1. Field of the Invention
The invention relates to novel lead structures connecting to die that provide for electromagnetic interference reductions. Crosstalk between leads, as well as susceptibility to noise created by electromagnetic emissions internal or external to the package, are reduced through the implementation of the invention.
Further, the invention relates to novel multiple ground planes formed to connect dielectric coated leads connecting to one or more dies.
2. Description of Related Art
Electromagnetic interference leading to reduced performance is an increasingly common problem for packaged die, particularly for die having input/output (IO) operating at Gigahertz frequencies. Many integrated circuits generate undesirable amounts of EMI. Typically, the noise generated by the integrated circuit originates from the die and its connections to the pins through the package. As the EMI is coupled to neighboring components and integrated circuits, it interferes with their individual performance which may, in turn, affect the overall performance of a system. Because of the negative effects of EMI and because the level of acceptable radiated EMI is subject to strict regulatory limits, it is desirable to contain or suppress the EMI generated by an integrated circuit.
Solutions such as separation of leads or isolation with shields are not always available or sufficient. Furthermore, EMI solutions at the IC package level are often ignored because the main concerns at that level are signal integrity and functionality. It would be beneficial to have an EMI solution at the package level because it would help reduce the need for “downstream” or add-on solutions.