1. A wafer appearance inspection apparatus comprising: a light irradiation portion that irradiates light to an inspection target wafer; a detection portion that detects light reflected from the inspection target wafer; an image processor that converts, into an image, the light detected by the detection portion; an image display portion; an operation portion that inputs an operational instruction; an operation control portion that performs: defining, as a template image, a part of an image distortion editing wafer for which image processing is performed by the image processor; pattern match processing with an entire image of the image editing wafer using the template image; computing a pixel deviation of the image of the image editing wafer; editing the image of the inspection target wafer using the computed pixel deviation; determining an image region indicated by the operation portion; searching an image region, a surface profile pattern of which is similar to a surface profile pattern of the determined image region, from among other image regions of the edited inspection target wafer, and displaying the searched image region on the image display portion; and setting a sensitivity threshold for the image region indicated by the operation portion, and an inspection portion that inspects an appearance of the wafer based on the sensitivity threshold set by the operation control portion.