In a conventional device, a backplane is horizontally disposed at the bottom of a subrack, and a PCB board is vertically inserted from the front of the subrack into the subrack and then moved downward to fit into the backplane. In this way, the resistance and restraint from the backplane on the back side of the subrack can be eliminated, a direct front-to-back air duct is formed in the subrack, and heat dissipation is implemented through the front-to-back air duct, thereby improving the heat dissipation capability. Usually, a pluggable mechanism is used to drive the PCB board to implement the two-dimensional operation of inserting the PCB board into the subrack horizontally, then inserting the PCB board into or removing the PCB board from the backplane vertically. The conventional pluggable mechanism has at least the following disadvantages:
1. Complex structure, multi-step drive, and insufficient operation reliability.
2. Occupation of vertical space.
3. Great motion resistance, laborious operation, and poor operability, especially unsuitable for the PCB board plugging requiring great force for inserting or removing.