1. Field of the Invention
The present invention relates to an electrical connector assembly, and more particularly to an electrical connector assembly for electrically connecting to a printed circuit board.
2. Description of Related Art
An electrical connector assembly 100′ shown in FIG. 1 comprises a housing 5′, a plurality of terminals received in the housing 5′, a chip module 9′ mounted in the housing 5′, a stiffener 6′ surrounding the housing 5′, a metal clip 7′ attached on an end of the stiffener 6′ for pressing the chip module 9′ and a lever 8′ engaging with the other end of the stiffener 6′ for locking the metal clip 7′. The metal clip 7′ defines a pressing portion 71′. When the metal clip 7′ is pressed downwardly, the pressing portion 71′ abuts against the chip module 9′ into the housing 5′.
However, the chip module 9′ is directly mounted between the housing 5′ and the metal clip 7′. When the lever 8′ is rotated to press down the chip module 9′, the chip module 9′ bears two kinds of forces applied by the terminals and the metal clip 7′. In this case, the terminals received in the housing 5′ generate a nonuniform deformation due to an uneven force applied on, which can lead to an open electrical connection between the chip module 9′ and the terminals in a slight deformation section and destroy the terminals in a greater deformation section. So the chip module 9′ can be crashed by the pressing portion 71′.
An improved electrical connector assembly 200′ shown in FIG. 2 comprises a housing 10′, a plurality of terminals received in the housing 10′, a chip module 14′ mounted in the housing 10′, a stiffener 11′ surrounding the housing 10′, a metal clip 12′ and a lever 13′ engaging with two opposite ends of the metal clip 12′ and a heat sink 15′ attached on the chip module 14′. The heat sink 15′ defines a flange 151′. The metal clip 12′ presses the chip module 14′ via the flange 151′, which improves the pressing character thereof and electrical connection efficiency between the chip module 14′ and the terminals received in the housing 10′. However, the heat sink 15′ is mainly used for dissipating heat radiated by the chip module 14′ and the material of the heat sink 15′ must have a good heat dissipation, hence leading to a higher cost.
Thus, there is a need to provide a new electrical connector assembly that overcomes the above-mentioned problem.