a lubricating composition for use in slicing or cutting silicon wafers . the composition includes a soap , a phosphorous containing compound , and an ethylene oxide - propylene oxide polymer . the phosphorous compound is a low temperature , extreme pressure lubricant . the ethylene oxide propylene oxide polymer is a high temperature , extreme pressure lubricant . suitable soaps include c6 - c18 fatty acids reacted with triethanolamine or aminoethanolamine . additionally , biocides or fungicides may be added . also an antifoam and a complexing aid such as edta may be used .