there is disclosed herein an improved method and apparatus for plastic sealing / bonding in which a wire element is positioned between two interfacing pieces to be sealed / bonded together , wherein one or both of said pieces are wholly plastic or contain a plastic component . with the wire sandwiched and retained between the interfacing surfaces , a voltage is applied to the wire for a predetermined time to cause the wire to heat sufficiently to melt both interfacing surfaces and effect a fusion and formation of a bond .