1. A memory module, comprising: at least one memory chip; and a first intelligent chip coupled to the at least one memory chip and adapted to be coupled to a memory controller, wherein the first intelligent chip is configured to implement at least a part of a reliability and serviceability (RAS) feature; and a second intelligent chip coupled to the at least one memory chip and adapted to be coupled to the memory controller, and a sideband bus that couples the first intelligent chip to the second intelligent chip, wherein the second intelligent chip is configured to transmit a signal to the first intelligent chip to turn off an output buffer associated with the first intelligent chip.