This invention relates to the mounting of integrated circuits, particularly dual-in-line packages commonly called DIPS. Such circuits are found in a large variety of electronic applications. Each individual DIP or dual-in-line package may perform a particular electronic function. In many cases this function is repetitive and requires a plurality of identical dual-in-line packages. A plurality of identical dual-in-line packages may be mounted on a single circuit board in an electronic device, which itself is comprised of a plurality of relatively widely separated circuit boards. Mounting of the dual-in-line package is normally accomplished through the use of a socket, however considerable space may be wasted by mounting only one layer of packages on the relatively widely separated circuit boards. It is not appropriate to decrease the distance between adjacent circuit boards as a portion of this space is necessary to allow cooling air to circulate in the device. It would be advantageous however to be able to mount at least two layers of dual-in-line package type integrated circuits in the same area now required to mount the single dual-in-line signal package type integrated circuit. Since dual-in-line package type integrated circuits come in several standard sizes, that is the length, width and contact leads are generally standardized, it is appropriate to design a standardized socket which permits stacking of the integrated circuits. The result of stacking of the circuits is the saving of up to fifty percent of the space requirements for the device.