the invention , which includes a method for quantifying adsorbed molecular contamination while using a particular adsorbed molecular contaminant test structure , is disclosed in further detail within the context of the description provided below . the description provided below is understood within the context of the drawings described above . the drawings are intended for illustrative purposes , and as such are not necessarily drawn to scale . fig1 to fig7 show a series of schematic cross - sectional diagrams illustrating the results of progressive stages of fabrication and use of an adsorbed molecular contaminant test structure in accordance with the preferred embodiment of the invention . fig1 shows a substrate 10 . a first photoresist layer 12 is located upon the substrate 10 . the substrate 10 may comprise any of several materials . non - limiting examples include conductor materials , semiconductor materials and dielectric materials . for convenience of use within semiconductor fabrication , the substrate 10 typically comprises a semiconductor substrate . preferably , the substrate 10 has a comparatively low affinity for an adsorbed molecular contaminant material desired to be quantified in accordance with the invention . the first photoresist layer 12 may comprise any of several photoresist materials . non - limiting examples include positive photoresist materials , negative photoresist materials and hybrid photoresist materials . typically , the first photoresist layer 12 is formed using conventional spin - coating and thermal curing methods that provide the first photoresist layer 12 with a thickness from about 1000 to about 20000 angstroms . fig2 shows the results of photoexposing and developing the first photoresist layer 12 to yield first photoresist layer 12 ′ that exposes the substrate 10 at the bottom of a first aperture a 1 . the first aperture a 1 typically has a linewidth from about 10 to about 100 microns . the photoexposing and developing of the first photoresist layer 12 to provide the first aperture a 1 is undertaken using generally conventional methods and materials . fig3 shows the results of depositing a first test material layer 15 ( i . e ., a first test site ) upon the semiconductor structure of fig2 and in particular partially filling the first aperture a 1 . similarly with the substrate 10 , the first test material layer 15 may comprise any one of a conductor material , a semiconductor material and a dielectric material . typically , the test material is selected as a material that may be of particular importance with respect to adsorbed molecular contamination determination within a manufacturing process . within the context of a semiconductor manufacturing process , a dielectric material , such as a dielectric material having a composition that may be used within a gate dielectric layer , is often of particular importance . within the embodiment , the first test material layer 15 is deposited with a thickness k 1 v , where v is intended as a base design thickness ( which may be experimentally determined and verified as an actual value ) and k 1 is intended to designate a multiplier for the base design thickness v . for example and - without limitation , a base design thickness v may be in a range from about 10 to about 50 angstroms , and a first multiplier k 1 for the base design thickness may be an integral multiplier or a non - integral multiplier . typically , k 1 equals unity . fig4 shows an additional sequence of processing that corresponds with the sequence of processing of fig2 to fig3 , but with a second photoresist layer 13 that has a second aperture a 2 therein laterally separated from the first aperture a 1 . fig4 also illustrates a second test material layer 15 ′ that has a second thickness k 2 v . similarly with the fist thickness k 1 v , the second thickness k 2 v also comprises a base design thickness v and a second multiplier k 2 . thus , the first test material layer 15 and the second test material layer 15 ′ are interrelated in thickness by a first multiplier k 1 and a second multiplier k 2 with respect to a base design thickness v . fig5 shows an additional sequence of processing that corresponds with the sequence of processing of fig2 to fig3 , but with a third photoresist layer 14 and a third test material layer 15 ″. the third photoresist layer 14 is otherwise analogous or equivalent to the second photoresist layer 13 or the first photoresist layer 12 ′, but the third photoresist layer 14 defines a third aperture a 3 separated from the second aperture a 2 and the first aperture a 1 . in accordance with disclosure above , the third test material layer 15 ″ has a third thickness k 3 v , where , again , v is a base design thickness and k 3 is a third multiplier . thus , each of the first test material layer 15 , the second test material layer 15 ′ and the third test material layer 15 ″ is interrelated to a base design thickness v by way of the corresponding first multiplier k 1 , second multiplier k 2 and third multiplier k 3 ( i . e ., a designed thickness interrelationship ). typically , although not exclusively , the first multiplier k 1 , the second multiplier k 2 and the third multiplier k 3 are integrally related . fig6 shows the results of stripping excess portions of the third test material layer 15 ″ from the third photoresist layer 14 and then stripping the third photoresist layer 14 from the substrate 10 . fig6 thus shows a test structure that comprises a substrate 10 having a series of first , second and third test material layers 15 , 15 ′ and 15 ″ located thereupon . within the invention , the substrate 10 may comprise any of several materials , including but not limited to : conductor materials , semiconductor materials and dielectric materials . similarly , the first , second and third test material layers 15 , 15 ′ and 15 ″ may also comprise any of several test materials ( i . e ., conductor , semiconductor or dielectric ), but they are all formed of the same material preferably deposited identically . fig7 shows a schematic cross - sectional diagram illustrating the results of exposing the test structure of fig6 within a test environment that comprises a concentration of a molecular contaminant that absorbs upon the test material layers 15 , 15 ′ and 15 ″. the adsorbed molecular contaminant forms adsorbed molecular contaminant layer 1 8 , having a nominally identical thickness s upon each of the test material layers 15 , 15 ′ and 15 ″. in accordance with the invention , a total film thickness measurement is made for each of the composite layers comprising a first , second or third test material layer 15 , 15 ′ or 15 ″ and the adsorbed molecular contaminant layer 18 ( i . e ., 15 / 18 , 15 ′/ 18 and 15 ″/ 18 ). the thickness of the individual composite layers are t 1 = k 1 v + s , t 2 = k 2 v + s and t 3 = k 3 v + s ( i . e ., in general tm , n = km , nv + s , where m , n equal 1 , 2 , 3 . . . etc .). the measurements maybe made using an ellipsometry method , an optical scattering method , an ion beam method or an alternative quantification method having an appropriate resolution . the thickness measurement uses a measurement beam 19 that is nominally perpendicular to the plane of the substrate 10 . in light of the foregoing equations , actual values for v ( i . e ., base design thickness ) and s ( i . e ., adsorbed contaminant layer thickness ) may be calculated using any two test structures km and yn having any two thicknesses tm and tn as follows . the foregoing process and measurement are subject to measurement variation within the context of only two data points . thus , a regression analysis may be used for purposes of reducing measurement variations . the result of such a regression analysis is shown in the graph of fig8 . in general the graphical analysis uses the linear regression equation : tn = v * kn + s . for the graph of fig8 , an intercept s is equal to 8 . 25 angstroms as the actual measured value of the adsorbed molecular contaminant layer . a slope is equal to 9 . 91 angstroms which equates to the base design thickness v . the preferred embodiment of the invention is illustrative of the invention rather than limiting of the invention . revisions and modifications may be made to methods , materials , structures and dimensions in accordance with the preferred embodiment of the invention , while still providing an embodiment in accordance with the invention , further in accordance with the accompanying claims .