Micro/nano patterning characteristics in hot embossing process
The hot embossing process has been known as one of major nano replication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the hot embossing process, simple parametric studies for the embossing time have been carried out using high‐resolution masters which patterned by DRIE process and laser machining. Under different embossing times, the viscous flow of thin PMMA films into micro cavities under the compression force has been investigated. Also, the viscous flow during the embossing process was simulated by the continuum based FDM analysis considering micro/nano effect, such as surface tension and contact angle.
We present an asymptotic form of the Boussinesq equations in the limit of small P ´ eclet numbers i.e. when the time scale of motions is much larger than the time scale of ther- mal diffusion. We find that, in this limit, the effects of thermal diffusion and stable stratification combine in a single physical process. This process is an anisotropic dissipation (not effective for horizontal motions) which acts primarily on large scale mo- tions. The small-P´ eclet-number approximation presents also the great practical interest to avoid the numerical difficulty induced by the huge separation between the diffusive and dynamical time scales. The relevance of this approximation to study the flow dynamics within the stellar radiative zones is considered.