text:
2012-09-19 Assigned to IDEX ASA reassignment IDEX ASA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BREDHOLT, GEIR IVAR, CHRISTIE, NICOLAI W., NATAS, ANDERS, SLOGEDAL, Oyvind, BERNSTEIN, RALPH W.
The invention relates to a sensor for detection of properties and structures of an organic tissue and its surface, e.g. a fingerprint sensor comprising a chosen number of sensor electrodes at chosen positions for coupling to a finger tissue and its surface having a size less or comparable to the size of the structures, characteristics or properties of the finger tissue or surface, and a processing unit including electronic circuitry connected to said electrodes for detection of the voltage at, or the current flow in the electrodes, thereby providing for detection and collection of information of related capacitance, impedance, electromagnetic field, fingerprint, tissue aliveness or other biometric, physical, physiological, thermal or optical or characteristics or properties of the tissue or its surface positioned over the electrodes, the processing unit being mounted on one side of a substrate and the electrodes being embedded in said substrate, the substrate including through going first, second and third conductive paths between said sensor electrodes and said measurement circuitry. The substrate is made from a polymer material such as Polyimide, implemented as a rigid or a flexible multi layer build-up substrate, said first, second, and third conductive paths are constituted by through going substrate sections of a chosen size and material.
This patent application claims priority from and incorporates by reference the entire disclosure of U.S. Provisional Patent Application No. 61/290,630, filed on Dec. 29, 2009.
The present invention relates to a sensor for detection of structures and properties of organic tissue or its surface, especially a fingerprint sensor, comprising a chosen number of sensor electrodes at chosen positions for electrical and mechanical coupling to a finger surface and its tissue, having a size comparable to the size of the structures, characteristics, or properties of the finger tissue or surface.
In the recent years, biometrics, and especially fingerprint sensors, have become common for the purpose of verifying the identity of a person, e.g. at immigration control, at airports as well as with personal devices such as laptops etc. The present solutions still have a number of disadvantages. Fingerprint sensors used in airports and immigration control are large and too expensive for many applications, smaller sensors seen in portable devices are often silicon based solutions with limited robustness and challenging electronic interconnections. Traditional silicon production techniques for such sensors often result in solutions for electrical interconnection features interfering with the physical finger interface of the device. Recessed mounting of the sensor in a consumer application is often implemented to improve these shortcomings, but may not be the optimal solution both with respect to esthetical design and protection from dirt and moisture. Sensor size, both volume and area, along with the rigid properties of silicon, significantly limits the feasibility of integrating fingerprint devices in thin and flexible applications such as smartcards.
A fingerprint sensor which may be flush mounted in the same plane as the surface of the product it is mounted into is described in U.S. Pat. No. 7,251,351, in which a set of first electrodes/sensor elements are positioned on one side of an insulating substrate provided with through-substrate-via conductors. The substrate may be made from glass, ceramics or other insulating materials. In WO 03/049012 a substrate made from a multilayered or laminate PCB process is described being based on a subtractive PCB process in which, as with the abovementioned US patent, is based on the removal of materials, e.g. by etching, which has relatively low resolution and thus not sufficiently good for the small dimensions and tolerances of fingerprint sensors. If the dimensions such as the layer thickness are not sufficiently accurate they may affect the measurements and reduce the accuracy of the sensor unit.
Thus it is an object of the present invention to offer a thin, flexible fingerprint sensor realized by well established, high volume, low cost manufacturing processes, while also allowing the sensor surface to be positioned flush with the surface of the device in which it is mounted. This is accomplished with a fingerprint sensor as stated above being characterized as described in the independent claims.
The fingerprint sensor is thus manufactured using additive or semi-additive build-up processes to deposit dielectrics and conductors in layers to form a substrate with through going conductive paths, having embedded sensor electrodes for coupling to the finger surface on one side and with the processing unit well protected on the opposite side. The substrate may be manufactured using liquid or dry film dielectrics alternated with layers of conductive materials deposited through sputter, spray or other plating technology. Starting with a dielectric layer deposited on a mandrel, for instance glass, the first dielectric layer is ensured a high degree of flatness. Subsequent layers of conductive material and dielectrics are added using photo lithography and corresponding mask sets to define required section features. Building the layers from the finger interface side of the sensor to the rear processing unit interface side while still attached to the mandrel ensures dimensional stability of the substrate will minimizing feature and alignment tolerances. The finished substrate may be post-processed while still attached to the mandrel, or peeled off to reveal the first deposited layer. In the preferred embodiment of the invention a liquid polymer such as polyimide is used on a flat glass surface thus obtaining an improved accuracy in the dimensions of the sensor unit, especially the thickness and thus the contribution of the substrate structure on the provided measurements.
An alternative to the above mentioned process is to reverse the layer processing sequence. Instead of first depositing the top finger interface layer onto a glass plate, one or multiple layers are deposited onto a PCB type core. The core may be pre fabricated with a rear side processing unit interface and internal layers for signal redistribution and shielding. The front side of the PCB type core may then be post processed using the build-up processes described above to produce the small, high tolerance, features required for the fingerprint sensor design. The last layer to be deposited will in this process constitute the finger interface. This processing alternative is often utilized to manufacture IC substrates or Flip Chip substrates, and is often referred to as Micro PCB. An alternative process is where a dry film replaces the liquid polyimide material with metal covered films such as Kapton® where the conductive sections are processed using lithography and various etching, laser, and via filling techniques thus providing the conductor leads or paths as discussed in the abovementioned publications. Multiple layers are achieved by laminating such individual sheets together. A combination of dry and wet processes, with or without a core is also possible.
In the following descriptions, the term “detection of voltage or current” will be understood by a person skilled in the art as a method for detection and collection of information about the related capacitance, impedance, electromagnetic field, fingerprint or other biometric, physical, physiological, thermal or optical or characteristics or properties of the tissue or its surface positioned over the electrodes of the sensor. Also, the term coupling is understood as including both direct electrical contact between two parts as well as capacitive or inductive coupling of two parts separated physically by a dielectric material.
The invention will be discussed more in detail below with reference to the accompanying drawings, illustrating the invention by way of examples.
FIG. 1 illustrates the cross section of a preferred embodiment of the invention.
FIG. 2 illustrates a linear fingerprint sensor layout as seen from above.
FIG. 3 illustrates the cross section of a second embodiment of the invention.
FIG. 4 illustrates the cross section of a third embodiment of the invention.
FIG. 5 illustrates the cross section of a forth embodiment of the invention.
FIG. 6 illustrates the cross section of a fifth embodiment of the invention.
FIG. 7 illustrates the cross section of a sixth embodiment of the invention.
FIG. 8 illustrates the cross section and layout of a seventh embodiment of the invention.
FIG. 9 illustrates the cross section and layout of an eighth embodiment of the invention.
FIG. 10 illustrates the cross section and layout of a ninth embodiment of the invention.
FIG. 11 illustrates the cross section and layout of a tenth embodiment of the invention.
FIG. 12 illustrates the cross section and layout of an eleventh embodiment of the invention.
FIG. 13 a,b illustrates a fingerprint sensor according to the invention positioned on an additional substrate for mounting in a credit card.
FIG. 14 illustrates a fingerprint sensor mounted in a smart card.
FIG. 1 illustrates the cross section of the preferred embodiment of the fingerprint sensor 21 according to the invention. Primarily the sensor unit is constituted by a flexible unit 40 including a dielectric, possibly organic, substrate 8 with embedded conductive sections 1,2,3,4. First electrodes 1 are connected to first conductive paths 4, created by sequentially depositing layers of conductive and dielectric materials forming unbroken conductive paths of conductive sections from the first electrodes, through the substrate 8 and redistributed to coupling points 31 for connecting to the processing unit interfaces 7 on the reverse side. This is provided in a layered structure from the contact surface 9 being touched by the finger 10, the layered structure being constituted by a first dielectric layer 39 covering the first electrodes 1 (also called sensor elements in the mentioned patent publications) and other (second and third) electrodes 2,3 in a second layer being separated by a dielectric material 8, and a third layer comprising the conductor leads 4,5,6 to the coupling points 31. This structure is preferably built in a build-up process as mentioned above and may include several additional steps for introducing additional layers, e.g. if the required positions of the coupling points to the processing unit is different from the positions of the electrodes.
The preferred embodiment of the invention involves galvanic isolation between the finger surface and the sensor electrodes and thus the sensor electrodes are embedded in the substrate below the finger interface surface, the substrate dielectric 8 providing the required dielectric medium between the finger surface and first electrodes. Preferably a surface coating layer 9 is added for improved mechanical and chemical protection, controlled friction, improved image quality, enhanced cosmetics or other purposes. The performance coating may be made from a carbon based materials such as Diamond Like carbon (DLC) or amorphous diamond, as described in EP0779497 and U.S. Pat. No. 5,963,679. The thickness of the substrate dielectric and performance coating layers may be chosen to provide suitable detection conditions, for example in the range of 500 nm or more. Exposed electrodes without dielectrics providing direct electrical contact with the finger may be implemented for improved detection conditions, like increased signal levels.
