OPTIMAL EXPOSURE OF A BOTTOM SURFACE OF A SUBSTRATE MATERIAL AND/OR EDGES THEREOF FOR CLEANING IN A SPIN COATING DEVICE
FIG2 is a schematic view of a semiconductor wafer configured to be placed on a spin chuck of a photoresist coating device of the photoresist coating system of FIG1, according to one or more embodiments
FIG2 shows a semiconductor wafer 202 configured to be placed on spin chuck 108, according to one or more embodiments; in one or more embodiments, said semiconductor wafer 202 may be securely placed on spin chuck 108 based on application of suction to a surface (e.g., bottom surface 294, as shown in FIG2) of semiconductor wafer 202 directly in contact with spin chuck 108. Once semiconductor wafer 202 is securely placed on spin chuck 108, photoresist material may be applied on top (e.g., on top surface 292) of semiconductor wafer 202, as shown in FIG2. Both manual and automatic means of application of the photoresist material may be envisioned within the scope of the exemplary embodiments discussed herein. In one or more embodiments, spin chuck 108 may be configured to rotate at a high speed, as discussed above, to enable uniform spreading of the photoresist material (e.g., photoresist material 242 shown in FIG2) across top surface 292 of semiconductor wafer 202. FIG2 also shows edges 252 of semiconductor wafer 202, according to one or more embodiments.
schematic view
202
semiconductor wafer
242
photoresist material
294
bottom surface
252
edges
292
top surface
108
spin chuck
['1. A spin coating device comprising: a base plate; a spin chuck on which a substrate material is configured to be placed, the substrate material comprising a top surface and a bottom surface, and the top surface being a surface configured to be coated with a film-forming substance; and an actuator mechanism configured to engage the base plate with the spin chuck such that the base plate is configured to synchronously spin along with the spin chuck, wherein a cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface of the substrate material and edges thereof in a state of the engagement of the base plate with the spin chuck, wherein the actuator mechanism is further configured to: in response to disengagement of a lid configured to synchronously co-rotate with the base plate during the synchronous spinning thereof along with the spin chuck from the base plate, disengage the base plate from the spin chuck to render the spin chuck free of the base plate, and wherein the disengagement of the base plate from the spin chuck is configured to lower the base plate such that the cleaning mechanism is optimally exposed to the bottom surface of the substrate material and the edges thereof based on emergence of the cleaning mechanism through the base plate.', '2. The spin coating device of claim 1, wherein at least one of: the substrate material is a semiconductor wafer, and the film-forming substance is a photoresist material.']