referring now to the drawings in more detail and initially to fig1 , numeral 10 generally designates a plush item or toy , such as a teddy bear . the plush 10 may be of any configuration or shape , but generally includes a soft fabric outer layer 12 and is generally filled with some type of soft compressible fill material 14 . this well - known combination creates a plush item 10 that children 16 like to hold and / or squeeze , as pictured in fig1 . this particular plush 10 includes electrical components 18 that allow the plush 10 to interact with the child 16 . the electrical components 18 generally include a battery 20 , a micro - processor 22 , a speaker 24 , a plush hug sensor 26 of the present invention , and a plurality of the wires 28 connecting all of the other electrical components 18 to make an electrical circuit 30 . the battery 20 can be any power source known in the art . when the plush hug sensor 20 is positioned inside a plush item 10 , the power source is preferably a self - contained device , such as the battery 20 . the battery 20 , as is known in the art , is preferably contained inside a battery compartment or housing 32 . as the battery housing 32 is generally necessarily a rigid structure , and an item which users occasionally need access to in order to replace the battery 20 , the battery housing is preferably positioned adjacent the outer layer 12 . additionally , as children 16 generally hug the torso or trunk 34 of the plush item , rigid or non - soft items are preferably positioned above or below the middle 34 of the plush toy 10 . in the embodiments illustrated in fig3 - 6 , the battery compartment 32 is positioned inside a pocket 36 which is accessed through a rear 38 of the plush 10 near a lower most portion 40 of the trunk 34 . it should be noted that the battery compartment 32 can be positioned anywhere within the plush toy 10 . similarly , the speaker 24 may be positioned within a rigid housing 42 to protect it from damage . in the illustrated embodiments , the speaker housing 42 is positioned in a head 44 of the plush 10 adjacent or directly behind where the animal figure &# 39 ; s mouth would be such that audio emanating from the speaker 24 appears to be spoken by the plush 10 or emanating from its mouth . the microprocessor 22 , to be protected from damage , may be positioned in either the battery compartment 32 or the speaker housing 42 . fig3 illustrates an embodiment where the microprocessor 22 is positioned in the speaker housing 42 and fig4 illustrates an embodiment where the microprocessor 22 is positioned in the battery compartment 32 . the sensor 26 , which has been identified as a plush hug sensor for reasons that will become apparent after the benefit of this full disclosure but which is not constrained for use in a plush or for detecting hugs , is preferably constructed as a multi - layer device . in a first embodiment illustrated in fig7 - 12 , the sensor 26 preferably includes a pair of conductive foam sheets 46 , 48 separated by a non - conductive foam sheet 50 . while the sensor may be made with only the three layers of foam , preferably , adhesive layers 52 and 54 are positioned intermediate the foam layers to secure the foam layers to one another and to maintain the structural integrity of the sensor 26 , as will be discussed in more detail below . the non - conductive foam 50 , which is intermediate the two outer foam layers 46 , 48 , includes one or more holes or apertures 56 therethrough , as best illustrated in fig9 and 12 . while the intermediate , non - conductive foam layer 50 spaces apart the two conductive foam layers 46 , 48 , the holes 56 through the non - conductive foam 50 provide an opening through the non - conductive layer 50 where inwardly facing surfaces 58 of the conductive layers 46 , 48 can connect in abutting contact when moved towards one another . in that regard , the sensor 26 has a normal rest or non - compressed position that is illustrated in fig5 and 7 - 9 . in this position , as best illustrated in fig9 , the inwardly facing surfaces 58 of the outer conductive layers 46 , 48 are spaced apart from one another and do not provide an electrical connection from one layer to another or across the sensor 26 . in this regard , the sensor 26 , in this state , essentially acts as an open switch to prevent the flow of current across the sensor 26 and through the circuit 30 . because the sensor 26 is compressible ( or at least because the two conductive layers 46 , 48 are moveable towards one another ), external forces on the sensor 26 , preferably from opposite sides of the sensor 26 in the form of compression forces , will act to compress the non - conductive foam layer 50 and move the inwardly facing surfaces 58 of the two conductive layers 46 , 48 towards one another until they are in abutting contact in the areas where the non - conductive foam layer 50 has apertures 56 , as best illustrated in fig1 and 11 . accordingly , the sensor 26 has a second or compressed state where at least a portion of one of the conductive foam layers 46 , 48 is in abutting contact with a portion of the other conductive foam layer 46 , 48 . this abutting contact , identified in fig1 by numeral 60 , makes an electrical connection which permits current to flow through the