Heat-curable composition
FIELD OF THE INVENTION 
     The present invention is directed to a heat-curable composition comprising a polyepoxide, an unsaturated aromatic monomer, an unsaturated co-monomer, an amine, a trialkylsulfonium salt of an anion of low nucleophilicity, and a free-radical curing agent. 
     RELATED APPLICATION 
     The present application is related to patent application Ser. No. 635,984 filed July 30, 1984, having a common inventor and common assignee. 
     BACKGROUND OF THE INVENTION 
     A large number of curing agents are known for epoxy resins, as, for example, amines, anhydrides, mercaptans, etc. Each curing agent has advantages and disadvantages that make it acceptable or unusable for some applications. Also, each curing agent, or combination thereof, may be employed with one or more curing accelerators. Examples include the inorganic and organic metal salts such as lithium chloride and stannous octoate; onium salts such as ammonium chloride, alkyl phosphonium halides, etc; and BF 3  complexes. 
     There is a need to develop curable epoxy resin compositions which cure very rapidly at moderately elevated temperatures yet have very long pot life at room temperature. 
     Accordingly, it has now been disclosed that certain trialkylsulfonium salts containing anions of low nucleophilicity function as excellent accelerators for the amine cure of epoxy resins. These accelerators are much more thermally latent than prior art accelerators such as BF 3  complexes and give a much longer room temperature pot life at equivalent 150° C. gel time. These systems have further been modified with additional monomers to give lower viscosity products. 
     SUMMARY OF THE INVENTION 
     The present invention is directed to heat-curable epoxy resin compositions exhibiting improved thermal latency and pot life, which when cured, yield compositions exhibiting improved physical properties. More particularly, the invention provides a heat-curable composition comprising (1) a polyepoxide, (2) a curing amount of an amine, especially an aromatic amine, (3) a catalytic amount of a trihydrocarbyl sulfonium salt, particularly a trialkyl sulfonium salt containing an anion of low nucleophilicity, (4) at least one unsaturated aromatic monomer, (5) at least one unsaturated co-monomer selected from the group consisting of alkyl esters or amides of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds, vinyl esters, N-vinyl amides and allyl compounds and (6) a curing amount of a free radical curing agent. These compositions are suitable for use in sheet molding compositions (SMC), in structural applications such as automotive parts, oil well parts (sucker rods), as well as in resin transfer molding (RTM) applications. In addition to the above, these compositions also give reduced viscosity combined with excellent heat resistance, factors which make them leading candidates for a number of pultrusion, filament winding, and resin transfer molding applications. 
     DESCRIPTION OF THE PREFERRED EMBODIMENTS 
     It has now been found that heat-curable compositions exhibiting improved thermal latency are obtained from epoxy compositions comprising (1) a polyepoxide, (2) an aromatic (or possibly aliphatic) amine, (3) a trialkyl sulfonium salt, (4) at least one unsaturated aromatic monomer, (5) at least one unsaturated monomer selected from the group consisting of alkyl esters or amides of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds, vinyl esters, N-vinyl amides and allyl compounds and (6) a curing amount of a free radical curing agent. 
     Preferably, the composition comprises (1) about 98 to about 24 percent by weight of a glycidyl polyether of a polyhydric phenol, (2) from about 0.5 to about 1.5 chemical equivalents of an aromatic or aliphatic amine based on the glycidyl polyether, (3) a catalytic amount of a trialkyl sulfonium salt, preferably from about 0.001% to about 10% by weight of the glycidyl polyether, (4) from about 1 to about 75 percent by weight of an unsaturated aromatic monomer, (5) from about 1 to about 75 percent by weight of at least one unsaturated monomer selected from the group consisting of alkyl esters or amides of ethylenically unsaturated monocarboxylic acids, cyano-containing compounds, vinyl esters, N-vinyl amides and allyl compounds and (6) a curing amount of a free radical curing agent. 
     Polyepoxides 
     The polyepoxides used to prepare the present compositions comprise those compounds containing at least one vicinal epoxy group; i.e., at least one ##STR1## group. These polyepoxides may be saturated or unsaturated, aliphatic, cycloaliphatic, aromatic or heterocyclic and may be substituted if desired with non-interfering substituents such as halogen atoms, hydroxyl groups, ether linkages, and the like. They may also be monomeric or polymeric. 
     For clarity, many of the polyepoxides and particularly those of the polymeric type are described in terms of epoxy equivalent values. The meaning of this expression is described in U.S. Pat. No. 2,633,458. The polyepoxides used in the present process are preferably those having an epoxy equivalency greater than 1.0. 
     Various examples of liquid polyepoxides that may be used in the process of the invention are given in U.S. Pat. No. 2,633,458 and it is to be understood that the disclosure of that patent relative to examples of polyepoxides is incorporated by reference into this specification. 
     Other suitable polyepoxides are disclosed in U.S. Pat. No. 3,356,624, U.S. Pat. No. 3,408,219, U.S. Pat. No. 3,446,762, and U.S. Pat. No. 3,637,618 and the disclosure of these patents relevant to examples of epoxy compounds is incorporated by reference into this specification. 
