1. A camera module comprising: a housing including an image capture device receiving portion and a lens unit receiving portion, said image capture device receiving portion including a plurality of discrete support members, each of said plurality of discrete support members having a bottom surface; a lens unit coupled to said lens unit receiving portion of said housing; an image capture device including a top surface and a bottom surface, said top surface including an image sensor array, said top surface of said image capture device directly contacting said bottom surfaces of said discrete support members with no intervening adhesive; and a circuit substrate coupled to said image capture device, said circuit substrate having a top surface and a bottom surface; and wherein said image capture device receiving portion of said housing further includes an upper wall from which each of said plurality of discrete support members extends and a side wall extending below said upper wall, said side wall including a bottom surface defining a perimeter around said image capture device receiving portion below said upper wall; said image capture device is mounted on said bottom surface of said circuit substrate; and said bottom surface of said side wall and said top surface of said circuit substrate define a gap between said bottom surface of said side wall and said top surface of said circuit substrate; and further comprising an adhesive disposed in said gap, said adhesive fixing said bottom surface of said side wall to said top surface of said circuit substrate.