sensor 26 and from one of the foam layers 46 , 48 to the other . as such , in the compressed state , the sensor 26 acts as a closed switch to complete the electrical circuit 30 . the conductive foam used in the outer layers 46 , 48 , has a known resistance per length or distance between connection points . accordingly , if a piece of the conductive foam were to be placed in a circuit with a contact going in one end of the foam and another out the other end , if the distance between the contacts through the foam was known , a known resistance level could be calculated . the resistance level could be changed slightly by compression of the foam thereby decreasing the resistivity of the foam piece . while the connections to the conductive layers 46 , 48 of the sensor 26 can be made by inserting wires 28 therein , as illustrated in fig3 , 4 and 8 , the wires 28 can also be connected to the conductive layer by way of a piece of conductive copper tape 62 with a conductive adhesive , as best illustrated in fig7 and 12 . with a known resistivity for the conductive foam , the location at which the wires 28 are connected to the outer layers 46 , 48 will have an effect on the voltage across the sensor 26 . for example , in fig8 , the leads are wires 28 are connected to the sensor on opposite sides and at opposite ends . consequently , a single connection point between the outer layers 46 , 48 towards the upper portion of the sensor in fig8 will result in a resistance that is similar to a single connection by compression at the lower end of the sensor 26 . alternatively , if both leads were placed in the sensor on opposite sides at about the same location , the resistance would appear differently if the connection occurred farther away from the leads than if the connection occurred closer to the leads . these differences can be used and incorporated into the responses that are given , depending on the desired purpose of the sensor . in addition to the compressing of the conductive foam changing the resistance through the foam , the amount of surface area connection between the inwardly facing surfaces 58 of the two outer conductive foam layers 46 , 48 also changes the resistance across the sensor 26 and can be measured as a change in voltage by the micro - processor 22 . in that regard , if contact is only made between the two layers 46 , 48 through one hole 56 in the non - conductive or insulated foam layer 50 , a first resistivity value occurs that is associated with a first voltage level through the circuit 30 . if , however , more of the sensor 26 is compressed such that contact is made between the two layers 46 , 48 through multiple holes 56 , as illustrated in fig1 and 11 , an alternate and decreased resistance level is provided across the sensor 26 resulting in a second resistance and , in turn , a second voltage through the circuit that can be measured again by the micro - processor 22 . these detected changes correlate with a level of interaction with the sensor 26 and , in turn , changes in a level of interaction with the item , such as the plush toy 10 into which the sensor 26 is inserted . these detected changes can be used to create responses to the changes in interaction such as , for example , varying audio messages that are played back to the user or child 16 by the micro - processor 22 through the speaker 24 . for instance , in one example , a child may gently squeeze the plush toy 10 just enough to compress the sensor 26 sufficiently such that the outer layers 46 and 48 connect with each other through one hole 56 . the micro - processor can notice the change in the circuit 30 from an open circuit to a closed circuit and can associate the resulting voltage through the circuit 30 with an appropriate response message . an exemplary response message would be “ thanks for the gentle hug . can you give a bear hug too ?” should the child 16 squeeze harder , such that a greater amount of surface area of the two foam layers 46 , 48 abut one another through multiple holes 56 in the insulation layer 50 , the micro - processor 22 can recognize the resulting voltage change , associated with an increased compression or squeeze of the sensor 26 and output an appropriate response , such as “ you did it ! are you a bear too ?” it should be noted that other responses , apart from audio responses , may be made based on detected changes by the sensor . other responses may include for example , but are not limited to , activation or modification of light output , motion or data output based on the sensor readings , as well as changes in volume of audio outputs . the sensor 26 may be placed inside a fabric pouch 64 , similar to a pillow case , with the wire leads exiting the pouch . this assists with assembly of the plush toy 10 and allows for positioning of the sensor 26 in a desired location in the plush by securing , such as by sewing , a portion of the pouch 64 to the outer layer 12 , as illustrated in fig5 and 6 . while the sensor 26 has been described as having a use for incorporation into a plush toy for detecting squeezes or hugs thereof , the sensor 26 can be used in a number of environments and should not be limited to one particular use . the adhesive layers 52 , 54 , as discussed above , work to not only hold the sensor 26 