the present invention is directed to a method that attenuates , if not avoids , heating of a substrate undergoing imprint lithography process and the deleterious effects associated therewith . to that end , the present invention includes a method of patterning a field of a substrate with a polymeric material that solidifies in response to actinic energy in which a sub - portion of the field is exposed sufficient to cure the polymeric material is said sub - portion followed by a blanket exposure of all of the polymeric material associated with the entire field to cure / solidify the same .