Field of the Disclosure
The present disclosure relates generally to integrated circuit (IC) packaging and, more particularly, to IC package testing.
Description of the Related Art
Integrated circuit (IC) devices are modeled and tested throughout the fabrication process in order to assure that the components of the IC device are meeting both industry standards and customer requirements. While it is common in the industry to test and gather board level reliability (BLR) test net data for ball grid array (BGA) interconnects and other board-level interconnects using production parts, BLR data for die-level interconnect test nets conventionally has been difficult to obtain on production parts, and thus manufacturers typically have to resort to the design and fabrication of a function specific IC test vehicle and component package to enable daisy chain testing of the die-level interconnects of the IC package design. Designing a special test vehicle chip solely for die-level daisy chain testing can be impractical in view of the expense and resources involved, but the lack of this test data can place the manufacturer at a disadvantage relative to its competitors.