Supposedly, 2015 has been a busy year for Enya. However, we do not have any detailed information on what Enya is doing these days.
The National Electrical Contractors Association (NECA) recently published NECA-BICSI-607-2011, Standard for Telecommunications Bonding and Grounding Planning and Installation Methods for Commercial Buildings (ANSI). The new standard was jointly developed between NECA and Building Industry Consulting Service International (BICSI).
Copper wire has become one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications. Copper is used for fine wire ball bonding in sizes up to 0.003 inch (75 micrometres).