     Preferred polyepoxides are the glycidyl polyethers of polyhydric phenols and polyhydric alcohols, especially the glycidyl polyethers of 2,2-bis(4-hydroxyphenyl)propane having an average molecular weight between about 300 and 3,000 and an epoxide equivalent weight between about 140 and 2,000 and more preferably an average molecular weight of from about 300 to about 1000 and an epoxide equivalent weight of from about 140 to about 650. 
     Other suitable epoxy compounds include those compounds derived from polyhydric phenols and having at least one vicinal epoxy group wherein the carbon-to-carbon bonds within the six-membered ring are saturated. Such epoxy resins may be obtained by at least two well-known techniques, i.e., by the hydrogenation of glycidyl polyethers of polyhydric phenols or by the reaction of hydrogenated polyhydric phenols with epichlorohydrin in the presence of a suitable catalyst such as a Lewis acid, e.g., boron trihalides and complexes thereof, and subsequent dehydrochlorination in an alkaline medium. The method of preparation forms no part of the present invention and the resulting saturated epoxy resins derived by either method are suitable in the present compositions. 
     Briefly, the first method comprises the hydrogenation of glycidyl polyethers of polyhydric phenols with hydrogen in the presence of a catalyst consisting of rhodium and/or ruthenium supported on an inert carrier at a temperature below about 50° C. This method is thoroughly disclosed and described in U.S. Pat. No. 3,336,241, issued Aug. 15, 1967. 
     The hydrogenated epoxy compounds prepared by the process disclosed in U.S. Pat. No. 3,336,241 are suitable for use in the present compositions. Accordingly, the relevant disclosure of U.S. Pat. No. 3,336,241 is incorporated herein by reference. 
     The second method comprises the condensation of a hydrogenated polyphenol with an epihalohydrin, such as epichlorohydrin, in the presence of a suitable catalyst such as BF 3 , followed by dehydrohalogenation in the presence of caustic. When the hydrogenated phenol is hydrogenated Bisphenol A, the resulting saturated epoxy compound is sometimes referred to as &#34;diepoxidized hydrogenated Bisphenol A&#34;, or more properly as the diglycidyl ether of 2,2-bis(4-cyclohexanol)propane. 
     In any event, the term &#34;saturated epoxy resin&#34;, as used herein shall be deemed to mean the glycidyl ethers of polyhydric phenols wherein the aromatic rings of the phenols have been or are saturated. 
     Preferred saturated epoxy resins are the hydrogenated resins prepared by the process described in U.S. Pat. No. 3,336,241. Especially preferred are the hydrogenated glycidyl ethers of 2,2-bis(4-hydroxyphenyl)propane, sometimes called the diglycidyl ethers of 2,2-bis(4-cyclohexanol)propane. 
     Other examples of suitable polyepoxides include the glycidyl ethers of novolac resins, i.e., phenol-aldehyde condensates. Preferred resins of this type are those disclosed in U.S. Pat. No. 2,658,885. 
     For most applications it is desirable to utilize an epoxy resin which is liquid or semi-liquid under the conditions of application. Accordingly, a blend of a liquid and solid epoxy resin may be employed. For some applications, a solid resin may be employed. 
     Amines 
     Suitable aromatic amines include, among others, methylenedianiline, metaphenylenediamine, 2,4-bis[p-aminobenzyl]aniline, diaminodiphenyl sulfone, 2,4-toluenediamine, 1,3-diamino-2,4-diethyl-6-methylbenzene, 4,4&#39;-oxydianiline, methylenebis(ortho-chloroaniline), 2,6-diaminopyridine, 4-bromo-1,3-diaminobenzene, etc. Aliphatic amines such as bis(4-aminocyclohexyl)methane, 1,8diamino-p-menthane, or 1,2-diaminocyclohexane may also be used, although aromatic amines constitute a preferred class. 
     In general, a curing amount of amine is used. Operable amounts range from about 0.5 to about 2.0 chemical equivalents of amine to epoxy resin, with from about 0.75 to 1.25 being preferred. As used herein, a chemical equivalent is the amount which furnishes one amino hydrogen per epoxy group. 
     Trialkylsulfonium Salts 
     In general, the trialkylsulfonium salts containing anions of low nucleophilicity are preferred. Suitable tri(hydrocarbyl)sulfonium salts have the following general formula: ##STR2## wherein R 1 , R 2 , and R 3  each represent the same or different alkyl or aryl radicals of from about 1 to about 18 carbon atoms; and X is selected from the group: BF 4 , PF 6 , AsF 6 , SbF 6 , CF 3  SO 3 , FSO 3 , CH 3  SO 3 , 2,4,6-trinitrobenzenesulfonate, p-toluenesulfonate, etc. The alkyl or aryl radicals R 1 , R 2  and R 3  may contain various substituents such as oxygen, sulfur, halogens, etc. 
     Suitable triorgano-sulfonium salts include, among others, triethylsulfonium tetrafluoroborate, methyldiphenylsulfonium tetrafluoroborate, ethyldiphenylsulfonium tetrafluoroborate, allyldimethylsulfonium tetrafluoroborate, allyl bis(2-(allyloxy)ethyl)-sulfonium tetrafluoroborate, trimethylsulfonium hexafluorophosphate, ethyl(2-hydroxyethyl)(2-(ethylthio)ethyl)sulfonium tetrafluoroborate, etc. 
     Briefly, these triorgano-sulfonium salts can be prepared by a number of processes. One process involves reaction of a sulfonium halide with the silver salt of a nonnucleophilic anion such as tetrafluoroborate. In a second process, an alcohol such as allyl alcohol, a sulfide such as dimethyl sulfide, and an acid as tetrafluoroboric acid containing an anion of low nucleophilicity, are mixed and refluxed. In some cases a thiol may be used instead of a sulfide. Water is removed by azeotropic distillation and entrained in a Dean-Stark trap and the sulfonium salt is left in the pot (in this case, allyldimethylsulfonium tetrafluoroborate). In a third process, a β-hydroxyalkyl sulfide, such as 2,2&#39;-thiodiethanol, is mixed with an acid containing an ion of low nucleophilicity and water is removed by vacuum distillation, leaving a sulfonium salt mixture. 
