1. A ball grid array assembler and inspection system for affixing electronic components to printed circuit boards, said system comprising: a ball grid array attachment device; an X-ray inspection assembly adapted to produce an X-ray image of a ball grid array region; and a computer operatively connected to said ball grid array attachment device and said X-ray inspection assembly; said computer operating under the control of software to control operation of said ball grid array attachment device in cooperation with said X-ray inspection assembly.