SEMICONDUCTOR ELEMENT PACKAGE AND AUTOFOCUSING DEVICE
FIG10 is a plan view illustrating the semiconductor element package according to the fourth embodiment
As shown in FIG10, the first protective layer 145 may be disposed around a first outer side surface of the substrate 110, around a first outer side surface of the housing 130, on an upper surface of one side of the housing 130, and in a partial region of a first end of the diffusion part 140. The second protective layer 146 may be disposed around a second outer side surface of the substrate 110, around a second outer side surface of the housing 130, on an upper surface of the other side of the housing 130, and in a partial region of a second end of the diffusion part 140.
plan view
146
second protective layer second protective layers
145
protective layer protective layers
153
pad pads
10
third resistor R3 has
['2. The semiconductor element package of claim 1, further comprising: a second substrate disposed under the first substrate; a pad disposed along an edge of the diffusion part; a plurality of connection wirings disposed in the plurality of via holes; first and second bonding portions disposed under the first substrate and electrically connecting the connection wiring to the second substrate; and third and fourth bonding portions disposed at the step of the housing to electrically connect the connection wiring to the pad.', '5. The semiconductor element package of claim 2, further comprising a protective layer having a first region disposed along the edge of the diffusion part and a second region extending from the first region to contact the second substrate via the housing.', '9. The semiconductor element package of claim 7, wherein the protective layer includes a conductive material, and the protective layer includes a first protective layer and a second protective layer spaced apart from each other.']