1. A computer-implemented method for classifying defects detected on a wafer, comprising: acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool, wherein an inspection process used by the wafer inspection tool to detect the defect is setup to detect defects having sizes that are below a resolution limit of the wafer inspection tool; and determining a classification of the defect based on at least the electron beam image and without input from a user, wherein said acquiring and said determining are performed using a computer system.