1. A computer implemented method for providing in-plane distortion (IPD) prediction, the method comprising: (a) generating, with one or more processors, a series of Zernike basis wafer shapes; (b) performing, with the one or more processors, finite element (FE) model based IPD prediction for the series of Zernike basis wafer shapes; (c) performing, with the one or more processors, higher order shape (HOS) based IPD prediction for the series of Zernike basis wafer shapes; (d) comparing, with the one or more processors, the FE model based IPD prediction and the HOS based IPD prediction of a particular Zernike basis wafer shape of the series of Zernike basis wafer shapes to determine whether said particular Zernike basis wafer shape produces large prediction differences between the FE model based IPD prediction and the HOS based IPD prediction; (e) storing, in memory, the Zernike basis wafer shapes that produce large prediction differences between the FE model based IPD prediction and the HOS based IPD prediction; and (f) configuring a process tool to compensate for at least one of overlay error or misalignment based on a HOS based IPD prediction for a given wafer utilizing the stored Zernike basis wafer shapes.