the following description is merely exemplary in nature and is in no way intended to limit the disclosure , its application , or uses . for purposes of clarity , the same reference numbers will be used in the drawings to identify similar elements . as used herein , the phrase at least one of a , b , and c should be construed to mean a logical ( a or b or c ), using a non - exclusive logical or . it should be understood that steps within a method can be executed in different order without altering the principles of the present disclosure . referring now to fig1 and 2 , a feedthrough assembly 10 according to various embodiments of the present disclosure as illustrated . the feedthrough assembly 10 includes a plurality of layers . a substrate 14 includes a plurality of traces 15 formed on one or both sides of the substrate 14 . the substrate 14 can be made of any non - conductive material , for example , a high temperature co - fired ceramic or other ceramic material . the traces 15 can be formed on the substrate 14 by depositing a conductive material , such as platinum , gold or palladium , on the surface of substrate 14 such that they extend from one edge of the substrate to the other . other methods of forming traces 15 can be utilized . the traces 15 can be formed on a first surface 144 a and / or a second surface 144 b of the substrate 14 . in various embodiments , integrated devices such as capacitors and / or filtering devices , e . g ., saw filters , can be formed ( for example , by screening or photo lithography processes ) on the substrate 14 or applied to the substrate 14 , and electrically connected to the traces 15 / contact pads 150 . for example , a saw filter can be made from various materials , such as lithium niobate or lithium tantalate , and surface mounted to the substrate 14 . in this case , the insulator layer ( s ), which are described below , can encase the saw filter to serve as a hermetic housing . an insulator layer 13 a , 13 b can be formed on the first and second surfaces 144 a , 144 b , respectively . the insulator layer can be formed of any non - conductive material , such as a high temperature co - fired ceramic or other ceramic material , similar to the substrate 14 . in some embodiments , the insulator layers 13 a , 13 b can be formed of any biostable and biocompatible materials , e . g ., alumina , zirconia or a combination thereof . in various embodiments , the insulator layer 13 a , 13 b covers only a portion of the first and second surfaces 144 a , 144 b of the substrate 14 . for example , substrate edges 142 a , 142 b can remain exposed and not covered by insulator layer 13 a , 13 b . in this manner , traces 15 can be electrically connected to the imd . ground planes 12 a , 12 b can be formed on the insulator layer 13 a , 13 b in various embodiments . the ground planes 12 a , 12 b can be formed of any conductive material , such as platinum , gold , palladium or other metal . the ground planes 12 a , 12 b assist in shielding the traces 15 from stray electromagnetic interference , as well as minimizing interference between the traces 15 themselves . in various embodiments , the ground planes 12 a , 12 b can be formed of a continuous layer of conductive material covering the insulator layers 13 a , 13 b . in some embodiments , the ground planes 12 a , 12 b can be formed of a mesh or grid of conductive material covering the insulator layers 13 a , 13 b . another insulator layer 11 a , 11 b can be formed on the ground planes 12 a , 12 b to insulate the ground planes 12 a , 12 b from the imd . while the illustrated embodiments show the ground planes 12 a , 12 b to be formed on layers separate from substrate 14 , the present disclosure encompasses the formation of ground planes 12 a , 12 b in different configurations . for example , ground planes 12 a , 12 b can be formed on the substrate 14 and electrically insulated from traces 15 . furthermore , ground planes 12 a , 12 b can be formed to substantially surround the substrate 14 and / or be oriented perpendicular to the first and second surfaces 144 a , 144 b of substrate 14 . ground planes 12 a , 12 b can be connected to electrical ground potential in various ways , for example , by connection with one or more of the traces 15 , one or more of the contact pads 150 , with a weld ring 35 ( described more fully below ) or a combination thereof . for example only , ground planes 12 a , 12 b can be connected with traces 15 through the use of one or more vias formed in an insulator layers or layers 11 a , 11 b . the use of vias is described more fully below with respect to fig6 - 7 . the traces 15 of the feedthrough assembly 10 can extend to the edges 142 a , 142 b of the substrate 14 . in this manner , the traces 15 can be utilized as card edge connectors to mate with corresponding receiver slots ( not shown ) present , e . g ., in the imd . in various embodiments , contact pads 150 are included as part of the traces 15 . the contact pads 150 can have a larger surface area than traces 15 such that positive coupling between the traces and the associated circuitry of the imd can be assured . in various embodiments , the traces 15 / contact pads 150 can extend around the edges 142 a , 142 b and be present on end surfaces 140 of the substrate 14 , as shown in fig3 . the presence of the traces 15 , with or without contact pads 150 , on the end surfaces 140 can provide a more consistent coupling between the feedthrough assembly 10 and the receiver slots of the imd . referring now to fig4 , a feedthrough assembly 20 with an integrated transceiver 26 according to various embodiments of the present disclosure as illustrated . similar to feedthrough assembly 10 discussed above , the feedthrough assembly 20 includes a plurality