1. A fingerprint sensor arrangement comprising at least one driver electrode and at least one sensor electrode for a capacitive measurement, and an integrated signal processing circuit for the measurement of signals from the electrodes, and interconnecting wiring between the electrodes and the integrated circuit, wherein the arrangement further comprises a substrate of flexible material that forms at least part of said sensor, and the at least one driver electrode, the at least one sensor electrode, said signal integrated circuit and said interconnecting wiring are embedded within an integrated module and wherein said interconnecting wires are metallizations between polymer layers, and said at least one driver electrode and/or said at least one sensor electrode is metallization between polymer layers.