1. A method of fabricating semiconductor wafers using automatically detected failure patterns, comprising: forming respective wafer fingerprints by selecting a respective object of one or more objects in a respective wafer map of a plurality of wafer maps; determining a respective feature in each of the respective wafer maps using the respective selected object, classifying a respective pattern for each of the respective wafer maps using the respective determined feature and stored pattern information, and identifying a semiconductor wafer fabrication process or tool requiring adjustment using the respective wafer fingerprints formed for each of the plurality of wafer maps, wherein at least one of the forming, determining, classifying and identifying steps is performed by a computer.