Power semiconductor package
BACKGROUND OF THE INVENTION 
     1. Technical Field 
     This invention relates to semiconductor devices and, more particularly, to power semiconductor device packaging. 
     2. Discussion 
     Prior art power semiconductor packages include the standard TO-228 and TO-254 semiconductor packages. Both of these packages are similarly hermetically sealed. However, when these packages are mounted perpendicular to the main heatsink, they require a daughter or intermediate heatsink to thermally connect the chip to a main heatsink. The daughter heatsink contributes to poor heat transfer because it consists of another metal to metal thermal contact between the semiconductor chip and the main heatsink. The need for a daughter heatsink also increases the spacing required for installing these power semiconductor devices. Finally, replacement of present semiconductor packages is inconvenienced since the daughter heatsink must also be removed. 
     SUMMARY OF THE INVENTION 
     In accordance with the teachings of this invention, a power semiconductor device package is provided which includes a main body having two opposite major surfaces and two opposite end surfaces. The body encapsulates power semiconductor chips in its interior. In addition there is a plurality of pins projecting from one of the end surfaces which are connected to the semiconductor chip. One of the major surfaces is mounted to a relatively thick metal back. This back consists of two opposite major surfaces as well as two broad, opposite end surfaces. Both the end surfaces of the back contain a plurality of holes to accommodate fastening devices. 
     A mounting arrangement for this package includes a printed wiring board with a plurality of openings therein for receiving pins of the semiconductor package as well as mounting screws for the package. The pins of the package are installed through the openings in the printed wiring board and soldered in place in order to create electrical contact. One end surface of the back is fastened to the printed wiring board through the appropriate mounting openings in the board and holes in the back of the package. The other end surface of the package body is fastened to a heatsink also having a plurality of mounting openings. 
     This invention provides hermetically sealed power semiconductor packages which minimize spacing while maximizing thermal efficiency. The invention eliminates the need for a daughter heatsink which was previously required in similar semiconductor packages, thus simplifying replacement and providing an efficient means of channeling excess heat generated by most power semiconductor chips. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     The various advantages of the present invention will become apparent to those skilled in the art after reading the following specification and by reference to the drawings in which: 
     FIG. 1 is a side view of a semiconductor package made in accordance with the teachings of the present invention; 
     FIG. 2 is a front view of the package shown in FIG. 1; 
     FIG. 3 is a cross-sectional view of a typical mounting arrangement for the package in FIG. 1; and 
     FIG. 4 shows a front view of the mounting arrangement shown in FIG. 3. 
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 
     Referring now to FIGS. 1 and 2, the semiconductor device package 10 includes a semiconductor chip 20 which is mounted on a substrate 21 which, in turn, is surrounded by an encapsulating body 11 made of copper, Kovar, molybdenum, beryllia or alumina. The body 11 has two opposite major surfaces 16 and 18 and two end surfaces 12 and 14. A number of pins 22 connected to the semiconductor chip 20 (e.g. by conventional wire bonds) extend out from the encapsulating body. The encapsulating body may contain multiple semiconductor devices if desired. The substrate 21 is bonded in such a manner to create good thermal contact with a relatively thick metal back 24. The back 24 is generally thicker than body 11, as well as being longer along the axis of the pins 22. By way of a typical example, the back 24 is 0.25 inch thick×0.70 inch wide×0.635 long and can be made of a variety of thermally conductive materials such as aluminum, copper and the like. The back 24 also has two opposite major surfaces 30 and 32 as well as two end surfaces 26 and 28. These end surfaces are large enough so that several tapped holes 34 may be drilled from end surface 26 to end surface 30. These holes 34 accommodate various fasteners, such as mounting screws which are used to attach the device 10 to various printed wiring boards and also to external heatsinks as will be discussed later herein. A second device 11&#39; may be added as seen in FIG. 1 to create a &#34;piggy back&#34; arrangement. The second device is mounted on the other opposite major surface 32 of the back 24. 
     A preferred mounting arrangement for device 10 is shown in FIGS. 3 and 4. A printed wiring board 38 has holes 39 drilled therein for fasteners 40 as well as pin receiving openings 41. The pins 22 of device 10 are inserted through the holes 41 and are soldered into place through the use of solder joints 42. The metal back 24 is attached to the printed wiring board 38 through the use of one or more fasteners 40 which engage the threads in openings 34 to draw the underside of the board 38 against end surface 28 of the back 24. The other end surface 26 of the back 24 is similarly attached directly to an external metal heatsink 44. The heatsink 44 has several holes 46 drilled into it in order to accommodate a pair of fasteners 47. 
     In view of the foregoing, several advantages may be appreciated over the prior art. This invention provides a printed wiring board to heatsink mounting structure without the requirement of a daughter heatsink. This minimizes spacing in addition to eliminating the daughter heatsink for this type of application. This arrangement provides a very secure mounting thereby minimizing the detrimental effects of thermal stresses on the solder joints and hermetic, lead, ceramic or glass seals which may be used. In addition, it provides a secure mounting of the heatsink to the package. This also provides a direct metal to metal contact with high compression for good heat transfer. Since the daughter heatsink is not required in this mounting, it eliminates one metal to metal thermal contact which would otherwise contribute to loss of thermal efficiency. The elimination of the additional daughter heatsink also maximizes ease of disassembly or reassembly for replacement of defective semiconductor packages as compared to present alternatives of semiconductor packages. Various other advantages will become apparent to those skilled in the art.