1. A semiconductor device, comprising: a wiring board including a first surface, a first wiring formed on the first surface, and an insulating film formed on the first surface; a semiconductor chip mounted on the first surface of the wiring board; and a first wire electrically connecting a first pad of the semiconductor chip with the first wiring, wherein a part of the first wiring is exposed from a first opening of the insulating film, wherein, in plan view, the part includes: a first area including a first part, and a second part, and a second area protruded from the first area at the first part, and wherein the first wire is connected to the first part of the first area.