List of AMD mobile microprocessors

Initial platform (2003).
Launched in 2003, the initial platform for mobile AMD processors consists of:
Mobile Sempron.
"Dublin" (Socket 754, CG, 130 nm, Desktop replacement).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit"
"Dublin" (Socket 754, CG, 130 nm, Low power).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit"
"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit"
"Sonora" (Socket 754, D0, 90 nm, Low power).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit"
"Albany" (Socket 754, E6, 90 nm, Desktop replacement).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit"
"Roma" (Socket 754, E6, 90 nm, Low power).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit"
Mobile Athlon 64.
"ClawHammer" (C0 & CG, 130 nm, Desktop replacement).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"ClawHammer" (C0 & CG, 130 nm, 62 W TDP).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"ClawHammer" (CG, 130 nm, 35 W TDP).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"Odessa" (CG, 130 nm, Desktop replacement).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"Odessa" (CG, 130 nm, 35 W TDP).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"Oakville" (D0, 90 nm, 35 W TDP Low Power).
"MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"Newark" (E5, 90 nm, 62 W TDP).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
Turion 64.
"Lancaster" (90 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!"
Kite platform (2006).
Introduced in 2006, the "Kite" platform consists of:
Mobile Sempron.
"Keene" (Socket S1, F2, 90 nm, Low power).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!"
Turion 64.
"Richmond" (90 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion 64 X2.
"Taylor" (90 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
"Trinidad" (90 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Kite Refresh platform (2007).
AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.
Mobile Sempron.
"Sherman" (Socket S1, G1 & G2, 65 nm, Low power).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64"
Athlon 64 X2.
"Tyler" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion 64 X2.
"Tyler" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Puma platform (2008).
The "Puma" platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:
Mobile Sempron.
"Sable" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!"
Athlon X2.
"Lion" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion X2.
"Lion" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion X2 Ultra.
"Lion" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Yukon platform (2009).
The "Yukon" platform was introduced on January 8, 2009 with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.
Athlon Neo.
"Huron" (65 nm, 15 W TDP).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V"
"Sherman" (65 nm, 15 W TDP).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
"Congo" (65 nm, 13 W TDP).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
Turion.
"Congo" (65 nm, 20 W TDP).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!"
Congo platform (2009).
The "Congo" platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.
Athlon Neo X2.
"Conesus" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V"
Turion Neo X2.
"Conesus" (65 nm).
"MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!"
Tigris platform (2009).
The "Tigris" platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:
Sempron.
"Caspian" (45 nm).
Single-core mobile processor
"MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Athlon II.
"Caspian" (45 nm).
Dual-core mobile processor
"MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion II.
"Caspian" (45 nm).
Dual-core mobile processor
"MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Turion II (Ultra).
"Caspian" (45 nm).
Dual-core mobile processor
"MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V"
Nile platform (2010).
The "Nile" platform introduced on May 12, 2010 for the third AMD Ultrathin Platform consists of:
V series.
"Geneva" (45 nm).
Single-core mobile processor
Athlon II Neo.
"Geneva" (45 nm).
Single-core mobile processor
Single-core mobile processor
Dual-core mobile processor
Turion II Neo.
"Geneva" (45 nm).
Dual-core mobile processor
Danube platform (2010).
The "Danube" platform introduced on May 12, 2010 for the AMD Mainstream Notebook Platform consists of:
V series.
Champlain (45 nm).
Single-core mobile processor
Athlon II.
Champlain (45 nm).
Dual-core mobile processor
Turion II.
Champlain (45 nm).
Dual-core mobile processor
Phenom II.
Champlain (45 nm).
Dual-core mobile processor
 Triple-core mobile processors 
 Quad-core mobile processors 
Brazos platform (2011).
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs.
Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:
Sabine (Fusion) platform (2011).
The "Sabine" platform introduced on June 30, 2011 for the AMD Mainstream Notebook Platform consists of:
""Llano" (32 nm).
1 Unified shaders : Texture mapping units : Render output units
Brazos 2.0 platform (2012).
AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs.
This platform consists of:
Comal (Fusion) platform (2012).
The "Comal" platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of:
"Trinity" (2012, 32 nm).
1 Config GPU are Unified shaders : Texture mapping units : Render output units
"Richland"" (2013, 32 nm).
1 Config GPU are Unified shaders : Texture mapping units : Render output units
Jaguar (2013).
"Temash" (2013, 28 nm).
Elite Mobility APU:
1 Unified shaders : Texture mapping units : Render output units
"Kabini" (2013, 28 nm).
Mainstream APU:
1 Unified shaders : Texture mapping units : Render output units