Currently, the demand for portable devices in electronic product markets is increasing, and also, there has been a continuous demand for miniaturizing and lightening of portable devices to make them easy to carry. In order to miniaturize and lighten portable devices, packaging technology for integrating a plurality of circuit elements mounted on a printed circuit board (PCB) into a single package, as well as technology for reducing the sizes of individual electronic components provided in the portable devices are essential. In particular, a semiconductor package which deals with high frequency signals advantageously includes various electromagnetic interference (EMI) shielding structures in order to improve implementation of EMI or electromagnetic wave resistance characteristics as well as aid in miniaturization.
To achieve this, a related-art EMI shielding structure includes a structure which covers various circuit elements with a shield can made of press-processed metal, and a structure which forms a shielding dam made of a conductive material to enclose circuit elements, covers all the circuit elements by injecting an insulator into the shielding dam, and then forms a shielding layer thereon.
In the shielding structure applying the shield can, the shield can should have a constant thickness to maintain its shape, and should be spaced from each circuit element by a predetermined distance to prevent a short from the circuit element. However, due to the thickness of the shield can and the distance between the shield can and the circuit element, there is a limit to reducing the height of the shield can. Such a limit may be a factor that hinders miniaturization of the shielding structure. In addition, an air gap is formed between the shield can and the circuit element. The air gap performs an insulation action for hindering heat emitted from the circuit element from being discharged. In order to emit heat smoothly, air vents should be formed on the upper portion or side portion of the shield can. However, since electromagnetic waves leak through the air vents formed on the shield can, there is a problem that the EMI shielding effect is reduced.
In addition, as the technology develops, high density mounting is increasingly used. In this case, since a gap between circuit elements is set to be very narrow, it is difficult to manufacture a shielding dam satisfying a required width to height ratio by a related-art process.
The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the present disclosure.