1. Technical Field
The disclosure relates to light emitting diodes, and particularly to a conductive substrate for formation of LED package structures thereon.
2. Description of the Related Art
Light emitting diodes are commonly applied in environmental lighting. A conductive substrate for formation of a plurality of common LED packages thereon forms a plurality of conductive areas connected to a frame. Each conductive area includes a lead frame extending from the frame, and an inside electrode unit supported by the lead frame. Then, a plurality of insulation shells is arranged on the conductive areas of the conductive substrate respectively by means of plastic injection molding. Then, the lead frame is cut and bent over the insulation shell to function as external electrodes. Thus, a plurality of bases is formed. Finally, LED chips are arranged within the bases by means of bonding. Each LED chip is electrically connected to a corresponding inside electrode unit each consisting of a positive electrode and a negative electrode. Thereafter the LED chip is encapsulated and a corresponding LED package structure is completed. Nevertheless, when the insulation shell is injection molded on the conductive area of the conductive substrate, the conductive area together with the insulation shell is prone to separate from the frame since the frame has only two bumps engaging with the insulation shell. Furthermore, since there are only two ends of the lead frame fixed on the frame in a cantilevered manner which support the insulation shell, the lead frame is prone to deformation during the plastic injection molding of the insulation shell. Accordingly, the yield of the LED package structures is accordingly vulnerable to reduction.
Therefore, it is desirable to provide a conductive substrate for formation of LED packages thereon which can overcome the described limitations.