of layers . a substrate 24 includes a plurality of traces 25 formed on one or both sides of the substrate 24 . the substrate 24 can be made of any non - conductive material , for example , a high temperature co - fired ceramic or other ceramic material . the traces 25 can be formed on the substrate 24 by depositing a conductive material , such as platinum , gold or palladium , on the surface of substrate 24 such that they extend from one edge of the substrate to the other . other methods of forming traces 25 can be utilized . the traces 25 can be formed on a first surface 244 a and / or a second surface 244 b of the substrate 14 . the traces 25 can include contact pads , similar to that described above in regard to traces 15 and contact pads 150 . in various embodiments , integrated devices such as capacitors and / or filtering devices , e . g ., saw filters , can be formed on the substrate 24 and electrically connected to the traces 25 . an insulator layer 23 a , 23 b can be formed on the first and second surfaces 244 a , 244 b , respectively . the insulator layer can be formed of any non - conductive material , such as , a high temperature co - fired ceramic or other ceramic material , similar to the substrate 24 . in various embodiments , the insulator layer 23 a , 23 b covers only a portion of the first and second surfaces 244 a , 244 b of the substrate 24 . substrate edges 242 a , 242 b can remain exposed and not covered by insulator layer 23 a , 23 b . in this manner , traces 25 can be electrically connected to the imd . ground planes 22 a , 22 b can be formed on the insulator layer 23 a , 23 b in various embodiments . the ground planes 22 a , 22 b can be formed of any conductive material , such as platinum , gold , palladium or other metal . the ground planes 22 a , 22 b assist in shielding the traces 25 from stray electromagnetic interference , as well as minimizing interference between the traces 25 themselves . in various embodiments , the ground planes 22 a , 22 b can be formed of a continuous layer of conductive material covering the insulator layers 23 a , 23 b . in some embodiments , another insulator layer 21 a , 21 b is formed on the ground planes 22 a , 22 b to insulate the ground planes 22 a , 22 b from the imd . as described above , ground planes 22 a , 22 b can be connected to electrical ground potential in various ways , for example , by connection with one or more of the traces 25 , one or more of the contact pads 150 , with a weld ring 35 ( described more fully below ) or a combination thereof . the traces 25 of the feedthrough assembly 20 can extend to the edges 242 a , 242 b of the substrate 24 . in this manner , the traces 25 can be utilized as card edge connectors to mate with corresponding receiver slots ( not shown ) present , e . g ., in the imd . in various embodiments , the traces 25 can extend to around the edges 242 a , 242 b and be present on end surfaces 240 of the substrate 24 , as shown in fig3 with respect to feedthrough assembly 10 . the presence of the traces 25 on the end surfaces 240 can provide a more consistent coupling between the feedthrough assembly 20 and the receiver slots of the imd . an integrated transceiver 26 can be surface mounted on the substrate 24 , as illustrated in fig4 . a signal - in trace 262 can be electrically connected to integrated transceiver 26 from the imd . in this manner , integrated transceiver 26 can receive signals from the imd . integrated transceiver 26 can be further electrically connected to a signal - out trace 264 . signal - out trace 264 can be electrically connected to an antenna or transmission / reception element ( not shown ). in this manner , integrated transceiver 26 can transmit information received from the imd to , as well as receive information from , a remote device . integrated transceiver 26 can be powered by power lines 266 formed as traces on substrate 24 . in various embodiments , transceiver 26 can include power lines and / or include signal - in and signal - out lines that are separate from the substrate 24 and traces 25 formed thereon , such as with a wire or ribbon bond . referring now to fig5 , a feedthrough assembly 30 according to various embodiments of the present disclosure as illustrated . feedthrough assembly 30 can be substantially similar to feedthrough assemblies 10 and 20 described above . weld ring 35 can be hermetically sealed to feedthrough assembly 30 . weld ring 35 can be can be made of any biostable and biocompatible material , for example , titanium , niobium , tantalum or combinations thereof . weld ring 35 can also be connected to the body of imd such that there is a hermetic seal between imd and feedthrough assembly 30 . the weld ring 35 can be coupled to the feedthrough assembly in various manners , such as by braze joint , diffusion bond , glass seal or a compression seal . referring now to fig6 and 7 , a feedthrough assembly 200 according to various embodiments of the present disclosure as illustrated . the feedthrough assembly 200 includes a plurality of layers . a substrate 204 includes a plurality of traces 205 ( fig7 ) formed on one or both sides of the substrate 204 . the substrate 204 can be made of any non - conductive material , for example , a high temperature co - fired ceramic or other ceramic material . the traces 205 can be formed on the substrate 204 by depositing a conductive material , such as platinum , gold or palladium , on the surface of substrate 204 . other methods of forming traces 205 can be utilized . the traces 205 can be formed on a first surface 244 a and / or a second surface 244 b of the substrate 204 . in various embodiments , integrated devices such as capacitors and / or filtering devices , e . g ., saw filters , can be formed ( for