1. A system configured to detect design and process defects on a wafer, comprising: an electron beam review subsystem configured to acquire images for a wafer on a design is printed by a manufacturing process; and a computer subsystem configured to: inspect the design to detect defects in the design; compare an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database to detect additional defects in the design; determine locations on the wafer at which the images are acquired by the electron beam review subsystem based on the defects in the design, the additional defects in the design, and defects detected on the wafer by a wafer inspection system, wherein the electron beam review subsystem acquires images at the locations determined by the computer subsystem; detect design defects and process defects at the locations based on the images acquired at the locations by the electron beam review subsystem; and compare the images acquired at the locations by the electron beam review subsystem with design clips corresponding to the design defects and the process defects to compare the images to design intent, wherein the design clips are extracted from design data for the design of the wafer, and wherein the design data is generated prior to creation of the wafer for which the images are acquired.