1. A method for analyzing defect information, comprising: extracting defects generated on substrates by comparing data obtained from inspection of the substrates prior to processing the substrate by a prescribed process performed by a plurality of processing apparatuses in a thin-film device manufacturing process and data obtained from inspection of the substrates after processing the substrate by the prescribed process; and displaying information on a screen when a number of the extracted defects is greater than a preset number, the information including at least a processing history of the substrates processed by the prescribed process, and states of the processing apparatuses constituting the predetermined process.