the present disclosure relates to a bonding system comprising an adhesive , comprising thermoplastic material , in contact with a first contact surface and a second contact surface , and a plurality of solder particles positioned in the adhesive in contact with the first contact surface . also , the present disclosure relates to a bonding method to produce a solder - reinforced adhesive bond joining a first substrate and a second substrate , comprising applying , on a first contact surface of the first substrate , an adhesive comprising thermoplastic material , positioning , at least partially into the adhesive , each of a plurality of particles , such that each of the plurality of solder balls contacts the first contact surface , connecting , to a portion of the adhesive opposite the first contact surface , a second contact surface of the second substrate , and applying heat to the first contact surface such that each of the plurality of solder particles reaches a solder bonding temperature .