Distributed processor architectures are in use in base stations of radio systems, both at the level of the whole base station and at the unit level. In distributed processor architectures, several processors can attend to similar tasks, such as in digital signal processing, where several digital signal processors are connected to each other. Sub-units of such distributed processor architectures can also contain other components, for instance memories and application-specific integrated circuits (ASIC).
Usually, such sub-units connected to each other boot automatically. Each sub-unit and a processor in it can be booted independently, for instance by means of boot software stored in a non-volatile memory, such as a flash memory, connected to each processor.
As regards sub-processors executing similar functions, their boot software is usually the same. The disadvantage of the prior art solutions is that non-volatile memories with identical boot codes must be connected to all sub-processors. Thus, more components are required and much printed board space is consumed. Therefore, also costs are increased. Further, when a printed board of a unit formed by the process architecture is manufactured, more solder joints are required, whereby also the manufacturing is slower and the sensitivity to failure and the failure density in the device increase.