1. Field of the Invention
This invention relates to a process and system for temperature control and in-line testing of electronic, electromechanical or mechanical modules with the components fitted as semi-finished products, in particular printed circuit boards, which leave in succession a soldering station and, following temperature control in a test phase, are connected electrically or optically to at least one electric or optic testing device by means of an adapter unit and are tested by means of the testing device.
2. Discussion of Background
A system for handling and testing printed circuit boards with the electric or electronic components fitted is known from U.S. Pat. No. 4,818,933, where the printed circuit boards are tested in devices with respect to the correct positioning and orientation of the components fitted and with respect to the function prior to their final installation. The system exhibits a supporting frame, which contains at least one adapter plate for contacting printed circuit board contacts, and orientation devices and locking devices and conveyor for feeding in and carrying away the printed circuit boards to be tested. The essential feature in this system is that, during the testing process, the next printed circuit board can already be fed in and stopped.
Furthermore, an integrated printed circuit board testing system is described in the U.S. Pat. No. 5,055,779, where the conversion of a conventional vacuum test system into a mechanical test system is described. The use of such test systems for testing printed circuit boards at high temperatures or low temperatures has been demonstrated to be a problem, since the appropriate test electronics is attached directly to the adapter in order to scan the test points on the pc boards, and an ambient temperature of 100.degree. C., as required for a high temperature test for printed circuit boards, would also increase, for example, the operating temperature of the test equipment and thus possibly impair its proper operation.
A test console with a chamber, in which test pc boards for electronic components are arranged, is known from the DE-GM 83 04 116. In the test chamber it is determined whether or not the test pc board fails under the specified test conditions, such as temperature; if special sealing measures for the test chambers are used, a plurality of electric contacts between the selected pc board of the test device and the test pc boards is to be produced in a minimum of space within the console.
Furthermore, test equipment including a furnace chamber for testing electric components arranged on printed circuit boards is known from the DE-PS 37 21 653, wherein the walls, floor or cover have one slot or multiple slots with temperature resistant sealing lips that are attached to both sides of the longitudinal sides of the slot and through which parts of the supporting plates can be pushed. The sealing lips are formed by two sluice-shaped sealing profiles of a cross section that is, for example, U-shaped, where the profiles rest flat in the center of the slot.
Furthermore, a device for testing single electronic components, such as integrated circuits, is known from U.S. Pat. No. 4,607,220, wherein the-test conditions are conducted in a wide temperature range of -65.degree. to +150.degree. C., for example.
The problem with the known temperature control and test equipment has proven to be the batch loading of the furnaces or consoles or test equipment, so that a function test is not possible between the production steps or temperature control phases; and the final test of the modules cannot take place until said modules are finished; i.e., complete assembly with their external connecting configuration.