1. A method for inspecting a wafer comprising: capturing a plurality of images of at least one region of at least a first wafer, each wafer being of an unknown quality, each of the plurality of captured images being captured using a predetermined contrast illumination, each of the plurality of captured images comprising a plurality of pixels; determining a plurality of reference intensities for each of the plurality of pixels of each of the plurality of captured images based on a plurality of statistical parameters; deriving at least one golden reference image from the plurality of captured images; capturing an image of a region of a second wafer, the second wafer being of an unknown quality; selecting a first golden reference image from the at least one golden reference image; and comparing the captured image of the region of the second wafer with the first golden reference image to thereby determine at least one of presence and type of defect on the second wafer.