1. A method, in a data processing system, for monitoring temperature excursions an assembly experiences over a life of the assembly, the method comprising: determining, by a contributor module in the data processing system, if the assembly has been in service beyond a predetermined end of life objective; responsive to the assembly failing to be in service beyond the predetermined end of life objective, reading, by the contributor module, a new temperature value associated with the assembly; computing, by the contributor module, a modifier value for a figure of merit (FOM) value; adding, by the contributor module, the modifier value to a cumulative figure of merit value; comparing, by the contributor module, the cumulative figure of merit value to a cumulative stress figure of merit budget; and responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, implementing, by the contributor module, an identified stress management solution.