1. A pattern inspection system, based on a defect image that exists in a circuit pattern and positional information of the defect, in which an image of a region including the defect with higher resolution than the defect image is retrieved, comprising: a plurality of files which store a defect image and positional information of the defect; means for selecting a file from the plurality of files; a sample stage holding a sample to be inspected which holds a defect image corresponding to the selected file; electron beam optics which radiate an electron beam to the sample to be inspected; a detector unit including a plurality of detectors which detect a secondarily generated signal attributable to the electron beam; a review condition file which stores an electron beam radiating condition and signal detecting condition, corresponding to review modes of retrieving an image; means for selecting a review mode from the review condition file; an electron optic control unit which controls the electron beam radiating condition of the electron beam optics; and a detector unit control unit which controls a signal detecting condition of the detector unit; wherein one of the electron optic control unit and the detector unit control unit changes one of the electron beam radiating condition and the signal detecting condition; and wherein an image of the region including a position of the defect image selected by the file selecting means with higher resolution is retrieved.