1. A system for use in manufacturing semiconductor devices, the system comprising: an electrochemical processing tool comprising an electrode located at a central region of a platen, the electrode being adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool, and at least part of the electrode being viewable from above the platen when the electrochemical processing tool is operably assembled; and an image sensor capable of capturing an image of the viewable part of the electrode, the image sensor being positioned above the platen, and the image sensor adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.