a polishing pad for use in chemical mechanical polishing is disclosed . the polishing pad has a pad surface for polishing wafer surfaces . the pad surface is composed of a polymeric matrix material . the polishing pad also contains a polymeric additive which is defined in the polymeric matrix of the pad surface and in cells of the pad surface . the polymeric additive may include one of a polyurethane , a polyamide , a polyester , a polyacrylonitrile , a polyacrylate , a polymethacrylate , a polyvinylchloride , and a polyvinylidene chloride . the polymeric additive is configured to be hydrophilic so that the pad surface is wettable to enable improved slurry distribution over the pad surface .