1. An electronic device comprising: a main housing encapsulating operative circuitry for the device; an attachment member moveably coupled to the main housing with a spring loaded hinge to maintain the attachment member in a closed position relative to the main housing; and an acoustical device positioned within the attachment member, the acoustical device communicatively coupled to the operative circuitry in the main housing, wherein the attachment member comprises a recessed portion for positioning the acoustical device within the attachment member; wherein an adhesive layer is positioned between the piezoelectric speaker and the attachment member and wherein a second adhesive layer is positioned over the piezoelectric speaker and a cover layer is positioned over the second adhesive layer, the second adhesive layer securing the cover layer to the piezoelectric speaker.