     In general, a catalytic amount of triorgano-sulfonium salts are used; i.e. 0.001% to about 10% by weight of the polyepoxide, preferably about 0.3% to about 5% by weight. 
     Unsaturated Aromatic Monomers 
     Examples of unsaturated aromatic monomers include the vinyl aromatic monomers such as styrene; alpha-methyl styrene; p-methyl styrene, halo- and nitro-substituted styrenes such as vinyl toluene, chlorostyrene, bromostyrene, nitrostyrene; divinylbenzene, tertiary-butylstyrene; 2-vinylpyridine; and vinylnaphthalene. Styrene is the preferred monomer. Mixtures of unsaturated aromatic monomers may be employed. A preferred mixture comprises styrene and divinylbenzene. 
     Co-Monomers 
     As noted hereinbefore, the polyepoxide is blended with up to 75% by weight of one or more monomers selected from the group consisting of (1) esters or amides of ethylenically unsaturated carboxylic acids, (2) cyano-containing compounds, (3) vinyl esters, (4) N-vinyl amides or (5) allyl-containing compounds. 
     Suitable unsaturated monocarboxylic acid esters include the alkyl esters of ethylenically unsaturated acids such as acrylic acid, methacrylic acid, crotonic acid, alpha-phenylacrylic acid, alpha-cyclohexylacrylic acid, maleic acid, cyanoacrylic acid, methoxyacrylic acid, and the like. Very preferred acids are acrylic acid and methacrylic acid. Accordingly, suitable such esters include, methyl methacrylate, ethyl acrylate, butyl acrylate, butyl methacrylate, isobutyl methacrylate, and the like wherein side chains may contain halogen, e.g., 2,3-dibromopropyl acrylate, pentachlorophenyl methacrylate, etc. 
     Very preferred comonomers include the polyacrylate and polymethacrylate esters of polyols containing more than one terminal acrylate or methacrylate group. These esters are the acrylic and methacrylic acid esters of aliphatic polyhydric alcohols such as, for example, the di- and polyacrylates and the di- and polymethacrylates of alkylene glycols, polyoxyalkylene glycols, alicyclic glycols and higher polyols, such as ethylene glycol, triethylene glycol, tetraethylene glycol, tetramethylene glycol, hexanediol, trimethylolethane, trimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol and the like, or mixtures of these with each other or with their partially esterified analogs. 
     Typical compounds include but are not limited to trimethylolpropane triacrylate, trimethylolethane triacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, tetramethylene glycol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, and the like. Particularly preferred esters are neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, and 1,3-butylene dimethacrylate. 
     Additional acrylate or methacrylate esters of polyols are the acrylate or methacrylate esters of epoxide resins, wherein epoxide resins as used herein are considered to be polyols. The epoxide resins useful in reacting with acrylic or methacrylic acid are those epoxide resins described hereinbefore. The procedures for preparing these acrylate and methacrylate esters of epoxide resins are described in U.S. Pat. No. 3,377,406 which is hereby incorporated by reference. 
     Suitable unsaturated carboxylic acid amides includes acrylamide, N,N&#39;-dimethylacrylamide, diacetone acrylamide, N-isopropylacrylamide, N,N&#39;-dimethyl methacrylamide, etc. 
     Suitable cyano-compounds are acrylonitrile, methacrylonitrile, halogenated acrylonitrile, etc. 
     Suitable vinyl esters include vinyl acetate, vinyl benzoate, divinyl adipate, etc. Suitable N-vinyl amides include N-vinylpyrrolidone, N-vinylacetamide, N,N-divinyladipamide, etc. 
     Suitable allyl monomers include diallyl phthalate, triallyl isocyanurate, diallyl isophthalate, allyl diglycol carbonate, etc. 
     Free Radical Curing Agents 
     Examples of such catalysts include the peroxides, such as benzoyl peroxide, tertiary butyl hydroperoxide, ditertiary butyl peroxide, hydrogen peroxide, potassium persulfate, methyl cyclohexyl peroxide, cumene hydroperoxide, acetyl benzoyl peroxide, Tetralin hydroperoxide, phenylcyclohexane hydroperoxide, tertiary butyl peracetate, dicumyl peroxide, tertiary butyl perbenzoate, ditertiary amyl perphthalate, ditertiary butyl peradipate, tertiary amyl percarbonate, and the like, and mixtures thereof; azo compounds such as 2,2&#39;-azobisisobutyronitrile, dimethyl 2,2&#39;-azobisisobutyrate, 2,2&#39;-azobis(2,4-dimethylvaleronitrile), 2,2&#39;-azobisisobutyramide, and the like. Particularly preferred catalysts include the dialkyl peroxides, tertiary alkyl hydroperoxides, alkyl esters of peroxycarboxylic acids and particularly those of the above noted groups which contain no more than 18 carbon atoms per molecule and which have a half-life of at least one hour at 125° C. 
     An especially useful peroxide is 2,5-dimethyl-2,5-bis(tertiarybutylperoxy)hexane. 
     It will be appreciated that the amount of free-radical catalyst (curing agent) will vary over a broad range depending upon the amount of the particular vinyl monomer used, type of peroxide and end-use properties, etc. In general, an effective or curing amount is employed. One skilled in the art would simply adjust the amounts of a particular peroxide to suit his process conditions. Such adjustments are made in one or two runs knowing the temperatures, half-lives, etc. 
     Relative Amounts of Components 
     Usable blends of the various components will vary depending upon nature of polyepoxide used, and desired viscosity. These ranges of component amounts are shown below in percent by weight total composition: 
     
