1. A method for generating a model for detecting process non-compliance, comprising: receiving a plurality of wafer images, each wafer image of the plurality of wafer images comprising a set of die images; receiving an inspection result of each die corresponding to the set of die images; generating segment masks based on the die images of each set of die images and one or more segmentation types, wherein each segment mask is configured to mask noise such that only a portion of one of the die images is shown; applying, using a processor, each segment mask to each die image to create a masked die image, and calculating a set of metrics for each masked die image; and identifying, using the processor, one or more statistically significant combinations of metric, segment mask, and wafer image, based on the die inspection results to generate a detection model.