1. A method of performing alignment of an array of probe tips of a probe card to corresponding contact pads for wafer probing applications, comprising the steps of: obtaining a backside image of a wafer; obtaining a mapping of contact pads lying on a top side of the wafer opposite the backside; overlaying the mapping of contact pads over the backside image so as to create an image showing the contact pads superimposed on the backside image of the wafer; selecting at least some of the contact pads as landing points; obtaining an image of the probe tips array; comparing the landing points to corresponding positions of the probe tips; and, if the positions of the probe tips are not aligned with the corresponding landing points, rotating the probe card to align the positions of the probe tips to the landing points.