Power converters, such as buck converters, are commonly utilized to convert a high DC voltage to a low DC voltage. A power converter typically includes a high-side switch and a low-side switch connected in a half-bridge configuration. The power converter can include a driver integrated circuit (IC) to control a duty cycle of either or both of the high-side and low-side switches so as to convert a high input voltage to a low output voltage. To improve form factor, performance, and manufacturing cost, it is often desirable to integrate components of a power converter circuit, such as a half-bridge based DC-DC converter or a voltage converter, into a compact power semiconductor package.
In a conventional power semiconductor package, individual semiconductor dies are arranged side by side and coupled to a substrate through their corresponding conductive clips, which can undesirably increase electrical resistance and form factor of the power semiconductor package. Also, package design rules to successfully accommodate multiple leadframes and a conductive clip require a large degree of tolerance (i.e. a large clearance space) for manufacturing. Typically, a conductive clip having a leg portion is used to provide sufficient clearance space for necessary electrical connections. However, it is difficult to manufacture the leg portion of the conductive clip to match the exact height of the semiconductor devices in the conventional power semiconductor package. As a result, the leg portion may cause the conductive clip to tilt either toward or away from the semiconductor device, which in turn can cause unreliable electrical connection between the conductive clip and the semiconductor device, and limiting the current carrying capability of the conductive clip. Additionally, the increased package complexity resulting from the use of multiple conductive clips may negatively affect manufacturing time, cost, and package yields.
Thus, there is a need in the art to provide a compact power semiconductor package to with reduced form factor and increased current carrying capability.