1. Field
One or more exemplary embodiments relate to a connector and a method of manufacturing the same.
2. Description of the Related Art
Recent advancements and refinements in the semiconductor industry have shrunk sizes of semiconductor devices. Due to their shrunken sizes, the semiconductor devices have become more vulnerable to an influence of electrostatic discharge (ESD) or a surge. Abnormalities caused by ESD can occur not only in semiconductor manufacturing processes but also in electronic parts and semiconductor devices manufactured by such semiconductor manufacturing processes.
A method of embedding a diode has been applied to prevent ESD in an integrated circuit (IC). However, an embedded diode may decrease a performance of the IC. To prevent a semiconductor device from ESD, a circuit including a transient voltage suppressor (TVS) diode has been used.