In semiconductor manufacturing, a low K dielectric is a material with a small dielectric constant relative to silicon dioxide. Low K dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices. In integrated circuits, insulating dielectrics separate the conducting parts (i.e., wire interconnects) from one another. As components have scaled and transistors have got closer together, the insulating dielectrics have thinned to the point where charge build up and crosstalk may, in some instance, adversely affect the performance of the device. Replacing the traditional silicon dioxide dielectric layers with a low K dielectric of the same thickness reduces parasitic capacitance, thus enabling faster switching speeds and lower heat dissipation.