a method for releasing a handler from a wafer , the wafer comprising an integrated circuit , includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer , the handler comprising a material that is transparent in a wavelength range of about 193 nanometers to about 400 nm ; ablating the adhesive through the handler using a laser , wherein a wavelength of the laser is selected based on the transparency of the handler material ; and separating the handler from the wafer .