1. A method for inspecting a surface of a wafer with regions of different detection sensitivity, comprising the steps of: acquiring an image of the surface of the wafer with the help of a detector; displaying the image of the wafer on a display; defining via the display using an input unit at least one region on the surface of the wafer that is subjected to a different detection sensitivity than the rest of the surface of the wafer, wherein the detection sensitivity specified for the regions on the surface is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity; and specifying parameters or a way of acquiring the image of the surface of the wafer for the regions on the surface of the wafer to be handled with a different detection sensitivity, also by using the input unit; wherein the at least one region of the surface of a wafer detected with a different detection sensitivity is defined by a polygon or a rectangle or an object which is edited by the user.