List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
Through-hole packages.
Through-hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
Surface mount.
Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.
Chip carrier.
A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Ball grid array.
Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.
Package dimensions.
All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).
Multi-chip packages.
A variety of techniques for interconnecting several chips within a single package have been proposed and researched:
By terminal count.
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC).
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of , but the imperial 01005 name is already being used for the package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.
Two-terminal packages.
Rectangular passive components.
Mostly resistors and capacitors.
Metal electrode leadless face (MELF).
Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.
DO-214.
Commonly used for rectifier, Schottky, and other diodes.
Packages with more than six terminals.
Quad-in-line.
Quad-in-line:
Non-packaged devices.
Although surface-mount, these devices require specific process for assembly.
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.