In conclusion, we demonstrated the first high-power hybrid integrated transmitter on TFLN by flip-chip bonding a DFB laser. The bonding design allows efficient thermal anchoring for the laser which allowed uncooled operation with up to 60 (25) mW in the passive (active) waveguides. Our high-power transmitter platform will enable a new class of applications in digital and analog communication spaces. Beyond communication systems, integrating high-power lasers on other TFLN devices such as EO [1]} and Kerr combs [2]}, [3]} enables a critical step towards realizing fully-integrated spectrometers [4]}. Additionally, other exciting frontiers include optical remote sensing and beam forming [5]}, photon pair generation [6]}, and efficient frequency conversion [3]}, [8]} for realization of quantum networks. Future work would focus on realization of fully-integrated photonic links through integrating high-power and high-bandwidth photo-detector on TFLN platform [9]}. Recently, a complementary approach to TFLN-laser integration has been reported
[10]}.
