1. Field of The Invention
The present invention relates to a device for fixedly mounting a heat sink to a central processing unit (CPU) for dissipating heat generated therefrom.
2. The Prior Art
Since the processing speed of computer CPUs has increased resulting in higher temperatures, heat dissipation of the CPU becomes an increasingly important issue. To solve this problem, a number of devices for mounting heat sinks to CPUs have been proposed as in U.S. Pat. Nos. 4,745,456, 5,019,940 and 5,594,624 and Taiwan Patent Application Nos. 83217100-1, 83217100-2, 84207163, 84212747, 85200861 and 85206293. This prior art discloses a mounting device which can fasten a heat sink, a CPU and a CPU connector together, thereby enabling the heat sink to dissipate heat generated by the CPU. However, the prior art mounting devices have the following disadvantages.
1. The mounting devices disclosed in U.S. Pat. Nos. 4,745,456 and 5,019,940 and Taiwan Patent Application Nos. 83217100-2, 84212747 and 85200861 consist of too many components and have a complicated structure.
2. The prior art devices disclosed in U.S. Pat. No. 5,594,624 and Taiwan Patent Application Nos. 83217100-1, 84207163 and 85206293 each have a simpler structure, however, specially designed tools are required to fasten/detach the heat sinks to/from the CPU. Therefore, the cost of the heat sink mounting devices is increased and assembly thereof is further complicated.
Hence, an improved heat sink mounting device is needed to eliminate the above mentioned defects of current heat sink mounting devices.