1. A method of processing a wafer comprising: receiving the wafer at a production tool, wherein the wafer is associated with a wafer process history; accessing a database to find data associated with previous wafers processed by the production tool with a same wafer process history, the data including records each associated with a wafer and at least one stored process parameter, wherein the accessing the database comprises querying the database and comparing a sum of a number of records associated with the previous wafers with the same wafer process history and a number of records associated with previously-stored data to a threshold wherein the comparing excludes one or more records having a value of a stored process parameter outside of an expected range, and wherein the expected range is based on at least one of a deviation relative to a mean, a deviation relative to a median, and a set percentile; determining, in response to the comparing meeting or exceeding the threshold, a process parameter using the data associated with the previous wafers with the same wafer process history; determining, in response to the comparing being below the threshold, the process parameter using the previously-stored data associated with the previous wafers processed by the production tool based on a regression of model parameters using the data associated with the previous wafers with the same wafer process history and that have a different wafer process history from the wafer process history by at least a single factor and by a least absolute deviation objective function; and processing the wafer with the production tool using the process parameter when a value of the process parameter exceeds a minimum amount relative to a previous value of the process parameter.