COMPOSITIONS AND METHODS FOR ACTIVATING TITANIUM SUBSTRATES
FIG9 is a schematic illustration of a system for strike plating a substrate in accordance with the method of FIG1
Referring to FIG9, a strike plating system, generally designated 450, includes a bath 452, an electrolyte solution 454 received in the bath 452, a nickel anode 458 immersed in the electrolyte solution 454, and current source 460. The current source 460 may include first terminal 462 and a second terminal 464. The nickel anode 458 may be electrically coupled with the second terminal 464 by way of a lead 468. As shown in FIG9, the substrate 456 is immersed (e.g., completely immersed) in the electrolyte solution 454 in the bath 452. Then, the substrate 456 is electrically coupled with the first terminal 462 of the current source 460 by way of a lead 466.
schematic
464
second terminal
466
lead
452
bath
458
nickel anode
462
first terminal
468
lead
456
substrate
460
current source
450
generally designated
['9. A method for pretreating a substrate prior to depositing a material thereon, the method comprising: immersing the substrate in the activation solution of Claim 1 for a predetermined period of time, wherein the substrate is preferably a titanium substrate.']