본 발명의 반도체 장치의 제조방법은, 반도체 소자와 지지부재를 접착 필름의 경화물을 매개로 접착하는 반도체 장치의 제조방법으로서, (a) 접착 필름 부착 반도체 소자를 준비하는 공정과, (b) 접착 필름 부착 반도체 소자를 지지부재에 열압착하여, 접착 필름 부착 반도체 소자와 지지부재로 되는 반도체 부품을 얻는 열압착공정과, (c) 접착 필름 부착 반도체 소자와 지지부재로 되는 반도체 부품을, 가압 유체를 사용하여 가열, 가압하여 접착 필름의 경화를 진행시키는 가압 경화공정과, (d) 반도체 소자와 지지부재를 전기적으로 접속하는 공정을, 공정 (a)~(d)의 순서로 행하는 것을 특징으로 한다.
Provided is a method of manufacturing a semiconductor device capable of adhering semiconductor elements and a support member for mounting semiconductor elements, such as lead frames, organic substrates or the like, even in a relatively low temperature range without damaging adhesion property and workability and of suppressing the occurrence of voids. The method of manufacturing a semiconductor device according to the invention is a method of manufacturing a semiconductor device comprising a semiconductor element and a support member adhered to the semiconductor element through a cured material of an adhesive film, wherein the method comprises the steps (a) to (d) in this order; (a) preparing adhesive film-attached semiconductor elements; (b) thermocompression-bonding said adhesive film-attached semiconductor elements to said support member so as to obtain a semiconductor part made of said adhesive film-attached semiconductor elements and said support member; (c) heating and pressurizing said semiconductor part made of said adhesive film-attached semiconductor elements and said support member using a pressurized fluid so as to proceed with curing of adhesive film; and (d) electrically connecting said adhesive film-attached semiconductor elements and said support member.