1. An integrated circuit package for housing an integrated circuit die, said package providing a reference plane in relation to an image plane of said die, said package comprising: a transparent window; a lower frame; and an upper frame bonded to said lower frame, said lower frame configured as a main housing with wiring traces on a front side and a recessed shelf for receiving a recessed cover on a rear side, said upper frame configured as a standoff for said transparent window, said upper frame configured to provide a stopping surface for positioning an integrated circuit die.