1. A method of inspecting an edge of a semiconductor wafer comprising: capturing an image of a wafer edge from generally above a plane of the wafer; identifying a location of the wafer edge from the previously captured image; focusing an imaging device positioned generally radially outwardly from the edge of the wafer; illuminating at least a portion of an edge normal surface of the edge of the wafer using at least one of brightfield and darkfield illumination; capturing at least one image of the at least a portion of the edge normal surface of the edge of the wafer; and processing the at least one image with a controller to identify a defect on the edge of the wafer, if any.