Ultimate limits of conventional barriers and liners-implications for the extendibility of copper metallization
As allowable layer thicknesses shrink to the nanometer scale, metallization is facing fundamental limitations in the ability to extend conventional copper metallization schemes. The use of novel materials in the barrier/liner/seed stack can offer some relaxation of these roadblocks. For example, the development of a directly-platable barrier, thus avoiding the need to deposit a liner and seed, could offer potential benefits for scaling of copper past the 22nm generation. This talk will introduce some of these emerging options and describe their performance compared with conventional copper barrier seed-based interconnects.
The paper introducess the implemented conditions which colling recycle of flexible base on Ying-DaLine.It over all xpounds the investigation of road condlitions of original pavement,indoor trial study,determination of trial lot plan as well as completion of trial lot etc.