1. An image sensor comprising: a semiconductor die having a plurality of peripheral edges; a pixel array comprising a plurality of pixels fabricated on the semiconductor die, wherein the pixel array extends to locations adjacent to three peripheral edges of the semiconductor die; and control circuitry fabricated on the semiconductor die and configured to access the pixels of the pixel array, wherein the control circuitry is located along a fourth peripheral edge of the semiconductor die, and wherein none of the control circuitry is located within the pixel array.