  The thermal characteristics of silicon between 15 and 300 deg K areinvestigated by applying a computer program on the solution of the differentialheat diffusion equation. The computer model is linked to high-purity siliconthrough a set of experimental data. The numerical results are given in graphicform and show, in particular, very short diffusion transit times across longdistances. The computed figures require experimental confrontations; a testset-up is proposed.
The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set of experimental data.