in encapsulating an optocomponent with a plastics material , an mt - connector compatible interface is obtained having bores for guide pins in the wall of the capsule and optical connection surfaces . these bores are obtained from mold cavity guide pins that are used for aligning the optocomponent in a mold cavity in a mold in the molding operation of the encapsulating material on top of the component . in order to achieve a good accuracy in the positioning of the component during the molding operation , the mold guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mold half . thus , cavities are created extending straight through the capsule behind the component . the cavities allow that the guide pin bores are cleansed and that material residues are removed after the molding operation . further , the cavities can be used for spring clamps for retaining the optocomponent capsule at an optical connector having a similar interface . the clamps can then have tongues that are inserted in the cavities and that , in addition , can be provided with holes through which the guide pins can be pushed to safeguard the clamps against being lost .