The field of the invention is static control containers and the invention relates more particularly to containers for transporting printed circuit boards and other devices which could be harmed by electrostatic discharge, electromagnetic interference or radio frequency interference as well as physical damage resulting from shock and vibration.
In the fabrication of modern electronic equipment, printed circuit boards are often fabricated in one location for use at a remote site. Although such boards can be fabricated with great concern for a static-free environment, the shipping step has, in the past, led to damage or destruction of the board as a result of electrostatic discharge. Such boards are also often physically fragile and the boards should be transported in such a way where they will not bend or be subject to impact. Plastic bags fabricated from anti-static material and including a conducting layer such as aluminum wire mesh screen have been used for transporting, but such bags do not provide protection against physical impact and, also, are typically relatively fragile and are usually not reused. Because of this one-time use, the cost of such packs is relatively high. Corrugated containers, including a conductive metal foil layer, have been used, but such containers are also typically not reusable, although they do provide improved protection from physical damage as compared to a pouch.