the present invention is directed to a method for the lamination of metals , and especially copper , to the surfaces of fluoropolymers at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers . more specifically , the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of a metal in the presence of a functional monomer . the process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator . the so - laminated fluoropolymer - metal interfaces exhibit t - peel strengths of no less than 8 n / cm and delaminate via cohesive failure inside the fluoropolymer .