1. A semiconductor device, comprising: a wiring board including a first surface, a first wiring formed over the first surface, and an insulating film formed over the first surface; a semiconductor chip mounted over the first surface of the wiring board; and a first wire electrically coupling a first pad of the semiconductor chip to the first wiring, wherein a part of the first wiring is exposed from a first opening of the insulating film, wherein, in plan view, the first opening of the insulating film has a plurality of sides, wherein, in plan view, a first side of the plurality of sides and a second side of the plurality of sides facing the first side are extended along a first direction, wherein, in plan view, a third side of the plurality of sides and a fourth side of the plurality of sides facing the third side are extended along a second direction intersecting with the first direction, wherein, in plan view, the part of the first wiring is extended from the first side of the first opening to the second side of the first opening along the second direction, wherein, in plan view, the part of the first wiring has a first area and a second area, wherein, the first area has a first part, and a second part being adjacent to the first part and also intersecting with the second side of the first opening in plan view, wherein, in plan view, the second area is protruded from the first part of the first area of the first wiring toward the third side of the first opening, wherein, in plan view, the part of the first wiring has a fifth side which is parallel to the fourth side of the first opening and extending from the first side of the first opening to the second side of the first opening, wherein, in plan view, the second part of the first area has a sixth side which is parallel to the third side of the first opening and extending from the second area of the part of the first wiring to the second side of the first opening, wherein, in plan view, the third side of the first opening and the sixth side of the second part are facing to each other, wherein, in plan view, the fourth side of the first opening and the fifth side of the part of first wiring are facing to each other, and wherein the first wire is coupled to the first part of the first area of the part of the first wiring.