In mobile communication devices, radio frequency (RF) receivers or RF transceivers and baseband processing units may be provided on separate semiconductor chips or dies which are connected via an interface, e.g., a digital interface. RF receivers or radio frequency transceivers may be very complex and limited in available space on the die. Furthermore, the die carrying the RF receiver or transceiver may be provided in an older design node than the die carrying the baseband processing unit, e.g., the die including the baseband processing unit may be provided in 5 to 14 nm design node, whereas the die including the RF receiver or transceiver may be provided in a 28 nm, 40 nm or 65 nm design node or an even larger design node.
RF signals received by the RF receiver or transceiver may be processed digitally in the RF receiver or transceiver. For transferring the digital signal via a digital interface, the signal may be scaled to a set-point which is close to a saturation level of the digital interface in order to avoid a loss of signal quality in the event of a digital interface having a lower resolution than the RF transceiver and/or the baseband processing unit. A required gain for the signal may be determined based on a signal strength of the received signal. However, the signal strength of the received signal may vary dynamically and too fast for an accurate determination of the required gain. Therefore, the digital signal may be scaled to values which lie above the saturation level of the digital interface, so that the wave form of the digital signal is not preserved. This effect is known as clipping. Accordingly, data transfer via the digital interface may cause throughput degradation in case of a dynamically varying signal strength. Hence, there may be a desire for improved processing of a received radio frequency signal.