Heat dissipating chimney for adhesive supply unit
CROSS REFERENCE TO RELATED APPLICATIONS 
     This application is related to four copending applications entitled: 
     &#34;Multiple Heat Source Grid Assembly&#34;, U.S. Ser. No. 08/440,640, filed on May 15, 1996; 
     &#34;Viscous Fluid Shut-Off Valve and Filter&#34;, U.S. Ser. No. 08/441,385, filed on May 15, 1995; 
     &#34;Removable Hopper Cover&#34;, U.S. Ser. No. 08/440,648, filed on May 15, 1995; 
     &#34;Adhesive Supply Unit&#34;, U.S. Ser. No. 08/038,886, filed on May 15, 1995; 
     BACKGROUND OF THE INVENTION 
     1. Field of the Invention 
     This invention relates to an apparatus for receiving thermoplastic and other hot melt materials and adhesives, melting the material, and supplying the melted material to a dispenser. Non-process heat generated by electronic components, a motor, and the like, and heat lost from the melting process, is channelled through an integral chimney system built into the apparatus in order to more efficiently cool the electronic and other components. 
     2. Description of the Related Art 
     In the past, devices for receiving, melting, and dispensing of hot melt materials and adhesives did not consider the problems associated with overheating of electric and other components which formed a part of the device. Generally, attention was focused on the process steps and apparatus as they related directly to the melting and dispensing of hot melt materials. The prior art did not address the problems associated with the environment in which the various components operated. As a result, inadequate cooling and the resultant overheating of electric and electro-mechanical components in the hot melt devices led to many problems, such as electronic component failure, premature malfunction, and erratic performance. 
     Improvements in the form of improved heat transfer characteristics of individual components were achieved in the past, but the problems associated with damaging heat buildup within the cabinet of a hot melt unit as a whole have not been previously addressed or solved. 
     It is therefore an object of the present invention to provide a system for reducing the buildup of heat within the cabinet of a hot melt device. Specifically, it is an object of the present invention to design and integrate the components of a hot melt device to form a chimney which draws heat away from critical electrical and other components. The result is that the performance of individual components, and therefore the entire unit, is maintained at an acceptably high level, absent the thermal damage which would otherwise degrade performance. 
    
    
     BRIEF SUMMARY OF THE DRAWINGS 
     FIG. 1 is a side view of the present invention illustrating the entire melting/dispensing apparatus. 
     FIG. 2 is a perspective view of the top area of the hopper. 
     FIG. 3 is a detailed cross-sectional view of the top area of the hopper. 
     FIG. 4 is a cut-away perspective view of the present invention. 
    
    
     DESCRIPTION OF THE PREFERRED EMBODIMENTS 
     Referring to the drawings, FIG. 1 shows a material melting and dispensing apparatus 1 having a cabinet 21, a hopper 3, and hopper cover 12. Solid and quasi-solid material to be melted, such as hot melt adhesive pellets, are added to the hopper 3. Heat is supplied to the melter body 8 through the upper and lower heating elements 9 and 10. The heated material is drawn through the shut-off valve and filter 22 and is subsequently pumped by pumping means 30, the pumping means being driven by the prime mover 5 through the coupling 6. Feedback is provided by the temperature sensing means 11, and control of the process is maintained by the control panel 7. The material is dispensed as needed through the shut-off valve/filter 22 and eventually through the dispensing means 4. Heat generated in the electronic component enclosure 19 is drawn through vent apertures 18 to a top section 13 of the hopper 3. This heat travels by natural convection through the flue 15 and eventually exits at the exhaust apertures 14. 
     Referring now specifically to the heat dissipating chimney, FIG. 2 shows the hopper top section 13 which generally forms an external shell for the top portion of the hopper. It will be noted that in one embodiment, the hopper top section may be formed of sheet metal or plastic material. This hopper top section 13 is attached to and generally forms a semi-seal with the remainder of the material melting and dispensing apparatus 1. Exhaust apertures 14 are formed at an upper region of the hopper top section 13. These exhaust apertures 14 are in communication with the flue and other heat dissipating elements of the chimney. 
     FIG. 3 shows a detail of the hopper top section 13, illustrating the flue 15 and the exhaust holes 14. 
     FIG. 4 is a cut-away view of the invention showing the initial path of the generated heat in the form of warmed air and possibly other gases travelling by convection from the electronic heat generating components 16, through the apertures 18, into the flue 15, and finally out of the exhaust apertures 14. 
     Heat exchange fins 17 are arranged vertically to advantageously direct the convective heat flow vertically upwards in an unencumbered path towards the top of the exhaust and out the vent apertures 18. 
     It will be noted that the electronic heat sources include all electronic control equipment, all electronic circuits housed within the cabinet, and all electro-mechanical devices and motors within the cabinet. In addition to those heat sources are heat sources relating directly to the melting process, such as the upper and lower heating elements 9 and 10, which transfer heat to the melter body 8 and related components. The stray heat transferred from these components also travels by convection to the flue 15 and eventually out of the exhaust apertures 14. 
     A chimney effect is produced by the convective heat paths provided in the present invention. As warmed air having a lower density than ambient air travels out through the exhaust apertures, it is replaced by cooler air drawn in through gaps in the cabinet, particularly near the base of the cabinet. 
     As the various heat sources transfer heat from the heat sources to the cooler air, the air is warmed, causing it to become less dense, and then travel upwards through the path of least resistance provided by the present invention. This path directs the warmed air out of the exhaust apertures, whereby it is again replaced by cooler air at a distant location. This cycle is continuous during operation of the material melting and dispensing apparatus 1, resulting in consistent cooling of the involved electronic and other components. 
     A single preferred embodiment of the present invention is described above. However, those skilled in the art will appreciate the various modifications which could be made to the present invention without departing from the scope of the invention. The invention is therefore not limited except by the scope of the appended claims.