1. A lead frame for an integrated circuit (IC), the lead frame comprising: a plurality of inwardly extending leads formed of a conductive metal, each lead having: a first surface substantially parallel to a common plane and having a first feature proximate an inward end of the lead, wherein the first feature protrudes from the first surface, and a second surface opposite the first surface having a second feature further from the inward end of the lead than the first feature, wherein the second feature protrudes from the second surface and wherein the plurality of leads form an opening within the leads into which the IC is insertable, wherein the opening is approximately a size of the IC.