a system is disclosed for laminating surfacing materials , such as high and low pressure laminates , paper , wood veneers , metal foils and the like , to core material , such as plywood , particle board , flake board , hard board , rigid plastic foams and the like . the disclosure includes a machine for laminating , particularly utilizing high viscosity , hot melt adhesives within the ambient conditions of a factory . a sandwich is formed at ambient temperature with the adhesive between the laminate and core either as sheet material or precoated on the laminate or the core . the method employs a progressive heating of the adhesive and adjacent parts of the sandwich from ambient temperature through tackiness to an activating temperature followed immediately by a physical migration of the adhesive to wet out adjacent surfaces followed by a cooling of the sandwich to a mechanical bonding adhesive temperature . the machine is particularly useful in non - toxic , non - ventilated installations for laminating wherein it is desired to avoid solvent handling as well as the difficulties of melting and applying hot melt adhesives and controlling the necessary conditions thereof .