SEMICONDUCTOR ELEMENT PACKAGE AND AUTOFOCUSING DEVICE
FIG13 is a second exemplary view illustrating a shape of an electrode pad
As shown in FIG13, it is possible to include the electrode pad 150 disposed on the diffusion part 140. As an example, as shown in FIG13, the first region 151 and the second region 152 of the electrode pad 150 may be disposed in diagonal regions facing each other. The electrode pad 150 may include the first region 151 provided at a first corner with respect to the upper surface of the diffusion part 140. In addition, the electrode pad 150 may include the second region 152 provided at a third corner facing the first corner with respect to the upper surface of the diffusion part 140. Meanwhile, in the embodiment described with reference to FIG13, description has been made based on a case in which the first region 151 and the second region 152 of the electrode pad 150 are disposed on a diagonal corner facing each other with respect to the upper surface of the diffusion part 140. However, according to another embodiment, a region in which a connection wiring is bonded in the electrode pad 150 may be disposed on at least two corner regions of four corners with respect to the upper surface of the diffusion part 140.
view
151
first region
140
diffusion part
150
pad
['1. A semiconductor element package comprising: a first substrate; a semiconductor element disposed on the first substrate; first and second electrodes disposed on the first substrate, and electrically connected to the semiconductor element; a housing disposed on the first substrate, disposed around the semiconductor element, and having a step in an upper region thereof; a diffusion part disposed at the step of the housing, and disposed on the semiconductor element; and a plurality of via holes passing through the first substrate and the housing.', '2. The semiconductor element package of claim 1, further comprising: a second substrate disposed under the first substrate; a pad disposed along an edge of the diffusion part; a plurality of connection wirings disposed in the plurality of via holes; first and second bonding portions disposed under the first substrate and electrically connecting the connection wiring to the second substrate; and third and fourth bonding portions disposed at the step of the housing to electrically connect the connection wiring to the pad.', '5. The semiconductor element package of claim 2, further comprising a protective layer having a first region disposed along the edge of the diffusion part and a second region extending from the first region to contact the second substrate via the housing.']