Cooling cover for RF power devices
This is a continuation of application Ser. No. 07/835,816, filed Feb. 18, 1992 and now abandoned. 
    
    
     FIELD OF THE INVENTION 
     The field of this invention relates to the cooling of power devices and, in specific, to the cooling of RF power amplifiers. 
     BACKGROUND OF THE INVENTION 
     RF power amplifiers (RF PAs), are well known in the art. Such devices may be fabricated in the form of a single discrete device containing a single amplification device (e.g. a transistor die) and associated compensation devices (e.g. a MOS capacitor) (FIGS. 1 and 2). 
     Within the RF PA, an RF power amplifier die (10) is, typically, mounted to a metal (e.g. gold plated kovar or tin plated copper) collector lead (11) which is, in turn, mounted to an electrically non-conductive beryllium oxide (BeO) pedestal (16). The BeO pedestal, in turn, supports a base lead (12), and an emitter lead (13) which are wire-bonded to the die. The BeO pedestal may, in turn, be attached to a heat conductive, mounting support (14). The support (14), together with a cover (15), encloses the die and wire-bonds; and between which the collector, emitter and base leads project, provides an RF PA enclosure. 
     Cooling of the die occurs primarily through transfer of heat from the die into the metal leads (the lead frame) (11, 12, and 13). Cooling of the lead frame (11, 12, and 13), in turn, occurs through conduction into the pedestal (16). Heat passing into the pedestal is then re-transmitted into the mounting support (14) and, consequently, into a heat sink (not shown). 
     The cover enclosing the die also conducts a small amount of heat from the die, convectively, into the surrounding air. However, because the cover is in contact with the lead frame, it is typically constructed of an electrically non-conductive material, such as alumina (Al 2  O 3 ). Use of an alumina cover results in a poor rate of heat transfer through the cover (the thermal conductivity of alumina is 15-20 W/m°K.). Because of the poor rate of heat transfer of alumina, the prior art alumina covers may be regarded as non-conductive in terms of heat transfer from collector lead to support (14). 
     The pedestal (16), through which most of the heat from the die passes, has a fairly high rate of thermal conductivity (230-260 W/m°K.). During periods of continuous transmission, on the other hand, the rate of heat transfer through the pedestal (16) may not match the rate of thermal output of the die (10). The die (10) and collector lead (11), in such cases, may overheat and cause damage to the die (10) or to associated solder joints. 
     Past efforts at improving cooling of RF PAs have included attachment of fins or heat sinks to the collector lead external (11) to the RF PA enclosure. While these efforts have provided some protection from some types of short term overload, damage may still occur during periods of continuous transmission. Because of the importance of RF PAs a need exists for improved methods of cooling RF PAs. 
     SUMMARY OF THE INVENTION 
     A cooling cover for an RF power amplifier device having a mounting support, a first lead, and a die mounted on said first lead. The cover is comprised of a body composed of a thermally conductive material and having a first surface and a second surface. A layer of thermally conductive material and electrical non-conductive material is deposited upon said second surface such that when coupled to said mounting support, said first surface is in contact with said mounting support and said second surface is in contact with said first lead. 
    
    
     BRIEF DESCRIPTION OF THE DRAWING 
     FIG. 1 comprises a perspective view of an RF power amplifier under the prior art showing the die, collector, emitter, base, and support structure. 
     FIG. 2 comprises a schematic of a prior art RF power amplifier. 
     FIG. 3 depicts the thermally conductive cover in accordance with the invention. 
     FIG. 4 depicts a thermally conductive cover attached to a support structure of an RF power amplifier. 
     FIG. 5 comprises a perspective view of the heat conductive cover attached to a support structure of an RF power amplifier. 
     FIG. 6 comprises comparative test data of the inventive thermally conductive RF PA cover. 
     FIG. 7 depicts a heat sink cover attached to a support structure of an RF power amplifier. 
     FIG. 8 depicts cooling fins attached to a support structure of an RF power amplifier. 
    
    
     DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 
     The solution to the problem of die cooling of an RF PA lies, conceptually, in fabricating a thermally conductive device cover of a material with a relatively high rate of thermal conductivity and placing the cover in contact with a first/collector lead and mounting support. Use of a thermally conductive cover may allow significant amounts of heat to be beneficially transmitted through the cover, from the first lead to the mounting support, in parallel with heat flow through the pedestal. 
     Shown in FIGS. 3 and 4, generally, is a thermally conductive device cover (20) having a cavity (27) in accordance with the invention. The cover (20) includes two primary heat-transfer surfaces including a first, mounting support surface (24), and a second surface (22) and may include cavity 27. The mounting support surface (24) may be held in intimate contact with the mounting support (14) of the RF PA enclosing the cavity (27) through the use of screws (25). The screws (25) may also hold the second surface (22), in intimate contact with the collector (11). 
     The thermally conductive cover (20) is comprised of two materials. The first material, of which the conductive cover (20) is constructed, is copper (21). However, any similar conductive material may be substituted. A thin layer (e.g. 0.030&#34;) of a second material having a relatively high rate of thermal conductivity and a low rate of electrical conductivity is deposited on the second surface, creating a collector surface (22). 
     The collector surface (22) is deposited where the cover (20) contacts the collector, emitter, and base. The collector surface (22) provides electrical isolation among the collector, emitter, base. 
     The conductive cover (20) serves to provide a low resistance heat-flow path between the collector (11) and the mounting support (14). The relatively high rate of heat flow may be provided by the substantially copper construction of the conductive cover (20) and the high rate of thermal conductivity of copper (390 W/m°K.). The thin layer (22) of aluminum nitride although providing a lower rate of thermal conductivity (120-190 W/m°K.), still offers a heat path (26) of significantly less thermal resistance than that offered by the prior art, alumina cover. 
     In one embodiment of the invention the cover (20) is constructed to attach to the mounting support (14) by means of screws passing through the mounting support. Under such an embodiment the screws bias the cover (20) into intimate contact with the mounting support (14) and collector (11). In another embodiment of the invention the collector surface (22) of the cover (20) may be selectively soldered to the collector lead (11). 
     Shown in FIG. 6 is a collector lead temperature versus time comparison between a prior art, alumina cover and the thermally conductive cover (20). Data for the time v. temperature curves (FIG. 2) were generated through testing of a MRF847 RF PA available from Motorola, Inc. The data for such curves was generated, first, with an alumina cover. Following completion of such tests the alumina cover was removed and replaced, and the tests repeated, with a cover (20) constructed in accordance with the invention. As may be verified by reference to FIG. 6 an average collector lead temperature improvement of from 5°-10° C. is provided through use of the thermally conductive cover (20) over the alumina cover. 
     In another embodiment of the invention a heat sink cover (31, FIG. 7)) is clamped over the cooling cover (20) and mounting support (14) by mounting screws (25). Under such an embodiment heat (26) from the die (10) flows from the cooling cover (20) into the heat sink cover (31) and directly into the heat sink (30). 
     In another embodiment of the invention cooling fins (35, FIG. 8) are installed on the top of the cooling cover (20). Under such an embodiment heat (26) from the die (10) may be dissapated through conduction into cooling fins (35) as well as through conduction through the cover (20) into the heat sink.