a sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate and into the features of a micro - scale master mold . upon casting and demolding , the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool . the plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate , which provides a conducting support suitable for electroplating either contiguous or non - contiguous metal replicates . after electroplating and lapping , the sacrificial plastic can be dissolved , leaving the desired metal structure bonded to the porous metal substrate . optionally , the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon .