a solder structure comprising a radially - curved exterior surface enclosing a predetermined - sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties . by assembling the two planar elements in a tiered arrangement , one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad , separated by a spherical solder compound comprised of solder and a fluxing agent , a hollow solder structure can be created during a melting and subsequent cooling of the solder compound . the plasticity / resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint .