a finish laminate for high - frequency circuits , which consists of a metal - covered multilayer structure composed of at least one fundamental laminate in which a glass cloth layer is laminated on at least one side of an ultrahigh molecular - weight polyethylene layer with an adhesive layer interposed between the layers and , one fundamental laminate being able to be laminated on another with an adhesive layer interposed therebetween , and a metal foil laminated on at least one outermost layer of the multilayer structure with an adhesive layer interposed therebetween . in one embodiment , the glass cloth layer may be impregnated with a curable thermosetting resin or with this resin and a thermoplastic resin to form a resin - containing glass cloth layer or , thereby dispensing with an adhesive layer when laminating a metal foil on the outermost layer of the multilayer structure .