The present invention relates to a socket for a surface mount DIP, also referred to as a small-outline package or SO-package.
Dual-in-line packages, or DIPs, are a standard means for packaging circuit elements such as integrated circuit chips. Each Dip consists of a main plastic body having two rows of leads extending downward therefrom for reception in plated through holes or miniature spring sockets in a printed circuit board (PCB). In order to reduce the possibility of damaging the leads and further to facilitate replacement of the DIP, sockets which are mounted to the board and receive the DIPs therein have been developed. A low profile DIP socket having good contact properties and constant insertion force is disclosed in U.S. Pat. No. 4,060,296.
Some applications require that DIPs be temperature cycled or "burned-in" before end use, to reduce the possibility of failure. For this purpose, sockets comprising housings of temperature resistant material and having contacts offering low insertion force which engage the DIP leads without imposing stress thereon during burn-in have been developed. One such socket is marketed by AMP Incorporated as the DIPLOMATE HT (high temperature).
Recently, small outline packages have been developed. These are DIPs having opposed rows of leads formed with laterally projecting feet for soldering to surface pads on a PCB. As with standard DIPs, some applications such as "burning-in" require sockets from which the SO-package can be readily removed. Sockets for standard DIPs have contacts for receiving downward projecting leads and are quite unsuitable for engaging laterally projecting feet.