a laminated wear ring for a chemical mechanical planarization apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing / planarization operation . the laminated wear ring includes a high stiffness stainless steel base and a plastic laminate . the high stiffness stainless steel base avoids flexing of the wear ring during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed . the plastic laminate protects the stainless steel base from attack by the polishing slurry and provides a buffer that protects the stainless steel base from mechanically damaging the wafer and vice versa .