LED packaging technique is one of the focuses in the development of the semiconductor industry. Packaging technique for lateral LEDs and vertical LEDs by wire bonding, and packaging technique for flip-chip LEDs by flip-chip bonding are all being studied for improving brightness and reliability as well as reducing overall volume of the packaged LEDs.
In terms of packaging technique by flip-chip bonding, chip-scale packaged LED device has been developed for the purpose of miniaturization. However, there is still room for improvement regarding brightness, volume, reliability, yield, etc.