1. A method for analyzing a component mounting board, comprising: when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed, generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board; generating a multilayer component shell model divided by element division lines based on a bonding position to the surface of the multilayer wiring board of the component; redividing a mounting position of the component of the multilayer substrate shell model with the element division lines used upon generating the multilayer component shell model; forming an analysis model by bonding a neutral substrate plane computed from the redivided multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component; and computing deformation by applying boundary conditions to the analysis model.