ELECTRONIC COMPONENT AND ELECTRONIC DEVICE COMPRISING SAME
FIG5 is a cross-sectional view illustrating an electronic component according to various embodiments of the present disclosure
Further referring to FIG5, the electronic component 404 may include at least one recess 441a formed in the substrate 441. The recess 441a is formed on the other face of the substrate 441 (e.g., the face opposite the face on which the sensor element 443 is disposed or the face facing the flexible printed circuit board 449) at or adjacent to an edge of the other face. In one embodiment, when the flexible printed circuit board 449 extends to one side of the substrate 441 in a first direction D1, the recess 441a may extend in a second direction D2 intersecting or orthogonal to the first direction D1. The flexible printed circuit board 449 may be disposed to be at least partially correspond to a region where the solder bumps 449a are arranged on the other face of the substrate 441, and may extend to pass through the section where the recess 441a is formed. For example, the recess 441a may extend across the region facing the flexible printed circuit board 449 on the other face of the substrate 441. In some embodiments, the extending length of the recess 441a may be greater than or equal to the width W1 or W2 of the flexible printed circuit board.
cross-sectional view
451
molding portion
601
package manufacturing operation
605
post-processing operation
449
flexible printed circuit board
600
electronic component manufacturing method
604
cutting operation
602
mounting operation
404
electronic component
603
molding operation
['1. An electronic component (304, 404, 704) comprising: a substrate (341, 441, 741) having a sensor element (343, 443, 743) mounted on one face thereof; a flexible printed circuit board (349, 449, 749) coupled to face a remaining face of the substrate and extending to one side of the substrate in a first direction (D1);  characterised by at least one recess (441a, 741c) formed at an edge of the remaining face of the substrate, wherein the recess is located at least in a region facing the flexible printed circuit board on the remaining face of the substrate and extends in a second direction (D2) intersecting the first direction.', '4. The electronic component of claim 1, further comprising: a molding portion (351, 451, 751) provided to enclose at least a periphery of the substrate.']