may be horizontal or with other orientations , as may be appropriate . a ganged strip of clips 17 of which a portion is shown in fig2 with a number of clips corresponding to the number of component terminals to be soldered to the substrate 37 , is then placed over the array of connector terminals 33 as illustrated in fig4 . for example , if the component 31 has 21 terminals in alignment , a section of the clip array of fig4 having 21 clips will be applied over the component terminals 33 as shown , and severed from the remainder . the separation of the fingers 19 of each clip is selected so that there will be a frictional engagement between each clip 17 and its corresponding connector terminal 33 , so that the strip of clips will be retained in the position shown in fig4 and 5 during subsequent operations . it will be understood that where the component 31 has two or more rows of terminals , each row of terminals of the component 31 may be provided with a strip of the clips of fig4 although only one row is shown in fig4 and 5 . then , heat is applied to the solder , as by heated air or other conventional means , which causes the solder to reflow and to be drawn by capillary action into the space between the terminal 33 and the sides of the plated substrate hole 35 . the hole 35 has a metallic surface , as by being electroplated on its interior , as indicated at 39 . the plating may extend around onto the flat surface of the substrate 37 to form contact pads , as illustrated at 41 . normally , a slight space 43 is left between the terminal 33 and the plating 39 of the substrate hole 35 , into which the molten solder will be drawn . in normal practice this space may not be deliberately provided , since the customary slight irregularities in formation of the component terminal or the electro - plating 39 in the hole 35 will permit the molten solder to flow therebetween to bond the terminal 33 to the electro - plated layer 39 , as indicated in fig6 . after the soldering is completed , the carrier strip 15 is broken away from the individual clips 17 at the breakaway notches 23 , leaving the clips 17 in place but soldered to the component terminal , the plating of the hole , and to the contact pad 41 . if desired , the carrier strip may be broken away before the soldering is accomplished , although this is not preferred . [ 0037 ] fig7 shows an alternate way of using the clips of fig2 and 3 . in this instance , a connector or other component 31 a is shown having two rows of terminal pins 33 instead of one row as shown in fig5 . in this instance the clips 17 are positioned on the component pins 33 before the component pins 33 are inserted into the substrate 37 , and are positioned between the component 31 a and the substrate 37 . heat is supplied as in the case of fig5 and 6 to join the pins 33 to the plated hole 39 of the substrate by soldering . [ 0038 ] fig8 through 12 show a modified form of the present invention . as seen in fig8 the blank has a carrier strip 115 with indexing holes 113 similar to fig1 . extending laterally from the carrier strip 115 are the individual solder - holding clips 117 . as seen in fig8 each clip blank 117 is joined to the carrier strip 115 by a connecting piece 121 having a breakaway notch 123 . the individual clip blank 117 includes a body portion 147 having slits 149 extending adjacent the edges of the body portion 147 to form fingers 119 integral at one end with the body portion 147 . as indicated in fig9 a solder wire 151 ( preferably including a solder flux ) is laid over the successive body portions 147 of a portion of the array of clips 117 as the array moves along the progressive stamping apparatus . as seen in fig9 to 11 , the fingers 119 are then curled around the solder wire 151 to hold it on the body portions 147 . after the solder wire 151 is applied and held by the fingers 119 , holes 145 are formed as seen in fig9 as by punching through the clip bodies 147 . at the same time , the solder wire 151 is separated into two segments straddling each hole 145 and a gap 153 is made in the solder wire 151 between adjoining clip bodies 147 as seen in fig9 and 11 . in this way , each body portion 147 carries two solder masses 125 , straddling its hole 145 . the holes 145 are dimensioned to engage the component terminals 133 frictionally , to position a solder mass on either side of the respective terminal 133 as shown in fig1 . in this way the array of clip bodies is retained on the component terminals 133 . the solder masses 125 remaining held by each clip body 147 are dimensioned to provide adequate solder for joining each clip 117 to its respective component terminal 133 . as seen in fig1 and 12 , this form of solder - holding clip may be used in the same manner as shown in fig6 or 7 or 12 . further , the clip 117 may be used to join a component 31 or 131 with any desired further substrate or another component , whether or not substrate 137 is present . as shown in fig1 and 14 , the clips 117 may be formed with extensions 161 which may be used as terminals or leads to other apparatus . for example the end of each extension 161 may be formed into an edge clip shape 163 for a substrate as shown in fig1 and 14 , to permit coupling of the component 131 pins to a further substrate ( not shown ) parallel to the component 131 or in alignment thereto . by bending extension 161 at right angles , the further substrate may be perpendicular to substrate 137 . in place of edge clip 163 , the end of each extension 161 may be formed for surface mounting to a substrate contact pad , or may have any other desired configuration . fig1 - 18 show a further modification of the present invention . in this instance , each solder - holding clip 219 is formed with a pair of sides 201 joined by a back 203 . each side 201 has a pair of fingers or tabs 205 extending partially around a solder mass 225 , leaving a space 207 between the solder mass 225 and the back 203 , for receiving a terminal pin 209 of a connector 211 . alternatively , preferably the spacing between the arms 201 is dimensioned to frictionally engage the pins 209 . as shown in fig1 , the pin 209 passes through a substrate 213 , having an internally plated hole and / or a conductive pad to which the pin 