This paper presents a comparative study of the efficiency of several embedded EMI protections for integrated circuits (ICs) with respect to direct power injection (DPI) and very fast transmission-line pulsing (VF-TLP) into the substrate of the IC. This study involves three functionally identical cores, differing only by their EMI protection strategies (RC protection, isolated substrate, meshed power supply network) which were initially designed for low-emission design guidelines. Through extensive measurements, a classification between these strategies is established for both injection methods, leading to the introduction of design guidelines for the minimization of conducted susceptibility to substrate injection.
This paper presents a comparative assessment of the electromagnetic immunity of 4 integrated logic cores to near-field injection. These cores, located on the same die, are identical from a functional point of view, but differ by their design strategies. The injection is performed above each core according to the 6 components of the electromagnetic field, using appropriate probes. These results demonstrate that the die and bondwires of an integrated circuit can be sensitive to both magnetic and electric fields, and that some design rules can improve the immunity of integrated circuits to near-field interference.
The principal impediment to gene therapy is the development of efficient, nontoxic gene carriers that can handle and deliver foreign genetic materials into various cell types, including healthy and...