Clamping device for a thermally and electrically pressure-contacted semiconductor component in disk-cell construction
BACKGROUND OF THE INVENTION 
     1. Field of the Invention 
     The invention is concerned with a clamping device for a thermally and electrically pressure-contacted semiconductor component in disk-cell construction with two pressure or conductor plates between which the semiconductor component is placed and which can be squeezed together by means of clamping bolts and flat springs with an adjustable force measurable on the clamping device, the clamping bolts being guided by springs and the center of the spring engaging a convex surface in the center of one pressure or conductor plate. 
     2. Description of the Prior Art 
     In a known clamping device of this type, (DT-OS 2,210,180), exact pressure symmetry is obtained by an adjustable force, measurable by the deflection of the ends of the leaf springs, and the localized exertion of this force at the center of the one pressure plate -- without rigid coupling. Only with a closely toleranced clamping force and exact pressure symmetry are optimal current and heat transfers at the contact surfaces guaranteed. Of course, the magnitude of the contact force is determined mainly by the necessarily small thermal resistances of the disk-cell itself and the thermal resistances between it and the heat sinks. The sum of all thermal resistances at given temperature gradients is a measure of the current-carrying capacity or the permissible dissipation of the semiconductor element. A closely toleranced clamping force results from the requirement that the contact force is to be proportioned according to the crystal surface and must be held constant within relatively narrow tolerances independent of temperature. 
     The term &#34;disk-cell construction&#34; or &#34;disk-cell&#34; will be understood in the present connection to mean a semiconductor disk enclosed in an insulating housing with the interposition of conducting plates. Additional conductor plates or heat sinks can be pressure-contacted outside the insulating housing. Such high-power semiconductor components are widely known (e.g. Type CS 500 of Brown Boveri Co., Mannheim or from &#34;VDI-Zeitschrift&#34; 107 (1965) No. 34 - December, p. 1656). From the latter reference, it is further known how to clamp disk cells in heat sinks and, depending on the desired current capacity, to provide them with self-cooling, forced-air cooling or liquid cooling. It is also known how to clamp the heat absorbing sides of heat ducts (DT-OS No. 2,417,106). 
     SUMMARY OF THE INVENTION 
     The aim of the invention, starting with the clamping device of the aforementioned type, is to cope with very large disk cells or very large contact forces while maintaining measurability of the force on the clamping device itself and thus a closely toleranced clamping force, the pressure distribution being uniform along the diameter also. Disk-cell contact forces have already reached values of 28 KN and this is not the final limit. 
     The solution of the problem is that, in accordance with the invention, there serves as a plate spring over at least the one pressure or conducting plate, a large-area clamping plate with a central threaded insert, which clamping plate can be stressed by turning a central clamping screw, pressing against the convex surface, through a certain angle proportioned to the force, the plate being restrained by four clamping bolts passing through its corners. 
     Preferably a square clamping plate held at all four corners is used. 
     While in the aforementioned known design (DT-OS No. 2,210,180) the necessary clamping force is obtained by alternate tightening of the nuts on the clamping bolts, only a central screw in the clamping device of the invention need be turned. 
     The overall height of the clamping device is significantly less than in the case, for example, of known designs with cups, saddle or coil springs (DT-AS No. 1,276,209, DT-AS No. 1,204,751, GB-PS No. 777,985, DT-AS No. 1,248,813), because the spring action is obtained over the large area of the clamping plate. This is also an advantage over the object of DT-OS 2,210,180, because in practical realization of the known design, in order to attain the 18 KN contact pressure mentioned by way of example, three 22 × 4 mm 2  leaf springs must be stacked, allowing a spring deflection of only 1.5 mm which, in combination with the visual indicator, can lead to undue departures from the desired spring force. 
     With other dimensions the same, a contact force of up to 25 KN with about 4 mm spring deflection can be developed with the square clamping plate of the invention, 4 mm thick for example. Because of the softer spring characteristic and elimination of friction between parts, the force is more precisely adjustable. It is also read better visually; for, of course, the position angle of the clamping screw in the clamping plate is marked with the corresponding tolerance limits and thereby the required clamping force on the clamping plate or the pressure on the disk cell can be set. The spring deflection is consequently great enough to maintain the permissible tolerance of customarily +10% of the clamping force. 
