According to a known construction, an electronic device comprises a stacked assembly comprising a base wafer, an integrated circuit chip, mounted onto a front face of this base wafer and including a sensor within its front face, and a protection wafer mounted on top of this front face. Generally, this stacked assembly is surrounded by an encapsulation block.
Such an electronic device, generally resulting from a collective fabrication, notably exhibits difficulties in fabrication so that the front face of the encapsulation block runs substantially in the plane of the front face of the protection wafer.
There is a need in the art to solve such difficulties.