1. Technical Field
Embodiments described herein relate to a heat radiating component and a semiconductor package having the same.
2. Description of Related Art
Since a semiconductor device used for a central processing unit (CPU) and the like becomes hot while in operation, it is extremely important to swiftly radiate the heat to the outside to exhibit the performance of the semiconductor device.
Therefore, hitherto, passages for effectively radiating the heat emitted by the semiconductor device outside have been secured by loading heat radiating components, such as heat spreaders or heat pipes, on the semiconductor device. In addition, studies have been carried out to improve the heat radiating properties of the heat radiating components, such as heat spreaders or heat pipes, and, particularly, a variety of techniques have been disclosed regarding surface treatments of heat spreaders, heat pipes, and the like.
For example, a heat sink is disclosed for which an aluminum alloy die cast heat sink is used as a base, grooves are formed in a heat radiating direction, and the entire surface is blackened by painting or a plating treatment (for example, see JP-A-2001-291806).
In addition, a heat spreader is disclosed for which an insulating layer is formed of a fluororesin on the surface of a copper or copper-dominant alloy sheet so that the functions of insulating properties, heat resistance, thermal fatigue resistance, solvent resistance, and the like are secured, and, furthermore, the fluororesin film is made into a blackish color (for example, see JP-A-10-74872).
In addition, a heat radiating sheet is disclosed which is blackened by carrying out an alumite treatment on the surface of a material of a highly thermal conductive metal sheet covered with aluminum (cladding material) (for example, see JP-A-06-302730).
As such, the related art proposes use of blackening of the surface of a heat radiating component to improve the heat radiating properties. However, blackening of the surface of a heat radiating component is not sufficient. For example, the surface of an aluminum alloy heat sink is blackened in JP-A-2001-291806, but aluminum alloy has a lower thermal conductivity than copper, and therefore blackening of the surface thereof cannot lead to sufficient thermal conductivity.
In addition, the surface of a copper or copper-dominant alloy sheet is coated with a fluororesin in JP-A-10-74872, but the fluororesin has a high emissivity of 0.8 or more but has a poor thermal conductivity of 0.1 W/mK to 0.25 W/mK, and therefore heat cannot be efficiently radiated, and sufficient heat radiating properties cannot be obtained.
In addition, a cladding material having aluminum attached to copper is used in JP-A-06-302730, but there are problems in that the cladding material is expensive, and a boundary present between the copper and the aluminum hinders favorable thermal conduction from the copper to the aluminum.