1. An edge inspection method for detecting defects on a wafer edge normal surface, the method comprising: acquiring a set of digital images capturing a circumference of the wafer; determining an edge of the wafer about the circumference of the wafer; segmenting each digital image into a plurality of horizontal bands; combine adjacent edge clusters about the circumference of the wafer into edge pixel bins; analyze the edge pixel bins via edge cluster analysis to identify defects; and analyze the edge pixel bins via blob analysis to identify defects.