On the opposite side of the finger interface surface, the fingerprint sensor substrate is in a per se known way provided with electrical signal interfaces 7 for connecting the signal processing unit 13 to the conductive paths. These interfaces may be manufactured using well known technology for under-bump metallization (UBM) and provide a base for solder or glue based interconnection solutions to the processing unit. Similarly external IO connections 15 are provided.
According to the preferred embodiment the substrate is also provided with a second electrode 2 connected to a second conductive path 5 implemented in a similar manner as the first electrode and first conductive path but having larger electrode dimensions so as to be significantly larger than the features in the finger surface. Thus the coupling between the second electrode and the finger is not significantly affected by the structures in the surface of the finger. In this case the processing unit is adapted to detect the voltage at or the current flow in each of a multitude of first electrodes 1 provided by the first and second electrodes as the processing unit also applies a static or varying voltage between the first and second electrodes and detects the voltage and current in a per se known way, e.g. by applying a voltage between the second electrode and ground and by detecting the current flow from the finger into the first electrode, or voltage relative to ground at the first electrode. Due to the differences in size only the structures of the finger close to the first electrodes will affect the voltage or current sensed or detected by the sensor. In this embodiment of the invention it is also possible to vary the embedded depth of the electrodes, hence changing the dielectric thickness and coupling characteristics in order to optimize the detection conditions, like sensitivity, contrast, dynamic signal range or other parameters for the sensor electrodes 1, 2 and 3 and/or the remainder of the substrate 8.
According to the preferred embodiment the substrate is also provided with a third electrode 3 connected to a third conductive path 6 implemented in a similar manner as the first electrode and first conductive path. The third electrode may vary in size from smaller than, to significantly larger than the surface feature size of the finger. The third electrode may replicate the functionality of the first or second electrodes or be independently electrically exited, modulated, electrically left floating, or connected to ground as discussed in U.S. Pat. No. 7,606,398. The third electrode may also be implemented in such a way that a capacitive coupling to individual 1st electrodes may be utilized in a calibration or circuit test routine as described in U.S. Pat. No. 7,251,351B2. Other alternatives may also be contemplated, e.g. with a third conductor (not shown) close to the first conductor leads/conductive sections and with a comparable size such as the solution described in U.S. Pat. No. 6,512,381. The fingerprint sensor is designed as a swipe sensor where the surface to be measured is expected to traverse the electrodes in the swipe direction 11.
FIG. 2 illustrates the layout of a stripe shaped fingerprint sensor 21 constituted by an essentially linear array of sensor electrodes 12 wherein each first electrode 1 is related to one first conductive path 4. Spanning the sensor array 12 are two stimulation or drive electrodes 2, related to before mentioned second conductive paths, thus ensuring a uniform voltage distribution across the finger, and the variation in the detected signal from the sensor array being mainly caused by variations in the structure of the finger in close vicinity to the array.
In the preferred embodiment of FIG. 2 the layout also includes two third electrodes 3, in this instance used for a (digital and analog) ground connection, thus also providing ESD protection. These electrodes may also be related to before mentioned third conductive paths through the substrate. The embedded depth of these electrodes may be varied similarly to the first and second electrodes to increase the probability of ESD events to discharge to ground. Other solutions for providing ESD protection may be realized by implementation of diode structures connected to the conductive paths of the substrate. Alternatively a discrete component such as an ESD protection diode may be connected between the drive electrode and ground, internally embedded in the substrate or externally connected for instance by flip-chip assembly.
According to an alternative embodiment of the sensor layout illustrated in FIG. 2 the sensor array may be constituted by one or multiple linear arrays of electrodes, possibly shifted across the swipe direction providing a staggered structure and improving the resolution in the measurements. Multiple sensor arrays may also allow for reconstructing a fingerprint image by stitching as described in U.S. Pat. No. 6,289,114 or for measuring the movement of the finger over the sensor as described in U.S. Pat. No. 7,054,471.
According to an alternative embodiment the second, third, or both electrodes may be provided with interfaces to external IO connections 15 shown in FIG. 1 for implementation outside the substrate, with the advantage of reducing the substrate material area as discussed in U.S. Pat. No. 6,628,812 and U.S. Pat. No. 6,683,971.
Additional electrodes and circuitry may be embedded in the sensor 21, for example for measuring the relative movement of the finger across the surface, as described in U.S. Pat. No. 7,251,351 and U.S. Pat. No. 7,110,577, or for navigation or driving a pointer on a screen, as described in U.S. Pat. No. 7,129,926 and U.S. Pat. No. 7,308,121 or for measuring other biometric properties of the finger, like aliveness detection.
According to an alternative embodiment in FIG. 3 an additional internal layer of conductive sections 14 is included for shielding purposes. The shield layer is positioned between the electrodes and any conductive sections used for lateral signal redistribution to the processing unit interfaces. Connecting all or sections of this shield layer to ground will protect the processing unit interfaces and signal redistribution sections from electromagnetic interference or inductive or capacitive electrical coupling from the electrodes and finger surface, and vice versa.
According to an alternative embodiment in FIG. 4, one or more additional internal layers 16 of conductive sections may be included to facilitate various embedded features.
An additional layer may be included to facilitate improved signal redistribution with additional degrees of freedom to route conductive paths 17.
One or more additional internal layers of conductive sections may be included to facilitate various embedded components 18. A discrete component may be placed on the last deposited layer, connection terminal(s) up, fixed with glue or by other means before the next dielectric layer is deposited. The subsequent conductive section layer deposition is prepared with a mask including openings at the required connection positions of the discrete component. The conductive material deposition process will fuse to the appropriate discrete component terminals and connect to the appropriate conductive paths.
The alternative embodiment in FIG. 4 also illustrates how organic or printable electronic circuits 19 may be implemented. The patternable dielectric layer 16 may be used as a base medium for such a deposition process. These special circuits are connected to underlying conductive sections directly through their deposition processes, or by fusing to the subsequent conductive layers by its deposition processes.
Utilizing the patternable dielectric to create an intentional void, a gas filled volume between two conductive sections, may be used as a spark gap 20 to provide a high voltage discharge path, and to dissipate electrical charge to ground. ESD protection may hence be improved when incorporated into the conductive paths between electrodes and the processing unit.
The alternative embodiment in FIG. 5 is a special case of previously described embedded discrete components 18 of FIG. 4. In this embodiment the whole processing unit 13 is embedded in the dielectric, as opposed to flip chip mounted as depicted in FIG. 1.
In the alternative embodiment in FIG. 6, a curable polymer resin 22, for example epoxy, is used to improve mechanical robustness of the sensor. The underfill resin is used to encapsulate electrical interfaces and the processing unit, hence protecting them from the elements such as moisture and dirt, while also adding stiffness to the sensor. A sheet with multiple sensors can be underfilled and coated before cutting into individual sensors. The finished product is a fingerprint device, encapsulated and packaged with a BGA type ball interface 15. A similar result may be achieved using plastic molding processes as opposed to curable resins.
In the alternative embodiment in FIG. 7, an additional second dielectric material 23 is laminated onto the build-up substrate to improve stiffness and mechanical robustness of the sensor. This material may be a layer of liquid or dry film soldermask where the conductive sections are formed with the same process used to form the conductive sections of the build-up substrate. Alternatively the stiffening layer may be of a printed circuit board type material with preformed via's, interfaced and electrically connected to the build-up substrate conductive sections.
In the alternative embodiment in FIG. 8, a flexible ribbon cable 24 is integrated in the build-up substrate for external IO connections. This may simplify integration into various applications with the option to increase the distance between the finger interface and host system electronics. The ribbon cable may for instance be threaded through a slot in the application enclosure.
In the alternative embodiment in FIG. 9, a separate flexible ribbon cable 25 is connected to the external IO connection interface of the build-up substrate yielding advantages similar to what is described for the embodiment in FIG. 8.
In the alternative embodiment in FIG. 10 the high resolution build-up substrate 8 is laminated or otherwise fixed with electrical connections to a standard PCB or flexible printed circuit 26 constituting an interposer between the build-up sensor substrate and the signal processing unit 13. This may provide advantages in fixturing, interconnecting, and assembling while utilizing a lower cost material for circuitry requiring a larger area. The signal processing unit and external IO connections 27 may be located on either side of the interposer.
In the alternative embodiment in FIG. 11 the high resolution build-up substrate 8 is laminated or otherwise fixed with electrical connections to a standard PCB or flexible printed circuit 28 constituting a motherboard for an embedded fingerprint module. Combining the high resolution build-up substrate with low cost standard circuit board technology additional electronic circuitry such as integrated circuits, displays, LED's, buttons 29, and external electrical interfaces 30 can be integrated into the fingerprint module. The additional electronic circuitry may be located on either side of the motherboard.
