SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA
FIG1 is a cross-sectional view of an exemplary semiconductor package structure in accordance with some embodiments
FIG1 is a cross-sectional view of an exemplary semiconductor package structure 10 in accordance with some embodiments. In some embodiments, the semiconductor package structure 10 is a wafer-level semiconductor package structure, and is a flip-chip semiconductor package structure. As shown in FIG1, the semiconductor package structure 10 is mounted on a base (not shown), in accordance with some embodiments. For example, the semiconductor package structure 10 may be a system-on-chip (SOC) package structure. Moreover, the base may include a printed circuit board (PCB) and may be formed of polypropylene (PP). Alternatively, the base is a package substrate. The semiconductor package structure 10 is mounted onto the base by a bonding process. For example, the semiconductor package structure 10 includes conductive structures 150 that is mounted on and electrically coupled to the base by the bonding process. In some embodiments, each of the conductive structures 150 includes a conductive bump structure such as a copper bump or a solder bump structure, as shown in FIG1. Alternatively, each of the conductive structures 150 includes a conductive pillar structure, a conductive wire structure, or a conductive paste structure. It should be noted that the number of conductive traces and the number of sub-dielectric layers of the RDL structure 106 shown in FIG1 are only an example and are not a limitation to that disclosed in the embodiment.
cross-sectional view
121
IMD layer
126
through-opening
112
through via structures through via structure
143
second portion second portions
120
RDL structure
103
conductive traces
141
first portion first portions
116
adhesion layer
10
semiconductor package structure
128
molding compound layer
140
antenna antennas
110
molding compound layer
124
ground layer
100
semiconductor die
105
conductive traces
102
layer
101
pads
106
structure
150
conductive structures
114
antenna antennas
['1. A semiconductor package structure, comprising: a semiconductor die; a first redistribution layer (RDL) structure formed on a non-active surface of the semiconductor die; a second RDL structure formed on and electrically coupled to an active surface of the semiconductor die; a ground layer formed in the first RDL structure; a first molding compound layer formed on the first RDL structure; and a first antenna, comprising: a first antenna element formed in the second RDL structure; and a second antenna element formed on the first molding compound layer, wherein each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.', '2. The semiconductor package structure as claimed in claim 1, wherein each of the first antenna element and the second antenna element has a second portion adjoining the first portion, and wherein the ground layer has a through-opening overlapping the second portion as viewed from a top-view perspective.', '3. The semiconductor package structure as claimed in claim 1, further comprising: a second molding compound layer surrounding the semiconductor die; a through via structure formed in the second molding compound layer and electrically coupled between the ground layer and the second RDL structure; and a second antenna formed in the second molding compound layer and electrically coupled to the ground layer by the second RDL structure and the through via structure.', '5. The semiconductor package structure as claimed in claim 1, further comprising a plurality of conductive structures electrically coupled to the semiconductor die via the second RDL structure.']