1. A bump inspection apparatus for IC components, the apparatus comprising: a tray holding device for holding a component housing tray which houses a plurality of IC components, the plurality of IC components having respective bump-formation surfaces with a plurality of bumps formed in predetermined formation positions thereon, the plurality of IC components being arranged separately in an array with respective bump-formation surfaces facing up; an image-pickup device for picking up images of respective IC components housed in the component housing tray; and a control device for controlling the image-pickup device, the tray holding device, and inspection processing of bumps using the picked up images, wherein the image-pickup device comprises: an image-pickup camera unit for picking up one or more overall images of an IC component, the image-pickup camera unit having an optical axis along a direction approximately orthogonal to a bump-formation surface of the IC component; and an image-pickup optical-axis positioning unit for aligning the optical axis of the image-pickup camera unit with an approximate center position of the IC component, the control device comprises: a component position recognition portion for recognizing a position of the IC component on a basis of at least one of the one or more overall images picked up by the image-pickup camera unit; a bump inspection region setting portion for acquiring bump inspection images of respective bumps on the IC component from the one or more overall images on a basis of a position recognition by the component position recognition portion and the predetermined formation positions; and an inspection processing portion for determining positions of the respective bumps on a basis of the bump inspection images and determining degrees of crush of vertex portions of the respective bumps, and the tray holding device comprises: a pair of support members for supporting lower sides of respective opposing end portions of the component housing tray; a pair of pressing-and-holding members for pressing respective opposing end portions of the component housing tray from an upper side, so as to correct warp or deflection of the component housing tray and hold the component housing tray in an approximately horizontal posture; and a pressing-and-holding member movement device for integrally moving the pair of pressing-and-holding members between a holding position for holding the component housing tray and a holding cancel position.