본 발명은 고정밀 디바이스 제조 시설내에서 공정을 제한하는 진동을 제거하거나 실질적으로 감소시키는 하나의 방법, 시스템 및 제조 시설을 제공한다. 제조 시설내의 세워진 구조물들은 고정밀 디바이스 제조 장비를 지지하고 건물바닥과 세워진 구조물들의 상부사이에 진동을 감소시키는 공간을 제공한다.
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation / reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.