                   
June 29, 2021 
             
Notice of Listing of an Equity-Method Affiliate That Manufactures Semiconductor Wafers 
From the perspective of fair disclosure, the Company hereby discloses information on when Hangzhou Semiconductor 
Wafer Co., Ltd. (hereinafter "FTHW"), our equity-method affiliate, will get listed on the Science and Technology Innovation 
Board (hereinafter “STAR Market”) as referred to during a section of explaining our business operations in our 41st annual 
meeting of shareholders held today. In conjunction, we will use the following English abbreviation for the company from now 
1. When the equity-method affiliate gets listed on the STAR Market 
If we complete our preparations for listing of the company as we have planned, we will submit an application for its listing 
on the STAR Market in June 2022 with the current fiscal year (ending December 2021) deemed as the reference accounting 
period*.  
*This does not guarantee an approval for the company’s listing at any point in the future. In addition, please note that the 
Company may withdraw the application for listing depending on stock market conditions, changes in the business 
environment, or for any other reasons, even if we gain approval for listing. 
2. Change of the English abbreviation of the company 
(1) Details of the change 
Before the change After the change 
FTHW CCMC* 
*The abbreviated name is derived from the initial letters of China Chip Material Corporation. 
(2) Reason for the change   
The change is intended to use the same name for the company globally inside and outside of it. 
3. Overview of the equity-method affiliate as of December 31, 2020 
(1) Name Hangzhou Semiconductor Wafer Co., Ltd. 
(2) Address 888 Dongken Road, Qiantang New District, Hangzhou, Zhejiang, China 
(3) Title and name of 
representative 
He Xian Han, Representative Director 
(4) Contents of business Manufacture and sale of semiconductor wafers 
(5) Capital 3.93 billion yuan (approx. 67.2 billion yen) 
*1 Chinese yuan = 17.1 yen 
(6) Date of establishment September 28, 2017 
(7) Major shareholders and 
shareholding ratio 
Shareholder Shareholding 
ratio (%) 
Hangzhou Dahe Thermo-Magnetics Co., Ltd. (consolidated 
subsidiary) 
18.4% 
Shanghai Shenhe Thermo-Magnetics Electronics Co., Ltd. 
(consolidated subsidiary) 
11.1% 
Jiashan Jiahe Equity Investment Partnership (Limited 
Partnership) 
12.1% 
(8) Relationship between 
CCMC and the 
companies 
Capital relationship CCMC is an equity-method affiliate of the Company. 
Personnel relationship A director of the Company concurrently serves as the 
director of CCMC. 
Business relationship None applicable 
4. Future outlook 
The impact on the consolidated business performance of the Company for the fiscal year ending March 2022 is 
expected to be minor. However, we will promptly disclose relevant items as soon as they are confirmed. 
This document is a press release aimed solely at providing the general public with information on our preparations for 
listing of our equity-method affiliate, Hangzhou Semiconductor Wafer Co., Ltd., on the STAR Market of the Shanghai 
Stock Exchange and is not prepared for such purposes as to encourage investment either in Japan or overseas. 