1. A method for analyzing areas in a mask having features with a potential to fail, comprising: simulating a lithography process for a mask to produce a simulated image; identifying areas in the mask having features with a potential to fail in the simulated image; categorizing the areas in the mask having features with a potential to fail into groups; prioritizing the groups of areas in the mask having features with a potential to fail; implementing a sampling plan for obtaining data about the prioritized groups of areas in the mask having features with a potential to fail; and analyzing the data to determine which areas in the mask having features with a potential to fail should be changed in order to increase production yield.