e through via 822 to another through via in the PCB. In this embodiment, a coiled wire 854 wraps around a block 852 to extend the length of the path 850.
A voltage regulator with passives embedded in packaging maintains a short and low inductive path from the voltage regulator to the die. Additionally, increased voltage regulator control loop bandwidth increases operating frequency and shortens a feedback path to the voltage regulator. Passive components embedded in the packaging substrate allows increased inductance and capacitance values. Further, the embedded passive components reduce packaging substrate top side area consumed by passive components.
Although the terminology through silicon via includes the word silicon, it is noted that through silicon vias are not necessarily constructed in silicon. Rather, the material can be any device substrate material.
Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the technology of the disclosure as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.