         ______________________________________                                    
                      More     Much                                       
                      Preferred                                           
                               Preferred                                  
          Preferred Range                                                 
                      Range    Range                                      
______________________________________                                    
Polyepoxide 98 to 24      98 to 50 90 to 70                               
Unsaturated 1 to 75       1 to 25  5 to 25                                
Aromatic Monomer                                                          
Unsaturated 1 to 75       1 to 25  5 to 25                                
Co-Monomer                                                                
______________________________________                                    
 
    
     The present compositions may be utilized in many applications such as for coatings and impregnating compositions in the preparation of adhesives for metals, wood, cement and the like, and in the preparation of reinforced composite products, such as laminated products, filament windings, sheet molding compounds (SMC), electrical laminates, molding owders, fluidized bed powders, potting compounds, etc. A very suitable application is in the preparation of reinforced products and laminates wherein the compositions are applied to fibrous products such as glass fibers or cloth and the material formed into the desired object and cured. 
     The following examples are given to illustrate the preparation of the instant heat-curable thermosetting compositions. It is understood that the examples are embodiments only and are given for the purpose of illustration and the invention is not to be regarded as limited to any specific components and/or specific conditions recited therein. Unless otherwise indicated, parts and percentages in the examples, are parts and percentages by weight. 
     Epoxy Resin A is a liquid glycidyl polyether of 2,2-bis(4-hydroxyphenyl)propane having an epoxide equivalent weight of 180-195 and an average molecular weight of about 380. 
     Epoxy Resin B is a liquid glycidyl polyether of 2,2-bis(4-hydroxyphenyl)propane having an epoxide equivalent weight of 178-186 and a number average molecular weight of about 365. 
     Epoxy Resin C is a solid glycidyl polyether prepared by glycidation of an oligomeric condensate of ortho-cresol with formaldehyde. Epoxy Resin C has an epoxide equivalent weight of 210-250 and a number average molecular weight of about 550. 
     Curing Agent A is a liquid aromatic amine having an amine nitrogen content of 14-16% by weight and a viscosity (25° C.) of 15-35 poises, containing about 30% by weight of o-toluenediamine and 70% by weight of a mixture of polymethylene polyanilines. 
     The compositions were tested according to the following test procedures: 
     Heat distortion temperature, °C., ASTM D-648 
     Tg, °C., dynamic mechanical (Rheometrics) 
     R.T. Tensile Strength, MPa, ASTM D-638 
     R.T. Tensile Modulus, MPa, ASTM D-638 
     R.T. Tensile Elongation, %, ASTM D-638 
     The following examples show that certain trialkylsulfonium salts with anions of low nucleophilicity (such as tetrafluoroborate) function as accelerators for aromatic amine cure of epoxy resins. Some of these accelerators are much more thermally latent than prior art accelerators such as BF 3  complexes and give a much longer room temperature pot life at equivalent 150° C. gel time. The sulfonium salts can be dissolved or suspended in undiluted or diluted epoxy resins to give materials with &lt;1 month shelf life at room temperature with the accelerated resin stable until mixed with curing agent. Trialkylsulfonium salts in which at least one of the alkyl groups is allyl or 2-alkylthioalkyl constitute a preferred class. Even more preferred are liquid mixtures of sulfonium salts prepared by reacting an alkylthioethanol such as 2,2&#39;-thiodiethanol (optionally in the presence of another dialkyl sulfide) with BF 3  or HBF 4 . 
     The mixtures of epoxy resins with aromatic amine curing agents accelerated with the above accelerators are diluted with such monomers as styrene, divinylbenzene, and monofunctional or multifunctional acrylates or methacrylates or mixtures thereof. 
    
