as seen in fig1 a and 1b a wafer baking oven 1 has revolving baking tongs and an oven output station at which soft flat wafer cakes , that is round blanks , are removed by the individually opening baking tongs and transferred from a device 2 to a preshaping device 3 . here , this transfer is carried out by grippers 4 that can orbit about a rotation axis 5 of the transfer device 2 , that engage the flat wafer cakes from above , and that subsequently feed them with a rotary movement about the rotation axis 5 along a substantially horizontally transfer surface 6 to the preshaping device 3 . the preshaping device 3 has at least one , preferably a plurality of deep - drawing devices such as shown in fig2 - 10 that are mounted on a carousel rotatable about a vertical axis 7 . the speed of the revolving baking tongs and the angular speeds of the transfer device 2 and the preshaping device 3 are synchronized in such a manner that when a baking tong opens , the soft and still shapable flat wafer cake 8 or round blank is received by the transfer device 2 and is fed with a synchronous rotational movement to the preshaping device 3 , specifically each fed to a revolving deep - drawing device 9 . here , the absolute average speed of the flat wafer cake on the transfer device 2 is higher than the speed of the flat wafer cake on the deep - drawing device 9 . as further shown in fig1 a and 1b , during rotation of the flat wafer cake 8 on the preshaping device 3 about the axis 7 , the flat wafer cake 8 is deep drawn with the method steps described below . the method steps conform to first through fifth positions a , b , c , d , e that are preferably assumed in this order . at the end of the shaping method , that is after fifth step e , the deep - drawn edible body — the hollow baked product — is transferred from an intake device 10 to a reconditioning device 11 . the intake device 10 has a rotatable intake unit 10 that lines the baked products up into a straight row . subsequently , the straight row of baked products is fed substantially perpendicular to its longitudinal extent to the reconditioning device . therein , the edible bodies can for example be precooled , greased and finally cooled , or can also be provided with a coating , for example of chocolate . fig2 and 3 show the deep - drawing / deep - drawing device 9 according to the invention in the first position a in which a punch 16 movable by a punch actuator 17 is in a raised position spaced from the soft flat wafer cake 8 . the flat wafer cake 8 is positioned outside a deep - drawing mold 13 or its deep - drawing cavity 14 defined by a drawing ring 15 . as mentioned in the description of fig1 a and 1b , the flat wafer cake 8 coming from the baking oven 1 is fed by a transfer device 2 to the deep - drawing device 9 . for positioning the flat wafer , centering bosses 20 are provided that project from a support face 21 of the preshaping device 3 in order to be able to serve as stops and center the flat wafer cake over the deep - drawing cavity 14 . apart from the illustrated cylindrical embodiment , it is also possible to shape the stopper elements differently , for example as recesses in the support face 21 or stop rails and the like . in this embodiment , four coin - shaped or cylindrical bosses 20 are provided . using a smaller number of them can have advantages with respect to transporting the flat wafer cake 8 . thus , in this or in another embodiment , the support face 21 of the deep - drawing device 9 can be flush with the transfer surface 6 , the round blank 8 being slid over both surfaces 6 and 21 and stripped off at the centering bosses 20 serving as stopper elements by the gripper 4 . when using four centering bosses , the transfer surface 6 is above the support face 21 of the deep - drawing device 9 by a certain amount , preferably by the height of the centering bosses 20 . in this manner , the flat wafer cake is slid over the centering bosses and then positioned by gravity over the deep - drawing mold opening and then deposited centered between the centering bosses 20 . as further shown in fig2 and 3 , the flat wafer cake 8 positioned over the deep - drawing cavity 14 is lying on the drawing ring 15 of the deep - drawing device 9 . this drawing ring 15 is level with the transfer surface 6 of the preshaping device 3 . the flat wafer cake 8 is retained by gravity that here is parallel to the actuation direction 18 of the punch actuator 17 . in a different or alternative configuration , the flat wafer cake 8 can also be held by centrifugal forces that act outwardly when the preshaping device 3 rotates . furthermore , it is also a feature of the invention , apart from acceleration forces due to gravity or acceleration due to centrifugal force , to hold with low - pressure devices , or with mechanical holders and the like . in the first position a , the basically planar wafer cake lies flat on the drawing ring 15 over the deep - drawing cavity 14 and accordingly over the deep - drawing mold 13 . the term “ over ” refers to the schematic view as shown in fig2 . in practice it happens that due to the low stiffness of the flat wafer cake , sagging into the deep - drawing cavity 14 occurs . although in the course of this , the flat wafer cake 8 partially projects into the deep - drawing cavity 14 , for improving clarity and simplicity , this is understood to be covered