1. Technical Field
The present disclosure relates generally to a laser processing method and a laser processing apparatus for processing materials using a laser and, more particularly, to a laser processing method after a wafer is loaded on a work stage and to a structure of a laser processing apparatus for implementing the method.
2. Description of the Related Art
Solid-state lasers are used to perform a variety of types of material processing including laser cutting and scribing. In recent years, solid-state lasers operating at ultraviolet (UV) wavelengths have been developed, thereby expanding the application range of lasers to semiconductor processing, particularly, a process of cutting a wafer for chip separation. Chip separation is required for a variety of substrates such as silicon wafers, compound semiconductor wafers, ceramic substrates, metallic substrates, glass substrates, etc.