example , by screening or photo lithography processes ) on the substrate 204 or applied to the substrate 204 , and electrically connected to the traces 205 / contact pads 250 . for example , a saw filter can be made from various materials , such as lithium niobate or lithium tantalate , and surface mounted to the substrate 204 . in this case , the insulator layer ( s ), which are described below , can encase the saw filter to serve as a hermetic housing . an insulator layer 203 a , 203 b can be formed on the first and second surfaces 244 a , 244 b , respectively . the insulator layer can be formed of any non - conductive material , such as a high temperature co - fired ceramic or other ceramic material , similar to the substrate 204 . in some embodiments , the insulator layers 203 a , 203 b can be formed of any biostable and biocompatible materials , e . g ., alumina , zirconia or a combination thereof . in various embodiments , the insulator layer 203 a , 203 b covers the entire first and second surfaces 244 a , 244 b of the substrate 204 . ground planes 202 a , 202 b can be formed on the insulator layer 203 a , 203 b in various embodiments . the ground planes 202 a , 202 b can be formed of any conductive material , such as platinum , gold , palladium or other metal . the ground planes 202 a , 202 b assist in shielding the traces 205 from stray electromagnetic interference , as well as minimizing interference between the traces 205 themselves . in various embodiments , the ground planes 202 a , 202 b can be formed of a continuous layer of conductive material covering the insulator layers 203 a , 203 b . in some embodiments , the ground planes 202 a , 202 b can be formed of a mesh or grid of conductive material covering the insulator layers 203 a , 203 b . another insulator layer 201 a , 201 b can be formed on the ground planes 202 a , 202 b to insulate the ground planes 202 a , 202 b from the imd . while the illustrated embodiments show the ground planes 202 a , 202 b to be formed on layers separate from substrate 204 , the present disclosure encompasses the formation of ground planes 202 a , 202 b in different configurations . for example , ground planes 202 a , 202 b can be formed on the substrate 204 and electrically insulated from traces 205 . furthermore , ground planes 202 a , 202 b can be formed to substantially surround the substrate 204 and / or be oriented perpendicular to the first and second surfaces 244 a , 244 b of substrate 204 . as described above , ground planes 202 a , 202 b can be connected to electrical ground potential in various ways , for example , by connection with one or more traces 205 , one or more contact pads 250 , a weld ring 35 ( described more fully below ) or a combination thereof . in various embodiments , the traces 205 of the feedthrough assembly 200 do not extend to the edges of the substrate 204 . instead , contact pads 250 are formed on a separate layer ( in the illustrated example , insulator layer 201 a ) and electrically coupled with traces 205 . in this manner , the contact pads 250 can be utilized as card edge connectors to mate with corresponding receiver slots ( not shown ) present , e . g ., in the imd . the contact pads 250 can have a larger surface area than traces 205 such that positive coupling between the traces and the associated circuitry of the imd can be assured . in various embodiments , the contact pads 250 can extend around the edges of the feedthrough assembly , similar to feedthrough assembly 20 illustrated in fig3 . the presence of the contact pads 250 on the end surfaces can provide a more consistent coupling between the feedthrough assembly 200 and the receiver slots of the imd . the traces 205 can be electrically coupled with the contact pads 250 by vias 255 . vias 255 extend between the various layers of feedthrough assembly 200 , and can be formed of any conductive material , such as platinum , gold , palladium or other metal . in the illustrated embodiment , vias 255 extend through insulator layer 201 a , ground plane 202 a and insulator layer 203 a to couple contact pads 250 to traces 205 . in order to isolate the vias 255 from ground plane 202 a , apertures 257 are formed in ground plane 202 a through which vias 255 extend . in some embodiments , apertures 257 can be filled with an insulative material . in other various embodiments , apertures 257 can be hollow openings in the various layers through which vias 255 extend . in various embodiments of the present disclosure , feedthrough assembly 200 can include a weld ring 235 to hermetically seal feedthrough assembly 200 . weld ring 235 can also be connected to the body of imd such that there is a hermetic seal between imd and feedthrough assembly 200 . the weld ring 235 can be coupled to the feedthrough assembly in various manners , such as by braze joint , diffusion bond , glass seal or a compression seal . furthermore , in various embodiments , feedthrough assembly 200 can include an integrated transceiver , similar to feedthrough assembly 20 described above and illustrated in fig4 . the broad teachings of the disclosure can be implemented in a variety of forms . therefore , while this disclosure includes particular examples , the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings , the specification , and the following claims .
a multilayered feedthrough for an implantable medical device includes a substrate having a first edge , a second edge , and a substrate length . a plurality of traces is formed on the substrate and extends along the substrate length . the plurality of traces extends to the first and second edges of the substrate . an insulator layer is formed on the substrate and the plurality of traces . a ground plane layer is formed on the insulator layer .