ete entities.
The components could include, for example, one or more of a processor, memory (e.g., RAM, SDRAM, DDR RAM, and ROM), CODEC circuitry, Input/Output ("I/O") circuitry, communication circuitry, accelerometers, capacitors, or any other suitable components.
In some embodiments, a die including the components of a system could be coupled to a substrate. The substrate, in turn, could be coupled to a flexible printed circuit board ("flex"). The substrate and the flex could include any suitable wiring and routing to electrically couple the die to other parts of the system such as, for example, a flash memory. In some embodiments, the flex can be coupled to a different surface of the substrate than the die. In some embodiments, the flex can be coupled to the same surface of the substrate as the die.
In some embodiments, the flex could include a ledge to which one or more components could be coupled. In some embodiments, a system could be created which does not include a substrate. In this case, all necessary wiring could be provided through the flex. In some embodiments, test points could be provided for a component of a die. For example, the test points could be included in a portion of the flex located substantially below the component to be tested.
In some embodiments, rather than being included together in a single die, the components of a system could be included as discrete entities. The discrete entities could be coupled to a substrate rather than being coupled to a printed circuit board ("PCB"). As a substrate can have more stringent design rules than a PCB, coupling the discrete entities to the substrate could allow for a system that is smaller and more compact in size. For example, the wiring for the system could be created using fewer layers and could be formed more densely in a substrate than in a PCB.
Apple's patent, in respect to components discussed earlier, states that "A system utilizing these components could be included in any suitable electronic device such as, for example, a cellular telephone, a personal data assistant ("PDA"), a digital media player (e.g., an iPod available from Apple Inc. of Cupertino, Calif.), a computer, or any other suitable electronic device." The latter entry of "computer" is both interesting and important considering that Apple's recent iMac Touch patent basically confirms that possibility in practice. Meaning that an iMac Touch could utilize both a standard CPU from Intel or AMD in addition to an A4 type chip or, as the patent presents it, a "system-on-a-substrate" – for touch related functionality.
Apple first launched the A4 on January 27, 2010 as the brains behind their new revolutionary iPad and referred to it as a System-on-a-Chip or SOC: "iPad is powered by A4, Apple's next-generation system-on-a-chip." Apple's A4 chip may also end up in Apple's forthcoming Apple TV update due on September 1, 2010 if Engadget's sources are correct.
Apple's patent FIG. 1 shows an illustrative PCB (Printed Circuit Board) 100 that could be used for coupling together the components of the system when the components are each discrete entities. For example, discrete entities such as a processor microchip 102, memory microchip 104, and one or more capacitors 106 could be coupled together through PCB 100. PCB 100 could be formed with conductive pathways or wiring (e.g., wiring 108 or 110) that could suitably provide electrical connections between the various entities of the system to couple the entities together.
Although FIG. 1 illustrates a processor, memory, and capacitors, one skilled in the art could appreciate that one or more of the above-mentioned discrete entities (e.g., CODEC circuitry, I/O circuitry, communication circuitry, accelerometers, or any other suitable components) could alternatively or additionally be illustrated in FIG. 1. As used herein, when a specific illustration of a component is provided, one skilled in the art could appreciate that the specific illustration is given merely for illustration and not for limitation, and that any other suitable component (e.g., a 