The present invention relates in general to heat dissipation in semiconductors and, more particularly, to direct contact liquid cooling in electronic circuit module packages.
It is known in the art that combinations of various type semiconductors and/or hybrid circuits are required to achieve large scale electronic systems. It is desired that the packaging of these system functions be miniaturized in modular form to optimize cost, size, and weight advantages for the end user. The electronic systems often consume an appreciable amount of power and generate heat. As the level of modular system integration increases, the size of the module and the power consumption of the module correspondingly increases.
The electronic systems are often used at various pressure altitudes including submerged applications and high altitude applications. In some applications, conventional package cooling techniques such as convection and radiation may be inadequate to assure sufficient cooling and reliable electronic system performance. Likewise, package pressure constraints that are related to a wide range of pressure altitude variations have not been adequately addressed with present module technology to provide a universal pressure solution.
Hence, a need exists for an electronic circuit module package that is capable of reliable operation at various atmospheric and sub-surface altitudes and maintains good heat dissipation characteristics throughout its range of operation.