1. A method semiconductor device design, comprising: providing design data having a geometric feature; preparing a base feature from the geometric feature, wherein the base feature has a substantially linear edge; determining a pseudo-dissection point on the base feature; performing at least one of adding a polygon and trimming a polygon from the base feature to form a modified feature, wherein the performing uses the pseudo-dissection point; performing optical proximity correction (OPC) process on the modified feature to generate an output design; and using the output design to fabricate a semiconductor device on a semiconductor substrate.