1. Field
The embodiments discussed herein relate to high-speed circuits. In particular, embodiments relate to circuit boards with both flexible and rigid sections for use in optoelectronic devices.
2. Relevant Technology
Optoelectronic modules, such as optoelectronic transceiver or transponder modules, are increasingly used in electronic and optoelectronic communication. Optoelectronic modules generally include an outer housing that at least partially encloses one or more transmitters and/or receivers, as well as one or more printed circuit boards (PCBs) with circuitry related to the transmitters/receivers, such as driving and amplifying circuitry. Electrical data signals generally pass through this circuitry as they pass between the transmitters/receivers and a host device in which the optoelectronic module is positioned.
It is desirable for optoelectronic communication to send and receive data signals having ever higher frequencies in order to increase the rate at which data may be communicated via the optoelectronic modules. However, increasing data signal frequencies may present a number of difficulties in designing optoelectronics modules. In particular, increasing data signal frequencies may lead to signal degradation in circuits designed using techniques acceptable for lower data signal frequencies.
In some instances, the design of certain aspects of optoelectronic modules is constrained by Multi-Source Agreements (MSAs). MSAs govern particular aspects of the module to allow the module to be plugged into a host device designed in compliance with the MSA. Aspects specified by the MSA may include housing dimensions, as well as connector dimensions and placement. In some instances, MSAs may require that the module include a dual-side rigid edge connector for forming a pluggable communication connection with a host device.
Using flexible PCBs within the optoelectronic devices may offer a number of advantages. For example, flexible PCBs may allow an efficient use of space within the optoelectronic device, particularly where the flexible PCBs are contorted to transition from the dual-side rigid edge connector to the transmitters/receivers, which may be oriented perpendicular to the rigid edge connector. A PCB may be fabricated with both rigid and flexible sections. Such PCBs are commonly described as “rigid flex” PCBs.
The subject matter claimed herein is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. Rather, this background is only provided to illustrate one exemplary technology area where some embodiments described herein may be practiced.