A known semiconductor device of this kind is depicted and described, for example, in patent DE 195 06 093 02. A schematic diagram of such a known semiconductor device is provided in FIG. 2. In that case, a microcooler 20 is fabricated by bonding together plural copper foils structured by etching. The individual layers form in conjunction a coolant inlet 24; a cooling channel 26, which conducts the coolant to the region of the microcooler 20 on which a power laser bar 12 is mounted; and a coolant outlet 28. The coolant flows along the arrow 30 from the inlet 24 to the outlet 28. Implemented in at least one region 32 are microstructures: narrow channels, for example. Particularly effective heat exchange takes place in that region because of turbulent flow of the coolant.
The laser bar 12 is soldered to the front edge of the microcooler by means of a soft solder 52—indium, for example. Mounting the bar 12 directly on the copper block 20 improves heat transfer from the laser bar to the cooler.