Laser-processing of features (e.g., through-vias, blind vias, trenches, routs, kerfs, and other features) within one or more materials of a workpiece can be processed using parameters such as laser power, pulse repetition frequency (PRF), pulse energy, pulse width, bite size, and other parameters. In many laser processing applications, the speed or efficiency with which a feature is formed, and the quality of the feature ultimately formed, can be very sensitive to such processing parameters.
An example application in a compound motion laser processing machine is the processing of “rout” features: laser cut lines made up of sequential linear or circular arc segments. Traditionally, such processing is accomplished by moving the process beam at a constant velocity along a desired trajectory. For a given laser power and PRF, this provides a consistent fluence and bite size at the worksurface.
However, it is possible to exceed the dynamic limits (e.g., linear stage acceleration or velocity, or galvo scan field) of a compound motion system when processing routs. For certain rout velocities, for example, a rout that reverses direction can easily produce peak linear stage acceleration beyond the system's capability.