1. A method for operating a stacked-chip image sensor, wherein the stacked-chip image sensor comprises a planar array of image sensor pixels, an array of vertical conductive vias, and processing circuitry coupled to the planar array of image sensor pixels through the array of vertical conductive vias, the method comprising: with a portion of the image sensor pixels, capturing a first set of image data; with the processing circuitry, determining an integration time for the portion of the image sensor pixels based on the first set of image data; and with the processing circuitry, reading out a second set of image data from the portion of the image sensor pixels through the array of vertical conductive vias after the determined integration time.