1. A method, comprising: generating a layout of an electronic circuit; generating abstract data at a level of a substrate that are associated to the layout of said electronic circuit; generating a grid of partitioning, with respect to a view regarding said abstract, into meshes and nodes and applying said grid to said substrate; and extracting, on the basis of said grid, a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of portions or elements of said substrate, wherein said netlist is configured for use in simulation operations, in particular of a SPICE type, for making an evaluation of thermal effects in said electronic circuit.