1. A lead frame, comprising: a frame body made of a conductive material and including at least one opening for mounting a semiconductor chip; a die pad placed in the opening of the frame body; and a group of leads extending from the frame body into the opening, the group of leads including at least: a first lead connected to the frame body and including a first bonding pad provided on an upper surface of the first lead and a first land provided on a lower surface of the first lead; a second lead connected to the frame body and including a second bonding pad provided on an upper surface of the second lead and a second land provided on a lower surface of the second lead; and a third lead connected to the first lead and including a third bonding pad provided on an upper surface of the third lead and a third land provided on a lower surface of the third lead, wherein a connecting portion that is thinner than the lead frame body and that can be punched through is provided between the first lead and the third lead.