1. A method for adjusting an imaging magnification of a semiconductor inspection apparatus, the method for adjusting the imaging magnification comprising the steps of: obtaining coordinates of a first point, a second point, a third point and a fourth point at which points a line segment representing a change in concavity and convexity in design data, first intersects a line segment drawn in a first direction from a reference point representing a portion to be measured by the semiconductor inspection apparatus, a line segment drawn in a second direction against said first direction, a line segment drawn in a third direction different from said first and said second directions, and a line segment drawn in a fourth direction against said third direction, respectively; obtaining lengths of a line segment between said first and said second points and a line segment between said third and said fourth points on the basis of said four coordinates; and setting an imaging magnification such that points on a semiconductor sample corresponding to both end points of the shorter line segment of said two line segments are included in a field of view imaged by the semiconductor inspection apparatus.