a method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a shearing blade into a loading position . load the assembly of the substrate and the chip into a fixture with a window therethrough for the chip with the shearing blade in contact with the chip . remove the loading force to arm the shearing blade to apply a shearing force from the shearing blade to the chip . heat the solder connections of the assembly in the fixture to a predetermined temperature , preferably below the melting temperature of the solder at which shearing of the solder connections occurs . the shearing blade comprises a slidable plastic blade backed up by a metal blade . the shearing blades are affixed to a the slide block that is connected by a linkage to a coil spring which applies the biasing force thereto and which provides a nest for catching a chip which has been sheared away from a substrate .