In the alternative embodiment in FIG. 12 the high resolution build-up substrate 8 is utilized not only as a sensor substrate, but is also implemented as a carrier and interconnect device for a full biometric system. 1st, 2nd and 3rd electrode signals are redistributed (not shown) to the signal processing unit 13 located either directly below the finger interface or shifted in any lateral direction. Additional integrated circuits such as micro controllers 32 and other electrical components 33 such as capacitors, resistors, buttons, displays and antennas may be integrated either by Flip Chip, wire bonding, conductive glue or other. External IO connections 15 may be integrated as exposed conductive pads, headers, and connectors or other. The finger interface section may be supported mechanically by a laminated stiffener plate 34 of suitable thickness and material. The complete biometric assembly may be mounted inside a suitable enclosure, or molded, alternatively laminated, inside for example an id or financial transaction card.
In FIGS. 13 a and 13 b the flexible unit 40 with the fingerprint sensor 21 is mounted on a second dielectric material 23 as in FIG. 7. This second dielectric unit 23 constitutes a circuit board including a bonding interface 41 to connect with the coupling points 31 on the back side of the fingerprint sensor 21 as well as conductor leads through the second dielectric unit to a solder surface 42 on the opposite side on which processors 13 may be placed, thus being connected to the fingerprint sensor 21. This solution is especially suitable for mounting in smart cards having an opening or recess adapted to receive the fingerprint sensor unit. The sensor unit may then be fastened in the recess or hole using lamination processes or adhesives and sealed to constitute an integral part of the smart card.
Smart cards are often made in a layered structure having at least three layers where the a middle layer includes conductor leads making it possible to connect to other circuitry in the card. An example showing this type of connection is shown in U.S. Pat. No. 6,881,605. As the fingerprint sensor is to be positioned in a recess or hole in the card contact points 43 in a position suitable for connecting to the conductive card layer are provided at a suitable position matching the thickness of the outer layers covering the electrical conductors in the card.
FIG. 14 illustrates the fingerprint sensor 21 positioned in a smart card 47 also comprising electrical conductors 44 as well as a microchip 45 and an antenna 46, e.g. for RFID or near field communication. As mentioned above these conductors 44 are embedded in an intermediate layer inside the smart card while the connector interface of the microchip 45 and fingerprint sensor 21 extend to the card surface.
Thus the invention refers especially to the realization of fingerprint sensors with sensor electrodes and associated conductive paths embedded in a dielectric substrate.
and electrically conductive connecting means at said predetermined positions of said second ends of the conductive sections for galvanic connection to a signal processing unit.
This way a substrate is provided for mounting of the processor unit where the substrate contains both the first electrodes in the predetermined pattern, and possibly additional electrodes, in a polymer material. The dielectric material preferably being polyimide and the sensor being built using a build-up process where the first layer is deposited as a liquid on a plane glass surface.
Thus the invention primarily relates to a sensor for detection of properties and structures of an organic tissue and its surface, especially a fingerprint sensor, the sensor surface being part of a flexible unit suitable to be included in credit card etc. The flexibility may thus preferably be according to the ISO standard for credit cards ISO-IEC 7810. The physical characteristics being tested with test procedures from ISO-IEC 10373-1 identification cards—Test methods. For other purposes the flexibility of the substrate layers without processors and other components may be larger, e.g. with a bend radius down to 1 mm. It comprises a chosen number of first electrodes or sensor elements at chosen positions for coupling to a surface to be measured. The size of the first electrodes and preferably the distances between them should be less or comparable to the size of the properties or structures in the tissue or its surface so as to be able to distinguish between different types of features such as ridges and valleys in a fingerprint. A processing unit may be included having electronic circuitry for detection of voltage at or the current flow in the electrodes, thereby providing for detection and collection of information of related capacitance, impedance, electromagnetic field, fingerprint, structure, tissue aliveness or other biometric, physical, physiological, thermal or optical characteristics or properties of the tissue or its surface. This circuitry is connected to said first electrodes for providing detection of said characteristics, properties or structures, the processing unit being mounted on one side of a substrate, and the first electrodes being positioned on internally embedded layers of said substrate. The substrate thus includes through going first conductive paths between said sensor electrode and said measurement circuitry, wherein the substrate is made from a flexible single or multi layer dielectric polymer material such as polyimide and said first conductive paths are constituted by through going substrate sections of a chosen size and material.
The substrate preferably is made from flexible materials and also includes at least one second electrode with a size substantially larger than the structures of the surface to be measured. The second electrode may be grounded or connected to said processing unit, with a second conductive path also being constituted by thru going conductive sections of the substrate, and the processing unit is adapted to detect the voltage or current at the first and second electrodes. In the preferred embodiment of the invention a varying voltage may be applied by the processing unit or an external oscillator between the second electrode and the first electrodes, the processing unit measuring or calculating the impedance between the first electrodes and the second electrode.
The substrate may also includes at least one third electrode, providing an electrode being coupled to said surface and connected to said processing unit, with a third conductive path also being constituted by thru going conductive leads of the substrate. The third electrode may be grounded or the processing unit may be adapted to detect the voltage or current at the third electrode.
The first, second and third electrodes may be embedded in the same plane or at varying depth, relative to the surface to be measured or completely exposed to the said surface, yielding individual dielectric coupling characteristics for said surface structure measurements. Thus the first layer may include areas with reduced thickness or openings over at least some of the electrodes thus also providing means for adjusting the capacitance between the finger and electrode or providing galvanic contact between the electrodes and the finger/object to be measured.
For protecting the sensor unit surface an outer protective layer made from a carbon based material, e.g. amorphous diamond, covering the measurement surface interface of the surface sensor.
The substrate may also include at least one external interface to an external electrode outside the substrate being substantially larger than the structures of the surface, providing an external electrode being coupled to said surface to be measured, and connected to said processing unit.
The third layer of the sensor unit may also include at least one embedded patternable sub-layer for signal redistribution purposes of said first, second or third conductive paths at predetermined positions of connection point for coupling to the processing unit. The sub-layer may also include embedded active and passive electronic devices, where at least one electronic devise is implemented between at least two conductive sections of said first, second or third conductive paths.
The processing unit with measurement circuitry connected to at least two conductive sections of said first, second or third conductive paths, may also be embedded into the substrate structure.
The substrate may also include at least one embedded organic electronics layer where at least one electronic device is implemented between at least two conductive sections of said first, second or third conductive paths, and or at least one embedded patternable dielectric layer where at lease one void is created to form a spark gap between at least two conductive sections of said first, second or third conductive paths.
As mentioned above referring to FIGS. 10-12 the coupling means provided for coupling to a signal processing unit may be connected to conductors on a flexible foil, PCB or printed circuit, where the conductors provide a connection between the coupling means and a corresponding interface on a signal processing unit positioned in a position laterally separated from the coupling means. This way the processing unit may be positioned in a different position than the sensor surface, either on the same side of the foil, PCB or printed circuit or on the opposite side. The printed circuit or PCB may also comprise other circuitry or interfaces to external equipment.
depositing the third layer by applying a pattern of electrically conductive material and depositing a liquid polyimide layer thus providing an insulation between the first electrodes and hardening the polyimide material, and after curing the unit removing it from the glass plate thus producing a layered flexible film or foil.
This sequence may be performed in the opposite order thus leaving the glass plate on the opposite side of the foil, depending on the required accuracy of the process and positioning of the sensor electrodes.
The method may also include a step of applying an electrically conductive material on the second ends of the conductive sections for providing connecting means.
The surface of the sensor may be treated in several ways depending on the use and operating conditions. For example the substrate may be altered for optical properties by patterning and imaging polyimide structure for appearance, reflection etc, or for obtaining surface characteristics such as hydrophobicity, friction, resistance to wear etc.
The substrate may also be altered to accommodate an embedded processing unit, or coated with a hardened curing resin on the processing unit side to form an encapsulated device with a ball grid array type external IO interface. In order to make it more durable it may also be laminated onto another surface for added rigidity and interconnection purposes such as a printed circuit board.
For improving the coupling characteristics or, in case the surface to be measured is curved, the substrate may be lamination onto a curved surface, e.g. so as to obtain a solution similar to the swipe sensor described in U.S. Pat. No. 6,785,407.
An advantage with the present invention is that a flexible substrate may be obtained which may function as a part of a flexible ribbon cable for interconnection purposes, or be laminated onto a flexible flat cable for interconnection purposes. It may also laminated or otherwise electrically connected to a PCB or flexible circuit, constituting an interposer between said substrate and said processing unit for additional degrees of freedom in layout of assembly and interconnections or a motherboard for an embedded fingerprint module, providing an interface between said sensor substrate and processing unit, while allowing for additional electronic circuitry and components to be integrated.
wherein said signal processing unit is adapted to detect a voltage or current at said first electrodes and second electrodes.
2. The sensor unit according to claim 1, wherein the dielectric material is polyimide.
3. The sensor unit according to claim 1, further comprising an additional layer comprising at least two sub-layers, wherein at least one of the two sub-layers comprises a pattern of additional conductive sections adapting the positions of the second ends of the plurality of conductive sections to positions of connection points of the signal processing unit.
4. The sensor unit according to claim 1, wherein at least one of said second electrodes has dimensions that are larger than dimensions of at least one of the first electrodes.
5. The sensor unit according to claim 4, wherein each of the second electrodes is provided with a connection point at the second side of the second dielectric layer for coupling to the processing unit.
