1. A color solid-state image pickup device including a plurality of photoelectric conversion areas provided in an array pattern on a surface of a semiconductor substrate, and a light-shielding film, wherein the inside of each of said photoelectric conversion areas is two-dimensionally partitioned into a plurality of segments which output a plurality of photoelectric conversion signals of different spectral sensitivities using transfer electrodes, wherein an aperture in said light-shielding film corresponds to at least two of said segments in one of said photoelectric conversion areas, and wherein the diameter or diagonal dimension of said aperture is smaller than the diameter or diagonal dimension of said one photoelectric conversion area, and is larger than a dimension of at least one segment, wherein said plurality of different spectral sensitivities include red, green and blue of primary colors, and the diameter or the diagonal dimension of each said aperture satisfies the formula λ≦t≦2λ wherein t represents the diameter or the diagonal dimension of said aperture and λ represents the wavelength 0.650 μm of a red color, and wherein a distance between two of said transfer electrodes is smaller than a distance across segments adjacent to said two transfer electrodes, the image pickup device further comprising an element isolation zone arranged between the segments in one photoelectric conversion area, wherein the transfer electrodes are formed so as to avoid said element isolation zone and to exist between said photoelectric conversion areas.