1. Field of the Invention
The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly having a wire clip and a heat sink, wherein the wire clip is received in and abuts against the heat sink to enhance a stability of the heat sink.
2. Description of Related Art
Advances in microelectronics technology have resulted in add-on cards which process signals and data at unprecedented high speeds. During operation of many contemporary add-on cards such as memory module large amounts of heat are produced. The heat must be efficiently removed, to prevent the system from becoming unstable or being damaged.
A conventional heat sink is used to dissipate heat generated by the add-on cards. The add-on card comprises a bottom end adapted for engaging with a corresponding socket of a computer, and a top end opposite to the bottom end. The heat sink is made of aluminum and comprises a first heat absorbing plate, a second heat absorbing plate and a connecting portion connecting with the first and second heat absorbing plates. The add-on card is sandwiched between and thermally connects with the first and second heat absorbing plates. The top end of the add-on card abuts against a bottom surface of the connecting portion of the heat sink. When the add-on card assembled with the heat sink engages with the socket, the connecting plate of the heat sink is deformed by an upward press of the top end of the add-on card. Thus, the stability of the heat sink is unfavorably affected.
An improved heat sink assembly, which overcomes the above problems, is desired.