The present invention relates, in general, to an electric connection element for connecting electric components.
Connection elements of a type involved here have been used to electrically interconnect several electric components, e.g. solar cells, and are constructed in the form of a flat wire as electric conductor which has a coating of solder material. As the connection element is heated to melt the coating, it is soldered with the electric component. Coated connection elements designed as punched parts or cut bands have also been known.
Common to all conventional connection elements is the drawback that the attainable adhesive force by which the connection element is attached to the electric component is oftentimes insufficient. Moreover, a significant layer thickness of the solder is required, thereby increasing the costs for the coating. In addition, conventional connection elements, including those configured as flat wire, have a coating that normally has a convex surface configuration.
It would therefore be desirable and advantageous to provide an improved connection element which obviates prior art shortcomings and which is able to realize a high adhesive force, while requiring only little coating thickness.