1. Field of the Invention
This invention relates to a process for repairing an electrical printed circuit and more particularly to repairing an electrical interruption in the circuit path.
2. Information Disclosure Statement
Conductor path interruptions occur during manufacturing, repairing or as a result of physical shock or vibration. An interruption in one circuit connector will in many cases cause the total failure of the printed circuit board. Accordingly, a small defect in the printed circuit may necessitate the replacement of the entire printed circuit board and the associated components.
One process utilizes a device which holds a specifically shaped metallic part above the conductor path interruption. The device lowers the metallic part onto the conductor path and micro-resistance welds the shaped metallic part to the circuit so as to electrically reestablish the conductor path interruption.
Another prior art method seems to suggest the use of an insulated wire extending or bridging the electrical gap in the printed circuit.
In another process for manufacturing printed circuits, a resinous conductive ink circuit is printed on an electric board. While the ink is wet, the inked circuit is covered with a conductive metal powder. The powder is pressed into the ink and is allowed to cure. A solder paste is printed over the circuit and the board heated to cause the solder to alloy with the ink and powder to complete the method. A particular apparatus is employed to carry out the process.
Another process discloses an electrically conductive adhesive for bonding small semi-conductor components to a substrate. This patent fails to teach or suggest any tendency for a substance to bridge any gap. The disclosure of this patent is limited to the adhering of one small object to another through an electrically conductive bond.
Another method is drawn to an improved composition for a metallic ink as well as an improved method of use involving a low melting point metal first used in conjunction with a conductive ink. The combination is fired after the ink is screened in place in order to produce a relatively thick film on a substrate or semi-conductor device for making subsequent electrical contact by any one of various methods including clamping and soldering.
Another method utilizes a rather complex system to find a conductor path break and suggests the the gap may be bridged by the use of an insulated wire extending point to point across the gap.
Another method involves making contact between two conductors of printed circuits on opposite sides of a non-conducting substrate used as a circuit board. Holes are drilled through the board at the appropriate points. In the preferred embodiment, the sides of the holes are electroplated with a conductive material to permit electrical communication from circuits on one side of the board to the other.
The aforementioned methods utilize rather complex devices or insulated wire to effect the repair of a conductor break.
Accordingly, it is an object of this invention to provide a method of repairing an electrical conductor path interruption on a printed circuit board which is economical and simple to perform.
It is a further object of this invention to provide a method of repairing an electrical conductor path interruption on a printed circuit board in the presence of heat sensitive electrical components.
It is a further object of this invention to provide a method of repairing an electrical conductor path interruption on a printed circuit board without the need for welding a metallic conductor at the site of the interruption.
It is a further object of this invention to provide a method of repairing an electrical conductor path interruption on a printed circuit board without the need for metallic strips to bridge the interruption.
It is a further object of this invention to provide a process which allows for a simple and complete repair of conductor path breaks without the use of a complex device.
It is a further object of this invention to provide a method of repairing an electrical conductor path interruption on a heat sensitive dielectric printed circuit board such as impregnated paperboard.
The foregoing has outlined some of the more pertinent objects of the present invention. These objects should be construed to be merely illustrative of some of the more pertinent features and applications of the invention. Many other beneficial results can be obtained by applying the disclosed invention is a different manner or modifying the invention within the scope of the disclosure. Accordingly, other objects and a fuller understanding of the invention may be had by referring to the summary of the invention and the detailed description describing the preferred embodiment in addition to the scope of the invention defined by the claims taken in conjunction with the accompanying drawings.