6. The sensor unit according to claim 4, wherein the thickness of the first layer over at least one second electrode is reduced.
7. The sensor unit according to claim 1, wherein the first dielectric layer comprises openings over at least one of said electrodes providing galvanic contact between the electrode and the object.
8. The sensor unit according to claim 1, wherein said electrically conductive components are connected to conductors on a flexible printed circuit board (PCB) or printed circuit, the conductors providing a connection between the electrically conductive components and a corresponding interface on the signal processing unit, wherein the corresponding interface on the signal processing unit is offset from the electrically conductive components.
9. The sensor unit according to claim 8, wherein the signal processing unit is positioned on the same side of the flexible PCB or printed circuit relative to the electrically conductive components.
10. The sensor unit according to claim 8, wherein the signal processing unit is positioned on the opposite side of the flexible PCB or printed circuit relative to the electrically conductive components.
11. The sensor unit according to claim 8, wherein the flexible PCB or printed circuit comprises a number of components and a coupling interface to external equipment.
12. The sensor unit according to claim 1, wherein at least one of the first dielectric layer and the second dielectric layer is flexible.
removing the first layer, second layer, and third layer from said glass surface, so as to provide a contact surface at a surface of said first layer.
14. The method according to claim 13, including a step of applying an electrically conductive material to opposite ends of the number of conductors to form electrically conductive components for interfacing with a signal processing unit.
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Application No. 2014112601288820
Application No. 2014112801136520
Application No. 2012
Application No. 2012
Application No. 099146099


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LA Rev Stat § 14:63.3 What's This?
A. No person shall without authority go into or upon or remain in or upon or attempt to go into or upon or remain in or upon any structure, watercraft, or any other movable, or immovable property, which belongs to another, including public buildings and structures, ferries, and bridges, or any part, portion, or area thereof, after having been forbidden to do so, either orally or in writing, including by means of any sign hereinafter described, by any owner, lessee, or custodian of the property or by any other authorized person. For the purposes of this Section, the above mentioned sign means a sign or signs posted on or in the structure, watercraft, or any other movable, or immovable property, including public buildings and structures, ferries and bridges, or part, portion or area thereof, at a place or places where such sign or signs may be reasonably expected to be seen.
B. Whoever violates the provisions of this Section shall be guilty of a misdemeanor and upon conviction thereof shall be fined not more than five hundred dollars or imprisoned in the parish jail for not more than six months, or both.
Added by Acts 1960, No. 78, §1. Amended by Acts 1963, No. 91, §1; Acts 1968, No. 647, §1; Acts 1977, No. 445, §1; Acts 1978, No. 694, §1.


From Villani, Giovanni, Selfe, Rose E., translator. Villani’s Chronicle being selections from the First Nine Books of the Croniche Fiorentine of Giovanni Villani. London: Archibald Constable & Co. LTD, 1906; pp. 127-146.
1220 A. D. and the great things which came to pass.
In the year of Christ 1220, on the day of St.
115-117. reason of the rulers of Holy Church who could not or would not deal with him, nor be content that he should have the Imperial rights, wherefore he subdued and smote Holy Church; or because that God permitted it as a Divine judgment, because the rulers of the Church had been the means through whom he became the child of the holy nun, Constance, they not remembering the persecutions which Henry, his father, and Frederick, his grandfather, had caused Holy Church to endure. This Frederick did many noteworthy things in his time, and raised in all the chief cities of Sicily and of Apulia, strong and rich fortresses which are still standing, and built the fortress of Capovana, in Naples, and the towers and gate upon the bridge over the river Volturno at Capua, the which are very marvellous; and he made the park for sport on the marsh of Foggia in Apulia, and made the hunting park near Gravina and Amalfi in the mountains. In winter he abode at Foggia, and in 129summer in the mountains, for the delights of the chase. And many other noteworthy things he caused to be made, as the castle of Prato, and the fortress of Samminiato, and many other things, as we shall make mention hereafter. And he had two sons by his first wife, Henry and Conrad, whom he caused each one during his lifetime to be elected king of the Romans; and by the daughter of King John of Jerusalem he had King Giordano, and by others he had King Frederick (from who are descended the lineage of those who are called of Antioch), King Enzo and King Manfred, who were great enemies to Holy Church; and during his life he and his sons lived and ruled with much earthly splendour; but in the end he and his sons because of their sins came to an ill end, and their line was extinguished, as we shall make mention hereafter.
1222 A. D. routed by the Florentines at Casteldelbosco. § 4. — How the Florentines marched against Fegghine, and built l’Ancisa.
§ 5. — How the Florentines led an army against Pistoia, and laid waste the country round about.
xxv. 1-3. high, and thereupon two arms in marble, whereof the hands were ‘making the figs’ at Florence; wherefore the artificers of Florence, to express contempt for money or ought else offered to them, were wont to say: “I can’t see it, for the fortress of Carmignano is in the way.” And the Pistoians hereupon agreed to whatever terms the Florentines might devise, and caused the said fortress of Carmignano to be destroyed.
1235 A. D.gration in Florence. § 10. — Yet again of the war with Siena. § 11. — The same. § 12. — Of the conflagration in Florence. § 13. — How peace was made between the Florentines and the Sienese.
§ 14. — How the Emperor Frederick came to enmity with the Church.
1230 A. D. Christ 1230.
1240 A. D. the Emperor Frederick besieged and took the city of Faenza.
§ 22. — How the Emperor laid hold of King Henry, his son.
31-108. about through envy of his great estate. And thereon the said M. Piero soon suffered himself to die of grief in prison, and there were who said that he himself took away his own life.
§ 23. — How the war began between Innocent IV. and the Emperor Frederick.
1241 A. D. straightway caused them to come to Rome, and thereupon embarked with all his cardinals and will all his court, and immediately caused himself to be conveyed to his city of Genoa without any opposition; and having tarried some time in Genoa, he came to Lyons on the Rhone, by the way of Provence; and this was the year of Christ 1241.
1245 A. D.§ 24. — Of the sentence which Pope Innocent pronounced at the council of Lyons-on-Rhone, upon the Emperor Frederick.
1245 A. D. give back; and by force he had kept vacant eleven archbishoprics, with many bishoprics and abbeys in the Empire and in the Kingdom, not suffering those who were duly elected by the Pope to held or to till them; doing violence and extortions on sacred persons, constraining them to appear and plead before his bailiffs and secular lords. The third cause was the sacrilege he had done, when by the galleys of Pisa, and by his son King Enzo, he had taken the cardinals and many prelates at sea, as we afore told, and caused some to be drowned in the sea, and kept some dying in cruel and harsh prisons. The fourth cause was, because he was found and convicted in many articles of heresy in the faith; and certainly he was no Christian Catholic, living always more after his delight and pleasure than according to reason or just law; and in fellowship with the Saracens. Likewise he used the Church and her officers but little or not at all, and did no alms; so that not without great and evident causes he was deposed and condemned; and albeit he did much injury and persecution to Holy Church after that he was condemned, yet in a short time every honour and power and greatness God took from him, and showed him His wrath as we shall make mention hereafter. And because many have made question, who was to blame in the quarrel, whether the Church or the Emperor, hearing his excuses in his letters, therefore to this I make answer and say, that manifestly not by one divine miracle but by many was it shown that the Emperor was to blame, as God showed by open and visible judgments in his wrath upon Frederick and his seed.
The said Frederick being deposed and condemned as has been afore said, the Pope sent word to the electors of Germany who elect the king of the Romans, that they should without delay make a new choice for the Empire; and this was done, for they elected William, count of Holland and landgrave, a valiant lord, to whom the Church gave her support, causing a great part of Germany to rebel, and gave indulgence and pardon as if they were going over seas, to whoever should be against the said Frederick; whence in Germany there was great war between the said elected King William of Holland and King Conrad, son of the said Frederick; but the war endured but a short time, for the said King William died, the year of Christ . . . . and the said Conrad reigned in Germany, whom his father Frederick the Emperor had caused to be elected king, as we shall make mention. From this sentence Frederick appealed to the successor of Pope Innocent, and sent his letters and messengers throughout all Christendom, complaining of the said sentence, and setting forth how iniquitous it was, as appears by his epistle written by the said Messer Piero dalle Vigne, which begins, after the salutation: “Although we believe, that words of the already current tidings, etc.” But considering the real facts as to the process, and as to the deeds of Frederick against the Church, and as to his dissolute and uncatholic life, he was guilty and deserving of the deposition, for the reasons set forth in the said process; and afterwards for the deeds done by the said Frederick after his deposition; for if before he was and had been cruel and persecuting to Holy Church and to the believers in Tuscany 140 and in Lombardy, afterwards he was much more so, as long as he lived, as hereafter we shall make mention. We will now leave for a time the story of the doings of Frederick, and turn back to where we left off telling of the doings of Florence and of the other noteworthy events which came to pass in those days throughout the whole world; returning afterwards to the doings and to the end of the said Frederick and of his sons.
