1. A CMOS type of image sensor module comprising: a substrate, and a circuit pattern integral therewith; a first semiconductor chip, having a CMOS sensor capable of picking up an optical image, mounted on an upper one of said sides of the substrate and wire-bonded to the circuit pattern; a second semiconductor chip, capable of processing a digital signal, mounted on a lower one of said sides of the substrate and wire-bonded to the circuit pattern; and a resin sealing unit comprising transparent polymeric material integrated with said substrate and encapsulating at least one of said first and second semiconductor chips.