Plastic encapsulant for semiconductor
This application is a continuation, of application Ser. No. 07/127,405 filed on Dec. 2, 1987, which is a continuation of Ser. No. 06/618,455 filed on June 7, 1984, now abandoned. 
    
    
     BACKGROUND OF THE INVENTION 
     The present invention relates to a plastic encapsulated semiconductor device and, more particularly, to a plastic encapsulant for a semiconductor chip such as an IC (integrated circuit) chip. 
     Recently, with the improvement of the compactness and thinness of electronic apparatus such as an electronic wristwatches, cameras, and electronic calculators, compact and thin semiconductor devices are required to be included in the apparatus. 
     In response to the above requirement, a method for packaging the IC chip by using a tape carrier system and a method for directly packaging the semiconductor device on a substrate have been widely applied. 
     In order to make the semiconductor device as thin as possible with a high reliability, it is desired to provide an improved plastic encapsulant for semiconductor devices. 
     SUMMARY OF THE INVENTION 
     It is an object of the present invention to provide a compact and thin plastic encapsulated semiconductor device with a high reliability. 
     It is another object of the present invention to provide an improved plastic encapsulant for a semiconductor chip. 
     Other objects and further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. It should be understood, however, that the detailed description of and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description. 
     According to an embodiment of the present invention, the plastic encapsulant for the semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlohydrinbisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, with three methoxy groups. The hardener is a resol type phenol resin hardener, and the pigment is an organic pigment or an inorganic pigment. The organic solvent contains a ketone solvent, an alcohol solvent, an aromatic hydrocarbon solvent. 
     The amount of the organosilicon compound is less than about 30% by weight based on the total weight of the resin components including the epoxy resin, the organosilicon, and the hardener. 
     According to another embodiment of the present invention, the semiconductor device comprises a semiconductor chip, a supportor for supporting the semiconductor chip, and a plastic member for encapsulating the semiconductor chip to the supportor, the plastic encapsulant comprising an epoxy resin, an organosilicon compound, a resol type phenol resin hardener, a pigment, and an organic solvent. 
     The epoxy resin is an epichlohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, with three methoxy groups. The hardener is a resol type phenol resin hardener, and the pigment is an organic pigment based on a &#34;cromophtal&#34; (trade name) made by Ciba Geigy Limited. 
     The organic solvent contains a ketone solvent, an alcohol solvent, and an aromatic hydrocarbon solvent. For example, the organic material solvent contains toluene, xylene, butanol, methyl isobuthyl ketone. 
    
    
     BRIEF DESCRIPTION OF THE INVENTION 
     The present invention will be better understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention and wherein: 
     FIGS. 1 and 2 show sectional views of conventional plastic encapsulated semiconductor devices packaged by using a tape carrier system; and 
     FIGS. 3 and 4 show sectional views of semiconductor devices encapsulated with a resin according to an embodiment of the present invention, respectively. 
    
