1. A measurement equipment comprising: a rack; a first camera disposed on the rack; a second camera disposed on the rack, the first camera and the second cameras disposed at different positions relative to a to-be-measured object; a third camera disposed on the rack; a fourth camera disposed on the rack, the third camera and the fourth cameras disposed at different positions relative to the to-be-measured object; and a processing device connected to the first camera, the second camera, the third camera, and the fourth camera, wherein the first camera and the second camera are configured to capture an entire image of the to-be-measured object, the entire image of the to-be-measured object is captured by the first camera and the second camera by simultaneously focusing on the to-be-measured object, the third camera and the fourth camera are configured to capture a plurality of local images of a plurality of local areas of the to-be-measured object, and each of the local images is captured by the third camera and the fourth camera by simultaneously focusing on a corresponding one of the local areas of the to-be-measured object; wherein the processing device is configured to analyze the entire image and the local images to obtain in-plane deformation, distortion and warpage of the to-be-measured object.