1. Field of the Invention
The present invention relates to a bonding structure of vehicle members and a bonding structure of a back door.
2. Description of Related Art
Japanese Patent Application Publication No. 2007-245759 (JP 2007-245759 A) has disclosed a technology of bonding outer edge portions of an inner panel made of resin and an outer panel made of resin together with adhesive. Further, according to Japanese Patent Application Publication No. 2009-173086 (JP 2009-173086 A), a recessed groove is provided on the outer edge portion of any one of the inner panel made of resin and the outer panel made of resin. A technology of filling the inside of the recessed groove with adhesive and bonding the inner panel and the outer panel together via the adhesive has been disclosed.
However, in these related arts, it has been described only that the outer panel (first member) and the inner panel (second member) are made of resin. Thus, if materials each having a different thermal expansion coefficient are used for the outer panel and the inner panel, when these panels are bonded together, thermal strain may be generated on a panel side having a larger thermal expansion coefficient.