209 is to be soldered . this form of invention also is adapted for multi - stage progressive stamping . in fabrication , an elongated strip of conductive material is stamped as shown in fig1 to have a carrier strip 215 with a series of the clips 219 extending laterally therefrom . the body is bent into the u - shape shown in fig1 to form clip sides 201 each with a pair of tabs or fingers 205 . a solder wire 225 of a diameter conforming to the separation between the pairs of fingers 205 is laid between the pairs of fingers 205 , and the fingers are then bent partially around and staked into the solder wire 225 . the solder wire 225 is then cut between the clips 219 , leaving an amount of solder appropriate for the specific use for the clips . a connecting portion 221 serves to join the clip 219 to the carrier strip 215 , and is bent with an offset as shown in fig1 and 18 , so that when assembled to a row of terminals 209 , interference is avoided between the terminal pins 209 a and 209 b and the carrier strip 215 . the spacing between the clips 209 is correlated to the spacing between the pins 209 a or 209 b of the connector 211 , so that in use a section of the strip of fig1 having a number of clips 219 equal to the number of pins 209 in a row of the connector 211 , may be inserted over the pins 209 as shown in dashed lines 209 in fig1 and also in fig1 . fig1 shows connectors 211 illustratively of the dual row type , having terminal pins 209 a and 209 b equally spaced in the direction perpendicular to the plane of the paper . it will be understood that the present invention may be used with any number of rows of terminal pins , from one row up . by way of illustration , the connectors 211 may be of the j1 or j2 type , and the substrate 213 may be a pc 104 board . illustratively the terminals 209 may be spaced at 0 . 100 inch intervals , and the pins may be 0 . 480 inches long with a 0 . 025 inch square cross section . upon reflowing , the solder will flow around the pins 209 and by capillary action into the internally plated holes of the substrate 213 . after the soldering is completed , each clip has its joining section 221 broken or cut off , as by a notch 223 formed therein . the solder - holding clips of the present invention are usable not only to solder a connector or other component having non - solder - bearing terminals to through - plated holes of a substrate , but may also be used to solder a lead having any desired terminal configuration to a pin or other terminal of an electrical component . fig1 shows the lead clip 219 with its lead 221 bent out at a right angle to terminal pin 209 , and terminated in a solder - holding arrangement 250 to permit surface mounting of connector 211 on a substrate ( not shown ). the solder - holding arrangement may have any appropriate construction , such as shown in u . s . pat . no . 4 , 679 , 889 . referring now to fig2 , therein is shown an alternative embodiment of the present invention , which is similar to that shown in fig1 - 6 . however , as seen in fig2 , clip 317 is provided with two pairs of fingers 319 , with one pair of fingers being located on the side of clip 317 adjacent carrier strip 15 , and the other pair of fingers being located on the opposite side of clip 317 . clip 317 has a generall double i - shape , which may be formed by a progressive stamping operation . two solder portions 321 are positioned laterally across the two pairs of fingers 319 . the solder portions 321 may be formed in much the same manner as solder wire 25 ( fig2 ). each pair of fingers 319 is then curled around the corresponding solder portion 321 to thereby securely retain the solder portion 321 ( fig2 ). as shown in fig2 , the solder sections 321 extend partially into the central aperture in clip 317 . referring now to fig2 , therein is shown a connector or other circuit component 31 having a plurality of pins 33 , with each of the pins 33 passing through the central aperture of a corresponding clip 317 . because the solder portions 321 extend partially into the central aperture , they act to frictionally engage the inserted pin 33 . after the clips 317 are positioned on the connector 31 , the pins 33 are subsequently inserted into corresponding holes 35 of a substrate 37 . heat is then applied , which causes the solder sections 321 to reflow and be drawn into the space between the terminals 33 and the sides of the holes 35 ( fig2 ). although the clip 317 shown in fig2 - 23 , is shown as being positioned between the connector 31 and substrate 37 , the clip 317 may also be used where it is positioned after the substrate 37 is mated with the clip 317 , similar to fig5 . referring now to fig2 , therein is shown the use of a pair of clips 219 ( after the removal of connecting portion 221 ) for soldering a pair of pins 33 on a connector 31 to a pair of contact pads 350 positioned on opposite sides of a substrate 37 . effectively , the pair of clips 219 provide a “ straddle mount ” between the connector pins 33 and the substate 37 . as shown in fig2 , the clips 219 are positioned with their solder portions 225 facing each other . the connector pins 33 are then inserted into the opposed clips 219 , and the substrate is positioned in between clips 219 so as to be frictionally engaged by the opposed solder portions 225 . heat is applied , as described above , to cause the solder to reflow . the clips 219 may be provided as a pair of arrays to thereby solder an edge connector to two rows of contact pads , wherein each row is positioned on opposite sides of the substrate 37 . it will be understood that the solder elements 25 , 125 , 151 and 321 may incorporate customary solder flux to facilitate the proper soldering operation . while the solder - holding clips of the present invention are illustratively described as used with the terminals of a connector , it will be understood that these clips may be used in joining terminals of integrated circuit chips , chip holders , resistors , capacitors and other non - solder bearing electrical components to contact pads or plated holes of printed circuit boards or other substrates . the foregoing embodiments should be understood as exemplary only , the present invention being defined by the following claims .