     At higher power levels, the pressure or conductor plates are preferably in the form of liquid-cooled heat sinks of conventional type. As is known, such arrangements permit higher thermal transfer values than do directly air-cooled heat sinks. 
     While in the known case (DT-OS 2,210,180) the pressure or conductor plates are aligned on the clamping bolts so that, for the sake of pressure symmetry, the convex surface on the one pressure plate has its point of contact exactly on the axis of symmetry, in the clamping device of the invention, the central clamping screw is held exactly on the symmetry axis and the heat sinks, which are not aligned on the draw bolts, are arranged symmetrically with respect to the central axis of the disk cell and symmetrically with respect to the mid-plane in the clamping direction. Since there is likewise no rigid coupling between the convex surface and the clamping screw, there is guaranteed a symmetrical pressure distribution in the clamping device of the invention also. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     Various objects, features and attendant advantages of the present invention will be more fully appreciated as the same becomes better understood from the following detailed description of the present invention when considered in connection with the accompanying drawings, in which: 
     FIG. 1 shows a clamping device for a pressure-contacted semiconductor component in disk-cell construction with two head-sink capsules for liquid cooling. 
     FIG. 2 is a partial perspective view from above of the clamping device of FIG. 1, and 
     FIG. 3 is a detail of a draw bolt at a clamping plate. 
    
    
     Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more particularly, to FIG. 1 thereof, the disk cell 1 lies between two cooling capsules 2, one of which is supported on a pedestal 3 on a transom 4. This is provided with four insulating pieces 5 through which the draw rods or clamping bolts 6 pass and the latter are furnished with nuts 6&#39;. The draw rods 6 are insulated from the transom 4 by insulating tubes 7. On the upper cooling capsule 2&#39; shown in the drawing there is a pedestal 8 with a convex surface 8&#39; on which a clamping screw 13 presses. The reaction force of the clamping screw 13 is transmitted by way of a threaded insert 12 to a large-area, square clamping plate 11 which in turn is stressed by convex washers 9 and nuts 10 on the threaded upper ends of draw rods 6. 
     The clamping process is as follows: With the clamping screw 13 backed off by an amount a, the nuts 10 are screwed on by hand, after mounting the clamping or spring plate 11, until the clamping screw 13 is held in positive contact with the pedestal 8. The clamping screw is then turned through a definite angle α to produce, in accordance with the thread pitch, a screw advance by the amount a, resulting, in accordance with the spring stiffness c, in the required clamping force F, i.e. the angle α is a measure of the magnitude of the clamping force F. 
     Depending on the size of the semiconductor component, the contact force can range from 5 to 28 KN. The clamping plate 11 covers this range because it conveniently exhibits a flat spring characteristic. 
     To keep the threaded insert 12 from turning in the spring plate 11, its round body 14 is provided with flats 15 on two opposite sides (FIG. 2). Its seating hole 16 in the clamping plate 11 is correspondingly shaped to fit. The threaded insert 12 is supported at the clamping plate 11 by a shoulder 17. 
     The draw bolts 6 fit through holes 18 in the clamping plate 11 (FIG. 3). These holes are countersunk to receive the convex washers 9. This ensures that the draw rods 6 will not be subjected to bending forces and can freely stress the clamping plate within predetermined tolerances. In case several disk cells 1 and cooling capsules 2, 2&#39; are stacked in a self-evident manner, it is advantageous to replace the transom 4 with a second leaf spring or spring plate to allow for the resulting greater thermal expansion. 
     As a further refinement, it is possible, with direct air cooling, to anchor the draw rods 6 in the form of stud bolts directly in one of the pressure or conductor plates and employ the electrical insulating on the side of the plate spring 11. 
     Further, the pressure or conductor plates can also be heat absorbing ends of heat pipes, as shown for example from the journal &#34;Chemie-Ingenieur-Technik&#34; vol. 41, 1969, pp. 30-37 and in connection with thyristor cooling from the above mentioned literature. 
     Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described herein.