An electronic component such as a heat-sensitive resistive element is used, as a resistor, for information communication devices such as moving body communication terminals or personal computers, as well as electronic devices such as wearable devices, medical devices, consumer devices, or automobile electrical devices.
Recently, a reduction in a thickness of such electronic devices has been required, and development of electronic components having a small thickness has been under development due to limitation of a thickness dimension of the electronic devices.
For example, Patent Literature 1 describes a thin film thermistor using a ceramic substrate having a thickness dimension of 50 μm to 300 μm in a chip resistor to be mounted on a board. Patent Literature 2 describes a chip resistor having a thickness dimension of 60 μm to 150 μm. On the other hand, Patent Literature 3 mentions a problem that, when a ceramic substrate in which an insulating substrate has a thickness dimension of 30 μm to 100 μm is used, the substrate may break at the time of fabricating a chip component. Therefore, even when a chip resistor having a thickness dimension of 60 μm according to Patent Literature 2 can be formed, there is concern that the substrate may break, a problem such as cracks at the time of mounting of the board occurring, and a product with extremely low reliability being obtained.
Due to this, it is preferable to use an extremely thin substrate having a thickness dimension of 100 μm or less so that the substrate does not break at the time of fabricating a chip component, and to fabricate a chip resistor and a heat-sensitive resistor using an insulating substrate formed of, for example, a ceramic material of which the reliability such as the stability or heat resistance is high.
On the other hand, in a resistor and a heat-sensitive resistor that are used for a wearable device that monitors biological information, a catheter that is a medical device, or the like, it is required for the resistor and the heat-sensitive resistor to be formed of a material for which biocompatibility is taken into consideration regarding a material to be used when there is a high risk of exposure of the resistor and the heat-sensitive resistor inside a living body.
When a part of the heat-sensitive resistor is formed of a biocompatible material, direct contact with a living body is possible, and an effect that accurate temperature detection of the living body is possible can be expected.