1. A high-resolution microfabricated feature in a deep recess comprising: a cavity in a substrate or wafer, wherein the cavity has a depth of 75 μm to 100 μm; a focusing pattern on a bottom of the cavity, wherein the focusing pattern comprises a trench formed using contact lithography; and a microfabrication feature formed at the bottom of the cavity using the focusing pattern to focus a high resolution lithography tool.