a method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded . by using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur . the method and apparatus provides rapid , reproducible bonding even for the smallest of contact geometries . for example , the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape , such as a polyimide , without damaging the tape . a strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape . in the application of the present invention to the bonding of conductive leads on a tab circuit to the silicon substrate of an inkjet printhead the need for a window in the tab circuits is eliminated . the elimination of the window results in elimination of the need for an encapsulation material to cover the conductive leads in the tab circuit . this in turn results in die size reduction , or increased number of nozzles with the same die size , ease of assembly , higher yields , improved reliability , ease of nozzle serviceability , and overall material and manufacturing cost reduction .