레이저 가공 방법 및 장치를 제공한다. 본 발명의 레이저 가공 방법에 의하면 스캐너 또는 다각형 미러를 이용하여 레이저 빔을 움직이도록 스캔하고 사각 방향으로 대상물로 조사함으로써, 대상물을 효율적으로 스크라이빙 또는 절단할 수 있다.
To provide a method and a device for laser processing hardly causing thermal deformation despite processing using a high-output laser light source and capable of improving processing quality and performing processing deeply by preventing the re-deposition of particles as much as possible by securing a path through which generated particles escape from a portion to be processed. According to the laser processing method, it is possible to efficiently perform the scribing or cutting of an object by scanning laser beams to move using a scanner or a polygon mirror and by irradiating the object in an inclined angle direction.