The present invention relates to the field of displaying technologies, especially to an organic light-emitting diode (OLED) display panel manufacturing method and an OLED display panel manufacturing device.
Organic light-emitting diode (OLED) displays are new generation displays. By making an organic film on an OLED substrate with the organic film disposed between cathode and anode metal or conductive layers and electrifying the electrodes, the organic film emits light. In comparison to liquid crystal displays, OLED displays have various advantages such as self-light-emission, short response time, wide viewing angles, and high color saturation, etc.
Water-dissolved oxygen in the air oxidizes active metal of a cathode of an OLED device and reacts with organic material, which causes malfunction of the OLED device. Therefore, an effective package of the OLED device sufficiently separating the OLED device from water-dissolved oxygen is of paramount importance for prolonging lifespan of the OLED device. Currently, OLED packaging methods includes drier and UV adhesive packaging, surface mount packaging, frit glue (glass adhesive) packaging, and thin film packaging, etc. The frit glue packaging has excellent packaging effect, is flexible and convenient and may be applied to products with different dimensions. Therefore, the frit glue packaging is a developmental packaging method.
With reference to FIG. 2A, during a packaging process of frit glue 203, because a start point of the frit glue 203 has a cured protruding portion 205, during lamination of a lid 202 and a substrate 201 under nitrogen (N2) environment, one side with the protruding portion 205 frequently fails to be laminated inseparably. The other side without the protruding portion 205 is laminated inseparably, as shown in FIG. 2B. The lid 211 and the substrate 210 are laminated inseparably by frit glue 212 and UV adhesive 213.
With reference to FIG. 2A, during a laser scanning process, because UV adhesive 204 surrounding the lid 202 has been cured, even the frit glue 203 is melted first and then cured again during laser scanning, the cured UV adhesive 204 constantly keeps cured and thus maintains the above loosely laminated status. Therefore, after laser scanning the re-cured frit glue 203 still cannot tightly adhere the lid 202 and the substrate 201 together. Clearances keep existing between the lid 202 and the substrate 201. As such, after periphery of the UV adhesive 204 is cut, an obtained OLED display panel packaged by the frit glue 203 has week sealability, and water-dissolved oxygen in the air enters an internal of the OLED device through the clearances to fail the package.
As described above, according to the conventional OLED display panel manufacturing method and device, during the process of first softening and then curing the protruding portion of the start point of the glass adhesive, because the UV adhesive surrounding the glass adhesive has been cured and maintains the loosely laminated status, under N2 environment one side of the lid and the substrate with the protruding portion fail to be inseparably laminated together such that the OLED display panel has weak sealability and negatively influences the packaging.