1. A method for inspecting a diced wafer that comprises multiple dice, the method comprises: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; wherein the multiple images are aligned with a frame coordinate system; locating unique features within the multiple images, at least partially during the acquiring; associating multiple unique features with multiple dice, at least partially during the locating, determining multiple transformations between multiple die coordinate systems and a global coordinate system, in response to locations of unique features and their associations with multiple dice, at least partially during the associating; and detecting defects in response to a comparison between dice and corresponding reference dice, and in response to the transformations, at least partially during the determining; wherein the determining of the multiple transformations between multiple die coordinate systems and a global coordinate system comprises (i) determining the relationships between the frame coordinate system to each die coordinate system, and (ii) calculating a transformation between each die coordinate system and the global coordinate system in response to: (a) a spatial relationship between the frame coordinate system and the global coordinate system, and (b) the relationships between the frame coordinate system and each of the die coordinate systems.