1. An ultrasonic bonder comprising: a support structure configured to support a workpiece during an ultrasonic bonding operation; a clamp finger for securing a portion of the workpiece against the support structure during the ultrasonic bonding operation; an imaging system; and an overlay configured to be imaged by the imaging system in relation to at least one of the support structure and the clamp finger, wherein the overlay is configured to assist in the alignment of at least one of the support structure and the clamp finger in connection with a position of the support structure or the clamp finger included in the overlay, wherein the overlay defines a relative position of at least a portion of at least one of (i) the clamp finger with respect to at least one reference position of a reference material handling system and (ii) the support structure with respect to at least one reference position of a reference material handling system.