1. A method for inspection recipe generation for automated inspection of semiconductor devices, comprising the following steps: using a reference data set for inspection recipe generation; running automatic inspection with an initial recipe on images of dies of the reference data set; classifying the detected inspection results from the automatic inspection and comparing the classified inspection results with an expert classification of defects in dies; automatically generating overkill and underkill numbers; and modifying inspection recipe parameters and repeating the automatic inspection if the detection and/or the classification is below a predefined threshold.