The present invention relates to a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure. The diaphragm element is structured and the deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is situated in the area of the attachment of the diaphragm element to the layer structure.
A particular advantage of piezosensitive MEMS microphone components is that—in contrast to capacitive MEMS microphone components—they may be equipped very easily with a “wake-up” functionality. They may thus be provided very easily so that they only consume power if needed, i.e., for example, only if a specific sound level is exceeded. The power consumption of piezosensitive MEMS microphone components in the “always-on” operating mode is thus significantly less than that of capacitive MEMS microphone components.
Piezosensitive MEMS microphone components are described in U.S. Patent Application Pub. No. 2014/0084395 A1. These MEMS microphone components each include a structured sound-pressure-sensitive diaphragm element having a piezoelectric layer structure for signal detection. The structuring of the diaphragm element is used here for pressure equalization between the two sides of the diaphragm element and is to promote the sound-pressure-related diaphragm movement. For this purpose, a uniform grid arrangement of passage openings in the entire diaphragm area is proposed, or also trench slits, by which the diaphragm element is divided into paddle-like segments. The piezoelectric layer structure is situated in each case in the edge area of the diaphragm element, where the greatest elongation or the greatest mechanical stresses occur when the diaphragm element is deflected.