1. A defect inspection method, comprising: imaging a same region of a sample in a plurality of image acquisition conditions using an image acquiring section comprising a plurality of image acquiring portions each of which is configured for a different image acquisition condition with respect to each other to acquire a plurality of images for said same region of the sample; storing said plurality of images in a plurality of image storing buffers corresponding to said plurality of image acquiring portions; extracting a defect candidate from each of the plurality of images using a defect candidate extracting section comprising a plurality of defect extracting portions each coupled to a corresponding one of the plurality of image storing buffers; clipping a partial image including the extracted defect candidate and a neighboring image of the defect candidate from the plurality of acquired images stored in a corresponding plurality of said image storing buffers using a controller configured to clip said partial image based on coordinate position information of the extracted defect candidate; obtaining feature quantities of the defect candidates in the plurality of clipped partial images using at least one defect determining section, said feature quantities comprising one or more of a difference between an inspection image and a reference image, a brightness variation between dies having same coordinates, a differential image variation in a pattern similar to a defect candidate of the reference image, and an edge strength of the reference image; associating, using said at least one defect determining section, the defect candidates that have the same coordinates and are detected in conditions in which the image acquisition condition is different among the extracted defect candidate; extracting, using a defect extracting section, a defect from among the associated defect candidates based on multi-dimensional feature quantity space data of feature quantities of the associated defect candidates; and outputting using a display information of the extracted defect.