Heat may be generated at one location in an electronic device, but dissipated at another location. A thermal conduit may be used to carry the heat from the generation location to the dissipation location, in order to maintain the various components of the device at a desirable temperature. To this end, some electronic devices incorporate fluid-filled heat pipes, which have no moving parts, but transfer heat very efficiently. Despite these advantages, heat pipes may be costly to manufacture at high volume, especially when configured to tolerate load, flexion, and other forms of mechanical strain.