Upstream electromigration study on multiple via structures in copper interconnect
Upstream Electromigration (EM) study was performed on different multiple via structures with different Cu line dimensions. EM performance was found to be dependent on both via layout and Cu line dimension. Failure analysis showed different EM failure modes and diffusion paths on these structures with their different grain morphology. Finite element analysis is applied to find out the current density profiles of these structures and explain their EM results. Simulated resistance increase was found to be dependent on the size and location of EM induced void in these structures.
Aiming at Shenyang Metro in construction,analysis of influence of advance small duct grouting on metro tunnel excavation is conducted.By different layout in ring of small duct,based on surrounding rock stress and displacement of each monitored point of tunnel,the rational layout is given.which has important reference meaning to similar tunnel engineering.