the invention is discussed below in a more detailed way with examples illustrated by the following figures : fig1 shows a microneedle manufacturing process according to the state of the art . fig2 shows a microneedle manufacturing process according to the invention . fig3 is an upper view of the element shown in fig2 . fig4 is a picture of an assembly microneedle - hat according to the state of the art ( without bridges ) fig5 shows one example of bridges according to the invention . fig6 shows another example of bridges according to the invention . fig7 shows another example of bridges according to the invention . fig8 shows another example of a bridges according to the invention . fig9 is a picture of the example shown on fig5 . fig1 is a picture of microneedles with hats and bridges before removal ( status before fig1 ) fig1 is a picture of a microneedle obtained with a process according to the invention . state of the art mems microneedle fabrication process as described in fig1 usually starts with a wafer , preferably a silicon wafer 4 . on top of this silicon wafer a silicon dioxide layer is used as a protective mask to pattern the microneedles . this process aims at obtaining microneedles separated from each others and as a consequence the continuous protective mask in step a becomes discontinue at the start of the structuration of the microneedles step b . the parts of this discontinuous protective mask are called hats 2 and each microneedle is overlooked by a hat , protecting the microneedle and allowing controlled and well defined structuration . fig4 shows an example of a microneedle creation 1 under a hat 2 . this structuration of the microneedles is performed by a sequence of isotropic and anisotropic etches as represented in fig1 steps b to e . the first isotropic etch as represented in fig1 step b initiates the tip of the microneedle . the first anisotropic etch ( fig1 , step c ) is used to define the head of the microneedle . the goal of the second isotropic etch as represented in fig1 step d is to initiate the shoulder of the microneedle and to separate the head of the microneedle with the shaft which is obtain thanks to the second anisotropic etch ( fig1 , step e ). finally comes the last isotropic etch ( fig1 , step f ) which is the most important etch of the process . thanks to this etch , we pattern the tip of the microneedle , the backside trough holes and the final design of the microneedle , an oxidation and a silicon oxide etch as represented in fig1 , step g are then realized to remove the hats and to polish the silicon surface . frequently hats may fall before the end of the process ( fig1 , step f , ref . 2 ): this leads to a situation in which the structuration of the microneedle becomes uncontrolled resulting in malformation and low production yields . in addition the fallen hats provoke a bad surface state as shown in fig1 ref 5 . the present invention provides a way to hold the hats together so that they won &# 39 ; t fall before the end of the process . to this effect the hats are linked together and are linked to the edges as displayed in fig3 . these links ( fig2 , ref 3 ), also named bridges in the present text , will stay in place up to the end of the process and guarantee the stability of each hat until the microneedle fabrication is ended ( fig2 step f ). when the process has been completed ( fig1 step g ) the hat and their links are removed revealing perfect microneedles pattern ( see e . g . fig1 ) and chip surface state . an important advantage of these links is that they do not modify the microneedle structuration parameters . the isotropic and anisotropic etches are the same with or without links . as described earlier bridges and hats are deeply linked together ; as a matter of fact their are made of same materials and have the same thickness . as far as the design of the bridges is concerned it can take many forms . simple linear bridge between the hats can be an option as shown schematically in fig5 and on the picture in fig9 which represents microneedle process of step b in fig1 . curved segments as in fig6 and fig7 or combination of rectilinear and curved segments as in fig8 are also possible . another aspect of the design of the bridges is the material . single layer bridges can be appropriate for many processes but depending on the complexity of the process and also on the cleaning steps multilayer bridges can be a better option . multilayered bridges improve the characteristics of the bridges ( fig1 ). we may associate metal layers ( aluminium , tungsten , nickel . . . ) and no conductive layers ( silicon dioxide , silicon nitride . . . ). the metal layers improve the thermal conductivity of the bridges and the non conductive layers improve the mechanical resistance and the high selectivity of the bridges .
out - of - plane microneedle manufacturing process comprising the simultaneous creation of a network of microneedles and the creation of a polygonal shaped hat above each microneedle under formation , said process comprising the following steps : providing bridges between the hats , maintaining the bridges during the remaining microneedle manufacturing steps , removing the bridges , together with the hats , when the microneedles are formed .