1. A method of inspecting position accuracy of conductive glue dispensed on a substrate, the substrate having at least one transfer pad and at least one check mark arranged neighboringly to the border of the at least one transfer pad, the method been performed after a conductive glue spot is formed on the at least one transfer pad, the method comprising: (a) capturing an image of at least one transfer pad by a video capturing element, (b) determining whether the conductive glue spot in the image matches a predetermined standard; and (c) reporting and warning when the conductive glue spot in the image does not match the predetermined standard.