a sacrificial plastic mold having an electroplatable backing is provided . one embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate and into the features of a microscale molding tool contacting the porous metal substrate . upon demolding , the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool . this plastic structure , in turn , provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non - contiguous metal replicates . after electroplating and lapping , the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate . optionally , the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon .