1. Field of the Invention
Exemplary embodiments of the present invention relate to a display panel, a display apparatus having the display panel, a method of manufacturing the display panel and a method of cutting the display panel. More particularly, exemplary embodiments of the present invention relate to a display panel having an upper substrate partially cut, a display apparatus having the display panel, a method of manufacturing the display panel and a method of cutting the display panel.
2. Description of the Related Art
Generally, a liquid crystal display apparatus includes a liquid crystal display panel displaying an image, and a backlight assembly providing light to the liquid crystal display panel. The liquid crystal display panel includes a display substrate that is a thin-film transistor substrate, a counter substrate facing the display substrate, and a liquid crystal layer disposed between the display substrate and the counter substrate. The display substrate may include a display area in which a pixel electrode is formed, and a non-display area in which a driver for driving the liquid crystal display panel is formed.
The driver formed in the non-display area may include a driving chip for driving the liquid crystal display panel, or a flexible printed circuit board (“FPCB”) for providing a driving signal to the driving chip. In order to expose a pad of the driver in the non-display area, the counter substrate is partially cut and removed. Generally, for a method of cutting the substrate, there are a scribing cutting method using a diamond wheel, a laser cutting method and a manual cutting method using a bamboo bar.
As for the display apparatus such as a laptop computer, a cellular phone and so on, the display apparatus is required to be light and slim, and so a plastic substrate is used as the liquid crystal panel. When the plastic substrate is cut by using the scribing cutting method, the substrate may be torn off so that a whitening phenomenon may be generated. Cutting the plastic substrate by using the laser cutting method is difficult to adjust a cutting width of the substrate. In addition, cutting the plastic substrate by using the manual cutting method is not efficient and impossible to be automated.