1. A method of manufacturing at least one wafer or chip, comprising: obtaining image data of the at least one wafer or chip dynamically during a production wafer test of the at least one wafer or chip; correcting the image data to remove normal variation within the image data wherein correcting the image data comprises: obtaining at least one of test parametric data, test state data, and process data for the at least one wafer or chip; comparing at least one of the test parametric data, the test state data, and the process data to historical data for other wafers or chips already fabricated to determine similar wafers or chips to that of the at least one wafer or chip; generating an image mask based on the historical data for the determined similar wafers or chips; and applying the image mask to the at least one wafer or chip thereby removing normal variation within the image data; comparing the corrected image data to image data for at least one other wafer or chip to determine whether the corrected image data for the at least one wafer or chip shows a defect or anomaly beyond that of the normal variation; and placing the at least one wafer or chip into a category of fabrication based on the comparison.