1. A computer-implemented method for binning defects detected on a wafer, comprising: comparing portions of design data proximate positions of the defects in design data space; determining if the design data in the portions is at least similar based on results of said comparing; binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar; and storing results of said binning in a storage medium.