Compliant lead clip
BACKGROUND OF THE INVENTION 
     The present invention relates generally to an electrical connector with a resilient clamping finger and more particularly to a support for supporting an integrated circuit chip on a printed circuit board and interconnecting electrical circuits on the chip with circuits on the board. 
     U.S. Pat. No. 4,384,757 to Andrews et al. discloses a conductive terminal for supporting a ceramic integrated circuit chip on a printed circuit or wiring board and electrically interconnecting circuits on the chip and board. As explained in the patent, printed circuit boards are subject to mechanical and thermal stresses which may cause warpage of the board. In addition, thermal stresses can result from temperature changes and the heat generated by electrical components on the chip. These mechanical and thermal stresses can damage the chip. 
     The terminal disclosed in the Andrews et al. patent has a rather complex configuration, has different widths over its length, includes a parallel conductor portion to shorten the electrical path, is embedded in an elastomeric material which absorbs some of the stresses, and is intended for insertion into a hole in the printed circuit board. These characteristics create wear problems, place a limit on the minimum spacing which can be attained between adjacent terminals and make the terminals more expensive to manufacture. In addition, the terminal is not suitable for use in situations where it is desired to solder a terminal to a flat surface of the printed circuit board. 
     The foregoing illustrates limitations known to exist in present devices. Thus, it is apparent that it would be advantageous to provide an alternative directed to overcoming one or more of the limitations set forth above. Accordingly, a suitable alternative is provided including features more fully disclosed hereinafter. 
     BRIEF SUMMARY OF THE INVENTION 
     In one aspect of the present invention, this is accomplished by providing a compliant lead clip comprising a C-shaped member and an S-shaped member integrally formed from a single piece of conductive material such that the C-shaped and S-shaped members have a common first portion. The common first portion resiliently supports a first surface of an associated chip. A second portion of the C-shaped member resiliently engages a second surface of the chip and makes electrical contact therewith. A second portion of the S-shaped member resiliently engages a flat surface of an associated printed circuit board and makes electrical contact therewith. 
     The foregoing and other aspects will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawing. It is to be expressly understood, however, that the drawing is not intended as a definition of the invention, but is for the purpose of illustration only. 
    
    
     BRIEF DESCRIPTION OF THE DRAWING 
     FIG. 1 is a top view of an assembly illustrating an embodiment of compliant lead clips attached to an elongated strip of metal from which the clips are formed; 
     FIG. 2 is a front view of the assembly illustrated in FIG. 1; 
     FIG. 3 is a sectional view, taken along the line A--A of FIG. 2 and illustrating an embodiment of a single compliant lead clip still attached to an elongated strip from which it is formed; 
     FIG. 4 illustrates the manner in which a chip carrier is mounted on a printed wiring board using a plurality of compliant lead clips; and, 
     FIG. 5 illustrates another embodiment of a compliant lead clip. 
    
    
     DETAILED DESCRIPTION OF THE INVENTION 
     Compliant lead clips constructed in accordance with the principles of the present invention are preferably manufactured in ganged assemblies in accordance with known methods. According to a typical method, an elongated strip of flat metal is progressively fed into a machine which removes material from the strip so that there remains a narrower strip somewhat like the strip 10 of FIG. 1 but having spaced flat fingers extending therefrom. Each of the fingers is scored at some point to facilitate subsequent separation. During subsequent steps the portion of each finger beyond its score line is bent or formed into the desired shape. As illustrated in FIGS. 1-3, the result is a strip of ganged compliant lead clips 12 each having a substantially uniform width and thickness and attached at a score line 14 to a portion of a finger 16 extending from the strip 10. The strip 10 may be severed between any two fingers to obtain ganged assemblies containing any desired number of clips. 
     In accordance with the present invention the clips 12 are each formed as shown in FIG. 3 to comprise a generally C-shaped member and a generally S-shaped member each having a first end portion 18 which is common to both members. 
     The C-shaped member is bent at A and B to form two further portions 20 and 22. At A the clip is bent so that portion 20 extends at substantially a right angle to portion 18 whereas the clip is bent at B such that the second end portion 22 extends downwardly with an angle of less than 90° being formed between portions 20 and 22. The end of portion 22 opposite the bend B is curved upwardly at C. 
