1. A device for detecting infrared radiation comprising: a substrate; a array of at least one line of elements for detecting said infrared radiation, each of said elements comprising a resistive imaging bolometer, said array being formed above the substrate; a read circuit for applying electrical stimuli to each imaging bolometer of said array to form an analog electrical signal constituting an image of said infrared radiation impinging on said array; a plurality of probes for measuring temperatures in a plurality of points of the substrate; an analog-to-digital converter for converting the analog electrical signals formed by the read circuit and the probe into digital values; a data processing unit comprising: a first memory space for storing digital values NC(i,j) corresponding to electrical signals from the array of imaging bolometers; a second memory space for storing a single set of parameters of a predetermined physical model of the electrical signals formed by the read circuit comprising: a first subset of parameters of a predetermined physical model of a resistance of the imaging bolometers as a function of the substrate temperature in the vicinity of each bolometer; and a second subset of parameters of a predetermined physical model of the electrical signals formed by the read circuit as a function of the resistance of the imaging bolometers; a third memory space for storing a set of parameters of a predetermined spatial model of the substrate approximating the temperature of the substrate in the immediate vicinity of each imaging bolometer based on temperatures of the substrate in said plurality of points thereof; a central processing unit for: correcting the digital electrical signal formed from each imaging bolometer according to the relation: 
 N corr ( i,j )= N brut ( i,j )− NC ( i,j )+ NC where: N brut (i,j) is the digital electrical signal from said bolometer, N corr (i,j) is the corrected digital electrical signal of said bolometer, and NC is the mean value of the digital values NC(i,j) stored in said first memory space; computing temperatures T mes (i,j) of the substrate in the vicinity of each imaging bolometer based on measured temperatures T mes — probe (k) in said plurality of points of the substrate and said set of parameters of said spatial model; computing resistances R est (i,j) of the imaging bolometers based on said computed temperatures T mes (i,j) in the vicinity of each imaging bolometers and said first subset of parameters of said physical model of a resistance; computing digital values NC(i,j) based on said computed resistances R est (i,j) of the imaging bolometers and said second subset of parameters of said physical model of the electrical signals; and overwriting said computed digital values NC(i,j) in said first memory space.