Due to demand for miniaturized, highly functional electronic products in the semiconductor industry, a variety of techniques for providing high-capacity semiconductor packages are being researched and developed.
In general, since wafer level packages are packaged on a wafer level, packaging costs can be considerably reduced according to the number of semiconductor die produced for each wafer. However, when a stress buffer is removed (e.g., a substrate serving as a stress buffer), the wafer level packages have poor reliability compared to packages with the stress buffer in place.
Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such systems with the present disclosure as set forth in the remainder of the present application with reference to the drawings.