carbon fiber - filled pc - abs resin compositions which have improved electrical properties at a given level of carbon fibers , and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder . the bundles are dispersed within the pc - abs blend . the compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and / or emi shielding . such articles include , but are not limited to electronic devices , dust handling equipment and notebook computer enclosures .