PRINTHEAD HAVING HEATED SHIELD PLATE
FIG11 is a magnified cross-sectional perspective of the ink manifold with a shim and one row of printhead chips removed
The longitudinal ink cavity 60 has cavity sidewalls 62, which extend downwardly from the cavity roof 55 to meet with the lower surface 52 of the manifold 25. A second portion 64 of each through-hole 50 extends beyond the cavity roof 55 to meet with the lower surface 52. In this way, the second portions 64 of the through-holes 50 form notches in the cavity sidewalls 62. Similarly, and as best shown in FIG11, at least part of the first portions 54 of the through-holes 50 form notches in opposite sides of the dividing wall 44.
cross-sectional view
14
first row
48
45
baffles
41
sidewalls
25
manifold
40
channels channel
52
lower surface
66
shim
10
coupling body
43
bellows
26
with complementary snap-locking features
50
through-holes through-hole
44
dividing wall
46
thicker longitudinal central wall
31
film
58
longitudinal rib longitudinal ribs
['1. An inkjet printhead (1) comprising: a manifold (25) having a plurality of ink outlets (50) defined in a manifold surface; a plurality of printhead chips (70) mounted to the manifold surface (52) via a shim (66), the printhead chips being aligned with the ink outlets; a PCB (18) mounted to the manifold surface and offset from the ink outlets, the PCB being electrically connected to the printhead chips, wherein a lower surface of the PCB is coplanar with a lower surface of the shim; and a shield plate (20) bonded to the PCB and part of the shim, the shield plate covering the PCB, wherein: the shield plate has one face in thermal contact with the PCB and an exposed opposite face defining a lower surface of the printhead; and the shim has at least one void region (68) offset from the printhead chips, the void region thermally isolating part of the shield plate from the manifold.', '6. The inkjet printhead of claim 5 comprising first and second rows of printhead chips, the first row of printhead chips having a respective first PCB and the second row of printhead chips having a respective second PCB, wherein the first and second PCBs are positioned at opposite distal longitudinal sides of the first and second rows of printhead chips.']