the present invention provides a material for packaging electronic components . in one embodiment , the packaging material comprises a puncture resistant film having opposed first and second major surfaces ; a substantially continuous metal free light transmissible layer disposed on the first surface of the puncture resistant film , wherein the light transmissible layer comprises at least one pair of polymer layer and transparent conductive oxide layer ; and a heat sealable layer disposed on the light transmissible layer or on the second surface of the puncture resistant film . other embodiments are provided .