1. An on-wafer method for assembling a large microbolometer infrared imaging array from sub-arrays comprising the steps of: providing a wafer; and forming a super-array assembly of independent imaging arrays on said wafer as the imaging sensor is being processed without stitching or mechanically-butting, whereby seams or gaps in a resulting image are avoided; said forming including modifying edge design of a plurality of focal plane arrays (FPAs); modifying at least one FPA with mirroring; modifying at least one FPA for left and right-handed versions; providing reticles; and forming an array from a plurality of said modified FPA subarrays on said wafer, whereby gaps in a resulting image are avoided.