    
     DETAILED DESCRIPTION OF THE INVENTION 
     FIGS. 1-2 are sectional views of conventionally plastic encapsulated semiconductor devices packaged by using the tape carrier system. 
     With reference to FIG. 1, after bump electrodes 2 provided at a circumference of the surface of a semiconductor chip 1 are bonded with lead terminals 3 supported by a film 4, the chip 1 bonded with the lead terminals 3 is encapsulated with a resin 5 from both sides of the semiconductor chip 1. 
     With reference to FIG. 2, the surface of the semiconductor chip 1 bonded with the lead terminals 3 is encapsulated with the resin 5, and the rear surface of the semiconductor chip 1 is sealed with a glass cloth sheet 7 permeated with a semicuring resin. 
     FIGS. 3 and 4 show sectional views of semiconductor devices encapsulated with a resin according to an embodiment of the present invention. In the embodiment of the present invention, a tape carrier system is used for encapsulating the semiconductor chip. 
     In FIG. 3, lead terminals 3 bonded with bump electrodes 2 of a semiconductor chip 1 is extensively encapsulated with a resin 10. In FIG. 4, only the surface of the semiconductor chip 1 is encapsulated with the resin 10. The chip electrodes 2 of the semiconductor chip 1 are bonded with lead terminals 3, and only the surface of the semiconductor chip 1 which is bonded with the lead terminals 3 is encapsulated with the resin 10. 
     According to the present invention, the plastic encapsulant (resin) 10 comprises: 
     (A) an epichlorohydrin-bisphenol A type epoxy resin, 
     (B) an organosilicon compound, 
     (C) a resol type phenol resin hardener, 
     (D) a pigment, and 
     (E) an organic solvent. 
     The compounds of the plastic encapsulant (resin) 10 will be described in detail below. 
     (I).(B)=(b) organosilicon compound with methoxy group: 
     (B) The organosilicon compound is, for example, (b) an organnosilicon compound with a methoxy group, preferably, three methoxy groups. The amount of the organosilicon compound is less than about 30 percent based on the total weight of the resin components including the epichlorohydrin-bisphenol A type epoxy resin, the organosilicon compound, the the resol type phenol resin hardener. 
     When a demethanol reaction occurs between the methoxy group of the organosilicon compound and a hydroxyl group of the epichlorohydrin-bisphenol A type epoxy resin, the epoxy resin is denatured to a silicon type resin by decreasing the hydroxyl group within the epoxy resin, whereby the water resistance of the epoxy resin is improved. The methoxy group which remains as an end group is reacted by a demethanol reaction with a hydroxyl group within a passivation film, for example, a SiO 2  (silicon dioxide) film, or a PSG (phosphate glass) film, on a surface of the semiconductor chip, so that the adhesive strength of the epoxy resin is improved. 
     (II).(D)=(d) organic pigment: 
     The pigment is, for example, (d) an organic pigment based on a &#34;cromophtal&#34; (trade name) made by Ciba-Geigy Limited. As the organic pigment based on the &#34;cromophtal&#34; is constructed by a plurality of very small particles and has a small specific gravity, the organic pigment based on the &#34;cromophtal&#34; shows a good dispersion and is rarely deposited even when the organic pigment is diluted with a solvent. An inorganic pigment may also be used as the pigment. 
     (III). (E)=(e) solvents: 
     The organic solvent contains several kinds of solvents in which boiling points of the solvents are different for restricting foam of the resin 10 when the resin 10 cures. The amount of the organic solvent is preferably, about 30-80 weight percent of the total weight. (e) The organic solvent contains, for example, an aromatic hydrocarbon solvent, alcohol solvent, and a ketone solvent. Preferably, (e) the organic of solvent is (e&#39;) a mixture solvent including toluene, xylene, butanol, and methyl isobutyl ketone. 
     The specific combinations of the plastic encapsulant 10 may be achieved in one of the following combinations (I), (II), and (III). 
     
         ______________________________________                                    
(I)             (II)         (III)                                        
______________________________________                                    
A               A            A                                            
B               b            b                                            
C               C            C                                            
D               d            d                                            
E               e            e&#39;                                           
______________________________________                                    
 
    
     When the semiconductor chip 1 is encapsulated with the liquid epoxy resin 10 containing the above compositions, the plastic encapsulated semiconductor device becomes a thin and compact device as shown in FIGS. 3 and 4, for example, the thickness of the liquid epoxy resin 10 on the semiconductor chip is about 100 μm. 
     The ratio of the compositions of, but not limited to, the plastic encapsulant 10 according to the embodiment of the present invention are as follows. 
     
         __________________________________________________________________________
Composition   Low viscosity type (30 cP)                                  
                           High viscosity type (120 cP)                   
__________________________________________________________________________
Epichlorohydrin-                                                          
bisphenol A type epoxy resin                                              
Resol type phenol                                                         
resin hardener  about 10-20% about 25-35%                                 
Organosilicon compound                                                    
with a methoxy group                                                      
Organic pigment lower than about 5%                                       
                             lower than about 5%                          
based on a &#34;cromophtal&#34;                                                   
Organic solvent about 70-80% about 55-65%                                 
Another contents                                                          
                lower than about 5%                                       
                             lower than about 5%                          
__________________________________________________________________________
 
    
     The reliability of the semiconductor device encapsulated with the liquid epoxy resin 10 according to the present invention is higher than those of the semiconductor device encapsulated with a pellet type epoxy resin as shown in FIGS. 1 and 2. 
     The details of reliability evaluation tests and the results between the semiconductor chips encapsulated with the resin 10 of the embodiment of the present invention and the conventional material are described as follows with reference to tables 1-5. 
     (1) Sample 
     
