Rapid acting gas temperature sensor
This invention concerns a temperature sensor for a gas flow, capable of sufficiently rapid response for service in the air intake system of an internal combustion engine, particularly a supercharged engine. 
     When it is necessary to control the rate of supply of fuel to an internal combustion engine in accordance with the intake air temperature, it is necessary that the temperature sensor serving to measure the air temperature be capable of following all temperature changes very rapidly, and therefore that the sensor should possess only a slight heat capacity. 
     THE INVENTION 
     It is an object of the present invention to provide a temperature sensor of very small heat capacity that can be mounted to the air intake duct of an internal combustion engine and exposed to the flow of air therein. It has been found that such a low heat capacity can be provided in a practical way by a resistance path of nickel provided by thin film technology in meander shape on a thin small plate or wafer of insulating material, protected from corrosion by a covering of silicone or epoxy resin material. It is preferred for the resistance path to be provided by a conducting nickel layer about 50 μm wide and having a thickness in the range from 0.2 to 0.6 μm, most preferably about 0.3 μm. The substrate for the thin film resistance path is preferably a ceramic wafer of a thickness of about 0.25 mm. The ends of the resistance path preferably have widened contact portions running along the longer sides of the substrate wafer, which is preferably of rectangular contour. 
     Means for supporting the substrate in an air duct where air can pass over it are of course necessary, and such means preferably comprise a casing composed of two pieces of insulation material, of which one holds the wafer and makes air accessible to it and the other contains connection strips molded into the casing part when the latter is injection molded, the strips being soldered to the contact portions of the nickel film structure on the ceramic substrate wafer. Preferably, the solder joint is located in a cavity filled with an epoxy resin containing up to 70% of a titanium dioxide filler 75 and also an amine hardener. 
    
    
     BRIEF DESCRIPTION OF THE DRAWINGS 
     The invention is further described by way of illustrative example with reference to the annexed drawings, in which: 
     FIG. 1 is a side view of the sensor, of which the left half is shown in side elevation, and the right half in axial section: 
     FIG. 2 is a longitudinal section of the sensor of FIG. 1 in a plane at 90° to the plane of the section in FIG. 1; 
     FIG. 3 is a top view along the axis of the sensor of FIGS. 1 and 2, partly in section, and 
     FIG. 4 is a plan view of a ceramic wafer serving as the carrier of a temperature sensitive resistance with a metallic film resistor provided thereon. 
    
    
     DESCRIPTION OF THE PREFERRED EMBODIMENT 
     The temperature sensor illustrated in the drawing is designed for building into an intake pipe, not shown in the drawing, of an internal combustion engine, for operation in the temperature range extending from -40° C. to 180° C. It has an injection molded casing of thermosetting plastic that is composed of a lower part 1 and an upper part 2. Both parts have a wide flange (3,4) at which they are connected by two hollow rivets 5. 
     The lower part 1 contains two prong strips 6, the lower end sections of which project into a cavity 7 serving for insertion of a connection bushing (socket connector) not shown in the drawings. At their upper ends each of the prongs 6 is pressed flat into a tab or lug 8. 
     The upper part 2 of the casing has two support pillars 9 spaced from each other, above which a protective cap 10 of sheet metal is held in engagement. Windows 11, stamped out of the protective cap 10, allow the intake air of the engine to have access to a small wafer 12 of insulating material shown in more detail in FIG. 4. The wafer 12 is about 0.25 mm thick and is made of a ceramic, preferably aluminum oxide. Directly on the surface of the wafer 12, a tantalum layer is applied that serves to improve the adhesion of a meander-shaped resistance path 13 made out of nickel that is vapor deposited on top of the tantalum layer. 
     The nickel resistance path 13 contains a number of conducting segments, each about 10 mm long and about 50 μm wide, with a layer thickness of from 0.2 to 1 μm. The thickness of 0.3 μm is preferred for the illustrated embodiment and results in a resistance value of about 1 K ohms between the two connection conductors 15 and 16 that are wider extensions of the resistance path running along the long sides of the substrate wafer 12, likewise applied in thin film technique. These conducting films 15 and 16 are soldered to the connection tabs 8 of the prongs 6. In the region of these conducting paths 15 and 16 and their zone of connection with the tabs 8, the cavity 17 of the upper part 2 is filled with a &#34;potting&#34; mass 18 composed of epoxy resin having a filler of up to 70% titanium dioxide (preferably at least 75%) and also an amine hardener (preferably from 7% to 8% by weight). The solder joints of the tabs 8 with the conducting paths 15 and 16 are mechanically and chemically protected by the potting mass. The portion of the ceramic wafer 12 that extends out of the potting mass 18 and carries the meander-shaped nickel layer is protected against deterioration by the intake air by a firmly adhering protective layer of silicone resin or epoxy resin. 
     The particular advantage of the temperature sensor according to the invention is that it has only a very slight mass and accordingly can follow quickly the temperature changes that occur in he intake air. 
     Although the invention has been described with reference to a particular illustrative example, it will be understood that modifications and variations are possible within the inventive concept.