what is the difference between bga and lga
Land grid array LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs. The balls are normally attached to the underside of the IC.
Mazda BT-50 The Mazda BT-50 (model code J97M) is a compact/mid-sized pickup truck produced by the Japanese manufacturer Mazda since 2006. It is a larger version of the predecessor B-Series pickup and is not sold in the Japanese and North American markets. Until 2011, Ford had also sold a version of the first-generation BT-50 as the Ford Ranger and as the SUV Ford Everest. From 2011 the second-generation Ranger has been designed by Ford Australia, with a Mazda derivative sold as the BT-50.