by the term “ over ” the deep - drawing cavity . actuating the punch actuator for moving the punch 16 in its actuation direction 18 is done in this embodiment by a pneumatic arrangement such as , for example , a linear pneumatic cylinder . of course , it is within the scope of the invention to carry out this linear movement by hydraulic , electric or mechanical actuators such as , for example , hydraulic cylinders , linear motors , linear drives , cam systems , etc . fig3 shows the flat wafer cake 8 positioned on the drawing ring 15 over the deep - drawing cavity 14 and the deep - drawing mold 13 . the punch 16 and the punch actuator are in the first position a , thus in a raised position . furthermore , an ejector 19 is illustrated that , in this embodiment , is configured as an elastically prestressed punch and is in a raised position . lifters 22 are completely recessed in the support face 21 . fig4 and 5 show the preshaping device 3 in the second position b . here , the lifters 22 are extended against a holding force in such a manner that they project above the support face 21 and give the flat wafer cake a shape that has multiple upward bulges , preshaping the cake 8 with folds 23 . thus , the flat wafer cake is converted from a substantially planar shape into a shape that has multiple bulges . during bulging or also after bulging is completed , the punch 16 itself can be moved toward and into the deep - drawing cavity 14 . fig6 and 7 show the deep - drawing device 9 in the third position c . the punch 16 is pushed by its actuator 17 into the deep - drawing cavity 14 and through the drawing ring 15 into the deep - drawing mold 13 . similar to a deep - drawing process , the round blank or the flat wafer cake 8 is drawn by this action into the deep - drawing mold 13 . thus the flat wafer cake 8 is formed into a cup 12 between the punch 16 and the deep - drawing mold 13 . the spring - loaded ejector 19 , which is mounted so as to be guided in the actuation direction of the punch actuator , is pushed by the punch 16 from an extended or raised position shown in fig2 - 5 , into a prestressed recessed position . optionally , a cutting arrangement interacting with a cutting ring 24 can be provided for interaction with the drawing ring in order to cut off the overhang of the flat wafer cake 8 at a rim 26 ( fig1 - 17 ) of the formed cup 12 . to this end , the punch 16 is provided with a cutting ring 24 that interacts with a stop ring 25 . when moving the punch into the deep - drawing cavity , the cutting ring 24 is pressed with its cutting edge against the ring 25 . with the present geometry , the flat wafer cake 8 is cut off along the edge of the cutting ring 24 . it is to be noted that in the present form , a circularly annular cutting ring 24 is provided . however , it is absolutely in accordance with the inventive idea to make the cutting ring oval , rectangular or star - shaped or to shape it following any conceivable shape , in particular following any conceivable closed contour . insertion of the punch 16 , pretensions the ejector 19 . the force of the punch is effective through the flat wafer cake for tensioning a biasing element of the ejector 19 to push this ejector 19 against the force of its biasing spring into the illustrated lowermost position . fig8 shows the device 9 in the fourth position d in which the punch 16 is retracted upward out of the deep - drawing mold 13 . the elastically biased ejector 19 moves synchronously up with the punch 16 and pushes the finished baked product 12 or edible body that is formed from the flat wafer cake 8 and is now cup - shaped and at least partially solidified and dimensionally stable with the punch 16 out of the deep - drawing mold 13 . as this happens , the deep - drawn flat wafer cake formed into the product 12 maintains the desired cup shape . fig9 and 10 show the apparatus in the final or fifth position e with the punch 16 retracted upward completely out of the finished cup 12 and the ejector 19 holding this cup 12 above the plane of the top face of the mold 13 . during the deep - drawing movement according to the invention as illustrated , for example , in fig2 - 9 , of folds are formed on the flat wafer cake or the hollow baked product takes place due to geometrical and physical conditions . as mentioned above , the formation of folds 23 is desired and provides the finished product with a number of advantageous properties . the formation of the folds is illustrated in detail in fig1 to 14 . these figures show a vertical section through a segment , in particular of the fold 23 of the edge of the flat wafer cake that , after the shaping according to the invention , corresponds in the finished state to the rim 26 of the hollow baked product 12 . bulging by the lifters 22 ( see fig4 ) gives the flat wafer cake 8 a shape that enables and / or facilitates the formation of the folds 23 at the desired positions . here , three lifters 22 are provided so that folds 23 are created in three regions of the flat wafer cake 8 . at the beginning of the deep - drawing process , these bulges that eventually form the folds 23 are slightly bulged upward against the deep - drawing direction , and the flat wafer cake 8 extends substantially perpendicular to this vertical deep - drawing direction . as the punch 16 moves down in the deep - drawing cavity 14 and the deep - drawing mold 