1. A method of forming an embedded device build-up package, the method comprising: forming a first plurality of features over a packaging substrate, wherein the first plurality of features comprises a first feature and a second feature; forming at least a first crack arrest feature in a first crack arrest available region, wherein the first crack arrest available region is between the first feature and the second feature; forming a dielectric layer over the first plurality of features and at least the first crack arrest feature; forming a second plurality of features over at least the dielectric layer, wherein the second plurality of features includes a third feature and a fourth feature; and forming at least a second crack arrest feature in a second crack arrest available region, wherein: the second crack arrest feature is between the third feature and the fourth feature; and the second crack arrest feature is substantially orthogonal to the first crack arrest feature.