a heat seal blister package having an improved moisture vapor transmission barrier hindering penetration of moisture into the blister package from the surrounding environment to support and protect a product therewithin , and a method for forming same . the blister package includes a substantially paperboard substrate , a coating having moisture vapor transmission barrier properties and heat seal capabilities and a plastic blister attached to at least one side of the substrate over a coated portion of the substrate by a heat seal , to create an enclosed pocket isolated from the surrounding environment , in which to house a product . the coating imparts a moisture vapor transmission barrier to the paperboard substrate to reduce penetration of moisture through the substrate , while simultaneously imparting heat sealing capabilities to the coated portion of the substrate to make the coated portion of the substrate susceptible to a heat seal .