the present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes . the materials can be hardened by photo - irradiation or by heat during the planarization process , and they include one or more types of monomers , oligomers , or mixtures thereof , an optional cross - linker , and an optional organic reactive solvents . the solvent , if used , is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process . these materials can be used for damascene , dual damascene , bi - layer , and multi - layer applications , microelectromechanical system , packaging , optical devices , photonics , optoelectronics , microelectronics , and sensor devices fabrication .