together but to prevent distortion or shrinking / closing of the apertures 56 in the non - conductive layer 50 , thereby keeping them open to permit the opposing layers 46 , 48 to abut therein . the adhesive layers 52 , 54 can take the form of a two - sided non - conductive adhesive tape , as illustrated in fig1 , or may be a liquid , such as a glue , applied via conventional solution coaters . one possible manufacturing method for the embodiment of the sensor 26 illustrated in fig1 includes using sheets of double - sided tape having a non - adhesive backer applied to both sides of the tape . a sheet of the tape may then have the backer layer removed from one of the sides of the tape to reveal the adhesive surface and placing the tape on one side of a sheet of non - conductive foam . a similar step may be taken by placing a second sheet of adhesive tape on the other side of the non - conductive foam sheet . the three layered resulting assembly may be then passed to a machine where it is die cut to not only form the apertures 56 but to also size the middle layer 50 of the sensor 26 . in this manufacturing method , holes 66 are cut through the double - sided tape that forms the adhesive layers 52 and 54 at the same time as the holes 56 are cut through the insulation layer 50 . as such , the holes 56 , 66 align . the three layer assembly may then be passed on to have the outer conductive foam layers 46 , 48 applied thereto by removal of the backing sheets on the outer surfaces of the double sided tape , thereby revealing the adhesive layer on the outer surfaces of the three layered assembly and creating the sensor 26 illustrated in fig7 through 12 . fig1 through 16 illustrate an alternate embodiment of the sensor 26 . in this embodiment , an additional outermost layer of nonconductive foam 68 is secured to an outer surface 70 of the conductive foam layer 46 . the outer layer of nonconductive foam material 68 provides the sensor 26 with increased resiliency and firmness without compromising its soft nature . many variations can be made to the illustrated embodiments of the present invention without departing from the scope of the present invention . such modifications are within the scope of the present invention . for example , the circumference , shape , and number of holes 56 may be modified depending on the characteristics desired in the sensor 26 . in that regard , the holes may be round , square , triangular , etc . there may be a single hole or a plurality of holes . also , the holes may be small or large and the thickness of the insulating layer may be modified . additionally , while the sensor has been shown as a generally plainer item , the sensor could be constructed as a cylinder or other shapes depending on the desired properties and configuration . further , while the wires 28 are shown connected to the sensor in one embodiment by way of a coppered tape 62 , other methods , such as two sided conductive tape ( carbon infused , conductive polymers , and the like ), conductive adhesives including “ super glues ”, epoxies and other conductive adhesives or other methods known in the art for holding electrical leads in low electrically resistive contact with the conductive foam are acceptable . similarly , the electrically conductive lead or wire 28 could simply be inserted into an area of the conductive foam and secured therein by applying a conductive adhesive to the lead prior to inserting it into the foam or by applying adhesive to the lead where it exits the foam . further still , while the conductive and non - conductive layers have been identified as a foam , any compressive or stretchable material with the same conductivity properties will suffice . other modifications would be within the scope of the present invention . from the foregoing it will be seen that this invention is one well adapted to attain all ends and objects hereinabove set forth together with the other advantages which are obvious and which are inherent to the method and apparatus . it will be understood that certain features and subcombinations are of utility and may be employed without reference to other features and subcombinations . this is contemplated by and is within the scope of the invention . since many possible embodiments may be made of the invention without departing from the scope thereof , it is to be understood that all matter herein set forth or shown in the accompanying drawings is to be interpreted as illustrative of applications of the principles of this invention , and not in a limiting sense .
a plush toy having electronics therein for interacting with a user includes a non - rigid electrical component for detecting deformation thereof . the component , also referred to as a hug sensor , has an electrically conductive and compressible material and is movable from a rest , non - compressed position towards a compressed position by way of the application of an external force thereon . the hug sensor has a resistance there across that is monitored by a microprocessor . compression of the hug sensor causes changes in the resistance across the hug sensor . changes in the detected resistance across the hug sensor result in activation of responses . varying responses may be activated as a result of varying changes in resistance .