the invention broadly relates to cyclic olefin polymer bonding compositions and release compositions , to be used independently or together , that enable thin wafer handling during microelectronics manufacturing , especially during a full - wafer mechanical debonding process . the release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent , and that are stable at room temperature for longer than one month . the cyclic olefin polymer bonding compositions provide high thermal stability , can be bonded to fully - treated carrier wafers , can be mechanically or laser debonded after high - temperature heat treatment , and are easily removed with an industrially - acceptable solvent . wafers bonded according to the invention demonstrate lower overall post - grind stack ttv compared to other commercial bonding materials and can survive 200 ° c . pecvd processing .