there is disclosed a novel sandwich blister package for adhesive composition products and similar articles which generally experience short shelf lives due to exposure to air , vapors , and other environmental elements . the package comprises a plastic film blister having heat - formed cavities which contain the product ; and a laminated blister card superimposed upon and sealed to the plastic film blister to form an air , water , and vapor - proof blister package assembly of a predetermined size and shape that significantly extends shelf life of the adhesive composition product .