1. A system configured to detect design and process defects on a wafer, comprising: an electron bearer review subsystem configured to acquire images for a wafer on which a design is printed using a manufacturing process; and a computer subsystem configured to: inspect the design to detect defects in the design; compare an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database to detect additional defects in the design; determine locations on the wafer at which the images are to be acquired by the electron beam review subsystem based on the defects in the design, the additional defects in the design, and defects detected on the wafer by a wafer inspection system; and use the images acquired at the locations to detect design defects and process defects at the locations.