                       TABLE 1                                                     
______________________________________                                    
         Encapsula-                                                       
         tion Type                                                        
                 Plastic Encapsulant                                      
______________________________________                                    
Present Invention                                                         
           FIG. 4    the liquid epoxy resin                               
                     (thickness of the resin: 100 μm)                  
Prior Art  FIG. 2    a pellet type epoxy resin                            
______________________________________                                    
 
    
     (2) Tests and Results 
     
                       TABLE 2                                                     
______________________________________                                    
NO.     Evaluation Items                                                  
                      Test Devices                                        
______________________________________                                    
1       Moisture Resistance                                               
                      C-MOS LSI                                           
2       Moisture Resistance                                               
                      TEG (Test Elements Group)                           
                      (Al(Aluminium) interdigitated                       
                      pattern)                                            
3       Electrical Stability                                              
                      TEG (Test Elements Group)                           
                      (Offset Gate MOS Transistor)                        
4       Heat Shock    C-MOS LSI                                           
        Resistance                                                        
______________________________________                                    
Condition           Results                                               
______________________________________                                    
85° C., 85% RH Operation                                           
                    See Table 3                                           
85° C., 85% RH, 30 V                                               
                    See Table 4                                           
125° C., V.sub.G = 10.sub.V, V.sub.D = 5.sub.V                     
                    See Table 5                                           
-65° C. (30 min) ←→ 150° C. (30                 
                    After 100 cycles, no                                  
                    damages in the samples of                             
                    the present invention                                 
                    and the prior art                                     
______________________________________                                    
 Where V.sub.G is a gate voltage and V.sub.D is a drain voltage.          
 
    
     
                       TABLE 3                                                     
______________________________________                                    
Test     C-MOS LSI/85° C., 85% RH Operation                        
______________________________________                                    
Time (Hours)                                                              
         240 H   500 H   750 H 1000 H                                     
                                     1500 H                               
                                           2000 H                         
Present  0/17    1/17    0/16  0/16  0/16  0/16                           
Invention                                                                 
Prior Art                                                                 
         0/20    1/20    1/19  0/18  0/18  0/18                           
______________________________________                                    
 Where a denominator is a test sample number and a numerator is a failure 
 sample number after testing.                                             
 
    
     
                       TABLE 4                                                     
______________________________________                                    
         TEG (Al (Aluminium) interdigitated pattern)                      
Test     /85° C., 85% RH, 30 V                                     
______________________________________                                    
Time (Hours)                                                              
         240    500    1000 1500 2000 2500 3000 3500                      
         H      H      H    H    H    H    H    H                         
Present  1/10   0/9    0/9  0/9  0/9  0/9  0/9  0/9                       
Invention                                                                 
Prior Art                                                                 
         0/30   1/30   1/29 0/28 0/28 0/28 1/28 1/27                      
______________________________________                                    
 
    
     
                       TABLE 5                                                     
______________________________________                                    
           TEG (Offset Gate MOS Transistor)/                              
           125° C., V.sub.G = 10.sub.V, V.sub.D = 5.sub.V          
Test         No.      P-Channel    N-Channel                              
______________________________________                                    
Present Invention                                                         
             1        ∂ = 0.917                              
                                   ∂ = 0.852                 
             2        0.880        0.875                                  
             3        0.821        0.952                                  
Prior Art    1        ∂ = 2.220                              
                                   ∂ = 1.233                 
             2        2.200        1.209                                  
             3        1.190        2.851                                  
______________________________________                                    
 Where ∂ = (dI.sub.D /dt).sub.MAX is a maximum of an         
 increasing ratio/time of a leakage current I.sub.D between a drain and a 
 source.                                                                  
 As the value of ∂ is small, the surface stability of the    
 plastic encapsulant is superior.                                         
 
    
     According to an embodiment of the present invention, the plastic encapsulant comprises the epoxy resin containing the organic solvent devoid of any filler material such as a silica filler, so as to make the coated resin uniformly thin. The plastic encapsulant provides a superior moisture resistance and heat shock resistance, so that the adherence between the semiconductor device and its support is improved. 
     The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications are intended to be included within the scope of the following claims.