corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners by exposing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100 ° c . to 2300 ° c . and emitting a dominant wavelength in the range of 2 . 1 to 1 . 0 microns . the speed of adhesive bond development is increased . polymeric adhesives may be used as alternatives to conventional starch based adhesives .