When a thermosetting resin is used as a sealant for a semiconductor package, the reliability of the package is affected by whether or not adhesion between the thermosetting resin and a metal material used for a substrate and wiring is favorable.
As a technique to improve the adhesion between a metal and a thermosetting resin, there is known a technique using a method that includes mixing the thermosetting resin with a chelating agent as an adhesion aid. For example, Japanese Patent Application Publication No. 2009-298875 proposes a resin composition that is obtained by mixing an epoxy resin with an aluminum chelate, thus having an improved adhesion to an aluminum substrate. The chelating agent is considered to improve the adhesion by interacting with a metal or a thermosetting resin.
However, the chelating agent acts also as a cross-linking agent for resins, the mixing of the chelating agent may sometimes embrittle the entire thermosetting resin. Particularly, when the thermosetting resin is used as a sealant for a semiconductor device, there is a concern that cracks will develop in the thermosetting resin due to a heating cycles. In view of the above circumstances, an object of the present invention is to obtain a resin molded article with improved crack resistance of a thermosetting resin while maintaining adhesion between a metal and the thermosetting resin.