1. A method for analyzing fail bit maps comprising: inputting positions of failures in wafers; preparing sections on the wafers; calculating feature amounts configured to represent distributions of the failures in the wafers for each of the sections by at least one numerical value; calculating a first numerical value configured to represent a degree of similarity between the feature amounts of the wafers; and detecting another wafer having the first numerical value greater than a predetermined first threshold for each of the wafers, and forming similar wafer groups of the wafers having the distributions of the failures similar to each other.