a tacking agent is provided for use in temporarily adhering electronic components and providing fluxing properties for soldering electronic assemblies . the tacking agent comprises a fluxing agent and a tackifier . the fluxing agent is composed of one or more carboxylic acids having the formula ## str1 ## where r is an alkyl group containing from 1 to 6 carbon atoms , r &# 39 ; is selected from the group consisting of hydrogen and hydroxyl , and r &# 34 ; is selected from the group consisting of hydrogen , hydroxyl and carboxyl . the tackifier comprises one or more alcohols , aromatic hydrocarbon solvents , aliphatic hydrocarbon solvents , or polymers . the tacking agent is deposited onto a printed circuit board or other substrate , the electronic components are placed into the deposited tacking agent and soldered . during solder reflow the fluxing agent provides fluxing action for the soldering process , and the tackifier volatilizes , leaving little or no residue on the printed circuit board .