The effect of dispersion hardening on the regularities and mechanisms of the creep of copper with submicron grain sizes
Regularities and mechanisms of the creep of submicrocrystalline copper and Cu-1.1 vol % Al2O3 dispersion-hardened powder composite in a temperature range of (0.2–0.35) T m Cu have been investigated. The role that the grain-boundary state and dispersion-hardening material with Al2O3 nanosized (10–40 nm) particles plays in the development of plastic deformation during creep is analyzed.
Abstract A study has been made of surface diffusion in the evaporated thin film couple Ni-Au. Structural changes within the diffusion zone were examined by electron microscopy in situ . Apart from a slight migration of the layers, crystallization was quite pronounced. The results obtained by means of an electron microprobe analyser showed that the diffusion rate was higher than in the bulk.