    
     EXAMPLE 1 
     Preparation of a Liquid Sulfonium Salt Mixture Based on 2,2&#39;-Thiodiethanol and Boron Trifuloride Etherate 
     2,2&#39;-Thiodiethanol (12.2 grams) was mixed with boron trifluoride diethyl etherate (7.1 g) in a polyethylene bottle and allowed to stand overnight at room temperature. The following day, the mixture had separated into two layers. Six days later, the lower layer (15.78 g) was transferred to a 100 ml glass round bottom flask and evaporated in a rotary evaporator at 40° C. and 400-600 Pa pressure. The product after evaporation (I) was a viscous light yellow liquid, weight 14.64 g. 
     EXAMPLE 2 
     Preparation of a Liquid Sulfonium Salt Mixture Based on 2,2&#39;-Thiodiethanol and Aqueous Tetrafluoroboric Acid 
     2,2&#39;-Thiodiethanol (13.3 grams) was mixed with 10.0 grams of a 48% aqueous solution of tetrafluoroboric acid in a polyethylene bottle and allowed to stand at room temperature for 12 days. The contents were then poured into a 100 ml glass round bottom flask (net quantity transferred 22.75 g) and evaporated in a rotary evaporator for 45 minutes at 80° C. and 400-600 Pa pressure. The product after evaporation (II) was a viscous light yellow liquid, weight 16.41 g. 
     EXAMPLE 3 
     Rapid Preparation of a Liquid Sulfonium Salt Mixture Based on 2,2&#39;-Thiodiethanol and Aqueous Tetrafluoroboric Acid 
     2,2&#39;-Thiodiethanol (13.3 grams) was mixed with 10.0 grams of a 48% aqueous solution of tetrafluoroboric acid in a 100 ml glass round bottom flask. The flask was transferred to a rotary evaporator and water was removed from the mixture for 45 minutes at 80° C. and 400-600 Pa pressure. The product after evaporation (III) was a viscous light yellow liquid, weight 16.9 g. 
     EXAMPLE 4 
     Determination of Gel Time and Pot Life for Aromatic Amine Cured Epoxy Resins Diluted With Styrene and Trimethylolpropane Trimethacrylate (TMPTMA) and Accelerated With Sulfonium Salts 
     Mixtures of the following components were prepared in small polyethylene beakers and hand-mixed or mixed with a stirrer in a glass jar. The gel times of the mixtures were determined on a hot plate at 150° C. The mixtures were poured into Ubbelohde viscometers which were then placed in a 25° C. constant temperature water bath. Viscosity of each mixture was determined periodically. Data for each mixture are given in Table 1. 
     A number of salient points can be noted from Table 1. First, copper and zinc tetrafluoroborates appeared similar to BF 3  diethyl etherate in catalysis of aromatic amine cure of epoxies with regard to 25° C. pot life-150° C. gel time relationship. All three materials gave pot lives of 150-210 minutes at gel times of 75-85 seconds. 
     Methyldiphenylsulfonium and ethyldiphenylsulfonium tetrafluoroborates showed an even less favorable combination of gel time and pot life with 25° C. pot lives of 120-130 minutes at 150° C. gel times of 75-92 seconds. Triethylsulfonium tetrafluoroborate showed a very favorable combination of 960 minute pot life and 107 second gel time when used at the (high) 2 phr level. However, a strong sulfide odor was emitted during gel-plate cure of the system accelerated with triethylsulfonium tetrafluoroborate. 
     When sulfonium salt mixtures (I), (II), or (III), prepared by the reaction of 2,2&#39;-thiodiethanol with BF 3  diethyl etherate or HBF 4 , were used as catalysts, only a very slight sulfide odor could be detected during cure. These latter catalysts also had favorable combinations of gel time and pot life, with 25° C. pot life ranging from 400 to 440 minutes at 150° C. gel times of 65 to 95 seconds. 
     
