1. A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry comprising: for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value within a predetermined distance from a drilling location with respect to a blind via geometry value to be formed at the drilling location; and setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via formation.