1. A wafer inspection method for inspecting a processed face of a wafer processed by grinding and polishing, comprising: an image pickup step of picking up an image of the processed face of a wafer held on a chuck table; and a first image creation step of delimiting picked up image data obtained by the image pickup at the image pickup step for each predetermined region and extracting a pixel having a pixel value higher than those of peripheral pixels as a characteristic point in the predetermined region to create a first image.