1. A method for classifying failures of integrated circuit dies, comprising: analyzing failure data for each of a plurality of dies on a wafer with a plurality of failure classifiers to produce a corresponding plurality of failure classification results for each die, wherein the failure data for each die combines bin map failure data, electrical analysis data and physical failure data for the die; and for the failure data for each die, analyzing the plurality of failure classification results to assign a particular one of a plurality of failure classifications to each die, wherein analyzing comprises analyzing the plurality of failure classification results with a preference towards assigning a wafer level failure classification to failure data for a die when any of the plurality of failure classification results indicates a presence of a wafer level failure.