memory cards containing integrated circuits and other electronic components in a variety of form factors having high quality external surfaces of polycarbonate , synthetic paper , or other suitable material can be made through use of injection molded thermoplastic material or thermosetting material that becomes the core layer of said memory cards and similar devices . the object of the invention is to provide the following properties to memory cards : rapid production cycle , high volume manufacturing throughput , security , electronics protection , better tamper resistance , durability , and highly reliable complex electronics encapsulation , achieved through a process utilizing low temperature and low pressure .