1. An electronic component mounting method for use with an electronic component mounting apparatus for mounting an electronic component to a board, the electronic component mounting method comprising: sucking the electronic component by a suction nozzle; acquiring image data of the electronic component through recognition of the electronic component sucked by the suction nozzle; concurrently processing the image data with a plurality of algorithms for detecting postures of components and generating a plurality of posture results; comparing the plurality of posture results with features of the electronic component stored in the electronic component mounting apparatus; selecting a posture result from the plurality of posture results; determining a corrected mounting position of the electronic component based on the selected posture result; and mounting the electronic component to the board using the corrected mounting position.