1. Technical Field of Invention
Aspects of the invention can relate to an alignment method, a method for manufacturing a semiconductor device, a substrate for a semiconductor device, and electronic equipment.
2. Description of Related Art
Related art methods for manufacturing a thin-film electronic device have been developed based on vacuum processing employing evaporation. While the vacuum processing can provide extremely high processing accuracy, it consumes a significant amount of energy and materials ineffectively. Therefore, low energy consuming, liquid-phase processing (using a liquid-phase method) has come under review as a substitution for the vacuum processing. See, for example, Domestic Republication of PCT International Publication No. WO 00/59040.
The liquid-phase processing provides the following advantages over the related art vacuum processing that involves evaporation. First, no vacuum equipment is required, which makes it possible to reduce the size of a manufacturing equipment. Second, the surface of films are planarized, which prevents the breaking of wires provided on the surface. Also, a high-voltage-resistant transistor can be manufactured by using a planarized film as a gate insulating film.