1. A method for inspecting a diced wafer that comprises multiple dice, the method comprises: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating unique features within the multiple images, at least partially during the acquiring; associating multiple unique features with multiple dice, at least partially during the locating, determining multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during the associating; and detecting defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determining.