1. A pattern inspecting method comprising the steps of: picking up an image of a substrate with a pattern formed thereon; subjecting a signal obtained by the image pick-up to A/D conversion to afford a digital signal; comparing the digital image with a stored reference image in a first inspecting condition to detect first defect candidates; storing images of the detected first defect candidates together with information on feature quantities of the images of the first defect candidates; extracting second defect candidates from among the first defect candidates, using the stored images of the first defect candidates and the stored information of feature quantities of the images of the first defect candidates; and displaying on a screen a state of distribution of the extracted second defect candidates on the substrate.