Field
Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus.
Description of the Related Art
Semiconductor processing systems that perform “dry” etching of semiconductor substrate via plasmic gases, also known as reactive ion etching (RIE) require constant monitoring. While it is possible to predefine the etch parameters and allow the systems to perform the etch process unmonitored, conditions within the systems can change over time. For example, monitoring a temperature of a showerhead assembly for a substrate processing apparatus aids in providing temperature feedback that can aid in maintaining stable process control. Minute changes in the composition or pressure of an etch gas or process chamber or substrate temperature creates undesirable etch results.
Therefore, there is a need for an increase showerhead assembly for a substrate processing apparatus.