There are a number of conventional processes for packaging integrated circuit (IC) dice. By way of example, many IC packages utilize a metallic leadframe. One or more dice may be electrically connected to the leadframe by means of bonding wires or solder bumps that have been preformed on the active surface of the die. In general, the dice and portions of the leadframe are encapsulated with a molding compound to protect the delicate electrical components on the active side of the die.
The dice within the package generate significant amounts of heat. Different package designs control heat buildup in a variety of ways. By way of example, a heat sink can be attached to one or more of the dice in the package. The heat sink may be exposed on the exterior of the package. That is, a surface of the heat sink is left uncovered by the molding compound. As a result, heat that is generated within the die can efficiently exit the package through the exposed surface.
There are a wide variety of other ways to improve the thermal performance of integrated circuit packages. For example, the die can be mounted on a die attach pad or heat spreader that is exposed on the exterior of the package. Thermal pipes can be provided within the package to help transfer heat from the die to the ambient environment. In some designs, the encapsulant does not entirely cover the die but instead leaves a surface of the die exposed. The package size can be increased so that heat can be more easily dissipated by convection along the sides of the package. In some applications, air flow can be directed to cool the package.
While existing arrangements and methods for packaging dice work well, there are continuing efforts to develop improved packaging techniques that provide cost effective approaches for meeting the needs of a variety of different packaging applications.