method of forming a flexible circuit laminate for use in the production of flexible circuits , comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side , modifying a second side of the polyimide strip to increase the surface energy thereof , applying a preformed adhesive film on the second side of the generally continuous strip of polyimide , the adhesive strip being formed of a substantially uncured polymeric material , and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured .