In the context of growing product functionalities of component carriers equipped with one or more electronic components and increasing miniaturization of such components as well as a rising number of components to be mounted on the component carriers such as printed circuit boards, increasingly more powerful array-like components or packages having several components are being employed, which have a plurality of contacts or connections, with ever smaller spacing between these contacts. In particular, a low loss electric connection of embedded components is desired. For example, component carriers with high I/O count and/or high-frequency signal transmission may be critical in this respect. Moreover, there is a strong tendency in the field of component carriers of continued miniaturization. In particular, it is desired to form electrically conductive connections with smaller and smaller dimensions. Thus, conventional procedures of contacting different layers of stacked layer-type component carriers reach their limits.