what is the difference between bga and lga
Land grid array LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs. The balls are normally attached to the underside of the IC.
LNG carrier An LNG carrier is a tank ship designed for transporting liquefied natural gas (LNG). As the LNG market grows rapidly,[1] the fleet of LNG carriers continues to experience tremendous growth.[citation needed]