the shield can plate for a smd process in accordance with the present invention , includes : a metal conductive layer which is made of one selected from a group consisting of copper , zinc , nickel , silver , iron and chromium or an alloy thereof , or clad metal , performs an electromagnetic shielding function and maintains a physical structure when a shield can is constructed ; an insulating layer which is made of one or more of polyethylene terephthalate and polyethylene naphthalate , which are crystalline polymers , wherein the insulating layer is laminated on one side of the metal conductive layer ; and a silane - based coupling layer interposed between the metal conductive layer and the insulating layer .