The present invention relates to a novel heat-conductive silicone oil compound or, more particularly, to a heat conductive silicone oil compound which is free from the problem of an undue increase in the consistency even by increasing the amount of addition of the inorganic particulate material as an additive to impart the oil compound with high heat conductivity.
It is a conventional method that, when a silicone oil compound is to be imparted with a high heat conductivity, the silicone oil compound is admixed with an inorganic particulate material such as metal oxides, e.g., zinc oxide, aluminum oxide and the like, and inorganic nitrides, e.g., aluminum nitride, silion nitride and the like.
A problem in the heat-conductive silicone oil compound with admixture of the above mentioned inorganic particulate material as a heat conductivity improver is that, when the added amount of the heat-conductivity improver is increased with an object to obtain a higher and higher heat conductivity, the consistency of the oil compound is rapidly increased as the amount of the heat-conductivity improver is increased so that the oil compound can no longer be used in the applications as an oil compound. In other words, a silicone oil compound can be imparted with high heat conductivity only at the sacrifice of the usability in practical applications.