1. Field of the Invention
The present invention relates to polyetherimide/poly(arylene sulfide) blends compatibilized with an epoxy compound, and more particularly relates to reinforced polyetherimide/poly(arylene sulfide) compatibilized blends.
2. Description of the Related Art
Compositions comprising blends of poly(phenylene sulfide) and polyetherimdes have been disclosed in U.S. Pat. No. 4,455,410 (Giles).
Compositions comprising a poly(arylene sulfide) resins, an epoxy compound, and optionally another thermoplastic resin, a reinforcing material, a filler and/or a fire retardant have been disclosed in U.S. Pat. No. 4,528,346 (Sugie). This patent further lists numerous possible other thermoplastic resins, and specifically sets out polyesters, polyamides, polyarylates, polycarbonates, poly(phenylene oxide)s, polyimides, polyketone imides, polyamideimides, poly(ether ether ketone)s, polysulfones and elastomers, and sets out in Table 4, Examples 44 and 45 compositions containing poly(phenylene sulfide), polyamideimide and an epoxy compound.
Compositions comprising glass reinforced poly(arylene sulfide) resins and polyetherimide which additionally contain at least one polyolefin in an amount to substantially improve the heat distortion temperature of the composition have been disclosed in commonly owned application Ser. No. 08/028,061 (Glaser et al) filed Mar. 8, 1993, now U.S. Pat. No. 5,430,102.
Glass filled poly(arylene sulfide)/polyetherimide blend compositions exhibit numerous desirable properties, but there has been a need to enhance various properties, including, for example, the flash resistance and ductility of the compositions.
It is an object of the present invention to provide glass filled poly(arylene sulfide)/polyetherimide blend compositions which exhibit enhanced physical properties, for example, exhibiting enhanced ductility and morphological stability, while substantially retaining other key properties such as heat distortion temperature.