1. A pattern matching processing system for conducting a pattern matching of an input image data with a previously prepared reference recognition pattern when an alignment of a plurality of pads in a semiconductor chip with a lead frame having a plurality of leads respectively coupled via bonding wires or a substrate having the leads formed therein is conducted, said input image data containing data being obtained by picking up an image of at least a portion of said leads, which are objects for the alignment, said system comprising: a storage unit configured to store first image data, obtained by picking up an image of said lead frame or at least a portion of said substrate serving as a first object, and second image data, obtained by picking up an image of said lead frame or at least a portion of said substrate serving as a second object that is different from said first object, respectively, and also storing one of said first image data and said second image data as an ordinary recognition pattern and an other as an auxiliary recognition pattern, said first image data and said second image data serving as said recognition pattern; a recognition unit configured to conduct a recognition of said input image data via a first pattern matching with said ordinary recognition pattern stored in said storage unit, said recognition unit conducting a second pattern matching with said auxiliary recognition pattern stored in said storage unit if an error is generated in said first pattern matching; and an assignment-processing unit configured to assign said auxiliary recognition pattern to said ordinary recognition pattern, and assigning the pattern, which was originally assigned to said ordinary recognition pattern, to new auxiliary recognition pattern, on the basis of results of said first pattern matching with said ordinary recognition pattern and said second pattern matching with said auxiliary recognition pattern by said recognition unit.