1. A device manufacturing method comprising: projecting a patterned beam of radiation onto a substrate; measuring values representative of a plurality of features of the pattern transferred to the substrate including values of at least one CD-profile parameter and at least one further feature profile parameter which is indicative of a machine setting of a monitored lithographic projection apparatus; storing a reference CD-profile parameter value and a reference feature profile value representative of the one further feature profile parameter; comparing the measured and reference values of the one further feature profile parameter; determining a corrected set of machine settings for use by the monitored lithographic apparatus dependent on the differences between the measured and reference values of the one further feature profile parameter and between the measured and reference values of the CD-profile parameter; and correcting the values of the machine settings according to the corrected set of machine settings.