The present invention relates to an assembly for cooling at least one electronic component disposed on a printed circuit board in accordance with the type defined in greater detail in the preamble of claim 1.
By way of example, a device for cooling an electronic device and an associated production method are known from DE 10 2013 204 029 A1. The cooling device is intended for a control device, which is disposed in a housing and comprises an electronic circuit disposed on a printed circuit board, having an element that produces a lossy line, wherein a contact pressure for establishing mechanical and thermal contact with the printed circuit board is provided on the housing. The contact pressure is disposed adjacent to the element producing a lossy line.
Tensions arise due to the different heights and tolerances of the electrical components in the circuitry, and because of bends in the printed circuit board, or carrier plate, respectively, which lead to the cooling surfaces of the components or printed circuit board not lying, or lying with different pressures, against the cooling device. As a result of the high working temperatures, the poorly cooled elements reduce the lifetime of the electronic components.