1. An imaging system comprising: a first image sensor array; a first optical system configured to project a first image on the first image sensor array, the first optical system having a first zoom level; a second image sensor array, the first image sensor array and the second image sensor array being fabricated on a single integrated circuit, the first image sensor array employing pixels of a first linear dimension and the second image sensor array employing pixels of a second linear dimension, a ratio of the first linear dimension and the second linear dimension being greater than 1.3 to 1; a second optical system configured to project a second image on the second image sensor array, the second optical system having a second zoom level, the second image sensor array and the second optical system are pointed in the same direction as the first image sensor array and the first optical system, the second zoom level being greater than the first zoom level such that the second image projected onto the second image sensor array is a zoomed in portion of the first image projected on the first image sensor array, and the first image sensor array includes at least four megapixels, and the second image sensor array includes about one-half or less than a number of pixels in the first image sensor array; first pixel circuitry configured to read image data from the first image sensor array; second pixel circuitry configured to read image data from the second image sensor array; an electronic global shutter configured to stop charge integration between the first image sensor array and the first pixel circuitry and between the second image sensor array and the second pixel circuitry at substantially the same time; and a photosensitive layer formed over a substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer.