1. An edge inspection system comprising: an edge sensor having an inspection area for acquiring a plurality of images about an edge portion of a wafer; an image acquisition module for receiving the acquired images, each of the images having a first dimension and a second dimension; a composite image module for generating a composite image of compressed images, the composite image module comprising: an image concatenating module for stitching the images; and an image compression module for compressing the images in the first dimension; and an image analysis module for analyzing the composite image to evaluate a wafer feature.