1. A semiconductor measurement method to determine an optimal position of a group of n shots to be measured from a plurality of m shots of a semiconductor wafer, the method comprising: selecting a group of n shots to be measured from a plurality of m shots of a semiconductor wafer; obtaining overlay alignment errors of the group of n shots; detecting erroneous data in the measurement of the overlay alignment errors for each of the n shots; and restoring the erroneous data with estimated good data using a second or higher order regression analysis model, wherein the method includes establishing an optimal criterion by a measurement system that maximizes (X T X) of a matrix X of a function for the second or higher order regression analysis model.