The present disclosure relates in general to electro-optical interfaces for transmitting and receiving optical signals through fiber optic cable systems. In particular, apparatuses and methods of assembling electro-optical interfaces are described that use a photonic integrated circuit for the active part of the printed circuit board to support optoelectronic components including vertical-cavity surface-emitting lasers (VCSELs) and photodiodes.
As technology progresses and the demand for high bandwidth transmission of optical signals over fiber optic networks in data centers increases, the tolerances of components in the optical interconnects become tighter, making optical interconnects more complex and more expensive.