1. A method to increase a reliability of packaged semiconductor integrated circuit dice, the method comprising: identifying a die cluster, the die cluster consisting of dice having failed an electrical test; identifying a core die from the die cluster; adding the core die from the die cluster to a weighted character map; adding at least one additional die from the die cluster to a weighted character map; assigning a weighting value to each of the dice added to the weighted character map; adding at least one tier of buffer dice to the weighted character map adjacent to each die on the weighted character map; and indicating dice from the die cluster and tier of buffer dice, thereby indicating dice not requiring packaging.