The invention relates generally to lens array packaging.
Many optoelectronic applications require lens arrays to either collimate or focus optical beams. Such systems typically include about four to forty eight optical paths. Alignment of all of the optical paths is typically needed between the lens array and one or more of a fiber array, a detector array, and an emitter array. Conventional alignment techniques for lenses and fibers use manual and automated active alignment processes wherein an optical path is illuminated and a detector is used to monitor the optical path during the alignment process. Active alignment processes are time consuming and hinder efforts to bring down the expense associated multi-path optoelectronic modules.
It would therefore be desirable to provide a lens array package without using a labor intensive alignment process.