A microscopic circuit pattern is formed on a surface of a semiconductor wafer, a glass substrate, and the like through a photolithography step or etching step. The chemical liquid supply device has been used in the photolithography step to apply chemical liquid such as photoresist solution to the surface of the wafer or glass substrate, whereby resist solution stored in a chemical liquid tank is sucked up by a pump, passes through a filter and the like, and is applied to a processed object such as the wafer from a nozzle, as described in Japanese Patent Laid-Open Publication No. 9-299862.
A resist processing device called also a spin coater or resist coater has been used to apply the resist solution to the wafer. The resist processing device includes: a chuck attracting a back surface of the wafer and rotating the wafer; and a nozzle for dropping the resist solution on the wafer. The nozzle reciprocates between an applying position and an evacuating position by an arm, and the resist solution is supplied to the nozzle through a supply tube from the pump provided on a main body side of the resist processing device. An application valve provided on the main body side of the resist processing device is operated when dropping the resist solution from the nozzle.