the invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor , optical and magnetic substrates . the polishing pad includes a polishing layer having a polymeric matrix , a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing . radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor , optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad .