Field
Embodiments of the present disclosure generally relate to semiconductor processing equipment. More particularly, embodiments of the present disclosure relate to a plasma source, and an abatement system for abating compounds produced in semiconductor processes.
Description of the Related Art
The process gases used by semiconductor processing facilities include many compounds which must be abated or treated before disposal, due to regulatory requirements and environmental and safety concerns. Typically, an abatement system may be coupled to a processing chamber to abate the compounds exiting the processing chamber. The abatement system typically includes at least a plasma source. Halogen-containing plasma and gases are frequently used in etch or cleaning processes, and components of the processing chamber and the abatement system are susceptible to corrosion from the halogen-containing plasma and gases. The corrosion reduces the service life of the processing chamber components and the abatement system, and, additionally, introduces undesirable defects and contamination into the processing environment.
Accordingly, what is needed in the art is an improved plasma source, and an abatement system for abating compounds produced in semiconductor processes.