A known semiconductor light emitting apparatus can include a substrate, a frame body mounted on the substrate, the frame body having a light-shielding property and a reflective property, a semiconductor light emitting element mounted on the substrate that is exposed within the frame body, and a light-transmitting resin filled inside the frame body to resin-seal the semiconductor light emitting element. This type of conventional semiconductor light emitting apparatus can be manufactured by the method shown in FIGS. 1A to 1E, for example, including:
Step (a): fabricating a multi-piece substrate 101 on which a plurality of semiconductor light emitting elements 100 are mounted at predetermined intervals (FIG. 1A);
Step (b): performing primary transfer molding using a light transmitting resin to form a light transmitting portion 102 with a predetermined thickness on the mounted substrate 101 (thereby resin-sealing semiconductor light emitting elements shown in FIG. 1B);
Step (c): cutting the light transmitting portion 102 using a dicer to form grooves 13 at predetermined intervals in the longitudinal and transverse directions with a predetermined depth and a predetermined width (FIG. 1C);
Step (d): performing secondary transfer molding using a resin having a light-shielding property and a reflective property to form frame bodies 104 within the grooves (FIG. 1D);
Step (e): cutting the product along the frame bodies 104 using a dicer to separate individual substrates 101 having the respective semiconductor light emitting elements mounted thereon together with the respective frame bodies 104 (FIG. 1E).
Through the above steps (a) through (e), a plurality of semiconductor light emitting elements 105 having the appearance shown in FIG. 1F can be simultaneously completed (for example, Japanese Patent Application Laid-Open Nos. 2002-344030 and 2003-31854).
Another method has been proposed as follows (for example, see Japanese Patent Application Laid-Open No. 2006-324623). First, a frame body is formed by performing primary transfer molding. Then, the product is released from the mold, and a light emitting body is disposed within the frame body. The resulting product is again set in the mold to perform secondary transfer molding so that a space within the frame body is filled with a light-transmitting resin for resin-sealing.