                                           TABLE 1                                 
__________________________________________________________________________
POT LIFE-GEL TIME RELATIONSHIP FOR                                        
ACCELERATED DILUTED AROMATIC AMINE-CURED EPOXY RESINS.sup.(a)             
                        Parts of                           Pot            
                        Accelerator/                  Gel                 
                                                           Life           
                        100 Parts                                         
                                Time After Mixing (Minutes)               
                                                      150°         
                                                           25° C.  
Run                                                                       
   Accelerator          Epoxy Resin A                                     
                                Viscosity (mPa · s)              
                                                      Sec. Min..sup.(b)   
__________________________________________________________________________
196-1                                                                     
   None                         140-946, 265-1009, 385-1083               
                                                      562  1,200          
2  BF.sub.3 Diethyl Etherate                                              
                        0.33    125-1603, 280-3466, 335-4432,             
                                                      815-6676            
                                                           150            
3  Cu(BF.sub.4).sub.2 (45% Aqueous Solution)                              
                        1.00    120-1835, 275-3671, 335-5531,             
                                                      765-8216            
                                                           210            
4  Zn(BF.sub.4).sub.2 (40% Aqueous Solution)                              
                        0.50    135-1817, 295-4134, 355-6356,             
                                                      855-8454            
                                                           180            
198-1                                                                     
   Triethylsulfonium Tetrafluoroborate                                    
                        2.00    70-1082, 135-1126, 315-1281,              
                                                      107 1353            
                                                           960            
2  Methyldiphenylsulfonium Tetrafluoroborate                              
                        2.00    60-1548, 140-7034, 245-Gelled             
                                                      27    70            
3  Ethyldiphenylsulfonium Tetrafluoroborate                               
                        2.00    70-1400, 140-3815, 245-Gelled             
                                                      35    90            
4  None                         80-886, 135-913, 325-1035,                
                                                      514 1084            
                                                           1,200          
48-B                                                                      
   Methyldiphenylsulfonium Tetrafluoroborate                              
                        0.69    65-1010, 140-1623, 230-2816,              
                                                      75-85966            
                                                           120            
C  Ethyldiphenylsulfonium Tetrafluoroborate                               
                        0.69    65-1023, 140-1486, 230-2412,              
                                                      85-92102            
                                                           130            
D  (I)                  1.16    65-955, 140-1106, 230-1245, 290-1363,     
                                375-1610              85-                 
                                                           400            
56-1                                                                      
   None                         50-875, 190-948, 330-1036,                
                                                           1,200  7       
2  (II)                 1.16    60-952, 190-1146, 330-1486,               
                                                      65-75214            
                                                           410            
3  (III)                1.16    55-975, 195-1154, 335-1467,               
                                                      70-80096            
                                                           440            
__________________________________________________________________________
 .sup.(a) Mixtures:                                                       
 
