1. A non-destructive solder joint inspection system for inspecting an electronic package for defects associated with solder joints disposed within the package, the system comprising: a laser module to producing a pulsed laser beam used to excite at least one device containing a plurality of solder joints to vibrate the device; an interferometer module disposed to sense vibration displacements created in the at least one device by the pulsed laser beam; and a system controller to receive vibration data from the interferometer and use the vibration data to generate a virtual reference, and wherein the system controller compares the virtual reference against the device to determine whether the device contains defects.