1. Field of the Invention
This invention relates to the field of material deposition, and more specifically, to the deposition of one or more semiconductor layers/films onto a substrate member.
2. Description of the Related Art
It is known in the field of semiconductor manufacturing that semiconductor material be selectively deposited onto a substrate member. In so doing, it is known that an in-line horizontal, and in-line vertical, or a circular assembly of vacuum deposition chambers may be used wherein the substrate member is sequentially moved from one chamber to another as is needed to achieve a desired sequence of semiconductor layers on the substrate member.
It is usual that the limited internal volume of a vacuum deposition chamber limits the physical size of a substrate member that can be inserted into the chamber(s), and upon which semiconductor material may be deposited.
It would be desirable to provide a means whereby a substrate holder would enable a larger area of substrate to be operated upon by a deposition chamber(s).