Paul William Coteus
Paul William Coteusis an electrical engineer at IBM's T.J. Watson Research Center in Yorktown Heights, New York. Coteus was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 for his contributions to packaging for high performance computing systems. References 20th-century births Living people Fellow Members of the IEEE Year of birth missing (living people) Place of birth missing (living people) American electrical engineers