1. Technical Field
The present disclosure generally relates to testing devices and, particularly, to a probe for testing a printed circuit board.
2. Description of Related Art
Developments in electronic technology have brought increases in the number of components arranged on the printed circuit boards. A printed circuit board having components thereon requires quality testing of electronic properties before release. In a commonly used testing method, a plurality of welding portions is formed on the conductive wires of the printed circuit board. However, each welding portion is wider than the conductive wire, whereby signal transmission of the conductive wires and, correspondingly, the testing precision may be compromised.
In another testing method, a weld bead is applied on the conductive wire, and then contacted with a probe. However, the probe often has a flattened surface or a plurality of protrusions with tips. The contact area between the probe and the weld bead may be relatively small, because the weld bead is substantially spherical, which decreases the testing precision. Furthermore, the tips of the probe may cause damage or break the weld bead or the conductive wire easily, which also decreases the testing precision.
Therefore, there is room for improvement within the art.