1. A computer-implemented method for determining different process windows for a wafer printing process for different reticle designs, comprising: generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process; detecting defects in each of the different reticle designs using the simulated images; and determining a process window for the wafer printing process for each of the different reticle designs based on results of said detecting.