1. A process for laser drilling blind vias in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising: before blind via drilling, evaluating a relationship between a capture pad geometry value within a predetermined distance from a drilling location of a capture pad with respect to a blind via geometry value for a blind via to be drilled at the drilling location; and setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling, wherein the desired capture pad appearance is a subjective surface texture of the capture pad after blind via drilling.