1. A system for performing voltage contrast inspection, comprising: an electron microscope, the electron microscope configured and disposed to acquire a plurality of voltage contrast images, each voltage contrast image corresponding to a different acquisition time; an image analysis module, the image analysis module comprising a central processing unit, and non-transistory storage containing instructions that when executed, computes a number of defect counts in each voltage contrast image, thereby establishing a number of defect counts corresponding to each acquisition time, and records the optimal voltage contrast acquisition time (OVA) for said at least one location on a wafer; and generates a voltage contrast inspection configuration, wherein the voltage contrast inspection configuration comprises at least one wafer OVA time which is the OVA time for inspection of the at least one location on the wafer.