The currently available hand-held mobile devices have higher and higher performance gained by using a multi-core central processing unit (CPU) having two, four or even more cores. However, with the multi-core CPU that has largely increased operating speed, the heat produced by the hand-held mobile device during operation thereof also disadvantageously increases, which necessitates more efficient heat dissipation solution for the hand-held mobile device.
According to a conventional technical means, a piece of graphite material is correspondingly attached to a heat source of the hand-held mobile device to enable good transfer of heat from the device to an external environment via the graphite material. However, to meet the demand for compactness and light weight, the current hand-held mobile devices all have a very limited internal space, which is too small to accommodate an additional graphite material. In other words, the use of the graphite material would inevitably increase the overall thickness, volume or weight of the mobile devices. It is therefore an important and challenging issue as how to provide a heat-dissipation structure that can be mounted in a hand-held mobile device to effectively solve its problem of heat dissipation without increasing the overall thickness, volume or weight thereof.