1. An apparatus for inspection of a wafer comprising: at least one illumination device that radiates an illuminating light beam onto a surface of the wafer, an image capture device that has a predefined spectral sensitivity and captures an image of an illuminated region on the surface of the wafer in a plurality of spectral regions, and a color modification device in order to modify the color spectrum of the illuminating light beam or that of the image that is acquired of the surface of the wafer, wherein the color modification device is designed in such a way that the color spectrum of the illuminating light beam, or that of the image that is acquired of the surface of the wafer, is adaptable to the spectral sensitivity of the image capture device.