what is the difference between bga and lga
Land grid array LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs. The balls are normally attached to the underside of the IC.
B-flat major In music theory, B♭ major is a major scale based on B♭, with pitches B♭, C, D, E♭, F, G, and A. Its key signature has two flats. Its relative minor is G minor, and its parallel minor is B♭ minor (not used enharmonically as A♯ minor). A♯ major, its enharmonic, has three double-sharps, which makes it impractical to use.