1. A method for producing a semiconductor device comprising a process step of forming a device configuration pattern in a device formation region in a chip formation region on a film side of a semiconductor wafer having the film for forming a pattern, and forming inspection patterns in a plurality of inspection regions in the chip formation region, and an inspection step, wherein the inspection patterns have a repeat pattern having identical lines and identical spaces formed in a first inspection region in the plurality of inspection regions, and a uniform pattern having no space, formed in a second inspection region in the plurality of inspection regions, the inspection step has at least a pattern inspection step including a first inspection to measure a parameter of the repeat pattern alternately provided with the line and space in a repeat direction in the first inspection region, by using an optical measurement method capable of measuring a three-dimensional pattern shape, and a second inspection to measure a film thickness of the uniform pattern in the second inspection region by using an optical measurement method capable of measuring the film thickness.