Prior to this invention, when continuous lengths of filament from an extrusion operation or from another source have been cut, substantial difficulties have been encountered in handling and removing the cut filament. The incoming uncut filament travels at relatively high rates of linear speed. When cut, the filament tends to be scattered in random directions because the impact from cutting tends to throw one end of the filament ahead of the other. At the same time the cut filament tends to interfere with incoming filament.
It is, therefore, an object of this invention to provide a method of and apparatus for cutting and handling filament which overcome the described problems.
Among the other objects of this invention are to provide a method and apparatus which limit and control the erratic movement of cut filament and which remove such filament from the path of filament to be cut.
Additional objects and advantages will be set forth in part hereinafter and in part will be obvious herefrom or may be learned with the practice of the invention, the same being realized and obtained by means of the apparatus recited in the appended claims.