1. An imaging device comprising: an image sensor having rows and columns of image pixels partitioned into an array of sensor subsections; and an array of wafer lenses disposed over the image sensor, the array of wafer lenses comprising: a first wafer lens optically positioned to focus first image light onto a first sensor subsection of the array of sensor subsections, wherein the first sensor subsection includes first image pixels each located directly under the first wafer lens, the first image pixels comprising any pixel configured to receive via the first wafer lens a respective portion of the first image light, wherein, of the first image pixels, only a first rectangular subset of the first image pixels is configured to capture images; and a second wafer lens optically positioned to focus second image light onto a second sensor subsection of the array of sensor subsections, wherein the second sensor subsection includes second image pixels each located directly under the second wafer lens, the second image pixels comprising any pixel configured to receive via the second wafer lens a respective portion of the second image light, wherein, of the second image pixels, only a second rectangular subset of the second image pixels is configured to capture images; wherein the first sensor subsection and the second sensor subsection comprise third image pixels other than any image pixels that are to receive focused light from the array of wafer lenses, wherein the third image pixels are between the first image pixels and the second image pixels.