§ 26. — We will tell an incident in the affairs of Florence.
xii. 102. bridge was named Rubaconte. And during his government all the roads in Florence were paved; for before there was but little paving, save in certain particular places, master streets being paved with bricks; and through this convenience and work the city of Florence became more clean, and more beautiful, and more healthy.
1248 A. D. miracle that took place in Spain. § 31. — How the town of Sanginiegio was rebuilt and then destroyed. § 32. — How the Tartars routed the Turks.
1248 A. D. fortress of Gangareta in the market place of the said Montevarchi, and there was a fierce battle of but few people, as far as the Arno, between the Guelf refugees from Florence, and the Germans. In the end the Germans were discomfited, and a great part thereof slain and taken prisoners, and this was in the year of Christ 1248.


Rosabelle is now in her second trimester of her pregnancy and she is also working on evolving and grafting plants in her garden to make even more simoleons. Fortuna is now a “B” student and hopefully she will gain the “A” level soon.
Fortuna wakes up having to pee so badly she is jumping up and down, although that shouldn’t be helping her. She goes to use the bathroom.
Rosabelle wakes up after Fortuna and the pregnancy is really bothering her today. She uses the bathroom and showers off.
Afterwards she joins Fortuna who is pondering chess moves and they chat before she has to go to school.
After Fortuna goes to school, Pawel gets up and grabs some breakfast and watches tv with Rosabelle.
Then they both work on their books for their daily work tasks.
The Royalty Report arrives for today and they have earned §5369, their funds are now §55,895 simoleons.
Rosabelle finishes her work task and goes to grab breakfast, she is 14 hours away from the 3rd trimester.
Pawel finishes his work task and his book. He makes a copy (§104) of it for the house, their funds are now §55,791 simoleons. He then sends it to the publisher to earn royalties.
Afterwards he tends the garden while Rosabelle practices chess for logic.
While Rosabelle is at work she gets writer’s block and she chooses to be honest about it to her boss.
And this is the outcome of her honesty, at least she didn’t loss any work performance.
Fortuna comes home from school at 3pm, she is tense from her day, but he good news is that she is now an “A” student at school! She tries to calm herself down in the mirror before doing anything else.
After she is calm she does her homework and extra credit work.
When she finishes her work she grabs some fish tacos for dinner and watches tv for fun.
Rosabelle comes home from work with §805, their funds are now §56,596 simoleons.
She is exhausted from work and being pregnant so she goes straight to bed. She is now 4 hours away from the 3rd trimester.
Pawel comes home work, he earned §480, their funds are now §57,067 simoleons. He is very tense from work and is also very low on fun.
He has this moodlet when he gets home. Maybe a vacation would do them good, but it seems like throwing money away to him.
As soon as he gets home, he eats dinner and watches tv with Fortuna. She tells hims about her day at school.
Pawel cleans the sink after he does the dishes since it has been dirty all day and he cant stand it anymore.
Afterwards Pawel joins his wife in bed.
I wonder if Pawel will be able to get rid of the tense mood just by doing some fun things around the house instead of taking vacation?


The greatest changes in cooperative and condominium law this past year did not come from the Legislature or from the courts but from the New York Attorney General’s office (NYAG). This article will review some of those changes and the most significant appellate cases affecting co-ops and condominiums.
With respect to co-op and condominium conversions, NYAG’s Real Estate Finance Bureau (REFB) has focused its mission on (1) maintaining and protecting the rent-regulated system and free market tenants in buildings converting to co-op and condominium ownership and (2) increasing and maintaining the number of low and moderate income housing units. As a result, the REFB is shifting its focus away from protecting owners suffering from buying in poorly built newly constructed buildings.
Thus, in early 2015 the REFB heavily relied on a July 9, 1986 internal memorandum setting forth its rules with regard to buyout offers. That memorandum stated that “buy-out offers cannot be accepted by the tenants until the Black Book is out. There will be no exceptions to this policy—our experience of the past nine months has persuaded us that the only fair, even-handed way of enforcing this policy is not to allow any exceptions.” (emphasis supplied). This internal memorandum was first disclosed to the public on REFB’s website almost a year ago, but it had never been published before nor had it been codified into a formal regulation.
If either the courts uphold M2015 or if the REFB re-issues its principles as a validly promulgated regulation under SAPA, the dynamic in conversions of rent-regulated units to owner-occupied units will be transformed. Under prior law, developers routinely bought out rent-regulated tenants in order to achieve the percentages of converting units necessary to declare a plan effective. Under the new policy, however, those percentages will no longer be available by these means. This new policy has therefore removed from rent-regulated tenants a right worth purchasing and long-term tenants who were counting on such buyouts to finance their move to warmer climates now can’t. This REFB policy makes it difficult for an elderly couple in a multi-bedroom apartment to sell their rights to that apartment so that they can downsize to a unit in Florida.1 The regulated tenants lose the buyout monies and the housing market loses desperately needed units to be sold during this housing shortage. And the overall housing market forces home prices to remain high and unaffordable because of the large inventory of apartments kept off the market.
Although the attorney general’s office first protested that the 1986 and then the 2015 memorandum were legal under SAPA, their violation of SAPA is clear.
Exiting the program is known as “privatization,” although, the only thing that is ever “public” about the program is the overseeing the project receives from a supervisory agency (in New York City, either the Department of Housing Preservation and Renewal or the State Division of Housing and Community Renewal) and the resultant real estate tax benefits.
In Trump, the shareholders decided to privatize, following the path of amending the corporation’s certificate of incorporation. New York City claimed that this exit from Mitchell-Lama was a “conveyance” and sought over $21 million in recording taxes, interest, and penalties. The city claimed that the privatization constituted a transfer from the old Mitchell-Lama-based corporation to a brand new generic Business Corporations Law corporation. The court ruled that the co-op was not subject to the taxes at all.
Because the apartments in such projects receive tax benefits, privatization frees the apartments from the restrictions on to whom they can be sold and for how much and generally instantly substantially enhances the sales prices of such apartments. For the shareholders, the decision whether to privatize is a decision whether to have the benefits of cheap housing or to have less cheap housing and higher profits in selling the apartment.
Thus the Trump case removed a disincentive to privatization and allowed such complexes to allow their shareholders to realize the full profitability of their investments in their apartments.
In South Tower Residential Board of Mgrs. of Time Warner Center Condominium v. The Ann Holdings,6 the First Department subtly adjusts the standard for self-interest on the board. The court wrote, “However, even if, arguendo, plaintiff engaged in some favoritism…, defendant failed to show prejudice therefrom.” This is a clear carve out from previous doctrine, but it leaves unclear whether a challenge to a board for violation of the business judgment rule requires showing for any violation that there is both a violation and resultant prejudice.
In Pomerance v. McGrath,7 the First Department ruled on challenges to the exercise of the business judgment rule and in each of them sustained the board’s authority. Thus, where a bylaw disallowed the board expending funds above $10,000 for a capital improvement without shareholder assent, the court found the business judgment rule allowed the board the discretion to do a repair regardless of price, without shareholder assent. It also found that the business judgment rule gave the board authority to sue the sponsor. A contrary finding would have been a disaster in New York where many cases attest to endemic poor construction in fresh construction condominiums, saddling the unit owners with the tab for correcting it. Boards must have the discretion to bring such suits.
In a relatively unusual application of the business judgment rule, Jacobs v. Grant,8 the Second Department found in favor of the board’s discretion in moving a shareholder’s property out of the storage bins to a storage facility after the shareholder refused. The board was moving the property for a building-wide asbestos abatement program. Unsurprisingly, the court refused to find that there was a conversion, as the shareholder had pressed. Surprisingly, the court found that the move of the personal property was within the board’s power under the business judgment rule. In other words, allowing for the possibility (sub silentio) that the conduct was actually tortious, the Appellate Division impliedly found that the business judgment rule gave the board the discretion to commit the tort.
That kind of limitation is seen in Razzano v. Woodstock Owners.9 Neither the business judgment rule nor anything else allows a co-op to craft a rule that favors some shareholders over others. In Razzano, subletting was limited to those who had purchased their shares prior to a particular date. Since the Business Corporations Law §501(c) requires that all shares in the same class be treated alike, there can be no rule in a cooperative that favors one over another. Thus, the board does not have the authority to discriminate against newcomers in favor of the old guard.
Intimately associated with the business judgment rule, is the power of a board to use its judgment to impose and assess fees, fines, and assessments. Although in real life the unit owners tend to dispute the facts of their having engaged in conduct that justifies a fee or fine and to dispute the board’s justification for imposing an assessment, in the court decisions, the matter is much more about whether the board has the legal authority for these financial matters.
One such dispute was in Cohan v. Board of Directors of 700 Shore Road Waters Edge,10 in which the bylaws would have permitted a fine for an illegal sublet, but the court did not permit the board to impose it. There was no sublet; the disputed occupancy was that of a sister, one the bylaws specifically permitted. Thus, not only did the court reverse the fine, but it also awarded the shareholder her attorney fees.
On the other hand, in Cave v. Riverbend Homeowners Association,11 the Second Department upheld a late fee, making it free from challenge under the business judgment rule.
