Conventionally, in order to form structures on a substrate by using a process that minimizes manual machining, such process may involve techniques such as photolithography, electroplating, etching, and so forth. Photolithography has been a reliable method used to form structural patterns on a substrate, and a process of using photolithography during fabrication to pattern parts of a substance deposited on a substrate would typically involve one or more photo masks having a specific geometric pattern which would be transferred from a photo mask to a light-sensitive photoresist. After a period of exposure to light, chemical or high intensity photon treatments would be applied to remove a part of the light-sensitive photoresist to develop a patterned exposure into which a material could then be deposited on the material underneath the photo resist.
However, such process would involve numerous expensive machines and masks as well as extremely clean operating conditions so that the overall costs of manufacturing would be increased. Also, in order to secure a photoresist onto a substrate, a polymeric resin such as epoxy would need to be sprayed on parts on a bonding surface before curing. Such process would involve additional chemicals and extra steps. Furthermore, even though electroplating has been a popular process used to deposit material into exposed parts of a photo resist on the material underneath the photo resist, conventional electroplating would also incur costs because of the use of electroplating equipment, electrodes, plating solutions, and etc. . . . .
Therefore, there could be a more efficient and cost effective way of developing patterned structures on a substrate than above mentioned conventional practices.