1. A control system for manufacturing apparatuses, comprising: a manufacturing information input unit configured to acquire time series data of apparatus parameters controlling a plurality of manufacturing apparatuses, the manufacturing apparatuses performing a sequence of manufacturing processes on wafers so as to manufacture semiconductor devices; a failure pattern classification unit configured to classify in-plane distributions of failures in each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by a plurality of algorithms so as to calculate a plurality of indices corresponding to the respective algorithms; an index analysis unit configured to provide first and second frequency distributions of the indices so as to implement a significance test between the first and second frequency distributions, the first and second frequency distributions categorized with and without the target failure pattern respectively; and an abnormal parameter extraction unit configured to extract a failure cause index of the target failure pattern by comparing a value of the significance test with a test reference value.