1. A method of providing printability analysis for a defect on a physical mask, the method comprising: generating a simulated wafer image of the physical mask; generating a simulated wafer image of a reference mask, the reference mask corresponding to a defect-free physical mask; identifying a first feature proximate to the defect on the simulated wafer image of the physical mask; identifying a second feature on the simulated wafer image of the reference mask, the second feature corresponding to the first feature; and comparing the first and second features to provide the printability analysis.