the invention describes a method for bonding components of a sputtering target , comprising the following steps : providing a first component and a second component , the harder of which has undercut protrusions ; positioning them against each other ; and pressing them towards each other resulting in a plastic deformation of the material of at least one of the two components , filling the undercuts thereby creating interlocking , as well as the bonded assembly so created , and its recycling . no step creating bonding other than interlocking on a major part of the bonded surface area is necessary .