ADDITION-CURABLE SILICONE RESIN COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICEThe present invention is directed to an addition curable type silicone resin composition which comprises (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(S iO4/2)s, (c) an organohydrogen polysiloxane represented by R4aHbSiO(4-a-b)/2, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si-O-Ce bond, and an Si-O-Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.An addition curable type silicone resin composition which comprises: (a) an organopolysiloxane having two or more alkenyl groups bonded to a silicon atom(s) in one molecule, and having a viscosity at 25°C of 50 to 100,000 mPa·s, (b) an organopolysiloxane represented by the following average composition formula (1), and is a liquid having a viscosity at 25°C of 1,000 Pa·s or more or a solid: an amount of the component (b) being more than 0 part by mass and less than 80 parts by mass based on 100 parts by mass of a total of the component (a) and the component (b),         (R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(S iO4/2)s ···     (1) wherein, R1 represents a monovalent hydrocarbon group which may contain an alkenyl group; R2 represents a monovalent hydrocarbon group which does not contain an alkenyl group, and 80% or more of the whole R2 is a methyl group; R3 represents a hydrogen atom or an alkyl group; 'm', 'n', 'p', 'q', 'r', and 's' are numbers satisfying m ≥ 0, n≥ 0, p≥ 0, q≥ 0, r≥ 0, s≥ 0, and are numbers satisfying m+n>0, q+r+s>0, m+n+p+q+r+s=1, (c) an organohydrogen polysiloxane represented by the following average composition formula (2), having two or more SiH bonds in one molecule, and having a viscosity at 25°C of 1,000 mPa·s or less: in an amount that a number of the SiH bonds of the component (c) being 0.5 to 5.0-fold based on a total of a number of the alkenyl groups of the component (a) and the component (b),         R4aHbSiO(4-a-b)/2 ···     (2) wherein, R4 represents a monovalent hydrocarbon group which does not contain an alkenyl group, and 50% or more of the whole R4 is a methyl group; and 'a' and 'b' are numbers satisfying 0.7≤ a≤ 2.1, 0.001≤ b≤ 1.0, and 0.8≤ a+b ≤ 3.0, (d) a platinum group metal catalyst: in an amount of 1 to 500 ppm in terms of a mass of metal atoms based on a total of the components (a) to (c), and (e) a polyorganometallosiloxane containing an Si-O-Ce bond, and an Si-O-Ti bond, a Ce content of which is 50 to 5,000 ppm, a Ti content of which is 50 to 5,000 ppm, and having a viscosity at 25°C of 10 to 10,000 mPa·s: in an amount of 0.01 to 5 parts by mass based on 100 parts by mass of a total of the components (a) to (d), which cures by heating.
부가경화형 실리콘 수지 조성물, 이 조성물의 제조방법, 및 광학반도체장치본 발명은, (a)규소원자결합 알케닐기를 갖는 오가노폴리실록산, (b)(R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s로 표시되는 오가노폴리실록산, (c)R4aHbSiO(4-a-b)/2로 표시되는 오가노하이드로젠폴리실록산, (d)백금족 금속계 촉매, 및 (e)Si-O-Ce결합, 및 Si-O-Ti결합을 함유하고, Ce와 Ti의 함유량이 각각 50~5,000ppm인 폴리오가노메탈로실록산을 함유하고, 가열에 의해 경화하는 부가경화형 실리콘 수지 조성물이다. 이에 따라, 투명성이 우수하고, 또한 고온조건하에 있어서의 경도변화 및 중량감소가 적은 경화물을 부여하는 부가경화형 실리콘 수지 조성물이 제공된다.부가경화형 실리콘 수지 조성물로서,(a)한분자 중에 규소원자에 결합하는 알케닐기를 2개 이상 갖고, 25℃에 있어서의 점도가 50~100,000mPa·s인 오가노폴리실록산,(b)하기 평균조성식(1)로 표시되고, 25℃에 있어서의 점도가 1,000Pa·s 이상의 액체 또는 고체인 오가노폴리실록산: 상기 (a)성분과 (b)성분의 합계 100질량부에 대하여 (b)성분이 0질량부보다 많고 80질량부 미만이 되는 양.(R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s···(1)(식 중, R1은 알케닐기를 포함할 수도 있는 1가 탄화수소기이며; R2는 알케닐기를 포함하지 않는 1가 탄화수소기로서, 전체 R2 중 80% 이상은 메틸기이며; R3은 수소원자 또는 알킬기이며; m, n, p, q, r, 및 s는 m≥0, n≥0, p≥0, q≥0, r≥0, s≥0, 또한 m+n>0, q+r+s>0, m+n+p+q+r+s=1을 만족시키는 수이다.)(c)하기 평균조성식(2)로 표시되고, 한분자 중에 SiH결합을 2개 이상 갖고, 또한 25℃에 있어서의 점도가 1,000mPa·s 이하인 오가노하이드로젠폴리실록산: 상기 (a)성분 및 상기 (b)성분의 알케닐기의 수의 합계에 대하여, (c)성분의 SiH결합의 수가 0.5~5.0배가 되는 양,R4aHbSiO(4-a-b)/2···(2)(식 중, R4는 알케닐기를 포함하지 않는 1가 탄화수소기로서, 전체 R4 중 50% 이상은 메틸기이며; a 및 b는, 0.7≤a≤2.1, 0.001≤b≤1.0, 또한 0.8≤a+b≤3.0을 만족시키는 수이다.)(d)백금족 금속계 촉매: 상기 (a)~(c)성분의 합계에 대하여, 금속원자의 질량환산으로 1~500ppm이 되는 양, 및(e)Si-O-Ce결합, 및 Si-O-Ti결합을 함유하고, Ce함유량이 50~5,000ppm, Ti함유량이 50~5,000ppm이며, 25℃에 있어서의 점도가 10~10,000mPa·s인 폴리오가노메탈로실록산: 상기 (a)~(d)성분의 합계 100질량부에 대하여 0.01~5질량부,를 함유하고, 가열에 의해 경화하는 것을 특징으로 하는 부가경화형 실리콘 수지 조성물.