    
     
         Component               Parts by Weight                                   
Epoxy Resin A           100                                               
Styrene                 15                                                
Pennwalt Lucidol Lupersol 101                                             
                        0.5                                               
(2,5-bis( .sub.-t-butylperoxy)-2,5-dimethylhexane)                        
Upjohn Curithane 103    15.2                                              
duPont BABA             12.8                                              
(2,4-bis(p-aminobenzyl)aniline)                                           
Trimethylolpropane Trimethacrylate (TMPTMA)                               
                        15                                                
Accelerator             As above                                          
 .sup.(b) Time to doubling of initial viscosity (interpolated or          
 extrapolated).                                                           
 
    
     EXAMPLE 5 
     Large Scale Reaction of 2,2-Thiodiethanol with 48% Aqueous HBF 4   
     6200 g (50 moles) of 98.5% 2,2&#39;-thiodiethanol was mixed with 4580 g (25 equivalents) of 48% aqueous tetrafluoroboric acid. This mixture was held in a 5-gallon polyethylene reservoir. A glass wiped-film evaporator with an evaporator surface area of 323 cm 2  was set up with a Teflon intake tube leading to the polyethylene reservoir; intake rate was controlled by a metering valve. The evaporative surface was held at a temperature of 95°-98° C., while water was pumped from an ice bath to cool the condensation surface. The pressure in the evaporator was lowered to 40-130 Pa and the thiodiethanol-tetrafluoroboric acid mixture was introduced slowly. Water was evaporated from the mixture leaving the desired reaction product as the residue. The intake rate was regulated to give a product output rate of 10-12 mL/min. Karl Fischer titration of the product (identified as V) showed a water level of 2.5% in the product. 
     EXAMPLE 6 
     Reaction of 2-(Ethylthio)ethanol with 48% Aqueous HBF 4   
     6372 g (60 moles) of 2-(ethylthio)ethanol was mixed with 5487 g (30 equivalents) of 48% aqueous tetrafluoroboric acid. This mixture was held in a 5-gallon polyethylene reservoir. A glass wiped-film evaporator was set up under evaporation conditions identical to those in Example 2. The feed intake rate was regulated to give a product output rate of 5-15 mL/min. Karl Fischer titration showed a water level of 2.5% in the product (identified as VI). Neutron activation analysis gave boron levels in the product of 4.2 and 4.3 weight percent. The  13  C NMR spectrum of the product in acetone-d 6  was consistent with a structure of ##STR3## for 72% of the product, with the product apparently containing 2% of 2-(ethylthio)ethanol and 26% of other components of unknown structure. 
     EXAMPLE 7 
     Preparation of Crude Allyldimethylsulfonium Tetrafluoroborate 
     Into a 3-neck 5-liter flask were weighed 1161.6 g (20 moles) of allyl alcohol, 950 g (15.3 moles) of dimethyl sulfide, and 1829 g (10 moles) of 48% aqueous tetrafluoroboric acid. The flask was attached to a large (1.5 liter) capacity Dean-Stark trap (initially filled with dimethyl sulfide) which was attached to a condenser. Reflux was started and an aqueous phase began to accumulate at the bottom of the Dean-Stark trap, displacing dimethyl sulfide back into the reaction mixture. Reflux was continued for six days. At the end of this period, the rate of accumulation of aqueous phase had become very small. The aqueous phase was drained into a tared bottle and weighed; the net weight of the aqueous phase was 1136.7 g. Excess dimethyl sulfide and allyl alcohol were allowed to distill at atmospheric pressure into the Dean-Stark trap until the temperature in the flask had reached 100° C. At this point, the flask was connected to a dry ice trap and vacuum was applied. The mixture in the flask was evaporated at 70° C. under magnetic stirring for one hour, with the pressure decreasing to a final value of 200 Pa. The yield of nonvolatile product was 1952 g. The nonvolatile product (identified as VII) was a viscous liquid containing a small amount of crystals. It showed no signs of further crystallization on standing at room temperature. 
     EXAMPLE 8 
     Use of Sulfonium Salts to Accelerate Aromatic Amine Cure of Epoxy Resins Diluted with Mixtures of Styrene and Acrylic Monomers 
     Epoxy Resin A (100 parts), Curing Agent A (25 parts), and monomers, accelerators and initiators in the proportions listed in Table 2 were combined at room temperature in polyethylene beakers and mixed thoroughly with Jiffy mixers. (The total amount of monomers used in each mixture was adjusted to give a target viscosity of 1 Pa.s.) 
     A portion of each mixture was poured into a mold made of two glass plated held 1/8&#34; (3.2 mm) apart with a polytetrafluoroethylene spacer to make a sheet casting. Another portion of each mixture was poured into two aluminum molds containing a linear cavity 1/2&#34; (12.7 mm) square to form bar castings. The sheet and bar molds were placed in an oven and held for two hours at 80° C., and two hours at 150° C. The sheet and bar castings were then removed from the molds and tested for mechanical properties. Mechanical properties are given in Table 2. 
     A third portion of each mixture was poured into a Ubbelohde viscometer which in turn was placed in a constant-temperature bath set at 25° C. Viscosity was determined periodically for each mixture. From the viscosity data was determined for each mixture a &#34;pot life&#34;, or the amount of time required for the viscosity to double from its initial value. Thin film gel time on a 150° C. gel plate was also determined for each mixture. 
     Table 2 lists data for two types of experiments: one type in which enough styrene was used as a diluent in the formulation to give a viscosity of approximately 1 Pa.s and a second type in which enough of a mixture of equal parts by weight of styrene and trimethylolpropane trimethacrylate (TMPTMA) was used in the formulation in order to obtain the same viscosity. One experiment of each type was performed with no sulfonium salt and with each of the sulfonium salts from the previous examples used as the accelerator. One can see from Table 2 that the styrene-TMPTMA mixture of each type gave resin castings much higher in HDT and glass transition temperature than the mixture diluted with styrene alone. Pot life was also longer for the mixtures containing styrene and TMPTMA than for those diluted with styrene alone. Room temperature tensile properties for the two types of systems were comparable. (The mixtures diluted with styrene alone are used as comparative cases and are not part of the invention.) 
     