In Baxter Street Condominium v. LPS Baxter Holding Co.,12 the court wrote, “The condominium board’s determination that the assessment was necessary for ‘repair’ work, which, pursuant to the by-laws, does not require the sponsor’s consent or the unit owners’ approval, is protected by the business judgment rule.” While the Baxter court showed the board’s justification, there need be no such showing. And even though Baxter is not explicit in this regard, it is the only proper way of understanding it. In short, the justification of the board’s actions is just a makeweight. Similarly in 40-50 Brighton Road Apartments v. Kosalapov,13 the Appellate Term, (2d, 11th, and 13th Jud. Dists.) ascertained that an assessment was made to finance certain work for the co-op and the court refused to grant any significance to the shareholders’ arguments that such funds were not actually used for such purposes, but for other corporate purposes. (Note: The authors’ firm represented the co-op board in Brighton Road, both at trial and on appeal).
Of great importance is Gabriel v. Board of Mgrs. Of the Gallery House Condominium,14 in which the court acknowledged the board’s power to impose fines, as set forth in a set of bylaws, but “the imposition of fines in the amount of $500 per day for violations of the guest policy is confiscatory in nature… The board cites no persuasive authority to support the imposition of such a hefty fine.” Boards’ counsel face this question daily. Clients routinely ask, “How severe a fine can we impose?” Their inclination is generally to make the fine so severe as to make it prevent the conduct sought to be discouraged, but if the number is too high, the court allows no fine at all. While there are cases that say when it is too much, there are none that provide any calculus for determining what is allowable. Since excessively small fines don’t accomplish anything, it is a difficult balance to strike.
This has been a very important year in the co-op and condominium world, especially for the middle class and rent-regulated tenants. The Court of Appeals has now allowed low-to-moderate income buildings to privatize and avoid a significant tax payment. At the other extreme, the Attorney General’s office has frozen rent-regulated tenants’ and sponsors’ ability to complete the buyouts of apartment leases, keeping fewer units from hitting the market and making it more difficult for New Yorkers to buy homes. At the Appellate Division, the courts have cleared up some debated issues on treating new owners differently than existing owners, while providing co-ops the power to use self help for recalcitrant owners who refuse to move storage items, and strictly construing the corporate documents when applying the law.
1. Peter D. Salins and Gerard C. S. Mildner, “Scarcity By Design” (Harvard University Press, Cambridge, Massachusetts: 1992) p. 29.
2. Matter of Sunrise Manor Nursing Home v. Axelrod, 135 A.D.2d 293, 296, 525 N.Y.S.2d 367, 369 (3d Dept. 1988), quoting Matter of Roman Catholic Diocese of Albany v. New York State Dept. of Health, 66 N.Y.2d 948, 951, 489 N.E.2d 749, 750, 66 N.Y.S.2d 948, 951 (1985).
3. 24 N.Y.3d 451, 24 N.E.3d 1086, 999 N.Y.S.2d 822.
4. Private Housing Finance Law §35(2).
5. Cohen v. Kings Point Tenant Corp., 126 A.D.3d 843, 6 N.Y.S.3d 93 (2d Dept.).
6. 127 A.D.3d 485, 8 N.Y.S.3d 38.
7. 124 A.D.3d 481, 2 N.Y.S.3d 436.
8. 127 A.D.3d 924, 6 N.Y.S.3d 623.
9. 111 A.D.3d 522, 975 N.Y.S.2d 38.
10. 108 A.D.3d 697, 969 N.Y.S.2d 547 (2d Dept. 2013).
11. 99 A.D.3d 748, 951 N.Y.S.2d 758.
12. 126 A.D.3d 417, 5 N.Y.S.3d 52.
13. 39 Misc.3d 27, 964 N.Y.S.2d 396. Full disclosure: Adam Leitman Bailey, P.C. of whom these authors represented the cooperative board and prevailed both at trial and on appeal.
14. —N.Y.S.3d—, 130 A.D.3d 482, 2015 WL 4112882, 2015 N.Y. Slip Op. 06019.


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C. Hauff and G. Gousios, “Matching GitHub developer profiles to job advertisements,” in Proceedings of the 2015 IEEE/ACM 12th Working Conference on Mining Software Repositories (MSR), 2015, pp. 362–366.
E. van der Veen, G. Gousios, and A. Zaidman, “Automatically Prioritizing Pull Requests,” in Proceedings of the 2015 IEEE/ACM 12th Working Conference on Mining Software Repositories (MSR), 2015, pp. 357–361.
V. Karakoidas, D. Mitropoulos, P. Louridas, G. Gousios, and D. Spinellis, “Generating the Blueprints of the Java Ecosystem,” in Proceedings of the 2015 IEEE/ACM 12th Working Conference on Mining Software Repositories (MSR), 2015, pp. 510–513.
G. Gousios, B. Vasilescu, A. Serebrenik, and A. Zaidman, “Lean GHTorrent: GitHub Data on Demand,” in Proceedings of the 11th Working Conference on Mining Software Repositories, New York, NY, USA, 2014, pp. 384–387.
G. Gousios and A. Zaidman, “A Dataset for Pull-based Development Research,” in Proceedings of the 11th Working Conference on Mining Software Repositories, New York, NY, USA, 2014, pp. 368–371.
D. Mitropoulos, V. Karakoidas, P. Louridas, G. Gousios, and D. Spinellis, “The Bug Catalog of the Maven Ecosystem,” in Proceedings of the 11th Working Conference on Mining Software Repositories, New York, NY, USA, 2014, pp. 372–375.
G. Gousios and D. Spinellis, “Alitheia Core: An extensible software quality monitoring platform,” in ICSE ’09: Proceedings of the 31st International Conference on Software Engineering – Formal Research Demonstrations Track, 2009, pp. 579–582.
G. Gousios, E. Kalliamvakou, and D. Spinellis, “Measuring developer contribution from software repository data,” in MSR ’08: Proceedings of the 2008 International Working Conference on Mining Software Repositories, New York, NY, USA, 2008, pp. 129–132.
G. Gousios, D. Safaric, and J. Visser, “Streaming Software Analytics,” in Proceedings of the 2nd International Workshop on BIG Data Software Engineering, New York, NY, USA, 2016, pp. 8–11.
M. Beller, I. Levaja, A. Panichella, G. Gousios, and A. Zaidman, “How to Catch ’Em All: WatchDog, a Family of IDE Plug-Ins to Assess Testing,” Proceedings of the 3rd International Workshop on Software Engineering Research and Industrial Practice. 2016.
G. Chen, D. Davis, G. Gousios, C. Hauff, and G.-J. Houben, “Learning transfer: does it take place?,” in Proceedings of the 2nd Workshop of Learning With MOOCs, 2015.
D. Mitropoulos, G. Gousios, P. Papadopoulos, V. Karakoidas, P. Louridas, and D. Spinellis, “The Vulnerability Dataset of a Large Software Ecosystem,” in Proceedings of the 3rd International Workshop on Building Analysis Datasets and Gathering Experience Returns for Security, 2014.
D. Mitropoulos, V. Karakoidas, P. Louridas, G. Gousios, and D. Spinellis, “Dismal Code: Studying the Evolution of Security Bugs,” in LASER ’13: Proceedings of the 2013 Workshop on Learning from Authoritative Security Experiment Results, Arlington, VA, 2013, pp. 37–48.
D. Mitropoulos, G. Gousios, and D. Spinellis, “Measuring the Occurrence of Security-Related Bugs through Software Evolution,” in PCI 2012: Proceedings of 16th Panhellenic Conference on Informatics, 2012, pp. 117–122.
E. Kalliamvakou, G. Gousios, D. Spinellis, and N. Pouloudi, “Measuring Developer Contribution from Software Repository Data,” in MCIS 2009: 4th Mediterranean Conference on Information Systems, 2009, pp. 600–611.
G. Gousios and D. Spinellis, “Java Performance Evaluation Using External Instrumentation,” in Proceedings of the 12th Pan-Hellenic Conference on Informatics, 2008, pp. 173–177.
G. Gousios, V. Karakoidas, K. Stroggylos, P. Louridas, V. Vlachos, and D. Spinellis, “Software Quality Assessment of Open Source Software,” in Proceedings of the 11th Panhellenic Conference on Informatics, 2007.
G. Gousios, “Open from the beginning,” in Perspectives in Data Science for Software Engineering, T. Menzies, L. Williams, and T. Zimmermann, Eds. Morgan Kaufmann, 2016, pp. 233–237.
P. C. Rigby, A. Bacchelli, G. Gousios, and M. Mukadam, “A Mixed Methods Approach to Mining Code Review Data: Examples and a study of multi-commit reviews and pull requests,” in The Art and Science of Analyzing Software Data, C. Bird, T. Menzies, and T. Zimmermann, Eds. Morgan Kaufmann, 2015, pp. 231–255.
A. de Groot, S. Kügler, P. Adams, and G. Gousios, “Call for Quality: Open Source Software Quality Observation,” in IFIP International Federation for Information Processing, vol. 203/2006, E. Damiani, B. Fitzgerald, W. Scacchi, M. Scotto, and G. Succi, Eds. Springer Boston, 2006, pp. 57–62.
