1. A ball grid array (BGA) device produced according to a process comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead; receiving at least the bottom view and the side perspective view of the lead using a single camera; transmitting the bottom view and the side perspective view of the lead to memory as pixel values; determining a first lead reference pixel position in the bottom view; determining a second lead reference pixel position in the side view; and converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration.