Material Composition Declaration© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under bothinternational and Pan-American copyright conventions.
This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly with lowerlevel parts, the declaration encompasses all lower level materials for which the manufacturer has engineering responsibility.
1752-21.1IPC Web Site for Information on IPC-1752 Standardhttp://www.ipc.org/IPC-175x
Form Type *Distribute
Declaration Class *Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Information
Supplier Information
Company name*
On Semiconductor
Company unique IDUnique ID AuthorityResponse Date*
2021-07-27
Contact Name
 Product-Env-Stewards
Title - Contact
Product Enviro Compliance
Phone - Contact*
Email - Contact*
 Product-Env-Stewards@onsemi.com
Authorized Representative*
 Product-Env-Stewards
Title - Representative
Product Enviro Compliance
Phone - Representative*
Email - Representative*
 Product-Env-Stewards@onsemi.com
Requester Item NumberMfr Item NumberMfr Item NameEffective DateVersionManufacturing SiteWeight*UOMUnit Type
NCP1117DT18GANA LO DIF 800MA POS REG2021-07-27MY1350.99mgEach
Manufacturing Proccess Information
Terminal Plating / Grid Array MaterialTerminal Base AlloyJ-STD-020 MSL RatingPeak Process Body Temperature Max Time at Peak TemperatureNumber of Reflow Cycles
Matte Tin (Sn) - annealedCU Alloy1260C30seconds3
Comments
level 1 - maximum time at peak temperature during soldering is 10-30 seconds
For more information regarding material composition please refer to page 3
RoHS Material Composition DeclarationDeclaration Type *Detailed
Directive 2015/863/EU amending RoHSDirective 2011/65/EU
RoHS Definition: Quantity limit of 0.01% by mass (100 PPM) in homogeneous material for Cadmium and quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead(Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE), and Bis(2-ethylhexyl) phthalate (DEHP), Benzyl-butylphthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate (DIBP).
Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part identified on this form contains lead, mercury,cadmium, hexavalentchromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a “RoHS restricted substance”) in excess of the applicable quantity limit identified above. If a homogeneous material within the partcontains a RoHS restricted substance inexcess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shallencompass all such components.Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief,as of the date that Supplier completes this form.Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive.Company acknowledges that Supplier may have relied on informationprovided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has notindependently verified information provided by others, Supplier agrees that, at a minimum, itssuppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as thecertification in this paragraph.If the Company and the Supplier enter into a written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part ofthat agreement, will be the sole and exclusivesource of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, thewarranty rights and/or remedies of Supplier's Standard Terms andConditions of Sale applicable to such part shall apply.
RoHS Declaration *4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptionsSupplier Acceptance *Accepted
Exemption: 7a: Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).
Exemption List VersionEL-2011/534/EU
Declaration Signature
Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign the declaration (if required by theRequester) and click on Submit Form to have the form returned to the Requester.
Supplier Digital SignatureRastislav Drska
Homogeneous Material Composition Declaration for Electronic Products
SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the homogeneous material [3], enter the weight of thehomogeneous material.
Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the substance (JIG) or enter the substance and CAS (Other). [D]select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3sigma range of distribution unless otherwise noted).
Homogeneous MaterialWeightUnit of MeasureLevelSubstanceCASExemptWeightUnit of Measure
Die0.2mgSupplierSilicon (Si)7440-21-30.2mg
Die Attach1.4mgALead (Pb)7439-92-17a1.33mg
SupplierTin (Sn)7440-31-50.07mg
Lead Frame214.64mgBNickel (Ni)7440-02-00.4293mg
SupplierCopper (Cu)7440-50-8214.2107mg
Mold Compound-Black129.65mgEpoxy resinproprietary data9.0755mg
SupplierPhenolic ResinProprietary Data9.0755mg
SupplierSilica Amorphous (SiO2)7631-86-919.4475mg
SupplierCarbon Black (C)1333-86-40.6482mg
SupplierFused Silica (SiO2)60676-86-091.4032mg
Plating3.73mgSupplierTin (Sn)7440-31-53.73mg
Wire Bond - Cu1.37mgSupplierCopper (Cu)7440-50-81.37mg