S. Androutsellis-Theotokis, V. Karakoidas, G. Gousios, D. Spinellis, and Y. Charalambidis, “Building an e-business platform: An experience report,” in Innovation and the knowledge Economy — Issues, Applications Case Studies, P. Cunningham and M. Cunningham, Eds. Amsterdam, Nethedlands: IOS Press, 2005, pp. 199–206.
G. Gousios, “Big Data Software Analytics with Apache Spark,” in Proceedings of the 40th International Conference on Software Engineering: Companion Proceeedings, New York, NY, USA, 2018, pp. 542–543.
D. Spinellis and G. Gousios, “How to Analyze Git Repositories with Command Line Tools: We’Re Not in Kansas Anymore,” in Proceedings of the 40th International Conference on Software Engineering: Companion Proceeedings, New York, NY, USA, 2018, pp. 540–541.
G. Gousios and D. Spinellis, “Mining Software Engineering Data from GitHub,” in Proceedings of the 39th International Conference on Software Engineering Companion, Piscataway, NJ, USA, 2017, pp. 501–502.
G. Gousios, “JikesNode: A Java operating system,” Master's thesis, University of Manchester, Manchester, UK, 2004.
G. Gousios, “Tools and Methods for Large Scale Software Engineering Research,” PhD thesis, Athens University of Economics and Business, Athens, Greece, 2009.
M. Beller, G. Gousios, and A. Zaidman, “Oops, my tests broke the build: An analysis of Travis CI builds with GitHub,” PeerJ Preprints, vol. 4, p. e1984v1, Apr. 2016.
A. Rastogi, N. Nagappan, and G. Gousios, “All contributors are equal; some contributors are more equal than others,” IIIT Delhi, IIITD-TR-2016-001, Jan. 2016.
G. Gousios and A. Bacchelli, “Work Practices and Challenges in Pull–Based Development: The Contributor’s Perspective,” Radboud University Nijmegen, Internal Report ICIS–R15001, Mar. 2015.
G. Gousios, A. Zaidman, M.-A. Storey, and A. Van Deursen, “Work practices and challenges in pull-based development: the integrator’s perspective,” Delft University of Technology, Software Engineering Research Group, Internal Report TUD-SERG-2014-013, Sep. 2014.
G. Gousios, “Rethinking the Java software stack: Optimisation opportunities in the face of hardware resource virtualisation,” Athens University of Economics and Business, Jan. 2007.
G. Gousios, “Software engineering properties of functionally enabled languages,” Athens University of Economics and Business, Jan. 2011.
E. Meijer and G. Gousios, “Teaching Applied Functional Programming: Experiences from the functional programming course at TU Delft,” 2015.

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From a peasant family, in 1969 Marmus finished a vocational college in Lviv. He worked first at a meat processing factory in the city of Chortkiv, and then on a collective farm in his home village.
From childhood he listened with fascination to the stories of relatives and others in the village about the national-liberation movement of the 1920s, and about the Ukrainian Resistance Army (UPA). He read Ukrainian literature published before 1939, and collected folklore in song on national-liberation themes.
It was from broadcasts of Radio “Svoboda” [Radio “Liberty”] that Marmus and his friends first heard the names of contemporaries fighting for a free Ukraine, using words as their weapon. They heard the works of I. DZIUBA, Y. SVERSTYUK, the poetry of V. SYMONENKO, L. KOSTENKO and others. Particularly decisive was to be 1972 which saw the second wave of arrests throughout Ukraine.
In light of the seriousness of the situation, Marmus decided to create an underground organization with the objective of achieving Ukrainian independence. Marmus drew up the text of an oath which each person joining the organization was obliged to declare their adherence to. On 5 November 1972 the oath was taken by Marmus himself, P. Vynnychuk, V. Senkiv and P. Vytiv. That same night they ripped down flags of the USSR hung to commemorate the October Revolution at the medical treatment clinic and at the sauna. There were 9 members in all of the organization.
In 1971 in the village of Rosokhach in front of everyone, the burial site of the Sichovi striltsi [fighters from military units striving for a free Ukraine] which had been dug by the entire village in 1942 in one night, was destroyed. Marmus then concluded that if a grave for the striltsi was not needed, then neither was the monument to Soviet soldiers. In this way, one ill led to another: in October 1972 V. Senkiv and P. Vytiv tried to destroy the monument.
For the 55th anniversary of the proclamation of the Ukrainian National Republic (UNR) in 1918, Marmus wrote the texts of a proclamation and leaflets: “Svoboda ukrainskym patriotam” [“Freedom for Ukrainian patriots”], with the victims of the repressive measures meted out to dissidents in 1972 – 73 in mind; “Hanba polititsi rusyfikatsiyi!” [“The policy of Russification is an outrage!”], “Khai zhyve zrostayuchy ukrainsky patriotism!” [“Long live and flourish Ukrainian patriotism!”] In honour of this date, on 21 – 23 January 1973 the group held a protest action against the policy of Russification in Ukraine and the arrests of members of the Ukrainian intelligentsia, demanding freedom of the press, of political demonstrations and gatherings. Four blue and yellow flags were raised in Chortkiv and 19 leaflets pasted up.
The KGB began actively searching for those responsible. On 25 February 1973 Marmus was arrested and taken to Ternopil where the investigation was carried out. During the investigation, Marmus stood firm in rejecting all of the KGB’s accusations.
ON 15-20 March 1973 M. Marmus, A. Kraviets, M. Slobodyan, M. Lysy, V. Senkiv, S. SAPELYAK and P. Vynnychuk were all arrested in connection with this case. P. Vytviv, as a minor, was not taken into custody.
All those arrested were charged with anti-Soviet activities under Articles 62 and 64 of the Criminal Code of the Ukrainian SSR.
On 24 September 1973 Marmus was convicted by the Ternopil Regional Court of anti-Soviet agitation and propaganda (Article 62 § 1), illegal possession of firearms (Article 222 § 1), the creation of an underground nationalist organization (Article 64), involving minors in a nationalist organization (Article 208). He was sentenced to 6 years harsh regime labour camp and 3 years exile. The other members of the organization were sentenced to various terms.
From 1973 Marmus was held in the Perm political labour camps, first camp No. VS-389/36 in the village of Kutchino in the Perm region, then in 1974 he was moved to camp № 35 (Vsekhsvyatskaya), and then to camp № 37 (Polovynka).
In the camps he took part in protest actions to mark Human Rights Day, the signing of the Helsinki Accords and over the intolerable conditions in which political prisoners were held.
While in exile in the Tyumen region, Marmus on several occasions addressed appeals to various bodies in support of O. MESHKO, V. PIDHORETSKY, Z. ANTONYUK, Y. SVERSTYUK with regard to their medical treatment and improving their living conditions, etc.
After his release, Marmus worked on the collective farm in his village.
From 1988 he was a member of the Ukrainian Helsinki Union (UHU), a founding member of the All-Ukrainian Society for Political Prisoners and Victims of Repression (1989), the organizer of the Chortkiv branch of “Memorial”, a member of Narodny Rukh Ukrainy [Popular Movement of Ukraine] (RUKH), the constant chairperson of the district organization of the Ukrainian Republican, then Christian Republican Party.
Marmus lives in Chortkiv and works in the district State administration. He is married and bringing up two sons.
V. Marmus. Prapory nad mistom [Flags over the city]. Molod Ukrainy – 1998 — 22 January.
Г.Касьянов. Незгодні: українська інтелігенція в русі опору 1960-1980-х років. / G. Kasyanov. Dissenting voices: the Ukrainian intelligentsia in the resistance movement of the 1960s to 1980s — Kyiv: Lybid, 1995 p. 142.
А.Русначенко. Національно-визвольний рух в Україні. / A. Rusnachenko. The National Liberation Movement in Ukraine. – Kyiv: The O. Teliha Publishing house, 1998, p. 208.
The sentence of the Ternopil Regional Court from 24 September 1973.

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Faculty of Sociology Taras Shevchenko National University of Kyiv (Ukraine) in cooperation with Faculty of Social Sciences Lund University (Sweden) open the first in Ukraine MA program “Gender Studies” (with major in sociology) .
MA program “Gender Studies” (with major in sociology) aimed at professional competences in sociological research, critical and analytical rethinking of social and gender issues. Gender studies gives a multidisciplinary research approach to study current processes and social changes in gender related enquiry, gender inequalities, core issues of the feminist and queer theories, civic activism. The program is focused on development of the competences of studentship in critical and analytical thinking, debates and assessment of the core ideas of social theories and research findings, methods of sociological research of gender issues and gender expertise, development and management of social projects with gender equality approach.
MA Gender Studies will become a successful follow up to social and humanities BA studies in various specialities, as gender competence is needed for all the professions in politics, economics, law, culture, arts, massmedia, social relations.
MA program Gender Studies is a chance to get better understanding of oneself and society around, gives professional capacities on sociological research and gender approach to social problems studies, prepares both to the further academic work, and professional occupations in sociological and gender studies, management of the personnel, public relations, mass communication and advertising, social policy, state service, international and non-governmental organizations, etc.
