In general, the electrical device comprises a variety of different kinds of electrical components, some of which can be removed from the electronic device depending on what is actually being required. In other words, some of the electrical components are detachably disposed in the electronic device. The heat dissipation component is designed for when the electrical device has been fully loaded with electrical components, which is called a “fully-loaded state”. In general, when the electrical device is in use, there are still some spaces left in the electrical device in order to accommodate other electrical components in the future. In addition, the heat dissipation component operates to produce an airflow flowing inside the electronic device to generate a flow field. However, the flow field in the “full-loaded state” is different from the flow field when the electronic device is not fully loaded with electrical components. Accordingly, the heat dissipation which is applied to the “fully-loaded state” may not provide the same heat dissipation for the electronic device when it is not fully loaded.
For example, a fan generates an airflow flowing toward a cooling fin set that is located over a central processing unit and toward the multiple memory slots that are fully loaded with multiple memories, namely, the airflow may flow through the cooling fin set and the memory slots uniformly. However, when the memory slots are not fully loaded, that is, some of the slots are not connected with the memories, a part of the airflow, which flows to the cooling fin set when the memory slots are fully loaded, flows to the memory slots instead of flowing to the cooling fin set, because the wind resistance at the memory slots is decreased. Nevertheless, the heat generated by the central processing unit is usually greater than the heat generated by the memory module, and the maximum allowable temperature (the maximum temperature at which the component can operate normally) of the central processing unit is lower than that of the memory module. When the server operates, even if the actual temperature of the central processing unit substantially approaches its allowable temperature, the actual temperature of the memory module is still much lower than its allowable temperature. Therefore, if increase airflow to the cooling fin but decrease airflow to memory slots and some of the heat generated by the central processing unit is transferred to the memory module, it not only keeps the memory module operating normally, but also decreases the temperature of the central processing unit. On the other hand, when not a lot of airflow is flowing through the cooling fin set or dissipating the heat of the central processing unit, the central processing unit may not operate normally because the actual temperature of the central processing unit is higher than the allowable temperature.
People in the industry dispose the virtual memory module on the memory slot, which cannot work but has the same shape as the real one. Accordingly, the flow field inside the electrical device corresponds to the original flow field when the electronic device is fully loaded with the electronic components and the wind resistance at the memory slots keeps same as that when memory slots are fully loaded. However, it increases the cost and the virtual memory module may be removed after the additional memory module has been disposed.