Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB. COUNT 5
QSN1 Which type of construction is more expensive? ANS1 Through-hole QSN2 What type of boards end up with limited routing space in through-hole manufacture? ANS2 multi-layer QSN3 What force might damage a PCB if large components are surface mounted? ANS3 mechanical stress QSN4 What components can be surface mounted to save space? ANS4 small-sized SMD components QSN5 A component might not be able to be made any smaller because of its mechanical limitations or what other need? ANS5 power requirements