1. A method comprising: specifying a first thermal analysis region of an integrated circuit; applying a first grid determining function to the first thermal analysis region with inputs comprising a power distribution of the integrated circuit; applying a second grid determining function to a second thermal analysis region that extends outward from at least a portion of the first thermal analysis region; and performing at least a portion of a thermal analysis of the integrated circuit in accordance with first and second grid resolutions respectively determined by the first and the second grid determining functions.