1. Field of the Invention
The present invention relates to a waveguide interconnection apparatus implementing low signal loss when interconnecting waveguides in an ultrahigh frequency circuit package and, more particularly, to a waveguide interconnection apparatus, which can reduce a signal reflection and a signal loss due to a mismatch occurred from discontinuous portions (i.e., edge) where the waveguides are perpendicularly connected to each other by making the rectangular interconnecting portion be a curved structure.
2. Discussion of Related Art
When two waveguides are interconnected in a rectangular portion in a waveguide interconnection apparatus of the prior art, discontinuity due to an occurrence of edge leads to a signal reflection and hence a signal loss. To reduce such signal loss, two waveguides have been interconnected each other to be curved, which have no discontinuous portions for the signal transmission. This is for the purpose of producing a package product with superior performance to the conventional method having the same chip and structure when the method proposed by the present invention is applied.
A waveguide interconnection apparatus in accordance with a prior art has been disclosed in the U.S. Pat. No. 5,929,728.
Hereinafter, the waveguide interconnection apparatus in accordance with the prior art will be described with reference to the accompanying drawings. FIG. 1A shows a schematic view of the waveguide interconnection apparatus in accordance with the prior art, and FIG. 1B shows a detailed view of the interconnection structure of the waveguide interconnection apparatus in accordance with the prior art.
Referring to FIG. 1A, the waveguide interconnection apparatus of the prior art consists of an upper housing 10, an intermediate housing 20, and a lower housing 30, wherein the shape of two adjacent housings is rectangle. Furthermore, an upper waveguide 10a, an intermediate waveguide 20a, and a lower waveguide 30a are included in the upper housing 10, the intermediate housing 20, and the lower housing 30, respectively.
To detail the ultrahigh frequency signal propagated through the cross-sectional view of the waveguide interconnection apparatus in accordance with the prior art, the ultrahigh frequency signal propagates through waveguides such that it does through the intermediate waveguide 20a of the intermediate housing 20 to pass the lower waveguide 30a of the lower housing 30 after it is inputted from the upper waveguide 10a of the upper housing 10 in a structure having its outer surface covered with a conductive material.
In this case, edge portions occur where the upper waveguide 10a of the upper housing 10 and the intermediate waveguide 20a of the intermediate housing 20 are contacted and where the intermediate waveguide 20a of the intermediate housing 20 and the lower waveguide 30a of the lower housing 30 are contacted during the signal propagation.
As such, these edge portions become discontinuous portions of the signal propagation, which cause a signal reflection and a signal loss due to a mismatch therefrom. In other words, when the waveguide interconnection apparatus in accordance with the prior art is employed, the above-mentioned discontinuous portions occur, which causes the waveguide structure to have the signal mismatch and a predetermined amount of signal attenuation.
Meanwhile, the upper housing 10, the intermediate housing 20, and the lower housing 30 can be produced in simple and low-cost manners such that rectangular parallelepiped waveguides are punched within a rectangular parallelepiped conductive structure, so that it is advantageous to fabricate a small-sized structure.
However, the waveguide interconnection apparatus fabricated by the above-mentioned prior art has the signal reflection and the signal loss due to a mismatch occurred from the discontinuous portions of the waveguides, which causes degradation of original performance of a semiconductor chip.
Therefore, according to the conventional method for interconnecting waveguides within a package having the waveguide structure, a mismatch occurred from discontinuous portions (i.e., edge) where the waveguides are perpendicularly connected to each other causes the signal reflection and the signal loss.