솔더와 패드 계면에 Cu6Sn5 상 만이 관찰되었고, 솔더 내부에는 ENIG 표면 처리 접합부와 마찬가지로 그물 형태의 Ag3 상이 생성된 것을 관찰할 수 있었다.
Only the Cu6Sn5 phase was observed at the solder and pad interface, and it was observed that the Ag3 phase in the form of a net was generated inside the solder, similar to the ENIG surface-treated junction.