PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
FIG4 is an application scenario diagram of yet another encapsulation structure provided in an embodiment of the present disclosure
As shown in FIG4, a device to be encapsulated 04 is disposed on a base substrate 05. Exemplarily, a TFT layer 051 is provided on the base substrate 05. The TFT layer 051 may include a plurality of TFTs. The device to be encapsulated 04 is disposed on the TFT Layer 051. It can be seen from FIG4 that in the embodiment of the present disclosure, an inorganic layer 031 coated on the device to be encapsulated 04 is formed on the outside of the device to be encapsulated 04. That is, the inorganic layer 031 is formed on the base substrate 05 on which the device to be encapsulated 04 is formed, and the inorganic layer 031 covers the outside of the device to be encapsulated 04. The schematic diagram after a cover plate 034 is provided on the barrier layer 033 may be referred to FIG4. The cover plate may be a transparent substrate, or may be a flexible substrate. Exemplarily, an optical adhesive may be used to attach the cover plate 034 onto the barrier layer 033. The optical adhesive may be, for example, an optically clear adhesive (OCA). For the process of disposing the cover plate 034 on the barrier layer 033, reference may be made to the related art, and the details will not be repeated in the embodiment of the present disclosure.
diagram
042
green light emitting unit
043
blue light emitting unit
032
organic layer
0321
polymer matrix polymer matrixes
0322
microstructure microstructures
04
be encapsulated
033
barrier layer
031
inorganic layer inorganic layers
034
cover plate
05
base substrate
['1. An encapsulation structure, comprising a plurality of film layers coated on the outside of a device to be encapsulated, wherein the plurality of film layers comprises an inorganic layer and an organic layer that are overlaid, and the organic layer comprises a polymer matrix and a repairing microstructure.', '12. The encapsulation structure according to any one of claims 1 to 11, wherein the encapsulation structure further comprises: a barrier layer disposed on the outside of the plurality of film layers, and a cover plate disposed on the barrier layer.', '13. The encapsulation structure according to any one of claims 1 to 11, wherein the device to be encapsulated is a display device, the display device is disposed on a display area of a base substrate, and both the inorganic layer and the organic layer cover the display area.']