1. Field of the Invention
The present invention generally relates to a metal/ceramic bonding article having a ceramic substrate and a metal plate bonded to the ceramic substrate, and a method for producing the same. More specifically, the invention relates to a metal/ceramic bonding article wherein a metal plate of a Cu—Ni or Cu—Mn—Ni alloy serving as a resistive element is bonded to a ceramic substrate and which is used for an electronic member for resistance, such as a shunt resistive element, and a method for producing the same.
2. Description of the Prior Art
In conventional electronic members for resistance, such as shunt resistive elements, an alloy plate serving as a sheet resistor precisely worked by a press working or the like is bonded to a ceramic substrate via a brazing filler metal, such as an Ag brazing filler, by means of the brazing and soldering (see Japanese Patent Laid-Open No. 11-97203).
However, in such an electronic member bonded via a brazing filler metal, a worked sheet resistor must be arranged on a ceramic substrate at a precise position to be bonded thereto. In particular, when a very small resistor having a size of 10 mm□, such as a hunt resistive element, is bonded to a ceramic substrate, the displacement of the resistor is easy to occur, and it is difficult to bond one or a plurality of resistors to one ceramic substrate, so that there is a problem in that the displacement failure of the resistor is not only caused, but productivity also considerably deteriorates.
In addition, since the alloy plate serving as the resistor has a low solder wettability, there is a problem in that there are some cases where bonding failure may occur when a semiconductor device or the like is mounted on the alloy plate.