Semiconductor components, such as dice and packages, are typically tested at the wafer level, e.g., prior to being singulated into separate components. The semiconductor components may include patterns of component contacts, such as bond pads, redistribution pads, or test pads, that provide electrical connection points for addressing integrated circuits contained on the components. A typical wafer-level test system may include a wafer handler (e.g., sometimes called a prober) for handling and positioning the wafers, a tester (e.g., sometimes called a test head) for generating test signals, and an interconnection device, such as probe card, for making temporary electrical connections with the wafer, e.g., with the component contacts of the semiconductor components on the wafer.
Problems may exist with conventional connectors that are sometimes used to connect the probe card to the tester. For example, some conventional connectors may have intermittent electrical contact behavior and/or may be unreliable.
Examples of connectors that may be used to connect a probe card to a tester include spring probe contacts and connector systems, such as zero insertion force (ZIF) connector systems. Spring probe contacts can be unreliable if contact surfaces are not relatively free of contaminants and often require frequent cleaning and/or replacement. Zero insertion force (ZIF) connectors can be expensive and may require complex add-on mechanical actuators.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for alternatives to existing connectors for connecting probe cards to testers.