     The S-shaped member is provided with a bend of approximately 180° at D and includes a second straight portion 24. At the end of portion 24 opposite bend D, the clip is bent at E. A second end portion 26 of the clip beyond bend E is curved concave upwardly. 
     In FIG. 4, a miniaturized assembly such as a leadless large scale integrated circuit chip (IC) 30 is shown mounted on a substrate such as a printed circuit board (PCB) 32 using the novel clip comprising the present invention. The mounting is accomplished as follows. One edge of the IC is inserted into the C-shaped members of a plurality of clips 12 1  which are still ganged as illustrated in FIGS. 1 and 2. The opposing edge of the IC 30 is then inserted into the C-shaped members of a second plurality of clips 12 2  which are similarly ganged. The clips are then soldered to circuits (not shown) on the top and bottom of the IC as indicated at 38. The assembly is then placed on the PCB 32 with the curved portions 26 (FIG. 3) of the clips resting on the surface 42 of the board. After each clip is attached by solder 40 to a circuit (not shown) on the board surface, each clip is broken along the score line 14 (FIG. 3) and the strip 10 and fingers 16 are discarded. What remains is a plurality of individual clips, two of which are visible in FIG. 4, each clip being soldered to the supporting surface 42 of the PCB 32 and each clip being soldered to the upper and lower surfaces of the IC 30 thereby providing support for the chip and also providing electrical interconnection between circuit conductors on the chip and the board. 
     The compliant clip of the present invention can be quite small and permits high density packing. By way of example and not limitation, the width of each clip 12, as viewed in FIG. 2, may be 0.020&#34; and the distance between centers of adjacent clips may be 0.025&#34;. The clip may be formed from 0.01&#34; thick phosphor bronze alloy with a 60/40 tin/lead finish. The bends C and D (FIG. 3) form a throat for guiding an IC chip into the C-shaped member. In this regard, the distance between the common portion 18 and the lowermost portion at bend C is made substantially equal to the thickness of the chip which is to be inserted into the C-shaped member. Thus, the clip places no appreciable stress on the chip. In a typical embodiment, the height of the S-shaped member may be on the order of 0.095&#34; and the clip may be inserted about 0.059&#34; into the throat of the C-shaped member before striking portion 20. 
     A primary advantage of the compliant clip is that its use reduces solder joint stress and compensates for the different thermal coefficients of expansion of the chip 30 and the PCB 32. Referring to FIG. 4, a temperature change will cause an expansion or contraction of IC 30 and PCB 32 along the dimension seen in the Figure, the expansion or contraction being different for the chip (usually ceramic) and the board. At the same time therein is an expansion or contraction of the IC and the PCB along the dimension which is into the Figure. As a result, torsional shear forces are applied to the solder joints 40 and to the solder joints 38 on the lower surface of the IC 30. The S-shaped construction of the compliant clip absorbs much of the force which would otherwise be applied to the solder joints. More particularly, as the IC 30 moves relative to the PCB 32 the S-shaped member of each compliant clip twists to absorb some of the force. In FIG. 3, the twisting movement of each S-shaped member takes place primarily between, and including, the bends D and E. The S-shaped members work in a similar manner to absorb stresses which result from warpage of the PCB 32. 
     A further advantage of the compliant clip is that it permits higher density packing of components. As is evident from FIGS. 1 and 2, there are no bends in the clip which extend laterally of the plane of the clip. That is, all bends lie in a single plane. Furthermore, there are no appendages extending laterally of a clip. From inspection of FIG. 2 it is evident that during the manufacturing process the clips may be more closely spaced than if the clips had appendages extending laterally thereof. 
     The configuration of the compliant clip may vary somewhat from the configuration shown in FIG. 3. For example, FIG. 5 shows a slightly modified configuration wherein the common portion is curved upwardly as indicated at 18 1 . 
     The foregoing has described a compliant lead clip comprising a C-shaped member and an S-shaped member formed together such that the members have a common first portion which resiliently supports a first surface of an associated chip. A second portion of the C-shaped member resiliently and electrically engages a second surface of the chip. A second portion of the S-shaped member resiliently and electrically engages a flat surface of an associated printed circuit board. 
     The clip of the present invention reduces solder joint stress, compensates for different thermal coefficients of expansion between an associated chip and a PCB, permits higher density packing of components, avoids wear problems associated with insertable devices and generally reduces manufacturing expense due to a relatively non-complicated configuration of a flexible clip having a uniform width.