an in - situ method for regenerating a chemical - mechanical polishing pad which includes the steps of : forming the polishing pad by dispensing liquid moldable material , such as wax , polymers or water , on a polishing surface and solidifying the liquid material by reducing the temperature , allowing the moldable material to harden ; distributing slurry material on the polishing pad ; polishing the surface of a semiconductor wafer with a combination of the slurry material and the polishing pad ; and regenerating in - situ the polishing pad . this method quickly , easily and repeatably , resurfaces and refreshes the surface on which the a semiconductor wafer is polished . the polishing pad may also include abrasives embedded therein to enhance its polishing capabilities .