1. A semiconductor device assembly, comprising: an interposer including a substrate with an opening therethrough; at least one semiconductor device positioned adjacent to a first surface of the interposer, at least partially over the opening, a bond pad-bearing surface of the at least one semiconductor device facing the opening, at least one bond pad of the at least one semiconductor device communicating electrically with a corresponding bond pad on the first surface of the interposer; and at least another semiconductor device positioned adjacent to a second surface of the interposer, at least partially over the opening, a bond pad-bearing surface of the at least another semiconductor device facing the opening, at least one bond pad of the at least another semiconductor device being in electrical communication with at least one bond pad of the at least one semiconductor device by way of a discrete conductive element that extends through the opening without contacting the substrate.