1. Technical Field
The present disclosure relates to a light-emitting diode (LED) manufacturing method, and particularly to a manufacturing method of LED with a phosphor layer which does not easily come off.
2. Description of Related Art
Light-emitting diodes (LEDs) are popular recently. LEDs have advantages such as energy saving, electricity saving, high efficiency, short response time, extensive life span, mercury-free, and environmental protection benefits. Therefore, LEDs are considered as the best light source of new generation illumination. At the present, the phosphor glue of a LED is formed by the processes of forming a reflective cup on the substrate and deposing a LED chip in the reflective cup, and then the reflective cup is filled with phosphor glue via dispensing. However, the connections between phosphor layer and substrate and reflective cup are unstable, whereby the phosphor layer has the problem of easily coming off from the substrate and the reflective cup.
In view of the above-mentioned problem, it is necessary to provide a light-emitting diode manufacturing method which the phosphor layer of the light-emitting diode does not easily come off.