1. A method for recognizing a defect image associated with a semiconductor substrate, comprising: collecting defect data of the defect image by testing and measuring the semiconductor substrate; extracting a defect pattern from the defect data; normalizing a location, orientation, and size of the defect pattern, wherein the normalizing includes determining a center of the defect pattern and shifting the defect pattern such that the center of the defect pattern is shifted from a first location of the semiconductor substrate to a second location of the semiconductor substrate; identifying the defect pattern after the normalizing by comparing the normalized defect pattern with standard defect patterns; performing a failure mode analysis based on the normalized defect pattern; and fabricating a semiconductor wafer based on the failure mode analysis.