1. Field of the Invention
The present disclosure relates to electrical assemblies, and more particularly to circuit board assemblies mounting electrical components like integrated circuits.
2. Description of Related Art
Printed circuit board (PCB) assemblies commonly include a PCB structure and one or more electronic components. The PCB structure typically supports the one or more electronic components mechanically, and includes one or more conductive features formed within the PCB structure. The conductive features, such as tracks or pads, are generally etched from a conductive material like copper or aluminum and electrically connect to the electronic component through a structure like a pin or a jumper. The electrical connection between the electronic component and the conductive features of the PCB structure provide connectivity between the various electronic component(s) within the PCB assembly as well as to other external electronic components. The electrical characteristics of the electrical connection between the electronic component and the conductive feature of the PCB structure can influence the performance of the electronic component and/or the PCB assembly. For example, in some PCB assemblies, the resistance of the electrical connection between the electronic component and the conductive features of the PCB structure can generate heat sufficient to influence the reliability of the electronic component or PCB assembly.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for improved PCB structures and PCB assemblies. The present disclosure provides a solution for this need.