1. A method, comprising: receiving first values for a plurality of recipe parameters associated with a first process recipe; receiving a first plurality of measurements of a plurality of locations on a first wafer processed using the first process recipe; receiving second values for the plurality of recipe parameters associated with a second process recipe; receiving a second plurality of measurements of the plurality of locations on a second wafer processed using the second process recipe; correlating, by a processing device, the first values for the plurality of recipe parameters to the first plurality of measurements and the second values for the plurality of recipe parameters to the second plurality of measurements; calculating, by the processing device, a first plurality of sensitivity values using the first values for the plurality of recipe parameters, the second values for the plurality of recipe parameters, the first plurality of measurements, and the second plurality of measurements, each of the first plurality of sensitivity values corresponding to one of the plurality of locations and representing a sensitivity to one of the plurality of recipe parameters; and providing, by the processing device, a graphical representation of a wafer that shows at least a subset of the first plurality of sensitivity values for the plurality of locations, wherein the graphical representation of the wafer is provided for subsequent analysis and manufacturing of wafers.