1. A system, comprising: an overlay metrology tool configured to collect a raw overlay signature from at least one wafer; a measurement device configured to collect wafer geometry data from the at least one wafer; and an analyzer in communication with the overlay metrology tool and the measurement device, the analyzer configured to provide a wafer geometry aware scanner correction for the at least one wafer based on the raw overlay signatures and wafer geometry data collected, wherein the wafer geometry aware scanner correction is configured to: identify a particular wafer geometry group out of a plurality of wafer geometry groups that best matches wafer geometry of the at least one wafer, and apply at least one scanner correction value associated with the particular wafer geometry group to the at least one wafer.