PCBs and other substrates are routinely employed to mount and interconnect electronic components, such as integrated circuits (ICs) and discrete components (e.g., capacitors, inductors, diodes and resistors), to form larger assemblies or whole circuits. A bare, or “unpopulated,” PCB or other substrate is assembled through a manual or automated, “pick and place,” process in which components are picked off a tape or other feeder and placed in specified locations and orientations (called “rotations”) on various land patterns provided thereon. Herein, a land pattern is a group of exposed conductive pads configured to receive and provide mechanical support and electrical connections for a specified electronic component. Through-hole and surface mount electronic components are soldered into place on the land pattern to complete a mechanical and electrical connection to the PCB or other substrate on which the land pattern is located.