본 발명은 무기기질과 유기폴리머간, 특히 전자인쇄회로의 구리표면과 폴리머 수지간 접착을 촉진시키는 방법 및 조성물에 관계하며, 다음을 포함하는 조성물로 처리하여 균일하고 촘촘한 흑갈색 유기금속층이 무기기질상에 침전된다: a) 일반식 Y-(CH2)n-Si(OR)3의 구조를 갖는 기능성 유기실란(Y는 기능성 유기실란 작용기, n은 0 내지 3의 정수, R은 수소원자이거나 수소원자를 방출할 수 있는 가수분해성 기이다) b) 아졸 화합물; c) 산소 캐리어; d) 유기 또는 무기산; e) 아연 화합물. 본 발명의 조성물 및 방법은 무기기질과 유기 폴리머간의 접착력을 크게 증가시킨다.
The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of printed circuits for electronic use and a polymer resin, in which an organometallic layer of a dark brown colour, which is very uniform and compact, is deposited on the inorganic substrate by means of treatment in a composition which comprises: a) a silane or a mixture of functional organic silanes with a structure represented by the following general formula: Y-(CH2 )n -Si(OR)3 where: Y represents a functional organic group, n is a number which has a value between 0 and 3, and R represents a hydrogen atom or any easily hydrolysable group which is capable of releasing an atom of hydrogen; b) an azole compound; c) an oxygen carrier; d) an organic or inorganic acid; and preferably e) a zinc compound. The process and the composition according to the invention ensure a considerable increase in adhesion between the inorganic substrate and the organic polymer.