1. A system for evaluating a multi-crystalline wafer comprising: an imaging apparatus; and a computing device coupled to the imaging apparatus, the computing device comprising a processor and a non-transitory computer readable medium coupled in communication with the processor and containing instructions that, when executed by the processor, cause the processor to: capture a plurality of images of the multi-crystalline wafer in the imaging apparatus, at least three images of the plurality of images illuminated in the imaging apparatus in accordance with different lighting parameters; stack and project the plurality of images to generate a composite image to display at least one enhanced boundary of one or more grains of the multi-crystalline wafer; analyze the composite image to identify the one or more grains of the multi-crystalline wafer based at least in part on the at least one enhanced boundary; and generate a report based on the analysis of the composite image.