Composite nanostructural materials
Heat-accumulating, heat-absorbing and heat-shielding composite structural parts on basis of new composite nanostructural compounds are being developed on the ground of scientific-research laboratory of material science and nanotechnologies. Structural parts preserve from destruction electronic memory modules, important mechanisms and assemblies, switching systems under long-term high-temperature exposure (from 100° C to 1100° C). The developments are performed in cooperation with the leading academic Scientific Research Institutes of RF.
Heat-absorbing heat-shielding compounds (supplied as a part of products) are intended to be used as irreversible thermal protection in the most important mechanisms, devices, and biological systems under long-term exposure to high temperature. The work over creation of multiuse heat-accumulating materials are being held.
Complex thermal shielding of memory card is standardized locked “joint-to-joint” parts of active and passive protection, based on nanostructure compounds of chemical and mineral substances and fibers.
Heat-absorbing heat-shielding compounds HSC (TZS, for its Russian initials) are intended to be used as irreversible thermal protection in the most important mechanisms, devices, and biological systems under long-term exposure to high temperature.
Heat-accumulating recoverable material HARM (TAMMI, for its Russian initials) is developed, method of producing of heat-accumulating parts and structures, based on the material.
High-performance heat-shielding material with low heat conductivity and an operation mode in a range of temperatures from minus 60°Ń up to plus 1000°Ń, not having analogues in Russia.