1. An apparatus forming an overmolded dual in-line memory module (DIMM) cooling structure, the apparatus comprising: a DIMM that includes a portion with attached memory chips; a mold that surrounds the portion of the DIMM with attached memory chips; and a thermal material that is injected into the mold, surrounds the portion of the DIMM, and forms a thermal interface between the DIMM and a cooling manifold that includes a liquid cooled pipe; wherein the thermal material includes a manifold engagement surface to lock the thermal interface to the cooling manifold.