1. A system for removing material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device, comprising: a stage for placing the device in a first position for receiving laser radiation to remove the material by ablation, and for placing the device in a second position for viewing one or more features along the outer surface of the device; an optical system configured to provide an exterior image, including one or more features along an exposed surface of the device, while the device remains in the second position; a laser; a viewing system for (i) displaying a captured image of the device, including one or more features interior to the protective surface, overlayed with the exterior image for simultaneous viewing of both images so that a position of a first feature present in the captured image can be viewed in relation to a position of a second feature in the exterior image; and (ii) for using a combination of the first feature position and the second feature position to define a region of the device for material removal; and a scanning system, including electro-optical components, for directing a beam from the laser along an ablative scan path for removal of the material from the defined region.