1. A wafer alignment system, comprising A. a rotatable platform, B. an image acquisition device having a field of view that includes at least a portion of a wafer on the platform, C. an illumination source that illuminates at least a portion of the wafer, D. an image processor that is coupled to the image acquisition device and that processes an image showing one or more characteristics of the wafer in a first frame of reference, the image processor determining therefrom a position and/or orientation of the wafer, or a portion thereof, in a second frame of reference, and E. the image processor including a mapping element that maps coordinates in the first frame of reference to coordinates in the second frame of reference at each of a plurality of angles of rotation of the platform.