1. A wafer edge inspection method comprising: acquiring a plurality of images about an edge portion of a wafer, each of the images comprising an array of pixels having a first dimension and a second dimension, each pixel of the array of pixels having a characteristic pixel value; generating a composite image of compressed pixel arrays by compressing each of the pixel arrays in the first dimension based on an average of the characteristic pixel values of the pixel across the first dimension and concatenating the pixel arrays; analyzing the composite image to evaluate a wafer feature; and modifying a wafer processing step in an edge inspection system based on the composite image.