1. A semiconductor package, comprising: a semiconductor chip having a first surface and a second surface; a plurality of leads disposed around the chip and having the same height as the semiconductor package, with strengthening structures being formed on sides of the leads; a plurality of connecting mechanisms formed on the leads and extending from surfaces of the leads toward the chip, for being electrically connected to the first surface of the chip; and an encapsulant for encapsulating the chip, the leads and the connecting mechanisms, with at least the second surface of the chip and upper and bottom surfaces of the leads being exposed to the outside of the encapsulant.