a method for encapsulating structures supported by a carrier substrate , includes : application , on the carrier substrate , of at least one cover supported by a mould , the mould including a catching layer , each cover being in contact with the catching layer ; then fastening of at least one cover onto the carrier substrate ; and then separation of the mould from the at least one cover . the catching layer includes a fluoropolymer . preferably , the mould is mechanically separated from the at least one cover , by pulling the mould away from the at least one cover . thus , the mould can be reused , which considerably simplifies encapsulating operations carried out on an industrial scale .