1. Technical Field of Industrial Application
The present invention relates to the technology of applying a high-viscosity bonding agent having a small thickness to a member.
2. Related Art
In the case of an ink-jet recording head, for example, which has a nozzle plate with a plurality of nozzle holes bored therein, a pressure generator, an ink supply port, a spacer for partitioning a common ink chamber and a second plate, which are fixedly formed in layers so that ink drops are made to jet out of the nozzle holes under the pressure generated in a pressure generating chamber by means of piezoelectric vibrators, piezoelectric vibrators whose tips are approximately tens to hundreds of .mu.m in size and which are arranged at intervals of tens of .mu.m must be fastened to a vibrating plate by means of a bonding agent.
In order to fasten such microscopic members disposed at small intervals to the vibrating plate with a bonding agent, the bonding agent, which is as viscous as possible in an unhardened state, needs to be applied uniformly without overcoating at the time of pressure-bonding.
For the reason stated above, a bonding agent is spread on a board with a squeegee or the like as thin as possible and subsequently the bonding agent thus spread on the board is transferred and spread onto an adherent as disclosed in Japanese Unexamined Patent Publications Nos. 91274/1982 and 150974/1992. However, the minimum possible thickness of such a bonding agent that can be spread by a squeegee or the like is in the order of tens of .mu.m, which is far greater than that of an ideal bonding agent layer for use in the manufacture of ink-jet recording heads. Such a large thickness causes a decrease in the production yield which arises from overcoating and the like at the time of bonding.