1. Field of the Invention
The present invention relates to a power rectifier arrangement comprising a transformer, at least one heat sink and at least one power rectifier which has a terminal at the floor of a housing.
2. Description of the Prior Art
As is known in the art, a power rectifier can exhibit a semiconductor element and structural parts such as current leads, a capsule to protect against mechanical and atmospheric influences, as well as a metallic housing floor having a contact surface and, for example, a threaded stud for fastening the power rectifier to a heat sink. The inputs of the power rectifier can be designed as terminal lugs which are secured to the upper side of the capsule. The threaded stud and housing floor can serve as an output. The threaded stud and the planar annular surface of the housing floor surrounding the stud can, in approximately equal parts, assume the dissipation of the heat arising in the power rectifier.
In case the inputs of the power rectifier are connected to a transformer which produces heat, the heat is dissipated to the terminal lugs of the power rectifier. The heat of the transformer, therefore, is dissipated over the power rectifier to the heat sink. The two heat sources, transformer and power rectifier, are therefore connected in series. This can lead to undesirable overheating of the tranformer and of the power rectifier.