1. A computer-implemented method for determining a position of inspection data in design data space, comprising: using a computer system to performing the following steps: aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites; determining positions of the alignment sites on the wafer in design data space based on positions of the predetermined alignment sites in the design data space; determining a position of inspection data acquired for the wafer by the inspection system in the design data space based on the positions of the alignment sites on the wafer in the design data space; and determining a sensitivity for detecting defects on different portions of the wafer based on the position of the inspection data in the design data space, one or more attributes of design data in the design data space, and one or more attributes of the inspection data, wherein the one or more attributes of the inspection data comprise one or more image noise attributes, if one or more defects were detected in the different portions, or some combination thereof.