a method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold is provided . the method comprises the steps of : providing an adhesive polymeric film having a protective liner ; depositing photoresist onto the protective liner ; photopatterning the photoresist to define a plurality of openings positioned for etching supply holes through the film ; etching the plurality of ink supply holes through the film , the photoresist acting as a mask for the etch ; and removing the protective liner having the photoresist deposited thereon .