13 , the flat wafer cake 8 is formed into the cup 12 . side walls 28 of the cup 12 are deformed here from the initial position toward the deep - drawing punch 16 . since the circumference of the flat - lying flat wafer cake 8 is larger than the circumference of the finished cup 12 , the desired formation of folds takes place in particular in the region of the cup rim 26 , but also in a region near a cup floor 27 . at the beginning of the deep - drawing movement , the folds 23 are ω - shaped ( omega - shaped ) bulges , as shown in fig1 . with continued penetration and deep drawing of the flat wafer cake 8 , these ω - shaped bulges are more and more compressed , as illustrated in the fig1 and 13 . once the punch 16 is completely or almost completely moved into the deep - drawing mold 13 , the desired fold shape according to fig1 is formed . it is to be noted that this is a possible fold shape . through suitable selection of the lifters 22 , for example asymmetrical lifters , angular lifters , but also through the number of lifters , it is possible according to the inventive idea to achieve different fold shapes . the fold shape as illustrated in fig1 , for example , imparts to the flat wafer cake a constant thickness during the baking process and forms the desired reinforced regions only through specific folding in the folds 23 . if the lifters 22 were not provided , folds 23 would still be created ; however , their positions would be at random so that the folds of each individual flat wafer cake would be generated at different positions . in is particular in mass production , this results in a high reject rate of wafer bodies caused by , for example , crack formation , irregular arrangement of folds , etc . with the present invention , selecting the position of the folds 23 is possible , that is they can be uniformly spaced in each cup 12 and identically spaced on all finished cups 12 . fig1 shows an embodiment of a possible baked , deep - drawn product . it has the rim 26 , the floor 27 , the side wall 28 and the folds 23 . here , the rim 26 is formed such that it projects laterally in a plane . this collar - shaped or bent embodiment increases stability and strength of the rim 26 . fig1 shows another embodiment of a cup - shaped baked product 12 according to the invention in a side view . here , however it is also in accordance with the inventive idea to shape the baked product spherically , hemispherically , cylindrically , conically , cubically or cuboidally , etc . in addition here the rim 26 is not bent over and outwardly projecting , but has been cropped off very close to the side wall 28 . fig1 is a view from above of an inventive baked product according to fig1 . as noted , the folds 23 are laid on top of each other multiple times . the present illustration is a schematic view . it can happen in practice that in particular the regions lying on top of each other in a multilayer manner are squeezed by the punch and that therefore the flat wafer cake is thinner in this region than in the remaining regions of the side wall 28 . thus , despite the multilayer arrangement in the folds , a constant total wall thickness along the entire side wall might exist . here of fig1 , two folds 23 are regularly distributed on the circumference . however , it is also in accordance with the is inventive idea to provide more than two , in particular three , four , five , six or more folds . in the embodiments shown , the folds are bulged by the lifters 22 . however , it is also within the meaning of the invention that no lifters extending opposite to the deep - drawing direction are used , but , for example , formations such as recesses or cutouts are provided in the region of the drawing ring 25 or in the region of the support face of the preshaping device 3 . for example , in a further , unillustrated embodiment , cutouts are provided in the drawing ring and in the region of the deep - drawing cavity , into which cutouts regions of the soft round blank , in particular of the hot , shapable flat wafer cake 8 are drawn by gravity or other holding force prior to the deep - drawing process or during the deep - drawing process . this configuration too forms folds that result in the desired specific fold formation during the deep - drawing process . it should be noted here that the invention is not limited to the above - described illustrated embodiments . further embodiments in accordance with the inventive idea arise from combinations of individual or a plurality of features that can be found in the entire description , the figures and / or the claims . thus , also such embodiments are disclosed that consist of combinations of features that originate from different illustrated embodiments . the figures are at least partially schematic views , dimensions and proportions deviating from further illustrated embodiments or features that are not graphically illustrated , as well as from real embodiments .
a hollow body is made from a flat baked wafer cake by first juxtaposing the wafer cake with a cavity of a deep - drawing mold and then forming edge regions of the cake with a plurality of deformations out of a plane of the cake at a uniformly spacing around a periphery of the cake . then the cake is pushed by a deep - drawing punch into the cavity to it into a hollow body and to form each of the deformations into a multilayer fold .