The invention relates to a method of manufacturing an inductive element for surface mounting device (SMD) applications, which method includes the following steps:
a) providing a number of predominantly parallel electroconductive wires in the mould of an injection-moulding device, PA1 b) circumferentially providing a part of the wires with a synthetic resin by injection moulding, in such a manner that the ends of the wires remain free, PA1 c) providing an envelope of a soft-magnetic material around the circumferentially injection moulded part of the wires.
The invention also relates to an inductive element. The term inductive elements includes inter alia inductors, such as in particular power inductors, and inductance coils, as well as transformers, such as in particular power transformers.
It has been found that in practice the inductive elements manufactured in accordance with the above-mentioned method give rise to problems. For example, in the case of mass-produced inductive elements, the electrical and magnetic properties of the elements vary to an undesirable extent. It has been found that the magnetic fields, which are generated during operation of these elements, are not optimally homogeneous. It has also been found that sometimes an electric short-circuit occurs in these elements. These drawbacks increase as the thickness or diameter of the wires is chosen to be smaller.