1. A method for assessing data worth for analyzing a yield rate of wafers in a semiconductor manufacturing process based on a quality score, comprising the steps of: measuring physical properties and electrical properties of the wafers, which are represented in terms of data points in a multi-dimension matrix, wherein each of the data points is a multi-dimension vector corresponding to a controlled factor; transforming the plurality of the data points corresponding to the physical properties and the electrical properties of the wafers into a distance matrix with matrix distances, and the matrix distances representing differences of the plurality of the data points; expressing the differences between the data points recorded in the distance matrix using two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to retrieve loss information as a conversion error value corresponding to the distance matrix among the data points; calculating discriminating ability of the transformed two-dimension vectors and expressing the discriminating ability by an error rate of a discriminate; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating the quality score corresponding to the physical properties and the electrical properties of the wafers; wherein the quality score is used for assessing distinguish-ability of the data points, with the higher quality score corresponding to the higher distinguish-ability of the data points under the controlled factors.