Ever-increasing demand for sustainable energy resources amplifies the need to improve the efficiency of existing power generation techniques and develop novel approaches across a broad swath of size scales. Waste-heat recovery through solid-state thermoelectric (TE) devices is one such approach that can contribute to robust small-scale energy scavenging and thermal management. Their widespread adoption may require new materials with high TE performance, typically measured by the dimensionless figure-of-merit \(ZT\)  [1]}. ZT is proportional to the power factor (PF), given by the product \(S^2 \sigma \)  of electrical conductivity \(\sigma \)  and the Seebeck coefficient \(S\)  squared. There is a well-established trade-off between \(\sigma \) , which increases with carrier concentration, and \(S\) , which decreases with it. Band-engineering techniques [2]}, [3]}, [4]} have been pursued to decouple this dependency and improve the PF by introducing sharp features in the electronic density-of-state (DOS), whose large slope benefits \(S\) . A complementary approach is by employing low-dimensional materials, such as graphene, that naturally possess a suitable DOS. Single-layer graphene (SLG) on hexagonal boron nitride (hBN) substrates has achieved the highest known room-temperature PF of 36 mW m\(^{-1}\)  K\(^2\)  [5]}. Beyond power generation applications, high-PF materials like graphene can enhance active cooling, which is vital for thermal management in electronic devices [6]}. Furthermore, graphene thermocouples exhibit the highest reported sensitivity [7]}, which can be used in reliable temperature sensors.
