this invention is a method of using a heat activatable adhesive for laminating vinyl sheet to wood . the organic solvent - free adhesive combines a reactive styrene - acrylic latex emulsion , an ethylene vinyl acetate copolymer emulsion , and a wax . after application to the vinyl substrate the adhesive is heat activated at temperatures as low as 160 ° f . and the laminate resists delamination at 190 ° f . .