FLUX COATING DEVICE AND METHOD FOR SOLAR CELL PANEL, AND APPARATUS FOR ATTACHING INTERCONNECTOR OF SOLAR CELL PANEL
FIG9 is a schematic view showing a flux bath included in the flux portion and a wiring material passing through the flux bath, which are shown in FIG8
For example, as shown in FIG9, the inlet 222a or the outlet 222b may be formed of a hole formed at the first surface 222c or at the second surface 222d of the flux bath 222 below the surface 220b of the flux 220a. Then, a whole portion of the hole is positioned below the surface 220b of the flux 220a. Thus, the wiring material 142 moves through the inlet 222a and the outlet 222b, the wiring material 142 can stably move below the surface 222b of the flux 220a inside the flux 220a. In this instance, when a front end of the wiring material 142 is positioned at the inlet 222a, the wiring material 142 is pushed from a rear side of the wiring material 142 and the wiring material 142 passes through the inlet 222a and then the outlet 222b, and thereafter, the wiring material 142 may move in a desired direction by fixing the wiring material 142 again at a side of the outlet 222b.
schematic view
222
flux bath
142
material materials
['1. A flux coating device for a solar cell panel, comprising: a flux bath (222) configured to receive flux (220a) and having an inlet (222a) and an outlet (222b), wherein the inlet (222a) and the outlet (222b) of the flux bath (222) are configured to pass an interconnector (142) below a surface (220b) of the flux (220a), characterized in that a supplying member (222e) or a spouting member is formed at a lower portion of the flux bath (222) configured to supply, jet, spray, eject, or spout the flux (220a) in an upward direction, and the supplying member (222e) is configured to only operate when the interconnector passes.', '10. The flux coating device of one of preceding claim, wherein the interconnector (142) comprises a wiring material, and wherein the wiring material includes: a rounded portion or a circular cross-section, a core layer (142a), and a solder layer (142b) formed on a surface of the core layer (142a).']