a laser drilling system for drilling blind vias in printed circuit board panels , multichip modules and chipscale packages with top and bottom surfaces and which include multiple dielectric polymer and metal layers . the system includes a first laser module comprising a laser able to form at least one via per pulse through one or more polymer layers . the vias are circular or non - circular in shape . an articulated arm is adapted to move at a speed of about 200 inches per second and at an acceleration of about 5 g &# 39 ; s or more . a beam delivery unit is attached to the articulated arm and a conveyor adapted to move panels at a constant speed . the first laser module positioned on a separate track from the conveyor moves at a faster rate than the conveyor to drill the top surface . a second laser module is positioned to move on another separate track from the conveyor movable at a faster rate so as to drill the bottom surface .