1. Field of the Invention
The present invention relates to a graphite heat dissipation apparatus, and in particular to a clamping frame for clamping a graphite heat dissipation fin module.
2. Description of Related Art
Please refer to FIG. 1 which illustrates a graphite heat dissipation apparatus 2 in prior art. As shown in FIG. 1, the graphite heat dissipation apparatus 2 draws heat away from an electronic device 6 such as processor or chipset which generates heat by a graphite heat dissipation fin module 4. The electronic device 6 is installed on the surface of a chassis 8 such as a printed circuit board. The graphite heat dissipation fin module 4 is attached to the top of the electronic device 6 to carry heat away from the electronic device 6. The graphite heat dissipation apparatus 2 is usually apparent at personal computers or servers and a much more advanced cooling method.
Furthermore, the graphite heat dissipation apparatus 2 also includes a metallic frame 10 and a metallic enclosure 12. The graphite heat dissipation fin module 4 includes a graphite substrate 402 and a plurality of graphite fins 404 extending from its surface. And, the graphite heat dissipation fin module 4 is soft so that it is prone to be damaged. Further referring to FIG. 1, the he graphite heat dissipation fin module 4 is positioned at the metallic frame 10, and the metallic frame 10 has a central hole 1002. The electronic device 6 protrudes through the central hole 1002 so the electronic device 6 is attached to the bottom surface of the graphite substrate 402 of the graphite heat dissipation fin module 4.
Furthermore, the metallic enclosure 12 is used to cover the graphite heat dissipation fin module 4 which is placed at the metallic frame 10 so that the graphite heat dissipation fin module 4 is protected and prevented from being damaged due to inadvertent collision.
However, the graphite heat dissipation apparatus 2 can prevent the graphite heat dissipation fin module 4 from being damaged, but the metallic frame 10 and the metallic enclosure 12 do not aid in dissipating heat. Then, dissipation efficiency is significantly decreased. Cost is higher and product is not so competitive as others in the market because too much material and many components are utilized in the metallic frame 10 and the metallic enclosure 12.
Thus, there is a need for a graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module to improve disadvantages in prior art.