Duration of study: 2 years (4 semesters) 120 ECTS credits.
Graduates of the program receive a Master's degree diploma in Sociology (educational program "Gender Studies") of Taras Shevchenko National University of Kyiv. The third semester of studies is in English and includes option for exchange (academic mobility) students.
In Sweden: please visit Lund university website http://www.lunduniversity.lu.se/international-admissions/bachelors-maste...) can be covered by different scholarships, (for example, Erasmus+ student exchange program) if a student will get one, or by the students themselves.
Students apply to this Programme at their home university in accordance to actual admission rules. Eligible to apply the the Programme are students who are enrolled in the Master´s programmes in Social Studies of Gender or Sociology at Lund University and students at KNU who are enrolled in a Master´s programme at the Faculty of Sociology, have a Bachelor´s degree in sociology, a minimum average grade in their Bachelor´s studies equivalent to 3.0 in cumulated grade point average (CGPA) out of 4, C in the ECTS grading scale, and B in the American grading scale, not less then 75 in a 100 points scale, and the following proficiency in English: A TOEFL score of at least 575 (Internet Based score: 90), or an IELTS score of at least 6.5 (with no score less than 5.5).
The students fulfilling the requirements for a double degree will be awarded a Degree of Master in Sociology with specialization in Gender Studies at KNU and a Degree of Master of Science (120 credits) in Social Studies of Gender with a major in sociology at Lund University. Requirements includes successful study at Faculty of Sociology (Kyiv) 1,2 and 4ht semesters and the 3d semester at Lund University (Sweden), or successful studies at Faculty of Social Sciences (Sociology of Gender Studies program) Lund University and the 3d semester at Faculty of Sociology Taras shevchenko National University of Kyiv; The MA Thesis within the field of gender issues is written in English; it is supervised by the assigned professors and assessed by a joint evaluation committee from the Department of Sociology in Lund and the Faculty of Sociology at KNU.
There is no tuition fees will be levied on students participating in the Programme of exchange. The Competition to the Programme of exchange is done on the basis of rating of studies excellence, English proficiency and interviews. The students will continue to pay tuition fees at their home university. All other expenses incurred will remain the personal responsibility of each exchange student or could be covered with scholarships (for ex. Erasmus+ academic mobility competitions).
Methodology and Organization of Scientific Research with Basics of Intellectual Property; Prof .Tsymbalyuk N.М.
Advanced Methods of Data Analysis in Sociology) Dr.Gorbachyk А.P.
Research Paradigms in Social Sciences Dr.Sobolevska М.О.
Methodology of Social Inequalities Studies Prof.Kutsenko О.D.
Professional and Corporate Ethics Prof.Tsymbalyuk N.М.
Quantitative Methods: Multivariative Analysis Dr.Sydorov М.V-S.
Gender, Age, Class, Nation: Cross-sectional Analysis; Dr.Babenko.S.S, assistant Kharchenko О.І.
Methods of Qualitative Data Analysis Dr.Marchenko А.М.
Evaluation Research in Sociology Dr. Mazuryk О.V.
Gender, Body and Sexuality Dr. Chervinska T.G.
Feminist Critics of Classical Social Theory Dr. Chervinska T.G.
Social and Feminist Movements in World, Europe, Ukraine Dr.Foster L.F.
Sociology of Gender Dr.Babenko.S.S, assistant Kharchenko О.І.
OR Current Challenges to Sociology and Global Development Dr.Babenko.S.S,. Dr.Tsymbal Т.V.
Gender and Family: Parenting and Care in Ukraine Dr.Males L.V., Dr.Strelnik О.О.
OR Current Challenges to Sociology and Global Development Dr.Babenko.S.S, Dr.Tsymbal Т.V.
Gender Expertise and Gender Audit Dr.Males L.V., assistant prof. Kharchenko О.І.
OR · Sociological Research and Social Projects Dr.Marchenko А.М.
Gendered Education аs. Kharchenko О.І.
OR Gendered Life Course and Life Success Dr. Babenko.S.S,.
Gender Analysis of Mass Media Dr. Vilkova О.Y.
OR · Biographical Method in Social Research Dr. Marchenko А.М.
OR · Qualitative Research Methods in Gender Studies Dr.Marchenko А.М.
Sociology of Masculinity and Men's Studies) Dr.Chervinska T.G.
OR · Social Networks Analysis Dr. Marchenko А.М.
Fieldwork "Sociological research on gender issues"
Where can I find a job after successful graduation?
5 A critical feminist perspective in contemporary sociology Males L. V.
5 Feminist critique of classical social theory Chervinska T. G.
5 Gender, class, age, nation: cross sectional analysis Babenko S. S.
5 Gender, corporeality and sexuality Chervinska T. G.
5 Methodology of Research of Social Inequality Kutsenko O. D.
5 Methods for analyzing nonnumerical data in sociology Savelyev Y. B.
5 Modern methods of data analysis in sociology Gorbachyk A. P.
5 Quantitative methods: multivariate analysis Sydorov M. V.
5 Research paradigms in social sciences Sobolevska M. O.
5 Social and women's movements in the world, Europe, Ukraine Foster (Kaminska) L. F.
5 Social Network Analysis Savelyev Y. B.
5 Technology of scientific texts writing Males L. V.
5 Valuation studies in sociology Mazuryk O. V.
6 Biographical method in gender studies Yuzva L. L.
6 Gender Expertise and Gender Audit Males L. V.
6 Gender expertise and gender audit Babenko S. S.
6 Gender order transformation in post-socialist Ukraine and Еurope Males L. V.
6 Gendered education Babenko S. S.
6 Gendered life course and life success Babenko S. S.
6 Qualitative methods in gender studies Yuzva L. L.
6 Sociological support of social projects Yuzva L. L.
6 Sociology of gender Babenko S. S.
6 Sociology of masculinity and men’s studies Chervinska T. G.

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Can. 96 By baptism one is incorporated into the Church of Christ and is constituted a person in it with the duties and rights which are proper to Christians in keeping with their condition, insofar as they are in ecclesiastical communion and unless a legitimately issued sanction stands in the way.
Can. 97 §1. A person who has completed the eighteenth year of age has reached majority; below this age, a person is a minor.
§2. A minor before the completion of the seventh year is called an infant and is considered not responsible for oneself (non sui compos). With the completion of the seventh year, however, a minor is presumed to have the use of reason.
Can. 98 §1. A person who has reached majority has the full exercise of his or her rights.
Can. 99 Whoever habitually lacks the use of reason is considered not responsible for oneself (non sui compos) and is equated with infants.
Can. 100 A person is said to be: a resident (incola) in the place where the person has a domicile; a temporary resident (advena) in the place where the person has a quasi-domicile; a traveler (peregrinus) if the person is outside the place of a domicile or quasi-domicile which is still retained; a transient (vagus) if the person does not have a domicile or quasi- domicile anywhere.
Can. 101 §1. The place of origin of a child, even of a neophyte, is that in which the parents had a domicile or, lacking that, a quasi-domicile when the child was born or, if the parents did not have the same domicile or quasi-domicile, that of the mother.
Can. 102 §1. Domicile is acquired by that residence within the territory of a certain parish or at least of a diocese, which either is joined with the intention of remaining there permanently unless called away or has been protracted for five complete years.
Can. 103 Members of religious institutes and societies of apostolic life acquire a domicile in the place where the house to which they are attached is located; they acquire a quasi-domicile in the house where they are residing, according to the norm of ⇒ can. 102, §2.
Can. 104 Spouses are to have a common domicile or quasi-domicile; by reason of legitimate separation or some other just cause, both can have their own domicile or quasi-domicile.
Can. 105 §1. A minor necessarily retains the domicile and quasi-domicile of the one to whose power the minor is subject. A minor who is no longer an infant can also acquire a quasi-domicile of one’s own; a minor who is legitimately emancipated according to the norm of civil law can also acquire a domicile of one’s own.
Can. 106 Domicile and quasi-domicile are lost by departure from a place with the intention of not returning, without prejudice to the prescript of ⇒ can. 105.
Can. 107 §1. Through both domicile and quasi-domicile, each person acquires his or her pastor and ordinary.
Can. 108 §1. Consanguinity is computed through lines and degrees.
Can. 109 §1. Affinity arises from a valid marriage, even if not consummated, and exists between a man and the blood relatives of the woman and between the woman and the blood relatives of the man.
Can. 110 Children who have been adopted according to the norm of civil law are considered the children of the person or persons who have adopted them.
§2. Anyone to be baptized who has completed the fourteenth year of age can freely choose to be baptized in the Latin Church or in another ritual Church sui iuris; in that case, the person belongs to the Church which he or she has chosen.
3/ before the completion of the fourteenth year of age, the children of those mentioned in nn. 1 and 2 as well as, in a mixed marriage, the children of the Catholic party who has legitimately transferred to another ritual Church; on completion of their fourteenth year, however, they can return to the Latin Church.
§2. The practice, however prolonged, of receiving the sacraments according to the rite of another ritual Church sui iuris does not entail enrollment in that Church.

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