an adhesive dispensing die module for mounting on a manifold incudes a die body having formed therein polymer and air flow passages , and a valve for selectively closing the polymer flow passage and a die tip or die nozzle detachably mounted on the die body . the die tip or die nozzle is secured to the die body by a pair of clamping members depending from the die body and adapted to engage die tip or die nozzle therebetween . the clamping members can selectively be moved toward one another to clampingly secure the die tip or die nozzle therebetween or moved away from one another to release the die tip or die nozzle , permitting it to be replaced without the need to remove the die module from the manifold .