                                           TABLE 2                                 
__________________________________________________________________________
USE OF SULFONIUM SALTS TO ACCELERATE AROMATIC AMINE                       
CURE OF EPOXY RESINS DILUTED WITH MIXTURES                                
OF STYRENIC AND ACRYLIC MONOMERS.sup.(a)                                  
__________________________________________________________________________
           Trimethylolpropane 150° C.                              
      Styrene,                                                            
           trimethacrylate                                                
                     Accelerators and                                     
                              Gel Time,                                   
                                    Time (min) - 25° C. Ubbelohde  
Run # phr  (TMPTMA), phr                                                  
                     initiators, phr                                      
                              Sec.  Viscosity (mPa · s)          
__________________________________________________________________________
16246-182-4                                                               
      12             Lupersol 101 (0.4)                                   
                              420                                         
16701-47-1                                                                
      10   10        Lupersol 101 (0.4)                                   
                              480   120-882,195-946,300-959,              
                                    385-1036,467-1117                     
16246-182-7                                                               
      12             V (1)    112   60-918,120-1067,240-1370,             
                     Lupersol 101 (0.4)                                   
                                    360-1890,390-2189                     
16701-47-2                                                                
      10   10        V (1)    185   125-886,197-953,305-1145,             
                     Lupersol 101 (0.4)                                   
                                    390-1262,470-1464                     
16246-182-8                                                               
      12             VI (1)    87   60-1016,120-1288,240-1832,            
                     Lupersol 101 (0.4)                                   
                                    360-2852,390-3456                     
16701-47-3                                                                
      10   10        VI (1)   135   117-922,192-991,297-1135,             
                     Lupersol 101 (0.4)                                   
                                    383-1328,465-1558                     
16246-182-2                                                               
      12             VII (0.7)                                            
                               96   60-1019,120-1174,240-1484,            
                     Lupersol 101 (0.4)                                   
                                    360-2029,390-2422                     
16701-47-4                                                                
      10   10        VII (0.7)                                            
                              150   125-851,195-916,305-1067,             
                     Lupersol 101 (0.4)                                   
                                    392-1136,467-1280                     
__________________________________________________________________________
25° C.                                                             
             HDT,  Tg, Rheo-                                              
                           R.T. TENSILE                                   
Run # Pot Life (hr.)                                                      
             264 psi, °C.                                          
                   metrics, °C.                                    
                           Strength, MPa                                  
                                   Modulus, MPa                           
                                           Elongation, %                  
__________________________________________________________________________
16246-182-4  133,133                                                      
                   154     79      2890    5.3                            
16701-47-1                                                                
      18.3   146,150                                                      
                   167     80      2820    5.6                            
16246-182-7                                                               
      4.4    126,127                                                      
                   150     78      3520    4.2                            
16701-47-2                                                                
      9.7    146,148                                                      
                   160     80      3190    4.5                            
16246-182-8                                                               
      4.0    125,126                                                      
                   156     84      3140    6.6                            
16701-47-3                                                                
      7.8    147,148                                                      
                   176     60      2900    3.1                            
16246-182-2                                                               
      4.8    116,122                                                      
                   156     75      2870    5.2                            
16701-47-4                                                                
      10.3   146,148                                                      
                   160     71      2920    3.7                            
__________________________________________________________________________
 .sup.(a) All phr levels based on Epoxy Resin A = 100 parts.              
 
    
     EXAMPLE 9 
     This example illustrates the use of sulfonium salt accelerators with a liquid formulated resin mixture containing an o-cresol novolac epoxy and a liquid formulated curing agent mixture, both containing monomer diluents. 
     The following components were mixed to form a mixture (&#34;Resin Mixture&#34;) which was stirred until homogeneous. 
     
         ______________________________________                                    
Component      Parts by weight                                            
______________________________________                                    
Epoxy Resin B  100                                                        
Epoxy Resin C  40                                                         
Styrene        20                                                         
Divinylbenzene 20                                                         
Lupersol 101   0.53                                                       
______________________________________                                    
 
    
     Another mixture (&#34;Curing Agent Mixture&#34;) was prepared as follows. Nineteen parts of Upjohn Curithane 116 (a crude form of methylenedianiline, MDA) were mixed with 10 parts of DuPont BABA (a crude form of 2,4-bis(p-aminobenzyl)aniline) and stirred for approximately one hour at 130°-135° C. until all solid material had melted. The mixture was then cooled to 80° C. Ten parts of trimethylolpropane trimethacrylate (TMPTMA) and 0.01 part of hydroquinone were then added and the mixture was stirred until homogeneous. The final &#34;Curing Agent Mixture&#34; was a viscous brown liquid. 
     The following mixture of the above two mixtures with Accelerator VI (the sulfonium salt product of Example 6) and Byk A-501 (an air-release agent) was prepared at room temperature in a polyethylene beaker with a Jiffy mixer. 
     
         ______________________________________                                    
Component        Parts by weight                                          
______________________________________                                    
Resin Mixture    100                                                      
Curing Agent Mixture                                                      
                 28                                                       
Accelerator VI   0.55                                                     
Byk A-501        0.1                                                      
______________________________________                                    
 
    
     The mixture had a thin film gel time of 62 seconds at 150° C. The mixture was poured into molds of the type used in Example 8 in order to prepare one sheet casting and two bar castings. The sheet and bar castings were cured for one hour at 80° C., one hour at 120° C., one hour at 150° C., and two hours at 170° C. Physical properties of the castings are given as follows. 
     
         ______________________________________                                    
Heat Distortion Temperature, °C.                                   
                     178                                                  
T.sub.g, Rheometrics, °C.                                          
                     201                                                  
R.T. Tensile Strength, MPa                                                
                     43.3                                                 
R.T. Tensile Modulus, MPa                                                 
                     3160                                                 
R.T. Tensile Elongation, %                                                
                     1.68                                                 
______________________________________                                    
 
    
     A higher heat distortion temperature and glass transition temperature are obtained in this formulation by use of the epoxy novolac, though at the expense of some tensile elongation.