Progress in study on detection of latent fingerprints by fuming with "502" glue
This article introduced the historical development and the present situation of the technology for detection of latent fingerprints by fuming with "502" super glue,while especially referring to its advantages and disadvantages and the methods for further improvements.
In this paper, we have presented an effective yield improvement methodology that can help both manufacturing ::: foundries, fabless and fab-lite companies to identify systematic failures. It uses the physical addresses of failing bits ::: from wafer sort results to overlay to inline wafer defect inspection locations. The inline defect patterns or the design ::: patterns where overlay results showed matches were extracted and grouped by feature similarity or cell names. The potentially problematic design patterns can be obtained and used for design debug and process improvement.