1. An apparatus comprising: a plurality of focal plane arrays, each of said focal plane arrays having a plurality of pixel locations; memory having a plurality of memory locations in which operating parameters of each pixel location are stored; means for measuring the temperature of each of said focal plane arrays; a shared processing module comprised of a logic circuit coupled to said temperature measuring means for converting a measured temperature of each of said focal plane arrays to an address, said logic circuit coupled to said memory to read said operating parameters of each of said pixel locations from said memory; a read-out circuit coupled to each of said focal plane arrays for measuring radiant energy incident on said pixel locations; and a processing circuit coupled to said logic circuit and to said read-out circuit for processing said operating parameters of each pixel location from said memory device with said measured radiant energy incident on said addressed pixel location to provide a temperature compensated measurement for each of said pixel locations and, multiplexing circuitry coupled between each of said focal plane arrays and said shared processing module for the multiplexing of an electronic signal between said focal plane arrays and said shared processing module.